JP6603092B2 - Ultrasonic probe - Google Patents

Description

  The present invention relates to an ultrasonic probe, and more particularly to a structure for grounding ground electrodes of a plurality of transducers.

  Ultrasound diagnostic apparatuses are used in the medical field. An ultrasound diagnostic apparatus is an apparatus that transmits and receives ultrasound to and from a subject and forms an ultrasound image based on a reception signal obtained thereby. Ultrasonic transmission / reception is performed by an ultrasonic probe connected to the apparatus main body by wire or wirelessly.

  The ultrasonic probe has a transducer array including a plurality of transducers. A signal (transmission signal) sent from each transmission path is given to each transducer. Thereby, each vibrator vibrates and ultrasonic waves are transmitted. In the plurality of transducers, electrodes are provided on the upper side (in the ultrasonic transmission direction side) and on the lower side, which is the opposite side. Typically, the upper electrode is grounded (connected to the ground), and a transmission signal is applied to the lower electrode. At the time of reception, each transducer that receives the reflected wave vibrates, and a reception signal is extracted from the lower electrode.

  Conventionally, a structure for grounding the ground electrodes of a plurality of vibrators has been proposed. For example, in a laminated body including a matching layer, a vibrator array, a backing material, and the like, a conductive ground film is laminated so as to be in contact with the ground electrodes of a plurality of vibrators, and an end of the ground film is formed from a side surface of the laminated body. There has been proposed a structure that is drawn out and connected to a ground point on a circuit board located below the laminated body.

  Further, in Patent Document 1, in a laminate including an acoustic lens, first and second matching layers, a vibrator, and a backing material, a ground wire is electrically connected to a ground electrode of the vibrator, and the ground wire is A structure connected to a predetermined ground point is disclosed.

JP 2001-74710 A

  In the ground connection method using the above-described ground film, a ground film having a thickness of about several μm is used, so that the electrical resistance between each vibrator and the grounding point becomes relatively high. As a result, the ground electrode of each vibrator is not suitably grounded (the ground is weak).

  Also in the ground connection method using the ground wire described in Patent Document 1, it is difficult to use a thick wire inside the ultrasonic probe, and it is considered that a thin wire must be used as the ground wire. Therefore, the electrical resistance of the ground wire becomes relatively high, and the ground electrode of each vibrator is not properly grounded.

  Therefore, a structure for suitably grounding the ground electrode of the vibrator is desired.

  On the other hand, when the ultrasonic probe operates, when the transducer array or the electronic circuit is built in the ultrasonic probe, heat is generated in the electronic circuit. Since the ultrasonic probe is brought into contact with the subject, there is also a demand for preventing the heat from moving to the subject side.

  An object of the present invention is to enhance the ground path to the ground electrode of each vibrator. Alternatively, an object of the present invention is to limit the movement of heat generated in the ultrasonic probe toward the subject.

An ultrasonic probe according to the present invention includes a laminated body block including a transducer array including a plurality of arranged transducers , and a circuit board provided below the laminated body block and in parallel to the lower surface of the laminated body block a is, the electrically connected electronic circuit transducer array, and has a ground bump group is provided on the upper side ground, circuitry board and the plurality of transducers of the ground electrode, and A conductive member electrically connected to a ground point on the circuit board , directly connected to the ground bump group of the circuit board , and at least of the transducer array along a side surface of the multilayer block And a ground frame having a thick plate-like portion extending to the side surface.

  In the above configuration, the ground frame is formed of, for example, metal (copper, aluminum, or the like) and is electrically connected to the ground electrodes and grounding points of the plurality of vibrators. The ground frame is thick, that is, has a certain thickness (preferably 1.0 mm or more), and has a plate-like portion extending along the side surface of the laminate block. For this reason, since the ground path between the ground electrodes of the plurality of vibrators and the ground point on the circuit board is formed by a thick plate-like portion, at least when the ground path is formed by a ground film or a thin wire rod Compared to the above, the electrical resistance between the two is reduced. That is, the ground path to the ground electrodes of the plurality of vibrators is strengthened.

