JP2015170671A - Wafer storage method, wafer storage device, and wafer take-out method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inhibit warpage of a wafer.SOLUTION: A wafer storage method includes: a step where an arm 32 suctions an upper surface of a first wafer 20a and stores the first wafer in a container 22; a step where a member 10b is placed on the first wafer so that an opening 12b of the member 10b is positioned at the arm in a state where the arm suctions the upper surface of the first wafer; and a step where the arm releases the first wafer with the member placed on the first wafer, passes through the opening, and separates from the first wafer.

Description

  The present invention relates to a wafer storage method, a wafer storage device, and a wafer take-out method, and, for example, relates to a wafer storage method, a wafer storage device, and a wafer take-out method in which a member placed on a wafer has an opening.

  A wafer storage method for storing semiconductor wafers in a container by stacking semiconductor wafers is known (for example, Patent Documents 1 and 2). In such a wafer storing method, the wafer is protected by interposing the sheet between the wafers.

JP-A-9-129719 JP-A-9-232416

  When the wafer is stored in the container or when the wafer is taken out from the container, the wafer may be warped. An object of the present wafer storage method, wafer storage apparatus, and wafer take-out method is to suppress wafer warpage.

  A step in which the arm adsorbs the upper surface of the first wafer and the first wafer is stored in a container; and the member is disposed so that an opening of the member is positioned on the arm while the arm adsorbs the upper surface of the first wafer. And a step of placing the arm on the first wafer and the arm separating the first wafer, passing through the opening, and leaving the first wafer with the member placed on the first wafer. A wafer storing method is used.

  A step in which an arm passes through the opening and sucks an upper surface of the wafer while a member having an opening is placed on the wafer housed in a container; and the arm holds the wafer in a state where the arm sucks the wafer. And a step of removing the wafer from the container.

  A first arm that sucks the upper surface of the wafer and stores the wafer in a container, and the member is placed on the wafer such that an opening of the member is positioned on the first arm with the first arm sucking the upper surface of the wafer. And a second arm placed on the wafer, wherein the first arm separates the wafer while the member is placed on the wafer, passes through the opening, and leaves the wafer. Use the device.

  According to the present wafer storage method, wafer storage device, and wafer removal method, warpage of the wafer can be suppressed.

1A is a perspective view of a member used in Example 1, FIG. 1B is a cross-sectional view of a wafer placed on the member, and FIG. 1C is an area A in FIG. 1B. It is an enlarged view. FIG. 2 is a block diagram of the wafer storage device. FIG. 3A to FIG. 3D are perspective views (part 1) illustrating the wafer storing method according to the first embodiment. FIGS. 4A to 4C are perspective views (part 2) illustrating the wafer storing method according to the first embodiment. FIG. 5A to FIG. 5C are perspective views (part 3) illustrating the wafer storing method according to the first embodiment. FIG. 6A to FIG. 6E are perspective views (part 4) illustrating the wafer storing method according to the first embodiment. FIG. 7 is a cross-sectional view taken along line AA in FIG. FIG. 8A to FIG. 8C are perspective views (part 1) illustrating the wafer removal method according to the first embodiment. FIG. 9A to FIG. 9C are perspective views (part 2) illustrating the wafer removal method according to the first embodiment. FIG. 10A to FIG. 10C are perspective views (part 3) illustrating the wafer removal method according to the first embodiment. FIG. 11A to FIG. 11D are cross-sectional views illustrating a wafer storage method according to Comparative Example 1. FIG. 12A to FIG. 12C are enlarged sectional views of the wafer edge. FIG. 13A to FIG. 13D are cross-sectional views showing a wafer removal method according to Comparative Example 1. 14A and 14B are enlarged cross-sectional views of the wafer edge. FIG. 15A to FIG. 15D are cross-sectional views illustrating the wafer storage method according to the first embodiment. FIG. 16A to FIG. 16D are cross-sectional views illustrating the wafer removal method according to the first embodiment. 17A is a perspective view of a member used in Example 2, FIG. 17B is a cross-sectional view of a wafer placed on the member, and FIG. 17C is an area A of FIG. 17B. It is an enlarged view. FIG. 18 is a cross-sectional view in which a wafer is stored in a container according to the second embodiment. FIG. 19A is a perspective view in which a wafer is placed on a member used in Example 3, and FIG. 19B is an enlarged view of a region A in FIG. FIG. 20A is a perspective view in which a wafer is placed on a member used in the fourth embodiment, and FIG. 20B is an enlarged view of a region A in FIG. FIG. 21A to FIG. 21D are perspective views (part 1) illustrating the wafer storing method according to the fourth embodiment. FIG. 22A to FIG. 22C are perspective views (part 2) illustrating the wafer storing method according to the fourth embodiment. FIG. 23A to FIG. 23C are perspective views (part 1) illustrating the wafer removal method according to the fourth embodiment. FIGS. 24A to 24C are perspective views (part 2) illustrating the wafer removal method according to the fourth embodiment. 25A is a perspective view of a member used in Example 5, FIG. 25B is a cross-sectional view taken along the line AA in FIG. 25A, and FIG. 25C is a view when the member and the wafer are stacked. A cross-sectional view, FIG. 25 (d) is an enlarged view of region A in FIG. 25 (c). FIG. 26A to FIG. 26F are plan views of arms used in the sixth embodiment.

