JP2015149456A - Method of replacing protective sheets in component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of replacing protective sheets in a component mounting apparatus capable of easily performing replacement work of protective sheets in a short period of time.SOLUTION: When a state in which a protective sheet 73b disposed between a crimp head 71 and a component 4 is to be replaced is detected, a substrate mounting stage 53 is retracted from a "work position" by substrate mounting stage moving means (a center substrate transfer part 33C or a rightward substrate transfer part 33R), the protective sheet 73b is replaced in a state where the substrate mounting stage 53 is retracted from the "work position".

Description

  The present invention relates to a method for replacing a protective sheet in a component mounting apparatus for manufacturing a liquid crystal panel or the like by crimping components placed on a substrate.

  A component crimping apparatus used in a liquid crystal panel production process by a liquid crystal panel production line is a film-like component (or semiconductor) placed (temporarily crimped) on a substrate via an anisotropic conductive sheet called an ACF (Anisotropic Conductive Film). The device is crimped (crimped) with a crimping head. In such a component crimping device, a protective sheet is installed in a horizontal position below the crimping head, and the pressure-sensitive adhesive material adheres to the crimping head so that the crimping head presses (crimps) the component through the protective sheet. To prevent it. Here, the protective sheet is placed in a cassette together with a pair of roller members that wind up and feed out the protective sheet, and the entire cassette is placed below the crimping head. The protective sheet in the cassette can expose a new surface under the pressure-bonding head by the operation of the pair of roller members, and the operator replaces the protective sheet when the new surface of the protective sheet disappears (when the sheet is cut). I do. Since the protective sheet is disposable, the operator replaces the protective sheet by removing the entire cassette from below the crimping head and then attaching a new cassette below the crimping head when replacing the protective sheet. (For example, patent document 1).

Japanese Patent No. 3757868

  However, in the above replacement operation of the protective sheet, when the component crimping operation to the substrate is not completed, the component is crimped to the substrate (main crimping) by the crimping head (that is, the working position below the crimping head). The substrate remained in position, and the operator had to remove and install the cassette while paying close attention not to touch the substrate. For this reason, it took a long time to replace the protective sheet, which hindered improvement of the productivity of the substrate by the component mounting apparatus.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a protective sheet replacement method in a component mounting apparatus that allows a protective sheet replacement operation to be performed easily and in a short time.

  The method for replacing a protective sheet in the component mounting apparatus according to the present invention includes a substrate placement stage for holding a substrate on which a component is mounted on an upper surface, and substrate transfer means for transferring the substrate to the substrate placement stage. A substrate placement stage moving means for moving the substrate placement stage; and the substrate placement stage moving means moves down from above the substrate placement stage positioned at a predetermined work position, and the component is placed on the substrate. A method for replacing a protective sheet in a component mounting apparatus comprising a pressure bonding head for pressure bonding and a protective sheet disposed between the pressure bonding head and the component, wherein the detection step detects a state in which the protection sheet should be replaced; When the state in which the protective sheet is to be replaced is detected in the detection step, the substrate placement stage is moved by the substrate placement stage moving means. Comprising a retraction step of retracting from the position, and a protective sheet exchange step for exchanging the protective sheet in a state of being retracted the substrate mounting stage from the working position.

  According to the present invention, the replacement operation of the protective sheet can be performed easily and in a short time.

The top view of the component mounting apparatus in one embodiment of this invention The figure which shows the advancing procedure of the component mounting operation | work with respect to the board | substrate by the component mounting apparatus in one embodiment of this invention The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention (A) (b) The perspective view of the ACF sticking operation part with which the component mounting apparatus in one embodiment of this invention is equipped, and a left board | substrate transfer part (A) (b) (c) The figure which shows the execution procedure of the sticking operation | work of the ACF tape by the ACF sticking operation | work part in one embodiment of this invention. (A) (b) The perspective view of the component mounting operation part with which the component mounting apparatus in one embodiment of this invention is equipped, and a center board | substrate transfer part (right board | substrate transfer part) The flowchart which shows the execution procedure of the component mounting operation | work by the component mounting operation | work part in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting operation part in one embodiment of this invention. (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting operation part in one embodiment of this invention. (A) (b) The perspective view of the 1st component crimping operation part (2nd component crimping operation part) with which the component mounting apparatus in one embodiment of this invention is equipped, and a center board | substrate transfer part (right board transfer part) (A) (b) (c) The figure which shows the execution procedure of the component crimping operation | work by the 1st component crimping operation part (2nd component crimping operation part) in one embodiment of this invention. The perspective view of the board | substrate transfer part in one embodiment of this invention The fragmentary top view of the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention The flowchart in the replacement | exchange operation | work of the protection sheet of the component mounting apparatus in one embodiment of this invention (A) (b) (c) Operation | movement explanatory drawing at the time of replacement | exchange work of the protection sheet of the component mounting apparatus in one embodiment of this invention (A) (b) (c) Operation | movement explanatory drawing at the time of replacement | exchange work of the protection sheet of the component mounting apparatus in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting apparatus 1 for manufacturing a liquid crystal panel substrate shown in FIG. 1 is used as an adhesive member on an electrode portion 2a provided on the upper surface of one of the four sides of a rectangular panel-like substrate 2 shown in FIG. After attaching the ACF tape 3, the component 4 is mounted on the attached ACF tape 3 (preliminary pressure bonding) and then pressure bonded (main pressure bonding), and then the component mounting operation for mounting the component 4 on the substrate 2 is executed. To do. The component 4 used here is a component having a film-like portion 4a, for example, an FPC component.

  In FIG. 1, a base 11 of the component mounting apparatus 1 includes a left base 11 a and a center base from the left in the left-right direction as viewed from the operator OP (the left-right direction in FIG. 1 and the X-axis direction). 11b and the right base 11c are arranged in this order, the left base 11a has a board receiving part 21, the central base 11b has a component mounting part 22, and the right base 11c has a board delivery part 23. Is provided. The operations of the board receiving unit 21, the component mounting unit 22, and the board passing unit 23 are controlled by a control device 24 (FIG. 3) as control means. The board 2 flows in the X-axis direction from the left side to the right side, that is, in order of the board receiving part 21, the component mounting part 22, and the board delivery part 23, and is sequentially processed. The substrate receiving unit 21 receives the substrate 2 sent from the upstream process side, and the substrate transfer unit 23 delivers the received substrate 2 to the downstream process side.

  In FIG. 1, the substrate receiving unit 21 has two substrate receiving stages 21s on the left side (upstream process side) and the right side (downstream process side). These two board receiving stages 21s are provided so as to be movable up and down with respect to the left base 11a, and the two boards 2 sent from the upstream process side of the component mounting apparatus 1 to the two board receiving stages 21s. Is placed.

