JP2015198064A - 通信モジュール及び通信モジュール用コネクタ - Google Patents
通信モジュール及び通信モジュール用コネクタ Download PDFInfo
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- JP2015198064A JP2015198064A JP2014076878A JP2014076878A JP2015198064A JP 2015198064 A JP2015198064 A JP 2015198064A JP 2014076878 A JP2014076878 A JP 2014076878A JP 2014076878 A JP2014076878 A JP 2014076878A JP 2015198064 A JP2015198064 A JP 2015198064A
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- Prior art keywords
- communication module
- connector
- thickness
- module
- module substrate
- Prior art date
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- 238000004891 communication Methods 0.000 title claims abstract description 64
- 238000003780 insertion Methods 0.000 claims abstract description 99
- 230000037431 insertion Effects 0.000 claims abstract description 99
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 230000008054 signal transmission Effects 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 abstract description 26
- 230000006866 deterioration Effects 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 230000001902 propagating effect Effects 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009429 electrical wiring Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/56—Means for preventing chafing or fracture of flexible leads at outlet from coupling part
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
C1=f・λ f:周波数 λ:信号波長
従って、真空中での信号波長が24.0mmであっても、図7に示される第1接続端子34及び第2接続端子54を伝搬する際の実際の信号波長は約12.0mmになる。すなわち、図7に示される高さ(H)は、真空中での信号波長との関係では1/4に止められており、現実的な信号波長との関係では1/2に止められている。もっとも、コネクタ2の内部は、誘電体と空気(真空とほぼ同じ誘電率)の複合構造である。よって、上記説明は考え方の概要を述べたものであり、実効的な比誘電率(ε)はより小さいと考えてよい。何れにしても、本実施形態では、信号伝送路に占めるコネクタ部分の長さが、信号伝送路を伝搬する信号の波長の数分の1程度の長さに止められており、信号劣化が低減される。
2 通信モジュール用コネクタ(コネクタ)
5 モジュール基板
30 プラグコネクタ
31 挿入凸部
32 フランジ部
33a 外側面(右外側面)
33b 外側面(左外側面)
34 第1接続端子
34a (第1接続端子の)上部
34b (第1接続端子の)下部
35,36 (第1接続端子の)端部
37,57 接続パッド
50 レセプタクルコネクタ
51 挿入凹部
52 底部
53a 内側面(右内側面)
53b 内側面(左内側面)
54 第2接続端子
54a (第2接続端子の)上部
54b (第2接続端子の)下部
55,56 (第2接続端子の)端部
Claims (6)
- 通信モジュールに設けられるプラグコネクタと、前記通信モジュールが接続される基板に設けられるレセプタクルコネクタと、から構成される通信モジュール用コネクタであって、
前記プラグコネクタは、前記通信モジュールが備えるモジュール基板に接続される挿入凸部を有し、
前記レセプタクルコネクタは、前記挿入凸部が挿入される挿入凹部を有し、
前記挿入凸部の互いに平行な2つの外側面には、複数の第1接続端子が配列され、
前記挿入凹部の互いに平行な2つの内側面には、前記第1接続端子が接触する複数の第2接続端子が配列され、
前記モジュール基板の厚みは、前記挿入凸部の厚みの1/4以上3/4以下である、
通信モジュール用コネクタ。 - 請求項1に記載の通信モジュール用コネクタであって、
前記モジュール基板の厚みが0.25mm以上0.75mm以下である、
通信モジュール用コネクタ。 - 請求項1又は2に記載の通信モジュール用コネクタであって、
前記モジュール基板には、信号伝送路の一部を形成する導電路が設けられ、
前記導電路の、前記モジュール基板の厚さ方向の長さは、前記挿入凸部の厚みの1/4以上3/4以下である、
通信モジュール用コネクタ。 - 基板に接続される通信モジュールであって、
モジュール基板が収容された筐体と、
前記基板に設けられているレセプタクルコネクタに接続されるプラグコネクタと、を備え、
前記プラグコネクタは、前記レセプタクルコネクタが備える挿入凹部に挿入される挿入凸部であって、前記モジュール基板に接続された挿入凸部を有し、
前記挿入凸部の互いに平行な2つの外側面には、前記挿入凹部の互いに平行な2つの内側面にそれぞれ配列されている複数の第2接続端子に接触する複数の第1接続端子がそれぞれ配列され、
前記モジュール基板の厚みは、前記挿入凸部の厚みの1/4以上3/4以下である、
通信モジュール。 - 請求項4に記載の通信モジュールであって、
前記モジュール基板の厚みが0.25mm以上0.75mm以下である、
通信モジュール。 - 請求項4又は5に記載の通信モジュールであって、
前記モジュール基板には、信号伝送路の一部を形成する導電路が設けられ、
前記導電路の、前記モジュール基板の厚さ方向の長さは、前記挿入凸部の厚みの1/4以上3/4以下である、
通信モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014076878A JP2015198064A (ja) | 2014-04-03 | 2014-04-03 | 通信モジュール及び通信モジュール用コネクタ |
US14/672,330 US9373906B2 (en) | 2014-04-03 | 2015-03-30 | Communication module and communication module connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014076878A JP2015198064A (ja) | 2014-04-03 | 2014-04-03 | 通信モジュール及び通信モジュール用コネクタ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015198064A true JP2015198064A (ja) | 2015-11-09 |
Family
ID=54210550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014076878A Pending JP2015198064A (ja) | 2014-04-03 | 2014-04-03 | 通信モジュール及び通信モジュール用コネクタ |
Country Status (2)
Country | Link |
---|---|
US (1) | US9373906B2 (ja) |
JP (1) | JP2015198064A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101933997B1 (ko) * | 2017-06-23 | 2018-12-31 | (주)티에이치엔 | 플러그인 타입 ips 모듈 |
JP7351552B2 (ja) | 2022-02-09 | 2023-09-27 | Necプラットフォームズ株式会社 | 基板、基板製造方法及び基板接続方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11831101B2 (en) * | 2022-01-05 | 2023-11-28 | Dell Products L.P. | Fine alignment adapter for a connector |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09223553A (ja) * | 1996-02-15 | 1997-08-26 | Nippon F C I:Kk | コネクタ |
JP2011176021A (ja) * | 2010-02-23 | 2011-09-08 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP2013051133A (ja) * | 2011-08-31 | 2013-03-14 | Yamaichi Electronics Co Ltd | リセプタクル用ケージ、リセプタクルアッセンブリー、トランシーバモジュールアッセンブリー |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005005148A (ja) * | 2003-06-12 | 2005-01-06 | Denso Corp | 電動式アクチュエータ用コネクタ |
US7160141B2 (en) * | 2004-10-26 | 2007-01-09 | Fci Americas Technology, Inc. | Low-profile, high speed, board-to-board connector system |
US20060232922A1 (en) * | 2005-04-15 | 2006-10-19 | Jiun-Hong Tong | Portable digital storage device |
JP4374379B2 (ja) * | 2005-04-21 | 2009-12-02 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
JP2007134150A (ja) | 2005-11-10 | 2007-05-31 | Sharp Corp | マイクロストリップコネクタ及びそれを用いた接続装置 |
US7672141B2 (en) * | 2006-10-30 | 2010-03-02 | Dell Products L.P. | Alignment and support apparatus for component and card coupling |
US8018729B2 (en) * | 2008-02-19 | 2011-09-13 | Lsi Corporation | Method and housing for memory module including battery backup |
US8264842B2 (en) * | 2010-03-30 | 2012-09-11 | Elitegroup Computer Systems Co., Ltd. | Data processing device and motherboard module thereof |
-
2014
- 2014-04-03 JP JP2014076878A patent/JP2015198064A/ja active Pending
-
2015
- 2015-03-30 US US14/672,330 patent/US9373906B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09223553A (ja) * | 1996-02-15 | 1997-08-26 | Nippon F C I:Kk | コネクタ |
JP2011176021A (ja) * | 2010-02-23 | 2011-09-08 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP2013051133A (ja) * | 2011-08-31 | 2013-03-14 | Yamaichi Electronics Co Ltd | リセプタクル用ケージ、リセプタクルアッセンブリー、トランシーバモジュールアッセンブリー |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101933997B1 (ko) * | 2017-06-23 | 2018-12-31 | (주)티에이치엔 | 플러그인 타입 ips 모듈 |
JP7351552B2 (ja) | 2022-02-09 | 2023-09-27 | Necプラットフォームズ株式会社 | 基板、基板製造方法及び基板接続方法 |
Also Published As
Publication number | Publication date |
---|---|
US9373906B2 (en) | 2016-06-21 |
US20150288087A1 (en) | 2015-10-08 |
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