JP6122090B1 - Ultrasonic probe - Google Patents

Abstract

An object of the present invention is to suitably propagate heat generated in an electronic circuit in an ultrasonic probe to a side opposite to an ultrasonic wave transmitting / receiving surface. A central frame 32 having a heat receiving plate 60 that receives heat from the ASIC 30 and a plate-like rear extending plate 62 that extends rearward from the center of the rear side surface of the heat receiving plate 60 is provided on the rear side of the ASIC 30 that is a heat source. . Furthermore, a hollow outer frame (comprised of an upper frame 34 and a lower frame 36) is provided that contacts the left and right ends of the rear surface of the heat receiving plate 60 and extends rearward therefrom. The left and right ends of the rear extending plate 62 are connected to the outer frame. Thereby, the inner heat transfer route in which heat is transferred from the central portion of the heat receiving plate 60 to the outer frame via the rear extending plate 62, and the outer heat transfer route in which heat is transferred directly from the left and right end portions of the heat receiving plate 60 to the outer frame. Is formed. [Selection] Figure 5

Description

  The present invention relates to an ultrasonic probe, and more particularly to a structure for radiating heat generated in an ultrasonic probe.

  Ultrasound diagnostic apparatuses are used in the medical field. An ultrasound diagnostic apparatus is an apparatus that transmits and receives ultrasound to and from a subject and forms an ultrasound image based on a reception signal obtained thereby. Ultrasonic transmission / reception is performed by an ultrasonic probe connected to the apparatus main body by wire or wirelessly. Some ultrasonic probes are equipped with an electronic circuit for channel reduction (reduction of the number of signal lines between the apparatus main body and the ultrasonic probe).

  When the ultrasonic probe on which the electronic circuit is mounted operates, heat is generated in the electronic circuit. The amount of heat generated in the electronic circuit varies depending on the transmission power of the ultrasonic wave, and the greater the transmission power of the ultrasonic wave, the more heat is generated. On the other hand, since the ultrasonic probe is to be brought into contact with the subject, there is a provision that the surface temperature of the portion in contact with the subject (ultrasonic wave transmitting / receiving surface) should not exceed a predetermined value. In view of this, there has been proposed a technique for dissipating heat so that heat generated in the electronic circuit is not transmitted as much as possible to the portion in contact with the subject.

  For example, Patent Document 1 discloses a superframe having a metal frame provided on the rear side of the electronic circuit (opposite to the ultrasonic wave transmitting / receiving surface) and extending in the front-rear direction, and a heat spreader provided so as to wrap the metal frame. An acoustic probe is disclosed. In the ultrasonic probe disclosed in Patent Document 1, the heat generated in the electronic circuit is transmitted to the heat spreader via the metal frame, and is radiated from the outer surface of the casing in close contact with the heat spreader.

Special table 2014-516686 gazette

  From the viewpoint of further improving the transmission power of ultrasonic waves, it is required to propagate a larger amount of heat backward from the electronic circuit. Ideally, if more heat is to be propagated backwards, the back side of the electronic circuit is completely filled with a heat conductor. However, a space for arranging a cable or the like for connecting the electronic circuit and the ultrasonic diagnostic apparatus main body is required on the rear side of the electronic circuit. Therefore, it is necessary to suitably propagate the heat from the electronic circuit backward while ensuring the space.

  An object of the present invention is to suitably propagate heat generated in an electronic circuit backward while ensuring a necessary space behind the electronic circuit in the ultrasonic probe.

  An ultrasonic probe according to the present invention is disposed behind an electronic circuit, receives a heat from the electronic circuit, and receives heat from the electronic circuit, and is connected to the heat receiving block and extends inward from the center of the rear side of the heat receiving block. A hollow shape having a body and an end connected to the rear side end of the heat receiving block, extending rearward from the rear side end and connected to the left and right side ends of the inner heat conductor An outer heat conductor, and a case that encloses the outer heat conductor and dissipates heat from the outer heat conductor, and heats from the heat receiving block to the outer heat conductor through the inner heat conductor An inner heat conduction path through which heat is transmitted and an outer heat conduction path through which heat is directly transmitted from the heat receiving block to the outer heat conductor are formed.

