JP2009155085A - Method and device for packing thin-plate substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a device for packing a thin-plate substrate capable of reducing the number of slip sheets to be used by half. <P>SOLUTION: A suction pad 11 sucks a cut portion 21 of slip sheets 2, and lifts the sucked cut portion 21 diagonally upwardly along the cut. A transfer arm 12 sucks one thin-plate substrate 3, and load the sucked thin-plate substrate 3 on a base portion 23 of the slip sheet 2. The suction pad 11 lowers the sucked and lifted cut portion 21, loads the sucked cut portion 21 in a covering manner onto the thin-plate substrate 3 loaded on the base portion 23, and the suction is released. The transfer arm 12 sucks and conveys the next thin-plate substrate 3, and the sucked thin-plate substrate 3 is loaded on the cut portion 21 loaded on the previous thin-plate substrate 3. The suction pad 11 and the transfer arm 12 repeat a series of actions until the number of the stacked thin-plate substrates 3 becomes the predetermined value. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a packaging method and a packaging apparatus for thin-plate substrates that stack and package thin-plate substrates, and in particular, stacks thin-plate substrates such as glass substrates or printed wiring boards and stores them in a packaging box or the like. The present invention relates to a packing method and a packing apparatus for a thin plate substrate.

  Thin plate-like substrates are widely used in electronic devices, such as glass substrates used in flat panel displays such as liquid crystal displays and plasma displays, and home appliances such as personal computers and AV (Audio Video) devices. There are printed wiring boards used. When a thin board is packed in a dedicated box for storage or transportation, a slip sheet as a cushioning material is inserted between the boards to prevent quality degradation such as scratches due to contact between the boards. Stacked. Usually, the substrates and the slip sheets are alternately stacked one by one.

  For example, the slip sheet insertion device described in Patent Document 1 stacks slip sheets drawn from a roll onto a plate material while cutting them into approximately the same size as the plate material.

JP 2001-39611 A

  However, the slip sheet inserting device described in Patent Document 1 alternately stacks the sheet material and the slip sheet one by one, but requires the same number of slip sheets as the sheet material as much as the sheet material. In the case of dealing with an increase in the size of a flat panel display, there is a problem that the cost of the material for the slip sheet becomes high, which causes an increase in cost.

  Furthermore, stacking does not fix the thin plate-like substrate, so there will be a shift in the box after stacking, resulting in quality problems such as damage caused by the shift during storage or transportation, and after unpacking There is a problem that a defect occurs during transfer. Such a problem after unpacking requires a process of alternately taking out the board and interleaf paper from the packaging box after unpacking, and the unloading process is usually performed by a machine, but it is shifted to the board during storage or transportation. If this happens, the machine will attempt to transfer while it is displaced at the time of removal, and the transfer will not be completed normally at the destination, or the corners of the substrate may rub against the inner wall of the packaging box at the time of removal. It is to cause chipping. Furthermore, since the interleaving paper is a lightweight cushioning material, there is a problem that an air current is generated when the interleaving paper is stacked, and the interleaving paper is turned up or displaced.

  An object of the present invention is to provide a packaging method and a packaging apparatus for a thin plate-like substrate that can halve the number of sheets used.

The present invention is a method for packing a thin plate substrate, in which a stacking step of stacking two substrates of a plurality of thin plate substrates is repeatedly packed until the number of stacked substrates reaches a predetermined number.
The stacking step includes
A placing step of placing one slip sheet among a plurality of slip sheets in which a predetermined shape of cut is formed;
A lifting step of lifting one of the first slip sheets separated by the cuts of the slip sheets placed in the placing step;
A first substrate placement that places a first substrate of the plurality of substrates on a second slip sheet portion different from the first slip sheet portion of the slip sheet portion placed in the placing step. Steps,
A slip sheet placing step of lowering the first slip sheet portion lifted in the lifting step and placing the first slip sheet portion on the first substrate placed in the first substrate placing step;
A second substrate mounting that places a second substrate different from the first substrate among the plurality of substrates on the first slip sheet portion that is placed on the first substrate in the slip sheet placing step. A thin plate-like substrate packing method including a placing step.

In the present invention, the predetermined shape is a U-shape.
The first interleaf portion is a U-shaped cut portion formed by a U-shaped cut in the interleaf portion.

In the present invention, the predetermined shape is a square shape.
The first interleaf portion is two U-shaped cut portions formed by a U-shaped cut in the interleaf portion.

