JP2016018617A - Radiator, heat radiation unit for radiator and lighting device with radiator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain a light weight formation while simplifying a heat radiation structure.SOLUTION: A radiator is thermally connected to a heat generating member 9 to radiate heat generated from the heat generating member 9. The radiator comprises a base board 2 thermally connected to the heat generating member 9 and one or more heat radiation units 3 fixed to the base board 2 in a thermal connected state so as to radiate heat conducted from the heat generating member 9. The heat radiation units 3 comprise: a plurality of thermal conductive sheets 4 arranged to be spaced apart to each other and having fibrous substance; a spacer 5 present between the thermal conductive sheets 4 arranged to be oppositely faced to each other; holders 6 arranged at both side end surfaces of the plurality of thermal conductive sheets 4 laminated through the spacer 5; and connecting elements 7 passing through the holders 6, thermal conductive sheets 4 and spacer 5 and connecting these laminated bodies.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a radiator that is thermally coupled to a heat generating member that generates heat in use, and dissipates heat generated from the heat generating member, a heat radiating unit used in the heat radiator, and an illumination device including the heat radiator, for example, The present invention relates to an illumination device that uses a semiconductor light emitting element such as an LED.

  In recent years, as new illumination, an illumination device using a semiconductor light emitting element such as a light emitting diode (LED) or a semiconductor diode (LD) as a light source has been developed. These have advantages such as low power consumption, small size, high impact resistance, and long life. In particular, in recent years, LEDs have increased in output, and in addition to replacing fluorescent lamps, high output types that can be replaced with high output light sources such as mercury lamps and halogen lamps have been developed.

  However, since such a semiconductor light-emitting element also generates a large amount of heat as the output increases, an effective heat dissipation structure is required. For example, LED has low power consumption and long life as its advantage, but when used continuously for a long time, when its temperature rises to an abnormally high temperature (for example, 100 ° C. or higher), There is a problem that the lifetime is remarkably shortened. For this reason, in a lighting device using LEDs, it is desirable that the temperature of the LEDs be controlled so that the temperature of the LEDs is substantially free from problems in use (preferably less than 80 ° C.) even when used continuously for a long time. . In particular, since the size of the LED itself is small, an area that can dissipate heat is small, and an efficient heat dissipating structure is essential to ensure stable reliability over a long period of time. Thus, a heat dissipation structure in which a metal heatsink fin or the like is thermally coupled to the LED chip is known (see, for example, Patent Documents 1 to 4).

  Such metal radiating fins are often made of aluminum in consideration of thermal conductivity and weight reduction. However, even aluminum is quite heavy and inevitably increases in size. In particular, in a high-output type that replaces a mercury lamp, heat dissipation performance is also required, and as a result, a very large and heavy heat dissipation fin is added to the back surface of the lighting device. In addition, high-power type lighting such as mercury lamps are used in applications such as factory lighting, stadium lighting, street lighting, highway and tunnel lighting, etc. There are many. In such an application, workability of installation work of a heavy lighting device is deteriorated. Furthermore, when the weight of the lighting device increases, the fixing structure is required to have a suitable strength.In particular, the lighting device for mounting at high places that is difficult to replace or maintain is required to have high durability specifications. Increases labor and costs. For this reason, there has been a demand for a lighting device that is lighter and easier to mount.

  Furthermore, not only the lighting device but also a device including a heat generating member that generates heat in a use state, a radiator is used to radiate the generated heat. Also in these radiators, a structure including a large number of radiation fins is employed in order to efficiently dissipate the heat generated from the heat generating member. The structure having a large number of heat dissipating fins has a problem that it is difficult to mass-produce at low cost because the structure for arranging a large number of metal plates formed in a thin plate shape apart from each other is complicated. In particular, if the number of heat dissipating fins is increased in order to improve the heat dissipating effect, there is a problem that the structure is further complicated and the weight is increased. Therefore, even in such a radiator, it is desired to reduce the weight while simplifying the structure in which a large number of radiation fins are provided.

WO2011 / 055659 JP2013-4169A JP 2013-54977 A JP2013-73696A

  The present invention has been made to solve such conventional problems. SUMMARY OF THE INVENTION The main object of the present invention is to provide a radiator, a radiator unit for a radiator, and a lighting device including the radiator, which are reduced in weight while simplifying a radiator structure.

Means for Solving the Problems and Effects of the Invention

  According to the heat radiator of the present invention, the heat radiator is thermally coupled to the heat generating member 9 to dissipate heat generated from the heat generating member 9, and the substrate 2 is thermally coupled to the heat generating member 9. One or more heat radiating units 3 fixed in a heat-bonded state and radiating heat conducted from the heat generating member 9, and the heat radiating units 3 are arranged in a posture separated from each other. A plurality of heat conductive sheets 4 having a spacer, a spacer 5 interposed between the heat conductive sheets 4 arranged to face each other, and the plurality of sheets stacked with the spacer 5 interposed therebetween. A holder 6 disposed on each of both end faces of the heat conductive sheet 4; and a connector 7 that penetrates the holder 6, the heat conductive sheet 4, and the spacer 5 and fastens these laminates. Features.

  According to the above configuration, by providing a heat dissipation unit formed by laminating a plurality of thermally conductive sheets having fibers in a posture separated from each other, it is significantly more than a heat radiator using a conventional metal heat sink. Can be reduced in weight. In addition, the heat dissipation unit used in the heatsink is fastened and fixed by a connecting tool penetrating them in a state where a plurality of thermally conductive sheets having fibers are alternately stacked with spacers interposed therebetween. In addition, it is possible to easily fix a large number of heat conductive sheets, and to realize a feature that the heat coupling state of each heat conductive sheet can be easily exhibited. Furthermore, since the heat radiation effect can be adjusted by variously changing the number and shape of the heat radiation units fixed to the substrate, there is an advantage that various specifications can be easily accommodated.

In the radiator of the present invention, the spacer 5 and the holder 6 are formed in a columnar shape extending in a direction substantially perpendicular to the substrate 2, and the thermally conductive sheet 4 is extended in the extending direction of the spacer 5 and the holder 6. In addition to the existing planar shape, the spacer 5 and the holder 6 can be arranged in a straight line in plan view and can be linearly connected via the connector 7.
With the above configuration, by connecting the planar heat conductive sheet with the columnar spacer and the holder, the surface area of the heat conductive sheet is increased to secure a wide heat radiation area, and the spacer and the holder for supporting these are provided. The overall weight can be reduced by reducing the volume. In particular, a plurality of thermally conductive sheets can be easily and firmly fixed by connecting the spacer and the holder in a straight line with a connector. Further, by disposing the planar heat conductive sheet, the columnar spacer, and the holder so as to extend in a substantially vertical direction with respect to the substrate, heat can be efficiently radiated while effectively using the region of the substrate surface.

The heat radiator of the present invention connects the plurality of thermal conductive sheets 4 to the spacer 5 in the middle in the width direction, and projects both side portions in a direction away from the spacer 5 to form protruding portions, which are opposed to each other. It can arrange in the attitude | position which spaces apart protrusion parts.
With the above configuration, adjacent thermal conductive sheets can be disposed while efficiently disposing the thermal conductive sheet in a wide range by projecting the thermal conductive sheets on both sides of the spacers that are linearly connected, thereby widening the heat radiation area. By separating them from each other, the heat dissipation effect of each thermally conductive sheet can be improved. Moreover, by disposing the spacer in the middle of the heat conductive sheet, heat can be dissipated by conducting heat uniformly to the plurality of heat conductive sheets.

In the radiator of the present invention, the thermal conductive sheet 4 has elasticity, and the connector 7 can fasten the laminate of the holder 6, the thermal conductive sheet 4, and the spacer 5 by screwing. .
According to the above configuration, the coupling tool is screwed to fasten the laminate of the holder, the heat conductive sheet, and the spacer, and the heat conductive sheet is made of an elastic fiber, so that it is difficult for screws to loosen. A reliable structure with excellent vibration resistance can be realized.

In the heat radiator of the present invention, the plurality of heat conductive sheets 4 can be arranged substantially in parallel with being spaced apart at equal intervals.
With the above-described configuration, heat can be radiated in a well-balanced manner by uniformly conducting heat to the plurality of heat conductive sheets while efficiently arranging the plurality of heat conductive sheets over a wide area.

The radiator of the present invention can thermally couple the end face of the holder 6, the thermally conductive sheet 4, and the spacer 5 to the substrate 2 at the boundary between the heat radiating unit 3 and the substrate 2.
With the above configuration, heat can be radiated more efficiently by directly conducting heat from the end surfaces of the spacer, the holder, and the thermally conductive sheet that are thermally coupled to the substrate. In particular, at the boundary with the substrate, the heat conducted from the end surfaces of the spacer, the holder, and the heat conductive sheet can be moved along the extending direction to effectively dissipate heat.

In the radiator of the present invention, the connector 7 has a rod portion 7a that penetrates the holder 6, the heat conductive sheet 4, and the spacer 5, and the holder 6, the heat conductive sheet 4, and the The spacer 5 can be provided with through holes 6a, 4a, 5a through which the rod portion 7a is inserted.
With the above configuration, a plurality of thermally conductive sheets can be fixed in a predetermined arrangement easily and reliably by the rod portion that penetrates the holder, the thermally conductive sheet, and the spacer. Moreover, there is a feature that these can be connected at an accurate position by inserting a rod through a through hole opened in the holder, the heat conductive sheet and the spacer.

In the radiator of the present invention, two rows of spacers 5 are arranged between the thermal conductive sheets 4 arranged to face each other, and the rod portions 7a are penetrated into the spacers 5 of each row. Thus, the holder 6, the heat conductive sheet 4, and the spacer 5 can be integrally connected.
With the above configuration, a plurality of thermal conductive sheets can be more reliably connected in a predetermined posture by interposing two rows of spacers between the opposing thermal conductive sheets. Further, by arranging the spacers in two rows, the connection strength and the thermal coupling state between the heat dissipation unit and the substrate can be improved.

The radiator of the present invention includes a connection portion 6B for fixing the holder 6 to the substrate 2, and the heat dissipation unit 3 can be fixed to the substrate 2 via the connection portion 6B.
With the above configuration, the heat dissipation unit can be fixed to the substrate easily and easily.

In the radiator of the present invention, the lateral width (W) of the plurality of thermal conductive sheets 4 is gradually reduced from the thermal conductive sheet 4 disposed at the center toward the thermal conductive sheets 4 disposed at both ends. can do.
By the said structure, the heat | fever conducted by the center part can be efficiently thermally radiated by enlarging the lateral width of the heat conductive sheet arrange | positioned in the center part where heat is most likely to be stored.

In the radiator of the present invention, in the plurality of spacers 5 connected to each other, the lateral width (D) of the spacer 5 disposed at the center is made larger than the lateral width (D) of the spacer 5 disposed at both ends. be able to.
With the above configuration, the spacer can be thermally coupled to the substrate with a wider area through the wide spacer disposed at the center, and the spacer can be stably raised by bringing the end face of the wider spacer into contact with the substrate. It can be fixed with. In particular, by disposing a wide spacer close to the mounting position of the heat generating member, heat generated by the heat generating member can be conducted more effectively and dissipated.

In the radiator of the present invention, a plurality of the heat radiating units 3 can be arranged on the substrate 2 and a ventilation gap 29 can be provided between the heat radiating units 3 adjacent to each other.
With the above configuration, the heat radiation effect of each heat radiation unit can be improved by providing a ventilation gap between the plurality of heat radiation units.

In the heat radiator of the present invention, the plurality of heat radiating units 3 can be arranged on the circumference of the substrate 2 at equal intervals on the circumference.
With the above configuration, a plurality of heat radiating units are evenly arranged with respect to the substrate, and heat can be radiated efficiently and in a balanced manner.