  In FIG. 1, the component mounting unit 22 performs an operation of attaching the ACF tape 3 to the substrate 2, an ACF adhering operation unit 22 a (adhesive member adhering operation unit), and an operation of mounting the component 4 on the upper surface of the substrate 2. A component mounting operation unit 22b performed at a fixed position, and two component crimping operation units (first component crimping operation) for crimping the mounted component 4 to the substrate 2 on which the component 4 mounting operation has been performed in the component mounting operation unit 22b. Part 22c and second component crimping work part 22d).

  The ACF attaching work part 22a is provided in the left area of the central base 11b, and the component mounting work part 22b is provided in the central area of the central base 11b. The first component crimping work part 22c is provided in a region between the ACF adhering work part 22a and the component mounting work part 22b on the central base 11b, and the second component crimping work part 22d is the central base. It is provided in the area on the right side of the component mounting work part 22b on 11b. That is, in the component mounting apparatus 1 according to the present embodiment, the first component crimping work part 22c and the second component crimping work part 22d are provided at positions sandwiching the component mounting work part 22b from the left and right sides.

  A first base portion 31 is provided in the front area of the ACF attaching work portion 22a on the central base 11b (the front-rear direction viewed from the operator OP is the Y-axis direction). A second base portion 32 is provided extending in the X-axis direction in the front region of the component mounting operation portion 22b, the first component crimping operation portion 22c, and the second component crimping operation portion 22d.

  1 and FIGS. 4A and 4B, the first base portion 31 is provided with a left substrate transfer portion 33L. The left substrate transfer portion 33L is provided on the first base portion 31 so as to extend in the Y-axis direction, and is provided on the first base portion 31 so as to be movable in the X-axis direction. The moving stage 35 is provided so as to be movable in the Y-axis direction on the Y-axis table 34, and two substrate holding stages 36 are provided on the upper surface of the moving stage 35 so as to be arranged in the X-axis direction. On the two substrate holding stages 36, the two substrates 2 are transferred and held from the two substrate receiving stages 21s of the substrate receiving unit 21.

  Each of the two substrate holding stages 36 is movable up and down with respect to the moving stage 35, and the control device 24 moves the moving stage 35 in the Y-axis direction with respect to the Y-axis table 34 to transfer the substrate 2. The substrate holding stage 36 is moved up and down to move the substrate 2 placed on the two substrate holding stages 36 up and down.

  4 (a) and 4 (b), the ACF adhering work part 22a includes two adhering heads 41 arranged in the X-axis direction above the central base 11b, and below the adhering heads 41. Two backup stages 42 for attaching ACF are provided extending in the X-axis direction. Each of the two sticking heads 41 feeds and feeds the ACF tape 3, cuts the fed ACF tape 3 into a predetermined length, and holds it in a horizontal position at a predetermined position, and a tape supply A sticking tool 41b for pressing the ACF tape 3 held in a horizontal posture by the part 41a from above onto the backup stage 42 side for ACF sticking work is provided.

  The control device 24 moves the moving stage 35 of the left substrate transfer part 33L on the Y-axis table 34 to the “substrate delivery position” (FIG. 4A) set to the front and the “work position” set to the rear (see FIG. 4A). 4 (b)). The “substrate delivery position” is a position where the substrate 2 can be delivered to the two substrate holding stages 36, and the “work position” is the two substrates 2 placed on the two substrate holding stages 36. It is a position where each electrode part 2a can be positioned above the backup stage 42 for two ACF attaching operations.

  An operation of attaching the ACF tape 3 to the substrate 2 by the attaching head 41 will be described with reference to FIG. First, as shown in FIG. 5A, the control device 24 operates the tape supply unit 41a to position the ACF tape 3 in a state cut to a predetermined length above the substrate 2 (electrode unit 2a). Next, as shown in FIG. 5B, the sticking tool 41b is lowered to press the ACF tape 3 together with the substrate 2 against the backup stage 42 for ACF sticking work. Finally, as shown in FIG. 5C, the sticking tool 41 b is raised with respect to the substrate 2. As a result, the ACF tape 3 having a predetermined length is attached to the substrate 2.

  In FIG. 1, the second base portion 32 is provided with a central substrate transfer portion 33C and a right substrate transfer portion 33R. The central substrate transfer unit 33C and the right substrate transfer unit 33R are the same type, and the central substrate transfer unit 33C is located to the left of the right substrate transfer unit 33R. The central substrate transfer unit 33C (same as the right substrate transfer unit 33R) is provided to be movable in the X-axis direction along the second base portion 32, as shown in FIGS. 6 (a) and 6 (b). A Y-axis table 51, a moving stage 52 provided on the Y-axis table 51 so as to be movable in the Y-axis direction, and two substrate mounting stages 53 provided side by side in the X-axis direction on the upper surface of the moving stage 52 are provided. . The moving stage 52 has a built-in lifting mechanism that individually lifts and lowers the two substrate mounting stages 53 in the Z-axis direction. The two substrate placement stages 53 can move in the horizontal direction by moving the Y-axis table 51 in the X-axis direction with respect to the second base portion 32 and moving the moving stage 52 with respect to the Y-axis table 51. From the two substrate holding stages 36 of the left substrate transfer unit 33L, the two substrates 2 on which the components 4 are mounted are transferred and held on the substrate mounting stage 53.

  The two substrate mounting stages 53 can move in the horizontal direction by moving the Y-axis table 51 in the X-axis direction relative to the second base portion 32 and moving the moving stage 52 relative to the Y-axis table 51, respectively. It is provided so that it can be raised and lowered individually by driving the above-described lifting mechanism built in the stage 52. The control device 24 moves the Y-axis table 51 in the X-axis direction with respect to the second base portion 32 and moves the moving stage 52 in the Y-axis direction with respect to the Y-axis table 51 to place the two substrate placement stages 53 in a horizontal plane. The substrate 2 is transferred by moving inward, the two substrate placement stages 53 are lowered or raised, and the two substrates 2 placed on the two substrate placement stages 53 are transferred to the backup stage 64. Land or separate from the top surface.

  In FIG. 1, FIG. 6 (a), (b), the component mounting operation part 22b is projected from the rear part of the center base 11b to the rear, and the part supply part 61 and the center base 11b which supply the part 4 are provided. A mounting head 63 that is movable in a horizontal plane by a mounting head moving mechanism 62 provided at the center rear of the mounting head 63 and sucks the component 4 supplied by the component supply unit 61 from above, and a central rear region of the second base portion 32. Is provided with a backup stage 64 for component mounting provided extending in the Y-axis direction. The control device 24 controls the supply operation of the component 4 by the component supply unit 61, the movement operation of the mounting head 63 in the horizontal plane by the operation of the mounting head moving mechanism 62, and the suction operation of the component 4 by the mounting head 63. Thereby, a series of operations from adsorption (pickup) of the component 4 by the mounting head 63 to mounting of the component 4 on the substrate 2 is performed.