In the present invention, the predetermined shape is a D-shaped shape composed of two parallel line segments,
The first interleaf sheet portion is two portions between the outer peripheral edge and each cut line among the interleaf sheet portions separated by the D-shaped cut line,
In the lifting step, one first slip sheet portion of the two first slip sheet portions is lifted,
The first substrate placement step includes:
One end of the first substrate of the plurality of substrates was lifted by the lifting step with a second slip sheet portion different from the first slip sheet portion among the slip sheet portions placed by the placing step. A first insertion step of inserting into a gap with one first slip sheet portion;
A second lifting step of lowering one first interleaving paper portion lifted in the lifting step and then lifting the other first interleaving paper portion of the two first interleaving paper portions;
After inserting the other end of the first substrate into the gap between the second slip sheet portion and the other first slip sheet portion lifted in the second lifting step, the first substrate is And a second insertion step of placing on the two interleaving paper portions.

In the present invention, the substrate has a rectangular shape.
The position where the first substrate is placed on the second interleaf sheet portion is a position where one side of the outer peripheral edge of the first substrate is close to the end portion of the cut. .

Further, the present invention is a packing device for stacking and packing a plurality of thin plate-like substrates,
An adsorbing means that adsorbs and lifts one first interleaf sheet portion separated by the discontinuity of the interleaf sheet portion having a predetermined shape of discontinuity;
A conveying means for adsorbing and conveying the substrate;
After the first interleaving paper portion has been lifted by the adsorbing means, the transport means is configured to change the first substrate of the plurality of substrates from a first interleaving paper portion different from the first interleaving paper portion. After the first interleaving paper portion is lowered by the adsorbing means and the first interleaving paper portion is placed on the first substrate, the plurality of substrates are placed on the interleaving paper portion. The step of placing a second substrate different from the first substrate on the first interleaf sheet portion placed on the first substrate is an odd number until the number of stacked substrates reaches a predetermined number. The packaging apparatus is characterized by repeating the substrate as a first substrate and the even-numbered substrate as a second substrate.

  According to the present invention, when stacking and packing a plurality of thin plate-like substrates, in the stacking step, two of the plurality of thin plate-like substrates are stacked. The stacking step is repeated until the number of substrates to be stacked reaches a predetermined number. The stacking step includes a placing step, a lifting step, a first substrate placing step, a slip sheet placing step, and a second substrate placing step.

  In the placing step, one interleaving paper among a plurality of interleaving papers having a predetermined shape cut is placed at a predetermined position. In the lifting step, one of the first slip sheets separated by the cut is lifted out of the slip sheets placed in the placing step. In the first substrate placing step, the first substrate of the plurality of substrates is replaced with a second slip sheet portion different from the first slip sheet portion among the slip sheet portions placed in the placing step. Put it on top.

  In the interleaving paper placing step, the first interleaving paper portion lifted in the lifting step is lowered and placed on the first substrate placed in the first substrate placing step. In the second substrate placing step, a second substrate different from the first substrate among the plurality of substrates is placed on the first substrate in the slip sheet placing step. Place it on the paper part.

  Therefore, if the method for packing a thin substrate according to the present invention is applied, the number of sheets used can be reduced by half, and the cost can be reduced.

  Further, according to the present invention, when stacking and packing a plurality of thin plate-like substrates, one of the first joints separated by the breaks in the part of the slip sheet in which the cuts having a predetermined shape are formed by the suction means. The paper portion is sucked and lifted, and the substrate is sucked and transported by the transport means.

After the first interleaving paper portion is lifted by the adsorbing means by the conveying means, the first substrate of the plurality of substrates is different from the first interleaving paper portion in the interleaving paper portion. After the first interleaving paper portion is lowered by the adsorbing means and the first interleaving paper portion is placed on the first substrate, among the plurality of substrates, The step of placing the second substrate different from the first substrate on the first interleaf sheet portion placed on the first substrate is performed until the number of stacked substrates reaches a predetermined number. The odd-numbered substrate is repeated as the first substrate, and the even-numbered substrate is repeated as the second substrate.
Therefore, the number of sheets used can be halved, and the cost can be reduced.

  FIG. 1 is a diagram schematically showing a schematic configuration of a transfer packaging device 1 according to an embodiment of the present invention. The method for packing a thin plate substrate according to the present invention is processed by the transfer packing device 1 which is a packing device.

  The transfer packaging device 1 includes a suction pad 11, a transfer arm 12, and an unillustrated slip sheet transport device. The suction pad 11 serving as a suction means is a pad that sucks and lifts a portion 21 separated by a cut in the portion of the interleaf paper 2. The transfer arm 12 serving as a transfer means is an arm that sucks and transfers the thin plate-like substrate 3. An unillustrated slip sheet transporting device transports the slip sheet 2 and places it in a packing box for stacking and storing the thin plate-like substrates 3.

