KR101018626B1 - Ultrasonic probe having a heat sink - Google Patents

Ultrasonic probe having a heat sink Download PDF

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Publication number
KR101018626B1
KR101018626B1 KR1020080071290A KR20080071290A KR101018626B1 KR 101018626 B1 KR101018626 B1 KR 101018626B1 KR 1020080071290 A KR1020080071290 A KR 1020080071290A KR 20080071290 A KR20080071290 A KR 20080071290A KR 101018626 B1 KR101018626 B1 KR 101018626B1
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KR
South Korea
Prior art keywords
heat sink
ultrasonic probe
heat
layer
heat conduction
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Application number
KR1020080071290A
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Korean (ko)
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KR20100010358A (en
Inventor
임성민
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주식회사 휴먼스캔
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Priority to KR1020080071290A priority Critical patent/KR101018626B1/en
Publication of KR20100010358A publication Critical patent/KR20100010358A/en
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/54Control of the diagnostic device
    • A61B8/546Control of the diagnostic device involving monitoring or regulation of device temperature
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004Mounting transducers, e.g. provided with mechanical moving or orienting device

Abstract

The present invention relates to an ultrasonic probe having a heat sink, and in the ultrasonic probe, a heat sink for radiating heat is installed on a rear layer. Therefore, the present invention allows the heat generated from the piezoelectric material to be quickly discharged to the heat sink through the back layer to suppress the degradation of the piezoelectric characteristics, thereby preventing degradation of the ultrasonic probe and deterioration of durability, and preventing heat generation of the acoustic lens. The temperature of the contact surface is lowered, and the ultrasonic wave absorbed by the rear layer is prevented from being reflected back to the front surface, thereby maintaining the performance of the ultrasonic probe.
Back layer, heat sink, ultrasonic wave, probe, acoustic lens, piezoelectric body, heat conduction groove, heat conduction protrusion

Description

Ultrasonic probe with heat sink {ULTRASONIC PROBE HAVING A HEAT SINK}

The present invention relates to an ultrasonic probe having a heat sink to reduce the temperature of the contact surface with a patient by suppressing the degradation of the piezoelectric property to prevent degradation of performance and deterioration of durability of the ultrasonic probe and to prevent heat generation of the acoustic lens.

In general, an ultrasound imaging apparatus generally includes an ultrasonic probe that is responsible for converting electrical and ultrasonic signals, a signal processor that processes transmitted and received signals, and a display unit that displays an image using signals obtained from the ultrasonic probe and the signal processor. .

Among them, the ultrasonic probe converts a signal and is an important part that determines the quality of an ultrasound image. That is, the ultrasonic probe functions to convert electrical energy and acoustic energy into mutual. As a basic condition to be equipped with such an ultrasonic probe, the electro-acoustic conversion efficiency (electromechanical coupling coefficient), the ultrasonic pulse pulse characteristics, and the focus characteristic or focusing property of the ultrasonic beam should be good.

Referring to the accompanying drawings, a conventional ultrasonic probe for medical purposes is as follows.

1 is a cross-sectional view showing a medical ultrasound probe according to the prior art. As shown, the medical ultrasound probe 10 according to the related art includes an acoustic lens 11, a matching layer 12, a piezoelectric body 13, and a rear layer 14 from a front portion contacting a patient. Is arranged.

The acoustic lens 11 is formed to cover the entire surface of the matching layer 12 to focus the ultrasonic waves.

The matching layer 12 is formed on the electrode of the ultrasonic transmission / reception surface of the piezoelectric element 13 to increase the reflectance and efficiency of the ultrasonic waves.

The piezoelectric body 13 is bonded to the front surface of the rear layer 14, and is connected to the main PCB by FPCB (Flexible Printed Circuit Board; 15), converts the electrical signal into ultrasonic waves, which are acoustic signals, and emits them into the air and reflects in the air. The ultrasonic reflection signal is then converted back into an electrical signal and sent to the device.

The back layer 14 is fixed by the filling of silicon in the state of being located in the case 16 and absorbs unnecessary ultrasonic waves emitted to the rear.

As such, the conventional medical ultrasound probe 10 is divided into two types according to the use, the first is an image probe used in an image diagnosis device, and the second is a high intensity focused ultrasound treatment (HiFU) such as cancer treatment and lipolysis. Therapeutic probe used in the system.

