JP2015224281A - Resin composition and resin molding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition that prevents its dimension from changing when formed into a resin molding.SOLUTION: A resin composition comprises, as main components of resin, polyethylene terephthalate resin, at least one resin selected from polypropylene resin, acrylonitrile-butadiene-styrene resin, and polyethylene resin, planar inorganic particles, a chain extender, and a plasticizer.

Description

  The present invention relates to a resin composition and a resin molded body.

  Conventionally, various resin compositions have been provided, and thermoplastic resins are also used in parts such as home appliances and various parts of automobiles, casings, office equipment, and casings of electronic and electrical equipment.

For example, Patent Document 1 discloses that (A) 100 parts by mass of a polyester resin in which 70 mol% or more of the repeating units are alkylene (2 to 6 carbon atoms) terephthalate units, and (B) the flexural modulus is 10 ⁴ kg / cm ^2. A polyester resin composition comprising 2 to 30 parts by mass of the following soft resin and (C) 0 to 400 parts by mass of reinforcing filler is disclosed.

  Patent Document 2 includes (a) 1 to 99 parts by mass of thermoplastic polyester, (b) 1 part by mass of polyolefin 99 (provided (a) + (b) = 100 parts by mass), and (c) in the molecule. And at least two functional groups having a functional group selected from the group consisting of carboxyl group, acid anhydride group, epoxy group, (meth) acryloyl group, amino group, alkoxysilyl group, hydroxyl group, isocyanate group, and oxazoline group A thermoplastic resin composition containing 0.1 to 30 parts by weight of the containing compound is disclosed.

JP 58-045253 A JP 2004-204210 A

  The objective of this invention is providing the resin composition in which generation | occurrence | production of the dimensional change at the time of setting it as a resin molding is suppressed.

The above object is achieved by the present invention described below.
That is, the invention according to claim 1
As the main component of the resin, polyethylene terephthalate resin, and at least one resin selected from polypropylene resin, acrylonitrile butadiene styrene resin, and polyethylene resin;
Planar inorganic particles,
A chain extender;
A plasticizer,
Is a resin composition.

The invention according to claim 2
As the main component of the resin, polyethylene terephthalate resin, and at least one resin selected from polypropylene resin, acrylonitrile butadiene styrene resin, and polyethylene resin;
Planar inorganic particles,
A chain extender;
A plasticizer,
It is the resin molding containing.

  According to the first aspect of the present invention, the inorganic particles are planar with respect to the resin composition mainly composed of polyethylene terephthalate resin and polypropylene resin, acrylonitrile butadiene styrene resin, and polyethylene resin. Compared with the case where any one of the chain extender and the plasticizer is not included, a resin composition is provided in which the occurrence of a dimensional change when the resin molded body is formed is suppressed.

  According to the second aspect of the present invention, the inorganic particles are planar with respect to a resin composition comprising as a main component a polyethylene terephthalate resin and a polypropylene resin, an acrylonitrile butadiene styrene resin, and a polyethylene resin. Thus, a resin composition in which the occurrence of a dimensional change is suppressed is provided as compared with the case where any one of a chain length agent and a plasticizer is not included.

  Hereinafter, embodiments of the resin composition and the resin molded body of the present invention will be described.

<Resin composition>
The resin composition according to the present embodiment is at least one selected from polyethylene terephthalate resin (PET), polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE) as the main component of the resin. It contains a seed resin and contains planar inorganic particles, a chain length agent, and a plasticizer.

Here, the main component is a polyethylene terephthalate resin (PET), a polypropylene resin (PP), an acrylonitrile butadiene styrene resin (with respect to all resins contained in the resin composition according to the present embodiment or the resin molding. ABS) and the total content of at least one resin selected from polyethylene resin (PE) (that is, the total content of the PET, PP, ABS, and PE) means 60% by mass or more.
The total content of at least one resin selected from polyethylene terephthalate resin (PET), polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE) in the resin is further 65. More preferably, it is more than 70 mass%, and still more preferably 70 mass% or more.

  A resin composition comprising as a main component a polyethylene terephthalate resin (PET) and at least one resin selected from polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE) is a resin. When formed into a molded body, dimensional changes such as shrinkage (so-called sink) and warping may occur. In addition, the above-mentioned dimensional change was more remarkable as the environment in which the resin molded body was placed was higher and the humidity was higher.