  Preferably, the ground frame exhibits a heat conduction function for transferring heat generated in the transducer array to an outer space of the ultrasonic probe. Since the ground frame extends to the side surface of the transducer array, the heat generated in the transducer array is preferably absorbed by the ground frame. The heat absorbed by the ground frame is released to the outer space of the ultrasonic probe via, for example, a heat conductor thermally connected to the ground frame. Thereby, propagation of the heat generated in the transducer array to the subject side (ultrasonic wave transmitting / receiving surface side) can be limited.

  Preferably, the ground frame has a hollow block shape covering four side surfaces of the laminate. If the ground frame has a hollow block shape, the electrical resistance between the ground electrodes of the multiple vibrators and the ground point on the circuit board is further reduced, that is, the ground path to the ground electrodes of the multiple vibrators is enhanced. The Further, by adopting a hollow block shape, heat can be absorbed from the four side surfaces of the transducer array. That is, heat from the vibrator can be absorbed more suitably. Furthermore, a shield function is exhibited by covering the four side surfaces of the transducer array with a grounded ground frame, and the influence of external electrical noise can be reduced.

  Preferably, the ground frame exhibits a support function for supporting the laminate block. Conventionally, the laminate block has to be self-supporting on the circuit board, and each layer included in the laminate block has to have a certain strength or more. When the ground frame exhibits a supporting function, it is possible to reduce the strength of each layer included in the laminate as compared with the conventional case. Thereby, for example, in forming the backing material, the backing performance (ultrasonic attenuation performance) can be prioritized over the strength.

  Desirably, an acoustic matching layer provided across the laminated body block and the upper portion of the ground frame, the conductive acoustic matching layer being electrically connected to the plurality of vibrators and the ground frame. Further prepare. According to this configuration, the ground electrodes and the ground frames of the plurality of transducers are electrically connected by the acoustic matching layer that is provided in the ultrasound transmission / reception path and adjusts the acoustic impedance between the subject and the transducer array. Connected. Thereby, it is possible to electrically connect the ground electrodes and the ground frames of the plurality of vibrators while suppressing deterioration of the ultrasonic characteristics.

  According to the present invention, the ground path to the ground electrode of each vibrator can be strengthened. Alternatively, an object of the present invention can limit the movement of heat generated in an electronic circuit disposed below a plurality of vibrators to the subject side.

It is an external appearance perspective view of the ultrasonic probe concerning this embodiment. It is a disassembled perspective view of the ultrasonic probe which concerns on this embodiment. It is an enlarged view of a transmission / reception unit. It is sectional drawing of a transmission / reception unit. It is a figure which shows the arrangement | positioning area | region of a ground bump. It is a figure which shows a mode that a laminated body is couple | bonded with a conductive frame. It is a figure which shows a mode that a laminated body is couple | bonded with an electroconductive flame | frame by another method. It is sectional drawing of the modification of a transmission / reception unit.

  Hereinafter, embodiments of an ultrasonic probe according to the present invention will be described.

  FIG. 1 is an external perspective view of an ultrasonic probe 10 according to this embodiment. The ultrasonic probe 10 has a shape extending in the vertical direction (y-axis direction in FIG. 1), and transmits and receives ultrasonic waves via an ultrasonic wave transmitting / receiving surface 12 provided at the top.

  The ultrasonic probe 10 has an upper case 14 and a lower case 16 as a waterproof or antibacterial skin. The upper case 14 and the lower case 16 are united by being combined. This constitutes a probe case. The upper case 14 and the lower case 16 are preferably made of a material having a high waterproof property, antibacterial property, and insulating property. In the present embodiment, the upper case 14 and the lower case 16 are made of resin.