In the radiator of the present invention, the plurality of heat radiating units 3 can have the same shape, and each heat radiating unit 3 can be arranged on a locus of rotation with respect to the center of the substrate 2.
With the above configuration, since the heat radiation unit having the same shape is fixed to the fixed position of the substrate in the same posture, the assembly work in the manufacturing process can be efficiently performed while making the structure capable of heat radiation efficiently and in a balanced manner. Moreover, by making the heat radiating unit the same structure, the manufacturing cost can be reduced and mass production can be performed at a low cost.

In the radiator of the present invention, the plurality of heat radiating units 3 are arranged such that the connecting direction of the coupler 7 is a tangential direction of the circumference with respect to the center of the substrate 2, and a plurality of the heat radiating units 3 are arranged. The heat conductive sheet 4 is protruded in both sides of the spacer 5 in plan view, and the leading edge extending from the spacer 5 toward the outer peripheral edge of the substrate 2 is extended close to the outer peripheral edge of the substrate 2. At the same time, the leading edge extending from the spacer 5 toward the center of the substrate 2 can be extended close to the center of the substrate 2.
By the said structure, the some heat conductive sheet which protrudes on the both sides of the spacer connected with a connector can be arrange | positioned over the wide area | region of a board | substrate, and the whole board | substrate can be thermally radiated more effectively.

The radiator of the present invention includes a metal back plate 50 that is spaced apart from and substantially parallel to the substrate 2, and a plurality of heat dissipation units 3 are disposed between the substrate 2 and the back plate 50. In addition, the substrate 2 and the back plate 50 can be connected via the heat dissipation unit 3.
With the above configuration, the heat radiation effect of each heat radiating unit can be improved by connecting the metal back plate to the heat radiating unit.

The radiator of the present invention can be provided by opening a back plate vent 53 in the back plate 50.
By the said structure, the heat radiated from a heat conductive sheet can be exhausted outside via the back plate vent opened to the back plate, and the heat dissipation effect can be improved.

In the radiator of the present invention, the plurality of heat conductive sheets 4 can be fiber sheets containing a heat conductive filler.
By the said structure, the heat conductivity of a heat conductive sheet can be improved and the heat dissipation effect of a heat radiator can be improved.

  In the radiator of the present invention, the thermal conductivity in the surface direction of the plurality of thermal conductive sheets 4 can be set to 15 W / m · K or more.

  In the radiator of the present invention, the heat generating member 9 thermally coupled to the substrate 2 can be a light emitting diode.

  The heat dissipating unit of the present invention is a heat dissipating unit for a radiator that is thermally coupled to the heat generating member 9 and dissipates the heat generated from the heat generating member 9, and has a plurality of fibers that are arranged in a mutually spaced posture. A plurality of thermal conductive sheets 4, a spacer 5 interposed between the thermal conductive sheets 4 arranged to face each other, and the plurality of thermal conductive layers stacked with the spacers 5 interposed therebetween. It comprises a holder 6 disposed on each side end surface of the sheet 4, and a connector 7 that penetrates the holder 6, the heat conductive sheet 4, and the spacer 5 and fastens these laminates. .

  With the above configuration, by laminating a plurality of thermally conductive sheets having fibers in a posture separated from each other, a significant weight reduction can be achieved as compared with a structure using a conventional metal heat sink. In addition, a plurality of thermally conductive sheets having fibrous materials can be fastened and fastened by a connecting tool penetrating them in a state of being alternately laminated with spacers interposed therebetween, so that a large number of thermally conductive sheets can be fixed. The work can be easily performed, and the thermal bonding state of each heat conductive sheet can be easily exhibited.

In the heat dissipation unit of the present invention, the spacer 5 and the holder 6 are formed in a columnar shape extending in one direction, and the thermal conductive sheet 4 is formed in a planar shape extending in the extending direction of the spacer 5 and the holder 6. The spacer 5 and the holder 6 can be arranged on a straight line in the cross-sectional direction and can be linearly connected via the connector 7.
With the above configuration, by connecting the planar heat conductive sheet with the columnar spacer and the holder, the surface area of the heat conductive sheet is increased to secure a wide heat radiation area, and the spacer and the holder for supporting these are provided. The overall weight can be reduced by reducing the volume. In particular, a plurality of thermally conductive sheets can be easily and firmly fixed by connecting the spacer and the holder in a straight line with a connector.

In the heat dissipation unit of the present invention, the plurality of heat conductive sheets 4 are connected to the spacer 5 in the middle in the width direction, and both side portions are protruded in a direction away from the spacer 5 to form protrusions. It is possible to arrange the projecting portions to be separated from each other.
With the above configuration, adjacent thermal conductive sheets can be disposed while efficiently disposing the thermal conductive sheet in a wide range by projecting the thermal conductive sheets on both sides of the spacers that are linearly connected, thereby widening the heat radiation area. By separating them from each other, the heat dissipation effect of each thermally conductive sheet can be improved. Moreover, by disposing the spacer in the middle of the heat conductive sheet, heat can be dissipated by conducting heat uniformly to the plurality of heat conductive sheets.

In the heat radiating unit of the present invention, the thermal conductive sheet 4 has elasticity, and the connector 7 can fasten the holder 6, the thermal conductive sheet 4, and the spacer 5 by screwing. .
According to the above configuration, the coupling tool is screwed to fasten the laminate of the holder, the heat conductive sheet, and the spacer, and the heat conductive sheet is made of an elastic fiber, so that it is difficult for screws to loosen. Thus, it is possible to obtain a highly reliable heat radiating unit having excellent vibration resistance.

In the heat dissipation unit of the present invention, the plurality of heat conductive sheets 4 can be arranged substantially in parallel with the heat conductive sheets 4 being spaced apart at equal intervals.
With the above-described configuration, heat can be radiated in a well-balanced manner by uniformly conducting heat to the plurality of heat conductive sheets while efficiently arranging the plurality of heat conductive sheets over a wide area.

In the heat radiating unit of the present invention, the end face of the holder 6, the heat conductive sheet 4, and the spacer 5 can be arranged on the same plane at the end face on the side thermally coupled to the heat generating member 9.
With the above configuration, the spacer, the holder, and the end face of the heat conductive sheet that are arranged on the same plane are directly thermally coupled to a member such as a substrate to which the heat generating member is thermally coupled, thereby conducting heat more efficiently. To dissipate heat.

In the heat dissipation unit of the present invention, the connector 7 has a rod portion 7a that penetrates the holder 6, the thermally conductive sheet 4, and the spacer 5, and the holder 6, the thermally conductive sheet 4, and the The spacer 5 can be provided with through holes 6a, 4a, 5a through which the rod portion 7a is inserted.
With the above configuration, a plurality of thermally conductive sheets can be fixed in a predetermined arrangement easily and reliably by the rod portion that penetrates the holder, the thermally conductive sheet, and the spacer. Moreover, there is a feature that these can be connected at an accurate position by inserting a rod through a through hole opened in the holder, the heat conductive sheet and the spacer.

In the heat dissipating unit of the present invention, two rows of spacers 5 are arranged between the thermally conductive sheets 4 arranged to face each other, and the rod portions 7a are respectively penetrated into the spacers 5 of each row. Thus, the holder 6, the heat conductive sheet 4, and the spacer 5 can be integrally connected.
With the above configuration, a plurality of thermal conductive sheets can be more reliably connected in a predetermined posture by interposing two rows of spacers between the opposing thermal conductive sheets.

In the heat dissipation unit of the present invention, the plurality of thermal conductive sheets 4 are gradually reduced in width (W) from the thermal conductive sheet 4 disposed at the center toward the thermal conductive sheets 4 disposed at both ends. can do.
By the said structure, the heat | fever conducted by the center part can be efficiently thermally radiated by enlarging the lateral width of the heat conductive sheet arrange | positioned in the center part where heat is most likely to be stored.

In the heat dissipating unit of the present invention, in the plurality of spacers 5 connected to each other, the lateral width (D) of the spacer 5 disposed at the center is made larger than the lateral width (D) of the spacer 5 disposed at both ends. be able to.
With the above configuration, the wide spacer disposed in the center can be thermally coupled with a wider area to a member such as a substrate to which the heat generating member is thermally coupled, and the end surface of the wide spacer is brought into contact with the member. Thus, the spacer can be fixed in a stable standing posture. In particular, by disposing a wide spacer close to the heat coupling position of the heat generating member, heat generated by the heat generating member can be more effectively conducted and dissipated.

In the heat dissipation unit of the present invention, the plurality of heat conductive sheets 4 can be fiber sheets containing a heat conductive filler.
By the said structure, the heat conductivity of a heat conductive sheet can be improved and the thermal radiation effect of a thermal radiation unit can be improved.

  In the heat dissipation unit of the present invention, the thermal conductivity in the surface direction of the plurality of heat conductive sheets 4 can be set to 15 W / m · K or more.

  The lighting device of the present invention includes one or more semiconductor light emitting elements 1, a substrate 2 on which the semiconductor light emitting elements 1 are mounted on the first surface 2X, and a power supply unit for adjusting power supplied to the semiconductor light emitting elements 1. 60 and a heat radiator 10 for radiating heat generated from the semiconductor light emitting device 1. The radiator 10 includes one or more heat radiating units 3 that are fixed to the second surface 2Y of the substrate 2 in a thermally coupled state and radiate heat conducted from the semiconductor light emitting element 1. The heat dissipating unit 3 is interposed between a plurality of heat conductive sheets 4 having a fibrous structure, which are disposed in a mutually separated posture, and the heat conductive sheets 4 disposed to face each other. A spacer 5, a holder 6 disposed on each side end face of the plurality of thermal conductive sheets 4 stacked with the spacer 5 interposed therebetween, the holder 6, the thermal conductive sheet 4, and the spacer 5. And a connector 7 that penetrates and fastens these laminates.

  Due to the above configuration, it has a heat-dissipating unit that is made by laminating a plurality of thermally conductive sheets having fibrous properties so as to be spaced apart from each other, thereby significantly reducing the weight compared to a structure using a conventional metal heat-radiating plate. Can be achieved. Since the overall weight of the lighting device can be reduced, the fixing structure can be simplified, the manufacturing cost can be reduced, and workability at the time of installation can be improved. Furthermore, the reduced weight lighting device can be used stably and safely over a long period of time in a use state installed at a high place, and the reliability can be improved. In addition, the heat dissipation unit used in the heatsink is fastened and fixed by a connecting tool penetrating them in a state where a plurality of thermally conductive sheets having fibers are alternately stacked with spacers interposed therebetween. In addition, it is possible to easily fix a large number of heat conductive sheets, and to realize a feature that the heat coupling state of each heat conductive sheet can be easily exhibited. Furthermore, since the heat dissipation effect can be adjusted by variously changing the number and shape of the heat dissipation units fixed to the substrate, an advantage that it can be easily applied to lighting devices having various specifications can be obtained.

In the lighting device of the present invention, a plurality of semiconductor light emitting elements 1 are arranged on the circumference at equal intervals on the first surface 2X of the substrate 2, and a plurality of heat radiation units 3 are arranged on the second surface 2Y of the substrate 2. It can arrange | position at equal intervals on the circumference.
With the above configuration, the heat generated from the plurality of semiconductor light emitting elements fixed on the substrate can be effectively conducted to the plurality of heat radiating units to be radiated.

In the illuminating device of the present invention, the plurality of heat dissipating units 3 can arrange the spacers 5 at portions corresponding to the positions where the semiconductor light emitting elements 1 are mounted.
With the above configuration, the heat generated from each semiconductor light emitting element can be more efficiently conducted to the heat radiating unit through the spacers arranged at the opposing positions to be radiated.