  According to the above configuration, the heat of the central portion of the heat receiving block that has received heat from the electronic circuit by the inner heat conductor propagates to the inner heat conductor, and then from the left and right ends of the inner conductor to the outer heat conductor. Propagate to (inner heat conduction path). Further, the heat at the end of the heat receiving block is directly propagated to the outer heat conductor and is propagated backward (outer heat conduction path). The heat propagated to the outer heat conductor by the inner heat conduction path and the outer heat conduction path is radiated from the outer surface of the case to the outside of the ultrasonic probe. Thus, according to the said structure, since the heat of a heat receiving block can be propagated back by several heat conduction path | routes, the heat which generate | occur | produced in the electronic circuit is propagated suitably back. Thereby, the temperature rise of an ultrasonic transmission / reception surface is suppressed. Furthermore, according to the above configuration, since the outer heat conductor has a hollow shape, a space is formed inside the outer heat conductor, and a cable or the like for connecting the electronic circuit and the ultrasonic diagnostic apparatus main body is disposed therein. be able to.

  Desirably, at least one of the end of the inner heat conductor on the heat receiving block side and the end of the outer heat conductor is enlarged. From the viewpoint of propagating more heat backward, it is preferable to make the volume of the outer heat conductor or the inner heat conductor as large as possible. Further, if the heat receiving block and the outer heat conductor are separately formed and then combined, the heat resistance at the interface between them can be further reduced when the contact area between them is as large as possible. Therefore, by enlarging the end portion of the outer heat conductor or the end portion of the inner heat conductor, the volume of the outer heat conductor becomes larger and the contact area with the heat receiving block becomes larger. Heat from the electronic circuit can be drawn backwards.

  Preferably, the thickness of the case is uniform at least in a portion covering the outer heat conductor.

  The heat transferred to the outer heat conductor is dissipated from the case surface. The thinner the case, the more heat is dissipated from the outer heat conductor. Therefore, if the thickness of the case varies, the amount of heat radiation at each surface position of the case varies, which can cause variations in the temperature of the case surface. In particular, the case surface temperature of the portion where the thickness of the case is thin is locally increased to generate a heat spot. This is uncomfortable for the user of the ultrasonic probe. By making the thickness of the case covering the outer heat conductor uniform, it is possible to prevent the formation of heat spots, thereby reducing discomfort to the user.

  Desirably, the said outer side heat conductor has an insertion part which pinches | interposes the left-right side edge of the said inner side heat conductor. In the connection between the left and right ends of the inner heat conductor and the outer heat conductor, by adopting a sandwiching structure with a sandwiching portion, there is no need to provide an adhesive layer between the inner heat conductor and the outer heat conductor, Both are brought into direct contact. Thereby, the thermal resistance between the inner heat conductor and the outer heat conductor is reduced, and the heat from the inner heat conductor can be more suitably propagated to the outer heat conductor. In order to further reduce the thermal resistance between the two, it is preferable to increase the contact area between the two as much as possible.

  Desirably, the heat receiving block and the inner heat conductor constitute an integrally molded body. Since the heat receiving block and the inner heat conductor are integrally formed, the thermal resistance between them can be reduced as compared with a configuration in which both are formed separately and brought into contact with each other. Therefore, the heat from the heat receiving block is more suitably propagated to the inner heat conductor.

  ADVANTAGE OF THE INVENTION According to this invention, the heat | fever which generate | occur | produced in the electronic circuit can be suitably propagated back, ensuring a required space behind the electronic circuit in an ultrasonic probe.

It is an external appearance top view of the ultrasonic probe concerning this embodiment. It is an external appearance side view of the ultrasonic probe concerning this embodiment. It is a disassembled perspective view of the ultrasonic probe which concerns on this embodiment. It is an enlarged view of a center frame, an upper frame, and a lower frame according to the present embodiment. It is BB sectional drawing of the ultrasonic probe which concerns on this embodiment. It is AA sectional drawing of the ultrasonic probe which concerns on this embodiment. It is an enlarged view which shows the modification of a center frame, an upper frame, and a lower frame. It is the perspective view of a flange, a top view, and sectional drawing. It is a figure which shows the positional relationship of a heat conductive frame, a flange, and a cable boot. It is a rear enlarged view of AA sectional view of the ultrasonic probe concerning this embodiment.

  Hereinafter, embodiments of an ultrasonic probe according to the present invention will be described.

  FIG. 1 is an external plan view of the ultrasonic probe 10 according to the present embodiment, and FIG. 2 is an external side view of the ultrasonic probe 10. As shown in FIG. 1 or FIG. 2, the ultrasonic probe 10 has a shape extending in the front-rear direction, and transmits and receives ultrasonic waves from an acoustic lens 12 provided at the forefront. That is, the surface of the acoustic lens 12 is an ultrasonic wave transmitting / receiving surface that comes into contact with the subject. In this specification, the short direction of the ultrasonic probe 10 is the x axis, the long direction is the y axis, and the direction orthogonal to the x axis and the y axis is the z axis. In addition, the side on which the ultrasonic wave transmitting / receiving surface is provided (the positive side of the y axis) is referred to as “front side”, and the opposite direction (negative direction side of the y axis) is referred to as “rear side”. In addition, the short direction (x-axis direction) of the ultrasonic probe 10 may be described as “left-right direction”.