  Hereinafter, embodiments will be described with reference to the drawings.

  1A is a perspective view of a member used in Example 1, FIG. 1B is a cross-sectional view of a wafer placed on the member, and FIG. 1C is an area A in FIG. 1B. It is an enlarged view. As shown in FIG. 1A, the member 10 has a sheet shape and has an opening 12. The opening 12 corresponds to the shape of an arm that sucks the wafer. The material of the member 10 is, for example, resin. The resin is, for example, polycarbonate, polyethylene, polypropylene, modified polyphenylene ether, polyether sulfone, polyether ether ketone, or acrylonitrile butadiene styrene. The thickness of the member 10 is 0.5 mm to 3.0 mm, for example.

  As shown in FIGS. 1B and 1C, the semiconductor wafer 20 overlaps the member 10. The wafer 20 is, for example, a silicon wafer. The diameter of the wafer 20 is, for example, 300 mm. The lower surface of the wafer 20 contacts the upper surface of the member 10. The lower surface of the wafer 20 is a surface 19 on which a circuit is formed. The member 10 and the wafer 20 are each circular and have substantially the same diameter.

  FIG. 2 is a block diagram of the wafer storage device. As shown in FIG. 2, the wafer storage device 60 includes robots 62 and 64 and stands 65 and 66. Robots 62 and 64 have robot arms 32 and 34, respectively. The tip of the arm 32 can attract and release the wafer 20. The tip of the arm 34 can adsorb and release the member 10. For example, a vacuum suction method is used as a method for sucking the wafer 20 and the member. The stand 65 supports the container 22. The container 22 includes a base 24 and a wall 26. The container 22 stores the wafer 20 and the member 10 in the wall 26. The stand 66 supports the plurality of members 10 in a stacked manner. A wall 68 is provided on the upper surface of the base 66. The wall 68 restricts the movement of the members 10 so that the positions of the plurality of members 10 are aligned with each other. The horizontal direction in which the arms 32 and 34 move when the wafer 20 and the member 10 are stored in the container 22 is the X direction, the horizontal direction orthogonal to the X direction is the Y direction, and the vertical direction is the Z direction.

  Each of the arms 32 and 34 has a joint 61. The arms 32 and 34 can be bent from the joint 61. Thereby, the tips of the arms 32 and 34 can be moved linearly in the X direction. As the robots 62 and 64 move in the Y direction, the arms 32 and 34 move in the Y direction. The robots 62 and 64 can move the arms 32 and 34 in the Z direction. Robots 62 and 64 can move arms 32 and 34 independently.

  Next, a method for storing wafers in the container 22 will be described. FIG. 3A to FIG. 6E are perspective views illustrating the wafer storage method according to the first embodiment. As shown in FIG. 3A, the container 22 for storing the wafer is, for example, a coin stack type container. The container 22 includes a base 24 and a wall 26. The base 24 has a flat plate shape. The wall 26 is formed on the base 24 and is cylindrical. In the wall 26, a slit 23 for moving the arms 32 and 34 is formed. Inside the wall 26 is a storage area 27 for storing wafers. The inner diameter of the wall is the same as or slightly larger than the diameter of the wafer to be stored. The arm 34 adsorbs the upper surface of the member 10a and moves the member 10a upward of the container 22 as indicated by an arrow 50a.