In the lighting device of the present invention, among the plurality of spacers 5 to which the heat radiating unit 3 is connected to each other, the width (D) of the spacer 5 arranged at the center is set to the width of the spacer 5 arranged at both ends. It can be larger than (D) and can be disposed at a position corresponding to the position where the semiconductor light emitting element 1 is mounted.
With the above configuration, the spacer can be thermally coupled to the substrate with a wider area through the wide spacer disposed at the center, and the spacer can be stably raised by bringing the end face of the wider spacer into contact with the substrate. It can be fixed with. In particular, since the spacer having a wide width is disposed at a position corresponding to the mounting position of the semiconductor light emitting element, which is a heat generating member, heat generated from the semiconductor light emitting element can be more effectively conducted and dissipated.

It is a vertical cross section of an illuminating device provided with the heat radiator which concerns on one embodiment of this invention. It is the disassembled perspective view which looked at the illuminating device shown in FIG. 1 from the lower side. It is the disassembled perspective view which further decomposed | disassembled the illuminating device shown in FIG. It is the perspective view which looked at the illuminating device shown in FIG. 2 from the upper side. It is a disassembled perspective view of the illuminating device shown in FIG. It is a bottom view of the board | substrate of the illuminating device shown in FIG. It is a top view of the board | substrate of the illuminating device shown in FIG. It is a perspective view of the thermal radiation unit of the illuminating device shown in FIG. It is a disassembled perspective view of the thermal radiation unit shown in FIG. FIG. 9 is an exploded plan view of the heat dissipation unit shown in FIG. 8. It is a perspective view which shows another example of a thermal radiation unit. It is a disassembled perspective view of the thermal radiation unit shown in FIG. It is a disassembled perspective view which shows another example of a thermal radiation unit. It is a top view which shows another example of a thermal radiation unit. It is an expanded sectional view which shows the connection structure of a board | substrate and a thermal radiation unit.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies a radiator for embodying the technical idea of the present invention, a radiator unit for the radiator, and a lighting device including the radiator. The heat radiating unit and the lighting device are not specified as follows. Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention unless otherwise specified, and are merely explanations. It is just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

  Hereinafter, as an example of the radiator of the present invention, a radiator used in the lighting device will be described in detail. The radiator uses a light emitting member mounted on the lighting device as a heat generating member, and dissipates heat generated from the light emitting member. However, the radiator of the present invention is not limited to the lighting device, and can be used for radiating heat generated from a heat generating member other than the light emitting member. For example, the heat radiator can be used in an application in which an electronic device including a heat generating member such as a semiconductor element, a transformer, or a display is provided and heat generated from the heat generating member is radiated.

  An illuminating device provided with the heat radiator which concerns on one embodiment of this invention is shown in FIGS. 1 is a vertical sectional view of the illumination device, FIG. 2 is an exploded oblique perspective view of the illumination device shown in FIG. 1 as viewed from below, and FIG. 3 is an exploded oblique perspective view of the illumination device shown in FIG. 4 is an oblique perspective view of the illumination device shown in FIG. 2 as viewed from above, FIG. 5 is an exploded perspective view of the illumination device shown in FIG. 4, and FIG. 6 is a bottom view of the substrate of the illumination device shown in FIG. FIG. 7 is a plan view of the substrate of the lighting device shown in FIG. The illumination device shown in these figures includes one or more semiconductor light emitting elements 1, a substrate 2 on which the semiconductor light emitting elements 1 are mounted on the first surface 2X, and a power source for adjusting the power supplied to the semiconductor light emitting elements 1. The unit 60 and the radiator 10 that radiates heat generated from the semiconductor light emitting device 1 are provided. In this illuminating device, the semiconductor light emitting element 1 mounted on the substrate 2 is used as the heat generating member 9, and heat generated from the semiconductor light emitting element 1 in the use state is radiated by the radiator 10. In addition, let the up-down direction in this specification be the up-down direction in FIG.

(Semiconductor light emitting element 1)
The semiconductor light emitting device 1 can use various light emitting devices that can emit light as a light source. The semiconductor light emitting device 1 shown in FIGS. 3 and 6 is a COB (chip on board) type light emitting device. As such a semiconductor light emitting element 1, a board in which a plurality of light emitting diodes (LEDs) are mounted on a board such as a ceramic substrate can be used. In the semiconductor light emitting device 1 shown in the figure, a plurality of light emitting diodes are mounted on a board in a predetermined arrangement, and the surfaces thereof are covered with a sealing resin. However, the semiconductor light emitting element 1 is not limited to the COB (chip on board) type, and other types that can be mounted on the substrate 2 can be used.

  The semiconductor light emitting element 1 is fixed at a fixed position on the mounting surface which is the first surface 2X of the substrate 2. The lighting device preferably has a plurality of semiconductor light emitting elements 1 mounted on a substrate 2. The illumination device shown in the figure includes six semiconductor light emitting elements 1. However, the lighting device may include 1 to 5 semiconductor light emitting elements, or may include 7 or more semiconductor light emitting elements. The semiconductor light emitting device 1 can be brightened by increasing its output, and can be brightened by increasing the number of mounted components. The output and the number of the semiconductor light emitting elements 1 mounted on the lighting device are variously changed depending on the application. For example, in a lighting device used as a replacement lamp for a mercury lamp on a factory ceiling or the like, a COB (chip on board) type can use 6 semiconductor light emitting elements with output of 28W, and the total output can be 168W, or COB (chip on board) type can use 3 semiconductor light emitting elements with output of 28W The overall output can be 84W.

(Substrate 2)
The board | substrate 2 is a board | substrate with which the semiconductor light-emitting element 1 is mounted, Preferably, the board | plate material excellent in thermal conductivity can be used. The substrate 2 shown in FIGS. 1 to 7 is a metal plate, and is an aluminum plate. However, the substrate can be made of a metal other than aluminum or made of plastic. Plastic substrates are heated by mixing various fillers made of metal compounds, for example, oxide fillers such as silica and alumina, nitride fillers such as boron nitride and aluminum nitride, or carbon fillers such as silicon carbide into the resin. Conductivity can be improved. Furthermore, the metal substrate 2 preferably has an insulating structure on the surface of the mounting surface by applying an insulating paint to the first surface 2X.

  The illustrated substrate 2 has a circular outer shape. However, the outer shape of the substrate may be a regular polygon. The circular or regular polygonal substrate 2 preferably has a plurality of semiconductor light emitting elements 1 mounted on the outer periphery thereof at a predetermined interval. The substrate 2 shown in FIGS. 3 and 6 has six semiconductor light emitting elements 1 arranged on the outer periphery. In this substrate 2, six semiconductor light emitting elements 1 are arranged at equal intervals on the same circumference along the outer peripheral edge of the circular substrate 2. That is, the substrate 2 has six semiconductor light emitting elements 1 on the circumference of the reference circle 21 in the circumferential direction so that the center angles formed by the radii passing through the centers of the six semiconductor light emitting elements 1 are equal. They are arranged at intervals of 60 degrees. As shown in FIG. 6, the six semiconductor light emitting elements 1 arranged on the same circumference are fixed to the substrate 2 so as to be arranged at six vertices of a regular hexagon. Similarly, a substrate on which n semiconductor light emitting elements are arranged on the same circumference can be mounted such that n semiconductor light emitting elements are arranged at n apexes of a regular n-gon.

  Here, the reference circle 21 forming the circumference on which the plurality of semiconductor light emitting elements 1 are arranged is arranged so that the semiconductor light emitting elements 1 can be arranged in an optimum region of the substrate 2 as shown in FIGS. A radius (r) is specified. The radius (r) of the reference circle 21 can be specified as a ratio with respect to the radius (R) of the substrate 2, for example. When the radius (r) of the reference circle of the substrate is reduced, a plurality of semiconductor light emitting elements are unevenly distributed on the center portion side of the substrate, so that heat is easily trapped in the center portion of the substrate. On the other hand, when the radius (r) of the reference circle is increased, the semiconductor light emitting element approaches the outer peripheral edge of the substrate, and the heat dissipation area for radiating the heat generated by the semiconductor light emitting element is narrowed. Therefore, in consideration of the above, the reference circle has a radius (r) of 50 to 90%, preferably 60 to 80%, of the radius (R) of the substrate.

  Note that a semiconductor light emitting element can be mounted on the center of the substrate. For example, a lighting device including one semiconductor light emitting element can mount a semiconductor light emitting element at the center of the substrate, and a lighting device including a plurality of semiconductor light emitting elements also emits semiconductor light at the center and outer periphery of the substrate. An element can be mounted.

  In the substrate 2, each semiconductor light emitting element 1 is fixed in a thermally coupled state at a fixed position on the mounting surface which is the first surface 2X. The semiconductor light emitting element 1 is fixed via a connecting tool (not shown) such as a set screw or a holder, or is bonded and fixed to the substrate 2. The semiconductor light emitting element 1 fixed at a fixed position on the substrate 2 is electrically connected to a power supply unit 60 described later and supplied with power. The substrate 2 in FIGS. 1 and 6 has a through hole 22 for wiring at the center, and a power cable 62 that supplies power from the power source 60 to the semiconductor light emitting element 1 is passed through the through hole 22. Wiring. The through hole 22 is opened to a size that allows the power cable 62 to be inserted. The substrate 2 closes the gap between the through hole 22 and the power cable 62 with the closing material 12 in a state where the power cable 62 is inserted into the through hole 22. Resin, rubber, and adhesive can be used for the closing material 12. Thus, by blocking the gap between the through hole 22 and the power cable 62 with the closing material 12, it is possible to prevent insects and moisture from entering from this portion.

(Cover cap 11)
Each of the semiconductor light emitting elements 1 fixed to the substrate 2 is covered with a cover cap 11. The cover cap 11 has translucency, and transmits light emitted from the semiconductor light emitting element 1 to the outside. The cover cap 11 shown in FIGS. 1, 3, and 6 is a shallow bottomed cylinder, and is molded from resin so that the lower end of the cylinder 11A surrounding the semiconductor light emitting element 1 is closed by the cover 11B. doing. 11 A of cylinder parts are provided in the inner surface with the reflection layer which reflects the light emission of the semiconductor light-emitting device 1. FIG. The cover portion 11B is formed in a shape that swells in the center in a dome shape. Furthermore, the cover cap 11 has a structure for diffusing light that passes through the cover portion 11B. For example, the resin cover cap 11 can have a diffusion characteristic of allowing the light emitted from the semiconductor light emitting element 1 to pass through while being mixed with a filler that diffuses the transmitted light. The cover cap can also be mixed with a phosphor in the resin. The cover cap can change the color of light emitted from the semiconductor light emitting element by changing the wavelength of light emitted from the semiconductor light emitting element with a phosphor. However, in an illuminating device used for a spotlight or the like, it is not always necessary to provide the cover cap with a diffusing characteristic, and a condensing characteristic can be provided.

  As shown in FIGS. 3 and 6, the cover cap 11 is fixed to a fixed position of the substrate 2 through a set screw 13 that penetrates the fixing pieces 11 </ b> C provided on both sides of the cylindrical portion 11 </ b> A. The substrate 2 is provided with a plurality of screw holes 23 in order to fix the cover cap 11 to the first surface 2X by screwing. The screw holes 23 are provided at positions where the six cover caps 11 are fixed at fixed positions on the substrate 2.