  The ultrasonic probe 10 has a front case 14 and a rear case as an outer skin for waterproofing or antibacterial purposes. The rear case is further separable into two parts up and down, and comprises an upper case 16 and a lower case 18 (see FIG. 2). By combining the front case 14 and the rear case, both are integrated to form a probe case. The probe case (that is, the front case 14, the upper case 16, and the lower case 18) is preferably formed of a material that is highly waterproof, antibacterial, and highly insulating. In the present embodiment, the probe case is made of resin.

  A cable 20 connected to the ultrasonic diagnostic apparatus main body extends from the rear portion of the ultrasonic probe 10 further rearward. Further, a cable boot 22 is provided for preventing the cable 20 from being damaged at the base of the probe case. The cable boot 22 is made of, for example, resin. The cable 20 is inserted into the cable boot 22.

  A constriction 24 that is a portion that is gripped by a user (for example, a doctor) is formed slightly behind the center of the ultrasonic probe 10 in the front-rear direction. By providing the constriction 24, the ultrasonic probe 10 can be easily held. In the constriction 24, the area of the transverse cross section (xz cross section) of the ultrasonic probe 10 is narrowed. Specifically, the width of the ultrasonic probe 10 in the left-right (short) direction is narrowed.

  Although the ultrasonic probe 10 according to the present embodiment is a convex probe, the present invention can also be applied to other types of probes such as a sector probe.

  FIG. 3 is an exploded perspective view of the ultrasonic probe 10. Each member which the ultrasonic probe 10 has is demonstrated using FIG.

  The acoustic lens 12 is disposed at the forefront of the ultrasonic probe 10 as described above, and the surface thereof becomes an ultrasonic wave transmitting / receiving surface. The acoustic lens 12 performs focusing of ultrasonic waves transmitted from a transducer array included in a transmission / reception unit 26 described later.

  Since the front case 14, the upper case 16, the lower case 18, the cable 20, and the cable boot 22 have been described above, description thereof is omitted here. A semicircular cutout 16 a is provided on the rear side surface of the upper case 16, and a semicircular cutout 18 a is also provided on the rear side surface of the lower case 18. By combining the upper case 16 and the lower case 18, a circular hole is formed by the notches 16a and 18a, and the cable 20 is pulled out from the hole.

  The transmission / reception unit 26 is composed of a plurality of vibration elements, a transducer array that transmits and receives ultrasonic waves, and electrically connects each vibration element and a relay substrate 28 described later while suppressing unnecessary vibration of the transducer array. A lead array built-in backing including a plurality of leads, and one or a plurality of acoustic matching layers for matching acoustic impedance between the transducer array and the subject. In the transmission / reception unit 26, these members are laminated. In this embodiment, the acoustic matching layer, the transducer array, and the lead array built-in backing are stacked in this order from the front side.

  The relay substrate 28 is a substrate formed of a material such as glass epoxy. The relay substrate 28 is provided in parallel with the transverse section (xz plane) of the ultrasonic probe 10. The relay substrate 28 is a multilayer substrate, and electrical wiring is provided in each layer. On the front side surface of the relay substrate 28, a plurality of pads are provided for making electrical contact with a plurality of leads of the lead array built-in backing.

  The ASIC 30 as an electronic circuit is provided on the rear side surface of the relay substrate 28. Each terminal included in the ASIC 30 is electrically connected to each vibration element included in the transducer array via the relay substrate 28 and a lead array built-in backing. The ASIC 30 functions as a transmission sub beam former and a reception sub beam former. The transmission sub-beamformer generates a plurality of transmission signals having a delay relationship for each vibration element included in the transducer array. The reception sub-beamformer performs a phasing addition process on a plurality of reception signals obtained from each vibration element to generate a reception signal. When the ASIC 30 performs the above processing, the number of signal lines between the ultrasonic probe 10 and the ultrasonic diagnostic apparatus main body is reduced.

  The operation of the ultrasonic probe 10 generates heat in the ASIC 30. Although heat is generated also in the transducer array, the heat generation amount of the ASIC 30 is several times or a dozen times larger than the heat generation amount of the transducer array. Therefore, the main heat source in the ultrasonic probe 10 is the ASIC 30.

  The central frame 32, the upper frame 34, and the lower frame 36 are combined to form a heat conducting frame. The heat conduction frame is disposed behind the ASIC 30, and propagates backward by absorbing heat generated in the ASIC 30, and further dissipates the absorbed heat to the external space of the ultrasonic probe 10 through the rear case. It is. Details of the center frame 32, the upper frame 34, and the lower frame 36 will be described later.