On the other hand, in this embodiment, the main component is at least one resin selected from polyethylene terephthalate resin (PET), polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE). Generation | occurrence | production of a dimensional change is suppressed by containing a planar inorganic particle, a chain length agent, and a plasticizer with respect to a resin composition.
The mechanism that achieves this effect is presumed as follows. That is, it is considered that the dimensional change can be achieved by the planar inorganic particles, the crystallization energy can be decreased by the chain length agent, and the crystallization temperature can be decreased by the plasticizer. Specifically, the chain length agent has a reactive group at both ends, and serves to increase the molecular weight by connecting the resin molecules. Due to this effect, crystallization is inhibited due to the increase in the molecular weight and the rigidity of the chain length for PET to be crystallized by folding molecules and at least one resin selected from PE, ABS and PE. It is speculated that it can be done. In addition, it is speculated that the plasticizer has a function of increasing the mobility of molecules and can lower the crystallization temperature.
By these actions, it is considered that dimensional change can be suppressed from both physical dimensional change suppression and chemical crystallization suppression.

  In addition, the resin composition according to the present embodiment is further provided with an impact resistance and a self-supporting shape retaining property (this is equivalent to a resin molded body made of acrylonitrile butadiene styrene resin, a resin molded body made of acrylonitrile butadiene styrene resin and polycarbonate resin, etc.) Thus, a resin molded body having mechanical properties such as a deflection temperature under load, mechanical properties such as a deflection temperature under load, and wet heat characteristics can be obtained. In addition, since the resin composition has high transparency, a resin molded body excellent in colorability by the colorant can also be obtained.

  Next, each component will be described.

-Resin-
In the present embodiment, polyethylene terephthalate resin (PET) as a main component of resin, and at least one resin selected from polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE), Including.

・ Polyethylene terephthalate resin (PET)
As the polyethylene terephthalate resin (PET), known polyethylene terephthalate such as polyethylene terephthalate obtained by dehydration condensation of ethylene glycol and terephthalic acid is used. Biomass PET or recycled PET may be used.

The weight average molecular weight of the polyethylene terephthalate resin is not particularly limited, but is preferably 10,000 or more and 500,000 or less, and more preferably 30,000 or more and 100,000 or less.
The weight average molecular weight of the polyethylene terephthalate resin is measured by gel permeation chromatograph (GPC). The molecular weight measurement by GPC is carried out with a chloroform solvent using a Tosoh Corporation HPLC1100 as a measuring apparatus, using a Tosoh column TSKgel GMHHR-M + TSKgel GMHHR-M (7.8 mm ID 30 cm). The weight average molecular weight is calculated from the measurement result using a molecular weight calibration curve prepared with a monodisperse polystyrene standard sample.
The weight average molecular weight of other resins such as polyethylene resin (PE) described later is also measured by the same method.

  The resin used in combination with the polyethylene terephthalate resin is at least one resin selected from polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE), which is known as a general-purpose resin. .

・ Polypropylene resin (PP)
As the polypropylene resin (PP), known polypropylene resins such as isotactic (isotactic), syndiotactic and atactic are used due to the difference in stereoregularity. Copolymers with these monomers may also be used. Biomass PP or recycled PP may be used.

・ Acrylonitrile butadiene styrene resin (ABS)
The acrylonitrile butadiene styrene resin (ABS) is a copolymer of acrylonitrile, styrene, and butadiene, and may be a mixture or a bulk polymerization product thereof. Biomass ABS or recycled ABS may be used.

・ Polyethylene resin (PE)
As the polyethylene resin (PE), known polyethylene such as very low density polyethylene, low density polyethylene, linear low density polyethylene, and high density polyethylene is used. Even if it is a homopolymer of ethylene, other than α-olefin, etc. Copolymers with these monomers may also be used. Biomass PE or recycled PE may be used.

  The weight average molecular weight of at least one resin selected from polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE) is not particularly limited, but is 10,000 or more and 500 Is preferably 10,000 or less, more preferably 10,000 or more and 300,000 or less.