  In FIG. 6A, the part mounting work backup stage 64 is provided with two position recognition cameras 65 arranged in the X-axis direction with the imaging visual field facing upward. These two position recognition cameras 65 are controlled by the control device 24 to perform an imaging operation, and the parts are passed through a transparent material part 64a (FIG. 6A) such as quartz glass provided on the upper part of the backup stage 64 for mounting parts. An object located above the mounting backup stage 64 is imaged.

  The component mounting operation control unit SR1 (FIG. 3) of the control device 24 has a “substrate delivery position” (FIG. 6A) in which the moving stage 52 of the central substrate transfer unit 33C is set forward on the Y-axis table 51. It is moved between the “working position” set rearward (FIG. 6B). The “substrate delivery position” is a position where the substrate 2 can be delivered to the two substrate placement stages 53. The “working position” indicates that the ACF tape 3 attached to the electrode portion 2a of the substrate 2 placed on the two substrate placement stages 53 is positioned above the backup stage 64 for component placement work (further, component crimping described later). This is a position that can be positioned above the work backup stage 72.

  As shown in FIGS. 6A and 6B, each of the two substrate placement stages 53 provided in the central substrate transfer portion 33C (the right substrate transfer portion 33R is the same) is provided with each of the substrate placement stages 53. A frame-shaped component support member 54 having a horizontal portion 54a extending rearward in the X-axis direction is provided. The component support member 54 protrudes from the substrate 2 in the film-like portion 4a of the component 4 mounted on the substrate 2 in the mounting process (component mounting operation) of the component 4 on the substrate 2 by the component mounting operation unit 22b described later. Is supported from below.

  Next, the operation of the component mounting apparatus 1 will be described. When the component mounting apparatus 1 performs the component mounting work, first, the moving stage 52 moves to the “working position” and the electrode portion 2a of the substrate 2 is positioned above the backup stage 64 (mounting work position). (Step ST1 shown in the flowchart of FIG. 7). Then, the two position recognition cameras 65 image and recognize two position recognition marks m (FIG. 2) of the substrate 2 positioned above the component mounting backup stage 64 (FIG. 8A). Information on the position of the substrate 2 is calculated (acquired) based on the position information of the two position recognition marks m thus obtained. As a result, the first correction data storage area KR1, the second correction data storage area KR2, and the third correction data storage area of the storage unit 24a of the control device 24 are obtained as position correction amount data of the substrate 2 with respect to the substrate placement stage 53. It is stored in KR3 and the fourth correction data storage area KR4 (FIG. 3) (step ST2).

  Specifically, the position correction amount data for the substrate 2 placed on the substrate placement stage 53 on the left side of the central substrate transfer unit 33C is stored in the first correction data storage region KR1, and the central substrate transfer unit 33C The position correction amount data for the substrate 2 placed on the right substrate placement stage 53 is stored in the second correction data storage area KR2. Further, the position correction amount data for the substrate 2 placed on the substrate placement stage 53 on the left side of the right substrate transfer unit 33R is stored in the third correction data storage area KR3, and the right side of the right substrate transfer unit 33R. The position correction data for the substrate 2 placed on the substrate placement stage 53 is stored in the fourth correction data storage area KR4.

  When step ST2 is completed, the moving stage 52 once moves forward, and retracts the electrode portion 2a of the substrate 2 from the upper position (mounting work position) of the backup stage 64 (FIG. 8B) (step ST3). Next, the mounting head 63 is lowered, and the component 4 is moved in the direction approaching the backup stage 64 (to the position recognition camera 65 side) (to the mounting work position) (step ST4). Next, the two position recognition cameras 65 capture and recognize a position recognition mark (not shown) provided on the component 4 (FIG. 8C), and information on the position of the component 4 (the component 4 with respect to the mounting head 63). After calculating (acquiring position information), the position correction amount of the component 4 is obtained, and the result is stored in the storage unit 24a (step ST5).

  When the two position recognition cameras 65 obtain the position correction amount of the component 4 and store the result in the storage unit 24a as described above, the mounting head 63 is raised (FIG. 9A), and the moving stage 52 is moved. It is located at the “working position” again. The central substrate transfer unit 33C operates based on information on the position of the substrate 2 (position correction amount of the substrate 2) and information on the position of the component 4 (position correction amount of the component 4) stored in the storage unit 24a. The substrate 2 is positioned with respect to the component mounting work portion 22b (directly with respect to the component 4) so that the electrode portion (not shown) on the component 4 side and the electrode portion 2a on the substrate 2 side are aligned vertically ( 9B, step ST6).

  When the central substrate transfer unit 33C positions the substrate 2 with respect to the component mounting operation unit 22b as described above, the mounting head 63 descends and the sucked component 4 is pressed against the ACF tape 3 on the substrate 2 to the substrate 2. Mounting (temporary pressure bonding) is performed (FIG. 9C) Step ST7. The pressing force of the mounting head 63 at this time is supported by the backup stage 64 for mounting components. The mounting head 63 rises when the component 4 is mounted on the substrate 2 (step ST8).

  When the mounting head 63 mounts the component 4 on the substrate 2 in step ST7, a part of the film-like portion 4a of the component 4 protrudes out of the substrate 2, but the protruding film-like portion 4a is placed on each substrate. It is supported from below by a horizontal portion 54 a of a component support member 54 provided on the stage 53. For this reason, the film-like portion 4a of the component 4 mounted on the substrate 2 is prevented from hanging down from the edge of the substrate 2 (FIGS. 10A and 10B).

  As shown in FIGS. 10A and 10B, the first component crimping work part 22c (and the second component crimping work part 22d) is provided with two crimping heads arranged side by side in the X-axis direction. 71 and two backup stages 72 for crimping the two components provided in the X-axis direction below each crimping head 71. The component crimping operation control unit SR2 (FIG. 3) of the control device 24 controls the ascending and descending operations of the crimping head 71 provided in the first component crimping operation unit 22c and the crimping head 71 provided in the second component crimping operation unit 22d. (Figure 3). The pressure bonding head 71 is located above the substrate placement stage 53 positioned at a predetermined work position by the central substrate transfer portion 33C or the right substrate transfer portion 33R which is a substrate placement stage moving means for moving the substrate placement stage 53. The component 4 is lowered and pressed onto the substrate 2.