  The interleaving paper 2 is a cushioning material sandwiched between stacked thin-plate substrates 3 and is made of, for example, a material such as polyethylene, polypropylene, polyolefin, polystyrene, or elastomer, and the thickness is the material, thickness, and weight of the substrate. It is decided in consideration of several factors such as.

  The thin plate substrate 3 is a glass substrate used in flat panel displays such as liquid crystal displays and plasma displays, or a printed wiring board used in home appliances such as personal computers and AV (Audio Video) devices. For example, a rectangular shape.

  FIG. 2 is a diagram illustrating an example of the cut 22 formed in the slip sheet 2. FIG. 2A shows the slip sheet 2 in which a U-shaped cut 22 is formed. FIG. 2B is a side view of the slip sheet 2. The interleaving paper 2 has a rectangular shape, and the interleaving paper 2 is formed with a predetermined-shaped cut, for example, a U-shaped cut 22 composed of three straight cuts parallel to the three sides of the outer periphery. ing. In the interleaf paper 2, a part of the interleaf paper 2 (hereinafter referred to as a “cut portion”) is separated by a U-shaped cut line 22 to form a U-shaped cut portion 21 which is a first interleaf portion. Yes. Hereinafter, the portion excluding the U-shaped cut portion 21 in the portion of the slip sheet 2 is referred to as a base portion 23 which is a second slip sheet portion.

  FIG. 3 is a view showing a state in which the cut portion 21 is lifted by the suction pad 11. FIG. 3A is a top view seen from a direction perpendicular to the surface of the slip sheet 2, and FIG. 3B is a side view thereof. An unillustrated slip sheet transporting device transports the slip sheet 2 and places it in a packing box for stacking and storing the thin plate-like substrates 3. The suction pad 11 sucks the cut portion 21 of the slip sheet 2 placed in a packing box or the like, and lifts the sucked cut portion 21 along the cut 22 obliquely upward.

  FIG. 4 is a view showing a state in which the thin plate-like substrates 3 are stacked on the base portion 23 of the interleaving paper 2. FIG. 4A is a top view of a state in which the thin plate-like substrate 3 is stacked on the base portion 23 in a state where the cut portion 21 is lifted, and FIG. 4B is a side view thereof. The suction pad 11 lifts the cut portion 21 sucked to the extent that it does not get in the way to place the thin plate-like substrate 3 on the base portion 23. In this state, the transfer arm 12 sucks the thin plate-like substrate 3 and places the sucked thin plate-like substrate 3 on the base portion 23 of the interleaf paper 2.

  FIG. 5 is a view showing a state in which the cut portion 21 is placed on the thin plate substrate 3. FIG. 5A is a top view showing a state in which the cut portion 21 is placed on the thin plate-like substrate 3, and FIG. 5B is a side view thereof. The suction pad 11 lowers the sucked cut portion 21 and places the sucked cut portion 21 on the thin plate-like substrate 3 placed on the base portion 23 to release the suction.

  FIG. 6 is a view showing a state in which the next thin plate-like substrate 3 a is placed on the cut portion 21. 6A is a top view showing a state in which the next thin plate-like substrate 3a is placed on the cut portion 21, and FIG. 6B is a side view thereof. The transfer arm 12 sucks and conveys the next thin-plate substrate 3a, and places the second thin-plate substrate 3a on the cut portion 21 placed on the previous thin-plate substrate 3.

  The transfer packing apparatus 1 repeats the operations shown in FIGS. 3 to 6 until the number of thin plate-like substrates 3 reaches a predetermined number, for example, the number of packing boxes becomes full. Accordingly, the interleaf paper 2 can serve as a buffer material for the two thin plate-like substrates 3 by the single interleaf paper 2, and the interleaf paper 2 is inserted between the thin plate-like substrates 3 one by one. However, the number of interleaf sheets 2 can be halved.

  FIG. 7 is a view showing an example in which the thin plate-like substrate 3 is placed close to the terminal portion 221 of the cut 22. FIG. 7A is a top view showing a state in which the thin plate-like substrate 3 is placed on the interleaving paper 2 in a state where the cut portion 21 is lifted, and FIG. 7B is a side view thereof. FIG. 7 is shown in FIG. 4 except that the thin substrate 3 is placed at a position where one side of the outer peripheral edge of the thin substrate 3 is close to the terminal portion 221 of the U-shaped cut 22. This is the same state as the above.

