PL422471A1 - Sposoby i układy do laserowej ablacji i obróbki - Google Patents

Sposoby i układy do laserowej ablacji i obróbki

Info

Publication number
PL422471A1
PL422471A1 PL422471A PL42247115A PL422471A1 PL 422471 A1 PL422471 A1 PL 422471A1 PL 422471 A PL422471 A PL 422471A PL 42247115 A PL42247115 A PL 42247115A PL 422471 A1 PL422471 A1 PL 422471A1
Authority
PL
Poland
Prior art keywords
contact
laser beam
create
laser
systems
Prior art date
Application number
PL422471A
Other languages
English (en)
Other versions
PL240054B1 (pl
Inventor
Bartosz Andrzej Dajnowski
Original Assignee
G.C. Laser Systems, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by G.C. Laser Systems, Inc. filed Critical G.C. Laser Systems, Inc.
Publication of PL422471A1 publication Critical patent/PL422471A1/pl
Publication of PL240054B1 publication Critical patent/PL240054B1/pl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/34Methods of heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0734Shaping the laser spot into an annular shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355Texturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00Modifying the physical properties by methods other than heat treatment or deformation
    • C21D10/005Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles, e.g. plated or painted; Surface treated articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)

Abstract

Ujawniono układy i sposoby ablacyjnego usuwania lub obróbki powierzchni z wykorzystaniem promienia laserowego. Sposób obejmuje kierowanie promienia laserowego na powierzchnię aby utworzyć obszar styku. Sposób obejmuje także przemieszczanie obszaru styku aby utworzyć krzywą styku. Sposób obejmuje dostrajanie długości fali i mocy promienia laserowego aby przetwarzać materiał i/lub ablacyjnie usuwać powłokę. Długość fali i moc może być następnie dostrojona aby nie uszkodzić powierzchni pod powłoką. Przemieszczanie powierzchni styku może obejmować utworzenie drugiej krzywej styku przez nałożenie w tym samym czasie, drugiej krzywej styku na krzywą styku. Układ zawiera laser i zespół kierowania skonfigurowany do kierowania promienia laserowego (155) z lasera na powierzchnię aby utworzyć obszar styku. Ujawniono nieulotny, odczytywany przez procesor nośnik mający zapisane na nim instrukcje.
PL422471A 2014-09-09 2015-09-08 Sposoby i układy do laserowej ablacji i obróbki PL240054B1 (pl)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462048212P 2014-09-09 2014-09-09
US62/048212 2014-09-09
US14/582,987 US9914985B2 (en) 2014-09-09 2014-12-24 Laser ablation and processing methods and systems
US14/582987 2014-12-24
PCT/US2015/048892 WO2016040288A1 (en) 2014-09-09 2015-09-08 Laser ablation and processing methods and systems

Publications (2)

Publication Number Publication Date
PL422471A1 true PL422471A1 (pl) 2019-01-14
PL240054B1 PL240054B1 (pl) 2022-02-14

Family

ID=55436660

Family Applications (1)

Application Number Title Priority Date Filing Date
PL422471A PL240054B1 (pl) 2014-09-09 2015-09-08 Sposoby i układy do laserowej ablacji i obróbki

Country Status (8)

Country Link
US (2) US9914985B2 (pl)
EP (3) EP3970906B1 (pl)
AU (2) AU2015315390B2 (pl)
CA (1) CA2951718C (pl)
DE (1) DE112015004118T5 (pl)
GB (1) GB2544230B (pl)
PL (1) PL240054B1 (pl)
WO (1) WO2016040288A1 (pl)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11047017B2 (en) 2014-09-09 2021-06-29 G.C. Laser Systems, Inc. Laser ablation devices that utilize beam profiling assemblies to clean and process surfaces
US9914985B2 (en) 2014-09-09 2018-03-13 G.C. Laser Systems, Inc. Laser ablation and processing methods and systems
US10195688B2 (en) 2015-01-05 2019-02-05 Johnson Controls Technology Company Laser welding system for a battery module
CN107378165A (zh) * 2017-09-13 2017-11-24 安徽江淮汽车集团股份有限公司 一种激光焊接方法
CN110178228A (zh) * 2017-12-19 2019-08-27 君泰创新(北京)科技有限公司 除膜处理方法和设备
JP6920540B2 (ja) * 2018-03-23 2021-08-18 Primetals Technologies Japan株式会社 レーザ加工ヘッド及びレーザ加工装置並びにレーザ加工ヘッドの調整方法
CN109048047B (zh) * 2018-07-09 2020-09-25 江苏峰钛激光科技有限公司 一种硬脆材料的激光打标方法
EP3674427A1 (en) * 2018-12-28 2020-07-01 Etxe-Tar, S.A. Method and system for heating using an energy beam
EP3674029A1 (en) * 2018-12-28 2020-07-01 Etxe-Tar, S.A. Method and system for heating an object using an energy beam
KR102636043B1 (ko) * 2019-01-21 2024-02-14 삼성디스플레이 주식회사 레이저 에칭 장치와 그것을 이용한 레이저 에칭 방법
CN109821822A (zh) * 2019-03-13 2019-05-31 何兴 网状激光清洗系统及方法
CN110276149B (zh) * 2019-06-27 2020-12-11 大连理工大学 激光烧蚀金属靶材的径向热影响区宽度求解方法
CN110539068A (zh) * 2019-09-16 2019-12-06 广东镭奔激光科技有限公司 一种定向区域快速扫描式激光冲击强化方法及系统
CN110813927B (zh) * 2019-11-01 2021-01-01 苏州热工研究院有限公司 一种核电站用板式换热器板片激光去污方法
US11440062B2 (en) * 2019-11-07 2022-09-13 General Electric Company System and method for cleaning a tube
CN110936022B (zh) * 2019-12-16 2020-11-06 山东大学 一种阵列式微织构成形系统及方法
CN111906094B (zh) * 2020-07-29 2022-09-20 中国南方电网有限责任公司超高压输电公司柳州局 一种激光清洗剂除锈环形接头装置
DE102020121131B4 (de) 2020-08-11 2022-08-11 Jenoptik Automatisierungstechnik Gmbh Verfahren zur Herstellung einer Sollbruchlinie in die gewölbte Airbag Abdeckung einer Lenkradkappe eines Bauteils eines Fahrzeugs mittels Laser
CN112190326B (zh) * 2020-10-13 2022-02-25 西安炬光科技股份有限公司 一种光斑扫描装置及其扫描方法、医疗美容装置
CN112427801B (zh) * 2020-11-25 2022-08-30 西安中科微精光子科技股份有限公司 一种基于交点搜索的激光加工方法、设备及计算机存储介质
DE102021214980A1 (de) 2021-12-23 2022-12-08 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Abtragen von Material und optische Anordnung
CN115415251A (zh) * 2022-09-15 2022-12-02 武汉理工大学 一种音圈电机转镜激光清洗系统及其清洗方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4986664A (en) * 1984-02-07 1991-01-22 International Technical Associates System and process for controlled removal of material to produce a desired surface contour
US5520679A (en) * 1992-12-03 1996-05-28 Lasersight, Inc. Ophthalmic surgery method using non-contact scanning laser
US5582752A (en) * 1993-12-17 1996-12-10 Laser Industries, Ltd. Method and apparatus for applying laser beams to a working surface, particularly for ablating tissue
US20120145685A1 (en) * 2010-12-09 2012-06-14 Edison Welding Institute, Inc. Polygonal laser scanner and imaging system for coating removal

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4725709A (en) * 1984-09-25 1988-02-16 Siemens Aktiengesellschaft Apparatus having a sweep arrangement for non-contacting modification of an article
AU651374B2 (en) * 1990-08-22 1994-07-21 Visx Incorporated System for scanning a surgical laser beam
IL100664A0 (en) * 1992-01-15 1992-09-06 Laser Ind Ltd Method and apparatus for controlling a laser beam
DE19500398C1 (de) * 1995-01-09 1996-04-25 Gabor Csontos Vorrichtung zur Behandlung von Gewebeschichten mittels Laserstrahlen
US5546214A (en) * 1995-09-13 1996-08-13 Reliant Technologies, Inc. Method and apparatus for treating a surface with a scanning laser beam having an improved intensity cross-section
US5860968A (en) * 1995-11-03 1999-01-19 Luxar Corporation Laser scanning method and apparatus
US6022427A (en) * 1997-02-08 2000-02-08 Fried Krupp Method for producing helical springs
US5897798A (en) 1997-06-04 1999-04-27 Hmt Technology Corporation Laser texturing apparatus employing a rotating mirror
US5932120A (en) * 1997-12-18 1999-08-03 General Electric Company Laser shock peening using low energy laser
WO2001010177A1 (en) * 1999-08-03 2001-02-08 Xsil Technology Limited A circuit singulation system and method
US6296448B1 (en) * 1999-09-30 2001-10-02 General Electric Company Simultaneous offset dual sided laser shock peening
JP2002066780A (ja) * 2000-08-30 2002-03-05 Canon Inc レーザ加工装置
US6541733B1 (en) * 2001-01-29 2003-04-01 General Electric Company Laser shock peening integrally bladed rotor blade edges
US7562768B2 (en) * 2006-07-14 2009-07-21 Michael Tokarski Screw cap package for contact lens
US7888621B2 (en) * 2006-09-29 2011-02-15 International Paper Co. Systems and methods for automatically adjusting the operational parameters of a laser cutter in a package processing environment
US20080116183A1 (en) 2006-11-21 2008-05-22 Palo Alto Research Center Incorporated Light Scanning Mechanism For Scan Displacement Invariant Laser Ablation Apparatus
US20080116182A1 (en) 2006-11-21 2008-05-22 Palo Alto Research Center Incorporated Multiple Station Scan Displacement Invariant Laser Ablation Apparatus
EP1990126B1 (en) * 2007-05-08 2012-11-21 Volvo Car Corporation Method of laser cutting a painted or multilayered workpiece by means of a scanned laser beam
DE102008014263A1 (de) * 2008-03-13 2009-09-24 Schott Solar Gmbh Verfahren und Vorrichtung zur Bildung der Trennlinien eines fotovoltaischen Moduls mit serienverschalteten Zellen
US8461477B2 (en) * 2009-08-19 2013-06-11 General Electric Company Method for determining laser shock peening approach accessibility
US8743165B2 (en) * 2010-03-05 2014-06-03 Micronic Laser Systems Ab Methods and device for laser processing
US20130131653A1 (en) 2011-11-22 2013-05-23 Excelsius Medical, Inc. Ophthalmological laser method and apparatus
JP5909352B2 (ja) * 2011-12-09 2016-04-26 東芝機械株式会社 パルスレーザ加工装置およびパルスレーザ加工方法
EP2823929A4 (en) * 2012-03-09 2015-12-02 Toyokoh Co Ltd LASER IRRADIATION DEVICE, LASER IRRADIATION SYSTEM, AND METHOD FOR REMOVING COATING OR ADHESION MATERIAL
JP6043179B2 (ja) * 2012-12-21 2016-12-14 レーザ・ネット株式会社 樹脂被覆除去システム
CN203804413U (zh) * 2014-03-28 2014-09-03 湖北百一科技发展有限公司 用于激光清洗系统的二维立式扫描振镜装置
US9914985B2 (en) 2014-09-09 2018-03-13 G.C. Laser Systems, Inc. Laser ablation and processing methods and systems
FI126769B (en) * 2014-12-23 2017-05-15 Picodeon Ltd Oy Lighthouse type scanner with a rotating mirror and a circular target
CN104941961B (zh) * 2015-07-01 2017-01-04 中国工程物理研究院激光聚变研究中心 一种采用激光清洗金属管道的机器人

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4986664A (en) * 1984-02-07 1991-01-22 International Technical Associates System and process for controlled removal of material to produce a desired surface contour
US5520679A (en) * 1992-12-03 1996-05-28 Lasersight, Inc. Ophthalmic surgery method using non-contact scanning laser
US5582752A (en) * 1993-12-17 1996-12-10 Laser Industries, Ltd. Method and apparatus for applying laser beams to a working surface, particularly for ablating tissue
US20120145685A1 (en) * 2010-12-09 2012-06-14 Edison Welding Institute, Inc. Polygonal laser scanner and imaging system for coating removal

Also Published As

Publication number Publication date
EP3970906C0 (en) 2024-04-03
CA2951718A1 (en) 2016-03-17
US9914985B2 (en) 2018-03-13
EP3191253B1 (en) 2021-11-03
PL240054B1 (pl) 2022-02-14
AU2019200676A1 (en) 2019-02-21
US20160067824A1 (en) 2016-03-10
GB2544230B (en) 2021-06-23
CA2951718C (en) 2023-05-09
WO2016040288A1 (en) 2016-03-17
EP3191253A1 (en) 2017-07-19
EP3191253A4 (en) 2018-03-14
US20180119238A1 (en) 2018-05-03
GB2544230A (en) 2017-05-10
AU2019200676B2 (en) 2020-07-23
AU2015315390B2 (en) 2018-11-08
EP3970906A1 (en) 2022-03-23
DE112015004118T5 (de) 2017-06-14
GB201703250D0 (en) 2017-04-12
EP4372107A2 (en) 2024-05-22
AU2015315390A1 (en) 2017-02-02
EP3970906B1 (en) 2024-04-03

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