Ultrasonic probes for imaging have become smaller and smaller in size as more and more devices have been mounted in recent years to increase resolution. Smaller devices have large differences in electrical impedance between the imaging device and the probe device. As a result, electrical energy that cannot be converted into ultrasonic waves is converted into thermal energy and lost.

Unlike the ultrasound probe for imaging, the therapeutic ultrasound probe requires a high output, thereby increasing the heating of the device itself.

The exothermic phenomenon in such a medical ultrasonic probe should be suppressed for two reasons.

First, since the piezoelectric material used for the ultrasonic probe has a weak characteristic to heat, it exhibits deterioration when continuously exposed to high temperature. This causes the degradation of the performance of the probe itself and the durability of the probe.

Second, since the ultrasound probe is a product used in contact with the patient, the temperature of the contact surface with the patient is limited. Since the temperature of the contact surface with the patient rises due to the heat generated by the ultrasonic probe itself, the temperature should not exceed the limit temperature. Therefore, in the case of an ultrasonic probe having a high fever, the voltage applied to the ultrasonic probe should be lowered. Since this lowers the output of the ultrasonic probe, this also causes a decrease in performance.

As described above, the medical ultrasonic probe according to the related art may be a method of using a piezoelectric element having a high dielectric constant and a method of increasing the heat radiation efficiency of the ultrasonic probe as a method of suppressing heat generation in order to prevent performance and durability degradation. I will.

Using a piezoelectric element with a high dielectric constant reduces the electric impedance difference between the piezoelectric element and the system, thereby reducing the heat generation of the probe itself. However, when using a stacked piezoelectric element or a high dielectric constant piezoelectric element for this purpose, there is a problem in that the effect is limited because of the limitation of the piezoelectric element that can be used, the difficulty of the process of making the stacked piezoelectric element.

In addition, when the back layer uses a material having high thermal conductivity to increase thermal diffusion, there is a problem in that the back layer uses a material having a high thermal conductivity in order to satisfy the attenuation characteristics of ultrasonic waves. In particular, in order to increase the heat radiation efficiency of the ultrasound probe, while restraining heat generation to the contact surface with the patient as much as possible, such a heat dissipation structure is not limited to adversely affect the performance of the ultrasound probe.

The present invention has been made to solve the above problems, the ultrasonic probe is to be radiated to the rear to suppress the heat emitted from the contact surface with the patient, and such a radiating structure does not degrade the performance of the ultrasonic probe.

The ultrasonic probe having a heat sink according to the present invention is characterized in that a heat sink for radiating heat is installed on a rear surface of the ultrasonic probe.

According to the present invention, the heat generated from the piezoelectric material is quickly discharged to the heat sink through the back layer, thereby suppressing the degradation of the piezoelectric characteristics, thereby preventing the degradation of the ultrasonic probe and the deterioration of durability. The temperature is lowered, and the ultrasonic waves absorbed by the rear layer are not reflected back to the front surface, thereby maintaining the performance of the ultrasonic probe.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

2 is a perspective view illustrating an ultrasonic probe having a heat sink according to a first embodiment of the present invention, and FIG. 3 is a side cross-sectional view illustrating an ultrasonic probe having a heat sink according to a first embodiment of the present invention. As shown, the ultrasonic probe 100 having the heat sink according to the first embodiment of the present invention is an acoustic lens (110), matching layer 120, piezoelectric body 130 from the front portion in contact with the patient And a rear layer 140 are arranged, and a heat sink 150 is provided in the rear layer 140.

The acoustic lens 110 is formed to cover the entire surface of the matching layer 120 to focus the ultrasonic waves.

The matching layer 120 is formed on the electrode of the ultrasonic transmission / reception surface of the piezoelectric body 130 to increase the reflectance and efficiency of the ultrasonic waves.

The piezoelectric body 130 is bonded to the front surface of the rear layer 140, the primary electrode and the secondary electrode connected to the main PCB (not shown) by the FPCB (Flexible Printed Circuit Board; 160) are provided on both sides, respectively, It converts electrical signals into ultrasonic waves, which are acoustic signals, and sends them out into the air, and converts ultrasonic reflected signals reflected from the air back into electrical signals and sends them to the device.