  The mass ratio of polyethylene terephthalate resin (PET) and at least one resin selected from polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE) in this embodiment is 95: The range of 5 to 50:50 is preferable, the range of 95: 5 to 60:40 is more preferable, and the range of 90:10 to 70:30 is still more preferable.

Other resin The resin composition in the present embodiment includes at least one selected from polyethylene terephthalate resin (PET), polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE). Other resins may be used in combination with the resin. However, when other resins are used in combination, the proportion of the other resins is 10% by mass or less.

  Examples of other resins include conventionally known thermoplastic resins, and specifically, polycarbonate resins; polyester resins; polyolefin resins; polyester carbonate resins; polyphenylene ether resins; polyphenylene sulfide resins; Polysulfene resin; Polyarylene resin; Polyetherimide resin; Polyacetal resin; Polyvinyl acetal resin; Polyketone resin; Polyetherketone resin; Polyetheretherketone resin; Polyarylketone resin; Polyethernitrile resin; Polyparabanic acid resin; one or more vinyls selected from the group consisting of aromatic alkenyl compounds, methacrylic acid esters, acrylic acid esters, and vinyl cyanide compounds; Vinyl polymer or copolymer resin obtained by polymerizing or copolymerizing a monomer; diene-aromatic alkenyl compound copolymer resin; vinyl cyanide-diene-aromatic alkenyl compound copolymer resin; aromatic Alkenyl compound-diene-vinyl cyanide-N-phenylmaleimide copolymer resin; vinyl cyanide- (ethylene-diene-propylene (EPDM))-aromatic alkenyl compound copolymer resin; polyolefin; vinyl chloride resin; Vinyl chloride resin; and the like. These resins may be used alone or in combination of two or more.

-Compatibilizer In this embodiment, the dispersion of at least one resin selected from polyethylene terephthalate resin (PET), polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE). A compatibilizing agent may be further added from the viewpoint of improvement.
The compatibilizer effective for dispersing at least one resin selected from polyethylene terephthalate resin and polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE) is particularly limited. Instead, known compatibilizers are used, and examples include epoxy group-containing copolymers such as epoxy resins.

Examples of the epoxy resin include those containing epoxy acryl inside and outside the molecule.
More specifically, among these epoxy resins, NOF A4300, A4400, CL430, etc. are mentioned.
In addition, only 1 type may be used for a compatibilizing agent, or 2 or more types may be mixed and used for it.

  The addition amount of the compatibilizer is 100 parts by mass of a total amount of at least one resin selected from polyethylene terephthalate resin (PET), polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE). Is preferably from 0.1 parts by weight to 100 parts by weight, more preferably from 0.5 parts by weight to 20 parts by weight, still more preferably from 1 part by weight to 10 parts by weight, and more preferably from 1 part by weight to 5 parts by weight. More preferred is less than or equal to parts by weight.

-Planar inorganic particles-
In this embodiment, it contains planar inorganic particles. The flat shape means a plate-like shape and does not include a needle-like shape or a fiber-like shape.

-Aspect ratio The length of the maximum diameter in the direction parallel to the plane of the inorganic particles that are planar (that is, the length of the longest axis) is the "a-axis length", and the length of the minimum diameter in the direction parallel to the plane Is the “b-axis length” and the length of the maximum diameter in the direction perpendicular to the plane (that is, the thickness of the plane) is “c-axis length”, the aspect ratios of the planar inorganic particles are as follows: A range is preferable.
That is, the aspect ratio of “a-axis length / b-axis length” is preferably 1 or more and 1000 or less, and more preferably 1 or more and 500 or less.
The aspect ratio of “a-axis length / c-axis length” is preferably 5 or more and 1000 or less, and more preferably 5 or more and 500 or less.

Examples of the planar inorganic particles include talc, magnesium hydroxide, mica, and clay.
The planar inorganic particles may be used alone or in combination of two or more.

The volume average particle diameter of the planar inorganic particles is preferably 0.001 μm to 100 μm, and more preferably 0.01 μm to 10 μm.
By being above the lower limit value, an advantage of dispersibility can be obtained, while by being below the upper limit value, an advantage can be obtained in which a decrease in mechanical strength is suppressed.

