JP2016006216A - Electroplating device by clamp feeding of electropeeling clamp deposition metal in the same tank - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electroplating device where electroplating to the body to be plated by clamp feeding and the electroplating of a metal deposited to the feeding contact part of a clamp in the electroplating process are simultaneously performed in parallel in the same tank, and the molten metal peeled from the feeding contact part of the clamp in the electropeeling process is effectively activated in the electroplating process.SOLUTION: The inside of the same electrolytic tank 1 is provided with an electroplating process A by the clamp feeding of a cathode and an electropeeling process B, and a metal deposited to the feeding contact part 4 of a clamp 3 in the electroplating process A is electrolytically peeled from the feeding contact part 4 fed with the current of the anode in the returning process of the clamp 3. The cathode as a counter electrode is made covalent in the electroplating process A and the electropeeling process B. The feeding contact part 4 of the clamp 3 is formed with titanium. Further, preferably, platinum or iridium is formed at the feeding contact part 4 made of titanium by covering.

Description

  The present invention relates to an apparatus for peeling a metal adhering to a clamp by electrolytic plating using a clamp power supply by electrolysis in a return stroke of the clamp.

  In the electrolytic processing apparatus of Patent Document 1, individual clamps that are driven to rotate endlessly are separated from the electrolytic chamber in which metal is electrodeposited onto a plate-like object such as a circuit board through a return path of the clamps. There has been disclosed a technique of passing through an electrolytic solution in a removal chamber and removing metal adhering to a clamp in the electrolytic chamber by electrolysis in a metal removal chamber of a separate tank. However, since the tank partition wall of the electrolysis chamber and the metal removal chamber is interposed in the transport path and return path of the clamp that is driven to rotate endlessly, the clamp that is rotationally driven is connected to the electrolysis chamber and the metal removal chamber. It was technically difficult to pass through.

  In order to solve this problem, the present applicant has already attached a plurality of clamps that are attached to a circular driving means that is continuously driven in an endless manner and moved around at a constant height level to the clamps in the return path of the clamps. Even when passing through the treatment liquid of the metal stripping treatment tank that peels off the attached components such as attached metal and stripping off the attached components such as metal attached to the clamp, the space between the electrolytic plating treatment tank and the metal peeling treatment tank Has proposed a device that allows the clamp to smoothly pass through a moving path in which the tank partition wall is interposed, and can significantly reduce the outflow of the processing liquid from the electrolytic plating processing tank and the metal stripping processing tank (Patent Document 2).

Japanese Patent Laid-Open No. 63-76898 (Japanese Patent Publication No. 6-31476) JP2013-249527A

  In the electroplating apparatus of Patent Documents 1 and 2 of the background art, the metal adhering to the clamp in the electroplating process of the electroplating tank passes through the liquid in a tank separate from the electroplating tank in the return path of the clamp, The metal attached to the clamp is peeled off.

  For this reason, the tank shape is complicated, the conveyance machine and conveyance equipment such as the passage of the tank partition are complicated, there is a risk of mixing with a peeling solution (chemical), and there are various problems such as difficulty in managing the apparatus.

  In view of such circumstances, the main problem to be solved by the present invention is that electrolytic plating on the object to be plated by clamp power feeding and peeling of the metal attached to the power feeding contact portion of the clamp in the electrolytic plating process within the same tank. In addition to providing an electroplating apparatus that can simplify the tank shape, simplify the transport machine and transport equipment, eliminate the need for a stripping chemical, and manage the apparatus easily. In the starting position of the above, there is provided an electroplating apparatus capable of improving the quality of electroplating by the clamp power supply in a state in which the attached metal of the power supply contact portion of the clamp is always peeled off.

  In order to solve the above-described problems, the present invention (invention of claim 1) is provided with a clamp moving means for continuously moving a plurality of clamps along a circulation path, and the electrolyte in the same electrolytic cell is placed in the electrolytic solution. The power supply contact portion is configured to continuously move in a circulation path that enters the plating process again after a return process after moving the plating process, and the clamp that moves the plating process is disposed in the air and is connected to the cathode. The upper part of the clamp is moved in contact with the plating power supply rail supplied with current in the air, the cathode current is supplied from the plating power supply rail to the power supply contact portion in the electrolyte, and the cathode current is supplied. The end of the object to be plated is gripped by the power supply contact part, and the object to be plated which is gripped by the power supply contact part and supplied with the current of the cathode is disposed in the electrolyte during the plating process. Anode for plating An electroplating apparatus for electrodepositing the metal deposited from the plating anode in this transport process on the surface of the object to be plated with the polarity of the cathode fed, and moving the return stroke Is moved while the upper part of the clamp is in contact with the peeling power supply rail disposed in the air and supplied with the anode current in the air, and the anode current flows from the peeling power supply rail to the power supply contact portion in the electrolyte. Clamp power supply for electrolytically peeling the metal attached to the clamp in the same tank so that the deposited metal adhering to the power supply contact part in the plating process can be dissolved and peeled off from the power supply contact part of the anode moving in the return process by electrolysis An electrolytic plating apparatus is provided.

