JP2015056235A - Lighting device and radiator for lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve weight reduction of a radiation structure and achieve saving of work for installation.SOLUTION: A lighting device includes: one or more semiconductor light-emitting elements 1; a mounting substrate 2 having a mount surface 2X mounting thereon the semiconductor light-emitting elements 1; a power supply unit 6 regulating electric power supplied to the semiconductor light-emitting elements 1; a metallic support 3 fixed to a second surface 2Y of the mounting substrate 2 in a thermally bonded state; and a plurality of radiation plates 4 fixed to the support 3 in a thermally bonded state, the radiation plates 4 being formed of carbon-containing paper.

Description

  The present invention relates to an illumination device that uses a semiconductor light emitting element such as an LED, and a radiator for the illumination device.

  In recent years, as new illumination, an illumination device using a semiconductor light emitting element such as a light emitting diode (LED) or a semiconductor diode (LD) as a light source has been developed. These have advantages such as low power consumption, small size, high impact resistance, and long life. In particular, in recent years, LEDs have increased in output, and in addition to replacing fluorescent lamps, high output types that can be replaced with high output light sources such as mercury lamps and halogen lamps have been developed.

  However, since such a semiconductor light-emitting element also generates a large amount of heat as the output increases, an effective heat dissipation structure is required. For example, LED has low power consumption and long life as its advantage, but when used continuously for a long time, when its temperature rises to an abnormally high temperature (for example, 100 ° C. or higher), There is a problem that the lifetime is remarkably shortened. For this reason, in a lighting device using LEDs, it is desirable that the temperature of the LEDs be controlled so that the temperature of the LEDs is substantially free from problems in use (preferably less than 80 ° C.) even when used continuously for a long time. . In particular, since the size of the LED itself is small, an area that can dissipate heat is small, and an efficient heat dissipating structure is essential to ensure stable reliability over a long period of time. Thus, a heat dissipation structure in which a metal heatsink fin or the like is thermally coupled to the LED chip is known (see, for example, Patent Documents 1 to 4).

  Such metal radiating fins are often made of aluminum in consideration of thermal conductivity and weight reduction. However, even aluminum is quite heavy and inevitably increases in size. In particular, in a high-output type that replaces a mercury lamp, heat dissipation performance is also required, and as a result, a very large and heavy heat dissipation fin is added to the back surface of the lighting device. In addition, high-power type lighting such as mercury lamps are used in applications such as factory lighting, stadium lighting, street lighting, highway and tunnel lighting, etc. There are many. In such an application, workability of installation work of a heavy lighting device is deteriorated. Furthermore, when the weight of the lighting device increases, the fixing structure is required to have a suitable strength.In particular, the lighting device for mounting at high places that is difficult to replace or maintain is required to have high durability specifications. Increases labor and costs. For this reason, there has been a demand for a lighting device that is lighter and easier to mount.

WO2011 / 055659 JP2013-4169A JP 2013-54977 A JP2013-73696A

  The present invention has been made to solve such conventional problems. A main object of the present invention is to provide an illuminating device and a radiator for the illuminating device in which the heat dissipation structure is reduced in weight.

Means for Solving the Problems and Effects of the Invention

In order to achieve the above object, according to the illumination device of the present invention, one or more semiconductor light emitting elements 1, a mounting substrate 2 on which the semiconductor light emitting element 1 is mounted on a mounting surface 2X, and the semiconductor light emitting element 1 A power supply unit 6 for adjusting the power supplied to the substrate 2, a metal support 3 fixed to the second surface 2 Y of the mounting substrate 2 in a thermally coupled state, and a thermally coupled state to the support 3. The heat radiating plate 4 is made of paper containing carbon.
With the above configuration, the heatsink of the heatsink installed in the lighting device can be made of paper, making it significantly lighter than conventional metal heatsinks, thus saving labor for installation. The advantage that reliability can be improved is obtained.

In the lighting device according to the present invention, the support body 3 is formed in a plate shape and arranged in a substantially vertical posture with respect to the mounting substrate 2, and the plurality of heat radiating plates 4 are fixed so as to protrude from the surface of the support body 3. can do.
With the above configuration, by arranging the support in a plate shape in a substantially vertical posture with respect to the mounting substrate, it is possible to ensure a wide heat radiation area while effectively using the region on the back side of the support. In particular, heat can be radiated more effectively by projecting a large number of heat radiating plates from the surface of the plate-like support.

In the lighting device of the present invention, the plurality of heat radiating plates 4 can be fixed to both surfaces of the support 3 in a posture in which adjacent heat radiating plates 4 are separated from each other.
With the above configuration, the heat dissipation effect of each heat dissipation plate can be improved by separating adjacent heat dissipation plates from each other while widening the heat dissipation area by projecting the heat dissipation plates on both sides of the support.

In the illuminating device of the present invention, the plurality of heat sinks 4 can be arranged in a substantially vertical posture with respect to the mounting substrate 2.
With the above configuration, by disposing a plurality of heat radiating plates in the axial direction of the support body, heat can be radiated by heat conduction evenly to the plurality of heat radiating plates. Further, the heat released from the second surface of the mounting substrate can be effectively radiated by moving along the heat sink plate in a substantially vertical posture.

In the illuminating device of the present invention, the support 3 forms a plurality of rows of connecting grooves 34 extending in the axial direction substantially parallel to each other, and the side edges of the heat sink 4 are inserted into the connecting grooves 34 and fixed. can do.
With the above configuration, the plurality of heat sinks can be easily fixed at a fixed position of the support.

In the illumination device of the present invention, the heat radiating plate 4 can be connected to the second surface 2Y in a thermally coupled state.
With the above configuration, heat can be radiated more efficiently by conducting heat directly from the mounting board to the heat sink.

In the illuminating device of the present invention, the support 3 is disposed on the second surface 2Y of the mounting substrate 2 at a position corresponding to the position where the semiconductor light emitting element 1 is mounted on the mounting surface 2X. it can.
With the above configuration, the heat generated from the semiconductor light emitting element can be more effectively conducted to the support to dissipate heat.

In the illuminating device of the present invention, the support 3 may include a heat conducting portion 36 that increases a contact area with the second surface 2Y at a portion corresponding to a position where the semiconductor light emitting element 1 is mounted. .
With the above configuration, the support body can be thermally coupled to the mounting substrate with a larger area via the heat conducting portion. In particular, by disposing the heat conducting portion of the support at a portion corresponding to the mounting position of the semiconductor light emitting element, heat generated from the semiconductor light emitting element can be more effectively conducted and dissipated.

In the lighting device of the present invention, the support 3 includes a plate-shaped main body 31 having an arc shape in cross section, and connecting portions 32 connected to both side portions of the main body 31. Can be fixed to the mounting substrate 2 via the connecting portion 32.
With the above configuration, the support body can be fixed in a stable standing posture by bringing the end surface of the arc-shaped support body into contact with the second surface of the mounting substrate. In addition, with the above configuration, even when the metal support is thermally expanded by the heat conducted from the semiconductor light emitting element, it is possible to reduce the load applied to the connection portion between the support and the mounting substrate, thereby supporting the metal support. The thermal coupling state between the body and the mounting board can be maintained. This is because the support fixed to the mounting substrate via the connecting portions provided on both sides of the arc-shaped main body portion is deformed so as to bend the arc-shaped main body portion due to thermal expansion. This is because it can be absorbed. Thereby, the thermal coupling state between the thermally expanding support and the mounting substrate can be maintained satisfactorily.

In the lighting device of the present invention, a heat radiating unit 9 is constituted by one support 3 and a plurality of heat radiating plates 4 fixed to the support 3, and the heat radiating unit 9 is connected to the second surface 2Y of the mounting substrate 2. A plurality can be arranged.
With the above configuration, the heat dissipation effect of the radiator can be improved by fixing a plurality of heat dissipation units to the mounting substrate while mass-producing heat dissipation units having the same structure at low cost. In addition, since the heat radiation effect can be adjusted by variously changing the number and shape of the heat radiation units fixed to the mounting substrate, an advantage that it can easily cope with various specifications can be obtained.

In the lighting device of the present invention, a ventilation gap 29 can be provided between the heat dissipating units 9 adjacent to each other.
With the above configuration, the heat radiation effect of each heat radiation unit can be improved by providing a ventilation gap between the plurality of heat radiation units.

In the illuminating device of the present invention, the plurality of heat dissipation units 9 can be arranged at equal intervals on the circumference with 2Y on the second surface of the mounting substrate 2.
With the above configuration, a plurality of heat dissipation units can be evenly arranged with respect to the mounting substrate, and heat can be radiated efficiently and in a balanced manner.

In the illuminating device of the present invention, the plurality of heat radiating units 9 can have the same shape, and each heat radiating unit 9 can be arranged on a locus of rotation with respect to the center of the mounting substrate 2.
With the above configuration, the heat radiation unit having the same shape is fixed to the fixed position of the mounting substrate in the same posture, so that the assembly work in the manufacturing process can be efficiently performed while having a structure capable of efficiently and well radiating heat.

In the lighting device of the present invention, the heat radiating unit 9 fixes a plurality of heat radiating plates 4 on both surfaces of the support 3, and one surface of the support 3 is on the outer peripheral side of the mounting substrate 2. The front edges of the plurality of heat radiating plates 4 that are fixed to the second surface 2Y in a posture in which the surface faces the center side of the mounting substrate 2 and are arranged on the outer peripheral edge side of the mounting substrate 2 are shown in plan view. While extending close to the outer peripheral edge of the mounting substrate 2, the front edge of the heat radiating plate 4 disposed on the center side of the mounting substrate 2 extends close to the central portion of the mounting substrate 2 in plan view. be able to.
With the above configuration, the plurality of heat sinks fixed to both surfaces of the support and disposed on the second surface of the mounting substrate can be disposed over a wide area of the mounting substrate, and the entire mounting substrate can be radiated more effectively.

The illuminating device of the present invention includes an even number of the heat dissipating units 9, and the odd-numbered heat dissipating units 9G have the same shape as the first heat dissipating unit 9Gx and are arranged at equal intervals on the circumference. The second heat dissipating unit 9G can have the same shape as the second heat dissipating unit 9Gy and can be disposed on the circumference at equal intervals.
With the above configuration, by dissipating heat radiation units having different shapes alternately, the entire mounting board can be radiated efficiently and in a balanced manner.

The illuminating device of the present invention includes a metal back plate 5 that is disposed on the back side of the mounting substrate 2 so as to be substantially parallel and spaced apart, and a plurality of the back plates 5 are provided between the mounting substrate 2 and the back plate 5. While disposing the heat radiating unit 9, the mounting substrate 2 and the back plate 5 can be connected by the support 3 of the heat radiating unit 9.
With the above configuration, the metal support can be used in addition to the function of fixing the heat sink, and can also have the function of connecting the mounting substrate and the back plate. Moreover, the thermal radiation effect of each support body can be improved by connecting a back plate to a support body as metal.

The illuminating device of the present invention can be provided by opening a back plate vent 53 in the back plate 5.
With the above-described configuration, the heat radiated from the heat radiating plate can be exhausted to the outside through the back plate vent opened in the back plate, thereby improving the heat radiating effect.

In the illuminating device of the present invention, the mounting substrate 2 can open the substrate vent 2 </ b> B so as to face the plurality of heat radiating plates 4 fixed to the support 3.
With the above configuration, the heat dissipation effect of the radiator can be improved by allowing air to pass through the plurality of heat radiating plates via the substrate vent of the mounting substrate.

  In the lighting device of the present invention, the heat conductivity of the heat radiating plate 4 can be 15 W / (m · K) or more.

The radiator for a lighting device of the present invention is connected to a lighting device including a mounting substrate 2 on which one or more semiconductor light emitting elements 1 are mounted on a mounting surface 2X, and dissipates heat generated from the semiconductor light emitting element 1. A metal support 3 having a fixing structure for fixing to the mounting substrate 2 in a thermally coupled state on the back surface side of the mounting surface 2X of the mounting substrate 2, and heat to the support 3 And a plurality of heat sinks 4 fixed in a combined state, wherein the heat sinks 4 are made of paper containing carbon.
With the above configuration, the heat sink can be made of paper, and can be significantly reduced in weight as compared to conventional metal heat sinks. Thus, it is possible to save the work for installation and improve the reliability. .

The radiator for the lighting device according to the present invention is configured such that the support 3 is formed in a plate shape and disposed in a substantially vertical posture with respect to the mounting substrate 2, and the plurality of heat dissipation plates protrude from the surface of the support 3. 4 can be fixed.
With the above configuration, by arranging the support in a plate shape in a substantially vertical posture with respect to the mounting substrate, it is possible to ensure a wide heat radiation area while effectively using the region on the back side of the support. In particular, heat can be radiated more effectively by projecting a large number of heat radiating plates from the surface of the plate-like support.

The radiator for the lighting device of the present invention can fix the plurality of radiator plates 4 to both surfaces of the support 3 in a posture in which the adjacent radiator plates 4 are separated from each other.
With the above configuration, the heat dissipation effect of each heat dissipation plate can be improved by separating adjacent heat dissipation plates from each other while widening the heat dissipation area by projecting the heat dissipation plates on both sides of the support.

In the radiator for the lighting device of the present invention, the plurality of radiator plates 4 can be arranged in a substantially vertical posture with respect to the mounting substrate 2.
With the above configuration, by disposing a plurality of heat radiating plates in the axial direction of the support body, heat can be radiated by heat conduction evenly to the plurality of heat radiating plates. Further, the heat released from the mounting board can be effectively radiated by moving along the heat radiating plate in a substantially vertical posture.

In the radiator for the lighting device according to the present invention, the support 3 is formed with a plurality of rows of connecting grooves 34 extending in the axial direction substantially parallel to each other, and the side edges of the heat sink 4 are formed in each of the connecting grooves 34. Can be inserted and fixed.
With the above configuration, the plurality of heat sinks can be easily fixed at a fixed position of the support.

In the radiator for the lighting device of the present invention, the heat radiating plate 4 can be connected to the second surface 2Y of the mounting substrate 2 in a thermally coupled state.
With the above configuration, heat can be radiated more efficiently by conducting heat directly from the mounting board to the heat sink.

In the radiator for the lighting device of the present invention, the support 3 is disposed on the second surface 2Y of the mounting substrate 2 at a position corresponding to the position where the semiconductor light emitting element 1 is mounted on the mounting surface 2X. Can do.
With the above configuration, the heat generated from the semiconductor light emitting element can be more effectively conducted to the support to dissipate heat.

In the radiator for the lighting device of the present invention, the support 3 can include a heat conducting portion 36 that increases a contact area with the mounting substrate 2.
With the above configuration, the support can be thermally coupled to the mounting substrate in a wider area via the heat conducting portion, and thereby, heat generated by the semiconductor light emitting element can be more effectively conducted to the support and dissipated.

The radiator for the lighting device of the present invention includes the support body 3 including a plate-like main body portion 31 having an arc shape in cross-sectional view, and connection portions 32 connected to both side portions of the main body portion 31. The support 3 can be fixed to the mounting substrate 2 via the connecting portion 32.
With the above configuration, the support body can be disposed in a stable standing posture by bringing the end surface of the arc-shaped support body into contact with the second surface of the mounting substrate. In addition, with the above configuration, even when the metal support is thermally expanded by the heat conducted from the semiconductor light emitting element, it is possible to reduce the load applied to the connection portion between the support and the mounting substrate, thereby supporting the metal support. The thermal coupling state between the body and the mounting board can be maintained. This is because the support fixed to the mounting substrate via the connecting portions provided on both sides of the arc-shaped main body portion is deformed so as to bend the arc-shaped main body portion due to thermal expansion. This is because it can be absorbed. Thereby, the thermal coupling state between the thermally expanding support and the mounting substrate can be maintained satisfactorily.