  As shown in FIGS. 10A and 10B and FIGS. 11A, 11B, and 11C, the respective crimping heads 71 of the first component crimping working portion 22c and the second component crimping working portion 22d. A protective sheet supply unit 73 is detachably installed below the screen. The protective sheet supply unit 73 has a tape-shaped protective sheet 73b in a box-shaped cassette 73a, and the pressure-bonding head in a state where the substrate 2 on which the component 4 is temporarily pressure-bonded is placed on the backup stage 72. The protective sheet 73b is arranged horizontally between 71 and the component 4. As a result, the pressure-bonding head 71 pressure-bonds the component 4 to the substrate 2 via the protective sheet 73b (FIG. 11 (b)), so that the adhesive material of the ACF tape 3 is prevented from adhering to the pressure-bonding head 71. .

  The protective sheet 73b is taken up and fed out by a pair of roller members 73c provided in the cassette 73a, and the new surface of the protective sheet 73b is moved below the pressure-bonding head 71 by the operation of the pair of roller members 73c. Can be exposed. When the new surface of the protective sheet 73b disappears (the sheet has run out), the operator OP replaces the protective sheet 73b. Since the protective sheet 73b is disposable, when the operator OP replaces the protective sheet 73b, the operator OP removes the cassette 73a from the lower side of the pressure bonding head 71 and then attaches a new cassette 73a to the lower side of the pressure bonding head 71.

  When the mounting head 63 performs the mounting operation of the component 4 on the two substrates 2 placed on the two substrate placement stages 53 provided in the central substrate transfer unit 33C, the Y-axis table 51 remains as it is in the second base. The component 4 of the two substrates 2 mounted on the two substrate mounting stages 53 is mounted by moving to the left along the portion 32 (that is, in the horizontal direction toward the first component crimping operation unit 22c). This portion is positioned above the backup stage 72 for two component crimping operations (below the crimping head 71) (crimping operation position). At this time, the substrate mounting stage 53 moves based on the information regarding the position of the substrate 2 stored in the storage unit 24a, and positions the substrate 2 with respect to the first component crimping operation unit 22c (FIG. 10A). )).

  Specifically, the Y-axis table 51 positions the substrate 2 placed on the left substrate placement stage 53 by using the position correction amount data stored in the first correction data storage area KR1. The substrate 2 placed on the right substrate placement stage 53 is positioned using the position correction amount data stored in the second correction data storage area KR2. When the positioning is completed, the two crimping heads 71 included in the first component crimping work unit 22c are sequentially lowered, and the component 4 mounted on the component mounting work unit 22b is crimped to the two substrates 2 (main crimping). (FIG. 11 (a) → FIG. 11 (b) → FIG. 11 (c)). At this time, the crimping head 71 presses the component 4 by pressing the protective sheet 73b supplied from the protective sheet supply unit 73 from above (FIG. 11B).

  Similarly, when the mounting head 63 performs the mounting operation of the component 4 on the two substrates 2 placed on the two substrate placement stages 53 included in the right substrate transfer unit 33R, the Y-axis table 51 is left as it is. The two parts 4 of the substrate 2 mounted on the two substrate mounting stages 53 are mounted by moving to the right side (that is, the second component crimping operation unit 22d side) along the two base portions 32. This portion is positioned above the backup stage 72 for component crimping work (below the crimping head 71) (crimping work position). At this time, the substrate mounting stage 53 moves based on the information on the position of the substrate 2 stored in the storage unit 24a, and positions the substrate 2 with respect to the second component crimping operation unit 22d (FIG. 10A). )).

  Specifically, the Y-axis table 51 positions the substrate 2 placed on the left substrate placement stage 53 using the position correction amount data stored in the third correction data storage area KR3. The substrate 2 placed on the right substrate placement stage 53 is positioned using the position correction amount data stored in the fourth correction data storage area KR4. When the positioning is completed, the two crimping heads 71 provided in the second component crimping work unit 22d are sequentially lowered, and the component 4 mounted on the component mounting work unit 22b is crimped to the two substrates 2 (main crimping). (FIG. 11 (a) → FIG. 11 (b) → FIG. 11 (c)). At this time, the crimping head 71 presses the component 4 by pressing the protective sheet 73b supplied from the protective sheet supply unit 73 from above (FIG. 11B).

  In the crimping operation of the component 4 by the two crimping heads 71 provided in each of the first component crimping operation portion 22c and the second component crimping operation portion 22d, two substrate mounting stages 53 are attached and two substrates 2 are attached. Since the two substrate mounting stages 53 are attached to one moving stage 52, the positioning of each substrate 2 with respect to the corresponding crimping head 71 and the subsequent component crimping operation are sequentially shifted at different timings. Do.

  When the two crimping heads 71 provided in the first component crimping work part 22c or the second component crimping work unit 22d crimp the component 4 to the two substrates 2 by the above procedure, the moving stage 52 is moved to the Y-axis table. It moves forward along 51 and returns to the “board transfer position”.

  Note that the substrate positioning of the crimping head 71 with respect to the substrate 2 placed on the two substrate placement stages 53 and the crimping of the component 4 by the crimping head 71 are not performed individually on the left and right substrates 2 as described above. It may be performed simultaneously. That is, the average value of the positional deviation of the left substrate 2 relative to the left substrate placement stage 53 and the positional deviation of the right substrate 2 relative to the right substrate placement stage 53 obtained in the component mounting operation is calculated, and the left and right sides are calculated. The substrate mounting stage 53 may be simultaneously positioned with respect to the corresponding pressure-bonding heads 71, and then the component 4 may be simultaneously pressure-bonded to the two substrates 2 by the two pressure-bonding heads 71. In this case, the tact time can be shortened although the positioning accuracy is slightly lower than in the case of positioning individually.

  In FIG. 1, the substrate transfer section 23 has two substrate transfer stages 23 s on the left side (upstream process side) and the right side (downstream process side). These two left and right substrate transfer stages 23s are provided so as to be movable up and down with respect to the right base 11c. The two substrate transfer stages 23s are either a first component crimping work part 22c or a second component crimping work part. In 22d, the two substrates 2 on which the component 4 is crimped are placed. The two substrates 2 placed on the two substrate delivery stages 23 s are sent to another device provided on the lower side of the component mounting apparatus 1 by a substrate unloading means (not shown).

  In FIG. 1, a moving base 81 extending in the X-axis direction is provided in the front region of the base 11 over the left base 11a, the center base 11b, and the right base 11c. On the moving base 81, three substrate transfer units 82 (a left substrate transfer unit 82a, a central substrate transfer unit 82b, and a right substrate transfer unit 82c) are provided in order from the left.

  As shown in FIG. 12, each of the left substrate transfer portion 82a, the central substrate transfer portion 82b, and the right substrate transfer portion 82c is provided with a base 91 that is movable in the X-axis direction with respect to the movement base 81. And two arm units 92 provided on the base 91. Each arm unit 92 includes an arm base 93 fixed to the base portion 91 and two arms 94 provided to extend horizontally rearward from the arm base 93. Each arm 94 is provided with a plurality of suction pads 95 with suction surfaces facing downward. Each arm unit 92 can vacuum-suck one substrate 2 via a plurality of suction pads 95 (four in the present embodiment) provided on the two arms 94.