  Further, the present invention (invention of claim 2) is provided with clamp moving means for continuously moving a plurality of clamps in the circulation path on both sides with the conveyance path of the object to be plated in the plating process. The clamp that moves the plating stroke is configured to continuously move in the electrolyte path in the inner circuit and continuously move around the return path through the return stroke after the feeding contact portion of the clamp moves through the plating stroke. The upper part of the clamp is moved in contact with the plating power supply rail disposed in the air and supplied with the cathode current, and the cathode current is supplied from the plating power supply rail to the power supply contact portion in the electrolytic solution. The left and right ends of the object to be plated are gripped at the power supply contact portion to which the cathode current is supplied, and the object to be plated which is held at the power supply contact portion and supplied with the cathode current is plated. Electricity of process It is transported horizontally in one direction between the upper and lower pairs of plating anodes arranged in the liquid, and the metal deposited from the plating anode in this transport process is electrodeposited on the surface of the object to be plated with the cathode polarity fed The clamp that moves in the return stroke moves while the upper part of the clamp is in contact with the feeding rail that is disposed in the air and is supplied with the anode current. The anode current is supplied from the power supply rail to the power supply contact part in the electrolyte, and the deposited metal adhering to the power supply contact part in the plating process can be dissolved and separated by electrolysis from the power supply contact part of the anode moving in the return process. Provided is an electroplating apparatus using clamp power feeding for electrolytically peeling the metal attached to the clamp in the same tank.

  Further, according to the present invention (invention of claim 3), the clamp is made of titanium as a material for the current-carrying portion at the lower part of the clamp including the power-feeding contact portion placed in the electrolyte, and the titanium power-feeding contact portion of the clamp is provided. Provided is an electroplating apparatus using clamp power feeding, in which a current-carrying portion at a lower portion of the clamp is covered with an insulator, and a power supply contact portion of the clamp is formed of titanium, and the metal attached to the clamp is electrolytically peeled off in the same tank.

  Further, the present invention (invention of claim 4) is based on clamp power feeding in which the titanium power supply contact portion of the clamp is coated with platinum, and this platinum is used as the power supply contact portion, and the clamp adhering metal is electrolytically peeled off in the same tank. An electrolytic plating apparatus is provided.

  Further, according to the present invention (invention of claim 5), the titanium power supply contact portion of the clamp is coated with iridium, and this iridium is used as the power supply contact portion. An electrolytic plating apparatus is provided.

  According to the present invention (invention of claim 6), the positive electrode (positive electrode) of the plating rectifier and the plating anode composed of an insoluble anode are electrically connected, and the negative electrode (negative electrode) of the plating rectifier and the above-mentioned The plating power supply rail is electrically connected, the cathode current is supplied to the clamp that moves in the plating process while being in contact with the plating power supply rail, and the positive electrode (plus electrode) of the separation rectifier and the separation power supply rail are connected to each other. Electrically connected, electrically connected the negative electrode (minus electrode) of the stripping rectifier and the feeding rail for plating, and supplied the anode current to the clamp that moved in the return stroke while being in contact with the stripping rail However, a clamp that moves in a return stroke that is fed with an anode current is connected to a cathode that is fed from a clamp that moves in a plating stroke that is fed a current of the opposite polarity. Provided is an electroplating apparatus using clamp power supply for electrolytically peeling a metal attached to a clamp in the same tank so that the metal attached to the power supply contact portion of the clamp constituting the anode can be dissolved and peeled by electrolysis using the body as a counter electrode. .