In the radiator for the lighting device according to the present invention, a heat radiating unit 9 is constituted by one support 3 and a plurality of heat radiating plates 4 fixed to the support 3. A plurality of two surfaces 2Y can be arranged.
With the above configuration, the heat dissipation effect of the radiator can be improved by fixing a plurality of heat dissipation units to the mounting substrate while mass-producing heat dissipation units having the same structure at low cost. Further, since the heat dissipation effect can be adjusted by variously changing the number of heat dissipation units fixed to the mounting substrate, there is an advantage that various specifications can be easily accommodated.

In the radiator for the lighting device of the present invention, the ventilation gap 29 can be provided between the adjacent radiator units 9.
With the above configuration, the heat radiation effect of each heat radiation unit can be improved by providing a ventilation gap between the plurality of heat radiation units.

In the radiator for the lighting device of the present invention, the plurality of heat radiating units 9 can be arranged on the circumference of the second surface 2Y of the mounting substrate 2 at equal intervals.
With the above configuration, a plurality of heat dissipation units can be evenly arranged with respect to the mounting substrate, and heat can be radiated efficiently and in a balanced manner.

In the radiator for the lighting device of the present invention, the plurality of heat radiating units 9 can have the same shape, and each heat radiating unit 9 can be arranged on a locus of rotation with respect to the center of the mounting substrate 2.
With the above configuration, the heat radiation unit having the same shape is fixed to the fixed position of the mounting substrate in the same posture, so that the assembly work in the manufacturing process can be efficiently performed while having a structure capable of efficiently and well radiating heat.

In the radiator for the lighting device according to the present invention, the heat radiating unit 9 fixes a plurality of heat radiating plates 4 on both surfaces of the support 3, and one surface of the support 3 is on the outer peripheral side of the mounting substrate 2. The front edges of the plurality of heat sinks 4 arranged on the outer peripheral edge side of the mounting substrate 2 are fixed to the mounting substrate 2 with the other surface facing the central portion side of the mounting substrate 2 in the plan view. 2, the tip edge of the heat radiating plate 4 disposed on the center side of the mounting substrate 2 can be extended close to the center of the mounting substrate 2 in plan view.
With the above configuration, the plurality of heat sinks fixed to both surfaces of the support and disposed on the second surface of the mounting substrate can be disposed over a wide area of the mounting substrate, and the entire mounting substrate can be radiated more effectively.

The radiator for the lighting device of the present invention includes an even number of the heat radiating units 9 and the odd-numbered heat radiating units 9G having the same shape as the first heat radiating unit 9Gx and at equal intervals on the circumference. The even-numbered heat dissipating units 9G can be arranged in the same shape as the second heat dissipating unit 9Gy, and can be disposed on the circumference at equal intervals.
With the above configuration, by dissipating heat radiation units having different shapes alternately, the entire mounting board can be radiated efficiently and in a balanced manner.

The radiator for the lighting device according to the present invention includes a metal back plate 5 that is disposed on the back side of the mounting substrate 2 so as to be spaced apart substantially in parallel, and a plurality of the radiators are provided between the mounting substrate 2 and the back plate 5. The heat radiating unit 9 can be arranged, and the mounting substrate 2 and the back plate 5 can be connected by the support 3 of the heat radiating unit 9.
With the above configuration, the metal support can be used in addition to the function of fixing the heat sink, and can also have the function of connecting the mounting substrate and the back plate. Moreover, the thermal radiation effect of each support body can be improved by connecting a back plate to a support body as metal.

The radiator for the lighting device of the present invention can be provided by opening the back plate vent 53 in the back plate 5.
With the above-described configuration, the heat radiated from the heat radiating plate can be exhausted to the outside through the back plate vent opened in the back plate, thereby improving the heat radiating effect.

  In the radiator for the lighting device according to the present invention, the heat conductivity of the radiator plate 4 can be 15 W / (m · K) or more.

It is a vertical sectional view of a lighting device according to an embodiment of the present invention. It is the disassembled perspective view which looked at the illuminating device shown in FIG. 1 from the lower side. It is the disassembled perspective view which further decomposed | disassembled the illuminating device shown in FIG. It is the perspective view which looked at the illuminating device shown in FIG. 2 from the upper side. It is a disassembled perspective view of the illuminating device shown in FIG. It is a bottom view of the mounting board | substrate of the illuminating device shown in FIG. It is a top view of the mounting board | substrate of the illuminating device shown in FIG. It is a perspective view of the thermal radiation unit of the illuminating device shown in FIG. It is a disassembled perspective view of the thermal radiation unit shown in FIG. It is a top view of the support body of the thermal radiation unit shown in FIG. It is a top view which shows another example of a support body. It is a top view which shows another example of a support body. It is a top view which shows another example of a support body. It is a top view which shows another example of a support body. It is a top view which shows another example of a support body. It is a disassembled plan view which shows another example of a support body and a heat sink. It is a perspective view which shows another example of a heat sink. It is a top view which shows another example of a thermal radiation unit, and an example of the arrangement pattern. It is a top view which shows another example of a thermal radiation unit, and an example of the arrangement pattern. It is a top view which shows another example of a thermal radiation unit, and an example of the arrangement pattern. It is a top view which shows another example of a thermal radiation unit, and an example of the arrangement pattern. It is a top view which shows another example of a thermal radiation unit, and an example of the arrangement pattern. It is a top view which shows another example of a thermal radiation unit, and an example of the arrangement pattern. It is a top view which shows another example of a thermal radiation unit, and an example of the arrangement pattern. It is an expanded sectional view which shows an example of the connection structure of a mounting substrate and a support body. It is a vertical sectional view of an illuminating device according to another embodiment of the present invention. It is the disassembled perspective view which looked at the illuminating device shown in FIG. 26 from the lower side. It is a graph which shows the measurement result of the thermal radiation characteristic of the illuminating device which concerns on one embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies a lighting device and a radiator for the lighting device for embodying the technical idea of the present invention, and the present invention is a radiator for the lighting device and the lighting device. Is not specified as below. Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention unless otherwise specified, and are merely explanations. It is just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

  A lighting device according to an embodiment of the present invention is shown in FIGS. 1 is a vertical sectional view of the illumination device, FIG. 2 is an exploded oblique perspective view of the illumination device shown in FIG. 1 as viewed from below, and FIG. 3 is an exploded oblique perspective view of the illumination device shown in FIG. 4 is an oblique perspective view of the illumination device shown in FIG. 2 as viewed from above, FIG. 5 is an exploded oblique view of the illumination device shown in FIG. 4, and FIG. 6 is a bottom surface of the mounting board of the illumination device shown in FIG. FIG. 7 shows a plan view of the mounting substrate of the lighting device shown in FIG. The illumination device shown in these drawings includes one or more semiconductor light emitting elements 1, a mounting substrate 2 on which the semiconductor light emitting elements 1 are mounted on the mounting surface 2X, and a power source for adjusting the power supplied to the semiconductor light emitting elements 1. The unit 6 and a radiator 10 that radiates heat generated from the semiconductor light emitting element 1 are provided. In addition, let the up-down direction in this specification be the up-down direction in FIG.

(Semiconductor light emitting element 1)
The semiconductor light emitting device 1 can use various light emitting devices that can emit light as a light source. The semiconductor light emitting device 1 shown in FIGS. 1, 3, and 6 is a COB (chip on board) type light emitting device. As such a semiconductor light emitting element 1, a board in which a plurality of light emitting diodes (LEDs) are mounted on a board such as a ceramic substrate can be used. In the semiconductor light emitting device 1 shown in the figure, a plurality of light emitting diodes are mounted on a board in a predetermined arrangement, and the surfaces thereof are covered with a sealing resin. However, the semiconductor light emitting element 1 is not limited to the COB (chip on board) type, and other types that can be mounted on the mounting substrate 2 can be used.

  The semiconductor light emitting element 1 is fixed at a fixed position on the mounting surface 2X of the mounting substrate 2. The illumination device preferably mounts a plurality of semiconductor light emitting elements 1 on a mounting substrate 2. The illumination device shown in the figure includes six semiconductor light emitting elements 1. However, the lighting device may include 1 to 5 semiconductor light emitting elements, or may include 7 or more semiconductor light emitting elements. The semiconductor light emitting device 1 can be brightened by increasing its output, and can be brightened by increasing the number of mounted components. The output and the number of the semiconductor light emitting elements 1 mounted on the lighting device are variously changed depending on the application. For example, in a lighting device used as a replacement lamp for a mercury lamp on a factory ceiling or the like, a COB (chip on board) type can use 6 semiconductor light emitting elements with output of 28W, and the total output can be 168W, or COB (chip on board) type can use 3 semiconductor light emitting elements with output of 28W The overall output can be 84W.

(Mounting board 2)
The mounting substrate 2 is a substrate on which the semiconductor light emitting element 1 is mounted, and preferably a plate material excellent in thermal conductivity can be used. The mounting substrate 2 shown in FIGS. 1 to 7 is a metal plate and is an aluminum plate. However, the mounting substrate can be made of a metal other than aluminum, or can be made of plastic. A plastic mounting board is obtained by mixing various fillers made of metal compounds, for example, oxide fillers such as silica and alumina, nitride fillers such as boron nitride and aluminum nitride, or carbon fillers such as silicon carbide into the resin. Thermal conductivity can be improved. Further, the metal mounting substrate 2 preferably has an insulating structure on the surface of the mounting surface 2X by applying an insulating paint to the mounting surface 2X.

  The mounting substrate 2 in the figure has a circular outer shape. However, the outer shape of the mounting board can be a regular polygon. The circular or regular polygonal mounting substrate 2 preferably has a plurality of semiconductor light emitting elements 1 mounted on the outer periphery thereof at a predetermined interval. The mounting substrate 2 shown in FIGS. 3 and 6 has six semiconductor light emitting elements 1 arranged on the outer periphery. In this mounting substrate 2, six semiconductor light emitting elements 1 are arranged at equal intervals on the same circumference along the outer peripheral edge of the circular mounting substrate 2. That is, the mounting substrate 2 has the six semiconductor light emitting elements 1 on the circumference of the reference circle 21 in the circumferential direction so that the center angles formed by the radii passing through the centers of the six semiconductor light emitting elements 1 are equal. Are arranged at intervals of 60 degrees. As shown in FIG. 6, the six semiconductor light emitting elements 1 arranged on the same circumference are fixed to the mounting substrate 2 so as to be arranged at six vertices of a regular hexagon. Similarly, a mounting substrate on which n semiconductor light emitting elements are arranged on the same circumference can be mounted so that n semiconductor light emitting elements are arranged at n apexes of a regular n-gon. .

  Here, the radius (r) of the reference circle 21 that forms the circumference on which the plurality of semiconductor light emitting elements 1 are arranged is specified so that the semiconductor light emitting elements 1 can be arranged in an optimum region of the mounting substrate 2. The radius (r) of the reference circle 21 can be specified as a ratio with respect to the radius (R) of the mounting substrate 2, for example. When the radius (r) of the reference circle of the mounting substrate is reduced, a plurality of semiconductor light emitting elements are unevenly distributed on the central portion side of the mounting substrate, and heat is likely to be accumulated in the central portion of the mounting substrate. On the other hand, when the radius (r) of the reference circle is increased, the semiconductor light emitting element approaches the outer peripheral edge of the mounting substrate, and the heat radiation area for radiating the heat generated by the semiconductor light emitting element is narrowed. Therefore, in consideration of the above, the mounting board has a radius (r) of the reference circle of 50 to 90%, preferably 60 to 80%, of the radius (R) of the mounting board.

  Note that the mounting substrate can also be mounted with a semiconductor light emitting element at the center thereof. For example, a lighting device including one semiconductor light-emitting element can mount a semiconductor light-emitting element at the center of the mounting substrate, and also in a lighting device including a plurality of semiconductor light-emitting elements, at the center and the outer periphery of the mounting substrate. A semiconductor light emitting device can be mounted.

  In the mounting substrate 2, each semiconductor light emitting element 1 is fixed in a thermally coupled state at a fixed position on the mounting surface 2X. The semiconductor light emitting element 1 is fixed via a connecting tool (not shown) such as a set screw or a holder, or is bonded to the mounting substrate 2 by bonding. The semiconductor light emitting element 1 fixed at a fixed position on the mounting substrate 2 is electrically connected to a power supply unit 6 to be described later and supplied with power. The mounting substrate 2 shown in FIGS. 1 and 6 has a through hole 22 for wiring at the center, and a power cable 62 that supplies power from the power source 6 to the semiconductor light emitting element 1 is passed through the through hole 22. Wiring. The through hole 22 is opened to a size that allows the power cable 62 to be inserted. The mounting board 2 closes the gap between the through hole 22 and the power cable 61 with the closing material 23 in a state where the power cable 62 is inserted into the through hole 22. Resin, rubber, and adhesive can be used for the closing material 12. Thus, by closing the gap between the through hole 22 and the power cable 61 with the closing material 12, it is possible to prevent insects and moisture from entering from this portion.

(Cover cap 11)
Each of the semiconductor light emitting elements 1 fixed to the mounting substrate 2 is covered with a cover cap 11. The cover cap 11 has translucency, and transmits light emitted from the semiconductor light emitting element 1 to the outside. The cover cap 11 in FIGS. 1 and 3 has a shallow bottomed cylindrical shape, and is molded of resin into a shape formed by closing the lower end of the cylindrical portion 11A surrounding the semiconductor light emitting element 1 with the cover portion 11B. 11 A of cylinder parts are provided in the inner surface with the reflection layer which reflects the light emission of the semiconductor light-emitting device 1. FIG. The cover portion 11B is formed in a shape that swells in the center in a dome shape. Furthermore, the cover cap 11 has a structure for diffusing light that passes through the cover portion 11B. For example, the resin cover cap 11 can have a diffusion characteristic of allowing the light emitted from the semiconductor light emitting element 1 to pass through while being mixed with a filler that diffuses the transmitted light. The cover cap can also be mixed with a phosphor in the resin. The cover cap can change the color of light emitted from the semiconductor light emitting element by changing the wavelength of light emitted from the semiconductor light emitting element with a phosphor. However, in an illuminating device used for a spotlight or the like, it is not always necessary to provide the cover cap with a diffusing characteristic, and a condensing characteristic can also be provided.

  As shown in FIG. 6, the cover cap 11 is fixed to a fixed position of the mounting substrate 2 via a set screw 13 that penetrates the fixing pieces 11 </ b> C provided on both sides of the cylindrical portion 11 </ b> A. The mounting substrate 2 is provided with a plurality of screw holes 23 for fixing the cover cap 11 to the mounting surface 2X by screwing. The screw holes 23 are provided at positions where the six cover caps 11 are fixed at fixed positions on the mounting substrate 2.

