JP2015506276A5 - - Google Patents

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Publication number
JP2015506276A5
JP2015506276A5 JP2014549222A JP2014549222A JP2015506276A5 JP 2015506276 A5 JP2015506276 A5 JP 2015506276A5 JP 2014549222 A JP2014549222 A JP 2014549222A JP 2014549222 A JP2014549222 A JP 2014549222A JP 2015506276 A5 JP2015506276 A5 JP 2015506276A5
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JP
Japan
Prior art keywords
laser
passages
inner diameter
diameter
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014549222A
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English (en)
Japanese (ja)
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JP6433295B2 (ja
JP2015506276A (ja
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Publication date
Priority claimed from US13/331,472 external-priority patent/US9289858B2/en
Application filed filed Critical
Publication of JP2015506276A publication Critical patent/JP2015506276A/ja
Publication of JP2015506276A5 publication Critical patent/JP2015506276A5/ja
Application granted granted Critical
Publication of JP6433295B2 publication Critical patent/JP6433295B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014549222A 2011-12-20 2012-12-19 硬化したシリコン中に微少なテーパー付の穴をあける方法 Expired - Fee Related JP6433295B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/331,472 US9289858B2 (en) 2011-12-20 2011-12-20 Drilling holes with minimal taper in cured silicone
US13/331,472 2011-12-20
PCT/US2012/070470 WO2013096372A1 (en) 2011-12-20 2012-12-19 Drilling holes with minimal taper in cured silicone

Publications (3)

Publication Number Publication Date
JP2015506276A JP2015506276A (ja) 2015-03-02
JP2015506276A5 true JP2015506276A5 (cg-RX-API-DMAC10.html) 2016-02-12
JP6433295B2 JP6433295B2 (ja) 2018-12-05

Family

ID=48609323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014549222A Expired - Fee Related JP6433295B2 (ja) 2011-12-20 2012-12-19 硬化したシリコン中に微少なテーパー付の穴をあける方法

Country Status (6)

Country Link
US (1) US9289858B2 (cg-RX-API-DMAC10.html)
JP (1) JP6433295B2 (cg-RX-API-DMAC10.html)
KR (2) KR20140103321A (cg-RX-API-DMAC10.html)
CN (1) CN104010760B (cg-RX-API-DMAC10.html)
TW (1) TWI623368B (cg-RX-API-DMAC10.html)
WO (1) WO2013096372A1 (cg-RX-API-DMAC10.html)

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US9414498B2 (en) * 2013-09-20 2016-08-09 Coherent, Inc. Via-hole drilling in a printed circuit board using a carbon monoxide laser
US9950392B2 (en) 2014-03-04 2018-04-24 Rohr, Inc. Forming one or more apertures in a fiber-reinforced composite object with a laser
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CN113441852B (zh) * 2021-06-24 2022-07-19 中国科学院西安光学精密机械研究所 一种激光螺旋扫描盲孔制造方法
DE102021005297A1 (de) 2021-10-25 2023-04-27 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zur Erzeugung angesenkter Löcher
CN114833472A (zh) * 2022-05-26 2022-08-02 苏州思萃声光微纳技术研究所有限公司 用于航空发动机火焰筒的无锥度冷却气膜孔激光加工方法
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CN117444429A (zh) * 2023-12-25 2024-01-26 西安晟光硅研半导体科技有限公司 一种基于微射流技术螺旋加工孔的工艺方法

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