  A cable 18 connected to the ultrasonic diagnostic apparatus main body extends from the lowermost part of the ultrasonic probe 10. A cable protection boot 20 is provided to protect the joint between the cable 18 and the lower case 16.

  In this specification, the short direction of the ultrasonic probe 10 is the x axis, the long direction is the y axis, and the direction orthogonal to the x axis and the y axis is the z axis. Further, the side on which the ultrasonic wave transmitting / receiving surface 12 is provided (the positive direction side of the y axis) is described as “upper side”, and the opposite direction (the negative direction side of the y axis) is described as “lower side”.

  FIG. 2 is an exploded perspective view of the ultrasonic probe 10. The ultrasonic probe 10 includes a transmitter / receiver unit 30 including a transducer array, a lead array built-in backing, or a conductive frame (all of which will be described later) inside the case, and an upper side that transfers heat from the transducer array to the upper case 14. Thermal conductor 32, lower thermal conductor 34 for transferring heat from the electronic circuit to the lower case 16, and FPC that is electrically connected to the electronic circuit via the relay substrate and serves as a signal path from the ultrasonic diagnostic apparatus body (Flexible Printed Circuits) 36, a wire 38 connected to the FPC 36, and a connector 40 that relays between the FPC 36 and the wire 38.

  FIG. 3 is an enlarged view of the wave transmitting / receiving unit 30. FIG. 3 is a schematic diagram for explaining a stacking state (stacking order) of each layer included in the transmission / reception unit 30. The wave transmitting / receiving unit 30 is composed of a plurality of stacked members. The wave transmitting / receiving unit 30 includes, in order from the top, an acoustic lens 50, an acoustic matching layer 52, a transducer array 54, a hard backing layer 56, a lead array built-in backing 58, a relay substrate 60, and an ASIC 62 that is an electronic circuit. Yes. In the present specification, a laminated body including the transducer array 54, the hard backing layer 56, and the lead array built-in backing 58 is referred to as a “laminated body block”. The laminated body block has a substantially rectangular parallelepiped shape. The wave transmitting / receiving unit 30 is provided with a ground sheet and a conductive frame as will be described later, but these are not shown in FIG.

  The acoustic matching layer 52 adjusts acoustic impedance between the transducer array 54 and the subject so that the ultrasonic waves transmitted from the transducer array 54 can suitably enter the subject. is there. The acoustic matching layer 52 is formed of resin, carbon, metal filler, or a compound thereof. The acoustic matching layer 52 is conductive. Although not shown in FIG. 3, the area of the xz plane of the acoustic matching layer 52 is larger than the area of the xz plane of the layers below that, that is, the laminate block.

  The transducer array 54 is composed of a plurality of transducers. The vibrator is a piezoelectric element, and repeats expansion and expansion when a voltage is applied. That is, it vibrates. Thereby, an ultrasonic wave is generated. An upper electrode layer is provided on the upper surface of the transducer array 54, and a lower electrode layer is provided on the lower surface. In the present embodiment, the upper electrode layer is a ground electrode layer and is grounded. A signal (transmission signal) from the ASIC 62 is applied to the lower electrode layer.

  When the ultrasonic probe 10 operates, heat is generated in the plurality of vibrators. The amount of heat generated in the vibrator varies depending on the operating condition of the vibrator (that is, ultrasonic transmission / reception conditions). Specifically, the heat generation amount in the plurality of vibrators increases as the ultrasonic transmission intensity increases or the ultrasonic transmission pulse interval (PRT) decreases. That is, it can be said that the heat generation amount increases as the image quality of the obtained ultrasonic image is better.

  The hard backing layer 56 uses the acoustic impedance difference as a vibration node on the back side of the transducer array 54. The hard backing layer 56 includes a plurality of elements corresponding to a plurality of vibrators. One vibrator and one hard backing element constitute a vibrating body, and the hard backing element functions like a resonator in the vibrating body. The hard backing layer 56 is conductive. The hard backing layer 56 can be omitted.