(Reflector 16)
Further, a reflective plate 16 is disposed on the mounting surface 2X side of the mounting substrate 2. The reflection plate 16 is formed in a shape substantially equal to the outer shape of the mounting substrate 2. As shown in FIG. 1, the reflector is disposed in a posture parallel to the mounting substrate 2 and separated from the mounting substrate 2, and lead wires 63 and connection leads 64 are wired in the gap. Yes. Further, the reflecting plate 16 has a plurality of guide holes 16A. The guide hole 16 </ b> A is a through hole for guiding the cover cap 11 that covers the semiconductor light emitting device 1, and guides the cover cap 11 into the through hole, and the center convex cover portion 11 </ b> B of the cover cap 11 is connected to the reflection plate 16. It can be guided in a state of protruding from. The reflection plate 16 has a white surface layer that is reflective to the light that passes through the cover cap 11 and is irradiated. The reflection plate 16 can be formed of a metal or resin into a plate shape, and a surface layer can be provided by applying a white paint on the surface, or a surface layer can be formed by molding with a white resin.

(Transparent cover 8)
Further, the lighting device shown in FIGS. 1 and 2 includes a transparent cover 8 on the lower surface side of the reflecting plate 16. The illustrated lighting device includes a fixing ring 7 to which the mounting substrate 2 is fixed, and the transparent cover 8 is fixed to the mounting substrate 2 through the fixing ring 7. The transparent cover 8 is disposed on the mounting surface 2X side of the mounting substrate 2 on which the semiconductor light emitting element 1 is mounted, and covers the irradiation surface side of the semiconductor light emitting element 1. The transparent cover 8 is formed of glass or plastic having translucency, and transmits light emitted from the semiconductor light emitting element 1 to irradiate the outside. Furthermore, by using a diffusion type for the translucent cover, it is possible to adjust the light irradiation range, brightness, glare, and the like.

(Fixing ring 7)
The fixing ring 7 has a short ring shape along the outer peripheral edge of the mounting substrate 2 and includes a ring-shaped inner ring 7A that protrudes inward from the inner peripheral surface in order to position the mounting substrate 2. Furthermore, the fixing ring 7 is provided with fixing pieces 7B at several locations on the inner ring 7A, and the mounting substrate 2 is fixed to the fixing ring 7 via set screws 17 that pass through the fixing pieces 7B. In the illumination device shown in the figure, the set screw 17 is also used as a member for fixing the reflection plate 16. That is, in the illustrated illumination device, a set screw 17 penetrating the reflecting plate 16 and the fixing piece 7 </ b> B is screwed into the mounting substrate 2 to fix the reflecting plate 16 and the fixing ring 7 to the mounting substrate 2.

(Power supply unit 6)
The power supply unit 6 includes a power supply circuit 60 that converts AC power supplied from an external power source such as a commercial power source into DC power supplied to the semiconductor light emitting element 1 and outputs the same. Although not shown, the power supply circuit 60 includes a rectifier circuit that converts supplied alternating current into direct current, and a voltage adjustment circuit that converts the output of the rectifier circuit into a predetermined voltage and outputs the voltage. The illuminating device shown in FIG. 1 has electronic parts for realizing these circuits built in a casing 61, and this casing 61 is arranged and connected outside the illuminating device main body. However, the power supply circuit can also be mounted on a mounting board. The illuminating device shown in FIG. 1 has a casing 61 of the power supply unit 6 disposed on the side opposite to the irradiation surface of the semiconductor light emitting element 1 and above the illuminating device main body. A power cable 62 serving as a power supply line for supplying power to the semiconductor light emitting element 1 mounted on the mounting substrate 2 is drawn out from the casing 61. In the illuminating device shown in FIG. 1, the power cable 62 is passed through the through hole 22 of the mounting board 2 through the central portion of the radiator 10. The power cable 62 that penetrates the mounting substrate 2 is electrically connected to the semiconductor light emitting element 1 on the mounting surface 2X of the mounting substrate 2. The illuminating device shown in FIG. 6 is divided into two blocks by connecting six semiconductor light emitting elements 1 in series three by three. The semiconductor light emitting devices 1 of each block are connected in series via connection leads 64, and lead wires 63 extending from the power cable 62 are connected to the semiconductor light emitting devices 1 at both ends. As described above, the structure in which the plurality of semiconductor light emitting elements 1 are connected in blocks can adjust the power supply in units of blocks and adjust the brightness of the lighting device. However, two or more semiconductor light emitting elements 1 can be connected in series, all six can be connected in series, or all can be connected in parallel. In other words, the connection methods of the plurality of semiconductor light emitting elements 1 can be various connection methods that can turn on each semiconductor light emitting element 1 with the power supplied from the power supply unit 6.

(Heatsink 10)
The radiator 10 is connected to the back surface side of the mounting surface 2X on which the semiconductor light emitting element 1 is mounted on the second surface 2Y of the mounting substrate 2, and dissipates heat generated from the semiconductor light emitting element 1. To do. 1 to 5 and FIG. 7, the radiator 10 is fixed to the second surface 2Y of the mounting substrate 2 in a thermally coupled state, and is fixed to the support 3 in a thermally coupled state. And a plurality of heat radiating plates 4. As shown in FIGS. 8 and 9, the support 3 has a plurality of heat radiating plates 4 fixed in a thermally coupled state so as to protrude from the surface. In the illustrated radiator 10, a heat radiating unit 9 is constituted by one support 3 and a plurality of heat radiating plates 4 fixed to the support 3.

(Heat dissipation unit 9)
1 to 5 has a plurality of heat dissipation units 9 arranged on the second surface 2Y of the mounting substrate 2. The plurality of heat radiating units 9 are formed in the same shape, and are fixed to the second surface 2Y of the mounting substrate 2 in a thermally coupled state in a predetermined arrangement. In the radiator 10 of FIG. 7, a plurality of heat radiating units 9 are arranged on the circumference at equal intervals in the outer peripheral portion of the mounting substrate 2. The heat radiator 10 arranges the heat radiating units 9 adjacent to each other in a non-contact state, and provides a ventilation gap 29 between the heat radiating units 9 adjacent to each other. Thereby, the heat dissipation effect of each heat radiating unit 9 is improved.

  The radiator 10 in FIG. 7 is located on the back side of the reference circle 21 of the mounting substrate 2 on which the plurality of semiconductor light emitting elements 1 are mounted, and a plurality of heat dissipation units 9 are arranged along the reference circle 21. Yes. The plurality of heat dissipating units 9 arranged along the reference circle 21 are arranged on the back side of the semiconductor light emitting element 1 mounted on the mounting surface 2X of the mounting substrate 2. Since the illuminating device shown in the figure has six semiconductor light emitting elements 1 arranged on the mounting surface of the mounting substrate 2, six heat radiating units 9 are arranged on the back side of these semiconductor light emitting elements 1. ing. With this structure, heat generated from the semiconductor light emitting device 1 can be more effectively conducted to the heat radiating unit 9 to radiate heat. However, the heat radiator 10 does not limit the number of the heat radiating units 9 to six. The radiator can include 1 to 5 heat radiating units, or can include seven or more heat radiating units. The number of heat dissipating units can be changed variously according to the size of the mounting board, the number of semiconductor light emitting elements mounted on the heat dissipating element, the amount of heat generated, and the size and amount of heat dissipating of each heat dissipating unit. it can. Furthermore, the lighting device does not necessarily require the number of semiconductor light emitting elements mounted on the mounting surface of the mounting board to be equal to the number of heat radiation units fixed to the back side surface. It is not specified for the structure in which the element and the heat radiating unit are arranged at opposing positions.

  In the heat radiator 10 of FIG. 7, the heat radiating units 9 are arranged on a locus of rotation with respect to the center of the mounting substrate 2. In the radiator 10, the plurality of heat radiating units 9 are arranged so that each heat radiating unit 9 is rotated and moved around the center of the mounting substrate 2. That is, the radiator of FIG. 7 is arranged in an arrangement in which six heat radiation units 9 are rotated and moved at intervals of 60 degrees. Similarly, in a radiator including n (however, n ≧ 2) heat dissipation units, the heat dissipation units can be arranged in an array formed by rotational movement at 360 / n degree intervals. The radiator 10 having the above structure can efficiently and uniformly conduct heat conducted from the semiconductor light emitting element 1 to the mounting substrate 2 to the plurality of heat radiating units 9 to radiate heat. However, in the heat radiator, a plurality of heat radiation units can be arranged in a line-symmetric arrangement, a point-symmetric arrangement, or a random arrangement.

  The heat dissipation unit 9 having the above shape changes the length (L) of the support, the length (D) of the heat dissipation plate, and the width (W) of the plurality of heat dissipation plates 4 fixed to the support 3. Therefore, the heat dissipation level can be adjusted. Here, in the heat radiating unit 9 shown in the figure, the length (D) of each heat radiating plate 4 is made equal to the length (L) of the support 3, and the horizontal width (W) of each heat radiating plate 4 is It is changed according to the array pattern.

(Support 3)
The support 3 is made of metal so that heat can be dissipated while conducting the heat of the mounting substrate 2 efficiently. The metal support 3 can efficiently conduct heat by increasing the volume by increasing the volume. However, when the volume of the metal support 3 is increased, the weight of the metal support 3 increases and the entire lighting device becomes heavy. Therefore, the overall shape and size of the metal support 3 are determined in consideration of these matters. The support 3 shown in FIGS. 7 to 10 has a plate shape as a whole. The plate-like support 3 is arranged in a substantially vertical posture with respect to the mounting substrate 2. As shown in FIGS. 3 to 5, the support 3 has one end face fixed in thermal contact with the second face 2 </ b> Y of the mounting board 2 and thermally coupled, and the opposite end is mounted. It arrange | positions with the attitude | position which protrudes in the back surface side of the board | substrate 2. As shown in FIG. As described above, the structure in which the support 3 is formed in a plate shape and arranged in a substantially vertical posture with respect to the mounting substrate 2 effectively uses the region on the back surface side of the mounting substrate 2 while reducing the weight of the support 3. And a large heat dissipation area. However, the support is not necessarily limited to a shape having a plate shape as a whole, and the whole support may have a block shape, a plate shape that is partially block-shaped or annular, or a partial shape. It is also possible to form a block shape that is hollow.

  The support 3 includes a connecting portion 32 for fixing to the mounting substrate 2. The support 3 in FIGS. 8 to 10 includes connecting portions 32 on both sides of the plate-like main body portion 31, and is fixed to the mounting substrate 2 via the connecting portions 32. The connecting portion 32 shown in the figure is a cylindrical portion integrally provided along both side edges of the main body portion 31, and a fixing screw 14 penetrating the mounting substrate 2 is screwed into this cylindrical portion to mount the support 3 on the mounting substrate. 2 is fixed. The connecting portion 32 shown in FIGS. 8 to 10 is not completely cylindrical, but is provided with a slit-like opening 33 along the axial direction, which is the length direction of the support 3, and has a C-shaped cross-sectional view. It is in the shape. In addition to being easily molded, the connecting portion 32 having this structure has a feature that the tip of the fixing screw 14 can be visually recognized through the opening 33 when the fixing screw 14 is screwed. However, the connecting portion does not necessarily have a cylindrical shape, and a connecting hole can be provided in the side edge portion of the support without providing an opening, and a fixing screw can be screwed into the connecting hole and fixed.

  The support 3 is preferably disposed on the second surface 2Y of the mounting substrate 2 at a position corresponding to the position where the semiconductor light emitting element 1 is mounted on the mounting surface 2X. The support 3 in FIG. 7 is fixed to the mounting substrate 2 so that the central portion of the main body 31 is a part corresponding to the position where the semiconductor light emitting element 1 is mounted. With this structure, heat generated from the semiconductor light emitting element 1 can be more efficiently conducted to the support 3 to dissipate heat. In particular, by arranging the central portion of the support 3 on the back side of the central portion of the semiconductor light emitting element 1, heat can be efficiently conducted to the entire support 3. However, the support does not necessarily have to be fixed facing the semiconductor light emitting element mounted on the mounting surface, and the support can be arranged at a shifted position. This structure conducts heat generated from the semiconductor light emitting element to the support through the mounting substrate.

  Furthermore, the support body 3 is fixing the some heat sink 4 in the heat coupling | bonding state so that it may protrude from the surface. The support 3 shown in FIGS. 7 to 9 has a plurality of heat sinks 4 fixed to both surfaces of a plate-like main body 31. The plurality of heat radiating plates 4 are fixed to the surface of the support 3 so that the adjacent heat radiating plates 4 are separated from each other at a predetermined interval. As described above, by projecting a large number of the heat radiating plates 4 from both surfaces of the support 3, the heat radiating area can be widened and heat can be radiated more effectively. Further, as shown in FIGS. 4 and 5, the plurality of heat radiating plates 4 are arranged so as to be substantially perpendicular to the mounting substrate 2. In this structure, by disposing the plurality of heat radiating plates 4 in the extending direction of the support 3, heat conducted from the mounting substrate 2 can be evenly conducted to the plurality of heat radiating plates 4 to radiate heat. Further, the heat released from the second surface 2Y of the mounting substrate 2 can be moved along the heat radiating plate 4 to effectively radiate heat.

  7 to 10 form a plurality of rows of connecting grooves 34 extending in the axial direction, which is the length direction of the support 3, in order to fix the plurality of heat sinks 4 in a state of protruding from the surface. Provided. The plurality of rows of connecting grooves 34 are formed substantially parallel to each other, and the side edges of the heat sink 4 are inserted into the respective connecting grooves 34 to fix the heat sink 4 in place. The support 3 shown in the figure has a pair of opposing walls 35 extending in the axial direction on the surface of the main body 31, and a connecting groove 34 is provided between these opposing walls 35. However, the support is not limited to a structure in which a facing groove is provided on the surface to form a connection groove. The support can be provided with a connection groove by cutting the surface in the axial direction, or can be formed by press-molding a metal plate.

  In the support body 3 in which the coupling groove 34 is formed by the pair of opposing walls 35, the opening direction of the coupling groove 34, that is, the extending direction of the tip of the heat sink 4 inserted into the coupling groove 34 is specified by the protruding direction of the opposing wall 35. Is done. The support 3 shown in FIGS. 7 and 8 specifies the opening direction of the connecting groove 34 so that the front ends of the plurality of heat radiating plates 4 fixed to both surfaces of the main body 31 are widened toward the end. The support 3 is arranged in such a manner that the tips of the plurality of heat radiating plates 4 are widened in a state where the heat radiating plates 4 are fixed to the respective connecting grooves 34. For this reason, there exists the characteristic which can arrange | position the several heat sink 4 more widely, and can improve the heat dissipation effect. However, the support is not necessarily specified as a structure in which a plurality of heat radiating plates fixed to the surface of the main body are arranged in a diverging posture toward the tip. The support body can fix a plurality of heat sinks in a parallel posture or can be fixed in a tapered state toward the tip. The support body determines the opening direction of the connecting groove so that a plurality of heat radiation plates fixed to both surfaces of the main body portion are extended in a predetermined direction.

  The support body 3 of FIGS. 8-10 is made into the plate shape formed in the substantially circular arc shape in sectional view. The support body 3 has a plate-like main body 31 having a circular cross-sectional shape and an overall arc-like shape. The arc-shaped main body 31 has a radius of curvature slightly smaller than the radius (r) of the reference circle 21 described above. However, the radius of curvature of the arc-shaped main body can be made substantially equal to or slightly larger than the radius (r) of the reference circle.

