JP2003209145A - Thermo compression bonding unit and thermo compression bonding method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermo compression bonding unit and a thermo compression bonding method of an electronic component by which a contamination preventive sheet for a thermo compression bonding tool can be promptly replaced. <P>SOLUTION: A sheet unit 10 having the contamination preventive sheet 2 placed between the electronic component and the thermo compression bonding tool 46 includes a first rotary shaft 13 and a second rotary shaft 14 to wind and rewind the sheet 2, and rails 21, 22 that cause the second rotary shaft 14 to go in and out between a support portion 41 and the thermo compression bonding tool 46 by moving the sheet unit 10. When the sheet 2 of the first rotary shaft 13 is wound around the second rotary shaft 14 as thermo compression bonding operations progresses, the used contaminated sheet 2 wound around the second rotary shaft 14 is rewound around the first rotary shaft 13, and a winding diameter of the second rotary shaft 14 becomes smaller. In such a state, the sheet unit 10 is retreated, and the second rotary shaft 14 is detached from between the support portion 41 and the thermo compression bonding tool 46 to replace the sheet. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component thermocompression bonding apparatus and thermocompression bonding method for thermocompression bonding an electronic component to a substrate such as a liquid crystal panel.

[0002]

2. Description of the Related Art As a method of mounting electronic parts, an anisotropic conductive sheet (hereinafter referred to as "A") is formed on an electrode of a substrate such as a liquid crystal panel.
It is known that a "CF") is attached and an electronic component is thermocompression bonded by pressing a thermocompression bonding tool (hereinafter simply referred to as "tool") on the ACF. Examples of such electronic components include a flexible carrier such as a tape carrier package having leads (terminals) formed thereon, and a flip chip having bumps (terminals).

In such a thermocompression bonding apparatus for electronic components, when the tool is lowered and the terminals of the electronic component are pressed onto the ACF for thermocompression bonding, part of the ACF made of soft resin or the like is placed on the lower surface of the tool. Although easy to adhere, the ACF adhered to the lower surface of the tool becomes an obstacle to the thermocompression bonding work.

Therefore, it is known that a stain prevention sheet is provided below the tool, and the tool is pressed against the electronic component through the sheet to perform thermocompression bonding. Since such a sheet is apt to be contaminated due to ACF, a new, clean sheet is fed below the tool by appropriately feeding it from the supply reel to the take-up reel.

[0005]

When the thermocompression bonding work progresses and the sheets are used up, the sheets must be replaced (collection of used dirty sheets and setting of new sheets). Conventionally, this sheet replacement is performed manually by an operator, but since the reel for winding the sheet is located on the opposite side of the crimping mechanism including tools, it takes time and time to replace the sheet. There was a problem that it took.

Therefore, an object of the present invention is to provide a thermocompression bonding apparatus and a thermocompression bonding method for electronic parts, which can quickly replace a stain prevention sheet of a tool.

[0007]

SUMMARY OF THE INVENTION A crimping device for an electronic component according to the present invention comprises a supporting portion for supporting a substrate from below, and a thermocompression bonding of the electronic component to the substrate by performing an up / down operation above the supporting portion. The thermocompression-bonding tool, the seat unit with the dirt prevention sheet interposed between the electronic component and the thermocompression-bonding tool, and the mounting part for detachably mounting the seat unit A first rotating shaft that supplies a sheet, a second rotating shaft that winds a dirty sheet by thermocompression bonding, and a rewinding unit that rewinds the sheet wound on the second rotating shaft to the first rotating shaft. Equipped with.

Also preferably, there is provided guide means for guiding the movement of the sheet unit and guiding the second rotating shaft to pass between the support portion and the thermocompression bonding tool.