  The suction pad 11 lifts the cut portion 21 sucked to the extent that it does not get in the way to place the thin plate-like substrate 3 on the interleaving paper 2. In this state, the transfer arm 12 sucks the thin plate-like substrate 3 and places the sucked thin plate-like substrate 3 on the base portion 23 of the interleaf paper 2. The transfer arm 12 is located at a position where one side of the outer peripheral edge of the thin plate-like substrate 3 is close to the terminal portion 221 of the U-shaped cut 21 when the thin plate-like substrate 3 is placed on the base portion 23. Put.

  Since the movement of the thin plate-like substrate 3 is restricted by the terminal portion 221 of the U-shaped cut line 21, the shift between the thin plate-like substrate 3 and the interleaf 2 can be prevented, and the thin plate-like substrate 3 is damaged by the shift. Can be eliminated.

  Thus, the thin plate-like substrate 3 has a rectangular shape, and the position where the thin plate-like substrate 3 is placed on the base portion 23 is such that one side of the outer peripheral edge of the thin plate-like substrate 3 is a U-shape. Since the position is close to the end portion 221 of the cut line 21, the shift can be prevented, and the thin plate-like substrate 3 can be prevented from being damaged due to the shift generated during storage or transportation.

  FIG. 8 is a diagram illustrating another example of the U-shaped cut line 22. FIG. 8A is a top view of the slip sheet 2a in which two U-shaped cuts 22a1 and 22a2 are formed, and FIG. 8B is the first thin plate-like substrate on the slip sheet 2a. FIG.

  In the example shown in FIG. 8, U-shaped cut portions 21a1, 21a2 in opposite directions are formed by two U-shaped cuts 22a1, 22a2. The thin plate-like substrate 3 is placed on the base portion 23a in a state of being sandwiched between the cut portions 21a1, 21a2 and the base portion 23a excluding the cut portions of the interleaf paper 2a. In the example shown in FIG. 8, it is necessary to provide the suction pad 11 for each U-shaped cut.

  The two U-shaped cuts 22a1 and 22a2 are used when the shape of the thin substrate 3 is large, and when the shape of the thin substrate 3 is further increased, The same effect can be obtained by forming three or more alternately in opposite directions. As described above, the optimal U-shaped cut formed on the slip sheet is appropriately selected according to the shape, size, thickness, weight, material, unevenness, mounted parts, etc. of the thin plate substrate 3. By configuring as above, the same effect can be obtained. In other words, even if the substrate is small and can be supported by a single U-shaped cut in terms of area and weight, if the substrate is large, it will bend from the area weight and come into contact with the underlying substrate to crack or chip. Therefore, it is effective to disperse and support a plurality of U-shaped cuts, and as a result, it is possible to prevent the substrate from being displaced in response to the increase in size of the substrate.

  In this way, the predetermined shape is a U-shaped shape, and the U-shaped cut portion 21 is formed by the U-shaped cut 22 of the interleaf paper 2 portion. Since it is a cut portion of the mold, the number of sheets 2 used can be reduced by half, and the cost can be reduced. Furthermore, the cut portion can be reduced by half the number of suction pads compared to the case where the cut is an E-shape. Can be lifted.

  FIG. 9 is a diagram showing still another example of the break 22. FIG. 9A is a top view of the slip sheet 2b in which the U-shaped cut 22b is formed, and FIG. 9B is a top view of the state in which the thin plate-like substrate 3 is sandwiched between the slip sheets 2b. It is. The interleaf paper 2b is formed with an E-shaped cut 22b composed of three linear cuts parallel to the three sides of the outer peripheral edge, and the two U-shaped cuts 22b form two U-shaped cuts 22b. Cut portions 21b1 and 21b2 are formed.

  When the U-shaped cut 22b is used, the operation of the transfer packaging device 1 is performed in the U-shape shown in FIGS. 3 to 6 except that it is independently sucked and lifted by the two sets of suction pads 11. The operation is the same as in the case of the mold cut 22.

  One of the two sets of suction pads 11 sucks one U-shaped cut portion of the two U-shaped cut portions, for example, a U-shaped cut portion 21b1. At the same time, the other pair of suction pads 11 out of the two sets of suction pads 11 sucks and lifts the U-shaped cut portion 21b2. That is, the two sets of suction pads 11 lift two U-shaped cut portions along the cuts from the center to both sides like a double door.

  In this way, the predetermined shape is an E-shaped shape, and the cut portions 21b1 and 21b2 are two U-shaped shapes formed by the E-shaped cut 22b in the portion of the interleaf paper 2b. Therefore, it is possible to reduce the cost by halving the number of sheets 2b used, and to further reduce the movement distance of the suction pad 11 by half compared to the case of a U-shaped cut. it can.