  The support 3A shown in FIGS. 8 to 10 having the main body 31 in an arc shape is provided on the outer peripheral surface side and the inner peripheral surface side of the arc-shaped main body portion 31 in order to fix the plurality of heat radiating plates 4 on both surfaces. A row of connecting grooves 34 is provided. The support 3A shown in FIGS. 8 to 10 is provided with nine rows of connecting grooves 34 on the outer peripheral surface side of the arc-shaped main body 31 to fix the nine heat sinks 4a to 4i and 7 on the inner peripheral surface side. A row of connecting grooves 34 is provided to fix the seven heat sinks 4j to 4p. The support 3A has nine rows of connecting grooves 34 formed on the outer peripheral surface side at equal intervals, and the opening direction of each connecting groove 34 is perpendicular to the arcuate body portion 31, in other words, As the radial direction of the arc-shaped main body 31, the tip directions of the nine heat radiation plates 4a to 4i fixed to the outer peripheral surface are widened toward the end. Moreover, this support body 3A removes the 7 rows of connecting grooves 34 formed on the inner peripheral surface side from the nine heat sinks 4a to 4i fixed to the outer peripheral surface, excluding the heat sinks 4a and 4i at both ends. It is provided at a position facing the intermediate heat radiation plates 4b to 4h. The seven rows of connecting grooves 34 formed on the inner peripheral surface side specify the opening direction of each connecting groove 34 so that the distal ends of the seven heat radiating plates 4j to 4p fixed thereto are widened toward the end. . The support 3 </ b> A has a plurality of heat radiation plates 4 j to 4 p arranged on the inner peripheral surface side approaching the central portion of the main body portion 31, so that heat conducted from the semiconductor light emitting element 1 to the central portion of the main body portion 31. Can be efficiently conducted to the heat sinks 4j to 4p.

  However, the arcuate support 3 may have the shape shown in FIG. The support 3B shown in FIG. 11 is provided with nine rows of connecting grooves 34 on the outer peripheral surface side of the arc-shaped main body 31 to fix nine heat radiation plates 4a to 4i, and seven rows of connecting grooves on the inner peripheral surface side. The grooves 34 are provided to fix the seven heat radiation plates 4j to 4p, but seven rows of connecting grooves 34 formed on the inner peripheral surface side are provided over the entire inner peripheral surface. The support body 3B of FIG. 11 is a heat dissipation plate in which the heat dissipation plates 4j and 4p at both ends are fixed to both ends on the outer peripheral surface side among the seven heat dissipation plates 4j to 4p fixed to the inner peripheral surface of the main body 31. It arrange | positions so that it may become a position facing 4a, 4i. This support 3B dissipates heat conducted from the mounting substrate 2 to the main body 31 uniformly by disposing a plurality of heat dissipation plates 4j to 4p arranged on the inner peripheral surface side over almost the entire main body 31. Conductive to the plates 4j to 4p.

  Furthermore, the arcuate support 3 may have a shape shown in FIG. The support 3C shown in FIG. 12 is provided with seven rows of connecting grooves 34 on the outer peripheral surface side of the arc-shaped main body 31 to fix the seven heat radiation plates 4a to 4g, and seven rows of connecting grooves on the inner peripheral surface side. A groove 34 is provided to fix the seven heat sinks 4j to 4p. The support 3C has seven rows of connecting grooves 34 formed on the outer peripheral surface side and the inner peripheral surface side at equal intervals. Further, the support 3C is provided with seven rows of connecting grooves 34 formed on the outer peripheral surface side and seven rows of connecting grooves 34 formed on the inner peripheral surface side at positions facing each other, and the connecting grooves facing each other. The opening direction of 34 is on the same straight line. That is, the support 3C is fixed to the outer peripheral surface side so that the opening direction of each connecting groove 34 is perpendicular to the arcuate body portion 31, in other words, the radial direction of the arcuate body portion 31. The tip direction of the heat radiating plates 4a to 4g is widened so that the tip direction of the seven heat radiating plates 4j to 4p fixed to the inner peripheral surface is tapered.

  As described above, since the support bodies 3A, 3B, and 3C that are curved in an arc shape are in contact with the mounting substrate 2 in a state in which the end surface is in surface contact with the mounting substrate 2, the contact point is not on a straight line but on a plane. There exists the characteristic hold | maintained in the specific attitude | position with respect to the mounting board | substrate 2, for example, the attitude | position standing perpendicularly | vertically. That is, the arcuate supports 3A, 3B, and 3C are in a surface contact state with the body 31 that is curved away from the straight line connecting the connecting portions 32 on both sides when the connecting portions 32 on both sides are fixed to the mounting substrate 2. Since it is fixed to the mounting board 2, it is stably held in a posture that stands upright with respect to the mounting board 2.

  Further, the metal support 3 may be thermally expanded by the heat conducted from the semiconductor light emitting element 1, but in this case as well, both sides are fixed to the mounting substrate 2 as a curved shape. As shown by a chain line in FIG. 10, the support 3 can absorb the expansion of the metal by bending the main body 31 so as to expand outward. That is, by fixing the arcuate support 3 to the mounting substrate 2 at both sides, the entire body is smooth so that the curvature radius of the main body 31 changes even in a state where the metal constituting the support 3 is thermally expanded. It can be bent to absorb the expansion of the metal. Accordingly, the support 3 is prevented from being irregularly deformed due to thermal expansion, resulting in poor connection between the connecting portion 32 of the support 3 and the mounting substrate 2, or between the end surface of the support 3 and the mounting substrate 2. It is possible to surely prevent the thermal bonding state from becoming defective.

  Furthermore, as shown in FIG. 13, the support 3 may be provided with a heat conduction portion 36 that increases the contact area with the second surface 2 </ b> Y of the mounting substrate 2 in the middle of the main body portion 31 curved in an arc shape. it can. The support 3D shown in the figure has a shape in which an arc-shaped main body 31 is divided into two in the middle, and an annular heat conducting portion 36 is connected between them. The support 3D shown in the figure is provided with openings 36A extending in the lengthwise direction so that the heat conducting section 36 is C-shaped in cross-section, and the divided main body 31 is connected to each opening edge. doing. The support 3D having this shape can be thermally coupled to the mounting substrate 2 in a wide area by bringing the end surface of the heat conducting portion 36 provided in the center portion into contact with the second surface 2Y of the mounting substrate 2. In particular, in the structure in which the support 3D is disposed at a position corresponding to the position where the semiconductor light emitting element 1 is mounted, the heat conducting portion 36 is disposed to face the semiconductor light emitting element 1 so as to be more effective. The semiconductor light emitting device 1 is characterized in that it can conduct heat and dissipate heat. Further, the support 3D having this shape can also absorb the expansion of the metal by smoothly bending the whole by deforming the heat conducting portion 36 provided in the middle in the state of thermal expansion. In the support 3D of FIG. 13, a plurality of opposing walls 35 are provided on both surfaces of the divided main body portion 31 and the annular heat conducting portion 36 to form a connection groove 34. The support 3D shown in the figure is provided with eight rows of connecting grooves 34 on one surface to fix eight heat sinks 4a to 4h, and has eight rows of connecting grooves 34 on the other surface to provide eight heat sinks. 4j to 4q are fixed.

  The support 3 described above has a substantially arc shape in cross-sectional view, but the support body is not necessarily specified as a shape that is curved in an arc shape, and may be a shape that is bent in the middle. The support bent in the middle can also absorb the expansion of the metal by smoothly bending the entire support in the state of thermal expansion.

  Further, the support can be linear in cross-sectional view. The support 3H shown in the plan view of FIG. 14 is composed of a plate-like metal block cut to a predetermined thickness, and the entire shape is a straight line. The support body 3H shown in the drawing has a plurality of rows of connecting grooves 34 parallel to each other by cutting the surface in the length direction, and fixing the heat sinks 4 to these connecting grooves 34 to attach the plurality of heat sinks 4 to each other. It is fixed in a state of protruding outward. 14 has eight rows of connecting grooves 34 formed on one surface and seven rows of connecting grooves 34 formed on the other surface at equal intervals, and is adjacent to each other. A connecting groove 34 provided on the opposite surface is positioned between the grooves 34. Further, the support body 3H shown in the figure has through holes as connecting portions 32 at both ends, and can be fixed to the mounting substrate 2 by screwing a fixing screw that penetrates the mounting substrate 2. Although this support is not shown in the drawing, the through hole provided at both ends is a long hole, or the fixing hole opened to the mounting board is a long hole, and the metal support is deformed in a linear direction in a state of thermal expansion. It can also be absorbed. The entire support 3H is made of a metal block, thereby increasing the heat capacity and dissipating heat while efficiently conducting heat. Furthermore, since the connection groove 34 can be provided by cutting the surface in a straight line, there is also a feature that it can be manufactured easily and easily.

  Further, as shown in FIG. 15, the support 3 may be provided with a heat conducting portion 36 that has a linear shape as a whole and increases the contact area with the second surface 2 </ b> Y of the mounting substrate 2. The support 3I shown in the figure has a shape in which a linear main body 37 is divided into two in the middle, and a hollow heat conducting portion 36 is connected therebetween. The support 3I shown in the figure has a heat conduction part 36 with an outer shape as a cross-sectional view, a hollow part 36B having a circular shape in cross-section is provided inside, and a divided main body part 37 on both side surfaces of the heat conduction part 36. Are connected. Further, the heat conducting portion 36 is provided with an opening 36A by opening the central portion of one surface in the length direction. The support 3I having this shape can also be thermally coupled to the mounting substrate 2 in a wide area by bringing the end surface of the heat conducting portion 36 provided in the center portion into contact with the second surface 2Y of the mounting substrate 2. In particular, in the structure in which the support 3I is disposed at a position corresponding to the position where the semiconductor light emitting element 1 is mounted, the heat conducting portion 36 is disposed so as to face the semiconductor light emitting element 1 so that the semiconductor can be more effectively provided. There is a feature that heat of the light emitting element 1 can be conducted to dissipate heat. However, the heat conduction part does not necessarily need to be provided with an opening, and can also be provided with a cylindrical hollow part. Moreover, the heat conduction part can also be made into the block shape with which the content was filled, without providing a hollow part.

  Further, the support body 3I of FIG. 15 is provided by cutting the connecting grooves 34 extending in the length direction of the support body 3I on both surfaces of the divided main body portion 37 and the heat conducting portion 36. The support 3I shown in the figure is provided with eight rows of connecting grooves 34 on one surface to fix the eight heat sinks 4a to 4h, and six rows of connecting grooves 34 on the other surface to provide six heat sinks. 4j to 4o are fixed. By configuring the support 3I, the main body 37 and the heat conducting portion 36 with metal blocks, the heat capacity can be increased and heat can be dissipated while conducting heat efficiently. Furthermore, since the connecting groove 34 can be provided by cutting the surfaces of the main body 37 and the heat conducting portion 36 in a straight line, there is also a feature that it can be manufactured easily and easily.

  The support 3 described above is provided with a plurality of rows of connection grooves 34 formed on the surface in order to fix the plurality of heat sinks 4, but the support does not necessarily need to be provided with connection grooves on the surface. As shown in FIG. 16, the support can also be fixed by directly bonding a plurality of heat sinks 4 to the surface of the support 3. The support 3J shown in FIG. 16 has a surface as a smooth surface without providing a connection groove on the surface of the plate-shaped main body portion 38, and a plurality of heat radiating plates 4 are bonded and thermally bonded to both surfaces. The plurality of heat radiating plates 4 are provided with connecting pieces 4Y by bending rear end portions into an L shape as adhesive margins for bonding to the surface of the support 3. As described above, the structure in which the connecting pieces 4Y are provided on the plurality of heat radiating plates 4 and bonded to the surface of the support 3J simplifies the structure of the support 3J, and makes each heat radiating plate 4 wide while reducing the weight and cost. The area 3 is thermally coupled to the support 3 to efficiently conduct heat from the support 3J to the heat radiating plate 4 to dissipate heat. The support 3J shown in FIG. 16 has the main body 38 curved in a cross-sectional arc shape, but this support can also form a plate-like main body in a straight line in cross-section.

  The metal support 3 is made of a metal that is lightweight and has excellent thermal conductivity, such as aluminum. The aluminum support 3 is preferably manufactured by extrusion. The support 3 described above can be easily and easily molded by extrusion molding, with the surface having a complicated shape. For example, the support bodies 3A, 3B, 3C, and 3D shown in FIGS. 8 to 13 have a plurality of rows of connecting grooves 34 provided on the surface of the main body 31 as a groove extending in the metal extrusion direction, and the main body. The connecting portions 32 provided on both side edges of the cylinder 31 have a cylindrical shape extending in the metal extrusion direction, and a slit-shaped opening 33 extending in the extrusion direction. Therefore, these supports 3A, 3B, 3C, and 3D can be efficiently mass-produced while the connecting groove 34 and the connecting portion 32 are extended in the aluminum extrusion direction. Further, the support bodies 3H and 3I shown in FIG. 14 and FIG. 15 can be formed with a plurality of rows of connecting grooves 34 by cutting the surface after the entire outer shape is manufactured by extrusion molding of aluminum. The support 3 manufactured by extrusion molding is efficiently mass-produced by, for example, cutting an elongated molding material formed into a predetermined cross-sectional shape by extrusion molding into a predetermined length. However, the support is not necessarily specified for production by extrusion. The support can also be manufactured by casting or pressing.

(Heatsink 4)
The heat sink 4 fixed to the support 3 is made of paper containing carbon. The paper heat sink 4 is manufactured by forming a paper sheet containing carbon in a predetermined size and thickness, and is fixed to the support 3. As shown in FIGS. 8 and 9, the plurality of heat radiating plates 4 fixed to the support 3 are rectangles having the same length (D) as the total length (L) of the support 3 and different widths (W). It is shaped into a shape. The rectangular heat radiating plate 4 is disposed at a fixed position in a state where one side edge portion is guided by a connecting groove 34 provided on the surface of the support 3 and is fixed in a thermally coupled state. The plurality of heat radiating plates 4 fixed to the support are individually adjusted in width (W) so that the heat radiating plates 4 adjacent to each other are in a predetermined arrangement.

  The lateral width (W) of the plurality of heat sinks 4 is adjusted so as to have an optimum length depending on the shape and orientation of the support 3 fixed to the mounting substrate 2, the number thereof, and the like. As shown in FIGS. 7 and 18 to 24, the plurality of heat radiating plates 4 fixed to the support 3 are arranged at the tips of the heat radiating plates 4 with the plurality of heat radiating units 9 fixed to the mounting substrate 2. However, the lateral width (W) is adjusted so as not to contact the heat dissipating units 9 adjacent to each other and so as not to protrude outward from the outer peripheral edge of the mounting substrate 2. That is, the plurality of heat radiating plates 4 fixed to the support body 3 is one surface of the support body 3, and the tip edge of the heat radiating plate 4 arranged toward the outside of the mounting substrate 2 is mounted on the mounting body 2. Regarding the heat radiating plate 4 whose width (W) is adjusted so as not to protrude from the outer peripheral edge of the substrate 2, and is disposed on the other surface of the support 3 toward the inside of the mounting substrate 2. The width (W) is adjusted so as to have a size that approaches the adjacent heat radiating unit 9 but does not come into contact therewith.