  The left substrate transfer unit 82 a picks up the two substrates 2 placed on the two substrate receiving stages 21 s of the substrate receiving unit 21 by the two arms 94. In this case, the left substrate transfer unit 82a sucks the substrate 2 in a state where the suction pads 95 of the two arms 94 are positioned above the two substrate receiving stages 21s. During the suction of the substrate 2, the two substrate receiving stages 21 s are lifted to bring the substrate 2 close to the suction pad 95. Further, the left substrate transfer unit 82a places the two substrates 2 picked up as described above on the two substrate holding stages 36 of the left substrate transfer unit 33L. In this case, the left substrate transfer unit 82 a performs the suction release of the substrate 2 in a state where the two picked up substrates 2 are moved so as to be positioned above the two substrate holding stages 36. When the suction of the substrate 2 is released, the two substrate holding stages 36 are raised to support the substrate 2 from below.

  The central substrate transfer part 82b picks up the two substrates 2 placed on the two substrate holding stages 36 of the left substrate transfer part 33L by the two arms 94. In this case, the central substrate transfer unit 82b sucks the substrate 2 in a state where the suction pads 95 of the two arms 94 are positioned above the two substrate holding stages 36. During the suction of the substrate 2, the two substrate holding stages 36 are lifted to bring the substrate 2 close to the suction pad 95. Further, the central substrate transfer unit 82b applies the two substrates 2 picked up as described above to the two substrate holding stages 36 of the central substrate transfer unit 33C or the two substrate holding stages 36 of the right substrate transfer unit 33R. Place. In this case, in the central substrate transfer part 82b, the two substrates 2 picked up are positioned above the two substrate holding stages 36 of the central substrate transfer part 33C or the two substrate holding stages 36 of the right substrate transfer part 33R. Then, the suction of the substrate 2 is released. When the suction of the substrate 2 is released, the two substrate holding stages 36 are raised to support the substrate 2 from below.

  The right substrate transfer unit 82c is configured to use two arms 94 for the two substrates 2 mounted on the two substrate holding stages 36 of the central substrate transfer unit 33C or the two substrate holding stages 36 of the right substrate transfer unit 33R. Pick up by. In this case, the right-side substrate transfer unit 82c sucks the substrate 2 in a state where the suction pads 95 of the two arms 94 are positioned above the two substrate holding stages 36. During the suction of the substrate 2, the two substrate holding stages 36 are lifted to bring the substrate 2 close to the suction pad 95. The right substrate transfer unit 82c places the two substrates 2 picked up as described above on the two substrate transfer stages 23s of the substrate transfer unit 23. In this case, the right substrate transfer unit 82c moves the picked up two substrates 2 so as to be positioned above the two substrate transfer stages 23s, and then releases the suction of the substrate 2. When the suction of the substrate 2 is released, the two substrate transfer stages 23s are lifted to support the substrate 2 from below.

  The controller 24 moves the left substrate transfer unit 82a, the central substrate transfer unit 82b, and the right substrate transfer unit 82c in the X-axis direction along the movement base 81, and suction pads in each arm unit 92. The adsorption | suction operation | movement of the board | substrate 2 through 95 is controlled (FIG. 3). The left substrate transfer unit 82a is controlled by the control device 24 to transfer the substrate 2 from the substrate receiving unit 21 to the left substrate transfer unit 33L. The central substrate transfer unit 82b is controlled by the control device 24, and transfers the substrate 2 from the left substrate transfer unit 33L to the central substrate transfer unit 33C or the right substrate transfer unit 33R. The substrate 2 to which the ACF tape 3 is adhered is distributed and placed on the two substrate placement stages 53 provided in the central substrate transfer portion 33C and the two substrate placement stages 53 provided in the right substrate transfer portion 33R. The right substrate transfer unit 82c is controlled by the control device 24 to transfer the substrate 2 from the central substrate transfer unit 33C or the right substrate transfer unit 33R to the substrate transfer unit 23.

  Next, the operation of each part when the component mounting apparatus 1 performs a component mounting operation on the board 2 will be described. As shown in FIG. 13, the control device 24 sets the front position (first position) of the substrate receiving unit 21 as a position that each of the left substrate transfer unit 82a, the central substrate transfer unit 82b, and the right substrate transfer unit 82c can take. 1 position P1), a front position (second position P2) of the ACF attaching work part 22a, a front position (third position P3) of the component mounting work part 22b, and a front position (fourth position P4) of the board transfer part 23. It has established.

  First, the left substrate transfer part 82a is located at the first position P1, the central substrate transfer part 82b is located at the second position P2, and the right substrate transfer part 82c is located at the third position P3. . Further, the central board transfer section 33C is located at the front position of the component mounting work section 22b, and the right board transfer section 33R is located at the front position of the second component crimping work section 22d. From such a state, the substrate receiving unit 21 receives the two substrates 2 sent from the apparatus on the upstream process side by the two substrate receiving stages 21s (substrate receiving step), and the left substrate transfer unit 82a is the substrate. The two substrates 2 received by the receiving unit 21 are picked up by the two arms 94 (FIG. 14A).

  The left substrate transfer unit 82a moves to the second position P2 when the two substrates 2 are picked up from the substrate receiving unit 21, and the left substrate transfer unit 82a transfers the picked up two substrates 2 to the left substrate transfer. It is placed and held on the two substrate holding stages 36 of the part 33L. At this time, the central substrate transfer part 82b moves to the third position P3, and the right substrate transfer part 82c moves to the fourth position P4 (FIG. 14B, substrate transfer process). When the substrate transfer unit 33L holds the substrate 2 on the moving stage 35, the moving stage 35 is positioned at the “working position”, and the two substrates 2 are positioned above the backup stage 42 for the ACF attaching operation. When the two substrates 2 are positioned above the backup stage 42, the ACF adhering work unit 22a performs the ACF adhering operation on the two substrates 2 (FIG. 14C). During this period, two new substrates 2 are placed on the two substrate receiving stages 21 s of the substrate receiving unit 21.

  When the ACF adhering operation unit 22a performs the ACF adhering operation on the two substrates 2, the left substrate transfer unit 33L positions the moving stage 35 at the “substrate delivery position”, and the left substrate transfer unit 82a. Is located at the first position P1, the central substrate transfer part 82b is located at the second position P2, and the right substrate transfer part 82c is located at the third position P3. Next, the left substrate transfer unit 82a picks up the two substrates 2 on the two substrate receiving stages 21s of the substrate receiving unit 21, and the central substrate transfer unit 82b receives the two substrates from the left substrate transfer unit 33L. 2 is picked up (FIG. 15A).