  The volume average particle diameter is measured using a Coulter Multisizer II type (manufactured by Coulter, Inc.) using the Coulter method. Specifically, it is calculated by measuring the particle size distribution of the resin particles using an aperture having an aperture diameter of 20 μm to 2000 μm according to the particle diameter, using a Coulter Multisizer type II. The number of particles to be measured is 50,000.

The content of the planar inorganic particles is not particularly limited, but at least one selected from the polyethylene terephthalate resin (PET), polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE). It is preferable that they are 0.01 mass part or more and 30 mass parts or less with respect to 100 mass parts of total amounts of seed | species resin. Furthermore, 0.1 mass part or more and 10 mass parts or less are more preferable, and 0.5 mass part or more and 5 mass parts or less are still more preferable.
When the content is equal to or higher than the lower limit, a decrease in mechanical strength is suppressed, and when the content is equal to or lower than the upper limit, a decrease in mechanical strength is suppressed.

-Chain length agent-
In this embodiment, a chain length agent is contained. The chain extender refers to a compound having two or more functional groups capable of reacting with the end group of the polyethylene terephthalate resin (PET) and having a function of connecting the molecules of the resin.

  Examples of the chain extender having a functional group that reacts with a terminal group of polyethylene terephthalate resin (PET) include carbodiimide compounds, dicarboxylic acid compounds, diol compounds, hydroxycarboxylic acid compounds, epoxy compounds, isocyanate group-containing compounds, oxazoline compounds, Examples thereof include phenyl carbonate compounds, phenyl ester compounds, lactam compounds, and aromatic tetracarboxylic acid anhydrides.

Examples of the carbodiimide compound include aliphatic monocarbodiimide, aliphatic dicarbodiimide, aromatic monocarbodiimide, aromatic dicarbodiimide, and the like.
Examples of the dicarboxylic acid compound include succinic acid, adipic acid, sebacic acid, and the like.
Examples of the diol compound include ethylene glycol, propylene glycol, bisphenol A, and the like.
Examples of the hydroxycarboxylic acid compound include lactic acid, 3-hydroxybutyric acid, 6-hydroxyhexanoic acid and the like.
Examples of the epoxy compound include bisphenol type epoxy and novolac type epoxy.
Examples of the isocyanate group-containing compound include aromatic diisocyanates having 6 to 20 carbon atoms (excluding carbon in the NCO group, the same shall apply hereinafter), aliphatic diisocyanates having 2 to 18 carbon atoms, and alicyclic rings having 4 to 15 carbon atoms. Formula diisocyanates, araliphatic diisocyanates having 8 to 15 carbon atoms, modified products of these diisocyanates, and mixtures of two or more of these are used. Specific examples of the isocyanate group-containing compound include phenylene diisocyanate, tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), naphthylene diisocyanate, ethylene diisocyanate, hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI), xylylene diisocyanate ( XDI), lysine triisocyanate and the like.
A chain length agent may be used individually by 1 type, and may use 2 or more types together.

  Among these, as the chain extender, those having an imide structure are preferable, and carbodiimide compounds are more preferable. Specific compounds include diphenylcarbodiimide, di-cyclohexylcarbodiimide, di-2,6-dimethylphenylcarbodiimide, dioctyldecylcarbodiimide, diisopropylcarbodiimide, N, N'-di-p-aminophenylcarbodiimide, N, N'- Dioctyldecylcarbodiimide, N, N′-di-2,6-dimethylphenylcarbodiimide, N, N′-di-2,6-diisopropylphenylcarbodiimide, 2,6,2 ′, 6′-tetraisopropyldiphenylcarbodiimide, N , N'-di-p-hydroxyphenylcarbodiimide, N, N'-dicyclohexylcarbodiimide, N, N'-benzylcarbodiimide, N, N'-di-p-ethylphenylcarbodiimide, N, N'- Di-o-isopropyl Phenylcarbodiimide, N, N′-di-2,6-diethylphenylcarbodiimide, N, N′-di-2-ethyl-6-isopropylphenylcarbodiimide, N, N′-di-2-isobutyl-6-isopropylphenyl Examples thereof include carbodiimide, N, N′-di-2,4,6-trimethylphenylcarbodiimide, N, N′-di-2-isobutyl-6-isopropylphenylcarbodiimide and the like.

The content of the chain extender is not particularly limited, but at least one selected from the polyethylene terephthalate resin (PET), polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE). It is preferable that it is 0.01 mass part or more and 5 mass parts or less with respect to 100 mass parts of total amounts of resin. Furthermore, 0.01 mass part or more and 4 mass parts or less are more preferable, and 0.01 mass part or more and 3 mass parts or less are still more preferable.
When the content is not less than the above lower limit, the chain extension effect is appropriately exhibited. On the other hand, when the amount is not more than the above upper limit, deterioration of mechanical properties due to excessive ester attack of imide is prevented.

-Plasticizer-
In this embodiment, a plasticizer is contained. The plasticizer can impart plasticity to the polyethylene terephthalate resin (PET) and at least one resin selected from polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE). Refers to a compound.
In addition, as a plasticizer, it is more preferable that it is a compound which can provide a flame retardance further.

Examples of the plasticizer include the following compounds.
First, plasticizers that are not flame retardant include triethyl citrate, acetyl triethyl citrate, dibutyl phthalate, diaryl phthalate, diethyl phthalate, dimethyl phthalate, triethyl phosphate, triphenyl phosphate, tripropionine, and tartaric acid. Dibutyl, triacetin, adipate plasticizer, polyester plasticizer, phthalic acid, tetrahydrophthal, azelain, dodecane, fumaric acid, pyromellitic acid, itaconic acid, ricinoleic acid, other fatty acids, phosphoric acid, monoester, glycerin, epoxy, Examples thereof include derivatives such as isophthalic acid, sebacic acid, maleic acid, trimellitic acid, citric acid, oleic acid, stearic acid, sulfonic acid, glutarsan, glycol, and paraffin.

Examples of the flame retardant plasticizer include phosphoric acid esters (including condensed phosphoric acid esters).
Examples of phosphate esters include trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri (2-ethylhexyl) phosphate, tributoxyethyl phosphate, triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, tris (isopropylphenyl) phosphate. , Tris (phenylphenyl) phosphate, trinaphthyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, diphenyl (2-ethylhexyl) phosphate, di (isopropylphenyl) phenyl phosphate, monoisodecyl phosphate, 2-acryloyloxyethyl acid Phosphate, 2-methacryloyloxyethyl acid phosphate, diphenyl Examples include 2-acryloyloxyethyl phosphate, diphenyl-2-methacryloyloxyethyl phosphate, melamine phosphate, dimelamine phosphate, melamine pyrophosphate, triphenylphosphine oxide, tricresylphosphine oxide, diphenyl methanephosphonate, and diethyl phenylphosphonate. It is done.

  Examples of the condensed phosphate ester include aromatic condensed phosphate esters such as bisphenol A type, biphenylene type, and isophthal type. Specifically, for example, a condensed phosphate ester represented by the following general formula (A) and a condensed phosphate ester represented by the following general formula (B) can be mentioned.

In general formula (A), Q ¹ , Q ² , Q ³ and Q ⁴ each independently represent an alkyl group having 1 to 6 carbon atoms, Q ⁵ and Q ⁶ each independently represent a methyl group, Q ⁷ and Q ⁸ each independently represent a hydrogen atom or a methyl group, m1, m2, m3 and m4 each independently represent an integer of 0 or more and 3 or less, and m5 and m6 each independently represent 0 or more and 2 The following integer is represented, n1 represents the integer of 0-10.

In the general formula (B), Q ⁹ , Q ¹⁰ , Q ¹¹ and Q ¹² each independently represents an alkyl group having 1 to 6 carbon atoms, Q ¹³ represents a methyl group, m7, m8, m9 and m10. Each independently represents an integer of 0 or more and 3 or less, m11 represents an integer of 0 or more and 4 or less, and n2 represents an integer of 0 or more and 10 or less.

  The condensed phosphate ester may be a synthetic product or a commercial product. As a commercial product of condensed phosphate ester, for example, “PX200”, “PX201”, “PX202”, “CR741”, which are commercial products manufactured by Daihachi Chemical Industry Co., Ltd., “Adekastab FP2100” which is a commercial product manufactured by Adeka Company And “ADK STAB FP2200”.

  Among the plasticizers mentioned above, phosphate esters (particularly PX200) are more preferably used.

The content of the plasticizer is not particularly limited, but is at least one resin selected from the polyethylene terephthalate resin (PET), polypropylene resin (PP), acrylonitrile butadiene styrene resin (ABS), and polyethylene resin (PE). 5 parts by mass or more and 50 parts by mass or less are preferable, and 5 parts by mass or more and 40 parts by mass or less are more preferable with respect to the total amount of 100 parts by mass.
When content is more than the said lower limit, the advantage that the flame retardance of V-2 or more is obtained is acquired. On the other hand, when it is not more than the above upper limit value, an advantage of suppressing deterioration of mechanical properties due to plasticity is obtained.

-Other ingredients-
In the present embodiment, other components other than those described above may be further included as necessary.
Examples of other components include flame retardants, antioxidants, mold release agents, light proofing agents, weathering agents, colorants, pigments, modifiers, anti-drip agents, antistatic agents, anti-hydrolysis agents, and fillers. And reinforcing agents (glass fiber, carbon fiber, clay, glass flake, milled glass, glass bead, crystalline silica, alumina, silicon nitride, alumina nitride, boron nitride, etc.).

-Flame retardant In this embodiment, you may further add a flame retardant in the range which does not impair the effect.
Examples of the flame retardant include phosphorus-based, silicone-based, nitrogen-containing, sulfuric acid, inorganic hydroxide-based flame retardants.
Examples of the phosphorus flame retardant include aluminum phosphate, examples of the silicone flame retardant include dimethylsiloxane, nano silica, and silicone-modified polycarbonate. Examples of the nitrogen-containing flame retardant include a melamine compound and a triazine compound. Examples of the sulfuric flame retardant include melamine sulfate and guanidine sulfate, and examples of the inorganic hydroxide flame retardant include magnesium hydroxide and aluminum hydroxide.

  The content of these other components is preferably 0% by mass or more and 5% by mass or less with respect to the entire resin composition. Here, “0 mass%” means that other components are not included.

[Method for Producing Resin Composition]
The resin composition according to this embodiment is produced, for example, by melt-kneading a mixture of the above components. In addition, the resin composition according to the present embodiment is produced, for example, by dissolving the above components in a solvent. Examples of the melt-kneading means include known means, and specific examples include a twin screw extruder, a Henschel mixer, a Banbury mixer, a single screw extruder, a multi-screw extruder, and a kneader.

<Resin molding>
The resin molding which concerns on this embodiment consists of the resin composition which concerns on this embodiment. That is, the resin molded body according to the present embodiment is configured with the same composition as the resin composition according to the present embodiment.
Specifically, the resin molded body according to the present embodiment is obtained by molding the resin composition according to the present embodiment. As the molding method, for example, injection molding, extrusion molding, blow molding, hot press molding, calendar molding, coating molding, cast molding, dipping molding, vacuum molding, transfer molding, or the like may be applied.

  The molding method of the resin molded body according to the present embodiment is preferably injection molding because it has a high degree of freedom in shape. The resin composition according to the present embodiment has high fluidity and can be applied by injection molding. The injection molding may be performed using a commercially available apparatus such as NEX150 manufactured by NISSEI RESIN INDUSTRY, NEX70000 manufactured by NISSEI RESIN INDUSTRY, SE50D manufactured by Toshiba Machine.

The molding temperature at the time of molding the resin molded body (for example, cylinder temperature in the case of injection molding) is preferably 200 ° C. or higher and 300 ° C. or lower, and more preferably 220 ° C. or higher and 280 ° C. or lower.
The mold temperature in the case of injection molding is, for example, 40 ° C. or more and 60 ° C. or less, and more preferably 45 ° C. or more and 55 ° C. or less.

  The resin molded body according to the present embodiment is suitably used for applications such as electronic / electrical equipment, office equipment, home appliances, automobile interior materials, and containers. More specifically, casings for electronic / electrical equipment and home appliances; various parts of electronic / electrical equipment and home appliances; interior parts for automobiles; storage cases such as CD-ROM and DVD; tableware; beverage bottles; Wrap material; film; sheet;

  EXAMPLES The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited to these examples.

