JP2015537377A - ヒートシンク取り付け装置及び方法 - Google Patents

ヒートシンク取り付け装置及び方法 Download PDF

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Publication number
JP2015537377A
JP2015537377A JP2015537844A JP2015537844A JP2015537377A JP 2015537377 A JP2015537377 A JP 2015537377A JP 2015537844 A JP2015537844 A JP 2015537844A JP 2015537844 A JP2015537844 A JP 2015537844A JP 2015537377 A JP2015537377 A JP 2015537377A
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JP
Japan
Prior art keywords
circuit board
electronic device
shield
heat sink
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2015537844A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015537377A5 (https=
Inventor
カーペンター，ジョセフ，リー
ホイ チェアー，シン
ホイ チェアー，シン
プロクタ−，クリストファー，マイケル，ウィリアム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Licensing SAS
Original Assignee
Thomson Licensing SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing SAS filed Critical Thomson Licensing SAS
Publication of JP2015537377A publication Critical patent/JP2015537377A/ja
Publication of JP2015537377A5 publication Critical patent/JP2015537377A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49227—Insulator making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2015537844A 2012-10-19 2013-10-17 ヒートシンク取り付け装置及び方法 Withdrawn JP2015537377A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261715876P 2012-10-19 2012-10-19
US61/715,876 2012-10-19
PCT/US2013/065529 WO2014062974A1 (en) 2012-10-19 2013-10-17 Heat sink attachment apparatus and method

Publications (2)

Publication Number Publication Date
JP2015537377A true JP2015537377A (ja) 2015-12-24
JP2015537377A5 JP2015537377A5 (https=) 2016-12-01

Family

ID=49519112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015537844A Withdrawn JP2015537377A (ja) 2012-10-19 2013-10-17 ヒートシンク取り付け装置及び方法

Country Status (7)

Country Link
US (1) US9603286B2 (https=)
EP (1) EP2910095B1 (https=)
JP (1) JP2015537377A (https=)
KR (1) KR20150073992A (https=)
CN (1) CN105009699A (https=)
BR (1) BR112015008465B1 (https=)
WO (1) WO2014062974A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016048298A1 (en) * 2014-09-24 2016-03-31 Hewlett Packard Enterprise Development Lp Heat sink with a load spreading bar
US10356948B2 (en) 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
US10624245B2 (en) * 2016-06-23 2020-04-14 Laird Technologies, Inc. Laser weldable brackets for attachment of heat sinks to board level shields
US9893474B1 (en) * 2016-10-12 2018-02-13 International Business Machines Corporation Active cable heat sink
CN106507651B (zh) * 2016-12-30 2019-11-29 韩端科技（深圳）有限公司 电子设备
US10785864B2 (en) * 2017-09-21 2020-09-22 Amazon Technologies, Inc. Printed circuit board with heat sink
USD835590S1 (en) 2018-06-27 2018-12-11 Advanced Thermal Solutions, Inc. Heat sink clip
USD837753S1 (en) 2018-06-27 2019-01-08 Advanced Thermal Solutions, Inc. Heat sink clip
USD876372S1 (en) 2018-06-27 2020-02-25 Advanced Thermal Solutions, Inc. Heat sink clip and attachment
USD877098S1 (en) 2018-06-27 2020-03-03 Advanced Thermal Solutions, Inc. Heat sink clip and attachment
US11971739B2 (en) * 2019-01-10 2024-04-30 Makersan Makina Otomotiv Sanayi Ticaret Anonim Sirketi Joystick with precise control
WO2022093402A1 (en) * 2020-10-28 2022-05-05 Arris Enterprises Llc Pass-through latching heat sink

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5304735A (en) * 1992-02-14 1994-04-19 Aavid Engineering, Inc. Heat sink for an electronic pin grid array
US5436798A (en) * 1994-01-21 1995-07-25 Wakefield Engineering, Inc. Spring clip and heat sink assembly for electronic components
US5411199A (en) * 1994-03-07 1995-05-02 Motorola, Inc. Method for attaching a shield
SE9401203L (sv) * 1994-04-11 1995-10-12 Ellemtel Utvecklings Ab Skärm och kylare
US5621244A (en) * 1994-05-16 1997-04-15 Lin; Shih-Jen Fin assembly for an integrated circuit
GB2295927A (en) * 1994-12-08 1996-06-12 Gareth Rhys Baron Mounting of an integrated circuit on a printed circuit board
US5570271A (en) * 1995-03-03 1996-10-29 Aavid Engineering, Inc. Heat sink assemblies
US5576933A (en) 1995-05-15 1996-11-19 Wakefield Engineering, Inc. Clamping heat sink for an electric device
US5881800A (en) * 1998-04-03 1999-03-16 Chung; Kuang-Hua Heat sink fastener
CN2342343Y (zh) * 1998-08-04 1999-10-06 钟光华 散热器固定座结构
US6617685B1 (en) * 1999-08-30 2003-09-09 Sun Microsystems, Inc. Clip heat sink assembly
EP1128432B1 (de) * 2000-02-24 2016-04-06 Infineon Technologies AG Befestigung von Halbleitermodulen an einem Kühlkörper
US7061774B2 (en) 2000-12-18 2006-06-13 Franklin Zhigang Zhang Computer board with dual shield housing and heat sink expansion zone apparatuses
US6856511B1 (en) * 2003-07-17 2005-02-15 Cisco Technology, Inc. Methods and apparatus for attaching a heat sink to a circuit board component
US8902603B2 (en) 2004-02-06 2014-12-02 Carmen Rapisarda Solder and lead free electronic circuit and method of manufacturing same
JP2006222388A (ja) * 2005-02-14 2006-08-24 Toshiba Corp 電子機器の放熱装置及び放熱方法
CN1953646A (zh) * 2005-10-18 2007-04-25 鸿富锦精密工业（深圳）有限公司 能防电磁干扰的散热装置
US7355857B2 (en) * 2006-02-07 2008-04-08 Methode Electronics, Inc. Heat sink gasket
WO2008070873A2 (en) * 2006-12-07 2008-06-12 Finisar Corporation Electromagnetic radiation containment and heat management in an electronic module
JPWO2008099554A1 (ja) * 2007-02-15 2010-05-27 日本電気株式会社 半導体パッケージの実装構造
US7567439B2 (en) 2007-08-10 2009-07-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a rotatable fastener
CN101754639A (zh) * 2008-12-02 2010-06-23 台达电子工业股份有限公司 散热器固定结构
CN201726632U (zh) * 2010-04-15 2011-01-26 鸿富锦精密工业（深圳）有限公司 电子产品之散热片固定结构
US20140036451A1 (en) * 2012-07-31 2014-02-06 Glenn C. Simon Heat sink assembly
US9146062B2 (en) * 2013-03-01 2015-09-29 Radian Thermal Products, Inc. Interlocking clip heatsink mounting system

Also Published As

Publication number Publication date
WO2014062974A1 (en) 2014-04-24
EP2910095B1 (en) 2019-08-14
KR20150073992A (ko) 2015-07-01
BR112015008465A2 (pt) 2017-07-04
US20150282388A1 (en) 2015-10-01
EP2910095A1 (en) 2015-08-26
US9603286B2 (en) 2017-03-21
CN105009699A (zh) 2015-10-28
BR112015008465B1 (pt) 2021-07-20

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