  In the present invention, the plating power supply rail is formed by a plurality of power supply rails separated in the conveying direction of the object to be plated in the plating process, and a plating rectifier is provided corresponding to the plurality of separated power supply rails for plating. Each of the plating anodes is provided as an insoluble anode in which a plurality of the plating anodes are arranged side by side at a predetermined interval in the conveying direction of the object to be plated in the plating process. Each of the power supply rails is electrically connected, and the positive electrode (positive electrode) of each plating rectifier is electrically connected to each of the plating anodes disposed in the vicinity of the corresponding power supply rail for plating. The cathode current is supplied to the clamp that moves in the plating process while being in contact with the power supply rail, and the positive electrode (plus electrode) of the stripping rectifier and the stripping feed The rail is electrically connected, and the negative electrode (minus electrode) of the stripping rectifier is electrically connected to each of the feeding rails for plating, and the anode is attached to the clamp that moves in the return stroke while being in contact with the stripping rail. The clamp that moves the return stroke that is fed with the current of the anode and that is fed with the current of the anode uses the cathode to be plated fed from the clamp that moves the plating stroke that is fed with the current of the opposite polarity as the counter electrode, Disclosed is an electroplating apparatus using clamp power feeding, in which a metal attached to a power supply contact portion of a clamp constituting an anode can be dissolved and peeled off by electrolysis, and the metal attached to the clamp is electrolytically peeled off in the same tank.

  Further, according to the present invention (invention of claim 7), the clamp that moves in the plating process moves while being slid and guided by the power supply rail for plating, and the clamp that moves in the return process is guided by the power supply rail for peeling. The plating power supply rail and the peeling power supply rail are connected in a state where they are not electrically connected via a resin insulating rail, while being in sliding contact with each other. Provided is an electroplating apparatus using clamp power feeding, in which a stripping power supply rail and an insulating rail are connected to each other to form a continuous path rail, and electrolytically peel off a metal adhering to a clamp in the same tank.

  According to the electroplating apparatus of the present invention, the electroplating of the object to be plated by clamp feeding in the same electrolytic bath and the electrolytic peeling of the metal attached to the power feeding contact portion of the clamp in the electroplating process can be performed simultaneously. . Therefore, the electrolytic plating apparatus of the present invention can simplify the tank shape, simplify the transport machine and transport equipment, does not require a stripping chemical solution, and is easy to manage the apparatus. In addition, since the feeding contact portion of the clamp that moves around the electrolytic plating process and the return process (electrolytic peeling process) is always in a state where the attached metal is peeled off at the start position of the electrolytic plating process that has passed through the electrolytic peeling process. The quality of electrolytic plating by clamp power supply can be improved.

  Further, according to the present invention (invention of claim 3), since the feeding contact portion of the clamp is formed of titanium, in the plating process, the cathode current can be fed from the titanium feeding contact portion to the object to be plated, and the return Even in the process (electrolytic peeling process), the titanium power supply contact part itself constituting the anode is not melted by electrolysis, and only the metal (for example, copper in the case of copper plating) attached to the power supply contact part in the plating process is electrolyzed. Can dissolve and peel efficiently.

  Further, according to the present invention (inventions of claims 4 and 5), if the power feeding contact portion made of titanium is coated with platinum or iridium, it is lower than the case where the power feeding contact portion is made of titanium. Since a current of the same magnitude can be supplied even with a voltage (about one third of the voltage), the cathode current can be supplied efficiently from the power supply contact point to the object to be plated in the plating process, and in the return process (electrolytic peeling process) However, the power supply contact portion itself constituting the anode is not melted by electrolysis, and only the metal (for example, copper in the case of copper plating) adhering to the power supply contact portion in the plating process can be dissolved and peeled more efficiently by electrolysis.

  Furthermore, according to the present invention (the invention of claim 6), the clamp that moves the return stroke (electrolytic stripping stroke) fed with the anode current moves the plating stroke that is supplied with the current of the opposite polarity. Using the cathode to be plated fed from the clamp as a counter electrode, the metal attached to the feeding contact portion of the clamp constituting the anode can be dissolved and peeled off by electrolysis. Thus, since the cathode as the counter electrode is shared (shared) in the electrolytic plating process and the electrolytic stripping process, the molten metal (for example, dissolved Cu) that has been melted and stripped from the power supply contact portion in the return process (electrolytic stripping process) Moves in the electrolyte toward the object to be plated that moves in the plating process, and is electrodeposited on the object to be plated that moves in the plating process. Therefore, the molten metal (for example, molten Cu) peeled off from the power supply contact portion of the clamp in the return stroke (electrolytic peeling stroke) can be effectively used, and the efficiency of electrolytic plating and electrolytic peeling can be improved. This is a great advantage resulting from performing the electrolytic plating process and the electrolytic stripping process in the same electrolytic cell.