  When the left substrate transfer unit 82a picks up two substrates from the two substrate receiving stages 21s of the substrate receiving unit 21, and the central substrate transfer unit 82b picks up the two substrates 2 from the left substrate transfer unit 33L. The left substrate transfer unit 82a moves to the second position P2, the central substrate transfer unit 82b moves to the third position P3, and the right substrate transfer unit 82c moves to the fourth position P4. The left substrate transfer unit 82a places and holds the two substrates 2 on the two substrate holding stages 36 of the left substrate transfer unit 33L, and the central substrate transfer unit 82b holds the two substrates 2. It is placed and held on the two substrate placement stages 53 of the central substrate transfer part 33C (FIG. 15B).

  Next, the left substrate transfer unit 33L positions the moving stage 35 at the “working position” and positions the two substrates 2 above the backup stage 42 for ACF attachment work. When the two substrates 2 are positioned above the backup stage 42, the ACF adhering operation unit 22a performs the ACF adhering operation on the two substrates 2. On the other hand, the central substrate transfer unit 33C moves the moving stage 52 to the “working position” and then moves the left substrate 2 out of the two substrates 2 placed on the two substrate placement stages 53 to the component. It is positioned above the backup stage 64 for mounting work. When the left substrate 2 is positioned above the backup stage 64, the component mounting operation unit 22b executes the component mounting operation on the substrate 2 (FIG. 15C). When the component mounting operation unit 22b executes the component mounting operation, the central substrate transfer unit 33C moves to the left, and the right substrate of the two substrates 2 mounted on the two substrate mounting stages 53. 2 is positioned above the backup stage 64 for component mounting work. When the right substrate 2 is positioned above the backup stage 64, the component mounting operation unit 22b performs the component mounting operation on the substrate 2 (FIG. 16A, first component mounting step). During this time, two new substrates 2 are placed on the two substrate receiving stages 21 s of the substrate receiving unit 21.

  As described above, the component mounting operation is performed in order from the left substrate 2 to the right substrate 2 of the two left and right substrates 2 mounted on the two substrate mounting stages 53. This is because 53 is moved to the first component crimping operation part 22c located on the left side and the component crimping step (first component crimping step) is performed. This eliminates the movement of the substrate 2 returning from the mounting of the component 4 to the substrate 2 to the pressing of the mounted component 4 to the substrate 2.

  When the component mounting operation unit 22b executes the above component mounting operation, the central substrate transfer unit 33C moves to the left (the first component crimping operation unit 22c side) as it is, and the two substrates 2 are bonded to the first component. The work part 22c is transferred, and the two substrates 2 are positioned above the backup stage 72 for two component crimping operations. When the two substrates 2 are positioned above the backup stage 72, the first component crimping operation unit 22c performs the component crimping operation on the two substrates 2 (FIG. 16B). Crimping process). At the same time, the left substrate transfer unit 82a is positioned at the first position P1 to pick up two substrates 2 from the substrate receiving unit 21, and the left substrate transfer unit 33L moves the moving stage 35 to “ When the central substrate transfer unit 82b is positioned at the second position P2 with the substrate transfer position positioned at the “substrate transfer position”, the two substrates 2 are picked up from the left substrate transfer unit 33L. Further, the right substrate transfer part 33R is located at the front position of the component mounting work part 22b, and the right substrate transfer part 82c is located at the third position P3 (FIG. 16B).

  When the first component crimping operation portion 22c performs the component crimping operation, the right substrate transfer portion 82c is positioned at the fourth position P4, and the central substrate transfer portion 82b is positioned at the third position P3. The central substrate transfer part 82b places and holds the two substrates 2 on the two substrate placement stages 53 of the right substrate transfer part 33R, and the left substrate transfer part 82a is at the second position P2. In position, the two substrates 2 are placed and held on the two substrate holding stages 36 of the left substrate transfer section 33L (FIG. 16C).

  When the right-side substrate transfer unit 33R and the left-side substrate transfer unit 33L hold the substrate 2, the left-side substrate transfer unit 33L places the moving stage 35 in the “work position” and attaches the two substrates 2 to the ACF. It is located above the backup stage 42 for use. On the other hand, the right substrate transfer unit 33R positions the moving stage 52 at the “working position” and positions the right substrate 2 out of the two substrates 2 above the backup stage 64 for component mounting work. . When the two substrates 2 of the left substrate transfer unit 33L are positioned above the backup stage 42, the ACF adhering operation unit 22a performs the ACF adhering operation on the two substrates 2. When the right substrate 2 of the right substrate transfer unit 33R is positioned above the backup stage 64, the component mounting operation unit 22b executes the component mounting operation on the substrate 2 (FIG. 17A).

  When the ACF adhering operation unit 22a executes the ACF adhering operation and the component mounting operation unit 22b executes the component mounting operation, the right substrate transfer unit 33R moves to the right and moves to the left of the two substrates 2. The other substrate 2 is positioned above the backup stage 64 for component mounting work. When the left substrate 2 is positioned above the backup stage 64, the component mounting operation unit 22b performs a component mounting operation on the substrate 2 (FIG. 17B, second component mounting step). During this time, two new substrates 2 are placed (loaded) on the two substrate receiving stages 21 s of the substrate receiving unit 21.

  As described above, the component mounting operation is performed in the order from the right substrate 2 to the left substrate 2 of the two left and right substrates 2 mounted on the two substrate mounting stages 53. This is because 53 is then moved to the second component crimping operation part 22d located on the right side and the component crimping step (second component crimping step) is performed. This eliminates the movement of the substrate 2 returning from the mounting of the component 4 to the substrate 2 to the pressing of the mounted component 4 to the substrate 2.

  When the component mounting operation unit 22b executes the component mounting operation, the right substrate transfer unit 33R moves to the right (the second component crimping operation unit 22d side) as it is, and the two substrates 2 are moved to the second component. The two substrates 2 are transferred to the crimping work section 22d and positioned above the two component crimping work backup stages 72. When the two substrates 2 are positioned above the backup stage 72, the second component crimping operation unit 22d performs a component crimping operation on the two substrates 2 (FIG. 17C). Crimping process). At the same time, the left substrate transfer unit 82a is positioned at the first position P1 to pick up two substrates 2 from the substrate receiving unit 21, and the left substrate transfer unit 33L moves the moving stage 35 to “ When the central substrate transfer unit 82b is positioned at the second position P2 with the substrate transfer position positioned at the “substrate transfer position”, the two substrates 2 are picked up from the left substrate transfer unit 33L. Further, the central substrate transfer unit 33C moves to the front position of the component mounting work unit 22b while moving the moving stage 52 to the “substrate transfer position”, and the right substrate transfer unit 82c receives two sheets from the central substrate transfer unit 33C. The substrate 2 is picked up (FIG. 17C).