Further, according to the sheet replacing method of the present invention, the second rotating shaft is passed between the supporting portion and the thermocompression bonding tool to make the first rotating shaft.
Positioning the sheet between the rotating shaft and the second rotating shaft between the supporting portion and the thermocompression bonding tool, and mounting the sheet unit on the mounting portion to position the sheet, and rotating the sheet from the first rotating shaft to the second rotating shaft. The step of performing the thermocompression bonding work of the electronic component by causing the thermocompression bonding tool to move up and down while winding the sheet around the shaft, and if the sheet of the first rotary shaft is wound around the second rotary shaft, the second
The used soiled sheet wound around the rotating shaft of 1 is rewound onto the first rotating shaft by the rewinding means, and then the sheet unit is removed from the mounting portion and the second portion is provided between the support portion and the thermocompression bonding tool. And a step of replacing the sheet by passing through the rotating shaft.

According to the present invention, the used dirty sheet wound on the second rotating shaft is rewound on the first rotating shaft to reduce the winding diameter of the second rotating shaft (zero or very small). Then, by moving the sheet unit in this state and letting the second rotation shaft pass between the support portion and the thermocompression-bonding tool, the sheet can be quickly replaced.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a thermocompression bonding apparatus for electronic parts according to an embodiment of the present invention, and FIGS. 2 to 8 are side views showing the order of use of the thermocompression bonding apparatus for electronic parts according to an embodiment of the present invention. FIG. 9 is a plan view of the sheet unit of the thermocompression bonding apparatus for electronic components according to the embodiment of the present invention.

First, the overall structure of the thermocompression bonding apparatus for electronic components will be described with reference to FIG. In FIG. 1, a seat unit 10 is provided on the base 1. The seat unit 10 includes a pair of left and right side plates 11 and 12 and side plates 11 and 12.
A first rotating shaft 13 and a second rotating shaft 14 are horizontally supported between the first rotating shaft 13 and the second rotating shaft 14. Reference numeral 2 is a tape-shaped sheet, which is wound and unwound by the first rotating shaft 13 and the second rotating shaft 14. Reference numeral 2'denotes a wound body of the sheet 2 wound around the first rotating shaft 13. A disc 15 is attached to the end of the first rotating shaft 13, and a hand-turning handle 16 for rotating the first rotating shaft 13 is attached to the disc 15. A gear 17 is attached to the end of the second rotating shaft 14.

On the sides of the side plates 11 and 12, a pair of left and right parallel rails 21 and 22 are installed on the base 1 by columns 18. The rails 21 and 22 have a support portion 4 at the center thereof.
1 is arranged so as to be sandwiched from the left and right. As shown in FIG. 2, one end portion thereof extends toward the movable table 50 side, and the other end portion thereof extends in a direction opposite to the movable table 50.

In FIGS. 1A and 1B, standing portions 23 as mounting portions for the seat unit 10 are provided at both ends of the rails 21 and 22, respectively.
24 is integrally provided. Recesses 25 and 26, into which both ends of the first rotating shaft 13 and the second rotating shaft 14 are removably fitted, are formed in the upper portions of the standing portions 23 and 24.
The seat unit 10 is positioned at a predetermined position by fitting the first rotary shaft 13 and the second rotary shaft 14 into the recesses 25 and 26.

The inner side surfaces of the upright portions 23 and 24 are formed with inclined surfaces 27 and 28 so that the second rotating shaft 14 can easily ride up along it and fit into the recesses 25 and 26. The inner surface of the upright portion 24 is a gear 29 with which the gear 17 is engaged and disengaged.
And a motor 30 as a rotating means for rotating the gear 29 is mounted on the outer surface. As will be described later, the first rotating shaft 13 and the second rotating shaft 14 are rotated by this motor 30.

In FIG. 9, a driven pulley 51 having a one-way clutch mechanism is attached to the end of the first rotary shaft 13. A pulley 52 is attached to the other end of the second rotating shaft 14. A belt 53 is attached to the driven pulley 51 and the pulley 52.