It is a schematic plan view of this apparatus. It is a schematic side view of this apparatus. The Example of a clamp is shown, (A) is a side view, (B) is a front view. It is explanatory drawing of the electric power feeding contact part of a clamp.

  A preferred embodiment of the present invention will be described with reference to FIGS. The electrolytic plating apparatus shown in FIGS. 1 and 2 has both sides of a clamp moving means 2 in which a plurality of clamps 3 continuously move along a circulation path, with a conveyance path of a plating object P (for example, a printed wiring board) in the plating process A in between. The power supply contact 4 of the clamp 3 is disposed in the electrolyte W in the same electrolytic cell 1 (as shown in FIGS. 3 and 4, the lower part of the clamp 3 excluding the power supply contact 4 is the electrolyte. Is covered with the insulator 5 over the liquid level of W.) After moving in the plating process A, the circuit moves continuously through the return path B, and then enters the plating process A again. The clamp 3 that moves in the plating step A moves along the plating power supply rail 6 that is disposed in the air and supplied with a cathode current, while the upper portion of the clamp 3 is in sliding contact in the air. From electrolyte rail 6 for electrolyte W A cathode current is supplied to the power supply contact portion 4, and the left and right ends of the object P to be plated are gripped by the power supply contact portion 4 to which the cathode current is supplied. An object between the upper and lower pairs of plating anodes (insoluble anodes) 7 (upper anode 7A, lower anode 7B) disposed in the electrolytic solution W in the plating process A is unidirectionally provided by the object P to which the cathode current is supplied. The metal which is horizontally transported and deposited from the upper and lower plating anodes (insoluble anodes) 7 in this transport process is electrodeposited on the surface of the object to be plated P to which the polarity of the cathode is fed.

  The clamp moving means 2 displays a large number of clamps 3 (in FIG. 1, the clamp 3 is shown only in a partial range of the circulation path C) at equal intervals to a drive chain 8 (see FIG. 3) driven endlessly. Are attached at equal intervals over the entire range of the circulation path C.). The drive chain 8 is hung on a sprocket (not shown), and one of the sprockets is rotationally driven by a conveyance drive motor (not shown) to be driven endlessly. The clamp moving means 2 and 2 provided on both sides of the conveying path of the plating process A are configured to be driven around at the same speed. The conveyance speed of the object P to be plated by the clamp moving means 2 and 2 is 0.5 m to 2 m per minute, and the conveyance speed can be changed depending on the plating process conditions of the object P to be plated.

  FIG. 1 shows that an object to be plated (printed wiring board) P is supplied to the electrolytic cell 1 from the left side by a loading means such as a loading drive roller in a horizontal state with the plate surface up and down, and the electrolytic cell 1 is continuously in a horizontal state. FIG. 2 shows a schematic plan view of the apparatus which is transported in the direction of the arrow and passed to the right from the electrolytic cell 1 by an unloading means such as an unloading drive roller after the electrolytic plating process. In addition, a horizontally long inlet (not shown) for carrying the object P to be plated in the horizontal state into the electrolytic cell 1 and a horizontally long outlet (not shown) for carrying out the object P to be plated in the horizontal state from the electrolytic cell 1. ), Upper and lower seal rollers (not shown) are horizontally disposed inside the electrolytic cell 1 corresponding to the carry-in port and the carry-out port so that the electrolyte W does not flow out from the carry-in port or the carry-out port. It is sealed.

  A clamp 3 that moves in a return stroke (electrolytic stripping stroke) B surrounded by a two-dot chain line in FIGS. 1 and 2 is disposed in the air and is along the peeling power supply rail 10 that is supplied with an anode current. Thus, the upper part of the clamp 3 moves while being in sliding contact with the air, and the anode current is supplied from the peeling power supply rail 10 to the power supply contact part 4 in the electrolyte W, and adheres to the power supply contact part 4 in the plating process A. The deposited metal was dissolved and separated from the clamp contact portion 4 of the anode moving in the return stroke (electrolytic peeling stroke) B by electrolysis.