  The lead array built-in backing 58 suppresses excessive vibration of the transducer array 54. The lead array built-in backing 58 has a lead array composed of a plurality of leads (conductive wires) extending in the vertical direction. Each lead included in the lead array corresponds to each transducer included in the transducer array 54. A plurality of transmission signals output in parallel from the ASIC 62 are sent to the transducer array 54 via the lead array. An upper electrode surface and a lower electrode surface are formed on the upper and lower surfaces of the lead array built-in backing 58.

  The relay substrate 60 is formed of a material such as glass epoxy or LTCC (Low Temperature Co-fired Ceramics). The relay substrate 60 is a multilayer substrate, and electrical wiring is provided in each layer. On the lower surface of the relay substrate 60, the ASIC 62 is mounted in the approximate center, and a chip component such as a capacitor or thermistor is surface-mounted around the ASIC 62. In addition, a bump array including a plurality of metal bumps connected to each pattern in the relay substrate 60 and a grounded ground bump are provided on the upper side surface of the relay substrate 60. The bump array and the ground bump will be described later.

  The ASIC 62 functions as a transmission sub beam former and a reception sub beam former. As a transmission sub-beamformer, a plurality of transmission signals having a delay relationship are generated in accordance with a signal from the ultrasonic diagnostic apparatus main body, and these are transmitted to each transducer. As a reception sub-beamformer, a reception signal is generated by performing phasing addition processing on a plurality of reception signals obtained from each transducer. The received signal is sent to the ultrasonic diagnostic apparatus main body and processed in the apparatus main body to generate one beam data. As the ASIC 62 performs the above processing, the number of signal lines between the ultrasonic probe 10 and the apparatus main body is reduced. Note that heat is generated also in the ASIC 62 by the operation of the ultrasonic probe 10.

  FIG. 4 is a yz sectional view of the wave transmitting / receiving unit 30. As shown in FIG. 4, in the acoustic matching layer 52, the transducer array 54, and the hard backing layer 56, a plurality of lattice-shaped grooves 70 are formed by a dicing saw or the like. Thereby, a plurality of transducers are formed in the transducer array 54, and the members of each layer are divided into portions corresponding to the respective transducers. Of the plurality of transducers included in the transducer array 54, the transducer located at the outermost periphery is a dummy transducer that is not used in transmitting and receiving ultrasonic waves.

  The plurality of grooves 70 reach the upper surface of the lead array built-in backing 58. As a result, the upper electrode surface formed on the upper surface of the lead array built-in backing 58 is also divided into a lattice pattern, and a plurality of upper electrode pads corresponding to a plurality of transducers are formed.

  A plurality of grid-like grooves 72 are also formed on the lower surface of the lead array built-in backing 58. As a result, the lower electrode surface formed on the lower surface of the lead array built-in backing 58 is also divided into a lattice pattern, and a plurality of lower electrode pads are formed. A plurality of lower electrode pads also correspond to a plurality of vibrators.

  As described above, the bump array 74 is formed on the upper surface of the relay substrate 60. The metal bumps included in the bump array 74 are formed of a metal such as solder or gold. The metal bumps included in the bump array 74 and the lower electrode pads of the lead array built-in backing 58 come into contact with each other so that they are electrically connected.

  Metal bumps 74 a located on the outermost periphery of the bump array 74 are connected to a ground pattern 76 a (a grounded line) of the relay substrate 60. The other metal bumps 74b are connected to the signal pattern 76b of the relay substrate 60, and a signal is transmitted between the transducer array 54 and the ASIC 62 via the lead 58a and the conductive hard backing layer 56 (divided hard backing element). Sent and received.

  A ground bump group 78 is provided on the upper side surface of the relay substrate 60. The ground bump group 78 is connected to the ground pattern 76a of the relay substrate 60, that is, the ground bump group 78 is grounded. A conductive frame 80 described later is connected to the ground bump group 78.