As shown in FIG. 9, when the seat unit 10 is advanced toward the support portion 41 and the motor 30 is rotated in the forward direction with the gear 17 engaged with the gear 29, the second rotary shaft 14 rotates. Then, the sheet 2 is wound around the first rotating shaft 13. At this time, due to the one-way clutch mechanism of the driven pulley 51, the driven pulley 51 does not transmit the rotational force to the first rotating shaft 13, so that the first rotating shaft 13 is attached to the seat 2 wound around the second rotating shaft 14. It is pulled and driven to rotate. When the motor 30 is rotated in the reverse direction, the second rotating shaft 14 is also rotated in the reverse direction, and the rotation thereof is the pulley 52 and the belt 5.
3. The sheet is transmitted to the first rotary shaft 13 via the driven pulley 51, and the first rotary shaft 13 rotates in the winding direction to wind up the dirty used sheet 2 from the second rotary shaft 14. That is, the motor 30, the driven pulley 51, the pulley 5
2, the belt 53, etc. are rewinding means for rewinding and collecting the used dirty sheet 2 from the second rotary shaft 14 to the first rotary shaft 13.

In FIG. 1, the rails 21 and 2 on the base 1 are
Between the two, a plate-shaped support portion 41 that supports an edge portion of a display panel (described later) from below is provided. A frame 42 is erected on the side surface of the base 1. A base plate 43 extending on the base 1 is provided at the upper end of the frame 42. A cylinder 44 as an up-and-down moving means is provided upside down on the base plate 43, and a lower end portion of a rod 45 thereof is connected with a thermocompression bonding tool 46. The tool 46 is above the support portion 41, and the rod 45 of the cylinder 44 is
It moves up and down when it sunk, and performs thermocompression bonding work for electronic components.

In FIG. 5, a movable table 5 is mounted on the base 1.
0 is provided. The display panel 3 as a substrate is placed and positioned on the movable table 50. The movable table 50 is movable in the front-rear direction (X direction).
In addition, the movable table 50 is provided with the display panel 3 mounted on it.
Horizontal direction (X direction, Y direction), vertical direction (Z direction),
It can be moved in the horizontal rotation direction (θ direction). As the display panel 3, the display panel or the like described in Japanese Patent No. 3102312 is applied. On the edge of the display panel 3, electrodes for aligning and bonding terminals such as leads and bumps of electronic parts are arranged in parallel at a narrow pitch.

This thermocompression bonding apparatus for electronic parts is constructed as described above, and its operation and usage will be described in order with reference to FIGS. FIG. 2 shows the initial state. In this state, the tool 46 is retracted to the upper position,
There is a gap G between the support 41 and the tool 46. If the winding diameter of the sheet 2 is small, the gap G is set to the second rotation shaft 14
Is a size that can be passed, and cannot be passed if the winding diameter is large. The movable table 50 is retracted forward (to the right in FIG. 2). The sheet 2 is wound around the first rotating shaft 13 in an unused state, and the winding diameter D of the winding body 2'is large. Further, the diameter of the second rotating shaft 14 is dimensioned so that it can pass through the above-mentioned interval G with a sufficient margin.

Therefore, the operator places both ends of the second rotary shaft 14 on the upper surfaces of the rails 21 and 22, and in this state, the seat unit 10 is manually pushed to move (forward) along the rails 21 and 22 (arrow N). ). FIG. 3 shows the forward movement in progress, and FIG. 4 shows the forward movement completed state. Here, since the winding diameter of the sheet 2 of the second rotating shaft 14 is zero or the minimum and is smaller than the gap G, the gap G can be passed. In the state where the forward movement is completed in FIG.
Then, both ends of the second rotating shaft 14 are fitted into the recesses 26 of the upright portion 24, whereby the seat unit 10 is positioned and mounted at a predetermined position. Further, in this state, the gear 17 engages with the gear 29. During this forward movement, the rails 21, 22 and the inclined surface 28 serve as guide means for guiding the second rotation shaft 14 so that the second rotation shaft 14 can be smoothly fitted into the recess 26 and the seat unit 10 can be mounted at a predetermined position. .