  In the present invention, the clamp 3 is characterized in that the material of the current-carrying part at the lower part of the clamp including the power feeding contact part 4 put in the electrolyte W is formed of titanium, as shown in FIGS. The current-carrying portion under the clamp excluding the titanium power supply contact portion 4 is coated with an insulator 5 (preferably, a PVC sol coating process). Therefore, the lower part of the clamp placed in the electrolytic solution W comes into contact with the electrolytic solution W only at the feeding contact portion 4 made of titanium. The feed contact portion 4 is more preferably a titanium feed contact portion coated with platinum and coated, and a titanium feed contact portion coated with iridium is more preferred. As shown in FIG. 4, the power supply contact portion 4 (grip surface) of the clamp 3 is formed in an elongated shape in the direction of movement of the clamp so that the side edge portion of the plating target P to be plated can be accurately grasped. In addition, a wide plating surface of the object to be plated P can be secured.

  In the present invention, since the power supply contact portion 4 of the clamp 3 is formed of titanium, in the plating process A, the cathode current can be supplied from the titanium power supply contact portion 4 to the object to be plated P, and the return process (electrolytic peeling process) B However, the titanium feed contact portion 4 itself constituting the anode is not melted by electrolysis, but only the metal (for example, copper in the case of copper plating) attached to the feed contact portion 4 in the plating process A is efficiently dissolved by electrolysis. Can peel.

  In addition, if the feed contact portion 4 made of titanium is formed by coating platinum or iridium, the voltage is equivalent to a lower voltage (about one third of the voltage) than when the feed contact portion 4 is formed of titanium. Since a large amount of current can be supplied, in the plating process A, the cathode current can be efficiently supplied from the power supply contact part 4 to the object to be plated P, and in the return process (electrolytic peeling process) B, the power supply contact part 4 constituting the anode. As such, it is not dissolved by electrolysis, and only the metal (for example, copper in the case of copper plating) adhering to the power supply contact portion 4 in the plating process A can be more efficiently dissolved and separated by electrolysis.

  The clamp 3 that moves in the plating process A moves while being guided and slid by the plating power supply rail 6, and the clamp 3 that moves in the return process (electrolytic separation process) B is guided and slid by the power supply rail 10 for separation. In parallel, it moves parallel to the opposite direction. The feeding rail 6 for plating is made of a conductive metal material having a rectangular cross section, and a plurality of rails 6A and 6B divided in two in the embodiment shown in FIG. However, the present invention is not limited to this.). The separation width of the separated power supply rail 6 is set so as not to hinder the clamp from moving smoothly along the rail. The plating power supply rail 6 may be formed by a single rail extending linearly over the entire range of the plating process A. The peeling power supply rail 10 is made of a conductive metal material having a rectangular cross section similar to the plating power supply rail 6 and extends over the entire range of the straight return stroke (electrolytic peeling stroke) B surrounded by a two-dot chain line in FIG. And fixedly provided. As shown in FIG. 1, the parallel feeding rail 6 for plating and the feeding rail 10 for peeling are connected in a state where they are not electrically connected via a semi-annular resin insulating rail 11, The power supply rail 6, the separation power supply rail 10, and the insulating rail 11 form a continuous path rail. The semi-annular resin-made insulating rails 11 have a rectangular cross section that is narrower than the power supply rails 6 and 10 in order to assist the pivot movement of the clamps.

  The plating anode (insoluble anode) 7 is a plate-like (including a perforated plate such as a lath plate) insoluble anode (upper anode 7A, lower anode 7B). The plate-like insoluble anodes (upper anode 7A and lower anode 7B) are each composed of a plurality of units, and the plurality of plate-like upper anodes 7A and lower anodes 7B are horizontally transported in the electrolyte solution W. Are arranged in parallel with the plate surface of the object to be plated P and arranged side by side at a certain interval in the conveying direction of the object to be plated P. Has been. Although only a part of the plating anode (insoluble anode) is shown in FIG. 1, it is arranged over the entire range of the plating process A.

  As shown in FIG. 2, the negative electrode (negative electrode) of the plating rectifier (supply power source) 12 and the feeding rail 6 for plating are electrically connected, and the positive electrode (positive electrode) of the plating rectifier (supply power source) 12. And a plating anode (insoluble anode) 7 are electrically connected to each other, and a cathode current is supplied to a clamp 3 (a body to be plated P) that moves in the plating process A while being in sliding contact with the plating power supply rail 6. The positive electrode (plus electrode) of the peeling rectifier (power supply) 13 and the peeling power supply rail 10 are electrically connected, and the negative electrode (negative electrode) of the peeling rectifier 13 and the plating power supply rail 6 are electrically connected. Then, the anode current is supplied to the clamp that moves in the return stroke (electrolytic peeling stroke) B while being in sliding contact with the peeling power supply rail 10, and the return stroke (electrolytic peeling is supplied with the anode current). The clamp 3 that moves B) is fed by the clamp 3 that constitutes the anode, with the negative electrode P being fed from the clamp 3 that moves the plating process A being supplied with the current of the opposite polarity. The metal adhering to the contact portion 4 was dissolved and peeled off by electrolysis.