  Hereinafter, the conductive frame 80 and the ground sheet 82 will be described with reference to FIG. 4.

  The conductive frame 80 forms a ground path between the upper electrode layer of the transducer array 54 and the ground pattern of the relay substrate 60 (ASIC 62), absorbs heat generated in the transducer array 54, and exceeds the heat. It is propagated to the external space of the acoustic probe 10.

  The conductive frame 80 is formed of a metal such as copper or aluminum and is disposed on the relay substrate 60. The conductive frame 80 is configured to include a plate-like portion extending upward from the relay substrate 60 along the side surface of the laminate block. The plate-like portion is thick and has a thickness of 0.1 mm or more, preferably 1.0 mm or more. Desirably, the said plate-shaped part is directly contacting the side surface of the laminated body block (especially vibrator array 54), and an adhesive etc. are not filled between both. Thereby, the heat from the transducer array 54 can be more suitably propagated to the conductive frame 80.

  In the present embodiment, the conductive frame 80 has a hollow block shape in which four plate-like portions provided along the four side surfaces of the laminate block are integrated. Thereby, the electroconductive frame 80 forms the exoskeleton of a laminated body block. Further, the conductive frame 80 may be composed of one or a plurality of plate-like conductive plates extending upward from the relay substrate 60 along some side surfaces (for example, two side surfaces) of the laminate block. Good. Even in this case, each conductive plate is thick and is formed with the above-described thickness.

  The conductive frame 80 extends upward from the relay substrate 60 to the side surface of the transducer array 54, and the upper surface thereof is in contact with the lower surface of the acoustic matching layer 52. That is, in the present embodiment, the acoustic matching layer 52 is laminated on the upper side of the laminate block and the conductive frame 80 so as to straddle both. As a result, the conductive frame 80 is not positioned on the side of the acoustic matching layer 52. The conductive frame 80 is formed of metal as described above, and these become high-frequency reflectors of ultrasonic waves. By not disposing the conductive frame 80 on the side of the acoustic matching layer 52, the ultrasonic waves from the transducer array 54 are prevented from being reflected on the side surfaces of the acoustic matching layer 52, thereby preventing deterioration of the ultrasonic characteristics. ing.

  The conductive frame 80 is connected to a ground bump group 78 provided on the surface of the relay substrate 60 by soldering or a conductive adhesive. As a result, the conductive frame 80 is grounded. In FIG. 5, an arrangement region 78a of the ground bump group 78 is shown. FIG. 5 is a plan view of the relay board 60. As shown in FIG. 5A, when the conductive frame 80 has a hollow block shape, an arrangement region 78a is provided so as to surround four directions of the bump area 74c where the bump array 74 is arranged. Further, when the conductive frame 80 is composed of two conductive plates provided along the two side surfaces of the laminate block, as shown in FIG. 5B, along the two opposing sides of the bump area 74c. An arrangement region 78a is provided.

  Returning to FIG. 4, the ground sheet 82 is a substantially rectangular sheet-like member in plan view. The ground sheet 82 has a two-layer structure including a conductive layer 84 and an insulating layer 86. In the present embodiment, the insulating layer 86 is formed of a resin such as PET (Polyethylene Terephthalate). The conductive layer 84 is formed of a metal such as gold. The thickness of the conductive layer 84 is preferably as thick as possible from the viewpoint of reducing electrical resistance (that is, strengthening the ground path to the upper electrode layer of the transducer array 54). However, since the ground sheet 82 is laminated on the acoustic matching layer 52 as described later, that is, disposed on the transmission path of the ultrasonic waves transmitted from the transducer array 54 to the subject, From the viewpoint, the ground sheet 82 is preferably thin. Therefore, the thickness of the ground sheet 82 is determined in consideration of the ground intensity and ultrasonic characteristics of the transducer array 54.