The back layer 140 is combined with the heat sink 150 for heat dissipation, and absorbs unnecessary ultrasonic waves emitted to the rear, and may be molded and manufactured in the heat sink 150 for coupling with the heat sink 150. .

The heat sink 150 is made of a material having high thermal conductivity, for example, metal such as aluminum (Al), copper (Cu), and the piezoelectric body 130 at the rear surface 141 of the rear layer 140, that is, the rear layer 140. ) Is fixed to the opposite side of the side to be bonded, it is fixed by the filling of the silicon (Silicon) in the state located in the case 170.

Heat sink 150 is preferably coupled to the rear surface of the rear layer 140 in order to increase the thermal conductivity from the rear layer 140, for this purpose, the heat from the rear layer 140 on one side of the body 151 Since a plurality of heat conduction protrusions 152 for conduction are formed, the heat conduction protrusions 152 are respectively inserted into the heat conduction grooves 142 formed in the rear layer 140 to have a shape corresponding to that of the heat conduction protrusions 152. Accordingly, the rear layer 140 has a shape corresponding to that of the heat conduction groove 142 and the heat conduction protrusion 152, thereby increasing the adhesion between the heat conduction groove 142 and the heat conduction protrusion 152, thereby increasing the heat conduction efficiency.

As shown in FIG. 4, the heat conduction protrusion 152 has a bar shape and maximizes a contact area with the rear layer 140 connected through the heat conduction groove 142.

In the ultrasonic probe 100 having the heat sink according to the first embodiment of the present invention having the configuration as described above, heat generated from the piezoelectric body 130 is conducted to the heat sink 150 through the rear layer 140 and is discharged. The rate of heat diffusion into layer 140 is increased. In particular, the heat conduction protrusion 152 of the heat sink 150 is coupled to each of the heat conduction grooves 142 of the back layer 140, thereby increasing the contact area between the back layer 140 and the heat sink 150. The heat conduction efficiency from the back layer 140 to the heat sink 150 is increased.

As such, the heat generated from the piezoelectric body 130 is rapidly discharged through the heat sink 150 to protect the piezoelectric body 130 from heat, thereby preventing the degradation of the property, and the rear layer 140 maintains the ultrasonic attenuation characteristics. This prevents performance degradation and durability degradation of the ultrasonic probe 100 itself and reduces the temperature of the contact surface with the patient by reducing the thermal conductivity to the acoustic lens 110.

5 is a perspective view illustrating an ultrasonic probe having a heat sink according to a second embodiment of the present invention, and FIG. 6 is a side cross-sectional view illustrating an ultrasonic probe having a heat sink according to a second embodiment of the present invention. As shown, the ultrasonic probe 200 having the heat sink according to the second embodiment of the present invention is the acoustic lens 210, the matching layer 220, the piezoelectric member 230 and the rear layer from the front portion in contact with the patient 240 is arranged, and the heat sink 250 is provided on the back layer 240. In the present embodiment, the configuration except for the heat sink 250 is the same as the ultrasonic probe 100 having the heat sink according to the first embodiment, and thus description thereof will be omitted.

The heat sink 250 is inserted into the heat conduction grooves 242 of the back layer 240 by forming a plurality of heat conduction protrusions 252 vertically on one side of the body 251 to be unevenly coupled to the back layer 240. As shown in FIG. 7, the heat conduction protrusion 252 has a bar shape, but has an inclined surface 252a to form an acute angle at an end thereof.

On the other hand, the rear layer 240 has a structure in which the heat conduction groove 242 is connected to the entire surface of the heat conduction protrusion 252 by having a shape corresponding to the heat conduction protrusion 252.

In the ultrasonic probe 200 having the heat sink according to the second embodiment of the present invention having the configuration as described above, heat generated from the piezoelectric body 230 is quickly conducted to the heat sink 250 through the rear layer 240 to be discharged. As a result, the degradation of the piezoelectric element 230 may be prevented to prevent the degradation of the performance of the ultrasonic probe 200 itself and the durability of the piezoelectric body 230.