  An FPC (Flexible Printed Circuits) 38 is electrically connected to the ASIC 30 via the relay substrate 28 and serves as a signal path between the ASIC 30 and the ultrasonic diagnostic apparatus main body. The FPC 38 is provided with a contact portion 40 for connecting to a connector 42 described later. In the present embodiment, two FPCs 38 are provided, one FPC 38 is connected to the upper side of the relay board 28, and the other FPC 38 is connected to the lower side of the relay board 28.

  The connector 42 relays the FPC 38 and the plurality of wires 46. In the present embodiment, since two FPCs 38 are provided, two connectors 42 are also provided. A plurality of wire rods 46 are electrically connected to the connector 42. The connector 42 has a contact portion 44, and the contact portion 44 contacts the contact portion 40 of the FPC 38. Thereby, the FPC 38 and the plurality of wires 46 are electrically connected. The plurality of wires 46 are elements constituting the cable 20.

The cable 20 has a circular cross section, and a plurality of wire rods 46 are provided at the center thereof, a ground sheath is provided so as to cover the outer surface of the plurality of wire rods 46, and an insulating sheath is provided so as to cover the outside of the ground sheath. The structure is provided. A ground sheath wire 48 formed by a ground sheath drawn from the cable 20 in the probe case is screwed to the lower frame 36 by a screw 50. Accordingly, the heat conduction frame is grounded, and the heat absorbed by the heat conduction frame can be propagated backward via the ground sheath.

  The flange 52 is provided behind the heat conduction frame. The flange 52 is thermally connected to the heat conduction frame and further propagates the heat absorbed by the heat conduction frame to the rear. Details of the flange 52 will be described later.

  4 is an enlarged view of the center frame 32, the upper frame 34, and the lower frame 36 in the exploded perspective view shown in FIG. Details of the center frame 32, the upper frame 34, and the lower frame 36 will be described with reference to FIG.

  First, the center frame 32 will be described. The central frame 32 is formed of a material (metal or the like) having a high thermal conductivity. In the present embodiment, the central frame 32 is formed of aluminum having a relatively high thermal conductivity and a relatively light weight.

  The center frame 32 has a heat receiving plate 60 as a heat receiving block that receives heat generated in the ASIC 30. The heat receiving plate 60 has a front side surface 60 a facing the front side, and the front side surface 60 a is oriented parallel to the relay substrate 28. Thereby, the front side surface 60a and the rear side surface of the ASIC 30 can be suitably contacted directly or indirectly (via an insulating layer or the like). The front side surface 60 a preferably has at least a larger area than the rear side surface of the ASIC 30 so as to come into contact with all of the rear side surface of the ASIC 30 in order to absorb more heat from the ASIC 30.

  The heat receiving plate 60 has a rear side surface facing the rear side, and a flat surface 60b is formed at the end portion of the rear side surface (both left and right end portions in the present embodiment). As will be described later, the front surfaces of the upper frame 34 and the lower frame 36 are in contact with the flat surface 60b.

  A part (center portion) of the upper surface of the heat receiving plate 60 is cut away, thereby forming a recess 60c. When the central frame 32, the upper frame 34, and the lower frame 36 are combined to form a heat conduction frame, the recess 60c forms a hole that communicates with the internal space formed in the heat conduction frame. The hole is used for passing the FPC 38. Although not shown in FIG. 4, a similar recess is provided on the lower surface of the heat receiving plate 60.

  The center frame 32 includes a rear extending plate 62 as an inner heat conductor that extends rearward from a central portion of the rear side surface of the heat receiving plate 60. The rear extending plate 62 is provided to propagate the heat at the center of the heat receiving plate 60 to the rear. In the present embodiment, the rear stretching plate 62 is a plate-like member having the lateral direction as the short direction and the front-rear direction as the longitudinal direction, but the shape of the rear stretching plate 62 is not limited thereto.

  In order to more suitably propagate the heat of the heat receiving plate 60 to the rear stretching plate 62, it is preferable to integrally mold the heat receiving plate 60 and the rear stretching plate 62. Thereby, an interface does not intervene between heat receiving plate 60 and back extension plate 62, and thermal resistance between heat receiving plate 60 and back extension plate 62 can be reduced more. Of course, it is also possible to adopt a mode in which both are formed separately and the both are combined later.

  Preferably, the rearward extending plate 62 has an enlarged portion 62a whose width is expanded (that is, enlarged) in the vertical direction. The enlarged portion 62a is provided at the base portion of the rearward extending plate 62, and the enlarged portion 62a and the heat receiving plate 60 are connected to each other. By providing the enlarged portion 62a, the rear stretching plate 62 has a larger volume, and more heat can be drawn rearward from the heat receiving plate 60.