  As shown in FIG. 3B, the arm 34 aligns the member 10 a with the storage area 27 in the wall 26. The arm 34 lowers the member 10 a as indicated by an arrow 52 a and stores it in the storage area 27 in the wall 26. As shown in FIG. 3C, the arm 34 releases the member 10a. The arm 34 rises as indicated by an arrow 54a and moves away from the container 22 as indicated by an arrow 56a. As shown in FIG. 3 (d), the member 10 a is accommodated in the container 22.

  As shown in FIG. 4A, the arm 32 sucks the upper surface of the wafer 20a (for example, the back surface where no circuit is formed), and moves the wafer 20a above the container 22 as indicated by an arrow 50b. As shown in FIG. 4B, the arm 32 aligns the wafer 20 a with the storage area 27. The arm 32 lowers the wafer 20 a as indicated by an arrow 52 b and stores it in the storage area 27 in the wall 26. As shown in FIG. 4C, the wafer 20 a is stored in the storage area 27 of the container 22 while being attracted to the arm 32. At least a part of the lower surface of the wafer 20a contacts the upper surface of the member 10a.

  As shown in FIG. 5A, in the state where the arm 32 is sucking the upper surface of the wafer 20a, the arm 34 sucks the upper surface of the member 10b, and the member 10b is placed above the container 22 as indicated by an arrow 50c. Move to. As shown in FIG. 5B, the arm 34 aligns the member 10 b with the storage area 27. The arm 34 lowers the member 10b as indicated by the arrow 52c and stores it in the storage area 27 in the wall 26. Since the member 10 b is provided with an opening corresponding to the arm 32, the member 10 b does not contact the arm 32. As shown in FIG. 5C, the arm 34 releases the member 10b, rises as indicated by an arrow 54b, and leaves the container 22 as indicated by an arrow 56b.

  As shown in FIG. 6A, the arm 32 releases the wafer 20a, rises as indicated by an arrow 54c, and moves away from the container 22 as indicated by an arrow 56c. At this time, the arm 32 passes through the opening of the member 10b. As illustrated in FIG. 6B, the member 10 b overlaps the wafer 20 a in the storage area 27. At least a part of the lower surface of the member 10b is in contact with the upper surface of the wafer 20a. As shown in FIG. 6C, the arms 32 and 34 similarly place the wafer 20b on the member 10b and the member 10c on the wafer 20b. As shown in FIG. 6D, the arms 32 and 34 stack a desired number of wafers and members. A spacer 25 is placed on the laminated wafer and member. The spacer 25 is a member that is softer than the wafer and the member, and appropriately applies stress to the wafer and the member to protect the wafer and the member. The spacer 25 may not be provided. As shown in FIG. 6 (e), the container 22 is covered with a lid 28.

  FIG. 7 is a cross-sectional view taken along line AA in FIG. A plurality of wafers 20 and members 10 are alternately stacked in the wall 26 of the container 22. The spacer 25 is placed on the uppermost wafer 20 or the member 10. The lid 28 has an upper wall 28a and a side wall 28b. The lower end of the side wall 28 b comes into contact with the upper surface of the base 24 of the container 22. In this state, the upper end of the wall 26 and the upper wall 28a are separated from each other.

  Next, a method for taking out the wafer from the container will be described. FIG. 8A to FIG. 10C are perspective views illustrating the wafer removal method according to the first embodiment. As shown in FIG. 8A, the wafer 20 b and the member 10 c are stored in the storage area 27 of the container 22. A member 10c is disposed on the wafer 20b. The arm 32 moves above the container 22 as indicated by an arrow 56d. As shown in FIG. 8B, the arm 32 is aligned with the opening of the member 10c and descends as indicated by an arrow 54d. As shown in FIG. 8C, the arm 32 sucks the upper surface of the wafer 20b. An opening corresponding to the arm 32 is formed in the member 10c. For this reason, the arm 32 does not contact the member 10c.

