JP2016018624A - Induction heating cooker - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an induction heating cooker which satisfies both of cooling efficiency and noise reduction by a fan device at the same time.SOLUTION: In an induction heating cooker which comprises a body; a top plate installed in the body, for placing a cooking pan; a heating coil installed under the top plate; a heating chamber installs under the heating coil; a substrate for mounting an electronic component for applying electric current to the heating coil; a fan device for cooling the heating coil and the electronic component; and a substrate case arranged lateral to the heating chamber, for storing the substrate and the fan device: the substrate case includes a storage container and a storing lid which are combined one on top of the other; and the fan device includes an impeller with a rotation axis in a direction parallel with the body, a casing for storing the impeller and a motor for rotating the impeller, in which the casing is sandwiched and supported by the storing container and the storing lid.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an induction heating cooker including a heating coil.

  There is known an induction heating cooker that uses an eddy current to heat a metal pan itself. When cooking with an induction heating cooker, not only cooking pots but also heating coils and electronic parts generate heat. Therefore, a technique for cooling a heating coil or the like using a fan device is known.

  For example, in Patent Document 1, each control unit related to energization control to the induction heating coil is configured by a stacked electrical box housed in a separate housing part, and a single fan is integrated into the electrical box. An induction heating cooking apparatus is described in which an air flow from a fan is diverted in accordance with the amount of heat generated in an air passage that passes through each of the stacked accommodating portions.

  In Patent Document 2, in a configuration in which cooling air is sent in parallel to a plurality of substrates with a single fan, the fan configuration is a centrifugal fan, and the rotation axis of the fan is installed in the vertical direction. An induction heating cooker configured to be blown by a fan is described.

JP 2010-182480 A JP 2004-172140 A

  In the invention described in Patent Document 1, the first to third storage portions (36 to 38) in which the electrical boxes are stacked and the fan are configured, and the fan (perspective view, FIG. 7) is the first storage portion 36. It is installed on the bottom. In other words, the fan is configured to be fixed only on the bottom side, and consideration for vibration and noise generated during actual operation is not sufficient for mounting the fan.

  Generally, rotational vibration tends to increase as the rotational speed of the fan motor (electric motor 40B) increases and the outer diameter of the impeller (multi-blade fan, so-called sirocco fan 40A) increases. Therefore, in this configuration, there is a concern about an increase in noise due to an increase in the air volume, with respect to the induction heating cooker that requires a larger cooling air volume.

  The increase in the air volume can be an increase factor of noise, although an increase in the rotational speed of the motor, an increase in the outer diameter of the impeller (or casing), and an increase in the width of the impeller are design improvement materials.

  In addition, in products such as induction heating cookers that are mass-produced, when an impeller is installed in a motor and a fan is configured, it is difficult to completely adjust and install the impeller rotational unbalance individually, Some shaft runout occurs.

  In order to suppress the vibration transmitted by the shaft runout, it is effective to reduce the outer diameter of the impeller, reduce the width of the impeller, and reduce the rotation speed, but all have a trade-off relationship with improvement of the air volume. .

Therefore, without any countermeasure, when using the fan mounting configuration disclosed in Patent Document 1, an upper limit is imposed on the practical maximum air volume in order to suppress an increase in noise. In addition, when multiple storage units are provided for the fan, noise generated by the fan easily leaks from the joint of the electrical box to the outside, and more countermeasures for noise reduction are required. Also, the electrical box is subdivided. There is a problem that the assembling property is not good and the fan is not sufficiently fixed.

  In the invention described in Patent Document 2, the rotation axis of the fan 10 is in the vertical direction, and the size of the fan outer shape is limited by the size of the roaster 5. In recent years, roasters have become cooking chambers that automatically cook a variety of menus such as bread, sweets, and other side dishes in addition to grilled fish, and many products occupy more than half the width of the main body. For this reason, the capacity for housing the fan is reduced, the outer diameter of the impeller is reduced, and means for increasing the rotation speed of the fan is adopted for blowing a large amount of air, so that a structure in which noise is likely to occur is obtained. Moreover, since the fixing direction of the fan is the rotational axis direction, there is a problem in that noise is likely to occur due to vibration transmission by the fan because the fan is not oriented in the direction perpendicular to the fixing direction.

  Then, this invention makes it a subject to provide the induction heating cooking appliance which made the improvement of the cooling performance by a fan apparatus, and noise reduction compatible.

  In order to solve the above problems, an induction heating cooker according to the present invention includes a main body, a top plate installed in the main body and on which a cooking pan is placed, and a heating coil installed below the top plate, A heating chamber installed below the heating coil, a substrate on which electronic components for passing current to the heating coil are mounted, a fan device for cooling the heating coil and the electronic components, and the heating chamber An induction heating cooker that is disposed in a lateral position and includes a substrate case that houses the substrate and the fan device, wherein the substrate case is configured by combining a storage container and a storage lid up and down, and the fan device includes: An impeller having a rotating shaft in the horizontal direction of the main body, a casing for housing the impeller, and a motor for rotating the impeller, the casing being the storage container and the storage lid Sandwiched therebetween to support.