  On the upper side of the enlarged portion 62a, an inclined surface 62b facing the upper side and the rear side is formed. The slope 62b is continuous with the bottom surface of the recess 60c. As described above, when the FPC 38 is disposed through the recess 60c, for example, if a corner (step) appears on the upper surface of the enlarged portion 62a, the FPC 38 may be damaged by the corner. Therefore, the slope 62b is provided from the viewpoint of preventing the FPC 38 from being damaged. The FPC 38 is disposed along the slope 62b. Similarly, a slope is formed on the lower side of the enlarged portion 62a.

  Hereinafter, the upper frame 34 and the lower frame 36 will be described. Since the upper frame 34 and the lower frame 36 have the same structure, the lower frame 36 will be mainly described here. The upper frame 34 and the lower frame 36 are combined so as to sandwich the center frame 32 as indicated by the arrows in FIG. The upper frame 34 and the lower frame 36 are provided as outer heat conductors.

  Similar to the central frame 32, the upper frame 34 and the lower frame 36 are formed of a material (metal or the like) having a high thermal conductivity. In this embodiment, it is made of aluminum.

  The lower frame 36 has a substantially semi-cylindrical shape extending in the front-rear direction and having a plane facing upward. A groove 36a having openings on the front side surface and the upper side surface of the lower frame 36 and extending in the front-rear direction is provided at the center in the left-right direction of the lower frame 36. A similar groove (not shown) is also provided in the upper frame 34 having a substantially semi-cylindrical shape extending in the front-rear direction and having a flat surface facing downward. A hollow portion is formed in the heat conduction frame formed by combining the center frame 32, the upper frame 34, and the lower frame 36 by the grooves 36 a and the grooves provided in the upper frame 34.

  Preferably, the lower frame 36 has an enlarged portion 36b that is widened in the left-right direction (that is, enlarged) and becomes thick. The enlarged portion 36b is formed on each of the left and right sides of the groove 36a. Like the enlarged portion 62 a of the rear extending plate 62, the enlarged portion 36 b is provided at the foremost portion of the lower frame 36. By providing the enlarged portion 36b, the volume of the lower frame 36 becomes larger, and more heat from the heat receiving plate 60 is absorbed by the lower frame 36.

  When the central frame 32, the upper frame 34, and the lower frame 36 are combined (hereinafter simply referred to as “combined state”), the front side surface 36c of the lower frame 36 (that is, the front side surface 36c of the enlarged portion 36b) is The heat receiving plate 60 comes into contact with the flat surfaces 60b provided at the left and right end portions. Similarly, the front side surface 34a of the upper frame 34 also abuts on the flat surface 60b. Specifically, the front side surface 36c of the lower frame 36 contacts the lower half of the flat surface 60b, and the front side surface 34a of the upper frame 34 contacts the upper half of the flat surface 60b. In this way, the upper frame 34 and the lower frame 36 (hereinafter, the upper frame 34 and the lower frame 36 are referred to as “outer frames”) are connected to the left and right ends of the heat receiving plate 60.

  When the outer frame is connected to the left and right ends of the heat receiving plate 60, the heat at the left and right ends of the heat receiving plate 60 propagates rearward through the outer frame. That is, a first heat conduction route (outside heat conduction route) is formed in which the left and right ends of the heat receiving plate 60 → the outer frame.

  In addition, by providing the enlarged portion 36b in the lower frame 36, the contact area between the heat receiving plate 60 (flat surface 60b) and the front side surface 36c is increased. That is, by providing the enlarged portion 36b in the forefront portion of the lower frame 36, the thermal resistance between the heat receiving plate 60 and the lower frame 36 is further reduced, and heat is more suitably propagated rearward. Also play.

  Near the upper end of the inner side surface of the lower frame 36 formed by the groove 36a, a shelf portion 36d protruding inward from the inner side surface is provided. In the present embodiment, the shelf 36d extends in the front-rear direction along the groove 36a. The shelf portions 36d are provided on the left and right inner side surfaces of the lower frame 36, respectively. In the combined state, the left and right side ends of the lower surface of the rear extending plate 62 are in contact with the upper surface of the shelf 36d. Further, the left and right side surfaces (lower half) of the rear extending plate 62 are in contact with the left and right inner side surfaces of the lower frame 36, respectively. Further, the upper frame 34 is similarly provided with a shelf (not shown), and the left and right ends of the upper surface of the rear extension plate 62 are in contact with the lower surface of the shelf of the upper frame 34. Further, the left and right side surfaces (the upper half thereof) of the rear extending plate 62 are in contact with the left and right inner side surfaces of the upper frame 34, respectively.