(Translucent cover 35)
Furthermore, the illuminating device shown in FIGS. 1 to 3 includes a translucent cover 35 on the lower surface side of the substrate 2. The illustrated lighting device includes a fixing ring 30 to which the substrate 2 is fixed, and the translucent cover 35 is fixed to the substrate 2 through the fixing ring 30. The translucent cover 35 is disposed on the mounting surface side of the substrate 2 on which the semiconductor light emitting element 1 is mounted, and covers the irradiation surface side of the semiconductor light emitting element 1. The translucent cover 35 is formed in a disk shape with glass or plastic having translucency, and transmits light emitted from the semiconductor light emitting element 1 and irradiates the outside. Furthermore, by using a diffusion type for the translucent cover, it is possible to adjust the light irradiation range, brightness, glare, and the like.

  Further, although the lighting device is not shown, it is also possible to dispose a reflection plate on the mounting surface side of the substrate and inside the translucent cover. The reflecting plate is formed in a shape substantially equal to the outer shape of the substrate, and is disposed in a state parallel to the substrate and spaced from the substrate. A plurality of guide holes are opened in the reflector, and a cover cap that covers the semiconductor light emitting element is guided in the guide holes. The reflecting plate can be provided with a white surface layer having reflectivity with respect to light irradiated through the cover cap. The reflection plate can be formed by forming a metal or a resin into a plate shape and applying a white paint on the surface to provide a surface layer, or can be formed by using a white resin to provide a surface layer.

(Fixing ring 30)
The fixing ring 30 is a ring-shaped short cylinder along the outer peripheral edge of the substrate 2, and includes an inner ring 32 that protrudes inward from the lower edge in order to support the disc-shaped translucent cover 35. The inner shape of the fixing ring 30 is substantially the same as or slightly larger than the outer shape of the translucent cover 35, and the inner shape of the inner ring 32 is slightly smaller than the outer shape of the translucent cover 35. Thereby, the translucent cover 35 guided to the inside of the fixing ring 30 is supported by the inner ring 32 so as not to fall. Furthermore, the fixing ring 30 is provided with a flange portion 33 that protrudes outward from the upper end edge in order to be positioned and fixed with respect to the substrate 2. The flange portion 33 has a ring shape along the outer peripheral edge of the substrate 2, and the flange portion 33 is fixed to the outer peripheral edge portion of the substrate 2 and the fixing ring 30 is fixed to the substrate 2. The flange portion 33 of the fixing ring 30 is fixed to the substrate 2 via a connecting tool such as a set screw, or is fixed to the substrate 2 by adhesion or welding.

(Power supply unit 60)
The power supply unit 60 includes a power supply circuit 65 that converts AC power supplied from an external power supply such as a commercial power supply into DC power supplied to the semiconductor light emitting element 1 and outputs the same. Although not shown, the power supply circuit 65 includes a rectifier circuit that converts supplied alternating current into direct current, and a voltage adjustment circuit that converts the output of the rectifier circuit into a predetermined voltage and outputs the voltage. The illuminating device shown in FIG. 1 has electronic parts for realizing these circuits built in a casing 61, and this casing 61 is arranged and connected outside the illuminating device main body. However, the power supply circuit can also be mounted on the substrate. The illuminating device shown in FIG. 1 has a casing 61 of the power supply unit 60 disposed on the opposite side of the irradiation surface of the semiconductor light emitting element 1 and above the illuminating device main body. A power cable 62 serving as a power supply line for supplying power to the semiconductor light emitting element 1 mounted on the substrate 2 is drawn out from the casing 61. In the lighting device shown in FIG. 1, the power cable 62 is passed through the through hole 22 of the substrate 2 through the central portion of the radiator 10. The power cable 62 penetrating the substrate 2 is electrically connected to the semiconductor light emitting element 1 on the mounting surface which is the first surface 2X of the substrate 2. The illuminating device shown in FIG. 6 is divided into two blocks by connecting six semiconductor light emitting elements 1 in series three by three. The semiconductor light emitting devices 1 of each block are connected in series via connection leads 64, and lead wires 63 extending from the power cable 62 are connected to the semiconductor light emitting devices 1 at both ends. As described above, the structure in which the plurality of semiconductor light emitting elements 1 are connected in blocks can adjust the power supply in units of blocks and adjust the brightness of the lighting device. However, two or more semiconductor light emitting elements 1 can be connected in series, all six can be connected in series, or all can be connected in parallel. In other words, the connection methods of the plurality of semiconductor light emitting elements 1 can be various connection methods that can turn on each semiconductor light emitting element 1 with the power supplied from the power supply unit 6.

(Heatsink 10)
The heat radiator 10 radiates heat generated from the semiconductor light emitting element 1 that is the heat generating member 9, and the substrate 2 to which the semiconductor light emitting element 1 is thermally coupled, and is fixed to the substrate 2 in a thermally coupled state. One or more heat radiating units 3 for radiating heat conducted from the light emitting element 1 are provided. 3 to 5 and FIG. 7, the substrate 2 on which the semiconductor element 1 as the heat generating member 9 is mounted is also used as the substrate 2 to which the heat dissipation unit 3 is fixed. This structure is generated from the semiconductor element 1 by fixing the heat radiating unit 3 with the second surface 2Y as the heat radiating surface while mounting the semiconductor light emitting device 1 with the first surface 2X of the single substrate 2 as the mounting surface. There is a feature that heat can be efficiently conducted to the heat radiating unit 3. However, in the radiator, the substrate on which the heat dissipation unit is fixed and the substrate on which the semiconductor element is mounted can be separate members.

(Heat dissipation unit 3)
As shown in FIGS. 8 to 10, the heat dissipating unit 3 includes a plurality of thermally conductive sheets 4 having a fibrous structure, which are disposed in a mutually separated posture, and a thermally conductive sheet disposed to face each other. A spacer 5 interposed between the holders 4, a holder 6 disposed on each side end face of the plurality of heat conductive sheets 4 laminated with the spacer 5 interposed therebetween, a holder 6, and a heat conductive sheet 4. And a connector 7 that penetrates the spacer 5 and fastens these laminates. In the heat radiating unit 3, a plurality of heat conductive sheets 4 are laminated with a spacer 5 interposed therebetween, and the plurality of heat conductive sheets 4 are arranged in a posture separated from each other. Furthermore, the heat radiating unit 3 has holders 6 arranged on both side end surfaces of a plurality of heat conductive sheets 4 laminated with spacers 5 interposed therebetween, and via a connector 7 penetrating these laminated bodies. The holder 6, the heat conductive sheet 4, and the spacer 5 are integrally connected.

  8 and 9, the spacer 5 and the holder 6 are formed in a columnar shape extending in one direction, and the heat conductive sheet 4 is formed in a planar shape extending in the extending direction of the spacer 5 and the holder 6. . The heat radiating unit 3 in FIG. 9 alternately stacks a plurality of heat conductive sheets 4 having a rectangular outer shape and spacers 5 formed in an elongated prismatic shape, and both sides of the stacked body of the heat conductive sheets 4. Holders 6 are arranged on the end faces, and these laminates are fastened by a connector 7. As shown in FIG. 10, the heat radiating unit 3 includes a plurality of spacers 5 stacked alternately with a heat conductive sheet 4 and holders 6 arranged at both ends arranged in a straight line in the cross-sectional direction. These are fastened in a straight line via a holder 6, a thermally conductive sheet 4, a spacer 5, and a connecting tool 7 penetrating through the holder 6.

  As shown in FIGS. 9 and 10, the connector 7 has a rod portion 7 a that penetrates the holder 6, the thermally conductive sheet 4, and the spacer 5. The rod portion 7 a is connected to the holder 6 and the thermally conductive sheet. 4 and the spacer 5 are inserted into through-holes 6a, 4a, and 5a, and these are fastened. The heat radiating unit 3 includes a plurality of sheets while firmly connecting the spacers 5 and the holders 6 by linearly fastening the spacers 5 and the holders 6 with rod portions 7a that penetrate the holders 6, the heat conductive sheets 4, and the spacers 5. The heat conductive sheets 4 can be arranged in a predetermined arrangement. Further, by inserting the rod portion 7a into the through holes 6a, 4a and 5a opened in the holder 6, the heat conductive sheet 4 and the spacer 5, these can be connected at an accurate position.

  9 and 10, 15 heat conductive sheets 4 and 14 spacers 5 are alternately stacked, and holders 6 are arranged on both outer sides. Further, from one holder 6 to the other, A connecting tool 7 having a rod portion 7a passing therethrough is inserted and fastened toward the holder 6. The connector 7 is inserted in two places apart from each other in the length direction of the holder 6. However, the heat dissipation unit can change the number of heat conductive sheets to be laminated in various ways according to the application. Furthermore, the heat radiating unit can be separated in the length direction of the holder and fastened at three or more locations with a connector.

Furthermore, the heat radiating unit 3 of FIGS. 8-10 is arrange | positioned in the attitude | position which mutually separated the some heat conductive sheet 4 from each other. The plurality of thermal conductive sheets 4 are connected to the spacer 5 in the middle in the width direction, and project both sides in a direction away from the spacer 5 to form a protruding portion. The heat radiating unit 3 has a plurality of projecting portions projecting on both sides of the spacer 5, and the projecting portions facing each other are arranged so as to be separated from each other. The plurality of heat conductive sheets 4 are connected to the opposing surfaces of the spacers 5 in a thermally coupled state so that the adjacent heat conductive sheets 4 are separated from each other at a predetermined interval. As described above, by projecting a large number of thermally conductive sheets 4 on both sides of the spacer 5, the heat radiation area can be widened and heat can be radiated more effectively.
In the present specification, the heat radiation unit 3 protrudes from the substrate 2, the direction perpendicular to the substrate 2 is the length direction, and the direction is parallel to the substrate 2, and is a thermally conductive sheet. 4, the spacer 5, and the holder 6 are fastened together with a coupling tool in the thickness direction, and the direction parallel to the substrate 2 and perpendicular to the thickness direction is the width direction.

  The heat radiating unit 3 shown in FIGS. 8 to 10 has a plurality of thermally conductive sheets 4 spaced apart at equal intervals and arranged substantially in parallel. The heat dissipating unit 3 in FIG. 9 has the thickness (d) of the plurality of spacers 5 interposed between the heat conductive sheets 4 adjacent to each other in order to arrange the plurality of heat conductive sheets 4 at equal intervals. Are equal. The spacer 5 shown in the drawing has a rectangular column shape with a rectangular cross section, and the thickness (d) is equal. Thereby, the several heat conductive sheet 4 is arranged in parallel at equal intervals. In the heat radiating unit 3, the distance between the opposing heat conductive sheets 4 is specified by the thickness (d) of the spacer 5. Furthermore, in the heat dissipation unit 3 of FIG. 10, the cross-sectional shape of the spacer 5 is rectangular, so that the extending direction of each thermal conductive sheet 4 supported by the opposing surface of the spacer 5 is the connecting direction of the connector 7. The vertical direction is used.

  Furthermore, the heat radiating unit 3 of FIG. 9 has a plurality of thermally conductive sheets 4 formed in a rectangular shape having a predetermined length (L) and a lateral width (W). The length (L) of the heat conductive sheet is equal to the total length (S) of the spacer 5 and the total length (H) of the holder 6, and the holder 6, the heat conductive sheet 4, and the spacer at both ends of the heat dissipation unit 3. 5 end faces are located on the same plane. The heat radiating unit 3 has the end surfaces of the holder 6, the heat conductive sheet 4, and the spacer 5 arranged on the same plane on the side thermally coupled to the heat generating member 9, that is, on the second surface 2 Y side of the substrate 2. Thermal bonding can be performed in a state of being in close contact with the substrate 2. For this reason, the spacer 5, the holder 6, and the end surface of the heat conductive sheet 4 are directly thermally coupled to the substrate 2 to conduct heat more efficiently and to dissipate heat. Further, the heat radiating unit 3 can be thermally coupled in a state where the end surfaces of the holder 6 and the spacer 5 arranged on the same plane are in close contact with a back plate 50 described later on the side opposite to the substrate 2.