  ADVANTAGE OF THE INVENTION According to this invention, even if a fan apparatus enlarges and it rotates at high speed, an air-cooling structure with a low noise can be comprised, and the induction heating cooking appliance which can cool components efficiently can be provided.

It is a disassembled perspective view of the induction heating cooking appliance of Example 1. FIG. It is the sectional side view cut | disconnected by the AA line shown in FIG. It is the sectional side view cut | disconnected by the BB line shown in FIG. It is a disassembled perspective view of a fan apparatus. It is a perspective view which shows arrangement | positioning of the board | substrate in the storage container and fan apparatus which comprise a board | substrate case lower side. In the induction heating cooking appliance of Example 2, it is the sectional side view cut | disconnected by the AA line of FIG. In the induction heating cooking appliance of Example 3, it is the sectional side view cut | disconnected by the AA line of FIG.

  Embodiments of the present invention will be described in detail with reference to the drawings as appropriate. As shown in FIG. 1 and the like, front / rear / up / down / left / right are defined based on the user's line of sight relative to the induction heater C (see FIG. 1). In the following, a case where the induction heating cooker 1 (see FIG. 1) is a built-in type IH (Induction Heating) cooking heater will be described as an example. However, the present invention may be applied to a stationary type IH cooking heater. .

  FIG. 1 is an exploded perspective view of the induction heating cooker of the present embodiment. The induction heating cooker 1 generates an eddy current at the bottom of a metal cooking pan (not shown) and heats the cooking pan itself by Joule heat generated by the eddy current. The aforementioned eddy current is generated by flowing a high-frequency current through the heating coils 3a, 3b, and 3c to change the magnetic flux with time.

  The induction heating cooker C mainly includes a main body 1, a top plate 2, heating coils 3a, 3b, 3c, a substrate case 6, substrates 7a, 7b, 7c, a heat sink 8, a fan device 9, It has.

  The main body 1 is a housing having an outer shell corresponding to a space (predetermined left-right width, front-rear width, height) in which the induction heating cooker 1 is installed, and has a box shape (concave shape) with an upper portion opened. Yes. The main body 1 is provided with a left roaster portion 5, a right substrate case 6, and heating coils 3a, 3b, 3c and the like positioned above them, and a top plate 2 is further installed so as to cover from above. The

  FIG. 2 is a sectional side view taken along the line AA shown in FIG. An intake opening H <b> 1 for taking in air from the outside by driving the fan device 9 is provided on the back side of the main body 1. In addition, the exhaust opening H2 for discharging the air blown into the main body 1 from the fan device 9 is provided behind the top plate 2 described later.

  In addition to the rear of the main body 1, for example, if an intake opening is provided on the lower front side, relatively low temperature air can be easily taken into the main body 1. Further, by providing the intake opening H1 on the back side far from the roaster portion 5 located on the left side (see FIG. 1), the influence of the air taken in through the intake opening H1 on the temperature control of the roaster portion 5 is mitigated. it can.

  On the front left side of the main body 1, a charging port (not shown) for slidably installing the roaster unit 5 is provided. An operation panel P <b> 2 for adjusting the heating of the cooking pan and the heating condition of the roaster unit 5 is provided on the front right side of the main body 1.

  The top plate 2 is a plate-like member (made of heat-resistant glass) on which the cooking pan is placed, and is installed from the top of the main body 1. The top plate 2 displays a three-necked pan mounting unit 21 corresponding to the installation positions of the three heating coils 3a, 3b, and 3c, an operation unit 22 for adjusting the heating of the cooking pan, and a heating power adjustment amount. And a display opening P1 and an exhaust opening H2.

  As described above, the exhaust opening H <b> 2 is a plurality of holes for discharging air blown from the fan device 9, and is provided at the rear (right side / left side) of the top plate 2.

  The heating coils 3 a, 3 b, and 3 c are coils through which a high-frequency current flows by driving an inverter circuit (such as the electronic component 72), and are placed on the coil base 31. In this embodiment, the heating coils 3a, 3b, and 3c are provided one by one on the right, left, and center back in plan view.

  The coil base 31 is supported by three support members 32 (for example, springs), and an upward biasing force is applied by the support members 32. As a result, the heating coil is pressed against the lower surface of the plate 2, and the distance between the cooking pan and the heating coils 3a, 3b, 3c is kept constant. A magnetic body 33 such as ferrite is embedded in the coil base 31 and is arranged so that the magnetic flux generated by the above-described high frequency current penetrates the cooking pan.