In the state of FIG. 4, the sheet 2 horizontally or substantially horizontally aligned between the first rotary shaft 13 and the second rotary shaft 14 is located between the support portion 41 and the tool 46. . Reference numeral 19 denotes a shaft horizontally arranged between the side plates 11 and 12, and the seat 2 is stretched on the shaft 19 to have a horizontal or substantially horizontal posture.

Therefore, as shown in FIG. 5, the movable table 5
The display panel 3 to which electronic parts are temporarily attached is set on 0, and the movable table 50 is moved (forward) from the retracted position shown by the dotted line to the work position shown by the solid line (see arrow), and the edge of the display panel 3 is The supporting portion 41 is supported from below. With the above, the preparation for the thermocompression bonding work is completed. So tool 46
Are moved up and down (see the arrow) to thermocompress and bond the terminals of the electronic component 5 onto the electrodes on the edge of the display panel 3 (FIG. 6).

Although not shown, the electronic components on the display panel 3 are temporarily attached via the ACF, and the tool 46 is used.
When is lowered and pressed against the electronic component 5, a part of the ACF elutes, adheres to the sheet 2, and the sheet 2 becomes dirty. Then, by driving the motor 30 to rotate the second rotary shaft 14, the sheet 2 of the first rotary shaft 13 is wound around the second rotary shaft 14, and a new clean sheet 2 is supported by the support portion 41. The thermocompression bonding work is carried out while being extended between the tool and the tool. The drive timing of the motor 30 can be arbitrarily determined as long as the tool 46 is raised and the sheet 2 is separated from the electronic component.

FIG. 7 shows a state in which the thermocompression bonding work progresses and all or almost all of the sheet 2 is wound around the second rotating shaft 14 (state in which the sheet 2 is used up). When the seat 2 is used up in this way, the seat is replaced. Here, the winding diameter D ′ of the wound body 2 ′ of the sheet of the second rotating shaft 14 is larger than the gap G between the support portion 41 and the tool 46. Therefore, even if the seat unit 10 is moved (retracted) to the right in FIG. 7 in order to return the seat unit 10 to the initial position shown in FIG. You cannot do it.

Therefore, in the state of FIG. 7, the motor 30 is reversely rotated to rotate the first rotary shaft 13 in the sheet winding direction (the mechanism is as described with reference to FIG. 9), and the second Used sheet 2 wound around the rotating shaft 14
Is rewound on the first rotary shaft 13. FIG. 8 shows a state in which the seat 2 is rewound on the first rotary shaft 13, and since the winding diameter of the seat 2 on the second rotary shaft 14 is zero or minimal, the second rotary shaft 14 is not shown. Can pass through the gap G. During this rewinding work, it is desirable that the movable table 50 be retracted backward as shown in FIG.

When the seat 2 is rewound in this way, the first rotary shaft 13 and the second rotary shaft 14 are respectively removed from the recesses 25 and 26, and the seat unit 10 is moved along the rails 21 and 22. When moved (retracted), the second rotary shaft 14 passes through the gap G and passes the tool 46 and the support portion 4 together.
It escapes from between 1 and becomes the state shown in FIG. Therefore, the worker replaces the seat. This seat replacement may be performed by replacing the seat unit 10 itself, or only the seat 2 banded in the seat unit 10 may be replaced. When the used dirty sheet 2 is collected, a new sheet 2 is set and the above work is restarted.

In the thermocompression bonding apparatus for electronic parts, it is strictly required to control the parallelism between the upper surface of the supporting portion 41 and the lower surface of the crimping tool 46. Generally, it becomes more difficult to control the parallelism in a thermocompression bonding apparatus having a larger lifting stroke of the thermocompression bonding tool. In the present embodiment, the second rotary shaft 14 with the winding diameter of the sheet 2 being zero or minimal is passed between the support portion 41 and the thermocompression bonding tool 46, so the lifting stroke (interval G) of the thermocompression bonding tool 46. Has an advantage that the parallelism can be easily ensured by making the value as small as possible.