  The plurality of heat conductive sheets 4 have the same length (L), but the width (W) is changed according to the arrangement. The lateral width (W) of the plurality of heat conductive sheets 4 is adjusted so as to have an optimum length depending on the shape and orientation of the heat radiating unit 3, the position fixed to the substrate 2, and the like. As shown in FIG. 7, the plurality of heat conductive sheets 4 are arranged so that the tips of the heat conductive sheets 4 protruding from the spacer 5 are adjacent to each other in a state where the plurality of heat dissipation units 3 are fixed to the substrate 2. The connection position with the spacer 5 and its lateral width (W) are adjusted so as not to contact the unit 3 and to protrude outward from the outer peripheral edge of the substrate 2. That is, the plurality of thermally conductive sheets 4 fixed to the spacer 5 have dimensions such that the leading edge of the protruding portion protruding toward the outside of the substrate 2 does not protrude outward from the outer peripheral edge of the substrate 2. The connecting position with the spacer 5 and the lateral width (W) thereof are adjusted so that the leading edge of the protruding portion protruding toward the side approaches the adjacent heat radiating unit 3 but does not come into contact with the spacer.

  The heat radiating unit 3 includes the length (S), width (D) and thickness (d) of the spacer 5, the length (H) of the holder 6, the length (L) and width ( W), the heat radiation level can be adjusted by variously changing the connection position of the spacer 5 and the holder 6 and the heat conductive sheet 4. Here, in the heat dissipation unit 3 shown in FIG. 9, the length (L) of each thermal conductive sheet 4 is made equal to the length (S) of the spacer 5 and the length (H) of the holder 6. The width (W) of the sheet 4 is changed depending on the location.

8 to 10, the lateral width (W) of the plurality of thermal conductive sheets 4 is changed from the thermal conductive sheet 4 disposed at the center to the thermal conductive sheet 4 disposed at both ends. It is gradually getting smaller. The heat radiating unit 3 can efficiently radiate the heat conducted to the central portion by increasing the width (W) of the heat conductive sheet 4 disposed in the central portion where heat is most likely to be stored. Furthermore, the heat radiating unit 3 that gradually reduces the lateral width (W) of the thermal conductive sheet 4 from the central portion toward both ends, as shown in FIG. 10, projects heat from both sides of the linearly connected spacer 5. The protruding amount of the protruding portion of the adhesive sheet 4 is gradually decreased from the central portion toward both ends. The heat dissipating unit 3 having this structure is formed in a substantially eel shape in plan view. As shown in FIG. 7, the heat dissipating units formed in a substantially eel shape can be efficiently arranged in a state where a plurality of the heat radiating units are arranged in a circular shape, and are arranged in a wide area on the second surface 2Y of the substrate 2. it can.
However, the outer shape of the heat radiating unit 3 used in the heat radiating unit, that is, the width (W) of the plurality of heat conductive sheets 4 arranged in the heat radiating unit 3 and the amount of protrusion from the spacer 5, Various changes can be made depending on the shape, the shape of the substrate to which the heat generating member is thermally coupled, the number and arrangement of the heat radiation units fixed to the substrate, and the like.

(Thermal conductive sheet 4)
The heat conductive sheet 4 is a fiber-containing sheet material, and is preferably a fiber sheet containing a heat conductive filler. A fiber sheet containing a heat conductive filler is manufactured by adding a heat conductive filler to a fiber and performing wet papermaking, or by coating the surface of a paper sheet or non-woven sheet with a heat conductive filler, or a paper sheet or The nonwoven fabric sheet is manufactured by impregnating a heat conductive filler, or alternatively, a heat conductive filler-containing sheet composed of a heat conductive filler and a binder resin is laminated on a paper sheet or a nonwoven fabric sheet.

  As the heat conductive filler, carbon is preferably used. Graphite is optimal for carbon. However, instead of graphite or in addition to graphite, charcoal, bamboo charcoal, amorphous carbon, diamond, diamond-like carbon, fullerene, carbon nanotubes, carbine, graphene, carbon fiber, graphite powder, etc. are used for carbon. be able to. Further, as the heat conductive filler, metal powder or inorganic powder can be used instead of or in addition to carbon. As the heat conductive filler of the metal powder, powder of aluminum, iron, copper, silver, gold or the like can be used. In addition, as the thermally conductive filler of the inorganic powder, powders of silicon nitride, aluminum nitride, magnesia, alumina silicate, silicon, silicon carbide, boron nitride, alumina, silica and the like can be used. These heat conductive fillers can have an average particle size of 0.01 μm to 500 μm, preferably 1 μm to 200 μm.

  Furthermore, in addition to a heat conductive filler, a heat conductive sheet can add a flame retardant and can improve a flame-retardant characteristic. A heat conductive sheet can improve a flame retardance characteristic, for example by impregnating a fiber sheet with a flame retardant. For example, a fiber sheet obtained by using guanidine phosphate as a flame retardant and impregnating it with a proportion of 10% by weight achieves a flame retardancy effect of about UL94 V-0.

[Production method by wet papermaking]
A fiber sheet produced by wet papermaking is produced by suspending fibers and a heat conductive filler in water to form a papermaking slurry, wetmaking papermaking this papermaking slurry into a sheet, and drying it. This fiber sheet is preferably formed by suspending beating pulp in which infinite number of fine fibers are provided on the surface of the papermaking slurry and non-beating fibers that are not beaten. A sheet produced by binding a thermally conductive filler suspended in a papermaking slurry to fibers and making a sheet is used. Furthermore, the fiber sheet can improve the strength in a state of being formed into a sheet by including a synthetic resin as a binder in the papermaking slurry. Furthermore, the fiber sheet can also be produced by hot pressing a papermaking sheet obtained by making a papermaking slurry into a sheet. In this hot press, when the surface pressure is increased, voids in the papermaking sheet can be eliminated and the thermal conductivity can be further increased as a high-density sheet.

[Production method by coating or impregnation]
The manufacturing method by coating or impregnation is applied to the surface of a paper sheet or non-woven sheet made by wet or dry processing, or a resin made by mixing a powder of a heat conductive filler, or the inside of a paper sheet or non-woven sheet. It is manufactured by impregnating. In this method, a resin serving as a binder is added at a predetermined ratio to the heat conductive filler powder to prepare a heat conductive filler-containing resin, and the heat conductive filler-containing resin in a molten state is made into a paper sheet or non-woven fabric. It is applied to the surface of the sheet or impregnated inside a paper sheet or non-woven sheet. Paper sheets and non-woven sheets can be applied by spraying the surface with a thermally conductive filler-containing resin in a molten state, or by rolling a roller to which a thermally conductive filler-containing resin in a molten state is attached on the surface. it can. Moreover, a paper sheet or a nonwoven fabric sheet can be passed between rollers in which a molten heat conductive filler-containing resin is adhered in a molten state, and the heat conductive filler-containing resin in a molten state can be transferred and impregnated. . Further, the paper sheet or the nonwoven fabric sheet can be brought into an optimum impregnated state by being immersed in a liquid heat conductive filler-containing resin in a molten state and then squeezed with a roller or the like. A paper sheet or a nonwoven fabric sheet coated or impregnated with a heat conductive filler-containing resin is sandwiched by rollers from both sides, or pressed by a flat plate press to heat and press the resin to cure the heat conductive filler. The containing fiber sheet is manufactured.

[Production method by lamination]
The production method by lamination is carried out by laminating a heat conductive filler-containing sheet composed of a heat conductive filler and a binder resin on the surface of a paper sheet or a nonwoven fabric sheet and bonding them by a method such as adhesion or heat welding. In this method, heat conductive filler-containing sheets are laminated on the surface of a paper sheet or a non-woven sheet made by a wet method or a dry method, and these are bonded together to be formed into a single sheet. For the thermally conductive filler-containing sheet, for example, a prepreg formed by impregnating a fiber base material obtained by processing carbon fiber into a sheet shape with a thermosetting resin plastic can be used. In this method, for example, a thermally conductive filler-containing sheet, which is a prepreg, is laminated on a paper sheet, and this is heated to cure the thermosetting resin of the thermally conductive filler-containing sheet and bond it into a sheet shape. Is produced. The heat conductive filler-containing sheet is preferably laminated with paper sheets on both sides, thereby preventing the heat conductive filler from falling off the surface and improving the heat conductive characteristics. The thermally conductive filler-containing sheet and the paper sheet are firmly bonded to each other through a thermosetting resin that is cured by heating, and are formed into a single sheet. However, a heat conductive filler containing sheet | seat is not specified to a prepreg, but can also be made into the various sheet | seat material containing a heat conductive filler. Such a thermally conductive filler-containing sheet is not impregnated with a thermosetting resin, and is bonded and laminated with a binder between a paper sheet or a nonwoven fabric sheet, or an uncured state that becomes a binder The thermosetting resin sheets can be laminated, and heated and pressurized to melt the thermosetting resin sheets and bond them together. As such a heat conductive filler-containing sheet, for example, a graphite sheet or the like can be used.

  The fiber sheet containing the above heat conductive filler has a kind and particle size of the heat conductive filler contained so that the thermal conductivity in the plane direction is 15 W / m · K or more, preferably 20 W / m · K or more. The content etc. are adjusted.

  The above fiber sheet has a feature that is strong against bending deformation and vibration due to the structure in which the fibers are gathered in an intersecting state. For this reason, a fiber sheet is manufactured by adding a heat conductive filler to a paper sheet or a non-woven sheet, and the heat conductive sheet 4 manufactured from the fiber sheet is excellent in heat dissipation because its deformation and deterioration are prevented over a long period of time. There is a feature that can sustain the characteristics.

  The fiber sheet containing the heat conductive filler manufactured as described above is cut into length (L) and width (W), which are predetermined dimensions, to manufacture the heat conductive sheet 4. The cut fiber sheets can be adjusted in thickness by laminating and bonding a plurality of sheets. The heat conductive sheet formed by laminating a plurality of fiber sheets can increase the strength.

  Furthermore, the heat conductive sheet 4 made of a fiber sheet preferably has elasticity. The heat conductive sheet 4 having elasticity is elastically deformed in the thickness direction in a state where a plurality of sheets are laminated and fastened by the connector 7. In the structure in which the thermally conductive sheet 4 that is elastically deformed in this manner is screwed and fastened by a connecting member 7 to be described later, the screw is not easily loosened, and the highly reliable heat radiation unit 3 having excellent vibration resistance. Can be realized.

  Furthermore, the heat conductive sheet 4 cut into a predetermined outer shape has a through hole 4a for allowing the rod part 7a of the connector 7 to pass therethrough. Each thermally conductive sheet 4 has a position where it is connected to the spacer 5 depending on the opening position of the through hole 4 a, and thus the amount of protrusion from the spacer 5 is specified. Therefore, each heat conductive sheet 4 determines the opening position of the through-hole 4a in the width direction in consideration of the lateral width (W) and the protrusion amount to be protruded on both sides of the spacer 5. Furthermore, the opening position of the through-hole 4a in the length direction is determined so that each heat conductive sheet 4 opposes the through-holes 5a and 6a provided in the opposing separator 5 and holder 6.

