JP2015513219A5 - - Google Patents

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Publication number
JP2015513219A5
JP2015513219A5 JP2014560402A JP2014560402A JP2015513219A5 JP 2015513219 A5 JP2015513219 A5 JP 2015513219A5 JP 2014560402 A JP2014560402 A JP 2014560402A JP 2014560402 A JP2014560402 A JP 2014560402A JP 2015513219 A5 JP2015513219 A5 JP 2015513219A5
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chuck
alignment
measuring
sensor
axis
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JP2014560402A
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JP6219320B2 (ja
JP2015513219A (ja
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Priority claimed from PCT/EP2013/054782 external-priority patent/WO2013132081A2/en
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JP2014560402A 2012-03-08 2013-03-08 ウェーハなどのターゲットを処理するためのリソグラフィシステム及び方法 Active JP6219320B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261608524P 2012-03-08 2012-03-08
US61/608,524 2012-03-08
PCT/EP2013/054782 WO2013132081A2 (en) 2012-03-08 2013-03-08 Lithography system and method for processing a target, such as a wafer

Publications (3)

Publication Number Publication Date
JP2015513219A JP2015513219A (ja) 2015-04-30
JP2015513219A5 true JP2015513219A5 (https=) 2016-04-28
JP6219320B2 JP6219320B2 (ja) 2017-10-25

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JP2014560402A Active JP6219320B2 (ja) 2012-03-08 2013-03-08 ウェーハなどのターゲットを処理するためのリソグラフィシステム及び方法

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US (2) USRE49241E1 (https=)
EP (1) EP2823361B1 (https=)
JP (1) JP6219320B2 (https=)
CN (1) CN104272194B (https=)
NL (1) NL2010415C2 (https=)
TW (1) TWI573174B (https=)
WO (1) WO2013132081A2 (https=)

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US10585360B2 (en) * 2017-08-25 2020-03-10 Applied Materials, Inc. Exposure system alignment and calibration method
US11740564B2 (en) * 2020-06-18 2023-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus and method using the same
CN112606209B (zh) * 2020-09-07 2022-04-22 厦门天润锦龙建材有限公司 对准防泄漏系统
DE202022003087U1 (de) * 2021-01-29 2024-09-23 Pink Gmbh Thermosysteme Anlage zum Verbinden von elektronischen Baugruppen
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CN115597510A (zh) * 2021-07-07 2023-01-13 长鑫存储技术有限公司（Cn） 量测装置、量测补偿系统、量测方法及量测补偿方法
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CN116466551A (zh) * 2023-04-17 2023-07-21 合肥芯碁微电子装备股份有限公司 背面对准装置及其方法和曝光设备

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