  Further, the heat radiating plate 4 shown in FIG. 9 is provided with an insertion connecting portion 4 </ b> X guided by the connecting groove 34 of the support 3 by thickly forming one rectangular side edge portion. The heat radiating plate 4 shown in the figure has a thickness that allows the insertion connecting portion 4X to be inserted into the connecting groove 34 with a multilayer structure. The thickness of the fitting connection portion 4X can be made substantially equal to the width of the connection groove 34 provided in the support body 3, slightly smaller, or slightly larger. With the heat sink having a thickness of the fitting connecting portion that is slightly smaller than the groove width of the connecting groove, the fitting connecting portion can be easily inserted into the connecting groove. This heat radiating plate can be bonded and fixed to the connecting groove in a thermally coupled state. The heat sink with the thickness of the fitting connection part being slightly larger than the groove width of the connection groove can be fixed by press-fitting the fitting connection part into the connection groove. This structure can be fixed by inserting the heat sink into the connecting groove without using an adhesive or the like. However, the heat sink press-fitted into the connecting groove can be further bonded with an adhesive.

  Further, the heat radiating plate 4 shown in FIG. 16 is provided with a connecting piece 4Y by bending one side edge of a rectangle into an L shape in order to adhere to the surface of the support 3. The heat radiating plate 4 is formed by cutting a paper sheet containing carbon into a predetermined size and then bending one side edge portion with a predetermined width to form a connecting piece 4Y. The heat sink 4 fixed to the support body 3 via the connecting piece 4Y can adjust the bending angle β of the connecting piece 4Y and specify the extending direction of the tip of the heat sink 4. In FIG. 16, the plurality of heat sinks 4 a to 4 i fixed to the outer peripheral surface side of the main body portion 38 having a circular arc shape in cross section have a bending angle β of the connecting piece 4 </ b> Y of about 90 degrees and are fixed to the outer peripheral surface side. The tip of the heat sink 4 is configured to be widened toward the end. In addition, the plurality of radiator plates 4j to 4p fixed to the inner peripheral surface side of the main body portion 38 having a circular arc shape in a sectional view has a bending angle β of the connecting piece 4Y of the radiator plate 4m disposed in the center as about 90 degrees. In addition, the radiating plates 4j to 4l and 4n to 4p arranged on both sides of the connecting pieces 4Y are gradually reduced from the center toward both sides, and the radiating plates are fixed to the inner peripheral surface side. The tip of 4 has a divergent posture. However, the bending angle β of the connecting piece can be adjusted so that a plurality of adjacent heat radiating plates are parallel to each other, or can be adjusted to be tapered toward the tip. Further, the heat radiating plate can have the same bending angle β of all the heat radiating plates.

  Here, the heat radiating plate 4 shown in FIG. 16 has a structure in which one side edge is bent in an L shape to provide a connecting piece 4Y. However, the heat radiating plate 4 has a side edge as shown in FIG. The connecting pieces 4 </ b> Y provided in the section can be alternately bent left and right along the length direction of the heat sink 4. The heat sink 4 shown in the drawing divides the connecting pieces 4Y provided on the side edge portions into a plurality of parts, and bends the connecting pieces 4Y adjacent to each other alternately in opposite directions. Since the heat sink 4 having this structure is bonded to the support body 3 via the connecting piece 4Y bent in both directions, it has a feature that it can be stably fixed to the support body 3 in a predetermined standing posture. This heat radiating plate can also be fixed to the support body by specifying the extending direction of the tips of the plurality of heat radiating plates by adjusting the bending angle of the connecting piece.

  The heat radiating plate 4 composed of a paper sheet containing carbon is adjusted so that its thermal conductivity is 15 W / (m · K) or more, preferably 20 W / (m · K) or more.

(Paper sheet manufacturing method)
The heat radiating plate 4 is manufactured by manufacturing a paper sheet containing carbon and cutting the paper sheet into a predetermined size. Paper sheets containing carbon are manufactured by adding carbon to fibers and wet papermaking, or by coating the surface of the paper sheet with carbon or impregnating the inside of the paper sheet with carbon. Alternatively, it is manufactured by laminating a sheet material containing carbon on a paper sheet.

[Production method by wet papermaking]
A paper sheet produced by wet papermaking is produced by suspending fibers and carbon in water to form a papermaking slurry, wet-making the papermaking slurry into a sheet, and drying it. This paper sheet is preferably made by suspending beating pulp in which infinite number of fine fibers are provided on the surface of the papermaking slurry and non-beating fibers that are not beaten, and with the beating pulp and non-beating fibers. In addition, a carbon fiber produced by binding carbon suspended in a papermaking slurry to a fiber and making it into a sheet is used.

The paper sheet containing carbon can be manufactured by wet papermaking as follows.
100 parts by weight of graphite (50 parts by weight having an average particle diameter of 100 μm and 50 parts by weight having an average particle diameter of 40 μm),
21 parts by weight of acrylic pulp as beating pulp (Canadian Standard Freeness (CSF) 50 ml, average fiber length 1.45 mm),
4 parts by weight of polyester fiber (0.1 dtex × 3 mm) as non-beaten fiber,
14 parts by weight of binder fiber (1.2 dtex × 5 mm) made of polyester fiber as binder fiber,
A composition comprising 2.9 parts by weight of carbon fiber (diameter 7 μm) is mixed and dispersed in water to prepare a slurry comprising 1% to 5% solids. This slurry is subjected to wet papermaking on a short net paper machine already used as a wet papermaking machine to form a papermaking sheet. The papermaking sheet is pressed and dried, and then heat passed between two hot rolls. The paper sheet is densified by pressure treatment. In the hot press treatment, the metal is passed through a metal roll having a surface temperature of 180 ° C., an outer diameter of 250 mm, and a pressure between the rolls of 150 kg / cm at a speed of 5 m / min.

The paper sheet manufactured by the above steps has a thickness of 0.26 mm, a density of 1.155 g / cm ³ , a basis weight of 294 g / m ³ , and a thermal conductivity of 54.2 W / (m · K). .

  The above paper sheet uses acrylic pulp for beating pulp and polyester fiber for non-beating fiber, but for beating pulp, either beating pulp made of synthetic fibers or natural pulp is used alone or in combination. It can be used as a mixture of seeds. In addition, acrylic fiber, polyarylate fiber, polyamide fiber, polyethylene fiber, polypropylene fiber, PBO (polyparaphenylene benzoxazole) fiber, rayon fiber, polysulfone fiber, etc. can be used for beating pulp made of synthetic fiber. Natural pulp For this, wood pulp, non-wood pulp and the like can be used. Non-beaten fibers include polyester fiber, polyamide fiber, polypropylene fiber, polyimide fiber, polyethylene fiber, acrylic fiber, carbon fiber, PBO fiber, polyvinyl acetate fiber, rayon fiber, polyvinyl alcohol fiber, ethylene vinyl alcohol fiber, poly Arylate fibers, metal fibers, glass fibers, ceramic fibers, fluorine fibers, polysulfone fibers, polyphenylene sulfide fibers and the like can be used.

  In addition, the above paper sheet is processed into a sheet by using a binder fiber that is a non-beaten fiber that is melted by heat, and heat-pressing the wet paper sheet to melt the binder fiber. As the binder fiber, polyester fiber, polypropylene fiber, polyamide fiber, polyethylene fiber, polyvinyl acetate fiber, polyvinyl alcohol fiber, ethylene vinyl alcohol fiber, polysulfone fiber, polyphenylene sulfide fiber, or the like can be used.

Furthermore, the paper sheet can be manufactured using only beaten pulp, for example, without necessarily using beaten pulp and non-beaten fiber.
Furthermore, although the above paper sheet was produced as a papermaking sheet by forming a slurry into a sheet using a sheet machine, it can be produced as a papermaking sheet by mold papermaking instead of the sheet machine.

  Furthermore, the strength in the state shape | molded as the heat sink 4 can improve a paper sheet by including the synthetic resin of a binder. Synthetic resins for this binder include polyacrylic acid ester copolymer resins, polyvinyl acetate resins, polyvinyl alcohol resins, NBR (acrylonitrile butadiene rubber) resins, SBR (styrene butadiene rubber) resins, polyurethane resins, and fluorine resins. Either a thermoplastic resin containing or a thermosetting resin containing any of a phenol resin, an epoxy resin, and a silicon resin can be used.

  Further, the above paper sheet uses graphite having an average particle diameter of 100 μm and graphite having an average particle diameter of 40 μm as carbon to be added to the fiber, but instead of or in addition to graphite, carbon is used. Charcoal, bamboo charcoal, amorphous carbon, diamond, diamond-like carbon, fullerene, carbon nanotube, carbine, graphene, carbon fiber, graphite powder, etc., and an average particle size of 0.01 μm to 500 μm, Preferably, it can be set to 1 μm to 200 μm. Even if the average particle size is too small or too large, the ratio of adhering to the fiber in the wet papermaking process decreases and the utilization efficiency deteriorates, so the optimum average considering the type of fiber used etc. Use a particle size.

Further, the paper sheet can be improved in flame retardant properties by adding a flame retardant. For example, a paper sheet can improve a flame retardance characteristic by impregnating a flame retardant. For example, a paper sheet obtained by using guanidine phosphate as a flame retardant and impregnating the guanidine phosphate at a ratio of 10% by weight achieves a flame retardant effect of about UL94 V-0.
Furthermore, the manufacturing method of the heat-radiation sheet of the present invention can be made by adding a synthetic resin as a binder to the papermaking slurry. As a synthetic resin, a thermoplastic resin including any of a polyacrylate copolymer resin, a polyvinyl acetate resin, a polyvinyl alcohol resin, an NBR (acrylonitrile butadiene rubber) resin, an SBR (styrene butadiene rubber) resin, a polyurethane resin, or Any of curable resins containing any of phenolic resin and epoxy resin can be used.

  Furthermore, the paper sheet can also be produced by hot pressing a papermaking sheet obtained by making a papermaking slurry into a sheet. In this case, the surface temperature of the hot press is set to 100 ° C. to 400 ° C., and the surface pressure is set to 3 MPa to 40 MPa. In this hot press, when the surface pressure is increased to 10 MPa to 40 MPa, the voids of the papermaking sheet can be eliminated and the thermal conductivity can be further increased as a high density sheet.

[Production method by coating or impregnation]
Furthermore, the paper sheet containing carbon can be manufactured by coating the surface of the paper sheet with carbon, or impregnating the inside of the paper sheet with carbon. In this method, a paper sheet is made by a wet or dry process, and a resin obtained by mixing carbon powder is applied to the surface of the paper sheet, or impregnated inside the paper sheet. In this method, a resin serving as a binder is added to the carbon powder at a predetermined ratio to prepare a carbon-containing resin, and the molten carbon-containing resin is applied to the surface of the paper sheet, or Impregnation into the paper sheet. The carbon-containing resin is prepared, for example, by adding 1 to 50 parts by weight, preferably 10 to 30 parts by weight of a binder resin to 100 parts by weight of carbon powder. The carbon powder is a carbon powder having an average particle size of 0.01 μm to 500 μm, preferably 1 μm to 200 μm, and the aforementioned graphite, charcoal, bamboo charcoal, amorphous carbon, diamond, diamond-like carbon, fullerene, Powders such as carbon nanotubes, carbine, graphene, carbon fiber, and graphite can be used. In addition, as a binder resin to be added, a thermosetting resin containing any of an epoxy resin and a phenol resin, or a polyacrylate copolymer resin, a polyvinyl acetate resin, a polyvinyl alcohol resin, and an NBR (acrylonitrile butadiene rubber) resin A thermoplastic resin containing any of SBR (styrene butadiene rubber) resin and polyurethane resin can be used.

  In the step of applying the carbon-containing resin to the surface of the paper sheet, the paper sheet is sprayed with a carbon-containing resin that is in a molten state on the surface of the paper sheet, or a roller that adheres the molten carbon-containing resin to the paper sheet. It can be applied by rolling on the surface. Further, in the step of impregnating the carbon-containing resin inside the paper sheet, for example, a roller to which a liquid carbon-containing resin is adhered in a molten state is disposed to face the paper sheet, and the paper sheet is interposed between these rollers. The carbon-containing resin in a molten state is transferred to a paper sheet and impregnated in a gap between the paper sheets. In this method, by passing the paper sheet in a state of being sandwiched by rollers from both sides, the molten carbon-containing resin can be reliably impregnated into the gaps of the paper sheet. Further, the paper sheet can be immersed in the liquid carbon-containing resin in a molten state, and the paper sheet impregnated with the liquid carbon-containing resin into the gap can be squeezed with a roller or the like to obtain an optimum impregnated state. After that, a paper sheet coated or impregnated with a carbon-containing resin is sandwiched with rollers from both sides, or pressed by a flat plate press to cure the resin by heating and pressurizing, and a paper sheet containing carbon Is manufactured.

[Production method by lamination]
Furthermore, the paper sheet containing carbon can also be manufactured by laminating a sheet material containing carbon on the surface of the paper sheet and bonding them by a method such as adhesion or heat welding. In this method, carbon-containing sheets are laminated on the surface of a paper sheet made by wet or dry processing, and these are bonded together to form a single sheet. As the carbon-containing sheet, for example, a prepreg formed by impregnating a plastic into a fiber base material obtained by processing carbon fibers into a sheet shape can be used. A carbon-containing sheet that is a prepreg is manufactured by impregnating a thermosetting resin in an uncured state into a fiber base material obtained by processing short-fiber carbon fibers into a sheet shape. The carbon-containing sheet preferably has a thermosetting resin content of 50 wt% to 90 wt% and a carbon fiber content of 10 wt% to 50 wt%.

  The fiber base is produced by wet papermaking short carbon fibers and processing them into sheet-like papermaking sheets, and binding the carbon fibers of the papermaking sheets with binder fibers. In the process of wet papermaking of the fiber base material, 3 to 30 parts by weight of binder fiber made of thermoplastic resin or wet heat melting type resin that is melted by heating and bonding carbon fiber is added to 100 parts by weight of carbon fiber. In addition to adding to the dispersion liquid, the carbon fiber and binder fiber-added dispersion liquid is sucked onto the paper making surface of the mesh conveyor to deposit the carbon fiber and process it into a sheet. Carbon fibers having an average fiber length of 0.5 mm to 13 mm are used. The binder fiber is a thermoplastic resin that is heated and melted to bond the carbon fiber, or a wet heat melting type resin that is humidified and melted to bond the carbon fiber, and is polyester fiber, polypropylene fiber, polyimide fiber, polyethylene fiber, Any one of vinyl acetate fiber, polyvinyl alcohol fiber, ethyl vinyl alcohol fiber, or a mixture of these is used. The wet papermaking sheet is heated to melt the binder fibers contained in the papermaking sheet and bond the carbon fibers at the intersections. In the papermaking sheet, carbon fibers are bonded to each other by a molten binder fiber thermoplastic resin or wet heat melting type resin to form a fiber base material.

  The fiber base produced as described above is impregnated with an uncured thermosetting resin. The thermosetting resin to be impregnated into the fiber base material is an uncured thermosetting resin having a tensile strength capable of ensuring the handleability in the process of laminating the fiber base material and laminating on the paper sheet described later. Is used. An epoxy resin is used as the thermosetting resin impregnated in the fiber base material. However, any of an epoxy resin, a phenol resin, a melamine resin, a urea resin, and an unsaturated polyester resin can be used as the thermosetting resin.