  Thus, in the combined state, the left and right ends of the rearward extending plate 62 are sandwiched between the upper frame 34 and the lower frame 36. As a result, the left and right ends of the rear extension plate are connected to the upper frame 34 and the lower frame 36 (outer frame). That is, the shelf portion 36 d provided on the lower frame 36 and the shelf portion similarly provided on the upper frame 34 constitute a sandwiching portion that sandwiches the left and right ends of the rearward extending plate 62.

  By connecting the left and right side ends of the rear stretching plate 62 to the outer frame, the heat absorbed by the rear stretching plate 62 from the heat receiving plate 60 from the left and right ends of the rear stretching plate 62 from the upper frame 34 and the lower frame 36. Propagate to. That is, a heat conduction route (inner heat conduction route) of the center portion of the heat receiving plate 60 → the rear extending plate 62 → the outer frame is formed.

  By adopting the sandwiching method in connecting the left and right side ends of the rear extending plate 62 and the outer frame, it is not necessary to use an adhesive between them. Thereby, both are contacted directly, the thermal resistance between both is reduced, and heat can be propagated more suitably. Further, in order to reduce the thermal resistance between the left and right side ends of the rear extending plate 62 and the outer frame, it is preferable that the contact area between the two in the sandwiched portion is as large as possible. Note that the shelf 36d is an example of a sandwiching portion, and the left and right ends of the rear extension plate 62 may be sandwiched by other structures.

  The lower frame 36 has a semicircular rear side surface 36e. A semicircular cutout 36f is provided on the upper side of the rear side surface 36e. Similarly, the upper frame 34 has a semicircular rear side surface 34b. A semicircular cutout 34c is also provided on the lower side of the rear side surface 34b. By combining the upper frame 34 and the lower frame 36, a circular rear side surface is formed in the heat conduction frame, and circular holes are formed in the rear side surface of the heat conduction frame by the notches 34c and 36f. The cable 20 is pulled out from the hole.

  FIG. 5 is a horizontal sectional view of the ultrasonic probe 10 (BB sectional view in FIG. 2), and FIG. 6 is a vertical sectional view of the ultrasonic probe 10 (AA sectional view in FIG. 1). Each member of the ultrasonic probe 10 shown in FIGS. 5 and 6 has been described with reference to FIGS. 3 and 4, and therefore, the same reference numerals as those in FIGS. 3 and 4 are attached. Omitted. As shown in FIG. 6, hollow portions 64 are formed on the upper and lower sides of the rear extension plate 62 in the heat conduction frame, and the FPC 38, the connector 42, the wire 46 and the like are arranged there.

  In FIG. 5, an example of the outer heat conduction route is indicated by a solid arrow 70, and an example of the inner heat conduction route is indicated by a broken arrow 72. As shown in FIG. 5 and as described above, the outer heat conduction route is a route through which heat is transferred directly from the left and right ends of the heat receiving plate 60 to the outer frame. The inner heat conduction route is a route in which heat is transmitted from the central portion of the heat receiving plate 60 to the rear extending plate 62, and heat is transmitted from the left and right ends of the rear extending plate 62 to the outer frame.

  The heat transmitted to the outer frame is radiated from the entire rear case surface including the upper case 16 and the lower case 18. As shown in FIGS. 5 and 6, the thickness of the rear case is uniform at least in a portion covering the outer frame. Therefore, the heat transmitted to the outer frame by the inner heat conduction route and the outer heat conduction route is radiated uniformly in the entire rear case. This prevents the formation of a heat spot that locally heats the surface of the case. By preventing the formation of the heat spot, discomfort given to the user of the ultrasonic probe 10 is reduced.

  Since the thickness of the rear case that covers the outer frame is uniform, the outer shape of the outer frame directly determines the outer shape of the ultrasonic probe 10. In the ultrasonic probe 10, a constriction 24 for easy holding is formed (see FIG. 1), and the constriction 24 is formed according to the outer shape of the outer frame. That is, the outer frame has a constriction with a narrow cross-sectional area. Specifically, as shown in FIG. 5, in a plan view, the outer frame has a width that decreases from the front end toward the constriction, and increases in width from the constriction toward the rear end. .

  As described above, in the ultrasonic probe 10, two heat conduction routes and an outer heat conduction route are formed as heat conduction routes for radiating heat generated in the ASIC 30. According to the inner heat conduction route, the heat of the central portion of the heat receiving plate 60 that receives heat from the ASIC 30 can be suitably radiated. Further, according to the outer heat conduction route, the heat at the left and right end portions of the heat receiving plate 60 can be suitably radiated. That is, heat can be drawn backward from almost the entire surface of the heat receiving plate 60. This more suitably prevents heat from the ASIC 30 from propagating to the ultrasonic wave transmitting / receiving surface side. Thereby, for example, it is possible to irradiate ultrasonic waves for a long time with high transmission power.