  As shown in FIG. 9A, the arm 34 moves above the member 10c as indicated by an arrow 56e. As shown in FIG. 9B, the arm 34 descends as indicated by an arrow 54e and sucks the upper surface of the member 10c. As shown in FIG. 9C, the arm 34 raises the member 10c as indicated by an arrow 52d and separates the member 10c from the container 22 as indicated by an arrow 50d while the arm 32 is attracted to the upper surface of the wafer 20b. .

  As shown in FIG. 10A, the member 10 c is taken out from the container 22. As shown in FIG. 10B, the arm 32 raises the wafer 20b as indicated by an arrow 52e and separates it from the container 22 as indicated by an arrow 50e. As shown in FIG. 10C, the wafer 20b is taken out from the container 22. Thereafter, similarly, the member 10b and the wafer 20a are taken out from the container 22.

  In order to explain the effect of the first embodiment, a wafer storing method in the first comparative example in which no opening is formed in the member 10a will be described. FIG. 11A to FIG. 11D are cross-sectional views illustrating a wafer storage method according to Comparative Example 1. As shown in FIG. 11A, the member 10 a is accommodated in the wall 26 of the container 22. A wafer 20a is overlaid on the member 10a. The wafer 20a is warped. For example, when the wafer 20a is polished and thinned, the wafer 20a may be warped. For example, when the wafer 20a is a single crystal silicon wafer having a diameter of 300 mm and the thickness is 100 μm, the warp amount L may be about 10 mm.

  As shown in FIG. 11B, the member 10b is placed on the wafer 20a. The arm 32 sucks the wafer 20b and aligns it above the member 10b. As shown in FIG. 11C, the arm 32 places the wafer 20b on the member 10b. As shown in FIG. 11D, the wafer 20b is further lowered by the weight of the wafer 20b and the lowering of the arm 32.

  FIG. 12A to FIG. 12C are enlarged sectional views of the wafer edge. As shown in FIG. 12A, when the wafer 20b is lowered as indicated by an arrow 45 with the end of the wafer 20a hitting the wall 26, the wafer 20a is sandwiched between the wall 26 and the member 10a, and the curvature of the wafer 20a is reached. The stress concentrates on the portion 40 where the current becomes small. Thereby, the wafer 20a may be broken.

  As shown in FIG. 12B, when the warpage of the wafer 20a is improved as the wafer 20b is lowered as indicated by an arrow 45, a position 42 where the end of the wafer 20a and the member 10b come into contact with each other is indicated by an arrow 41. Move like. Thereby, dust is generated. Further, the wafer 20a is scratched.

  As shown in FIG. 12C, as the wafer 20 b is lowered as indicated by an arrow 45, a location 44 where the end of the wafer 20 a contacts the wall 26 moves as indicated by an arrow 43. Thereby, dust is generated. Further, the wafer 20a is scratched.

  FIG. 13A to FIG. 13D are cross-sectional views showing a wafer removal method according to Comparative Example 1. As shown in FIG. 13A, the member 10 a is accommodated in the wall 26 of the container 22. A wafer 20a is overlaid on the member 10a. The wafer 20a is warped.

  As shown in FIG. 13B, the arm 32 is aligned above the wafer 20a. As shown in FIG. 13C, the arm 32 moves down to suck the wafer 20a. When the wafer 20a is warped, a gap is formed between the arm 32 and the wafer 20a. For this reason, the arm 32 is difficult to attract the wafer 20a. As shown in FIG. 13D, the arm 32 is further lowered to attract the wafer 20a.

  14A and 14B are enlarged cross-sectional views of the wafer edge. As shown in FIG. 14A, when the arm 32 is lowered with the end of the wafer 20a hitting the wall 26, the wafer 20a is sandwiched between the wall 26 and the member 10a, and the curvature of the wafer 20a is reduced. Stress concentrates at 48. Thereby, the wafer 20a may be broken. As shown in FIG. 14B, a location 47 where the end of the wafer 20a contacts the wall 26 moves as indicated by an arrow 46. Thereby, dust is generated. Further, the wafer 20a is scratched.

  Thus, in Comparative Example 1, since the wafer 20a is warped, the wafer 20a is broken, scratched, or dust is generated.