  In the embodiment shown in FIG. 1, plating rectifiers (supply power sources) 12 (12A, 12B, 12C, 12D) corresponding to the separated plating power supply rails 6A, 6B (four in total in FIG. A plurality of the above-mentioned plating anodes (insoluble anodes) 7 are arranged side by side at a predetermined interval in the conveying direction of the object to be plated P in the plating process A. As shown in FIGS. 1 and 2, each plating power supply rail 6 (6A, 6B) corresponding to the negative electrode (minus electrode) of each plating rectifier (power supply) 12 (12A, 12B, 12C, 12D) is connected. They are electrically connected to each other, and are arranged in the vicinity of the plating power supply rails 6 (6A, 6B) corresponding to the positive electrodes (positive electrodes) of the plating rectifiers (supply power supplies) 12 (12A, 12B, 12C, 12D). Each of the provided plating anodes (insoluble anodes) 7 is electrically connected, and the cathode current is supplied to the clamp 3 (the object to be plated P) that moves in the plating process A while being in sliding contact with the plating power supply rail 6. Then, the positive electrode (plus electrode) of the stripping rectifier (supply power source) 13 and the stripping power supply rail 10 are electrically connected, and the negative electrode (negative electrode) of the stripping rectifier 13 and each plating feed rail are connected. 6 (6A, 6B) are electrically connected to each other, and the anode current is supplied to the clamp that moves in the return stroke (electrolytic peeling stroke) B while being in sliding contact with the peeling feeding rail 10, and the anode current is fed. The clamp 3 that moves in the return stroke (electrolytic separation stroke) B uses the cathode to be plated P fed from the clamp 3 that moves in the plating stroke A to which the current of the opposite polarity is supplied as a counter electrode, The metal adhering to the power feed contact portion 4 of the constituting clamp 3 was dissolved and peeled off by electrolysis.

  As described above, since the cathode as the counter electrode is shared (shared) by the electrolytic plating process A and the electrolytic stripping process B, the dissolved metal (for example, melted and stripped from the feeding contact portion 4 in the return process (electrolytic stripping process) B) (for example, , Dissolved Cu) moves in the electrolyte as indicated by arrow F toward the object P to be moved in the plating process A, and is electrodeposited on the object P to be moved in the plating process A. Therefore, the molten metal (for example, molten Cu) peeled off from the power supply contact portion 4 of the clamp 3 in the return stroke (electrolytic peeling stroke) B can be effectively used, and the efficiency of electrolytic plating and electrolytic peeling can be improved. This is a great merit resulting from performing the electrolytic plating step A and the electrolytic stripping step B in the same electrolytic cell 1.

  Further, in the embodiment of FIG. 1, the plating rectifiers (supply power sources) 12 (12A, 12B, 12C, 12D) are arranged, it is possible to make the electroplating of the body P to be electroplated while being transported through the plating process A uniform.