  When the two substrates 2 are picked up, the right substrate transfer unit 82c is positioned at the fourth position P4, and places the two substrates 2 on the two substrate transfer stages 23s of the substrate transfer unit 23. The central substrate transfer part 82b is located at the third position P3, and places and holds the two substrates 2 on the two substrate placement stages 53 of the central substrate transfer part 33C. Further, the left substrate transfer part 82a is located at the second position P2, and the two substrates 2 are placed and held on the two substrate holding stages 36 of the left substrate transfer part 33L (FIG. 18A). ).

  When the central substrate transfer unit 33C and the left substrate transfer unit 33L hold the substrate 2, the left substrate transfer unit 33L positions the moving stage 35 at the “working position” and attaches the two substrates 2 to the ACF attachment work. Is positioned above the backup stage 42. When the two substrates 2 are positioned above the backup stage 42, the ACF adhering operation unit 22a performs the ACF adhering operation on the two substrates 2. On the other hand, the central substrate transfer unit 33C positions the moving stage 52 at the “working position” and then positions the left substrate 2 of the two substrates 2 above the backup stage 64 for component mounting work. . When the left substrate 2 is positioned above the backup stage 64, the component mounting operation unit 22b performs the component mounting operation on the substrate 2 (FIG. 18B).

  When the ACF adhering unit 22a executes the ACF adhering operation and the component mounting operation unit 22b executes the component mounting operation, the central substrate transfer unit 33C moves to the left and moves to the right of the two substrates 2. The substrate 2 is positioned above the backup stage 64 for component mounting work. When the right substrate 2 is positioned above the backup stage 64, the component mounting operation unit 22b performs the component mounting operation on the substrate 2 (FIG. 18C, first component mounting step). During this time, two new substrates 2 are placed on the two substrate receiving stages 21 s of the substrate receiving unit 21.

  When the component mounting operation unit 22b performs the component mounting operation, the central substrate transfer unit 33C moves to the left (the first component crimping operation unit 22c side) as it is, and the two substrates 2 are bonded to the first component. The work part 22c is transferred, and the two substrates 2 are positioned above the backup stage 72 for two component crimping operations. When the two substrates 2 are positioned above the backup stage 72, the first component crimping operation unit 22c performs the component crimping operation on the two substrates 2 (FIG. 19A). Crimping process). At the same time, the left substrate transfer unit 82a is located at the first position P1 and picks up two substrates 2 from the substrate receiving unit 21, and the left substrate transfer unit 33L moves the moving stage 35. The two substrates 2 are picked up from the left substrate transfer portion 33L by being positioned at the “substrate transfer position” and the central substrate transfer portion 82b being positioned at the second position P2. In addition, the right substrate transfer unit 33R is positioned in front of the component mounting operation unit 22b while moving the moving stage 52 to the “substrate transfer position”, and two right substrate transfer units 82c from the right substrate transfer unit 33R. The substrate 2 is picked up (FIG. 19A).

  When the first component crimping operation unit 22c performs the component crimping operation, the right substrate transfer unit 82c is positioned at the fourth position P4 and the two substrates 2 are transferred to the two substrate transfer stages 23s of the substrate transfer unit 23. And the central substrate transfer part 82b is positioned at the third position P3 to place and hold the two substrates 2 on the two substrate placement stages 53 of the right substrate transfer part 33R. The left substrate transfer part 82a is positioned at the second position P2, and the two substrates 2 are placed on and held on the two substrate holding stages 36 of the left substrate transfer part 33L (FIG. 19B). )).

  The state shown in FIG. 19B is exactly the same as the state shown in FIG. Therefore, thereafter, by repeating the steps of FIG. 16C to FIG. 19A, the board delivery unit 23 performs the process of receiving the board 2 from the outside by the board receiving unit 21 and mounting the component 4 on the board 2. Continuous substrate production can be performed by repeatedly executing a series of operations up to delivery of the substrate 2 to the outside.

  By the way, when the new surface of the protective sheet 73b supplied by the protective sheet supply unit 73 disappears in the step of pressing the component 4 to the substrate 2 (main pressing) by the pressure-bonding head 71 in the series of steps described above, the sheet is cut. Therefore, the operator OP needs to replace the protective sheet 73b together with the protective sheet supply unit 73 by attaching / detaching the cassette 73a. The execution procedure at the time of the replacement work of the protective sheet 73b will be described with reference to the flowchart of FIG. 20 and the operation explanatory diagrams of FIGS.

  The control device 24 constantly monitors whether or not the protective sheet 73b is out of sheet using the sheet out detector 100 (FIG. 3) (step ST11 shown in FIG. 20), and the sheet out detector 100 is out of sheet. When the state is detected, the information is input to the sheet breakage detection unit 24S (FIG. 3) so that the sheet breakage state can be detected. The sheet break detector 100 includes, for example, a detector that detects the number of rotations of the roller member 73c that performs the winding and unwinding of the protective sheet 73b.

  When the sheet breakage detection unit 24S detects a sheet breakage state (detects a state in which the protective sheet 73b should be replaced) (detection step), the control device 24 stops all the operations of the respective units (step ST12). After storing the position of the substrate 2 on which the component 4 has been pressure-bonded in the storage unit 24a using the protective sheet 73b that has caused the sheet cut (step ST13), the notification control unit 24H (FIG. 3) uses a lamp or the like. The operator OP is notified through the notification device 82 that the sheet has run out. Then, the stage retracting step is executed by retracting the substrate placing stage 53 from the “working position” by the central substrate transporting part 33C or the right substrate transporting part 33R which is the substrate placing stage moving means. In this stage evacuation step, the substrate 2 on which the component 4 has been crimped in the component crimping working portions 22c and 22d (in the present embodiment, the component crimping working portion 22d) on the side where the sheet is cut is placed. The substrate mounting stage 53 is retreated from the “work position” by the central substrate transfer unit 33C or the right substrate transfer unit 33R (in this embodiment, the right substrate transfer unit 33R) as the moving means (FIG. 21). (A)-> Drawing 21 (b) Step ST14). Further, the substrate 2 on the substrate placement stage 53 is transferred to a substrate by a central substrate transfer portion 82b or a right substrate transfer portion 82c (in this embodiment, the central substrate transfer portion 82b) as a substrate transfer means. The substrate 2 is retracted from the mounting stage 53 (FIG. 21 (b) → FIG. 21 (c), step ST15, substrate retracting step). When the evacuation process including the stage evacuation process and the substrate evacuation process is executed, the operator OP is in a state where the substrate placement stage 53 is evacuated from the “working position” (the state shown in FIG. 21C), and the protective sheet 73b. Is replaced (step ST16, protective sheet replacement step).