  FIG. 15A to FIG. 15D are cross-sectional views illustrating the wafer storage method according to the first embodiment. As shown in FIG. 15A, the member 10 a having the opening 12 a is accommodated in the wall 26 of the container 22. The arm 32 sucks the wafer 20a and stacks it on the member 10a. When the arm 32 having a flat suction surface sucks the wafer 20a, the warpage of the wafer 20a becomes smaller than that in FIG. For example, the warp of the wafer 20a is reduced by the arm 32 attracting a wide range of the wafer 20a.

  As shown in FIG. 15B, the member 10b is placed on the wafer 20a with the arm 32 adsorbing the wafer 20a. An opening 12b corresponding to the shape of the arm 32 is formed in the member 10b. Thereby, the member 10b does not contact the arm 32.

  As shown in FIG. 15C, the arm 32 releases the wafer 20a. At this time, since the load of the flat member 10b is applied to the wafer 20a, the warpage of the wafer 20a is suppressed. For example, when the wafer 20a is a 300 mm diameter single crystal silicon wafer and the thickness is 100 μm, the weight of the member 10b is set to 150 g, so that the wafer 20a can be maintained substantially flat.

  As shown in FIG. 15D, the arm 32 sucks the wafer 20b and stacks it on the member 10b.

  FIG. 16A to FIG. 16D are cross-sectional views illustrating the wafer removal method according to the first embodiment. As shown in FIG. 16A, the member 10a, the wafer 20a, and the member 10b are accommodated in the container 22. Since the member 10b is placed on the wafer 20a, the warpage of the wafer 20a is suppressed. As shown in FIG. 16B, the arm 32 is aligned above the wafer 20a. As shown in FIG. 16C, the arm 32 is attracted to the upper surface of the wafer 20a. At this time, the arm 32 does not contact the member 10b by the opening 12b. As shown in FIG. 16D, the member 10b is taken out. Even when the member 10b is taken out, the warp of the wafer 20a is suppressed because the arm 32 sucks the wafer 20a.

  According to the first embodiment, as shown in FIGS. 4A to 4C, the arm 32 (first arm) sucks the upper surface of the wafer 20 a (first wafer) and stores the wafer 20 a in the container 22. . As shown in FIGS. 5A to 5C, the arm 34 (second arm) moves the member 10b so that the opening of the member 10b is positioned at the arm 32 in a state where the arm 32 sucks the upper surface of the wafer 20a. Place on the wafer 20a. As shown in FIGS. 6A and 6B, with the member 10b placed on the wafer 20a, the arm 32 separates the wafer 20a, passes through the opening, and leaves the wafer 20a. Thereby, the warpage of the wafer 20a can be suppressed as shown in FIGS. Therefore, cracking of the wafer 20a, scratches on the wafer 20a, and generation of dust can be suppressed. Thereafter, as shown in FIG. 6C, the wafer 20b can be accommodated in the container 22 by placing the wafer 20b (second wafer) on the member 10b.

  As shown in FIGS. 8A to 8C, the arm 32 (first arm) passes through the opening while the member 10c having the opening is placed on the wafer 20b accommodated in the container 22. The upper surface of the wafer 20b is sucked. As shown in FIGS. 9A to 9C, the arm 34 (second arm) takes out the member 10c from the container while the arm 32 sucks the wafer 20b. Thereby, the warpage of the wafer 20b can be suppressed as shown in FIGS. Therefore, cracking of the wafer 20b, scratches on the wafer 20a, and generation of dust can be suppressed. Thereafter, as shown in FIG. 10A to FIG. 10C, the arm 32 can take out the wafer 20 b from the container 22.

  17A is a perspective view of a member used in Example 2, FIG. 17B is a cross-sectional view of a wafer placed on the member, and FIG. 17C is an area A of FIG. 17B. It is an enlarged view. As illustrated in FIG. 17A, the member 10 includes a flat portion 11 and a protrusion 14. The protrusion 14 is provided around the flat portion 11. The protrusion 14 is continuously provided on the entire periphery of the flat portion 11. The protrusion 14 may be provided on a part of the periphery of the flat portion 11. Further, the protrusion 14 may be provided other than the periphery of the flat portion 11.