  The ground sheet 82 is provided on the upper side of the acoustic matching layer 52. The ground sheet 82 is attached so that the conductive layer 84 is on the lower side and the insulating layer 86 is on the upper side. Thereby, the conductive layer 84 and the conductive acoustic matching layer 52 are electrically connected.

  The length of the ground sheet 82 in the z-axis direction (left-right direction) is longer than the length of the acoustic matching layer 52 and the conductive frame 80 in the left-right direction. Therefore, the ground sheet 82 has a main body portion 82 a stacked on the upper side of the acoustic matching layer 52, and an end portion 82 b that protrudes laterally from the left and right ends of the acoustic matching layer 52 and hangs downward. The end portion 82 b that hangs downward reaches the outer side of the conductive frame 80. That is, the length of the ground sheet 82 in the left-right direction is such that the lower end of the end portion 82 b that hangs downward is positioned at least below the upper end of the outer side surface of the conductive frame 80.

  When the end portion 82b hangs downward, the conductive layer 84 is positioned on the conductive frame 80 side (inner side), and the insulating layer 86 is positioned on the outer side. That is, the conductive layer 84 at the right end 90b and the outer side surface of the conductive frame 80 face each other. And the conductive layer 84 of the edge part 82b and the outer side surface of the conductive frame 80 are connected. In the present embodiment, both are bonded by the conductive adhesive 88. Alternatively, both may be pressure bonded. Thereby, the conductive layer 84 and the conductive frame 80 are electrically connected. Preferably, all of the opposing portions are bonded between the conductive layer 84 of the end portion 82b and the outer side surface of the conductive frame 80. Thereby, the contact resistance between both is reduced more.

  From the viewpoint of reducing contact resistance, the contact area between the conductive layer 84 and the outer side surface of the conductive frame 80 is preferably as large as possible. That is, it is preferable to increase the area of the ground sheet 82 and increase the length of the end portion 82b that hangs downward. On the other hand, when the heat dissipation of the conductive frame 80 is taken into consideration, it is preferable that the side surface of the conductive frame 80 is exposed. Therefore, the contact area between the conductive layer 84 and the outer side surface of the conductive frame 80 (that is, the hanging length of the end portion 82b) is determined in consideration of contact resistance and heat dissipation.

  Similarly, the length of the ground sheet 82 in the x-axis direction (front-rear direction) is longer than the lengths of the acoustic matching layer 52 and the conductive frame 80 in the left-right direction. The end portion 82b of 82 and the conductive frame 80 are electrically connected.

  The structure of the transmission / reception unit 30 is as described above. According to the above structure, the upper electrode of each vibrator has the conductive acoustic matching layer 52 (acoustic matching element divided by the groove 70) laminated on the upper side thereof, the conductive layer 84 of the ground sheet 82, the conductive property. It is connected to the ground bump group 78 of the relay substrate 60 which is a ground point through the adhesive 88 and the conductive frame 80. Thereby, the upper electrode of each vibrator is grounded.

  In the ground path extending in the vertical direction between the transducer array and the grounding point located below, an extremely thin ground film or a thin ground wire has been conventionally used. According to the present embodiment, the ground path The path is made of thick metal. That is, the cross-sectional area of the ground path is increased as compared with the conventional case. Therefore, the electrical resistance between the upper electrode of the vibrator and the ground point is reduced as compared with the conventional case, that is, the ground path to the upper electrode of the vibrator is strengthened.

  Between the conductive frame 80 and the conductive layer 84 of the ground sheet 82, the outer side surface of the conductive frame 80 and the conductive layer 84 are connected by surface contact. Thereby, the contact resistance between the two is reduced, that is, the ground path to the upper electrode of each vibrator is strengthened.