  The heating coils 3a, 3b, and 3c are installed below the top plate 2, and a temperature sensor 34 that detects the temperature of the pan bottom is installed near the center. The heating coils 3a, 3b, and 3c are disposed on the downstream side of the fan device 9, and the air blown out from the fan device 9 is heated by the heating coils 3a, 3b, and 3c via the ventilation duct D on the substrate case 6. It hits the lower side.

  In addition, in Example 1, although it is the induction heating cooking appliance which arranged the heating coil 3c in the center back, instead of the heating coil 3c, the electric heater (radiant heater) which heats a pan etc. with the resistance heat which arises when an electric current flows ). By providing the electric heater in this way, the heating coils 3a and 3b can also heat those that cannot be induction heated (for example, a clay pot).

  FIG. 3 is a sectional side view taken along line BB shown in FIG. The roaster unit 5 is used for, for example, grilling fish, and includes an electric heater (upper heater 41a and lower heater 41b) as a heat source, a grill 42 on which fish and the like are placed, and the grill 42 A receiving tray 43 disposed below. As described above, the roaster portion 5 is disposed in the left region in the main body 1 in a plan view and is slidable in the front-rear direction with respect to the main body 1.

  Note that the heat source of the roaster unit 5 is not limited to the electric heater, and the food may be heated by microwaves, water vapor, or a combination thereof. Further, a temperature controller may be provided and oven heating may be performed. In FIG. 1, the induction heating cooking appliance C provided with the roaster part 5 more than 1/2 of the main body width was shown.

  A board case 6 shown in FIG. 1 accommodates boards 7a, 7b, and 7c on which electronic components 71 and a heat sink 8 are mounted, and a fan device 9 that allows air to flow through an air passage in the board case 6. It is a housing and is installed on the right side of the roaster unit 5 in the main body 1. That is, the substrate case 6 is installed in an extra space excluding the heating coils 3 a, 3 b, 3 c and the roaster unit 5 in the space in the main body 1.

  Further, as shown in FIG. 2, the substrate case 6 is configured by combining a storage container 6a and a storage lid 6b vertically. The joint 61 of the storage container 6a and the storage lid 6b may be partly or entirely overlapped on the outer periphery as shown in FIG. 3, or may be fixed in a flange shape with a wide contact surface. Also good. These are structures for suppressing air leakage from the mating portion 61 of the storage container 6a and the storage lid 6b.

  FIG. 4 is an exploded perspective view of the fan device 9. The fan device 9 takes air into the substrate case 6 through the air inlets H3 and H4, and blows out the taken air toward the heating coils 3a, 3b, and 3c, so that the electronic component 71 and the heating coils 3a, 3b, and 3c are blown out. It is a multi-blade fan that cools.

  The fan device 9 according to the first embodiment includes a casing 90, an impeller 91, a motor 92, and a motor mounting plate 93. That is, the impeller 91 is housed in a space surrounded by the casing 90 and the motor mounting plate 93 and is rotatably supported by the rotation axis Z of the motor 92 so as not to contact the casing 90. The rotation axis Z extends in the left-right direction of the main body 1, and the motor 92 is provided only on the right side. The motor may be a direct current motor instead of the take-off type alternating current motor shown in the figure. The fan device 9 is intended for a configuration in which the rotation of the impeller 91 is driven from the outside via a motor mounting plate 93.

  The fan device 9 shown in FIG. 4 is formed by dividing the impeller 91 in the rotation axis direction, and intake ports H3 and H4 are arranged on the left side of the casing 90 and the motor mounting plate 93, respectively. The impeller 91 has a width W3 on the intake port H3 side and a width W4 on the intake port H4 side with respect to the width W1, and W3> W4.

  This is because the motor mounting plate 93 is provided with a motor mounting portion to reduce the area of the intake port H4. Therefore, the motor 92 is mainly cooled in the impeller portion having the width W4, and a large amount of air flow is generated in the width W3. It is the structure obtained in the impeller part. Note that the rotation shaft of the motor 92 and the impeller 91 are roughly divided portions (joint surfaces of W3 and W4) of the impeller 91.

  Further, in the fan device 9, since the width W <b> 1 of the impeller 91 is long, a minute shaft shake that occurs with respect to the rotation axis Z tends to be large at the tip 91 a of the impeller 91. For this reason, when the impeller 91 is housed in the casing 90 and the motor mounting plate 93, the tip 91a and the casing 90 of the impeller 91, the tip 91b of the impeller and the motor mounting are taken into account in consideration of the amount of vibration displacement due to shaft runout. A sufficient gap is provided between the plates 93 so that they do not come into contact with each other during rotation.

