JP2015511066A5 - - Google Patents

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Publication number
JP2015511066A5
JP2015511066A5 JP2014560476A JP2014560476A JP2015511066A5 JP 2015511066 A5 JP2015511066 A5 JP 2015511066A5 JP 2014560476 A JP2014560476 A JP 2014560476A JP 2014560476 A JP2014560476 A JP 2014560476A JP 2015511066 A5 JP2015511066 A5 JP 2015511066A5
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JP
Japan
Prior art keywords
heat sink
sink material
light source
light sources
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014560476A
Other languages
English (en)
Japanese (ja)
Other versions
JP6559424B2 (ja
JP2015511066A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2013/051563 external-priority patent/WO2013132389A1/en
Publication of JP2015511066A publication Critical patent/JP2015511066A/ja
Publication of JP2015511066A5 publication Critical patent/JP2015511066A5/ja
Application granted granted Critical
Publication of JP6559424B2 publication Critical patent/JP6559424B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014560476A 2012-03-06 2013-02-27 照明モジュール及び照明モジュールを製造する方法 Expired - Fee Related JP6559424B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261607058P 2012-03-06 2012-03-06
US61/607,058 2012-03-06
PCT/IB2013/051563 WO2013132389A1 (en) 2012-03-06 2013-02-27 Lighting module and method of manufacturing a lighting module

Publications (3)

Publication Number Publication Date
JP2015511066A JP2015511066A (ja) 2015-04-13
JP2015511066A5 true JP2015511066A5 (enExample) 2016-04-14
JP6559424B2 JP6559424B2 (ja) 2019-08-14

Family

ID=48093044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014560476A Expired - Fee Related JP6559424B2 (ja) 2012-03-06 2013-02-27 照明モジュール及び照明モジュールを製造する方法

Country Status (5)

Country Link
US (1) US9777890B2 (enExample)
EP (1) EP2823517B1 (enExample)
JP (1) JP6559424B2 (enExample)
CN (1) CN104160522B (enExample)
WO (1) WO2013132389A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150131295A1 (en) * 2013-11-12 2015-05-14 GE Lighting Solutions, LLC Thin-film coating for improved outdoor led reflectors
US11562982B2 (en) * 2019-04-29 2023-01-24 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit packages and methods of forming the same

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03151674A (ja) 1989-11-08 1991-06-27 Sharp Corp 半導体装置
JPH06326144A (ja) 1993-05-17 1994-11-25 Toshiba Corp 樹脂封止型半導体装置の製造方法
US5528474A (en) * 1994-07-18 1996-06-18 Grote Industries, Inc. Led array vehicle lamp
US6318886B1 (en) * 2000-02-11 2001-11-20 Whelen Engineering Company High flux led assembly
JP4100946B2 (ja) * 2002-03-27 2008-06-11 松下電器産業株式会社 照明装置
JP2010093285A (ja) 2003-02-28 2010-04-22 Sanyo Electric Co Ltd 半導体装置の製造方法
US7281860B2 (en) 2003-06-06 2007-10-16 Sharp Kabushiki Kaisha Optical transmitter
JP2005159296A (ja) 2003-11-06 2005-06-16 Sharp Corp オプトデバイスのパッケージ構造
US7858994B2 (en) * 2006-06-16 2010-12-28 Articulated Technologies, Llc Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
US7044620B2 (en) * 2004-04-30 2006-05-16 Guide Corporation LED assembly with reverse circuit board
JP2006100633A (ja) * 2004-09-30 2006-04-13 Toyoda Gosei Co Ltd Ｌｅｄ照明装置
DE102004057804B4 (de) 2004-11-30 2010-04-08 Osram Opto Semiconductors Gmbh Gehäusekörper für einen Halbleiterchip aus gegossener Keramik mit reflektierender Wirkung und Verfahren zu dessen Herstellung
WO2006093889A2 (en) 2005-02-28 2006-09-08 Color Kinetics Incorporated Configurations and methods for embedding electronics or light emitters in manufactured materials
JP4375564B2 (ja) 2005-03-17 2009-12-02 日本電気株式会社 封止樹脂組成物、封止樹脂組成物で封止された電子部品装置及び半導体素子のリペア方法
TWI256454B (en) * 2005-06-03 2006-06-11 Au Optronics Corp Light module
JP5192646B2 (ja) 2006-01-16 2013-05-08 Ｔｏｗａ株式会社 光素子の樹脂封止方法、その樹脂封止装置、および、その製造方法
US7942551B2 (en) 2006-04-25 2011-05-17 Koninklijke Philips Electronics N.V. LED array grid, method and device for manufacturing said grid and LED component for use in the same
TWI318792B (en) * 2006-09-19 2009-12-21 Phoenix Prec Technology Corp Circuit board structure having embedded semiconductor chip and fabrication method thereof
US20080298033A1 (en) * 2007-06-01 2008-12-04 Smith Roy A Power supply platform and electronic component
JP2009161742A (ja) 2007-12-14 2009-07-23 Sony Chemical & Information Device Corp 光半導体パッケージ封止樹脂材料
CN101463985B (zh) * 2007-12-21 2010-12-08 富士迈半导体精密工业（上海）有限公司 发光二极管灯具
JP2009231584A (ja) 2008-03-24 2009-10-08 Japan Gore Tex Inc Ｌｅｄ基板の製造方法およびｌｅｄ基板
US8461613B2 (en) 2008-05-27 2013-06-11 Interlight Optotech Corporation Light emitting device
RU2503092C2 (ru) * 2008-09-25 2013-12-27 Конинклейке Филипс Электроникс Н.В. Светоизлучающее устройство с покрытием и способ нанесения покрытия на него
DE102009012517A1 (de) 2009-03-10 2010-09-16 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
JP5121783B2 (ja) * 2009-06-30 2013-01-16 株式会社日立ハイテクノロジーズ Ｌｅｄ光源およびその製造方法ならびにｌｅｄ光源を用いた露光装置及び露光方法
JP5683799B2 (ja) * 2009-09-14 2015-03-11 スターライト工業株式会社 自動車用ｌｅｄ用ヒートシンク
KR101144202B1 (ko) * 2009-11-02 2012-05-10 삼성전기주식회사 엘이디 내장형 인쇄회로기판
JP4681071B1 (ja) * 2009-12-17 2011-05-11 株式会社スズデン 照明器具
BE1019763A3 (nl) 2011-01-12 2012-12-04 Sioen Ind Werkwijze voor het inbedden van led-netwerken.

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