(Spacer 5)
The spacer 5 is made of metal so that heat can be dissipated while conducting heat of the substrate 2 efficiently. The metal spacer 5 can increase the heat capacity by increasing the volume and conduct heat efficiently. However, when the volume of the metal spacer 5 is increased, the weight increases and the entire apparatus becomes heavy. Therefore, the overall shape and size of the metal spacer 5 are determined in consideration of these factors. The spacer 5 shown in FIGS. 8 to 10 is formed in an elongated column shape as a whole. The columnar spacers 5 are interposed between the heat conductive sheets 4 facing each other, and hold these heat conductive sheets 4 in a separated posture. The spacer 4 shown in the figure has a prismatic shape, and is arranged in a state in which the side surfaces are in close contact with each other in the middle in the width direction of the opposing heat conductive sheet 4. The spacer 3 shown in the figure has a rectangular cross-sectional shape, and is disposed in a posture in which the thermally conductive sheets 4 disposed on opposite side surfaces are separated from each other so as to be parallel to each other.

  The metal spacer 5 is made of a metal that is lightweight and has excellent thermal conductivity, such as aluminum. The aluminum spacer 5 is preferably manufactured by extrusion. The above spacer 5 can be easily and easily formed into a columnar shape having the same cross-sectional shape in the axial direction by extrusion molding. The metal spacer 5 formed in a columnar shape has side holes facing each other, and a through hole 5a for inserting the connector 7 is opened on the surface facing the heat conductive sheet 4 to be laminated. .

  The columnar spacer 5 is disposed in a substantially vertical posture with respect to the substrate 2. The spacer 5 is disposed in such a manner that one end surface is fixed in thermal contact with the second surface 2Y of the substrate 2 in a surface contact state and the opposite end edge protrudes to the back surface side of the substrate 2. . As described above, the structure in which the spacer 5 is formed in a columnar shape and is arranged in a substantially vertical posture with respect to the substrate 2 makes it possible to effectively use the region on the back surface side of the substrate 2 while reducing the weight of the spacer 5 and to provide a wide heat radiation area. There are features that can be secured. However, the spacers do not necessarily have to be prismatic shapes having the same overall cross-sectional area, and may be columnar shapes having partially different lateral widths.

(Holder 6)
The holder 6 is disposed on both sides of the laminate of the heat conductive sheets 4 laminated with the spacers 5 interposed therebetween, and sandwiches the laminate from both sides. The holder 6 shown in the figure includes a support plate portion 6A disposed to face the heat conductive sheet 4, and this support plate portion 6A is located in the middle of the heat conductive sheet 4 in the width direction, It is arranged along the opposing position. The support plate portion 6A has an elongated plate shape and is disposed in a state in which a wide side surface is in close contact with the opposing heat conductive sheet 4.

  Furthermore, the holder 6 includes a connecting portion 6 </ b> B for fixing the heat radiating unit 3 to the substrate 2. The holder 6 shown in FIGS. 8 to 10 includes a connecting portion 6B outside the support plate portion, and is fixed to the substrate 2 via the connecting portion 6B. The connecting portion 6B shown in the figure is a cylindrical portion integrally provided outside the support plate portion 6A. A fixing screw 14 penetrating the substrate 2 is screwed into the cylindrical portion to fix the heat dissipation unit 3 to the substrate 2. ing. The connecting portion 6B shown in FIGS. 8 to 10 is not completely cylindrical, but is provided with a slit-like opening 6b partially along the axial direction which is the length direction of the holder 6, and has a C-shaped sectional view. It is said. In addition to being easily molded, the connecting portion 6B having this structure has a feature that the tip of the fixing screw 14 can be visually recognized through the opening 6b in a state where the fixing screw 14 is screwed. However, the connecting portion does not necessarily have a cylindrical shape, and a connecting hole can be provided in the side edge portion of the holder without providing an opening, and a fixing screw can be screwed into the connecting hole and fixed.

  The metal holder 6 is made of a metal that is lightweight and has excellent thermal conductivity, such as aluminum. The holder 6 made of aluminum is also preferably manufactured by extrusion. The extruded holder 6 can be easily and easily formed into a columnar shape having the same cross-sectional shape in the axial direction. The holder 6 in FIGS. 9 and 10 has a support plate portion 6A facing the heat conductive sheet 4 in a plate shape, and a connecting portion 6B formed outside thereof is formed in a cylindrical shape extending in the metal extrusion direction. The slit-shaped opening 6b extending in the extrusion direction is provided. Accordingly, these holders 6 can be efficiently mass-produced while the support plate portion 6A and the connecting portion 6B are shaped to extend in the aluminum extrusion direction. The holder 6 having the above-described shape is formed by extrusion molding of aluminum into a columnar shape in which a cylindrical connecting portion 6B is integrally connected to the outside of the support plate portion 6A, and then above and below the connecting portion 6B extending in the axial direction. Two intermediate portions are removed, and the flat portion of the support plate portion 6A is exposed at the removed portion, and a through hole 6a through which the connector 7 is inserted is opened in the exposed surface 6c.

  The spacer 5 and the holder 6 manufactured by extrusion molding are efficiently mass-produced by, for example, cutting an elongated columnar molding material formed into a predetermined cross-sectional shape by extrusion molding into a predetermined length. However, the spacer and the holder are not necessarily specified for production by extrusion. The spacer and the holder can be manufactured by casting, pressing, or the like.

  As described above, the spacers 5 and the holders 6 that are fixed in a state where the plurality of thermally conductive sheets 4 are sandwiched and held at a predetermined interval are preferably made of metal. The heat dissipating unit 3 in which the spacer 5 and the holder 6 are made of metal can increase the overall strength and increase the connection strength with the substrate 2. In addition, the spacer 5 and the holder 6 are made of metal, thereby increasing the heat capacity, realizing excellent heat conduction characteristics, and efficiently radiating heat. However, the holder can be made of hard plastic.

(Connector 7)
The connector 7 passes through the holder 6, the heat conductive sheet 4, and the spacer 5 that are stacked on each other, and integrally fastens these stacked bodies. 9 and 10 includes a bolt 7A having a rod portion 7a penetrating the holder 6, the heat conductive sheet 4, and the spacer 5, and a nut 7B screwed into the tip of the bolt 7A. . The bolt 7A in FIG. 10 is provided with a male screw at the tip of the rod portion 7a, and is formed in a cylindrical shape from the middle portion to the screw head in the through holes 6a, 4a opened in the holder 6, the heat conductive sheet 4, and the spacer 5. 5a can be inserted. The connector 7 has the rod portion 7a of the bolt 7A penetrated through the holder 6, the heat conductive sheet 4 and the spacer 5 which are laminated with each other, and a nut 7B is screwed into the tip portion so that the holder 6 and the heat conductive sheet are 4 and the spacer 5 are fastened. However, a bolt provided with a male screw at the tip can be tightened by screwing into the holder by providing a female screw on the inner surface of the through hole of the holder arranged on the tip side of the bolt without screwing into the nut. . Further, the coupling tool can be constituted by a rod portion having male screws at both ends and a nut screwed into the male screws at both ends.

(Modification 1 of heat dissipation unit)
Further, in the heat dissipation unit 3, two rows of spacers 5 can be arranged between the heat conductive sheets 4 arranged to face each other. The heat radiating unit 3 shown in FIG. 11 and FIG. 12 is arranged in a posture in which two prismatic spacers 5 are arranged in parallel with each other between opposed thermal conductive sheets 4. In the heat dissipation unit 3, the holder 6, the heat dissipation sheet 4, and the spacer 5 are integrally connected to the spacers 5 in each row by penetrating the rod portions 7 a of the connectors 7. In order to connect the two rows of spacers 5 at a fixed position, the heat dissipating unit 3 shown in FIG. 12 is connected to the exposed surface 6c exposed by removing the connecting portion 6B at the upper and lower portions of the holder 6. Two through holes 6a through which the rod portions 7a of 7 are inserted are arranged side by side. Further, each spacer 5 is provided with a through hole 5a facing the through hole 6a opened in the exposed surface 6c. Further, the heat conductive sheet 4 has an oval through-hole 4a that is opposed to the through-holes 5a of the two spacers 5 arranged in two rows. The oval through-hole 4a is opened to a size and shape that are arranged at a fixed position while being positioned by two rod portions 7a that are inserted in a parallel posture.

  As described above, the heat radiating unit 3 having two spacers 5 interposed between the opposing heat conductive sheets 4 has a large contact area with the substrate 2 in a state where the end surface is in surface contact with the substrate 2. Therefore, there is a feature that it can be held in a posture that stands stably and vertically with respect to the substrate 2. Furthermore, there is a feature that heat conduction can be efficiently performed by increasing the contact area with the substrate 2.

(Other modification 2 of heat dissipation unit)
Further, as shown in FIG. 13, in the plurality of spacers 5 that are connected to each other, the heat radiating unit 3 has a lateral width (D) of the spacer 5 that is disposed at the intermediate portion as a lateral width (D) of the spacer 5 that is disposed at both ends. ). This structure can increase the contact area between the substrate 2 and the spacer 5 in a state in which the heat dissipation unit 3 is disposed on the substrate 2, so that heat conduction can be improved and the posture standing up with respect to the substrate 2 can be stabilized. There are features that can be retained. In particular, in the structure in which the spacer 5 is disposed at a position corresponding to the position where the semiconductor light emitting element 1 is mounted, the wide spacer 5 is disposed to face the semiconductor light emitting element 1 so that the semiconductor can be more effectively provided. There is a feature that heat generated by the light-emitting element 1 can be conducted and released.

  Here, in the heat radiating unit 3 shown in FIG. 13, the lateral width (D) of the end portion on the substrate 2 side of the spacer 5 disposed in the intermediate portion is widened to form a wide portion 5 h. In this structure, by increasing the lateral width (D) of the spacer 5 only on the substrate 2 side, the increase in the overall weight is reduced, and the heat conduction characteristics with the substrate 2 are improved. And can be fixed stably. However, as shown by the chain line in FIG. 13, the spacer disposed in the intermediate portion can be increased in overall width and heat capacity.

  As described above, the heat conductive sheet 4 sandwiched between the pair of spacers 5 or sandwiched between the spacers 5 and the holder 6 is disposed along the facing surfaces of the facing spacers 5 and the holder 6. Is done. For this reason, the extension direction of the heat conductive sheet 4 is specified by the direction of the opposing surface of the spacer 5 or the holder 6. That is, the extension direction of the front end of the heat conductive sheet 4 is specified by the directions of the spacers 5 that sandwich the heat conductive sheet 4 or the facing surfaces of the spacer 5 and the holder 6.

(Other modification 3 of heat dissipation unit)
In the heat dissipation unit 3 described above, the transverse cross-sectional shape of the spacer 5 interposed between the heat conductive sheets 4 facing each other is rectangular, and a plurality of heat conductive sheets sandwiched between the spacers 5 facing each other. 4 are arranged in parallel to each other. However, the heat radiating unit may have a structure in which an inclined surface is provided on the opposed surfaces of the spacers, and the thermally conductive sheet sandwiched between the opposed spacers is bent in the middle. This heat radiating unit can be arranged so as to be divergent toward the tip by adjusting the bending angle of a plurality of heat conductive sheets arranged adjacent to each other. Can also be arranged.

  In order to arrange the heat conductive sheet 4 in a predetermined shape in a state where the heat conductive sheet 4 is bent in the middle, the heat radiating unit 3 shown in FIG. 14 has the heat conductive sheet 4 on the surface facing the spacer 5 and the holder 6 facing each other. Inclined surfaces 5k and 6k are provided along the bent portion. The heat radiating unit 3 shown in FIG. 14 has an opposing surface between the spacers 5 or an opposing surface between the spacer 5 and the holder 6 as a chevron surface or a trough surface, and the heat conductive sheet 4 sandwiched between them. Can be held at a predetermined bending angle α. Here, the bending angle α is defined by a direction perpendicular to the connecting direction of the connector 7 and a protruding direction of the thermally conductive sheet 4 protruding in an inclined state in a plane parallel to the substrate 2. Shows corners.