  FIG. 10 is a diagram illustrating still another example of the break 22. FIG. 10A is a top view of the slip sheet 2c on which the D-shaped cuts 22c1 and 22c2 are formed, and FIG. 10B is a side view thereof. D-shaped cuts 22c1 and 22c2 formed of two straight cuts parallel to one side of the outer peripheral edge of the slip sheet 2c are formed on the slip sheet 2c, and the D-shaped cuts 22c1 and 22c2 are formed. Thus, the cut portions 21c1 and 21c2 and the base portion 23c are separated. The cut portion 21c1 is a portion between the outer peripheral edge and the cut 22c1 among the portions separated by the cut 22c1, and the cut portion 21c2 is between the outer peripheral edge and the cut 22c1 among the portions separated by the cut 22c2. It is a part in. The base portion 23c is a portion obtained by removing the cut portions 21c1 and 21c2 from the portion of the interleaf paper 2c.

  FIG. 11 is a view showing a state in which the gap portion 241 is formed by lifting the cut portion 21c1 by the suction pad 11. As shown in FIG. FIG. 11A is a top view of the slip sheet 2c in which the cut portion 21c1 is lifted and a gap 241 is formed, and FIG. 11B is a side view thereof. A slip sheet conveying device (not shown) transports the slip sheet 2c and places it in a packing box. The suction pad 11 sucks the cut portion 21c1 of the interleaf paper 2c placed in the packing box, lifts the sucked cut portion 21c1, and forms a gap 241.

  FIG. 12 is a view showing a state in which the thin plate-like substrate 3 is inserted into the gap 241 by the transfer arm 12. FIG. 12A is a top view showing a state in which the thin plate-like substrate 3 is inserted into the gap 241, and FIG. 12B is a side view thereof. The transfer arm 12 sucks and conveys the thin plate-like substrate 3, and the other end of the thin plate-like substrate 3 is attached to one end of the thin plate-like substrate 3 from the gap 241 formed by the suction pad 11 lifting the interleaf portion 21 c 1. Insert the cut 22c2 until it is not covered.

  FIG. 13 is a view showing a state in which the thin plate-like substrate 3 is inserted into the other gap 242 by the transfer arm 12. FIG. 13A is a top view showing a state in which the thin plate-like substrate 3 is inserted into the other gap 242, and FIG. 13B is a side view thereof.

  When the thin plate-like substrate 3 is inserted into the gap 241 by the transfer arm 12, the suction pad 11 lowers the sucked cut portion 21c1 and covers the cut portion 21c1 on the thin plate-like substrate 3, and then sucks it. Then, the cut portion 21c1 is placed on the thin plate substrate 3. The suction pad 11 moves to the position of the cut portion 21c2, sucks the cut portion 21c2, lifts the sucked cut portion 21c2, and forms a gap 242.

  The transfer arm 12 inserts the other end of the sucked thin plate-like substrate 3 into a gap 242 formed by lifting the cut portion 21c2 by the suction pad 11. The suction pad 11 lowers the sucked cut portion 21c2 and covers the cut portion 21c2 on the thin plate-like substrate 3, then releases the suction, and places the cut portion 21c2 on the thin plate-like substrate 3 to form a thin plate shape. It is assumed that both ends of the substrate 3 are located below the slip sheet portion 21c1 and the slip sheet portion 21c2, respectively.

  FIG. 14 is a view showing a state where the thin plate-like substrate 3 has been inserted into both the gaps 24. After the transfer arm 12 is placed on the base portion 23c of the interleaf paper 2c, the next thin plate-like substrate 3 is sucked and conveyed, and is placed on the interleaf paper portions 21c2 and 21c2.

  The transfer packaging apparatus 1 repeats the series of operations shown in FIGS. 11 to 14 until the number of the thin plate-like substrates 3 reaches a predetermined number, for example, until the number of packing boxes becomes full, Stack up. Accordingly, the interleaf paper 2 can serve as a buffer material for the two thin plate-like substrates 3 by the single interleaf paper 2, and the interleaf paper 2 is inserted between the thin plate-like substrates 3 one by one. However, the number of interleaf sheets 2 can be halved.

  Further, since the end portions of the cut are at both ends of the cut, the movement of the thin plate substrate 3 can be restricted, and the shift between the thin plate substrate 3 and the interleaf paper 2c can be prevented. Therefore, damage due to deviation can be reduced.