  FIG. 7 shows a modification of the center frame, the upper frame, and the lower frame. The basic embodiment shown in FIG. 4 and the modification shown in FIG. 7 have the same shape in the combined state, although the shapes of the frames are different.

  In addition to the heat receiving plate 60 and the rear extending plate 62 described above, the central frame 80 includes an outer extending portion 86 that extends rearward from the left and right ends of the heat receiving plate 60. The outer extending portions 86 are respectively provided on the left and right sides of the rear extending plate 62, and the left and right ends of the rear extending plate 62 are coupled to the outer extending portion 86. An enlarged portion 86 a for absorbing more heat from the heat receiving plate 60 is provided at the base of the outer extending portion 86.

  Also in the modified example, an inner heat conduction route and an outer heat conduction route are formed. Specifically, the route of the center portion of the heat receiving plate 60 → the rear extending plate 62 → the outer extending portion 86, the upper frame 82, and the lower frame 84 becomes an inner heat conduction route, and both left and right end portions of the heat receiving plate 60 → external extending. The route of the portion 86, the upper frame 82, and the lower frame 84 becomes the outer heat conduction route. Since the central frame 80 is integrally formed, in the modified example, as compared with the basic embodiment, between the heat receiving plate 60 and the outer extending portion 86 and the rear extending plate 62 (the left and right side ends thereof) and the outer extending portion. There is no interface with 86. Therefore, compared with basic embodiment, the thermal resistance between these is reduced more, and the heat of ASIC30 can be drawn back more suitably.

  The outer extending portion 86 has an inner side surface 86b facing inward, and a groove 86c is formed by the upper side surface and the inner side surface 86b of the rear extending plate 62. Similarly, a groove 86d is formed by the lower side surface and the inner side surface 86b of the rear extending plate 62. When the ultrasonic probe 10 is assembled, the connector 42 can be disposed and positioned in the groove 86c or the groove 86d, so that the groove 86c and the groove 86d have an effect of facilitating the assembly.

  Hereinafter, the details of the flange 52 will be described. FIG. 8A shows a perspective view of the flange 52, and FIG. 8B shows a vertical sectional view of the flange 52.

  As described above, the flange 52 is disposed behind the heat conduction frame, and further propagates the heat absorbed by the heat conduction frame to the rear.

  The flange 52 is formed of a material having high thermal conductivity, like the heat conduction frame. In particular, it is made of a material having a higher thermal conductivity than the cable boot 22 (see FIGS. 1 to 2). In this embodiment, the flange 52 is formed of aluminum. Further, the flange 52 is formed of a material harder than the cable boot 22.

  As shown in FIGS. 8A and 8B, the flange 52 includes a heat receiving plate 100 that contacts the heat conducting frame and receives heat from the heat conducting frame. In the present embodiment, the shape of the front side surface 100 a of the heat receiving plate 100 is circular according to the shape of the rear side surface 110 a of the heat conducting frame 110. A circular hole is provided in the center of the heat receiving plate 100.

  The flange 52 has an insertion portion 102 extending rearward from the rear side surface of the heat receiving plate 100. In the present embodiment, the insertion portion 102 has a cylindrical shape, and is erected along an edge of a hole provided in the heat receiving plate 100. A hole penetrating the cylindrical insertion portion 102 and a hole provided in the heat receiving plate 100 communicate with each other to form a hole 104. The cable 20 is inserted into the hole 104.

  FIG. 9 is a diagram illustrating a positional relationship among the heat conduction frame 110, the flange 52, and the cable boot 22. The front side surface 100 a of the heat receiving plate 100 included in the flange 52 is brought into contact with the rear side surface 110 a of the heat conducting frame 110. The front side surface 100a preferably has at least a larger area than the rear side surface 110a so as to come into contact with the entire rear side surface 110a of the heat conduction frame 110 in order to absorb more heat from the heat conduction frame 110.

  The insertion portion 102 of the flange 52 is inserted into the cable boot 22. As shown in FIG. 9, the cable boot 22 has a flange hole 22a having an opening on the front side surface, and the insertion portion 102 is inserted into the flange hole 22a. Further, the cable boot 22 is provided with a hole 22b penetrating from the bottom of the flange hole 22a to the rear side surface of the cable boot 22. The cable 20 is inserted through the hole 22b.