  The clamp 3 is schematically shown in FIG. 2, and as shown in FIGS. 3 and 4 in detail, the upper portion is supplied with current in the air and the lower portion is the electrolyte W in the electrolytic cell 1. The power supply contact portion 4 (upper contact) has a vertically long structure arranged at a position where it can move in the liquid, and grips and releases the end portion of the plate-like object P in the vertical direction at the lower end portion. Part 4b and lower contact part 4a). The contact portion in the electrolyte of the clamp 3 made of a current-carrying material excluding the feeding contact portion 4 is coated with the insulator 5 as described above. The clamp 3 shown in FIGS. 2 and 3 is attached to a drive chain 8 that is driven endlessly and has a slide engagement portion 14 that is slidably engaged with the plating power supply rail 6 or the peeling power supply rail 10. A fixed-side clamp rod 15 (the lower contact portion 4a is formed at the lower end of the fixed-side clamp rod 15) and a movable-side clamp rod 16 that is held by the fixed-side clamp rod 15 so as to be movable up and down are provided. The upper contact portion 4b formed at the lower end portion of the movable clamp rod 16 is moved downward by the spring pressure of the compression spring 17, and the power supply contact portion 4 (upper contact portion 4b and lower contact portion 4a) is moved vertically in the normal state. The closed state is controlled. A clamp opening / closing guide 18 having a height difference is disposed in the clamp movement path at the start position and the end position of the plating process A, and when the clamp 3 passes the position of the clamp opening / closing guide 18, The provided clamp opening / closing control means 19 is engaged with the higher guide surface portion of the clamp opening / closing guide 18, and the upper contact portion 4 b of the movable clamp rod 16 is moved against the spring pressure of the compression spring 17. The power supply contact portion 4 is moved up so as to be separated from the lower contact portion 4a, and can be controlled to an open state in which the power supply contact portion 4 is separated in the vertical direction. As a result, the clamp 3 passing through the beginning of the plating process A is controlled from the open state to the closed state in which the side end of the object P can be gripped, and the clamp 3 passing through the end of the plating process A is closed. From the state, the side end portion of the object to be plated P can be controlled to be openable.

  The above-described clamp opening / closing guide 18 is disposed so as to extend linearly throughout the entire process of electrolytic stripping. As shown in FIG. 2, the feed contact portion 4 of the clamp 3 that moves in the return stroke (electrolytic stripping process) B is electrolyzed. In the entire peeling process, the upper and lower contact portions 4a and 4b are opened in the vertical direction. By separating the upper and lower contact portions 4a and 4b of the power supply contact portion 4 in the return stroke (electrolytic separation step) B, the electrolytic separation of the metal attached to the power supply contact portion 4 can be promoted.

  As shown in FIG. 3, the clamp opening / closing control means 19 has a bent portion of a substantially L-shaped reversing lever 20 as a fulcrum portion, which is a fulcrum on the fixed side (in this embodiment, the outer surface of the slide engagement portion 14). The shaft 21 is pivotably attached to the shaft 21, the tip of the lower arm portion 20 b of the reversing lever 20 is rotatably connected to the upper portion of the movable clamp rod 16 via a pin shaft, and the upper arm portion 20 a of the reversing lever 20. In the engaged state in which the rotating roller 22 rolls along the upper surface portion of the clamp opening / closing guide 18 provided at the clamp opening position along the circulation path of the clamp 3, the upper arm is mounted. The portion 20a reverses upward with the fulcrum shaft 21 as an axis, and the movable side clamp rod 16 connected to the lower arm portion 20b is moved up against the spring pressure of the compression spring 17 to move the movable side clamp It is configured to be able to control the contact portion 4b on the rod 16 the lower contact portion 4a of the fixed clamp rod 15 to the open state of being spaced apart in the vertical direction.

1 Electrolytic tank W Electrolyte P Plating body (printed wiring board)
A plating process B return process (electrolytic peeling process)
2 Clamp Moving Means 3 Clamp 4 Clamp Feed Contact 5 Clamp Insulator 6 Plating Feed Rail 7 Plating Anode (Insoluble Anode)
DESCRIPTION OF SYMBOLS 10 Feeding rail for peeling 11 Insulating rail 12 Rectifier for plating 13 Rectifier for peeling

Claims (7)