  When there is a shaft runout, the fluctuation of the impeller 91 is transmitted through the rotation axis Z, and the motor 92 is vibrated. Therefore, vibration is transmitted to the motor mounting plate 93 to which the motor 92 is mounted, and further vibration of the casing 90 in which the motor mounting plate 93 is installed. Therefore, in the fan device 9, the unsupported part induces a large vibration and causes noise of the substrate case 6 and the main body 1. In addition, although the rotation speed of the fan apparatus 9 is a design matter by the induction heating cooking C, if the resonance frequency of a main body is near, a big vibration and noise will generate | occur | produce.

  The fan device 9 is configured to cause air to flow in the forward direction of the rotation by rotating the impeller 91 by driving the motor 92. That is, the fan device 9 is arranged on the upstream side of the heat sink 8 and is arranged in the left-right direction of the main body 1 so that the rotation axis Z is substantially parallel to the surface direction of the substrate 7a (first substrate). A wing fan. When the fan device 9 is driven, air is taken in from the intake ports H3 and H4 of the fan device 9 and blown out toward the boards 7a and 7b.

  Here, in this embodiment, for convenience, the casing 90 and the motor mounting plate 93 are separately described for each component.

  FIG. 5 is a perspective view showing the arrangement of the substrate 7 a and the fan device 9 in the storage container 6 a constituting the lower side of the substrate case 6. The fan device 9 is fixed to the inner bottom surface of the storage container 6a by legs 93 (see FIG. 4) provided below the casing 90.

  Moreover, as shown in FIG. 5, the four heat sinks 81-84 are arrange | positioned in the downstream of the discharge outlet H5 of the casing of the fan apparatus 9. As shown in FIG. The discharge port H5 of the fan device 9 opens larger than the upstream outer cross section of the heat sinks 81 and 83 on the fan device 9 side (see FIG. 3), and a predetermined flow rate of air flows through the heat sink 81 as the fan device 9 is driven. To 84.

  As shown in FIG. 2, the storage container 6 a of FIG. 5 in which the fan device 9 is installed is covered with the storage lid 6 b to constitute a substrate case 6. At that time, the casing 90 of the fan device 9 is in contact with and supported by the storage lid 6b. That is, the casing 90 is supported by being sandwiched between the storage container 6a and the storage lid 6b from above and below. Here, in the present embodiment, since the casing 90 is fixed to the storage container 6a, vibration (noise) generated when the fan rotates is absorbed and mitigated by the contact portion 60 (see FIG. 2) between the casing and the storage lid 6b. Note that vibration of the casing 90 can be further suppressed by applying a downward force to the fan device 9 when the storage lid 6b is installed.

  The above-described structure includes an assembly procedure in which the substrate 7a is first installed in the storage container 6a of the substrate case 6, the fan device 9 is installed, the substrates 7b and 7c are stored, and finally covered with the storage lid 6b. Become. This is an operation from the same direction as the assembly order of the roaster unit 5, the substrate case 6, the heating coils 3 a, 3 b, 3 c, and the top plate 2 from below the main body 1.

  In the case of the fan device 9 mounted as shown in FIG. 1, when the width W <b> 1 of the impeller 91 is longer than ¼ (about 50 mm) of the width of the substrate case 6, the influence of the shaft runout is noticeable. Further, since the vibration is increased as the outer diameter W2 is larger, the outer diameter W2 of the impeller 91 is desirably about 80 mm to 110 mm. The outer diameter W2 has a range suitable for the curved surface (enlarged angle of the scroll) inside the casing 90, and is determined by the design conditions of the blowing resistance and the blowing amount. Here, in the first embodiment, the fan device 9 in which the intake ports H3 and H4 are arranged at both ends of the impeller 91 is shown. However, for example, a configuration in which intake is performed from only one side (the intake port H3) may be employed.

  In the present embodiment, irregularities are provided to suppress deformation and bending of the upper surface of the storage lid 6b due to the force transmitted through the casing 90, and the contact portion 60 is reinforced to increase the rigidity. Moreover, the convex part 60a which protruded toward the inner side of the storage container 6a was comprised so that the upper surface of the casing 90 could be contacted efficiently.

  The unevenness can be used for, for example, a receiving portion for preventing the liquid 7 through the substrate 7d and the exhaust opening H2.

  Further, the fan device 9 supports the vibration in the rotational circumferential direction of the impeller 91 in the structure in which the rotation axis Z of the impeller 91 is sandwiched between the storage lid 6b and the storage container 6a from above and below. It goes without saying that the same vibration suppressing effect can be obtained even if the rotation axis Z is in the front-rear direction of the main body 1.

  The exhaust port H6 shown in FIG. 3 is a hole for guiding the air blown from the fan device 9 to the air duct D, and is provided on the upper wall of the storage lid 6b of the substrate case 6. A ventilation duct D having separate air paths on the left and right is connected to the exhaust port H6. Of the two outlets H7 provided in the ventilation duct D, the left side faces the lower surface of the heating coils 3a and 3c, and the right side faces the lower surface of the heating coil 3b.