In the present embodiment, the seat unit 1
The movement of 0 (forward / backward) is performed manually by the operator, but may be performed by using the power of a motor, a cylinder or the like. Further, the rotating means of the first rotating shaft 13 and the second rotating shaft 14 is not limited to the example shown in FIG. 9, and can be freely designed. For example, the first rotating shaft 13 and the second rotating shaft 14 can be designed. Each of them may be provided with a motor that is independently driven, or may be manually rotated by an operator.

[0030]

As described above, according to the present invention, the stain prevention sheet of the thermocompression bonding tool can be quickly replaced.

[Brief description of drawings]

FIG. 1 is a perspective view of a thermocompression bonding apparatus for electronic components according to an embodiment of the present invention.

FIG. 2 is a side view showing the order of using the thermocompression bonding apparatus for electronic components according to the embodiment of the present invention.

FIG. 3 is a side view showing the order of use of the thermocompression bonding apparatus for electronic components according to the embodiment of the present invention.

FIG. 4 is a side view showing the order of use of the thermocompression bonding apparatus for electronic parts according to the embodiment of the present invention.

FIG. 5 is a side view showing the order of use of the thermocompression bonding apparatus for electronic components according to the embodiment of the present invention.

FIG. 6 is a side view showing the order of use of the thermocompression bonding apparatus for electronic components in the embodiment of the present invention.

FIG. 7 is a side view showing the order of using the thermocompression bonding apparatus for electronic components according to the embodiment of the present invention.

FIG. 8 is a side view showing the order of use of the thermocompression bonding apparatus for electronic parts in the embodiment of the present invention.

FIG. 9 is a plan view of a sheet unit of a thermocompression bonding apparatus for electronic components according to an embodiment of the present invention.

[Explanation of symbols]

2 sheets 2'sheet roll 3 Display panel (board) 5 electronic components 10 seat units 13 First rotation axis 14 Second axis of rotation 21,22 rail (guide means) 23, 24 Standing part (mounting part) 30 motor 41 Support 46 Thermo-compression bonding tool (tool)

Claims (3)

[Claims] 1. A support part for supporting a substrate from below, a thermocompression bonding tool above the support part for thermocompression bonding an electronic component to the substrate by moving up and down, and between the electronic component and the thermocompression bonding tool. A seat unit having an antifouling sheet interposed between the seat unit and a mounting unit for detachably mounting the seat unit, wherein the seat unit has a first rotating shaft for supplying an unused seat; An electronic component comprising: a second rotating shaft that winds up a soiled sheet by pressure bonding; and a rewinding unit that rewinds the sheet wound around the second rotating shaft onto the first rotating shaft. Thermocompression bonding device. 2. A guide means for guiding the movement of the sheet unit so as to guide the second rotary shaft to pass between the support portion and the thermocompression bonding tool. 1. A thermocompression bonding apparatus for electronic components according to 1. 3. A thermocompression bonding method for electronic components using the thermocompression bonding device for electronic components according to claim 1 or 2, wherein the second rotating shaft is passed between the supporting portion and the thermocompression bonding tool. And a step of positioning a sheet between the first rotating shaft and the second rotating shaft between the supporting portion and the thermocompression bonding tool, and mounting the sheet unit on the mounting portion to position the sheet unit. A step of performing a thermocompression bonding operation on an electronic component by vertically moving the thermocompression bonding tool while winding a sheet from the first rotation shaft to the second rotation shaft; and a sheet of the first rotation shaft. Is wound around the second rotary shaft, the used dirty sheet wound around the second rotary shaft is rewound onto the first rotary shaft by the rewinding means, and then the Remove the seat unit from the mounting part, Wherein between the thermocompression bonding tool second
And a step of replacing the sheet by passing through the rotation axis of the electronic component.