  In this way, when stacking and packing a plurality of thin plate-like substrates 3, one of the U-shaped ones separated by the cuts in the portion of the interleaving paper 2 in which the predetermined cuts are formed by the suction pads 11. The cut portion 21 is sucked and lifted, and the thin plate-like substrate 3 is sucked and conveyed by the transfer arm 12.

  After the U-shaped cut portion 21 is lifted by the suction pad 11 by the transfer arm 12, the first thin plate-like substrate 3 of the plurality of thin plate-like substrates 3 is the co-paper 2 portion. The U-shaped cut portion 21 is placed on a base portion 23 different from the U-shaped cut portion 21, and the U-shaped cut portion 21 is lowered by the suction pad 11, so that the U-shaped cut portion 21 becomes the first thin plate. A second thin plate substrate 3 different from the first thin plate substrate 3 among the plurality of thin plate substrates 3 is placed on the first thin plate substrate 3. In the step of placing on the U-shaped cut portion 21, the odd-numbered thin-plate substrates 3 are used as the first thin-plate-shaped substrates 3 until the number of stacked thin-plate-shaped substrates 3 reaches a predetermined number. And the even-numbered thin plate-like substrate 3 as the second thin plate-like substrate 3 Is Rikaee.

  Therefore, the number of sheets used for the slip sheet 2 can be halved, and the cost can be reduced.

  FIG. 15 is a flowchart showing a processing procedure of a method for packing a thin plate substrate according to another embodiment of the present invention. When the empty packaging box is placed at a position for packaging the thin plate-like substrate 3, the process proceeds to step A1.

  In step A1, which is a placement step, an unillustrated slip sheet transport device transports one slip sheet 2 and places it in a predetermined position. In the case of the first interleaving paper 2, the predetermined position is the bottom of the packing box for stacking and accommodating the thin plate substrates 3, and the second and subsequent sheets are placed on the thin plate substrate 3. It is above the cut portion 21 of the previous slip sheet.

  In step A2, which is a lifting step, the suction pad 11 sucks the cut portion 21 of the interleaf paper 2 placed in step A1, lifts the sucked cut portion 21 obliquely upward along the cut 22, and the thin plate substrate 3 is lifted out of the way so as to be placed on the interleaving paper 2.

  In step A3 which is the first substrate placement step, the transfer arm 12 sucks one thin plate-like substrate 3 and places the sucked thin plate-like substrate 3 on the base portion 23 of the interleaf paper 2. In step A4, which is a slip-sheet placing step, the suction pad 11 lowers the cut-off portion 21 that has been sucked and lifted, and the sucked cut-away portion 21 is placed on the thin plate-like substrate 3 placed on the base portion 23. Put it on the top and release the suction.

  In step A5, which is the second substrate placement step, the transfer arm 12 sucks and conveys the next thin plate-like substrate 3 and moves the cut portion 21 placed on the previous thin plate-like substrate 3. The adsorbed thin plate-like substrate 3 is placed thereon. In step A6, the transfer arm 12 determines whether or not the thin plate-like substrates 3 have been stacked in a predetermined number, that is, a predetermined number, for example, a number that fills the packing box. When a predetermined number of the thin plate-like substrates 3 are stacked, the processing procedure of the method for packing the thin plate-like substrates is finished, and when the predetermined number of thin plate-like substrates 3 are not stacked, the process returns to Step A1. Steps A1 to A6 are stacking steps.

  The flowchart shown in FIG. 15 is a flowchart showing a processing procedure when using the slip sheet 2 in which the U-shaped cut 21 shown in FIG. 2 is formed, but the slip sheet 2a shown in FIG. Also when the slip sheet 2b shown in FIG. 9 is used, it is a flowchart of the same processing procedure, and description thereof is omitted to avoid duplication.

  In this way, when stacking and packing a plurality of thin plate-like substrates 3, in the flowchart shown in FIG. 15, in step A <b> 1 to step A <b> 6, two thin plate-like substrates 3 among the plurality of thin plate-like substrates 3 are stacked. Steps A1 to A6 are repeated until the number of stacked thin plate-like substrates 3 reaches a predetermined number.

  In step A1, one interleaving paper 2 out of the plurality of interleaving papers 2 in which a predetermined shape of cut is formed is placed at a predetermined position. In step A2, one U-shaped cut portion 21 separated by the cut is lifted from the portion of the interleaving paper 2 placed in step A1. In step A3, the first thin plate-like substrate 3 of the plurality of thin plate-like substrates 3 is placed on the base portion 23 different from the U-shaped cut portion 21 in the portion of the interleaving paper 2 placed in step A1. Put it on.