  The control device 24 determines whether or not the replacement operation of the protective sheet 73b by the operator OP is completed based on whether or not the operator OP has performed a predetermined operation (step ST17). As a result, the replacement operation of the protective sheet 73b is performed. In the case where the sheet cutting is detected, the crimping operation of all the components 4 scheduled to be mounted on the substrate 2 that has been the object of the crimping operation in the crimping operation unit on the side where the sheet has been cut is performed. It is determined whether or not the process has been completed (step ST18). As a result, when the sheet cutting is detected, the crimping operation of all the components 4 scheduled to be mounted on the substrate 2 that has been the object of the crimping operation in the crimping operation unit on the sheet cutting side has not been completed. In step ST13, based on the information on the position of the substrate 2, the central substrate transfer unit 82b or the right substrate transfer unit 82c (in this embodiment, the central substrate transfer unit 82b) 2 is returned to the substrate placement stage 53 of the central substrate transfer unit 33C or the right substrate transfer unit 33R (the right substrate transfer unit 33R in the present embodiment), and the central substrate transfer unit 33C or the right substrate transfer unit The substrate placement stage 53 is returned to the “working position” by 33R (in the case of the present embodiment, the right substrate transfer unit 33R). That is, the substrate 2 is returned to the original position (step ST19). And if the board | substrate 2 returns to the original position, the crimping | compression-bonding head 71 will be operated and the crimping | compression-bonding (main crimping) of the components 4 to the board | substrate 2 will be restarted (step ST20).

  On the other hand, in step ST18, when the sheet breakage is detected, the crimping operation of all the components 4 scheduled to be mounted on the substrate 2 that has been the object of the crimping operation in the crimping operation unit on the sheet cutting side has been completed. In this case, the control device 24 returns the substrate 2 to the substrate placement stage 53 of the right substrate transfer unit 33R by the central substrate transfer unit 82b (FIG. 21 (c) → FIG. 22 (a)). The substrate 2 on the substrate mounting stage 53 is sucked by the right substrate transfer portion 82c (FIG. 22 (a) → FIG. 22 (b)) and moved to the fourth position P4 (FIG. 22 (b) → FIG. 22 (c)), the substrate 2 is carried out to the subsequent process as it is (step ST21). If the substrate retracting process of the substrate 2 has been executed by the right substrate transfer unit 82c, the right side of the central substrate transfer unit 82b via the substrate mounting stage 53 as described in the present embodiment will be described. The substrate 2 is unloaded from the fourth position P4 without changing the substrate 2 to the side substrate transfer portion 82c.

  As described above, in the component mounting apparatus 1 according to the present embodiment, when the state in which the protection sheet 73b is to be replaced is detected, the substrate mounting stage 53 is retracted from the “working position”. Therefore, the operator OP can easily and in a short time replace the protective sheet 73b (remove and attach the cassette 73a). For this reason, the work efficiency of the replacement | exchange work of the protection sheet 73b improves, and the productivity of the board | substrate by the component mounting apparatus 1 can be improved. Further, since the risk of the operator OP contacting the substrate 2 on the substrate placement stage 53 during the replacement operation of the protective sheet 73b can be reduced, the possibility that the substrate 2 such as a glass panel is damaged as a result can be reduced. Can also be expected.

  In the retreating process, after the substrate placement stage 53 is moved from the “working position”, the substrate 2 is moved from the substrate placement stage 53 by the right substrate transfer portion 82c which is a substrate transfer means. Thus, the operator OP can more easily replace the protective sheet 73b.

  Further, when it is detected that the protective sheet 73b should be replaced before the crimping operation of the component 4 to the substrate 2 is completed, the information on the position of the substrate 2 before executing the pre-stored evacuation process. Therefore, after the protective sheet replacement process, the substrate 2 is returned to the position before the retreat process and the crimping operation is restarted. Work can be continued automatically. On the other hand, when it is detected that the protective sheet 73b is to be replaced when the crimping operation of the component 4 to the substrate 2 is completed, the right substrate transfer unit 33R that is the substrate carry-out means is used after the protective sheet replacement step. The substrate 2 is carried out to the subsequent process without returning to the position before execution of the retracting process. Therefore, after the retracting process, the substrate 2 is returned to the original position and the crimping operation can be automatically continued. On the other hand, after the retracting process, the substrate 2 is moved to the original position until it is not necessary to return the substrate 2 to the original position. The useless operation of returning to (4) is eliminated, and the component 4 can be efficiently crimped to the substrate 2.

  The configuration of the component mounting apparatus 1 is not limited to the configuration described in the present embodiment, and can be selected as appropriate without departing from the spirit of the present invention. For example, unlike the component mounting apparatus described in the present embodiment, a configuration having a substrate placement stage for each working unit and a substrate transfer unit for each working unit has the same effect.

  Provided is a method for replacing a protective sheet in a component mounting apparatus in which the protective sheet can be easily replaced in a short time.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 4 Components 33C Central board | substrate transfer part (board | substrate mounting stage moving means)
33R Right-side substrate transfer unit (substrate placement stage moving means)
53 Substrate placement stage 71 Crimp head 73b Protective sheet 82c Right side substrate transfer part (substrate transfer means)

Claims (4)

A substrate placement stage for holding a substrate having components mounted on the upper surface, substrate transfer means for transferring the substrate to the substrate placement stage, and a substrate placement stage for moving the substrate placement stage Moving means, a pressure-bonding head that descends from above the substrate-loading stage positioned at a predetermined work position by the substrate-loading stage moving means, and pressure-bonds the component to the substrate; and the pressure-bonding head and the component A protective sheet replacement method in a component mounting apparatus provided with a protective sheet disposed between,
A detection step of detecting a state in which the protective sheet is to be replaced;
A retracting step of retracting the substrate mounting stage from the working position by the substrate mounting stage moving means when a state in which the protection sheet should be replaced is detected in the detecting step;
A protection sheet replacement method in a component mounting apparatus, comprising: a protection sheet replacement step of replacing the protection sheet in a state where the substrate placement stage is retracted from the work position.   2. The retracting step is performed by moving the substrate mounting stage from the working position, and further moving the substrate from the substrate mounting stage by the substrate transfer means. A protective sheet replacement method in the component mounting apparatus described.   If it is detected that the protective sheet should be replaced before the component crimping operation to the substrate is completed, the previously stored information on the position of the substrate before executing the retraction step is detected. The protective sheet in the component mounting apparatus according to claim 1, wherein after the protective sheet replacement step, the crimping operation is resumed by returning the substrate to a position before the retreating step. method of exchange.   When it is detected that the protective sheet should be replaced when the crimping operation of the component to the substrate is completed, after the protective sheet replacement step, the substrate is removed by the substrate unloading means. 4. The protective sheet replacement method in the component mounting apparatus according to claim 3, wherein the protective sheet is carried out to a subsequent process without returning to a position before execution.

Images