  That is, the ventilation duct D is connected to the exhaust port H6 so that the air blown out from the fan device 9 is diverted toward the three heating coils 3a, 3b, and 3c. Thereby, the air from the fan device 9 can be directly blown from the lower side to the heating coils 3a, 3b, and 3c provided at the left and right and the center back.

  As described above, the substrate case 6 accommodates the substrates 7a, 7b, 7c and the fan device 9, and the portions other than the intake ports H3, H4 and the intake opening H1 of the fan device are substantially sealed. Accordingly, leakage of air flowing through the substrate case 6 can be suppressed, and the cooling efficiency of the substrates 7a, 7b, 7c on which the electronic component 71 is mounted and the heating coils 3a, 3b, 3c can be increased.

  The boards 7 a and 7 b are printed boards on which various electronic components 71 including an inverter circuit are mounted, and are housed in the housing container 6 a of the board case 6.

  The lower substrate 7a (see FIG. 2) extends horizontally near the bottom surface of the storage container 6a of the substrate case 6, and is positioned below the discharge port H5 of the fan device 9 provided in the storage container 6a. In the present embodiment, a substrate having a size in which the edge of the substrate 7a is close to the inner wall surface (rectangular shape in plan view) of the storage container 6a excluding the fan device 9 is used.

  The middle substrate 7b is stacked above the substrate 7a in the substrate case 6, extends substantially horizontally like the substrate 7a, and is supplied with air blown from the discharge port H5 of the fan device 9.

  The upper substrate 7c is stacked above the substrate 7b in the substrate case 6, extends substantially horizontally like the substrates 7a and 7b, and is disposed downstream of the substrates 7a and 7b. This is because only the electronic component 71 having a small calorific value is mounted on the board 7c, and it is relatively easy to cool compared to the boards 7a and 7b.

  On the lower substrate 7a, a high heat generating element 72, a heat sink 8 (in this embodiment, four heat sinks 81 to 84) for dissipating the high heat generating element 72, and a plurality of electronic components 71 are mounted. Yes. In this embodiment, the high heat generating element 72 and the heat sinks 81 to 84 are collected and mounted near the discharge port H5 in the lower substrate 7a. Thus, the high heat generating element 72 and the like can be effectively cooled by the air flowing into the substrate case 6 through the discharge port H5 of the fan device 9.

  A substrate stand 73a shown in FIG. 2 is an insulating member (resin member) for fixing the lower substrate 7a. For example, the substrate stand 73a is screwed in a state of being placed on a plurality of ribs (not shown) protruding inward from the inner wall surface of the substrate case 6, and is fixed near the bottom surface of the storage container 6a. .

  The board base 73b is an insulating member (resin member) for fixing the middle board 7b. An opening (not shown) for communicating the substrate 7a and the substrate 7b is formed on the front side of the substrate stand 73b, and air supplied to the substrate 7a and the substrate 7b is mixed through the opening.

  That is, the board base 73b fixes the board 7b in the area on the back side, and in the space inside the board case 6, two air paths (flows to the board 7a and the board 7b) supplied from the fan device 9 are provided. Functions as a partitioning wall.

  The board base 73c is an insulating member (resin member) for fixing the upper board 7c. An opening (not shown) for guiding the air that has cooled the substrates 7a and 7b upward is formed in the plate base 73c on the front side, and the air supplied to the substrates 7a and 7b is mixed through the openings. Then, it is carried above the substrate case 6 (see FIGS. 2 and 3).

  As described above, by fixing the substrates 7a, 7b, and 7c with the resin-made substrate stands 73a, 73b, and 7c, an effect of reducing electromagnetic noise between the substrates 7a, 7b, and 7c and suppressing heat transfer. There is. Incidentally, when the substrate case 6 is resin-molded, the lower substrate base 73 a may be omitted and the substrate 7 a may be directly fixed to the bottom surface of the storage container 6 a of the substrate case 6.

  As shown in FIG. 2, the positional relationship of the fan device 9 in the substrate case 6 is such that the discharge port H5 is arranged at a position straddling between the two substrates 7a and 7b in the vertical direction. Therefore, the air flowing into the substrate case 6 through the discharge port H5 is ventilated through two air paths formed by the lower substrate 7a, the middle substrate 7b, and the left and right inner wall surfaces of the substrate case 6. It flows toward the duct D.

  The heat sinks 81 to 84 shown in FIG. 5 are heat radiators that absorb heat from the high heat generating element 72 that is an electronic component having high heat generation and dissipate heat to the air flowing in through the discharge port H <b> 5 of the fan device 9. Each of the heat sinks 81 to 84 has a fin 8b having a predetermined surface area, and is installed on the substrate 7a. In the example shown in FIG. 3, the four heat sinks 81 to 84 are arranged in two rows on the left and right in the vicinity of the discharge port H5.