  In the impregnation step, a thermosetting resin sheet in an uncured state is laminated and heated on the surface of the fiber substrate, and the thermosetting resin in an uncured state is melted by heating the thermosetting resin sheet. Impregnate the gap. In this method, a thermosetting resin sheet that becomes a low-viscosity liquid when heated is laminated, and the liquid thermosetting resin that has been liquefied to a low viscosity by heating this can be smoothly impregnated in the gaps of the fibers. In the impregnation step, a roller having an uncured thermosetting resin attached to the surface can be pressed against the surface of the fiber base material to impregnate the gaps of the fiber base material. In this method, for example, a roller to which an uncured and liquid thermosetting resin is attached is disposed to face the fiber base material between the rollers, and an uncured thermosetting resin is passed between the rollers. Is transferred to a fiber base material and impregnated in the gaps of the fiber base material. In this method, the fiber base material can be impregnated with the uncured thermosetting resin even inside the gaps of the fiber base material by passing the fiber base material in a state of being sandwiched by rollers from both sides. Furthermore, the impregnation step includes immersing the fiber base material in an uncured and liquid thermosetting resin, and squeezing the fiber base material impregnated with the liquid thermosetting resin into the gap with a roller or the like to obtain an optimal impregnation state. You can also

  The carbon-containing sheet produced as described above is laminated on a paper sheet, and this is heated to cure the thermosetting resin of the carbon-containing sheet and bond it into a sheet to produce a paper sheet containing carbon To do. The carbon-containing sheet is preferably laminated on both sides of the paper sheet to improve heat conduction characteristics. The carbon-containing sheet and the paper sheet are firmly bonded to each other through a thermosetting resin that is cured by heating, and are formed into a single sheet.

  Furthermore, the carbon-containing sheet laminated | stacked on a paper-made sheet is not specified to a prepreg, It can also be set as the various sheet materials formed by containing carbon. Such a carbon-containing sheet is not impregnated with a thermosetting resin, but is applied by laminating and bonding a binder to a paper sheet, or an uncured thermosetting resin that becomes a binder. It is also possible to laminate through sheets, heat and press to melt the thermosetting resin sheets and bond them together. As such a carbon containing sheet, a graphite sheet etc. can be used, for example.

  The above-mentioned paper sheet has a feature that is strong against bending deformation and vibration due to the structure of the paper sheet assembled in a state where the fibers intersect. For this reason, a paper sheet is manufactured by containing carbon in a paper sheet, and the heat sink 4 manufactured from this paper sheet has a feature that deformation and deterioration are prevented over a long period of time and excellent heat dissipation characteristics can be maintained. is there.

  The heat radiating plate 4 is manufactured by cutting the paper sheet manufactured as described above into a predetermined size. The cut paper sheets can be adjusted in thickness by laminating and bonding a plurality of sheets. A heat dissipation plate formed by laminating a plurality of paper sheets can increase the strength. Further, as shown in FIGS. 8 and 9, a heat sink having a thick fitting connection portion at the side edge portion can form a fitting connection portion by laminating and bonding laminated pieces to the side edge portion.

  As described above, the heat radiating unit 9 is manufactured by fixing the plurality of heat radiating plates 4 having a predetermined size to the support 3 in a predetermined arrangement. Hereinafter, the Example of the thermal radiation unit used for a heat radiator and the Example of the arrangement pattern are explained in full detail based on FIG. 7 and FIGS. In the following embodiment, 60 heat dissipating units 9 are respectively disposed at positions facing the semiconductor light emitting element 1 on the second surface 2Y of the mounting substrate 2 on which the 6 semiconductor light emitting elements 1 are mounted. It shows an example of arrangement in an array formed by rotational movement at a degree interval.

  Furthermore, the heat radiator 10 of the Example shown below is fixing the support body 3 of the heat radiating unit 9 in the attitude | position which parallels or inclines with respect to the outer periphery of the mounting substrate 2. FIG. In other words, the plurality of heat dissipating units 9 are fixed to the mounting substrate 2 so that the orientation of the support body 3 is in the direction along the reference circle 21 described above or in a posture that intersects the reference circle 21. Each heat dissipating unit 9 is arranged such that the intersection angle α between the extending direction of the support 3 and the tangential direction of the reference circle 21 of the mounting substrate 2 is a predetermined angle. Here, the extending direction of the support 3 is a linear direction connecting the connecting portions 32 on both sides in the arc-shaped support 3, and indicates a tangential direction at an intermediate point of the main body portion 31. In the support 3, the extending direction is shown. The tangential direction of the reference circle 21 of the mounting substrate 2 is an extension line m drawn in the extension direction of the support 3 at the intermediate point of the support 3 and a reference circle at the intersection p of the extension line m and the reference circle 21. The direction of the tangent line s is 21. That is, the crossing angle α between the support 3 and the reference circle 21 is the extension line m drawn from the intermediate point of the support 3 and the tangent s of the reference circle 21 at the intersection p between the extension line m and the reference circle 21. The angle formed by is shown. The crossing angle α of the heat radiating unit 9 fixed to the mounting substrate 2 is 0 to 90 degrees, and the width of the plurality of heat radiating plates 4 fixed to the support 3 of each heat radiating unit 9 according to the angle. (W) is specified. The lateral width (W) of the plurality of heat dissipation plates 4 fixed to the heat dissipation unit 9 is preferably designed so that it can be arranged over a wide area of the second surface 2Y of the mounting substrate 2.

[Example 1]
A radiator 10A shown in FIG. 7 is a heat radiating unit 9A having the structure shown in FIGS. 8 and 9, and includes a heat radiating unit 9A including the support 3A shown in FIG. 10 and 16 heat radiating plates 4. Yes. In the radiator 10 </ b> A of FIG. 7, the heat radiating units 9 </ b> A are arranged in a posture in which the outer peripheral surface side of the arcuate support 3 </ b> A faces the outer peripheral edge side of the mounting substrate 2. Each heat radiating unit 9A is arranged such that the crossing angle α formed by the support 3A and the reference circle 21 is 25 degrees to 35 degrees (about 30 degrees in the figure).

  The heat radiating unit 9 </ b> A has a lateral width (W) of the heat radiating plates 4 a to 4 i so that the leading edges of the nine heat radiating plates 4 a to 4 i arranged on the outer peripheral edge side of the mounting substrate 2 approach the outer peripheral edge of the mounting substrate 2. Is gradually increased from the heat sink 4a toward the heat sink 4i. In particular, the radiator plates 4 a to 4 i fixed to the outer peripheral surface side of the arcuate support 3 </ b> A are arranged so as to expand toward the front end direction, and the front end edge thereof approaches the outer peripheral edge of the mounting substrate 2. The length is adjusted so as not to protrude from the outer peripheral edge. Thereby, in the outer peripheral edge part of the mounting board | substrate 2, the heat sink 4 is arrange | positioned in a wider area | region so that it can radiate heat ideally.

  Further, in the heat radiating unit 9A, the lateral width (W) of the seven heat radiating plates 4j to 4p disposed on the center side of the mounting substrate 2 is gradually increased from the heat radiating plate 4j toward the heat radiating plate 4p. The heat radiation plates 4j to 4p fixed to the inner peripheral surface side of the arcuate support 3A are arranged so as to expand toward the front end direction, and their front end edges approach the adjacent heat dissipating unit 9A but are in contact with each other. The ventilation gap 29 is provided between the heat dissipating units 9 </ b> A adjacent to each other. In particular, the innermost heat radiating plate 4 p has its tip edge approaching the center of the mounting substrate 2. As a result, the heat radiating plate 4 is also disposed in the region near the center of the mounting substrate 2 so that heat can be radiated ideally.

[Example 2]
A radiator 10B shown in FIG. 18 includes a heat radiating unit 9B composed of a support 3B having the structure shown in FIG. In the radiator 10 </ b> B of FIG. 18, the heat radiating units 9 </ b> B are arranged in such a posture that the outer peripheral surface side of the arcuate support 3 </ b> B faces the outer peripheral edge side of the mounting substrate 2. Each heat radiating unit 9B is arranged such that the crossing angle α formed by the support 3B and the reference circle 21 is 15 degrees to 25 degrees (about 20 degrees in the figure).

  The heat radiating unit 9 </ b> B is configured such that, of the nine heat radiating plates 4 a to 4 i disposed on the outer peripheral edge side of the mounting substrate 2, the tip edges of the heat radiating plates 4 a to 4 e approach the outer peripheral edge of the mounting substrate 2. The width (W) of the heat sinks 4a to 4e is gradually increased from the heat sink 4a toward the heat sink 4e. These heat radiation plates 4a to 4e are adjusted to such a length that the leading edge approaches the outer peripheral edge of the mounting substrate 2 but does not protrude from the outer peripheral edge. Further, the heat radiation plates 4e to 4i have the same width (W). By using a plurality of heat sinks 4 having the same dimensions as described above, the labor involved in manufacturing the heat dissipation unit 9B is simplified and the manufacturing cost is reduced.

  Further, in the heat radiating unit 9B, the lateral width (W) of the seven heat radiating plates 4j to 4p disposed on the center side of the mounting substrate 2 is gradually increased from the heat radiating plate 4j toward the heat radiating plate 4p. The radiator plates 4j to 4p fixed to the inner peripheral surface side of the arcuate support 3B are arranged so as to expand toward the tip, and the tips of the radiator plates 4j to 4o are adjacent to each other. About the heat sink 4o, 4p which is adjusted to the length which approaches the heat radiating unit 9B but does not contact, and the ventilation gap 29 is provided between the heat radiating units 9B adjacent to each other, and is disposed close to the center side. The tip edge is adjusted to a length that approaches the center of the mounting substrate 2. As a result, the heat radiating plate 4 is also disposed in the region near the center of the mounting substrate 2 so that heat can be radiated ideally.

[Example 3]
A heat radiator 10C shown in FIG. 19 includes a heat radiating unit 9C including a support 3C having the structure shown in FIG. 12 and 14 heat radiating plates 4. In the heat radiator 10 </ b> C of FIG. 19, each heat dissipating unit 9 </ b> C is arranged in such a posture that the outer peripheral surface side of the arcuate support 3 </ b> C faces the outer peripheral edge side of the mounting substrate 2. Each heat radiating unit 9C is arranged so that the crossing angle α formed by the support 3C and the reference circle 21 is 15 degrees to 25 degrees (about 20 degrees in the figure).

  The heat radiating unit 9 </ b> C has a lateral width (W) of the heat radiating plates 4 a to 4 g so that the leading edges of the seven heat radiating plates 4 a to 4 g disposed on the outer peripheral side of the mounting substrate 2 approach the outer peripheral edge of the mounting substrate 2. Is gradually increased from the heat sink 4a toward the heat sink 4g. In particular, the radiator plates 4 a to 4 g fixed to the outer peripheral surface side of the arcuate support 3 are arranged so as to expand toward the front end direction, and the front end edge thereof approaches the outer peripheral edge of the mounting substrate 2. The length is adjusted so as not to protrude from the outer peripheral edge. Thereby, in the outer peripheral edge part of the mounting board | substrate 2, the heat sink 4 is arrange | positioned in a wider area | region so that it can radiate heat ideally.

  Further, in the heat radiating unit 9C, the horizontal widths (W) of the seven heat radiating plates 4j to 4p arranged on the center side of the mounting substrate 2 are all equal. The heat radiating unit 9C is an arrangement in which seven heat radiating plates 4j to 4p fixed to the inner peripheral surface side of the arcuate support 3C are tapered toward the front end, and the front end edge thereof is The ventilation gap 29 is provided between the heat radiating units 9C adjacent to each other by adjusting the length so as not to contact each other and not contacting the adjacent heat radiating units 9C. By using a plurality of heat sinks 4 having the same dimensions as described above, the labor involved in manufacturing the heat dissipation unit 9C is simplified and the manufacturing cost is reduced.

[Example 4]
A heat radiator 10D shown in FIG. 20 includes a heat radiating unit 9D including a support 3C having a structure shown in FIG. 12 and 14 heat radiating plates 4. In the radiator 10 </ b> D of FIG. 20, the heat radiating units 9 </ b> D are arranged in such a posture that the outer peripheral surface side of the arcuate support 3 </ b> C faces the outer peripheral edge side of the mounting substrate 2. Each heat radiating unit 9D is arranged such that the crossing angle α formed by the support 3C and the reference circle 21 is 45 degrees to 80 degrees (about 65 degrees in the drawing).

  The heat radiating unit 9 </ b> D includes a heat radiating plate so that the tip edges of the heat radiating plates 4 a to 4 c are close to the outer rim of the mounting substrate 2 among the seven heat radiating plates 4 a to 4 g arranged on the outer peripheral edge side of the mounting substrate 2. The lateral width (W) of 4a to 4c is gradually increased from the heat sink 4a toward the heat sink 4c. These heat radiation plates 4a to 4c are adjusted to such a length that the leading edge approaches the outer peripheral edge of the mounting substrate 2 but does not protrude from the outer peripheral edge. Further, the heat radiation plates 4d to 4g have the same lateral width (W) and are larger than the lateral width (W) of the heat radiation plate 4c. Further, the innermost heat radiating plate 4g is adjusted to a length such that the edge of the heat radiating plate approaches the adjacent heat radiating unit 9D but does not come into contact therewith, and a ventilation gap 29 is provided between the adjacent heat radiating units 9D. ing. By using a plurality of heat sinks 4 having the same dimensions as described above, the labor involved in manufacturing the heat dissipation unit 9D is simplified and the manufacturing cost is reduced.

  Further, in the heat radiating unit 9D, the lateral width (W) of the seven heat radiating plates 4j to 4p arranged on the center side of the mounting substrate 2 is gradually increased from the heat radiating plate 4j toward the heat radiating plate 4p. The heat radiation plates 4j to 4p fixed to the inner peripheral surface side of the arcuate support 3C are arranged in a tapered shape toward the front end direction, and the front end edge thereof approaches the adjacent heat dissipation unit 9D. The ventilation gap 29 is provided between the heat dissipation units 9D adjacent to each other.

[Example 5]
A radiator 10E shown in FIG. 21 includes a heat radiating unit 9E composed of the support 3C having the structure shown in FIG. 12 and 14 heat radiating plates 4. The radiator 10E of FIG. 21 is configured so that each of the radiator units 9E has a posture in which the inner peripheral surface side of the arc-shaped support 3C faces the outer peripheral edge side of the mounting substrate 2, that is, the radiator unit 9D of the radiator 10D shown in FIG. The position is reversed. Each heat radiating unit 9E is arranged so that the crossing angle α formed by the support 3C and the reference circle 21 is 35 ° to 60 ° (about 50 ° in the figure).

  The heat radiating unit 9 </ b> E has a heat radiating plate so that the tip edges of the heat radiating plates 4 l to 4 p are close to the outer rim of the mounting substrate 2 among the seven heat radiating plates 4 j to 4 p arranged on the outer peripheral edge side of the mounting substrate 2. The lateral width (W) of 4l to 4p is gradually increased from the heat sink 4p toward the heat sink 4l. These heat radiation plates 4l to 4p are adjusted to such a length that the leading edge approaches the outer peripheral edge of the mounting substrate 2 but does not protrude from the outer peripheral edge. Further, the heat radiation plates 4j to 4l have the same width (W). By using a plurality of heat sinks 4 having the same dimensions as described above, the labor involved in manufacturing the heat dissipation unit 9E is simplified and the manufacturing cost is reduced.

