JP2015532004A - フレキシブルガラス基板の処理 - Google Patents

フレキシブルガラス基板の処理 Download PDF

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Publication number
JP2015532004A
JP2015532004A JP2015528515A JP2015528515A JP2015532004A JP 2015532004 A JP2015532004 A JP 2015532004A JP 2015528515 A JP2015528515 A JP 2015528515A JP 2015528515 A JP2015528515 A JP 2015528515A JP 2015532004 A JP2015532004 A JP 2015532004A
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JP
Japan
Prior art keywords
substrate
flexible glass
glass substrate
bonding layer
carrier substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2015528515A
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English (en)
Japanese (ja)
Other versions
JP2015532004A5 (OSRAM
Inventor
マシュー ガーナー，シーン
マシュー ガーナー，シーン
ジョージ マンレイ，ロバート
ジョージ マンレイ，ロバート
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of JP2015532004A publication Critical patent/JP2015532004A/ja
Publication of JP2015532004A5 publication Critical patent/JP2015532004A5/ja
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/542—Shear strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/702—Amorphous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays

Landscapes

  • Joining Of Glass To Other Materials (AREA)
  • Laminated Bodies (AREA)
JP2015528515A 2012-08-22 2013-08-12 フレキシブルガラス基板の処理 Ceased JP2015532004A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261691904P 2012-08-22 2012-08-22
US61/691,904 2012-08-22
PCT/US2013/054473 WO2014031372A1 (en) 2012-08-22 2013-08-12 Processing flexible glass substrates

Publications (2)

Publication Number Publication Date
JP2015532004A true JP2015532004A (ja) 2015-11-05
JP2015532004A5 JP2015532004A5 (OSRAM) 2016-09-08

Family

ID=49034218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015528515A Ceased JP2015532004A (ja) 2012-08-22 2013-08-12 フレキシブルガラス基板の処理

Country Status (5)

Country Link
JP (1) JP2015532004A (OSRAM)
KR (1) KR20150046218A (OSRAM)
CN (1) CN104685627B (OSRAM)
TW (1) TWI589443B (OSRAM)
WO (1) WO2014031372A1 (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107108334A (zh) * 2014-10-31 2017-08-29 康宁股份有限公司 对玻璃进行尺寸稳定的快速蚀刻
CN104992944B (zh) 2015-05-26 2018-09-11 京东方科技集团股份有限公司 一种柔性显示母板及柔性显示面板的制作方法
KR102649238B1 (ko) 2016-10-26 2024-03-21 삼성디스플레이 주식회사 표시패널, 이를 포함하는 적층 기판, 및 표시패널 제조방법
JP7091121B2 (ja) * 2018-04-18 2022-06-27 信越石英株式会社 石英ガラス板
CN108962028B (zh) 2018-07-10 2020-03-31 云谷（固安）科技有限公司 柔性显示屏盖板、柔性显示模组和柔性显示装置
CN112297546A (zh) * 2019-07-24 2021-02-02 东旭光电科技股份有限公司 显示面板的制备方法
CN111393032B (zh) * 2020-04-13 2022-07-08 Oppo广东移动通信有限公司 微晶玻璃盖板、柔性屏组件、电子设备及微晶玻璃盖板加工方法
KR102815849B1 (ko) * 2020-11-02 2025-06-05 삼성디스플레이 주식회사 유연성 글라스 제조를 위한 유리적층 구조물 및 이의 제조방법
CN112582576A (zh) * 2020-12-10 2021-03-30 深圳市华星光电半导体显示技术有限公司 柔性基板制备方法及显示面板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252342A (ja) * 1999-03-01 2000-09-14 Seiko Epson Corp 薄板の搬送方法および液晶パネルの製造方法
JP2004186201A (ja) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 薄層ガラスパネルの取扱い方法
JP2006152308A (ja) * 2005-12-28 2006-06-15 Nitto Denko Corp 電子部品の切断方法
JP2007036074A (ja) * 2005-07-29 2007-02-08 Toshiba Corp 半導体装置の製造方法
WO2009128359A1 (ja) * 2008-04-17 2009-10-22 旭硝子株式会社 ガラス積層体、支持体付き表示装置用パネルおよびこれらの製造方法
JP2011003668A (ja) * 2009-06-17 2011-01-06 Seiko Epson Corp 素子の転写方法および電子機器の製造方法
JP2012064710A (ja) * 2010-09-15 2012-03-29 Asahi Glass Co Ltd 半導体素子の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281560A (en) * 1993-06-21 1994-01-25 Corning Incorporated Non-lead sealing glasses
EP1655633A3 (en) * 1996-08-27 2006-06-21 Seiko Epson Corporation Exfoliating method, transferring method of thin film device, thin film integrated circuit device, and liquid crystal display device
US20060207967A1 (en) * 2003-07-03 2006-09-21 Bocko Peter L Porous processing carrier for flexible substrates
KR100820170B1 (ko) * 2006-08-30 2008-04-10 한국전자통신연구원 플렉시블 기판의 적층 방법
KR101458901B1 (ko) * 2008-04-29 2014-11-10 삼성디스플레이 주식회사 가요성 표시 장치의 제조 방법
EP2351718A4 (en) * 2008-10-23 2013-05-08 Asahi Glass Co Ltd GLASS SUPPLY LAMINATED DEVICE AND METHOD FOR PRODUCING LAMINATE GLASS SUBSTRATE
US9063605B2 (en) * 2009-01-09 2015-06-23 Apple Inc. Thin glass processing using a carrier
JP2012109538A (ja) * 2010-10-29 2012-06-07 Tokyo Ohka Kogyo Co Ltd 積層体、およびその積層体の分離方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252342A (ja) * 1999-03-01 2000-09-14 Seiko Epson Corp 薄板の搬送方法および液晶パネルの製造方法
JP2004186201A (ja) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 薄層ガラスパネルの取扱い方法
JP2007036074A (ja) * 2005-07-29 2007-02-08 Toshiba Corp 半導体装置の製造方法
JP2006152308A (ja) * 2005-12-28 2006-06-15 Nitto Denko Corp 電子部品の切断方法
WO2009128359A1 (ja) * 2008-04-17 2009-10-22 旭硝子株式会社 ガラス積層体、支持体付き表示装置用パネルおよびこれらの製造方法
JP2011003668A (ja) * 2009-06-17 2011-01-06 Seiko Epson Corp 素子の転写方法および電子機器の製造方法
JP2012064710A (ja) * 2010-09-15 2012-03-29 Asahi Glass Co Ltd 半導体素子の製造方法

Also Published As

Publication number Publication date
CN104685627A (zh) 2015-06-03
CN104685627B (zh) 2017-12-05
WO2014031372A1 (en) 2014-02-27
TW201410474A (zh) 2014-03-16
TWI589443B (zh) 2017-07-01
KR20150046218A (ko) 2015-04-29

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