  As shown in FIGS. 17B and 17C, bumps 21 are formed on the lower surface of the wafer 20 (surface 19 on which a circuit is formed). The bump 21 is, for example, solder. The height of the bump 21 is, for example, 100 μm. The protrusion 14 is higher than the bump 21. When the height of the bump 21 is, for example, 100 μm, the height of the protrusion is, for example, 110 μm to 500 μm. Other configurations are the same as those of the first embodiment shown in FIGS. 1A to 1C, and the wafer storage method and the wafer take-out method are the same as those of the first embodiment, and the description thereof is omitted.

  FIG. 18 is a cross-sectional view in which a wafer is stored in a container according to the second embodiment. As shown in FIG. 18, the members 10 and the wafers 20 are alternately stacked. Due to the protrusion 14, the bump 21 of the wafer 20 is not in contact with the flat portion 11. Other configurations are the same as those of the first embodiment shown in FIG.

  According to the second embodiment, the member 10 has the protrusion 14 protruding upward, and the wafer 20 is placed on the protrusion 14. Thereby, when the lower surface of the wafer 20 contacts the upper end of the protrusion 14, the lower end of the bump 21 does not contact the upper surface of the flat portion 11 of the member 10. Therefore, for example, when the wafer 20 is housed in the container 22 and transported, even if vibration or the like is applied, the lower end of the bump 21 can be prevented from being damaged and the bump 21 can be prevented from being crushed.

  Even when the bumps 21 are not formed on the wafer 20, the surface 19 on which the circuit is formed does not contact the flat portion 11. Thereby, it can suppress that the surface 19 is damaged.

  Bumps 21 and circuits are not formed around the wafer 20. Therefore, the protrusion 14 is preferably provided around the flat portion 11.

  FIG. 19A is a perspective view in which a wafer is placed on a member used in Example 3, and FIG. 19B is an enlarged view of a region A in FIG. As shown in FIGS. 19A and 19B, the sheet 16 is provided on the flat portion 11. An opening 17 having the same shape as the opening 12 is formed in the sheet 16. The openings 12 and 17 are continuous. The sheet 16 is softer than the flat portion 11. Examples of the material for the sheet 16 include embossed clean paper, embossed antistatic polyethylene, conductive foamed polyurethane, conductive foamed polystyrene, conductive urethane rubber, conductive nitrile rubber, conductive ethylene Propylene rubber or silicone rubber can be used. Since the sheet 18 is conductive, electrostatic breakdown of a circuit formed on the wafer 20 can be suppressed. The sheet 18 may not be conductive. The thickness of the sheet 18 can be set to 300 μm to 500 μm, for example.

  The bumps 21 of the wafer 20 face the sheet 16. The sheet 16 and the bump 21 are not in contact. Other configurations are the same as those in the second embodiment, and the wafer storage method and the wafer take-out method are the same as those in the first embodiment, and the description thereof is omitted.

  FIG. 20A is a perspective view in which a wafer is placed on a member used in the fourth embodiment, and FIG. 20B is an enlarged view of a region A in FIG. As shown in FIGS. 20A and 20B, a sheet 18 is provided on the flat portion 11. The sheet 18 has no opening 12 formed therein. The sheet 18 is softer than the flat portion 11. The material of the sheet 18 is the same as that of the sheet 16 of the third embodiment, for example. Other configurations are the same as those of the third embodiment, and the description thereof is omitted.

  Next, a method for storing sheets will be described. FIG. 21A to FIG. 22C are perspective views illustrating a wafer storing method according to the fourth embodiment. The process up to FIG. 3D of the first embodiment is performed. Thereafter, as shown in FIG. 21A, the arm 34 sucks the upper surface of the sheet 18a and moves the member 10a upward of the container 22 as indicated by an arrow 50f. As shown in FIG. 21B, the arm 34 aligns the sheet 18 a with the storage area 27 in the wall 26. The arm 34 lowers the sheet 18a as indicated by an arrow 52f and places it on the member 10a. As shown in FIG. 21C, the arm 34 releases the seat 18a. The arm 34 rises as indicated by an arrow 54f and moves away from the container 22 as indicated by an arrow 56a. As shown in FIG. 21 (d), the sheet 18 a is placed on the member 10 a in the container 22.