  In step A4, the U-shaped cut portion 21 lifted in step A2 is lowered and placed on the first thin plate-like substrate 3 placed in step A3. In step A5, the second thin plate substrate 3 different from the first thin plate substrate 3 among the plurality of thin plate substrates 3 is placed on the first thin plate substrate 3 in step A4. It is placed on the cut-shaped portion 21 of the letter-shaped.

  Therefore, if the packaging method of the thin board | substrate based on this invention is applied, the number of sheets of the interleaving paper 2 can be halved and cost can be reduced.

  FIG. 16 is a flowchart showing a processing procedure of a method for packing a thin substrate in the case of using the slip sheet 2c formed with the D-shaped cut shown in FIG. When the empty packaging box is placed at a position for packaging the thin plate-like substrate 3, the process proceeds to Step B1. Step B1 and Step B6 to Step B8 are the same as Step A1 and Step A4 to Step A6 of the flowchart shown in FIG. 15, respectively, and description thereof is omitted to avoid duplication.

  In step B2, which is a lifting step, the suction pad 11 sucks and lifts one of the two cut portions 21a1, 21a2 of the interleaf paper 2, for example, the cut portion 21c1, and forms a gap 241.

  In step B3, which is the first insertion step, the transfer arm 12 sucks and conveys the thin plate-like substrate 3, and the gap 241 formed by lifting the cut portion 21c1 on the suction pad 11 at one end of the thin plate-like substrate 3. To the position where the other end of the thin plate substrate 3 does not cover the cut 22c2. When the thin plate-like substrate 3 is inserted into the gap 241 by the transfer arm 12, the suction pad 11 lowers the sucked cut portion 21c1 and covers the cut portion 21c1 on the thin plate-like substrate 3, and then sucks it. Then, the cut portion 21c1 is placed on the thin plate substrate 3.

  In step B4, which is the second lifting step, the suction pad 11 moves to the position of the cut portion 21c2, sucks the cut portion 21c2, lifts the sucked cut portion 21c2, and forms a gap 242. In step B5, which is a second insertion step, the transfer arm 12 inserts the other end of the sucked thin plate-like substrate 3 into a gap 242 formed by lifting the cut portion 21c2 by the suction pad 11. Step B2 corresponds to step A2 in the flowchart shown in FIG. 15, and steps B3 to B5 correspond to step A3 in the flowchart shown in FIG.

  As described above, in the flowchart shown in FIG. 15, the predetermined shape is a D-shape formed by two parallel line segments, and the cut portions 21c1 and 21c2 are separated by a D-shape cut. Among the portions of the interleaving paper 2c, there are two portions between the outer peripheral edge and each cut, and in step B2, the cut portion 21c1 of the two cut portions 21c1 and 21c2 is lifted.

  In step B3, one end of the first thin plate-like substrate 3 of the plurality of thin plate-like substrates 3 is connected to a base portion 23c different from the cut portions 21c1 and 21c2 in the portion of the interleaf paper 2c placed in step B1. It inserts in the gap 241 with the cut portion 21c1 lifted by B2. In Step B4, after the cut portion 21c1 lifted in Step B2 is lowered, the cut portion 21c2 of the two cut portions 21c1 and 21c2 is lifted. In step B5, the other end of the first thin plate substrate 3 is inserted into the gap 242 between the base portion 23c and the cut portion 21c2 lifted in step B4, and then the first thin plate substrate 3 is used as the base. Place on top of part 23c.

  Therefore, it is possible to reduce the cost by halving the number of sheets used for the interleaving paper 2c, and further, it is possible to avoid turning over the interleaving paper because there is no U-shaped portion in the cut.