  The cable boot 22 is generally formed of resin or the like, and its thermal conductivity is not so high, but at least the insertion portion 102 having higher thermal conductivity than the cable boot 22 is inserted into the cable boot 22. Thereby, a member with high heat conductivity can be extended to back. Thereby, the heat from the heat conduction frame 110 is further propagated backward.

  FIG. 10 is a rear enlarged view of a vertical cross-sectional view of the ultrasonic probe shown in FIG. The heat receiving plate 100 of the flange 52 is housed in the rearmost part in the probe case in a state where the front side surface 100a is in close contact with the rear side surface 110a of the heat conducting frame 110. Further, since the insertion portion 102 extends rearward from the heat receiving plate 100 while being inserted into the cable boot 22, the insertion portion 102 has a circular hole 112 having an opening on the rear side surface of the probe case (this is notches 16a and 18a ( (See FIG. 3) to the inner region of). In the present embodiment, the insertion portion 102 extends to the rear side surface of the probe case. From the viewpoint of drawing heat more rearwardly, the insertion portion 102 is preferably inserted into the cable boot 22 as long as possible. However, since the flange 52 is a metal and is a rigid body, if the insertion portion 102 is too long, the cable 20 becomes difficult to bend, and the ultrasonic probe 10 becomes difficult to handle. Therefore, the amount of insertion of the insertion portion 102 into the cable boot 22 is determined in consideration of the amount of heat drawn backward and the ease of handling the cable 20.

  In the present embodiment, the cable 20 is inserted through the hole 104 of the flange 52 together with the outer skin thereof, and the inner surface of the hole 104 and the outer skin of the cable 20 are in contact with each other. The cable 20 may be inserted into the hole 104 in a state where the sheath is exposed, and the inner surface of the hole 104 and the ground sheath may be brought into contact with each other. Thereby, the heat receiving plate 100 can propagate the heat drawn backward by the receiving insertion portion 102 to the ground sheath, and the heat can be further propagated backward by the ground sheath.

  Moreover, since the flange 52 is formed of a material harder than the cable boot 22 as described above, a protective function for protecting the cable 20 is also exhibited. In particular, as described above, the insertion portion 102 of the flange 52 has entered the inner region of the hole 112 provided at the rearmost portion of the probe case, so that the cable 20 when the cable 20 is bent or pulled. It is possible to reduce the load applied to the connection portion of the 20 ultrasonic probes 10.

  10 Ultrasonic Probe, 12 Acoustic Lens, 14 Front Case, 16 Upper Case, 18 Lower Case, 20 Cable, 22 Cable Boot, 22a Flange Hole, 22b, 104, 112 Hole, 26 Transceiver Unit, 28 Relay Board, 32, 80 Center frame, 34, 82 Upper frame, 34a, 36c, 60a, 100a Front side, 34b, 36e, 110a Rear side, 36, 84 Lower frame, 36a, 86c, 86d Groove, 36b, 62a, 86a Hypertrophy Part, 36d shelf part, 40, 44 contact part, 42 connector, 46 wire rod, 48 ground sheath wire, 50 screw, 52 flange, 60 heat receiving plate, 60b flat surface, 60c recess, 62 rear extension plate, 62b slope, 64 hollow Part, 70 solid arrow, 72 dashed arrow, 8 Outer extending portion, 86b inner surface 100 heat receiving plate, 102 insertion portion 110 thermally conductive frame.

Claims (5)

A heat receiving block disposed behind the electronic circuit and receiving heat from the electronic circuit;
An inner heat conductor that continues to the heat receiving block and extends rearward from the center of the rear side of the heat receiving block;
A hollow outer heat conduction having an end portion connected to a rear side end portion of the heat receiving block, extending rearward from the rear side end portion, and connected to left and right side ends of the inner heat conductor. Body,
A case that encloses the outer heat conductor and dissipates heat from the outer heat conductor;
With
An inner heat conduction path through which heat is transferred from the heat receiving block through the inner heat conductor to the outer heat conductor and an outer heat conduction path through which heat is directly transferred from the heat receiving block to the outer heat conductor are formed. The
An ultrasonic probe characterized by that. At least one of the end part of the inner heat conductor on the heat receiving block side and the end part of the outer heat conductor is enlarged,
The ultrasonic probe according to claim 1, wherein: The thickness of the case is uniform at least in a portion covering the outer heat conductor,
The ultrasonic probe according to claim 1, wherein the ultrasonic probe is characterized in that: The outer heat conductor has a sandwiching portion that sandwiches the left and right ends of the inner heat conductor.
The ultrasonic probe according to any one of claims 1 to 3, wherein the ultrasonic probe is characterized in that: The heat receiving block and the inner heat conductor constitute an integral molded body,
The ultrasonic probe according to any one of claims 1 to 4, wherein the ultrasonic probe is characterized in that: