JP2015174103A - レーザ加工方法 - Google Patents

レーザ加工方法 Download PDF

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Publication number
JP2015174103A
JP2015174103A JP2014051407A JP2014051407A JP2015174103A JP 2015174103 A JP2015174103 A JP 2015174103A JP 2014051407 A JP2014051407 A JP 2014051407A JP 2014051407 A JP2014051407 A JP 2014051407A JP 2015174103 A JP2015174103 A JP 2015174103A
Authority
JP
Japan
Prior art keywords
processing
groove
trim
laser
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014051407A
Other languages
English (en)
Japanese (ja)
Inventor
慶介 寺山
Keisuke Terayama
慶介 寺山
潤 小原
Jun Kohara
潤 小原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amada Weld Tech Co Ltd
Original Assignee
Amada Miyachi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amada Miyachi Co Ltd filed Critical Amada Miyachi Co Ltd
Priority to JP2014051407A priority Critical patent/JP2015174103A/ja
Priority to PCT/JP2015/050031 priority patent/WO2015136948A1/fr
Publication of JP2015174103A publication Critical patent/JP2015174103A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2014051407A 2014-03-14 2014-03-14 レーザ加工方法 Pending JP2015174103A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014051407A JP2015174103A (ja) 2014-03-14 2014-03-14 レーザ加工方法
PCT/JP2015/050031 WO2015136948A1 (fr) 2014-03-14 2015-01-05 Procédé de traitement au laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014051407A JP2015174103A (ja) 2014-03-14 2014-03-14 レーザ加工方法

Publications (1)

Publication Number Publication Date
JP2015174103A true JP2015174103A (ja) 2015-10-05

Family

ID=54071403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014051407A Pending JP2015174103A (ja) 2014-03-14 2014-03-14 レーザ加工方法

Country Status (2)

Country Link
JP (1) JP2015174103A (fr)
WO (1) WO2015136948A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10748973B2 (en) 2016-11-25 2020-08-18 Samsung Display Co., Ltd. Display device with film groove having inclined and stepped side surface
WO2021039588A1 (fr) 2019-08-23 2021-03-04 トーカロ株式会社 Procédé de traitement de surface
JP7462219B2 (ja) 2020-05-08 2024-04-05 パナソニックＩｐマネジメント株式会社 レーザ加工装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6070813A (en) * 1998-08-11 2000-06-06 Caterpillar Inc. Laser drilled nozzle in a tip of a fuel injector
JP4899265B2 (ja) * 2000-11-16 2012-03-21 凸版印刷株式会社 多層配線基板及びその製造方法、並びにレーザードリル装置
JP2003136268A (ja) * 2001-11-06 2003-05-14 Hitachi Via Mechanics Ltd プリント基板の穴あけ加工方法
KR100661108B1 (ko) * 2003-03-17 2006-12-26 미쓰비시덴키 가부시키가이샤 레이저 가공방법
WO2010123068A1 (fr) * 2009-04-22 2010-10-28 古河電気工業株式会社 Dispositif de traitement au laser et procédé de traitement au laser

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10748973B2 (en) 2016-11-25 2020-08-18 Samsung Display Co., Ltd. Display device with film groove having inclined and stepped side surface
US11195891B2 (en) 2016-11-25 2021-12-07 Samsung Display Co., Ltd. Display device having film with groove
US11925062B2 (en) 2016-11-25 2024-03-05 Samsung Display Co., Ltd. Display device having film with protruding portion
WO2021039588A1 (fr) 2019-08-23 2021-03-04 トーカロ株式会社 Procédé de traitement de surface
KR20220038800A (ko) 2019-08-23 2022-03-29 도카로 가부시키가이샤 표면처리 방법
JP7462219B2 (ja) 2020-05-08 2024-04-05 パナソニックＩｐマネジメント株式会社 レーザ加工装置

Also Published As

Publication number Publication date
WO2015136948A1 (fr) 2015-09-17

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