  Further, the conductive frame 80 is located on the side surface of the transducer array 54, and preferably is in direct contact with the side surface of the transducer array 54. Thereby, heat from the transducer array 54 propagates to the conductive frame 80. The heat absorbed by the conductive frame 80 is released to the outer space of the ultrasonic probe 10 through the upper thermal conductor 32 that is thermally connected to the conductive frame 80. That is, the conductive frame 80 also exhibits a heat conduction function for propagating heat from the transducer array 54 to the outer space of the ultrasonic probe 10. Thereby, it is possible to suitably limit the heat generated in the transducer array 54 from propagating upward (to the subject side). By suitably limiting the propagation of heat generated in the transducer array 54 to the subject side, it is possible to make the intensity of the transmitted ultrasonic wave stronger than before.

  Further, if the conductive frame 80 has a hollow block shape covering the four side surfaces of the multilayer block, the four side surfaces of the multilayer block are surrounded by the ground potential. Thus, the conductive frame 80 also exhibits a shielding effect that reduces the influence of external electrical noise.

  Further, if the conductive frame 80 is a hollow block shape, the conductive frame 80 becomes an exoskeleton structure of the laminate block. Since the conductive frame 80 is a thick metal and has a predetermined strength, the conductive frame 80 also exhibits a support function for supporting the laminate block. Thereby, it becomes possible to reduce the intensity | strength of each layer contained in a laminated body block. For example, the lead array built-in backing 58 can be formed with priority given to ultrasonic attenuation performance over its strength.

  Hereinafter, with reference to FIGS. 6 and 7, a method of combining the laminated body block including the transducer array 54, the hard backing layer 56, and the lead array built-in backing 58, the acoustic matching layer 52, and the conductive frame 80 will be described. .

  FIG. 6 shows a first combination method. In the first combination method, the acoustic matching layer 52 includes a frame-shaped outer matching layer 52a having a rectangular hole 100 at the center and an inner matching layer 52b stacked on the upper side of the laminate block in a stage before assembly. It is divided into and. The width and depth of the inner matching layer 52b are smaller than the width and depth of the laminate block. Accordingly, the outer peripheral portion of the upper surface of the multilayer block (vibrator array 54) is exposed in a state where the inner matching layer 52b is laminated on the multilayer block (hereinafter referred to as a multilayer unit). The conductive frame 80 has a rectangular tube shape (that is, a hollow block shape) having holes 102.

First, the outer matching layer 52 a is bonded to the upper surface of the conductive frame 80. The side width w ₁ of the outer matching layer 52 a is larger than the side width w ₂ of the conductive frame 80. Therefore, in a state where both are bonded, the inner portion of each side of the outer matching layer 52 a protrudes inward from the inner end of each side of the conductive frame 80. Thereafter, the laminated unit is inserted into the hole 102 of the conductive frame 80. Since the hole 100 of the outer matching layer 52a is sized to fit the inner matching layer 52b, the inner matching layer 52b is fitted into the hole 100 of the outer matching layer 52a when the stacked unit is inserted into the hole 102. Combined. Thus, the acoustic matching layer 52 is formed by integrating the outer matching layer 52a and the inner matching layer 52b.

  Here, a part (inner part) of the outer matching layer 52 a protruding inward from the inner end of each side of the conductive frame 80 serves to position the laminated unit with respect to the conductive frame 80. That is, the laminated unit may be pushed into the hole 102 until the lower surface of the inner portion of the outer matching layer 52a protruding inward contacts the exposed upper surface of the outer peripheral portion of the laminated block (vibrator array 54). .

  FIG. 7 shows a second combination method. In the second combination method, the acoustic matching layer 52 is first laminated on the laminate block, and then the four conductive plates 80a to 80b are joined to the side of the laminate block. The four conductive plates 80a to 80b are bonded to the laminate block and then bonded with a conductive adhesive or the like to form the conductive frame 80.