  The heat sink 81 has a base portion 8a and a plurality of fins 8b extending horizontally from the base portion 8a, and is arranged so that air flows between the fins 8b. As shown in FIG. 3, the base 8a that fixes the base of the fin extends along a plane perpendicular to the left-right direction (that is, in a direction along the flow of air flowing from the intake port H3).

  As shown in FIG. 5, the heat sinks 81 to 84 are installed on the upstream side near the fan device 9. That is, the heat sinks 81 to 84 are arranged so that the high heat generating element 72 having the largest heat generation amount is cooled first by the air flowing in through the discharge port H5. Thus, by disposing the heat sinks 81 to 84 in the vicinity of the discharge port H5, the high heat generating element 72 can be effectively cooled.

  Further, when heat is exchanged by blowing air to the heat sinks 81 to 84, the heat transfer rate increases toward the front end (upstream end) of the flat fin 8b (front edge effect). That is, rather than securing the length of the fin 8b in the air flow direction (front-rear direction) to increase the surface area, the fin 8b length is secured in the left-right direction perpendicular to the air flow direction to increase the surface area. It becomes easier to cool.

  In the present embodiment, a plurality of heat sinks 81 to 84 with high heat exchange efficiency are arranged in the vicinity of the discharge port H5 of the fan device 9 in the air flow direction. Thereby, the cooling performance of the high heat generating element 72 is improved by utilizing the above-described leading edge effect.

  The electronic components 71 on the respective substrates 7a, 7b, 7c are integrated circuits, inverter circuits, capacitors, resistors, etc. used for supplying high-frequency current to the heating coils 3a, 3b and driving the fan device 9. It is.

  The inverter circuit that supplies a high-frequency current to the heating coils 3a, 3b, and 3c includes a plurality of switching elements (for example, IGBT: Insulated Gate Bipolar Transistor). Examples of the high heat generating element 72 include two switching elements used in a half bridge circuit and a diode bridge of a rectifier circuit.

In the example shown in FIG. 5, two heat sinks 81 and 82 are provided corresponding to the right inverter circuit for supplying power to the right heating coil 3a, and two corresponding to the left inverter circuit for supplying power to the left heating coil 3b. Heat sinks 83 and 84 are provided.
(Air flow in the substrate case)
The cooking pan is placed on the pan placing portion 21 (for example, corresponding to the left heating coil 3a) of the top plate 2, and the heat treatment is started by the operation panel P2 (see FIG. 1) being operated by the user. . A high frequency current is supplied from an inverter circuit (not shown) to the heating coil 3a located below the cooking pan in response to a command from a control device (not shown), and the cooking pan is induction heated.

  When the cooking pan is induction-heated by the heating coil 3a, the high heating element 72 and the electronic component 71 constituting the inverter circuit are also heated in addition to the heating coil 3a.

  With the start of the heat treatment, the fan device 9 is driven in response to a command from a control device (not shown). As shown in FIG. 2, the fan device 9 (multi-blade fan) is fixed with the storage container 6 a and the storage lid 6 b of the substrate case 6 sandwiched between the upper and lower sides. Therefore, even a fan device with a large impeller or a fan device in which the impeller is moved at high speed can suppress the vibration of the casing 90 and easily supply a large amount of air into the substrate case 6.

  When the fan device 9 is driven, a negative pressure is generated in the vicinity of the intake ports H3 and H4, and the air that has successively passed through the intake opening H1 and the discharge port H5 is taken into the substrate case 6. The air flowing in through the discharge port H5 is divided into the upper and lower substrates 7a and 7b across the substrate base 37b as a partition wall, absorbs heat from the heat sink 8 on the substrate, and flows between the lower substrate 7a and the middle substrate 7b. It goes to the board | substrate 7c of the upper stage through an air path. Further, the high heat generating element 72 is cooled by heat dissipation through the heat sink 8, and the other electronic components 71 mounted on the substrates 7a and 7b are also cooled by heat exchange with air.

  Next, the air supplied from the fan device 9 flows toward the upper side of the substrate case 6 and is used for cooling the heating coils 3a, 3b, and 3c. Since air flows between the upper substrate 7c and the substrate case 6, the electronic component 71 (the amount of heat generated) mounted on the substrate 7c is also cooled.

  The air blown upward from the fan device 9 through the opening H6 on the upper surface of the storage lid 6b of the substrate case 6 is blown to the heating coils 3a, 3b, 3c through the ventilation duct D (see FIGS. 1 and 3). . And heating coil 3a, 3b, 3c is cooled by heat exchange with the air which blows off from the blower outlet H7 of the ventilation duct D. As shown in FIG. On the other hand, the air that has absorbed heat from the heating coils 3a, 3b, and 3c flows through the air path K1 shown in FIG. 2 and cools the substrate 7d above the storage lid 6b of the substrate case 6 through the exhaust opening H2. Discharged.