In addition, as illustrated in FIG. 6, ultrasonic waves absorbed by the rear layer 240 are reflected to the rear layer 240 in the lateral direction by the inclined surface 252a formed on the heat conduction protrusion 252 of the heat sink 250. As a result, it is suppressed to be reflected back to the front surface so as to be absorbed in the back layer 240 to disappear. Therefore, the performance of the ultrasonic probe 200 is prevented by achieving the original purpose of the back layer 240 of absorbing the back reflection sound of the ultrasonic wave.

8 is a side cross-sectional view illustrating an ultrasonic probe having a heat sink according to a third embodiment of the present invention, and FIG. 9 is a perspective view illustrating a heat sink of an ultrasonic probe having a heat sink according to a third embodiment of the present invention. to be. As shown, the ultrasound probe 300 having the heat sink according to the third embodiment of the present invention is the front surface of the acoustic lens 310, the matching layer 320, the piezoelectric body 330 and the rear layer in contact with the patient 340 is arranged, and the heat sink 350 is provided on the back layer 340. In the present embodiment, the configuration except for the heat sink 350 is the same as the ultrasonic probe 100 having the heat sink according to the first embodiment, and thus description thereof will be omitted.

The heat sink 350 is inserted into the heat conduction grooves 342 of the back layer 340 by forming a plurality of heat conduction protrusions 352 vertically formed on one side of the body 351 to be unevenly coupled to the back layer 340. Is coupled to, the heat conduction projection 352 is made of a bar (Bar) shape, the insertion groove 352a extending from the end to the inner side is formed.

The insertion groove 352a has a conical shape in order to prevent the ultrasonic wave absorbed by the rear layer 340 from being reflected back to the front surface by the heat sink 350.

On the other hand, the rear layer 340 has a structure in which the heat conduction groove 342 is connected to the entire surface of the heat conduction protrusion 352 by having a shape corresponding to the heat conduction protrusion 352. That is, the heat conduction groove 342 has a shape in which the heat conduction protrusion 352 is inserted, and an insertion protrusion 342a for insertion into the insertion groove 352a is formed inside.

In the ultrasonic probe 300 having the heat sink according to the third embodiment of the present invention having the configuration as described above, heat generated from the piezoelectric body 330 is rapidly conducted to the heat sink 350 through the back layer 340 and is discharged. As a result, the degradation of the piezoelectric element 330 is prevented, thereby preventing the degradation of the performance of the ultrasonic probe 300 itself and the deterioration of durability, and the temperature of the contact surface with the patient due to the temperature decrease of the acoustic lens 310.

In addition, the ultrasonic wave absorbed by the back layer 340 is canceled by repeatedly canceling the reflection in the insertion groove 352a of the heat sink 350 to reduce the re-reflection to the front surface, thereby reducing the ultrasonic probe 300 Prevent performance degradation.

10 is a side cross-sectional view illustrating an ultrasonic probe having a heat sink according to a fourth embodiment of the present invention, and FIG. 11 is a perspective view illustrating a heat sink of an ultrasonic probe having a heat sink according to a fourth embodiment of the present invention. to be. As shown, the ultrasonic probe 400 having the heat sink according to the fourth embodiment of the present invention has an acoustic lens 410, a matching layer 420, a piezoelectric body 430, and a rear layer from the front part contacting the patient. 440 is arranged, and a heat sink 450 is provided on the back layer 440. In the present embodiment, since the configuration except for the heat sink 450 is the same as the ultrasonic probe 100 having the heat sink according to the first embodiment, description thereof will be omitted.

The heat sink 450 has a plurality of heat conduction protrusions 452 vertically formed on one side of the body 451 to be unevenly coupled to the back layer 440, so that the heat sink 450 corresponds to the heat conduction protrusions 452 on the back layer 440. Each of the heat conduction grooves 442 is inserted into and coupled to each other, and the heat conduction protrusions 452 have a conical shape in order to suppress re-reflection of ultrasonic waves absorbed by the rear layer 440 to the front surface.

On the other hand, the back layer 440 has a structure in which the heat conduction groove 442 is connected to the entire surface of the heat conduction protrusion 452 by having a shape corresponding to the heat conduction protrusion 452, that is, a conical shape.