  The heat conductive sheet 4 of FIG. 14 is bent in a square shape in the middle in the width direction. The thermal conductive sheet 4 is cut along a folding line extending in the length direction in the middle of the width direction after cutting the length (L) and the width (W) into predetermined dimensions. The bent heat conductive sheet 4 is sandwiched between a spacer 5 having a mountain shape on the opposite surface and a spacer 5 having a valley surface on the opposite surface, and is held in a predetermined posture. The heat conductive sheet 4 to be bent can adjust the bending angle α to specify the extending direction of the tip of the heat conductive sheet 4. In the heat dissipation unit 3 shown in FIG. 14, the bending angle α is gradually increased from the heat conductive sheet 4 disposed in the central portion toward the heat conductive sheet 4 disposed outside. The heat radiating unit 3 is configured such that the heat conductive sheet 4 disposed in the center is a flat shape that is not bent (in the plan view, straight), and the bending angle α of the heat conductive sheet 4 disposed on the outside is set to the center. The protrusions that protrude from both sides of the spacer 5 are gradually enlarged toward the outside so that the protrusions spread toward the tip. The heat radiating unit 3 having this shape is arranged in a state in which the tips of the plurality of heat conductive sheets 4 are widened in a state in which the plurality of heat conductive sheets 4 are fixed. For this reason, there exists the characteristic which can arrange | position the some heat conductive sheet 4 more extensively, and can improve the thermal radiation effect.

  However, the heat radiating unit can be configured such that the protruding portion protruding from the spacer is tapered toward the tip, and some of the thermally conductive sheets protrude from the spacer. It is also possible for the protruding portions to be parallel to each other, to be divergent, or to be tapered. These heat radiating units can specify the attitude | position of the protrusion part which protrudes from a spacer by adjusting the bending angle of a heat conductive sheet, and the inclination angle of the inclined surface in the opposing surface of a spacer and a holder.

(Arrangement of multiple heat dissipation units 3)
A radiator 10 shown in FIG. 7 is a second surface 2Y of the substrate 2, and a plurality of heat radiation units 3 are fixed in a thermally coupled state to the back surface side of the mounting surface on which the semiconductor light emitting element 1 is mounted. . The plurality of heat radiating units 3 are formed in the same shape, and are fixed to the second surface 2Y of the substrate 2 in a predetermined arrangement. In the radiator 10 of FIG. 7, a plurality of heat radiating units 3 are arranged at equal intervals on the circumference in the outer peripheral portion of the substrate 2. The heat radiator 10 arranges the heat radiating units 3 adjacent to each other in a non-contact state, and provides a ventilation gap 29 between the heat radiating units 3 adjacent to each other. Thereby, the heat dissipation effect of each heat radiating unit 3 is improved.

  7 is located on the back side of the reference circle 21 of the substrate 2 on which the plurality of semiconductor light emitting elements 1 are mounted, and a plurality of heat dissipation units 3 are arranged along the reference circle 21. . The plurality of heat dissipating units 3 arranged along the reference circle 21 are arranged on the back side of the semiconductor light emitting element 1 mounted on the first surface 2X of the substrate 2. Since the illuminating device shown in the figure has six semiconductor light emitting elements 1 arranged on the first surface 2X of the substrate 2, it is the second surface 2Y of the substrate 2 on the back side of these semiconductor light emitting elements 1. Six heat-dissipating units 3 are arranged in the position. With this structure, heat generated from the semiconductor light emitting element 1 can be more effectively conducted to each heat radiating unit 3 to radiate heat. However, the heat radiator does not limit the number of heat radiating units to six. The radiator can include 1 to 5 heat radiating units, or can include seven or more heat radiating units. The number of heat dissipation units depends on the size of the board, the number of heat generating members (semiconductor light-emitting elements mounted) and the amount of heat generated, and the size and amount of heat dissipation of each heat dissipation unit. Can be variously changed. Furthermore, the lighting device does not necessarily require the number of semiconductor light-emitting elements mounted on the first surface of the substrate to be equal to the number of heat radiation units fixed to the second surface, and the semiconductor light-emitting device is formed on both surfaces of the substrate. It is not specified for the structure in which the element and the heat radiating unit are arranged at opposing positions.

  In the heat radiator 10 of FIG. 7, each heat radiating unit 3 is arranged on a locus of rotation with respect to the center of the substrate 2. In the radiator 10, the plurality of heat radiating units 3 are arranged so that each heat radiating unit 3 is rotated and moved around the center of the substrate 2. That is, the heat radiator of FIG. 7 is arranged in an array in which six heat radiation units 3 are rotationally moved at intervals of 60 degrees. Similarly, in a radiator including n (however, n ≧ 2) heat dissipation units, the heat dissipation units can be arranged in an array formed by rotational movement at 360 / n degree intervals. The radiator 10 having the above structure can efficiently and uniformly conduct heat conducted from the semiconductor light emitting element 1 to the substrate 2 to the plurality of heat radiating units 3 to radiate heat. However, in the heat radiator, a plurality of heat radiation units can be arranged in a line-symmetric arrangement, a point-symmetric arrangement, or a random arrangement.

  Further, in the radiator 10 of FIG. 7, the heat radiating unit 3 fixed to the second surface 2Y of the substrate 2 is arranged on the first surface 2X of the substrate 2 at a position corresponding to the position where the semiconductor light emitting element 1 is mounted. doing. The heat radiating unit 3 is fixed to the substrate 2 so that the central portion of the spacers 5 connected in a straight line is a portion corresponding to the position where the semiconductor light emitting element 1 is mounted. With this structure, the heat generated from the semiconductor light emitting element 1 can be more efficiently conducted to the spacer 5 to dissipate heat. In particular, by arranging the spacer 5 in the central portion on the back side of the central portion of the semiconductor light emitting element 1, it is possible to efficiently conduct heat to the spacer 5, thereby efficiently conducting heat to the entire heat radiating unit 3. However, it is not always necessary to dispose the spacer at the portion facing the semiconductor light emitting element mounted on the mounting surface, and the heat dissipating unit can be disposed at a shifted position. This structure conducts heat generated from the semiconductor light emitting element to the spacer through the substrate.

(Heat conduction member)
The heat radiator 10 fixes a plurality of heat radiating units 3 to the second surface 2Y of the substrate 2 in a thermally coupled state. The plurality of heat radiating units 3 have a heat conducting member interposed between the heat radiating unit 3 and the substrate 2 in order to realize an excellent thermal coupling state with respect to the substrate 2. As such a thermal coupling member, grease or an adhesive excellent in thermal conductivity can be used. The heat radiating unit 3 is fixed to the substrate 2 with a heat conducting member such as grease or adhesive applied to the end face of the spacer 5, or the boundary between the spacer 5 and the substrate 2 with the spacer 5 fixed to the substrate 2. A thermally conductive member such as grease or adhesive is applied to the portion and fixed in a thermally coupled state. Furthermore, the heat dissipation unit can fix a plurality of thermally conductive sheets and holders to the substrate in a thermally coupled state. In this heat dissipation unit, a heat conductive member such as grease or adhesive is applied to the end surfaces of the heat conductive sheet or the holder, and the heat conductive sheet or the holder is connected to the substrate in a heat-bonded state. Since this structure can conduct the heat of the substrate directly to the heat conductive sheet or holder, the heat dissipation of the heat dissipation unit can be further improved.

  The heat conductive member 25 interposed between the heat dissipation unit 3 and the substrate 2 may be a heat conductive sheet 25A as shown in FIG. The heat conductive sheet 25A is a sheet material having excellent heat conductivity, and preferably contacts the spacer 5, the holder 6 and the heat conductive sheet 4 that are fixed to the substrate 2 in a pressed state. A sheet material having elasticity is used. As such a heat conductive sheet 25A, for example, a silicon sheet, a plastic sheet, or the like can be used. The heat conductive sheet 25 </ b> A is stacked between the heat radiation unit 3 on the second surface 2 </ b> Y of the substrate 2, and is connected in close contact with the end surfaces of the spacer 5 and the holder 6 and the edge of the heat conductive sheet 4. In this way, the structure in which the heat conductive sheet 25A is disposed between the substrate 2 and the heat radiating unit 3 has a structure in which the fixing screw 14 penetrating the substrate 2 and the heat conductive sheet 25A is connected to the connecting portion of the holder 6 as shown in FIG. The heat radiating unit 3 can be fixed to the substrate 2 by being screwed into 6B.

(Back plate 50)
Furthermore, the radiator 10 of FIGS. 1 to 5 includes a metal back plate 50 that is disposed on the back side of the substrate 2 so as to be spaced substantially parallel to each other. In the radiator 10, a plurality of heat radiating units 3 are arranged between the substrate 2 and the back plate 50, and the substrate 2 and the back plate 50 are connected via the heat radiating units 3.

  The back plate 50 has a shape along the outer periphery of the plurality of heat radiation units 3 fixed to the substrate 2 and has a circular outer shape as shown in FIGS. 4 and 5. Further, the circular back plate 50 has a central hole 52 opened at the center of the plate portion 55 and a plurality of back plate vents 53 having different shapes and sizes at the periphery and outer periphery thereof. The plurality of back plate vents 53 are opened to face the plurality of heat conductive sheets 4 of the plurality of heat radiating units 3 fixed to the substrate 2, and are heated by heat radiation of the spacer 5 and the heat conductive sheet 4. It is used as a vent for exhausting the discharged air to the outside. The internal air heated by the heat radiated from the radiator 10 rises by natural convection. Since the back plate 50 shown in the figure is fixed to the upper surface of the radiator 10, the heated internal air is discharged from the back plate vent 53 opened in the back plate 50 and ventilated. Further, the back plate 50 has a plate portion 55 in which the back plate vent 53 is not opened at a position facing the spacer 5 of the heat radiating unit 3. The heat conducted from the heat is directly conducted to the back plate 50 so that the heat can be dissipated.

  The back plate 50 is fixed to the holder 6 of the heat radiating unit 3 via the fixing screw 15 and fixed to a fixed position of the radiator 10. The back plate 50 shown in the figure has a plurality of fixing holes 54 through which the fixing screw 15 passes. The plurality of fixing holes 54 are opened to face the connecting portion 6 </ b> B provided in the holder 6, and a fixing screw 15 penetrating the back plate 50 is screwed into the connecting portion 6 </ b> B of the holder 6 so that the back plate 50 is attached to the holder 6. It is fixed. That is, the back plate 50 is fixed to the substrate 2 through the heat dissipation unit 3.

  Furthermore, the back plate 50 shown in the drawing is provided with a protruding piece 51 that faces both sides and protrudes in the outer peripheral direction, and the leading end side of the protruding piece 51 is bent upward. For example, the protruding piece 51 is used as a fixture for fixing the lighting device, or, as shown in FIG. 1, is also used as a member for fixing the power supply unit 60 arranged outside. However, the back plate does not necessarily need to be provided with a protruding piece, and can be fixed to the upper surface of a plurality of heat radiation units as a disk.

  As shown in FIGS. 1 to 5, the above radiator 10 is disposed on the outer peripheral surface, which is the side surface of the radiator 10, with the heat conductive sheets 4 of the plurality of heat radiating units 3 exposed. The air permeability to the unit 3 can be improved and heat can be radiated more effectively. However, although not shown, the radiator can include an outer cover that covers the outer periphery of the radiator. The exterior cover is disposed along the outer periphery of the radiator disposed on the back side of the substrate, and covers the periphery of the radiator. The exterior cover can be, for example, a cylindrical cylinder along the outer peripheral edges of the substrate and the back plate. The exterior cover can be provided with a vent so that the outside air can pass through the radiator. Such an exterior cover can be provided with ventilation holes by opening slits or through-holes, or can be made of a mesh material and provided with ventilation holes. The outer cover described above can be made of metal or plastic to reinforce the outer periphery of the lighting device.