[Examples 1 to 3, Comparative Examples 1 to 11]
The components shown in Table 1 and Table 2 were kneaded at a cylinder temperature of 270 ° C. using a biaxial kneader (Toshiki Machine, TEM58SS) to obtain resin composition pellets.
A test piece (ISO 527 tensile test, which was molded with an injection molding machine (NEX150, manufactured by Nissei Plastic Industry Co., Ltd.) with a cylinder temperature of 270 ° C. and a mold temperature of 50 ° C. with gates on both sides in the length direction. Corresponding to ISO178 bending test, test section thickness 4mm, width 10mm, UL test piece for UL-94 (thickness: 0.8mm, 1.6mm), and D2 test piece (length, width 60mm, 2 mm thick) was molded.

In addition, the detail of the component of following Table 1 and Table 2 is as follows.
・ Polymer “PET” = polyethylene terephthalate resin (Toyota Tsusho, BCB80)
"PP" = Polypropylene resin (Polypro, Novatec PP MA3)
“Compatibilizer” = ethylene glycidyl methacrylate-acrylonitrile srene copolymer, manufactured by NOF Corporation, A4400
Inorganic particles “talc” = planar inorganic particles (manufactured by Nippon Talc Co., Ltd., trade name: D-600, aspect ratio a-axis length / b-axis length: 1, a-axis length / c-axis length: 8)
“Comparative inorganic particles” = Fibrous inorganic particles (manufactured by Kinsei Matec Co., Ltd., trade name: wollastonite, aspect ratio a-axis length / b-axis length: 4, a-axis length / c-axis length: 8)
・ Chain length agent “carbodiimide” = (Nisshinbo Chemical Co., Ltd., trade name: LA1)
・ Plasticizer “Plasticizer 1” = Phosphate ester (Flame retardance, manufactured by Daihachi Chemical Co., Ltd., trade name: PX-200)
“Plasticizer 2” = benzyl-2- (2-methoxyethoxy) ethyl adipate (manufactured by Daihachi Chemical Co., Ltd., trade name: DAIFACTY-101)

<Evaluation test>
-Flame resistance-
Flame retardancy was evaluated using a UL test piece according to the V test of the UL-94 standard. Judgment criteria are V-0, V-1, V-2, and fire spread in the order of excellent flame retardancy.

-Tensile strength, elongation-
Using test pieces molded with gates on both sides in the length direction, in accordance with ISO 527, with an evaluation device (manufactured by Shimadzu Corporation, precision universal testing machine Autograph AG-IS 5 kN), tensile strength and elongation Was measured.

-Impact resistance-
A test piece formed by forming gates on both sides in the length direction is notched, and using this, in accordance with JIS-K7111 (2006), an evaluation apparatus (DG-UB2 manufactured by Toyo Seiki Co., Ltd.) is used. Impact resistance was measured from an impact test.

-Deflection temperature under load (HDT)-
Deflection temperature under a load of 1.8 MPa with a HDT measuring device (HDT-3, manufactured by Toyo Seiki Co., Ltd.) in accordance with ISO178 bending test, using test pieces formed with gates on both sides in the length direction. (° C.) was measured.

-Dimensional change (initial)-
The D2 test piece was left to stand for 24 hours under the conditions of 28 ° C. and 31% RH, and the dimensional change rate (%) of the test piece before and after being left was measured for each of the TD direction and the MD direction of the test piece.

-Dimensional change (under wet heat)-
The D2 test piece was allowed to stand for 1000 hours under the conditions of 28 ° C. and 90% RH, and the dimensional change rate (%) of the test piece before and after being left was measured for each of the TD direction and the MD direction of the test piece.

  From the above results, it can be seen that this example has a smaller dimensional change rate in the initial stage and under wet heat than in this comparative example. In particular, it can be seen that Example 1 has a smaller dimensional change rate at the initial stage and under wet heat than Comparative Examples 8 to 9 having the same composition.

Claims (2)

As the main component of the resin, polyethylene terephthalate resin, and at least one resin selected from polypropylene resin, acrylonitrile butadiene styrene resin, and polyethylene resin;
Planar inorganic particles,
A chain extender;
A plasticizer,
A resin composition comprising: As the main component of the resin, polyethylene terephthalate resin, and at least one resin selected from polypropylene resin, acrylonitrile butadiene styrene resin, and polyethylene resin;
Planar inorganic particles,
A chain extender;
A plasticizer,
A resin molded body containing