  FIG. 8 shows a transmission / reception unit 110 according to a modification. Members that are included in the transmission / reception unit 110 and that are the same as those of the transmission / reception unit 30 according to the basic embodiment described above are given the same reference numerals, and descriptions thereof are omitted.

  Compared with the transmission / reception unit 30, the transmission / reception unit 110 is provided with a conductive second acoustic matching layer 112 across the acoustic matching layer 52 and the upper part of the conductive frame 80 instead of the ground sheet 82. Yes. The second acoustic matching layer 112 is electrically connected to the acoustic matching layer 52 and the conductive frame 80.

  As shown in FIG. 8, the acoustic matching layer 52, the transducer array 54, and the hard backing layer 56 are divided by the grooves 70, but the second acoustic matching layer 112 is not divided. That is, the second acoustic matching layer 112 is bonded to the upper portion of the acoustic matching layer 52, the transducer array 54, and the hard backing layer 56 with a conductive adhesive or the like after the division process.

  According to the configuration of the transmission / reception unit 110, the upper electrode of each transducer is electrically connected to the ground via the conductive acoustic matching layer 52 and the conductive second acoustic matching layer 112 stacked on the upper electrode. Connected to the sex frame 80. Thereby, the upper electrode of each vibrator is grounded.

  In the configuration of the transmission / reception unit 110, since the ground sheet 82 is not provided in the ultrasonic transmission / reception path, deterioration of ultrasonic characteristics can be suppressed as compared with the transmission / reception unit 30. Further, the manufacturing process can be simplified as compared with the case where the ground sheet 82 is provided.

  As mentioned above, although embodiment which concerns on this invention was described, this invention is not limited to the said embodiment, A various change is possible unless it deviates from the meaning of this invention.

  10 Ultrasonic Probe, 12 Ultrasonic Transceiving Surface, 14 Upper Case, 16 Lower Case, 18 Cable, 20 Cable Protection Boot, 30, 110 Transceiving Unit, 32 Upper Thermal Conductor, 34 Lower Thermal Conductor, 36 FPC , 38 wire rod, 40 connector, 50 acoustic lens, 52 acoustic matching layer, 52a outer matching layer, 52b inner matching layer, 54 transducer array, 56 hard backing layer, 58 lead array built-in backing, 58a lead, 60 relay board, 62 ASIC, 70, 72 groove, 74 bump array, 74a, 74b metal bump, 74c bump area, 76a ground pattern, 76b signal pattern, 78 ground bump group, 80 conductive frame, 80a, 80b, 80c, 80d conductive plate, 82 Ground 84, conductive layer, 86 insulating layer, 88 conductive adhesive, 100, 102 holes, 112 second acoustic matching layer.

Claims (5)

A laminate block including a transducer array composed of a plurality of arranged transducers;
A circuit board provided in parallel to the lower surface of the laminate block below the laminate block , and an electronic circuit electrically connected to the transducer array , and provided on the upper surface and grounded It has a ground bumps group, a circuitry substrate,
The ground electrode of the plurality of vibrators and a conductive member electrically connected to a ground point on the circuit board, and directly connected to the ground bump group of the circuit board, A ground frame having a thick plate-like portion extending along the side surface to at least the side surface of the transducer array;
An ultrasonic probe comprising: The ground frame exhibits a heat conduction function for transferring heat generated in the transducer array to an outer space of the ultrasonic probe.
The ultrasonic probe according to claim 1, wherein: The ground frame has a hollow block shape covering four side surfaces of the laminate block.
The ultrasonic probe according to claim 1, wherein the ultrasonic probe is characterized in that: The ground frame exhibits a support function for supporting the laminate block,
The ultrasonic probe according to claim 3, wherein: An acoustic matching layer provided across the laminated body block and the upper part of the ground frame, further comprising a conductive acoustic matching layer electrically connected to the plurality of vibrators and the ground frame;
The ultrasonic probe according to any one of claims 1 to 4, wherein the ultrasonic probe is characterized in that: