JP2015501594A5 - - Google Patents

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Publication number
JP2015501594A5
JP2015501594A5 JP2014537801A JP2014537801A JP2015501594A5 JP 2015501594 A5 JP2015501594 A5 JP 2015501594A5 JP 2014537801 A JP2014537801 A JP 2014537801A JP 2014537801 A JP2014537801 A JP 2014537801A JP 2015501594 A5 JP2015501594 A5 JP 2015501594A5
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JP
Japan
Prior art keywords
membrane
cell
substrate
hole
stress layer
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Application number
JP2014537801A
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English (en)
Japanese (ja)
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JP6210992B2 (ja
JP2015501594A (ja
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Priority claimed from PCT/IB2012/055919 external-priority patent/WO2013061298A2/en
Publication of JP2015501594A publication Critical patent/JP2015501594A/ja
Publication of JP2015501594A5 publication Critical patent/JP2015501594A5/ja
Application granted granted Critical
Publication of JP6210992B2 publication Critical patent/JP6210992B2/ja
Active legal-status Critical Current
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JP2014537801A 2011-10-28 2012-10-26 応力層を持つ事前圧壊容量マイクロマシン・トランスデューサセル Active JP6210992B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161552482P 2011-10-28 2011-10-28
US61/552,482 2011-10-28
PCT/IB2012/055919 WO2013061298A2 (en) 2011-10-28 2012-10-26 Pre-collapsed capacitive micro-machined transducer cell with stress layer

Publications (3)

Publication Number Publication Date
JP2015501594A JP2015501594A (ja) 2015-01-15
JP2015501594A5 true JP2015501594A5 (enExample) 2015-11-26
JP6210992B2 JP6210992B2 (ja) 2017-10-11

Family

ID=47505271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014537801A Active JP6210992B2 (ja) 2011-10-28 2012-10-26 応力層を持つ事前圧壊容量マイクロマシン・トランスデューサセル

Country Status (8)

Country Link
US (1) US9534949B2 (enExample)
EP (1) EP2771132B1 (enExample)
JP (1) JP6210992B2 (enExample)
CN (1) CN103917304B (enExample)
BR (1) BR112014009659A2 (enExample)
MX (1) MX347686B (enExample)
RU (1) RU2603518C2 (enExample)
WO (1) WO2013061298A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2750806B1 (en) * 2011-12-20 2019-05-08 Koninklijke Philips N.V. Ultrasound transducer device and method of manufacturing the same
CN105263851B (zh) 2013-05-31 2017-10-13 罗伯特·博世有限公司 被限位的膜
DE102013223695B4 (de) * 2013-11-20 2016-09-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum herstellen eines kapazitiven ultraschallwandlers und anordnung einer mehrzahl von kapazitiven ultraschallwandlern
WO2015131083A1 (en) * 2014-02-28 2015-09-03 The Regents Of The University Of California Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut)
US10674999B2 (en) * 2014-11-25 2020-06-09 Koninklijke Philips N.V. Ultrasound system and method
CN105792084B (zh) * 2016-04-26 2020-02-21 瑞声声学科技(深圳)有限公司 Mems麦克风及其制造方法
EP4289521A3 (en) * 2016-12-22 2024-03-27 Koninklijke Philips N.V. Systems and methods of operation of capacitive radio frequency micro-electromechanical switches
RU2672099C2 (ru) * 2016-12-23 2018-11-12 Евгений Анатольевич Обжиров Электрическая машина емкостная (эме) с ячейками внутреннего сжатия
JP6970935B2 (ja) * 2017-06-21 2021-11-24 パナソニックIpマネジメント株式会社 物理量センサ
DE102019203829B4 (de) * 2019-03-20 2020-12-31 Vitesco Technologies GmbH Verfahren zum Herstellen einer Fluidsensorvorrichtung und Fluidsensorvorrichtung
US11904357B2 (en) * 2020-05-22 2024-02-20 GE Precision Healthcare LLC Micromachined ultrasonic transducers with non-coplanar actuation and displacement

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619476A (en) * 1994-10-21 1997-04-08 The Board Of Trustees Of The Leland Stanford Jr. Univ. Electrostatic ultrasonic transducer
DE69932587D1 (de) 1999-02-09 2006-09-14 St Microelectronics Srl Verfahren zur Herstellung von integrierten Bauelementen mit elektromechanischen Mikrostrukturen, ohne Restspannung
US20030022412A1 (en) 2001-07-25 2003-01-30 Motorola, Inc. Monolithic semiconductor-piezoelectric device structures and electroacoustic charge transport devices
US7489593B2 (en) 2004-11-30 2009-02-10 Vermon Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor
WO2009037655A2 (en) 2007-09-17 2009-03-26 Koninklijke Philips Electronics, N.V. Production of pre-collapsed capacitive micro-machined ultrasonic transducers and applications thereof
WO2009041675A1 (en) * 2007-09-25 2009-04-02 Canon Kabushiki Kaisha Electrostatic transducer and manufacturing method therefor
US7745248B2 (en) 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
WO2009077961A2 (en) * 2007-12-14 2009-06-25 Koninklijke Philips Electronics, N.V. Collapsed mode operable cmut including contoured substrate
EP2145696A1 (en) * 2008-07-15 2010-01-20 UAB Minatech Capacitive micromachined ultrasonic transducer and its fabrication method
JP2010061976A (ja) * 2008-09-03 2010-03-18 Toshiba Corp スイッチ及びesd保護素子
JP5628178B2 (ja) 2008-09-16 2014-11-19 コーニンクレッカ フィリップス エヌ ヴェ 容量性マイクロマシン超音波トランスデューサ
EP2400893B1 (en) 2009-02-27 2017-01-04 Koninklijke Philips N.V. Pre-collapsed cmut with mechanical collapse retention
US8402831B2 (en) * 2009-03-05 2013-03-26 The Board Of Trustees Of The Leland Standford Junior University Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
WO2013061204A2 (en) * 2011-10-28 2013-05-02 Koninklijke Philips Electronics N.V. Pre-collapsed capacitive micro-machined transducer cell with plug
IN2014CN03656A (enExample) * 2011-11-17 2015-10-16 Koninkl Philips Nv
EP2750806B1 (en) * 2011-12-20 2019-05-08 Koninklijke Philips N.V. Ultrasound transducer device and method of manufacturing the same

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