  Further, in the heat radiating unit 9E, the horizontal widths (W) of the seven heat radiating plates 4a to 4g arranged on the center side of the mounting substrate 2 are all equal. The heat radiating unit 9E is an array in which seven heat radiating plates 4a to 4g fixed to the outer peripheral surface side of the arcuate support 3C are widened toward the front end, and the front end edges of the heat radiating units are adjacent to each other. The air gap 29 is provided between the heat dissipating units 9E adjacent to each other by adjusting the length so as to approach the unit 9E but do not come into contact therewith. By using a plurality of heat sinks 4 having the same dimensions as described above, the labor involved in manufacturing the heat dissipation unit 9E is simplified and the manufacturing cost is reduced. However, this heat radiating unit can also arrange | position the heat sink 4 in a wider area | region, making the heat sink 4a, 4b arrange | positioned at the center part side of the mounting substrate 2 longer than the other heat sinks 4c-4g. .

[Example 6]
A heat radiator 10F shown in FIG. 22 includes a heat radiating unit 9F composed of the support 3C having the structure shown in FIG. 12 and 14 heat radiating plates 4. In the heat radiator 10 </ b> F of FIG. 22, the heat radiating units 9 </ b> F are arranged in such a posture that the outer peripheral surface side of the arcuate support 3 </ b> C faces the outer peripheral edge side of the mounting substrate 2. Each heat radiating unit 9F has an arcuate support 3C in a substantially parallel posture along the outer peripheral edge of the mounting substrate 2, in other words, the crossing angle α formed by the support 3C and the reference circle 21 is 0 degree. Are arranged as follows.

  In the heat radiating unit 9F, the widths (W) of the seven heat radiating plates 4a to 4g arranged on the outer peripheral edge side of the mounting substrate 2 are all equal. The heat radiating unit 9F is an array in which seven heat radiating plates 4a to 4g fixed to the outer peripheral surface side of the arc-shaped support 3C are widened toward the front end, and the front end edge thereof is the mounting substrate 2. The length is adjusted so as to approach the outer peripheral edge but not protrude from the outer peripheral edge. Thereby, in the outer peripheral edge part of the mounting board | substrate 2, the heat sink 4 is arrange | positioned in a wider area | region so that it can radiate heat ideally. Further, by using a plurality of heat radiating plates 4 having the same dimensions, the labor involved in manufacturing the heat radiating unit 9F is simplified and the manufacturing cost is reduced.

  Further, in the heat radiating unit 9F, the horizontal widths (W) of the seven heat radiating plates 4j to 4p arranged on the center side of the mounting substrate 2 are all equal. The heat radiating unit 9F is an array in which seven heat radiating plates 4j to 4p fixed to the inner peripheral surface side of the arc-shaped support 3C are tapered toward the front end, and the front end edge thereof is The ventilation gap 29 is provided between the heat radiating units 9C adjacent to each other by adjusting the length so as not to contact each other and not contacting the adjacent heat radiating units 9C. By using a plurality of heat sinks 4 having the same dimensions as described above, the labor involved in manufacturing the heat dissipation unit 9C is simplified and the manufacturing cost is reduced. Furthermore, since this heat radiator 10F can ensure a wide air gap 29 formed between the adjacent heat radiating units 9F, excellent air permeability can be realized.

[Example 7]
A radiator 10G shown in FIG. 23 includes a heat radiating unit 9G composed of the support 3B having the structure shown in FIG. This heat radiator 10G is provided with an even number (six in the figure) of heat dissipating units 9G, and these heat dissipating units 9G have different structures for odd and even numbers. The heat radiator 10G has the same shape as the first heat dissipating unit 9Gx in the odd-numbered heat dissipating units 9G and the same heat dissipating unit 9G as the second heat dissipating unit 9Gy. In the radiator 10G, a plurality of first heat radiating units Gx and a plurality of second heat radiating units Gy are arranged at equal intervals on the same circumference centering on the center of the mounting substrate 2, respectively. The radiator 10G of FIG. 23 arranges the three first heat radiating units 9Gx in an arrangement in which the three heat radiating units 9Gx are rotated and moved at intervals of 120 degrees, and the three second heat radiating units 9Gy are rotated and moved at intervals of 120 degrees. It is arranged in the following sequence.

  Further, in the radiator 10G shown in FIG. 23, the first heat radiating unit 9Gx and the second heat radiating unit 9Gy are arranged in such a posture that the outer peripheral surface side of the arcuate support 3B faces the outer peripheral edge side of the mounting substrate 2. The first heat radiating unit Gx and the second heat radiating unit 9Gy are arranged so that the arcuate support 3B has a substantially parallel posture along the outer peripheral edge of the mounting substrate 2, in other words, the intersection formed by the support 3B and the reference circle 21. It arrange | positions so that angle (alpha) may become 0 degree | times. However, the radiator can be arranged such that both the first heat radiating unit and the second heat radiating unit, or one of them, is arranged in such a posture that the outer peripheral surface side of the arc-shaped support body faces the central portion side of the mounting board. Can be arranged so as to have a posture intersecting the reference circle.

  In the first heat radiation unit 9Gx, the horizontal widths (W) of the nine heat radiation plates 4a to 4i arranged on the outer peripheral edge side of the mounting substrate 2 are all equal. The first heat radiating unit 9Gx is an array in which nine heat radiating plates 4a to 4i fixed to the outer peripheral surface side of the arcuate support 3B are widened toward the front end, and the front end edge is mounted. The length is adjusted so as to approach the outer peripheral edge of the substrate 2 but not protrude from the outer peripheral edge. The first heat radiating unit 9Gx has a width (W) of the seven heat radiating plates 4j to 4p arranged on the center side of the mounting substrate 2 from the heat radiating plates 4j and 4p on both sides to the central heat radiating plate 4m. The length is getting longer. The heat sinks 4j to 4p fixed to the inner peripheral surface side of the arcuate support 3B are arranged so as to expand toward the tip, and the heat sink 4j of the second heat radiating unit 9Gy whose tip edge is adjacent. The air gap 29 is provided between the adjacent second heat radiating unit 9Gy, adjusted to a length that approaches 4p but does not contact.

  In the second heat radiation unit 9Gy, the horizontal widths (W) of the nine heat radiation plates 4a to 4i disposed on the outer peripheral edge side of the mounting substrate 2 are all equal. The second heat radiating unit 9Gy is an array in which nine heat radiating plates 4a to 4i fixed to the outer peripheral surface side of the arcuate support 3B are widened toward the front end, and the front end edge is mounted. The length is adjusted so as to approach the outer peripheral edge of the substrate 2 but not protrude from the outer peripheral edge. The second heat radiating unit 9Gy has a width (W) of the seven heat radiating plates 4j to 4p arranged on the center side of the mounting substrate 2 from the central heat radiating plate 4m to the heat radiating plates 4j and 4p on both sides. The length is getting longer. The heat sinks 4j to 4p fixed to the inner peripheral surface side of the arcuate support 3B are arranged so as to expand toward the front end direction, and the front end edges thereof extend toward the center of the mounting substrate 2. However, the length is adjusted so as not to contact the heat radiating plate 4 of the adjacent first heat radiating unit 9Gx or the second heat radiating unit Gy, and a ventilation gap 29 is provided between the adjacent first heat radiating unit 9Gx.

[Example 8]
A heat radiator 10H shown in FIG. 24 includes a heat radiating unit 9H composed of a linear support 3H having a structure shown in FIG. 14 and 15 heat radiating plates 4. In the radiator 10H of FIG. 14, a plurality of radiator units 9H are arranged such that the crossing angle α formed by the linear support 3H and the reference circle 21 is 25 degrees to 35 degrees (about 30 degrees in the figure). ing.

  This heat radiating unit 9H has a width (W) of the heat radiating plates 4a to 4h so that the leading edges of the eight heat radiating plates 4a to 4h arranged on the outer peripheral edge side of the mounting substrate 2 approach the outer peripheral edge of the mounting substrate 2. Is gradually increased from the heat sink 4a toward the heat sink 4h. In particular, the radiator plates 4a to 4h fixed to one surface of the linear support 3H are parallel to each other, and their leading edges approach the outer peripheral edge of the mounting substrate 2, but protrude from the outer peripheral edge. The length is not adjusted. Thereby, in the outer peripheral edge part of the mounting board | substrate 2, the heat sink 4 is arrange | positioned in a wider area | region so that it can radiate heat ideally.

  Further, in the heat radiating unit 9H, the lateral width (W) of the seven heat radiating plates 4j to 4p arranged on the center side of the mounting substrate 2 is gradually increased from the heat radiating plate 4j toward the heat radiating plate 4p. The heat radiation plates 4j to 4p fixed to the other surface of the linear support 3H are adjusted to a length in which the tips of the heat radiation plates 4j to 4p approach each other but do not come into contact with the adjacent heat radiation unit 9H. Thus, a ventilation gap 29 is provided between the heat dissipating units 9H adjacent to each other. In particular, the innermost heat radiating plate 4 p has its tip edge approaching the center of the mounting substrate 2. As a result, the heat radiating plate 4 is also disposed in the region near the center of the mounting substrate 2 so that heat can be radiated ideally.

(Heat conduction member)
The heat radiator 10 of the above Examples 1-8 fixes the some heat radiating unit 9 to the 2nd surface 2Y of the mounting substrate 2 in the heat coupling | bonding state. The plurality of heat radiating units 9 interpose a heat conducting member between the support 3 and the mounting substrate 2 in order to realize an excellent thermal coupling state with respect to the mounting substrate 2. As such a thermal coupling member, grease or an adhesive excellent in thermal conductivity can be used. The heat dissipating unit 9 is fixed to the mounting substrate 2 in a state where a heat conducting member such as grease or adhesive is applied to the end face of the supporting member 3, or in a state where the supporting member 3 is fixed to the mounting substrate 2. A thermal conductive member such as grease or adhesive is applied to the boundary portion with the mounting substrate 2 and fixed in a thermally coupled state. Furthermore, the heat radiating unit can also fix a plurality of heat radiating plates protruding from the support to the mounting substrate in a thermally coupled state. In this heat radiating unit, a heat conducting member such as grease or adhesive is applied to the edge of the heat radiating plate, and the heat radiating plate is connected to the mounting substrate in a thermally coupled state. Since this structure can conduct the heat of the mounting substrate directly to the heat radiating plate, the heat radiating property of the heat radiating unit can be further improved.

  Furthermore, the heat conductive member 25 interposed between the heat radiating unit and the mounting board can be a heat conductive sheet 25A as shown in FIG. The heat conductive sheet 25 </ b> A is a sheet material having excellent heat conductivity, and preferably has elasticity that makes contact with the support 3 and the heat radiating plate 4 that are fixed to the mounting substrate 2 in a pressed state. Sheet material is used. As such a heat conductive sheet 25A, for example, a silicon sheet, a plastic sheet, or the like can be used. The heat conductive sheet 25 </ b> A is stacked between the heat radiation unit 9 on the second surface 2 </ b> Y of the mounting substrate 2 and is connected in close contact with the end surface of the support 3 and the edge of the heat dissipation plate 4. As described above, the structure in which the heat conductive sheet 25A is disposed between the mounting substrate 2 and the heat dissipation unit 9 has a structure in which the fixing screw 14 penetrating the mounting substrate 2 and the heat conductive sheet 25A is provided as shown in FIG. The heat dissipation unit 9 can be fixed to the mounting substrate 2 by being screwed into the connecting portion 32.

(Back plate 5)
Furthermore, the radiator 10 of FIGS. 1 to 5 includes a metal back plate 5 disposed on the back surface side of the mounting substrate 2 so as to be spaced apart substantially in parallel. In the radiator 10, a plurality of heat dissipation units 9 are arranged between the mounting substrate 2 and the back plate 5, and the mounting substrate 2 and the back plate 5 are connected by the support 3 of these heat dissipation units 9. ing.

  The back plate 5 has a shape along the outer periphery of the plurality of heat radiation units 9 fixed to the mounting substrate 2 and has a circular outer shape as shown in FIGS. 4 and 5. Further, the circular back plate 5 has a central hole 52 opened at the center, and the entire shape is a donut shape. The back plate 5 also has a plurality of back plate vents 53 at the outer periphery of the donut shape. The plurality of back plate vents 53 are opened to face the plurality of supports 3 fixed to the mounting substrate 2 and the plurality of heat sinks 4 fixed to the support 3. 4 is used as a ventilation port for discharging the air heated by the heat radiation of 4 to the outside. The internal air heated by the heat radiated from the radiator 10 rises by natural convection. Since the back plate 5 shown in the figure is fixed to the upper surface of the radiator 10, the heated internal air is discharged from the back plate vent 53 opened in the back plate 5 and ventilated.

  The above back plate 5 is fixed to the support 3 via the fixing screw 15 and fixed to a fixed position of the radiator 10. The back plate 5 shown in the figure has a plurality of fixing holes 54 through which the fixing screw 15 passes. The plurality of fixing holes 54 are opened to face the connecting portion 32 provided in the support 3, and the fixing screw 15 that penetrates the back plate 5 is screwed into the connecting portion 32 of the support 3 to support the back plate 5. It is fixed to the body 3. That is, the back plate 5 is fixed to the mounting substrate 2 via the support 3.

  Furthermore, the back plate 5 shown in the drawing is provided with a protruding piece 51 that faces both sides and protrudes in the outer peripheral direction, and the leading end side of the protruding piece 51 is bent upward. For example, the protruding piece 51 is used as a fixture for fixing the lighting device, or, as shown in FIG. 1, is also used as a member for fixing the power supply unit 6 arranged outside. However, the back plate does not necessarily need to be provided with a protruding piece, and can be fixed to the upper surface of a plurality of heat radiation units as a disk.

(Exterior cover 18)
Furthermore, the illuminating device can also include an exterior cover 18 that covers the outer periphery of the radiator 10 as indicated by a chain line in FIG. The exterior cover 18 is disposed along the outer periphery of the radiator 10 disposed on the back side of the mounting substrate 2 and covers the periphery of the radiator 10. The exterior cover 18 can be, for example, a cylindrical cylinder along the outer peripheral edge of the fixing ring 7 to which the mounting substrate 2 is fixed. The outer cover 18 shown in FIG. 1 has a cylindrical shape along the outer peripheral edge of the flange portion 7 </ b> C protruding outward from the upper end edge of the fixing ring 7. The outer cover 18 is preferably arranged in a state where a gap is provided between the outer cover 18 and the heat radiating unit 9 arranged inside. The cylindrical outer cover 18 can be fixed at a fixed position of the lighting device by fixing the lower end to the fixing ring 7 and fixing the upper end to the protruding piece 51 of the back plate 5. The exterior cover 18 can be provided with a vent so that the outside air can pass through the radiator 10. Such an exterior cover can be provided with ventilation holes by opening slits or through-holes, or can be made of a mesh material and provided with ventilation holes. The outer cover described above can be made of metal or plastic to reinforce the outer periphery of the lighting device.