In the ultrasonic probe 400 having the heat sink according to the fourth embodiment of the present invention having the configuration as described above, heat generated from the piezoelectric material 430 is heat-sink 450 through the back layer 440 as in the previous embodiments. By rapidly conducting to be discharged to prevent the degradation of the characteristics of the piezoelectric element 430 to prevent degradation of the performance of the ultrasonic probe 400 itself and weakening of durability, the contact surface temperature with the patient according to the temperature decrease of the acoustic lens 410 Will be lowered.

In addition, the ultrasonic wave absorbed by the back layer 440 is reflected by the conical heat conduction protrusion 452 of the heat sink 450 to the back layer 440 positioned laterally of the heat conduction protrusion 452 without being reflected back to the front surface. By being reabsorbed, it is extinguished by offset, thereby preventing the deterioration of the performance of the ultrasonic probe 400.

12 is a side cross-sectional view illustrating an ultrasonic probe having a heat sink according to a fifth embodiment of the present invention, and FIG. 13 is a perspective view illustrating a heat sink of an ultrasonic probe having a heat sink according to a fifth embodiment of the present invention. to be. As shown, the ultrasonic probe 500 having the heat sink according to the fifth embodiment of the present invention has an acoustic lens 510, a matching layer 520, a piezoelectric body 530, and a rear layer from the front part contacting the patient. 540 is arranged, and a heat sink 550 is provided on the back layer 540. In this embodiment, the configuration except for the back layer 540 and the heat sink 550 is the same as the ultrasonic probe 100 having the heat sink according to the first embodiment, and thus description thereof will be omitted.

The heat sink 550 is inserted into the rear surface 541 of the rear layer 540 to be coupled to the rear layer 540 has an insertion portion 552 is formed on one side of the body 551.

The insertion part 552 is preferably a wire 552a having a coil shape to increase the thermal conductivity from the rear layer 540.

Coil-shaped wire 552a is composed of a plurality of arranged in parallel to the body 551 as an example, each end is formed to be integral to the body 551, or to be integrally fitted to the body 551 by force. do. In addition, the coil-shaped wire 552a is fixed to the inside of the back layer 540 by forming the back layer 540 by molding on the body 551 of the heat sink 550, and thus the heat sink 550. The body 551 and the back layer 540 are coupled to each other, thereby minimizing interference with the ultrasonic waves absorbed by the back layer 540 to suppress the re-reflection of the ultrasonic waves to the front of the back layer 540.

In the ultrasonic probe 500 having the heat sink according to the fifth embodiment of the present invention having the configuration as described above, heat generated from the piezoelectric body 530 is heat-sink 550 through the back layer 540 as in the previous embodiments. By being quickly conducted and discharged) to prevent the degradation of the characteristics of the piezoelectric body 530 to prevent degradation of the performance of the ultrasonic probe 500 itself and weakening of durability, and to reduce the temperature of the acoustic lens 510. In particular, the coil-shaped wire 552a inserted into the back layer 540 serves to enlarge the heat conduction passage from the back layer 540 to the heat sink 550, thereby increasing the heat conduction efficiency.

In addition, the ultrasonic wave absorbed by the rear layer 540 passes between the coil-shaped wires 552a, thereby preventing the ultrasonic wave from being reflected back to the front surface of the rear layer 540, thereby preventing performance degradation of the ultrasonic probe 500. do.

As described above, according to preferred embodiments of the present invention, the heat generated from the piezoelectric material is quickly discharged to the heat sink through the rear layer, thereby suppressing the degradation of the piezoelectric property to prevent degradation of the ultrasonic probe and deterioration of durability. The temperature of the contact surface with the patient is lowered by preventing the acoustic lens from generating heat.

In addition, the ultrasonic wave absorbed by the rear layer is prevented from being reflected back to the front to maintain the performance of the ultrasonic probe. Due to this, it is possible to maximize the thermal conductivity to the rear layer by overcoming the disadvantage of not being mounted close to the piezoelectric body.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. And will be included in the described technical idea.