It is a figure which shows typically the structure of the outline of the transfer packaging apparatus 1 which is one Embodiment of this invention. It is a figure which shows an example of the cut | interruption 22 formed in the slip sheet 2. FIG. It is a figure which shows the state which lifted the cut part 21 with the suction pad 11. FIG. FIG. 3 is a view showing a state in which thin plate-like substrates 3 are stacked on a base portion 23 of a slip sheet 2. It is a figure which shows the state which mounted the cut | interruption part 21 on the thin plate-shaped board | substrate 3. FIG. It is a figure which shows the state which mounted the following thin plate-shaped board | substrate 3a on the cut | disconnected part 21. FIG. It is a figure which shows the example which mounts the thin plate-shaped board | substrate 3 in the vicinity of the termination | terminus part 221 of the cut | interruption 22. FIG. It is a figure which shows the other example of the U-shaped cut | interruption 22. It is a figure which shows the further another example of the cut | interruption. It is a figure which shows the further another example of the cut | interruption. It is a figure which shows the state which lifted the cut | interruption part 21c1 with the suction pad 11, and formed the clearance gap 241. FIG. It is a figure which shows the state which inserts the thin plate-shaped board | substrate 3 in the clearance gap 241 by the transfer arm 12. FIG. It is a figure which shows the state which inserts the thin plate-shaped board | substrate 3 in the other clearance gap 242 by the transfer arm 12. FIG. It is a figure which shows the state which inserted the thin plate-shaped board | substrate 3 in both the clearance gaps 24. FIG. It is a flowchart which shows the process sequence of the packing method of the thin-plate shaped board | substrate which is other form of implementation of this invention. It is a flowchart which shows the process sequence of the packing method of the thin-plate board | substrate about the case where the interleaving paper 2c in which the D-shaped cut formed in FIG. 10 is used.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transfer packing apparatus 2,2a-2c Interleaving paper 3,3a Thin board-like board 11 Adsorption pad 12 Transfer arm 21,21a1,21a2,21b1,21b2,21c1,21c2 Cut part 22,22a1,22a2,22b, 22c1, 22c2 cut 23, 23a to 23c base portion 24, 241, 242 gap 221 end portion

Claims (6)

A stacking method for stacking two substrates out of a plurality of thin plate-like substrates, and repeatedly packing until the number of stacked substrates reaches a predetermined number.
The stacking step includes
A placing step of placing one slip sheet among a plurality of slip sheets in which a predetermined shape of cut is formed;
A lifting step of lifting one of the first slip sheets separated by the cuts of the slip sheets placed in the placing step;
A first substrate placement that places a first substrate of the plurality of substrates on a second slip sheet portion different from the first slip sheet portion of the slip sheet portion placed in the placing step. Steps,
A slip sheet placing step of lowering the first slip sheet portion lifted in the lifting step and placing the first slip sheet portion on the first substrate placed in the first substrate placing step;
A second substrate mounting that places a second substrate different from the first substrate among the plurality of substrates on the first slip sheet portion that is placed on the first substrate in the slip sheet placing step. A thin plate substrate packing method comprising: a placing step. The predetermined shape is a U-shaped shape,
2. The packaging of a thin plate substrate according to claim 1, wherein the first interleaf sheet portion is a U-shaped cut portion formed by a U-shaped cut portion of the interleaf portion. Method. The predetermined shape is an E-shaped shape,
2. The thin plate-like substrate according to claim 1, wherein the first interleaf sheet portion is two U-shaped cut portions formed by a U-shaped cut portion of the interleaf portion. Packing method. The predetermined shape is a D-shaped shape composed of two parallel line segments,
The first interleaf sheet portion is two portions between the outer peripheral edge and each cut line among the interleaf sheet portions separated by the D-shaped cut line,
In the lifting step, one first slip sheet portion of the two first slip sheet portions is lifted,
The first substrate placement step includes:
One end of the first substrate of the plurality of substrates was lifted by the lifting step with a second slip sheet portion different from the first slip sheet portion among the slip sheet portions placed by the placing step. A first insertion step of inserting into a gap with one first slip sheet portion;
A second lifting step of lowering one first interleaving paper portion lifted in the lifting step and then lifting the other first interleaving paper portion of the two first interleaving paper portions;
After inserting the other end of the first substrate into the gap between the second slip sheet portion and the other first slip sheet portion lifted in the second lifting step, the first substrate is 2. The method for packing a thin plate-like substrate according to claim 1, further comprising a second insertion step of placing on the two interleaving paper portions. The substrate has a rectangular shape,
The position where the first substrate is placed on the second interleaf sheet portion is a position where one side of the outer peripheral edge of the first substrate is close to the end portion of the cut. The method for packing a thin plate substrate according to claim 1. A packing device for stacking and stacking a plurality of thin plate-like substrates,
An adsorbing means that adsorbs and lifts one first interleaf sheet portion separated by the discontinuity of the interleaf sheet portion having a predetermined shape of discontinuity;
A conveying means for adsorbing and conveying the substrate;
After the first interleaving paper portion has been lifted by the adsorbing means, the transport means is configured to change the first substrate of the plurality of substrates from a first interleaving paper portion different from the first interleaving paper portion. After the first interleaving paper portion is lowered by the adsorbing means and the first interleaving paper portion is placed on the first substrate, the plurality of substrates are placed on the interleaving paper portion. The step of placing a second substrate different from the first substrate on the first interleaf sheet portion placed on the first substrate is an odd number until the number of stacked substrates reaches a predetermined number. The packaging apparatus is characterized by repeating the substrate as a first substrate and the even-numbered substrate as a second substrate.

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