  As described above, in this embodiment, the substrate case 6 that accommodates the substrates 7a, 7b, and 7c and the fan device 9 is located above and below the storage container 6a (lower side) and the storage lid 6b (upper side). The fan device 9 is a multi-blade fan, and includes an impeller 91 having a rotation axis Z in the left-right direction of the main body 1, a casing 90 that houses the impeller 91, a motor mounting plate 93, and an impeller 91. The casing 90 is supported by being sandwiched between the storage container 6a and the storage lid 6b. The fan device 9 has a double suction structure in which intake ports are provided on the left and right sides of the casing 90, and the lower portion of the casing 90 is fixed to the bottom surface of the storage container 6a.

  With such a configuration, the fan device 9 is housed in the substrate case 6 and disposed upstream of the lower substrate 7a, so that the fan can be driven with low vibration even when the width W1 and the outer diameter W2 of the impeller 91 are large. The device 9 can be driven to blow a large amount of cooling air.

  In other words, the fan device 9 necessary for blowing a predetermined amount of air is used with the impeller 91 having the maximum outer shape that can be accommodated in the substrate case 6, and a necessary and sufficient number of revolutions is set to improve the cooling efficiency. , Quiet and large air volume can be achieved.

  Further, a plurality of heat sinks 8 are arranged in the vicinity of the discharge port H5 of the fan device 9, and the air flowing in from the intake opening H1 of the main body 1 is supplied to the heat sink 8, and in particular, the high heat generating element 72 can be efficiently cooled. .

  Further, in this configuration, after the fan device 9 is installed in the storage container 6a, the upper portion of the fan device 9 is covered with the storage lid 6b. Therefore, the attachment / detachment work of the parts of the induction heating cooker 1 can be performed only from the upper surface side of the main body 1, and the work burden can be reduced.

  The second embodiment is the same as the first embodiment except for the contact state between the storage lid 6a of the substrate case 6 and the fan device as compared with the first embodiment. Therefore, the different part will be described, and the description of the overlapping part will be omitted.

  FIG. 6 is a side cross-sectional view taken along line AA in FIG. 1 in the induction heating cooker according to the present embodiment. In addition, since the present Example does not depend on the position of the intake opening H1, the induction heating cooker C in which the intake opening H1 is the rear right side of the top plate 2 is shown.

As in the first embodiment, the casing 90 of the fan device 9 shown in FIG. 6 is supported by being sandwiched between the storage container 6a and the storage lid 6b of the substrate case 6 and, for example, silicon between the casing 90 and the storage lid 6a. An elastic member 61 made of an elastic material such as rubber is interposed.
Thereby, as described in the first embodiment, the vibration of the fan device 9 can be absorbed and the generation of noise can be suppressed.

  Furthermore, if the elastic member 61 is interposed in the gap between the bottom surface of the storage container 6a to which the casing 90 is fixed, the upper and lower portions of the casing 90 can be supported by the elastic member 61. In addition, by similarly winding an elastic member around the outer periphery in the vicinity of the discharge port H5, it is possible to reduce the gap in the vicinity of the discharge port H5 and suppress the leakage of air that flows backward from the substrates 71a and 71b.

  According to the present embodiment, by adding the elastic member 61, the adhesion between the casing 90 and the storage lid 6a is improved, and the vibration transmission of the fan device 9 can be effectively suppressed.

  Moreover, since the pressure directly supported by the casing 90 is relieved, the casing 90 (that is, the scroll 90a) can be prevented from being deformed. As a result, the deformation of the casing 90 can reduce the flow loss caused by the displacement of the positional relationship between the impeller 91 and the scroll 90a, suppress internal vortex generation, efficiently blow air from the impeller 91, and increase noise. Can be reduced.

  Further, in the case of the incorporation, as in the first embodiment, it can be easily stacked by sequentially stacking from the upper side of the main body 1.

  The third embodiment is the same as the first embodiment except for the contact state between the storage lid 6a of the substrate case 6 and the fan device as compared with the first embodiment. Therefore, the different part will be described, and the description of the overlapping part will be omitted.

  FIG. 7 is a sectional side view taken along the line AA of FIG. 1 in the induction cooking device according to the present embodiment. In addition, since the present Example does not depend on the position of the intake opening H1, the induction heating cooker C in which the intake opening H1 is the rear right side of the top plate 2 is shown.