  A clamp moving means for continuously moving a plurality of clamps through a circulation path is provided, and after the feeding contact portion of the clamp moves through the plating process in the electrolytic solution in the same electrolytic cell, it returns to the plating process again through a return process. The clamp that moves around the plating path is configured to move continuously in the circulation path to enter, and the upper part of the clamp is contacted in the air with the feeding rail for plating that is disposed in the air and supplied with the cathode current. The cathode current is supplied from the power supply rail for plating to the power supply contact portion in the electrolyte, and the end of the object to be plated is gripped by the power supply contact portion supplied with the cathode current. The object to be plated, which is held by the power supply contact portion and supplied with the cathode current, is transported in one direction between the pair of plating anodes disposed in the electrolyte during the plating process. Deposit from anode Is an electroplating apparatus for electrodepositing the applied metal on the surface of the object to be plated with the polarity of the cathode fed, and the clamp for moving the return stroke is disposed in the air and is supplied with anode current The upper part of the clamp moves in contact with the power supply rail in the air, the anode current is supplied from the peeling power supply rail to the power supply contact part in the electrolyte, and the deposited metal attached to the power supply contact part in the plating process is returned. An electroplating apparatus by clamp power feeding that electrolytically peels off the metal adhering to the clamp in the same tank so that it can be dissolved and peeled off by electrolysis from the power feeding contact portion of the anode moving in the process.   Clamp moving means for continuously moving a plurality of clamps in the circulation path are provided on both sides of the plating path for the object to be plated in the plating process. After moving the plating process, it is configured to continuously move the circuit path that enters the plating process again through the return process, and the clamp that moves the plating process is disposed in the air and supplied with the cathode current. The upper part of the clamp is moved in contact with the plating power supply rail in the air, the cathode current is supplied from the plating power supply rail to the power supply contact portion in the electrolyte, and the cathode current is supplied. The left and right ends of the object to be plated are gripped, and a pair of upper and lower plates are disposed in the electrolytic solution during the plating process by the object to be plated which is gripped by the power supply contact part and fed with the cathode current. Yang This is an electroplating apparatus that electrodeposits the metal deposited from the plating anode in this transport process in one direction onto the surface of the object to be plated, to which the polarity of the cathode is fed, and moves in the return stroke. The clamp moves while the upper part of the clamp is in air contact with the peeling power supply rail that is disposed in the air and supplied with the anode current, and the anode moves from the peeling power supply rail to the power supply contact portion in the electrolyte. In this way, the deposited metal attached to the power supply contact part during the plating process can be dissolved and peeled off by electrolysis from the power supply contact part of the anode moving in the return process. Electroplating equipment with clamp feeding.   The clamp is made of titanium as the material of the current-carrying part under the clamp including the power supply contact part to be put in the electrolyte, and the current-carrying part under the clamp except for the titanium power supply contact part is covered with an insulator. The electroplating apparatus by clamp electric power feeding which carries out the electrolytic peeling of the metal adhering to a clamp in the same tank of Claim 1 or 2 which comprised it, and formed the feed contact part of this clamp with the titanium.   The clamp is made of titanium as the material of the current-carrying part under the clamp including the power supply contact part to be put in the electrolyte, and the current-carrying part under the clamp except for the titanium power supply contact part is covered with an insulator. 3. Electrolysis by clamp power supply for electrolytically peeling the clamp adhering metal in the same tank according to claim 1 or 2, wherein the titanium power supply contact part of the clamp is coated with platinum and the platinum is used as the power supply contact part. Plating equipment.   The clamp is made of titanium as the material of the current-carrying part under the clamp including the power supply contact part to be put in the electrolyte, and the current-carrying part under the clamp except for the titanium power supply contact part is covered with an insulator. 3. Electrolysis by clamp power feeding in which the metal attached to the clamp is electrolytically peeled off in the same tank according to claim 1 or 2, wherein the titanium feeding contact portion of the clamp is coated with iridium and the iridium is used as the feeding contact portion. Plating equipment.   The plating rectifier positive electrode and the plating anode composed of an insoluble anode are electrically connected, the plating rectifier negative electrode and the plating power supply rail are electrically connected, and the plating rectifier is plated while being in contact with the plating power supply rail. Supply the cathode current to the clamp that moves the stroke, electrically connect the positive electrode of the stripping rectifier and the power supply rail for stripping, electrically connect the negative electrode of the stripping rectifier and the power supply rail for plating, An anode current is supplied to the clamp that moves in the return stroke while being in contact with the peeling power supply rail, and the clamp that moves in the return stroke that is fed with the anode current is supplied with a current of the opposite polarity. The metal attached to the power supply contact part of the clamp that constitutes the anode is dissolved by electrolysis using the cathode to be plated fed from the clamp moving as a counter electrode. Was so that, electrolytic plating apparatus by the clamp feed for electrolytic stripping clamp deposit metal in the same vessel according to claim 1 or 2.   The clamp that moves in the plating process moves while being guided and slid by the power supply rail for plating, and the clamp that moves in the return process moves in parallel in the opposite direction while being guided and slid by the power supply rail for peeling, The plating power supply rail and the peeling power supply rail are connected in a state where they are not electrically connected via a resin-made insulating rail, and the circulation path is continuous with the plating power supply rail, the peeling power supply rail, and the insulating rail. The electroplating apparatus by the clamp electric power feeding which carries out the electrolytic peeling of the metal adhering clamp in the same tank of Claim 1 or 2 which comprised the rail.

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