  As shown in FIG. 22A, the arm 32 attracts the upper surface of the wafer 20a and moves the wafer 20a upward of the container 22 as indicated by an arrow 50g. As shown in FIG. 22B, the arm 32 aligns the wafer 20 a with the storage area 27. The arm 32 lowers the wafer 20 a as indicated by an arrow 52 g and stores it in the storage area 27 in the wall 26. As shown in FIG. 4C, the wafer 20 a is stored in the storage area 27 of the container 22 while being attracted to the arm 32. After that, FIG.

  Next, a method for taking out the sheet will be described. FIG. 23A to FIG. 24C are perspective views illustrating a wafer removal method according to the fourth embodiment. As shown in FIG. 23A, the arm 32 raises the wafer 20a as indicated by an arrow 52h and separates it from the container 22 as indicated by an arrow 50h. As shown in FIG. 23B, the wafer 20a is taken out from the container 22. The uppermost layer in the container 22 is a sheet 18a. As shown in FIG. 23C, the arm 34 moves above the container 22 as indicated by an arrow 56h. As shown in FIG. 24A, the arm 34 is aligned on the seat 18a and descends as indicated by an arrow 54h. As shown in FIG. 24B, the arm 34 is attracted to the upper surface of the sheet 18a. The arm 34 raises the sheet 18a as indicated by an arrow 52i, and separates the sheet 18a from the container 22 as indicated by an arrow 50i. As shown in FIG. 24C, the sheet 18a is taken out from the container 2.

  According to the third and fourth embodiments, the wafer 20 is placed on the member 10 so as to face the sheet 18 that is softer than the member 10 provided on the member 10. Since the sheet 16 is soft, it is possible to prevent the bump 21 from being damaged or the bump 21 from being crushed even if the bump 21 is in contact with the upper surface of the sheet 16. Thereby, for example, when the wafer 20 is housed in the container 22 and transported, it is possible to prevent the bumps 21 from being damaged or the bumps 21 from being crushed even if vibrations are applied.

  In Example 3, the sheet 16 has an opening 17 that is continuous with the opening 12 of the member 10. Thereby, the sheet 16 can be bonded to the member 10.

  In Example 4, no opening is formed in the sheet 18. Therefore, before the wafer 20 is mounted on the member 10, the sheet 18 is placed on the member 10.

  In the third and fourth embodiments, the case where the member 10 includes the protrusion 14 has been described as an example. However, the member 10 may not include the protrusion 14.

  25A is a perspective view of a member used in Example 5, FIG. 25B is a cross-sectional view taken along the line AA in FIG. 25A, and FIG. 25C is a view when the member and the wafer are stacked. A cross-sectional view, FIG. 25 (d) is an enlarged view of region B of FIG. 25 (c).

  As shown in FIGS. 25A and 25B, a layer 14a is formed on the flat portion 11, a layer 14b is formed on the layer 14a, and a plurality of convex portions 15b are formed on the layer 14b. A concave portion 15a is formed on the lower surface of the flat portion 11 corresponding to the convex portion 15b. The layer 14a is formed around the flat portion 11, and the layer 14b is formed around the layer 14a. A step is formed between the layers 14a and 14b.

  As shown in FIGS. 25C and 25D, the lower surface of the wafer 20 is in contact with the upper surface of the layer 14a. The layer 14 a is almost the same height as the bump 21 or higher than the bump 21. Thereby, it is suppressed that the bump 21 contacts the upper surface of the flat part 11. The convex portion 15 b of the member 10 is fitted into the concave portion 15 a of the upper member 10. The method for storing and taking out wafers and members is the same as that in the first embodiment, and a description thereof will be omitted.

  According to Example 5, since the convex part 15b and the recessed part 15a fit, the members 10 do not detach | leave by weight. The wafer 20 is fixed between the members 10 by making the height of the layer 14 b substantially the same as or slightly larger than the thickness of the wafer 20. Accordingly, the wafer 20 can be transported in a bag or the like with the members 10 fixed. Further, the wafer 20 can be stored in a FOSB (Front Opening Shipping Box) or the like while the wafer 20 is sandwiched between the members 10, and the wafer 20 can be transported.