1 is a cross-sectional view showing a medical ultrasound probe according to the prior art,

2 is a perspective view illustrating an ultrasonic probe having a heat sink according to a first embodiment of the present invention;

3 is a side cross-sectional view showing an ultrasonic probe having a heat sink according to a first embodiment of the present invention,

4 is a perspective view illustrating a heat sink of an ultrasonic probe having a heat sink according to a first embodiment of the present invention;

5 is a perspective view illustrating an ultrasonic probe having a heat sink according to a second embodiment of the present invention;

6 is a side cross-sectional view showing an ultrasonic probe having a heat sink according to a second embodiment of the present invention;

7 is a perspective view illustrating a heat sink of an ultrasonic probe having a heat sink according to a second embodiment of the present invention;

8 is a side cross-sectional view showing an ultrasonic probe having a heat sink according to a third embodiment of the present invention;

9 is a perspective view illustrating a heat sink of an ultrasonic probe having a heat sink according to a third embodiment of the present invention;

10 is a side cross-sectional view showing an ultrasonic probe having a heat sink according to a fourth embodiment of the present invention,

11 is a perspective view illustrating a heat sink of an ultrasonic probe having a heat sink according to a fourth embodiment of the present invention;

12 is a side cross-sectional view showing an ultrasonic probe having a heat sink according to a fifth embodiment of the present invention;

13 is a perspective view illustrating a heat sink of an ultrasonic probe having a heat sink according to a fifth embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

110,210,310,410,510: Acoustic lens 120,220,320,420,520: Matching layer

130,230,330,430,530: Piezoelectric 140,240,340,440,540: Back layer

141,541: Rear 142,242,342,442,: Thermally conductive groove

150,250,350,450,550: Heat sink 151,251,351,451,551: Body

152,252,352,452: heat conduction protrusion 160: FPCB

170: case 252a: inclined surface

342a: Insertion protrusion 352a: Insertion groove

552: insertion portion 552a: wire

Claims (10)

  1. In the ultrasonic probe,
    A heat sink installed on the back layer to dissipate heat
    A plurality of heat conduction protrusions formed on one side are inserted into the heat conduction grooves in a shape corresponding to the heat conduction grooves so as to be unevenly coupled to the rear surface of the rear layer on which the plurality of heat conduction grooves are formed.
    The heat conduction protrusion is made of a bar (Bar) shape,
    The inclined surface is formed so that the end forms an acute angle, or an insertion groove is formed extending from the end to the inside
    Ultrasonic probe having a heat sink, characterized in that.
  2. delete
  3. delete
  4. delete
  5. delete
  6. delete
  7. The method of claim 1,
    The insertion groove,
    In the form of cones
    Ultrasonic probe having a heat sink, characterized in that.
  8. delete
  9. In the ultrasonic probe,
    Heat sink for heat dissipation on the back layer,
    Insertion portion is formed to be inserted into the rear of the rear layer to be fixed,
    The insertion unit,
    With wires in coil form
    Ultrasonic probe having a heat sink, characterized in that.
  10. delete
KR1020080071290A 2008-07-22 2008-07-22 Ultrasonic probe having a heat sink KR101018626B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080071290A KR101018626B1 (en) 2008-07-22 2008-07-22 Ultrasonic probe having a heat sink

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1020080071290A KR101018626B1 (en) 2008-07-22 2008-07-22 Ultrasonic probe having a heat sink
US13/054,092 US20110114303A1 (en) 2008-07-22 2009-07-06 Ultrasonic probe having heat sink
EP09800515A EP2309930A4 (en) 2008-07-22 2009-07-06 Ultrasonic probe having heat sink
PCT/KR2009/003677 WO2010011034A1 (en) 2008-07-22 2009-07-06 Ultrasonic probe having heat sink
CN2009801285123A CN102098965A (en) 2008-07-22 2009-07-06 Ultrasonic probe having heat sink
JP2011519975A JP2011528929A (en) 2008-07-22 2009-07-06 Ultrasonic probe with heat sink

Publications (2)

Publication Number Publication Date
KR20100010358A KR20100010358A (en) 2010-02-01
KR101018626B1 true KR101018626B1 (en) 2011-03-03

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Country Status (6)

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US (1) US20110114303A1 (en)
EP (1) EP2309930A4 (en)
JP (1) JP2011528929A (en)
KR (1) KR101018626B1 (en)
CN (1) CN102098965A (en)
WO (1) WO2010011034A1 (en)

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EP2309930A1 (en) 2011-04-20
CN102098965A (en) 2011-06-15
US20110114303A1 (en) 2011-05-19
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JP2011528929A (en) 2011-12-01
WO2010011034A1 (en) 2010-01-28

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