The radiator of the present invention and the radiator unit for the radiator can be suitably used for a radiator that radiates heat generated from a heat generating member that generates heat in a use state. In particular, the heat radiator and the heat radiating unit of the present invention realize excellent heat radiating characteristics and weight reduction, and can be suitably used for an apparatus including a heat generating member.
In addition, the lighting device of the present invention is used as an alternative lighting device such as a mercury lamp, especially in a high place such as a factory lighting or a street lamp while having a structure using a semiconductor light emitting element such as an LED as a light source. It can use suitably for the illuminating device.

DESCRIPTION OF SYMBOLS 1 ... Semiconductor light-emitting element 2 ... Board | substrate 2X ... 1st surface; 2Y ... 2nd surface 3 ... Radiation unit 4 ... Thermally conductive sheet 4a ... Through-hole 5 ... Spacer 5a ... Through-hole; 5h ... Wide part; 6 ... Holder 6A ... Support plate part; 6B ... Connection part 6a ... Through hole; 6b ... Opening part; 6c ... Exposed surface; 6k ... Inclined surface 7 ... Connector 7A ... Bolt; 7B ... Nut 7a ... Rod part 9 ... Heat generation Member 10 ... Radiator 11 ... Cover cap 11A ... Tube part; 11B ... Cover part; 11C ... Fixing piece 12 ... Closure 13 ... Set screw 14 ... Fixing screw 15 ... Fixing screw 21 ... Reference circle 22 ... Through hole 23 ... Screw Hole 24 ... Fixed hole 25 ... Heat conducting member 25A ... Heat conducting sheet 29 ... Ventilation gap 30 ... Fixed ring 32 ... Inner ring 33 ... Flange 35 ... Translucent cover 50 ... Back plate 51 ... Projection piece 52 ... Center hole 53 ... Back plate vent 54 ... fixed 55 ... plate portion 60 ... power supply unit 61 ... casing 62 ... Power cable 63 ... lead wire 64 ... connecting leads 65 ... power supply circuit

Claims (36)

A heat radiator that is thermally coupled to the heat generating member and dissipates heat generated from the heat generating member,
A substrate thermally coupled to the heating member;
One or more heat dissipating units fixed to the substrate in a thermally coupled state and dissipating heat conducted from the heat generating member;
With
The heat dissipation unit is
A plurality of thermally conductive sheets having a fibrous structure, arranged in a posture separated from each other;
A spacer interposed between the thermally conductive sheets disposed opposite to each other;
Holders respectively disposed on both side end surfaces of the plurality of thermally conductive sheets laminated via the spacers;
A connector for penetrating the holder, the thermally conductive sheet, and the spacer to fasten these laminates;
A heat radiator characterized by comprising: A radiator according to claim 1,
The spacer and the holder have a columnar shape extending in a direction substantially perpendicular to the substrate, and the thermally conductive sheet has a planar shape extending in the extending direction of the spacer and the holder, the spacer and the holder However, it is arrange | positioned on a straight line in planar view, and is connected with the linear form via the said connector, The heat radiator characterized by the above-mentioned. A radiator according to claim 2,
The plurality of thermally conductive sheets are connected to the spacer in the middle of the width direction, and both side portions are protruded in a direction away from the spacer, and are arranged in a posture in which the protruding portions facing each other are separated from each other. A heat radiator characterized by being formed. A radiator according to any one of claims 1 to 3,
The heat conductive sheet has elasticity, and the radiator is formed by fastening the laminate of the holder, the heat conductive sheet, and the spacer by screwing. It is a heat radiator as described in any one of Claim 1 to 4, Comprising:
The heat radiator, wherein the plurality of heat conductive sheets are spaced apart at equal intervals and arranged substantially in parallel. It is a heat radiator as described in any one of Claim 1 to 5,
An end face of the holder, the thermally conductive sheet, and the spacer is thermally coupled to the substrate at the boundary between the heat dissipation unit and the substrate. It is a heat radiator as described in any one of Claim 1 to 6,
The connector has a rod portion that penetrates the holder, the thermally conductive sheet, and the spacer, and the holder, the thermally conductive sheet, and the spacer open a through hole through which the rod portion is inserted. A heatsink characterized by A radiator according to claim 7,
Two rows of spacers are arranged between the thermally conductive sheets arranged opposite to each other,
The radiator, wherein the rod part is penetrated through the spacers in each row and the holder, the heat conductive sheet, and the spacer are integrally connected. A radiator according to any one of claims 1 to 8,
The radiator has a connecting portion for fixing to the substrate, and the heat dissipation unit is fixed to the substrate through the connecting portion. A radiator according to any one of claims 1 to 9,
The radiator having the lateral width (W) gradually decreases from the thermal conductive sheet disposed in the central portion toward the thermal conductive sheets disposed at both ends of the plurality of thermal conductive sheets. A heat radiator according to any one of claims 1 to 10,
In the plurality of spacers connected to each other, the radiator having the lateral width disposed at the center is larger than the lateral width (D) of the spacer disposed at both ends. A radiator according to any one of claims 1 to 11,
A heat radiator comprising a plurality of the heat radiating units arranged on the substrate and a ventilation gap provided between the heat radiating units adjacent to each other. A radiator according to claim 12,
The heat radiator, wherein the plurality of heat radiating units are arranged at equal intervals on the circumference of the surface of the substrate. A heat radiator according to claim 12 or 13,
The plurality of heat dissipating units have the same shape, and each heat dissipating unit is arranged on a locus of rotation with respect to the center of the substrate. A heat radiator according to any one of claims 12 to 14,
The plurality of heat dissipating units are arranged such that the connecting direction of the connector is a tangential direction of the circumference with respect to the center of the substrate,
The plurality of heat conductive sheets of each heat radiating unit protrudes in both directions of the spacer in plan view, and a leading edge extending from the spacer toward the outer peripheral edge of the substrate approaches the outer peripheral edge of the substrate. A radiator which is extended and has a leading edge extending from the spacer toward the center of the substrate and extending close to the center of the substrate. The heat radiator according to any one of claims 1 to 15, further comprising:
Comprising a metal back plate arranged spaced substantially parallel to the substrate;
A plurality of heat dissipating units are disposed between the substrate and the back plate, and the substrate and the back plate are connected via the heat dissipating unit. A radiator according to claim 16, wherein
A radiator having a back plate vent opening in the back plate. A heat radiator according to any one of claims 1 to 17,
The heat radiator, wherein the plurality of heat conductive sheets are fiber sheets containing a heat conductive filler. A heat radiator according to any one of claims 1 to 18,
The plurality of heat conductive sheets have a heat conductivity in a plane direction of 15 W / m · K or more. A heat radiator according to any one of claims 1 to 19,
A heat radiator, wherein the heat generating member thermally coupled to the substrate is a light emitting diode. A heat dissipation unit for a radiator that is thermally coupled to a heat generating member and dissipates heat generated from the heat generating member,
A plurality of thermally conductive sheets having a fibrous structure, arranged in a posture separated from each other;
A spacer interposed between the thermally conductive sheets arranged opposite to each other;
Holders respectively disposed on both side end surfaces of the plurality of thermally conductive sheets laminated via the spacers;
A connector for penetrating the holder, the thermally conductive sheet, and the spacer to fasten these laminates;
A heat dissipating unit comprising: The heat dissipating unit according to claim 21,
The spacer and the holder are columnar extending in one direction,
The thermally conductive sheet is a planar shape extending in the extending direction of the spacer and the holder,
The said spacer and the said holder are arrange | positioned on a straight line in the cross-sectional direction, and are connected linearly via the said coupling tool, The heat radiating unit characterized by the above-mentioned. A heat dissipating unit according to claim 22,
The plurality of thermally conductive sheets are connected to the spacer in the middle of the width direction, projecting both sides in a direction away from the spacer, and projecting from each other. A heat dissipation unit characterized by being arranged. A heat dissipating unit according to claim 21 to 23,
The heat conductive sheet has elasticity, and the connector is formed by fastening a stack of the holder, the heat conductive sheet, and the spacer by screwing. The heat dissipation unit according to any one of claims 21 to 24,
The heat dissipating unit, wherein the plurality of heat conductive sheets are spaced apart at equal intervals and arranged substantially in parallel. The heat dissipation unit according to any one of claims 21 to 25,
The heat radiation unit is characterized in that, on the end surface on the side thermally coupled to the heat generating member, the end surfaces of the holder, the heat conductive sheet, and the spacer are arranged on the same plane. A heat dissipating unit according to any one of claims 21 to 26,
The connector has a rod portion that penetrates the holder, the thermally conductive sheet, and the spacer,
The holder, the thermally conductive sheet, and the spacer are formed by opening a through hole through which the rod portion is inserted. A heat dissipation unit according to claim 27,
Two rows of spacers are arranged between the thermally conductive sheets arranged opposite to each other,
A heat dissipation unit, wherein the rod portion is penetrated through each row of spacers, and the holder, the heat conductive sheet, and the spacer are integrally connected. A heat dissipation unit according to any one of claims 21 to 28,
The plurality of thermally conductive sheets have a width (W) that gradually decreases from a thermally conductive sheet disposed at a central portion toward a thermally conductive sheet disposed at both ends. A heat dissipation unit according to any one of claims 21 to 29,
The plurality of spacers connected to each other is characterized in that the lateral width of the spacers arranged at the center is larger than the lateral width of the spacers arranged at both ends. A heat dissipation unit according to any one of claims 21 to 30, wherein
The heat dissipation unit, wherein the plurality of heat conductive sheets are fiber sheets containing a heat conductive filler. A heat dissipation unit according to any one of claims 21 to 31,
The plurality of heat conductive sheets have a heat conductivity in a plane direction of 15 W / m · K or more, and a heat dissipation unit. One or more semiconductor light emitting devices;
A substrate on which the semiconductor light emitting element is mounted on the first surface;
A power supply unit for adjusting power supplied to the semiconductor light emitting element;
A radiator that dissipates heat generated from the semiconductor light emitting element;
A lighting device comprising:
The radiator is fixed in a thermally coupled state to the second surface of the substrate, and includes one or more heat radiating units that radiate heat thermally conducted from the semiconductor light emitting element,
The heat dissipation unit is
A plurality of thermally conductive sheets having a fibrous structure, arranged in a posture separated from each other;
A spacer interposed between the thermally conductive sheets disposed opposite to each other;
Holders respectively disposed on both side end surfaces of the plurality of thermally conductive sheets laminated via the spacers;
A connector for penetrating the holder, the thermally conductive sheet, and the spacer to fasten these laminates;
A lighting device comprising: A lighting device according to claim 33,
On the first surface of the substrate, a plurality of semiconductor light emitting elements are arranged at equal intervals on the circumference,
On the second surface of the substrate, a plurality of heat dissipating units are arranged on the circumference at equal intervals. A lighting device according to claim 34,
The lighting device according to claim 1, wherein the plurality of heat dissipating units are configured such that the spacers are disposed at positions corresponding to positions where the semiconductor light emitting elements are mounted. 36. A lighting device according to claim 35, wherein
The heat dissipation unit is configured to increase the lateral width (D) of a spacer disposed at a central portion of the plurality of spacers connected to each other to be larger than the lateral width (D) of spacers disposed at both ends. A lighting device, wherein the lighting device is arranged at a position corresponding to a position where an element is mounted.

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