  FIG. 26A to FIG. 26F are plan views of arms used in the sixth embodiment. As shown in FIG. 26A, the arm 32 may be substantially C-shaped. As shown in FIG. 26B, the arm 32 may be Y-shaped. As shown in FIG. 26C, the arm 32 may be X-shaped. As shown in FIG. 26 (d), the arm 32 may have a + shape. As shown in FIG. 26 (e), the arm 32 may be V-shaped. As shown in FIG. 26 (f9, the arm 32 may have a circular shape. Thus, the arm 32 may have a shape other than the U-shape. The arm 32 is not linear but has a two-dimensional extension. The warpage of the wafer 20 adsorbed by 32 can be suppressed.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

In addition, the following additional notes are disclosed regarding the above description.
(Supplementary Note 1) The step in which the arm adsorbs the upper surface of the first wafer and stores the first wafer in a container, and the opening of the member is positioned on the arm in a state where the arm adsorbs the upper surface of the first wafer. A step of placing the member on the first wafer; and a step in which the arm separates the first wafer, passes through the opening, and leaves the first wafer in a state where the member is placed on the first wafer. And a wafer storing method comprising:
(Additional remark 2) The wafer storage method of Additional remark 1 characterized by including the step which accommodates the said 2nd wafer in the said container by mounting a 2nd wafer on the said member.
(Supplementary note 3) The wafer storing method according to supplementary note 2, wherein the second wafer is placed on the member so as to face a sheet softer than the member provided on the member.
(Supplementary note 4) The wafer storing method according to supplementary note 2 or 3, wherein the member includes a protrusion protruding upward, and the second wafer is placed on the protrusion.
(Additional remark 5) The said sheet | seat has an opening connected with the opening of the said member, The wafer storage method of Additional remark 3 characterized by the above-mentioned.
(Appendix 6)
The wafer storing method according to claim 3, further comprising a step of placing the sheet on the member.
(Supplementary note 7) In a state where a member having an opening is placed on a wafer housed in a container, an arm passes through the opening and sucks the upper surface of the wafer, and the arm sucks the wafer, And a step of removing the member from the container.
(Supplementary note 8) The wafer removal method according to supplementary note 7, wherein the wafer is removed from the container in a state where the arm sucks the wafer.
(Additional remark 9) The said member has the protrusion which protrudes upwards, The wafer extraction method of Additional remark 7 or 8 characterized by the above-mentioned.
(Supplementary Note 10) The first arm that sucks the upper surface of the wafer and stores the wafer in a container, and the opening of the member is positioned on the first arm with the first arm sucking the upper surface of the wafer. A second arm for placing a member on the wafer, wherein the first arm separates the wafer in a state where the member is placed on the wafer, passes through the opening, and leaves the wafer. Wafer storage device.
(Supplementary Note 11) A state in which a member having an opening is placed on a wafer housed in a container, a first arm that passes through the opening and sucks the upper surface of the wafer, and a state in which the first arm sucks the wafer And a second arm for taking out the member from the container.

DESCRIPTION OF SYMBOLS 10 Member 11 Flat part 12 Opening 14 Protrusion 16, 18 Sheet 20 Wafer 21 Bump 22 Container

Claims (6)

An arm adsorbs the upper surface of the first wafer and stores the first wafer in a container;
Placing the member on the first wafer such that an opening of the member is positioned on the arm in a state where the arm adsorbs the upper surface of the first wafer;
With the member resting on the first wafer, the arm separating the first wafer, passing through the opening and leaving the first wafer;
A wafer storing method comprising:   2. The wafer storing method according to claim 1, further comprising a step of storing the second wafer in the container by placing the second wafer on the member.   The wafer storage method according to claim 2, wherein the second wafer is placed on the member so as to face a sheet softer than the member provided on the member.   The wafer storing method according to claim 2, wherein the member includes a protrusion protruding upward, and the second wafer is placed on the protrusion. A step in which an arm passes through the opening and sucks the upper surface of the wafer while a member having an opening is placed on the wafer housed in the container;
Taking the member out of the container with the arm adsorbing the wafer;
A method for taking out a wafer, comprising: A first arm for adsorbing the upper surface of the wafer and storing the wafer in a container;
A second arm for placing the member on the wafer such that an opening of the member is positioned on the first arm in a state where the first arm adsorbs the upper surface of the wafer;
Comprising
The wafer storage device, wherein the first arm separates the wafer in a state where the member is placed on the wafer, passes through the opening, and leaves the wafer.

Images