  The casing 90 of the fan device 9 shown in FIG. 7 is supported by being sandwiched between the storage container 6 a and the storage lid 6 b of the substrate case 6 and being in contact with the casing 90, as in the first embodiment. 60 is formed into a curved surface matching the shape above the casing 90, and the contact area between the two is increased.

  As in the second embodiment, an elastic member may be interposed in the gap between the casing 90 and the substrate case 6.

  According to the present embodiment, the force applied to the casing 90 when the storage lid 6b is attached is dispersed by bringing the casing 90 and the support portion 60 of the storage lid 6b into surface contact. Accordingly, it is possible to suppress a reduction in the air blowing performance due to the deformation prevention of the casing 90 and to improve the noise reduction effect due to the vibration prevention of the casing 90.

  As mentioned above, although each Example demonstrated the induction heating cooking appliance C which concerns on a present Example, a present Example is not limited to these description, A various change can be performed.

  For example, in each of the above embodiments, the case where the three heating coils 3a, 3b, and 3c are installed below the top plate 2 has been described, but the present invention is not limited to this. In other words, the number of heating coils may be one or two, or four or more.

  In each of the above embodiments, the case where the number of substrates is three has been described. However, the present invention is not limited to this. That is, the number of substrates can be changed as appropriate according to the volume of the roaster unit 5, the number of electronic components 71, the amount of wiring thereof, and the like.

  In each of the above embodiments, only the case where the rotation axis Z of the fan device 9 is set to the left-right direction of the main body has been described, but it is only necessary to be supported by being sandwiched between the storage container 6a and the storage lid 6b. It goes without saying that the same low noise effect is obtained if the direction is horizontal with respect to the main body.

  In each of the above embodiments, the case where the ventilation duct D is branched so that the cooling air can flow to all the heating coils 3a, 3b, 3c arranged on the lower side of the top plate 2 has been described. Not exclusively. For example, an opening / closing means for supplying cooling air only to necessary heating coils according to the heat generation status of the heating coils 3a, 3b, 3c may be provided.

  In each of the above-described embodiments, the cooling coil is supplied from the lower side of the coil base 31 to the lower surface of the heating coils 3a, 3b, and 3c as a cooling method for the heating coils 3a, 3b, and 3c. Absent. That is, the air path may be configured to flow air through the gap between the top plate 2 and the heating coils 3a, 3b, and 3c, and both surfaces of the heating coils 3a, 3b, and 3c may be cooled.

  In the first embodiment, the case where the heat sink 8 is provided in the vicinity of the discharge port H5 of the fan device 9 has been described. However, the present invention is not limited to this. For example, if the air can be blown with low noise and a large air volume, the arrangement of the heat sink, that is, the wiring pattern of the board can be easily laid out freely.

  Moreover, although each said Example demonstrated the case where the intake opening part H1 was provided only in the back surface of the main body 1, it does not restrict to this. That is, as the intake opening H1, a slit-like opening may be further provided in the front operation panel P2 (see FIG. 1) to enlarge the intake area. In addition, it is preferable to install a filter in these intake openings H1 to prevent dust from entering. The same applies to other embodiments.

  Moreover, although the said each Example demonstrated the case where the induction heating cooking appliance C was a built-in type IH cooking heater, it is not restricted to this. That is, it may be a stationary IH cooking heater that is used by being placed on a kitchen table.

DESCRIPTION OF SYMBOLS 1 Main body 2 Top plate 3a, 3b, 3c Heating coil 6 Substrate case 7a, 7b, 7c, 7d Substrate 71 Electronic component 73a, 73b, 73c Substrate base 8, 81, 82, 83, 84 Heat sink 9 Fan device 90 Casing 91 Blade Car 92 Motor H1 Intake opening H2 Exhaust opening Z Rotating shaft

Claims (4)

The body,
A top plate installed on the main body and on which the cooking pan is placed;
A heating coil installed below the top plate;
A heating chamber installed below the heating coil;
A substrate on which electronic components for passing a current to the heating coil are mounted;
A fan device for cooling the heating coil and the electronic component;
A board case disposed in a side position of the heating chamber and containing the board and the fan device;
The substrate case is configured by combining a storage container and a storage lid up and down,
The fan device includes an impeller having a rotation shaft in the horizontal direction of the main body, a casing that stores the impeller, and a motor that rotates the impeller, and the casing includes the storage container and the storage lid. An induction heating cooker characterized by being sandwiched and supported.   The said casing is fixed to the bottom part of the said storage container, The said fan apparatus is supported on both sides of the rotating shaft of the said impeller by the said storage lid and the said storage container from the up-down direction. The induction heating cooker described.   The induction heating cooker according to claim 1, wherein a support portion of the storage lid that contacts the fan device is configured to protrude toward the inside of the storage container.   4. The induction heating cooker according to claim 1, wherein the fan device has a double suction structure having openings at both ends of the casing in a rotation axis direction of the impeller. 5.