(Modifications of mounting substrate, reflector, and transparent cover)
Further, in the lighting device shown in FIGS. 26 and 27, the mounting substrate 2, the reflection plate 16, and the transparent cover 8 are provided with openings. The mounting substrate 2 shown in FIG. 27 is located between the semiconductor light emitting elements 1 fixed to the mounting surface 2X, and has a plurality of substrate vents 2B. These substrate vents 2 </ b> B are provided to face the plurality of heat radiating plates 4 of the heat radiating unit 9 fixed to the mounting substrate 2. Further, the reflecting plate 16 shown in FIG. 27 is located between the guide holes 16A for exposing the cover cap 11 and opens a plurality of reflecting plate vents 16B. The plurality of reflecting plate vents 16B opened in the reflecting plate 16 are opened at positions facing the plurality of substrate vents 2B opened in the mounting substrate 2, and are substantially equal to the substrate vent 2B of the mounting substrate 2. It is formed in shape and size. As a result, air that passes through the reflector vent 16B of the reflector 16 and the substrate vent 2B of the mounting board 2 can be efficiently passed to the back side of the mounting board 2 to ventilate the radiator 10. The substrate vent 2B and the reflector vent 16B provided in the mounting substrate 2 and the reflector 16 shown in FIG. 27 are formed in an oval shape extending from the outer peripheral edge toward the center, and the opening area is increased. Furthermore, the transparent cover 8 shown in the drawing is provided with a plurality of cover vents 8B opened on a low cylindrical side surface. In the above lighting device, as shown by the arrows in FIG. It can be passed through the vent 2 </ b> B to flow into the radiator 10 and discharged from the upper surface side of the radiator 10 to the outside. This structure realizes ventilation from the lower part to the upper part of the radiator 10 and realizes excellent heat dissipation.

The heat dissipation characteristics of the lighting device of the present invention were measured as follows.
As the lighting device, the lighting device having the structure according to Example 1 shown in FIGS. 1 to 9 was used. As the semiconductor light emitting element 1, six semiconductor light emitting elements of COB (chip on board) type with an output of 28W were used, and the output of the entire lighting device was set to 168W. For the mounting substrate 2, an aluminum metal plate was used. On the second surface 2Y of the mounting substrate 2, a heat conductive sheet 25A made of a silicon sheet having a thickness of 2 mm and a heat conductivity of 3 W / (m · K) is laminated as the heat conductive member 25. Six heat dissipation units 9 were fixed with 25A interposed. As shown in FIG. 7, the six heat dissipation units 9 are disposed on the back side of the six semiconductor light emitting elements 1 disposed on the mounting surface 2 </ b> X so that the center portion of the support 3 is located. . A heat radiating plate 4 having a structure shown in FIGS. 8 to 10 was fixed to each heat radiating unit 9. The total length (L) of the support 3 constituting each heat radiation unit 9 and the total length (D) of the plurality of heat radiation plates 4 were 150 mm. The temperature at each measurement point was measured using a thermocouple. As shown in FIG. 6, the temperature of the semiconductor light emitting device 1 was measured at a position indicated by points A and B for two series of semiconductor light emitting devices 1 connected in series. The temperature of the mounting substrate 2 was measured at a position indicated by a point C in FIG. The temperature of the heat radiating plate 4 was measured at a site near the center in the width direction and close to the mounting substrate 2 as indicated by a point T in FIGS. 7 and 9. The ambient temperature was measured at 25 ° C. The above measurement results are shown in Table 1 and the graph of FIG.

  As shown in Table 1 and FIG. 28, in the state where the lighting device is continuously used, the temperature of the semiconductor light emitting element 1 is saturated at 75 ° C. to 79 ° C. after 30 minutes, and the temperature rise is suppressed. Considering the adverse effect on the semiconductor light emitting element 1, this temperature is a temperature level that is substantially free of problems. When the semiconductor light emitting element 1 is used for a long time, the temperature of the semiconductor light emitting element 1 is reliable. It has been demonstrated that the temperature range can be guaranteed.

  Moreover, it is a heat radiator used for the conventional lighting apparatus, Comparing its weight with a heat radiator having an aluminum heat radiation fin having the same surface area as the heat radiator shown in FIGS. The heat radiation fin made of aluminum is 506 g × 6 pieces = 3036 g, whereas the heat radiation unit of the radiator of the present invention can be made 260 g × 6 pieces = 1560 g, and a weight reduction of about ½ is realized.

  The illuminating device and the radiator for the illuminating device of the present invention can be suitably used for factory lighting, street lamps, and the like as alternative illuminating devices such as mercury lamps. In particular, the illumination device and the radiator for the illumination device of the present invention have a structure that uses a semiconductor light emitting element such as an LED as a light source, and realizes excellent heat dissipation characteristics and weight reduction, and is installed at a high place. Can be suitably used.

DESCRIPTION OF SYMBOLS 1 ... Semiconductor light-emitting element 2 ... Mounting board 2X ... Mounting surface; 2Y ... 2nd surface 2B ... Substrate vent 3 ... Support body 3A, 3B, 3C, 3D, 3H, 3I, 3J ... Support body 4 ... Heat sink 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i ... radiator plate 4j, 4k, 4l, 4m, 4n, 4o, 4p ... radiator plate 4X ... insertion connecting part 4Y ... connecting piece 5 ... back plate 6 ... power supply Part 7 ... Fixing ring 7A ... Inner ring; 7B ... Fixing piece; 7C ... Flange part 8 ... Transparent cover 8B ... Cover vent 9 ... Heat radiation unit 9A, 9B, 9C, 9D, 9E, 9F, 9G, 9H ... Heat radiation unit 9Gx: first heat radiating unit; 9Gy: second heat radiating unit 10: heatsinks 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H ... heatsink 11: cover cap 11A: cylinder part; 11B: cover part; ... Fixed piece 1 ... Blocking material 13 ... Set screw 14 ... Fixing screw 15 ... Fixing screw 16 ... Reflector plate 16A ... Guide hole; 16B ... Reflector plate vent 17 ... Set screw 18 ... Exterior cover 21 ... Reference circle 22 ... Through hole 23 ... Screw hole 24 ... fixed hole 25 ... heat conduction member 25A ... heat conduction sheet 29 ... ventilation gap 31 ... main body part 32 ... connection part 33 ... opening 34 ... connection groove 35 ... opposite wall 36 ... heat conduction part 36A ... opening part; 36B ... Hollow portion 37 ... Body portion 38 ... Body portion 51 ... Projection piece 52 ... Center hole 53 ... Rear plate vent 54 ... Fixing hole 60 ... Power supply circuit 61 ... Case 62 ... Power supply cable 63 ... Lead wire 64 ... Connection lead m ... Extension Line s ... tangent p ... intersection

Claims (37)

One or more semiconductor light emitting devices;
A mounting substrate on which the semiconductor light emitting element is mounted on a mounting surface;
A power supply unit for adjusting power supplied to the semiconductor light emitting element;
A metal support fixed in a thermally coupled state to the second surface of the mounting substrate;
A lighting device comprising a plurality of heat sinks fixed in a thermally coupled state to the support,
The lighting device, wherein the heat radiating plate is made of paper containing carbon. A lighting device according to claim 1,
The support is plate-shaped and is disposed in a substantially vertical posture with respect to the mounting substrate.
The lighting device, wherein the plurality of heat radiating plates are fixed so as to protrude from a surface of the support. A lighting device according to claim 2,
The lighting device according to claim 1, wherein the plurality of heat radiating plates are fixed to both surfaces of the support body in a posture in which adjacent heat radiating plates are separated from each other. A lighting device according to claim 2 or 3,
The plurality of heat dissipation plates are arranged in a substantially vertical posture with respect to the mounting substrate. It is an illuminating device as described in any one of Claims 1-4,
A plurality of rows of connecting grooves extending in the axial direction are formed substantially parallel to each other, and the support body is formed by inserting and fixing the side edges of the heat radiating plates in the respective connecting grooves. . It is an illuminating device as described in any one of Claims 1-5,
The said heat sink is connected with said 2nd surface in the heat coupling state, The illuminating device characterized by the above-mentioned. It is an illuminating device as described in any one of Claims 1-6,
The illuminating device, wherein the support is disposed on a second surface of the mounting substrate and corresponding to a position where the semiconductor light emitting element is mounted on the mounting surface. A lighting device according to claim 7,
The lighting device according to claim 1, wherein the support includes a heat conducting portion that increases a contact area with the second surface at a portion corresponding to a position where the semiconductor light emitting element is mounted. It is an illuminating device as described in any one of Claims 1-8,
The support includes a plate-like main body having an arc shape in cross section, and connecting portions connected to both side portions of the main body, and the support is connected to the mounting substrate via the connecting portions. An illuminating device fixed to the lighting device. It is an illuminating device as described in any one of Claims 1-9,
A heat radiating unit is composed of one support and a plurality of heat radiating plates fixed to the support.
A lighting device comprising a plurality of the heat dissipating units arranged on the second surface of the mounting substrate. The lighting device according to claim 10,
A lighting device, wherein a ventilation gap is provided between adjacent heat dissipation units. A lighting device according to claim 10 or 11,
The lighting device, wherein the plurality of heat dissipation units are arranged on the second surface of the mounting substrate at equal intervals on the circumference. A lighting device according to claim 12,
The plurality of heat radiation units have the same shape, and each heat radiation unit is disposed on a locus of rotation with respect to the center of the mounting board. It is an illuminating device as described in any one of Claims 10-13,
In the heat dissipation unit, a plurality of heat dissipation plates are fixed to both surfaces of the support, and one surface of the support is opposed to the outer peripheral edge of the mounting substrate, and the other surface is opposed to the central portion of the mounting substrate. Fixed to the second surface in a posture to
The front edges of the plurality of heat sinks arranged on the outer peripheral side of the mounting substrate are extended close to the outer peripheral edge of the mounting substrate in plan view,
A lighting device, wherein a front end edge of a heat dissipating plate disposed on a central portion side of the mounting substrate is extended close to the central portion of the mounting substrate in a plan view. It is an illuminating device as described in any one of Claims 10-14,
An even number of the heat dissipation units are provided,
The odd-numbered heat dissipating units have the same shape as the first heat dissipating unit, and are arranged at equal intervals on the circumference,
An illuminating device characterized in that even-numbered heat radiation units have the same shape as the second heat radiation unit and are arranged at equal intervals on the circumference. The lighting device according to any one of claims 10 to 15, further comprising:
It is provided with a metal back plate disposed on the back side of the mounting substrate so as to be spaced substantially parallel to each other,
A plurality of heat dissipating units are disposed between the mounting substrate and the back plate, and the mounting substrate and the back plate are connected by a support of the heat dissipating unit. . A lighting device according to claim 16, comprising:
A lighting device, wherein a back plate vent is opened in the back plate. It is an illuminating device as described in any one of Claims 1-17,
The lighting device, wherein the mounting substrate is formed by opening a substrate vent so as to face the plurality of heat radiation plates fixed to the support. It is an illuminating device as described in any one of Claims 1-18,
The heat radiation plate has a thermal conductivity of 15 W / (m · K) or more. One or more semiconductor light emitting elements are connected to a lighting device including a mounting substrate mounted on a mounting surface, and a heat radiator for radiating heat generated from the semiconductor light emitting elements,
On the back side of the mounting surface of the mounting substrate, a metal support having a fixing structure for fixing to the mounting substrate in a thermally coupled state;
A plurality of heat sinks fixed in a thermally coupled state to the support,
The radiator for an illuminating device, wherein the radiator plate is made of paper containing carbon. A radiator for a lighting device according to claim 20,
The support is plate-shaped and disposed in a substantially vertical posture with respect to the mounting substrate,
A radiator for an illuminating device, wherein the plurality of radiator plates are fixed so as to protrude from a surface of the support. A radiator for a lighting device according to claim 21,
The radiator for the lighting device, wherein the plurality of heat radiating plates are fixed to both surfaces of the support in a posture in which adjacent heat radiating plates are separated from each other. A radiator for a lighting device according to claim 21 or 22,
The radiator for the lighting device, wherein the plurality of heat sinks are arranged in a substantially vertical posture with respect to the mounting substrate. A radiator for a lighting device according to claim 20-23,
A plurality of rows of connecting grooves extending in the axial direction are formed substantially parallel to each other, and the support body is formed by inserting and fixing the side edges of the heat radiating plates in the respective connecting grooves. Heatsink. A radiator for a lighting device according to any one of claims 20 to 24,
A radiator for an illuminating device, wherein the radiator plate is connected to the second surface of the mounting substrate in a thermally coupled state. A radiator for a lighting device according to any one of claims 20 to 25,
The radiator for an illuminating device, wherein the support is a second surface of the mounting substrate and is disposed at a position corresponding to a position where the semiconductor light emitting element is mounted on the mounting surface. It is an illuminating device as described in any one of Claims 20-26, Comprising:
The said support body is provided with the heat conductive part which enlarges a contact area with a mounting substrate, The illuminating device characterized by the above-mentioned. A radiator for a lighting device according to any one of claims 20 to 27, wherein:
The support includes a plate-like main body having an arc shape in cross section, and a connecting portion connected to both sides of the main body, and the support is attached to the mounting substrate via the connecting portion. A radiator for a lighting device, characterized by being fixed. A radiator for a lighting device according to any one of claims 20 to 28,
A heat radiating unit is composed of one support and a plurality of heat radiating plates fixed to the support.
A radiator for an illuminating device, wherein a plurality of the radiation units are arranged on a second surface of a mounting substrate. A radiator for a lighting device according to claim 29,
A radiator for an illuminating device, wherein a ventilation gap is provided between adjacent radiator units. A radiator for a lighting device according to claim 29 or 30,
The radiator for a lighting device, wherein the plurality of heat dissipation units are arranged on the second surface of the mounting substrate at equal intervals on the circumference. A radiator for a lighting device according to claim 31,
The radiator for the lighting device, wherein the plurality of heat radiation units have the same shape, and each heat radiation unit is arranged on a locus of rotation with respect to the center of the mounting substrate. A radiator for a lighting device according to any one of claims 29 to 32,
In the heat dissipation unit, a plurality of heat dissipation plates are fixed to both surfaces of the support, and one surface of the support is opposed to the outer peripheral edge of the mounting substrate, and the other surface is opposed to the central portion of the mounting substrate. Is fixed to the mounting board in a posture
The front edges of the plurality of heat sinks arranged on the outer peripheral side of the mounting substrate are extended close to the outer peripheral edge of the mounting substrate in plan view,
A radiator for an illuminating device, wherein a front end edge of a heat radiating plate disposed on a central portion side of the mounting substrate is extended close to the central portion of the mounting substrate in a plan view. A radiator for a lighting device according to any one of claims 29 to 33,
An even number of the heat dissipation units are provided,
The odd-numbered heat dissipating units have the same shape as the first heat dissipating unit, and are arranged at equal intervals on the circumference,
A radiator for an illuminating device, characterized in that the even-numbered heat dissipating units have the same shape as the second heat dissipating unit and are arranged at equal intervals on the circumference. A radiator for a lighting device according to any one of claims 29 to 34, further comprising:
It is equipped with a metal back plate that is arranged on the back side of the mounting substrate so as to be spaced substantially parallel to each other.
A plurality of heat dissipating units are disposed between the mounting substrate and the back plate, and the mounting substrate and the back plate are connected by a support of the heat dissipating unit. Radiator. A radiator for a lighting device according to claim 35,
A radiator for a lighting device, wherein a back plate vent is opened in the back plate. A radiator for a lighting device according to any one of claims 20 to 36,
A heat radiator for a lighting device, wherein the heat dissipation plate has a thermal conductivity of 15 W / (m · K) or more.

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