JP2015141967A - Substrate treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To hold a substrate while aligning it to a rotation center.SOLUTION: A substrate treatment apparatus includes: a substrate supporting part 141 for supporting a substrate 9 from a lower side; a substrate rotation mechanism for rotating the substrate supporting part 141; and a top plate 123 that opposes a top face 91 of the substrate 9. The top plate 123 is selectively disposed by a counter part supporting mechanism at an isolation position which is isolated from the substrate supporting part 141 upwards, and a connection position connected with the substrate supporting part 141. The substrate supporting part 141 includes a chuck part 4 including a plurality of pawl parts 41 and a transfer mechanism 42. When locating the top plate 123 at the connection position, abutting parts 43 of the transfer mechanism 42 are pushed in by a dead weight of the top plate 123. The transfer mechanism 42 transfers force that acts on the abutting parts 43, to the plurality of pawl parts 41, such that the plurality of pawl parts 41 press an edge of the substrate 9 towards a central axis. As a result, the substrate 9 can be held while being aligned to the rotation center.

Description

  The present invention relates to a substrate processing apparatus.

  Conventionally, in a manufacturing process of a semiconductor substrate (hereinafter simply referred to as “substrate”), various processes are performed on the substrate using a substrate processing apparatus. For example, by supplying a chemical solution to a substrate having a resist pattern formed on the surface, a process such as etching is performed on the surface of the substrate. In addition, after the etching process is completed, a process of removing the resist on the substrate or cleaning the substrate is also performed.

  In a single-wafer type substrate processing apparatus that processes substrates one by one, a substrate is held by a substrate holder, and a processing liquid is supplied to the substrate while rotating the substrate holder. Various methods, such as a vacuum chuck, a mechanical chuck, and a magnet chuck, have been put to practical use as methods for holding a substrate in the substrate holder. For example, Patent Document 1 discloses a mechanism that clamps a substrate when the upper and lower chamber members are arranged close to each other and releases the substrate clamp when the upper and lower chamber members are separated. Further, Patent Document 2 discloses a mechanism for holding a substrate or releasing the holding by rotating each of a plurality of holding members arranged around the substrate. Further, Patent Document 3 discloses a method of holding a wafer with a rotating head by a gripping portion having a spring in an apparatus in which the rotating head rotates magnetically without contact with the stator.

US Pat. No. 6,446,643 JP-A-2005-19456 US Pat. No. 6,485,531

  By the way, when the substrate holder is rotated in a floating state as in the apparatus of Patent Document 3, in order to hold the substrate, a driving force from a power source such as electricity or compressed air is transmitted to the substrate holder. Is difficult. In the apparatus of Patent Document 3, a wafer is held by a gripping part having a spring, but the wafer is fixed to the rotating head outside the process chamber, and the rotating head on which the wafer is mounted is introduced into the process chamber. Work is required. In the substrate processing apparatus, in order to stably rotate the substrate, it is important to align the substrate with respect to the rotation center, but when the substrate is carried into the substrate processing apparatus by an external transport mechanism, It is not easy to accurately align the substrate with respect to the center of rotation. Therefore, there is a need for a new method that can hold the substrate while aligning the substrate with the center of rotation.

  The present invention has been made in view of the above problems, and an object thereof is to hold a substrate while aligning the substrate with respect to the center of rotation.

  The invention according to claim 1 is a substrate processing apparatus for processing a substrate, wherein the substrate is supported from below with the upper surface being one main surface of the substrate facing upward, A rotation mechanism that rotates the substrate support portion around a central axis perpendicular to the substrate, an upper surface facing portion that faces at least the outer edge portion of the upper surface, and the upper surface facing portion that is spaced upward from the substrate support portion A counter part support mechanism that is selectively disposed at a separation position and a connection position that is connected to the substrate support part; and a chuck part provided on one of the substrate support part or the upper surface counter part, wherein the chuck part is When viewed along the central axis, at least three claw portions arranged around the substrate and the substrate support portion or the upper surface facing portion when the upper surface facing portion is located at the connection position Pushed in by the other A force acting on the contact portion is transmitted to the at least three claw portions, whereby the edge of the substrate is pushed toward the central axis on the at least three claw portions. A transmission mechanism.

  Invention of Claim 2 is the substrate processing apparatus of Claim 1, Comprising: When the said transmission mechanism contains an elastic member and the magnitude | size of the board | substrate supported by the said board | substrate support part fluctuates, When the elastic member is elastically deformed, the distance between the upper surface facing portion and the substrate at the connection position is kept constant.

  Invention of Claim 3 is the substrate processing apparatus of Claim 1 or 2, Comprising: The said rotation mechanism is cyclic | annular centering on the said central axis, The rotor part containing a permanent magnet, The said rotor And a stator portion that generates a rotational force centered on the central axis between the rotor portion and the rotor portion, and the rotor portion is the substrate. Connected to the support.

  A fourth aspect of the present invention is the substrate processing apparatus according to the third aspect, further comprising a sealed space forming portion that forms a sealed internal space in which processing on the substrate is performed, and the substrate support portion The rotor portion, the upper surface facing portion, and the chuck portion of the rotation mechanism are disposed in the sealed space forming portion.

  The invention according to claim 5 is the substrate processing apparatus according to claim 4, wherein the sealed space forming portion has a chamber main body having an upper opening, and a chamber lid for closing the upper opening of the chamber main body. The chamber lid part is also a part of the facing part support mechanism, the chamber lid part moves up and down relatively with respect to the chamber body, and the upper surface facing part is located at the separated position. The upper surface facing portion is suspended from a part of the chamber lid portion located above the chamber main body, and the upper surface facing portion is disposed on the chamber main body when the upper surface facing portion is positioned at the coupling position. It is in a non-contact state with the chamber lid portion that abuts or is close to.

  A sixth aspect of the present invention is the substrate processing apparatus according to any one of the first to fifth aspects, wherein the upper surface is opposed to extend along the upper surface so as to cover the substrate when positioned at the connection position. A nozzle for supplying a predetermined chemical solution is further provided between the portion and the upper surface of the substrate.

  According to the present invention, the substrate can be held while being aligned with the rotation center.

It is sectional drawing which shows a substrate processing apparatus. It is a block diagram which shows a gas-liquid supply part and a gas-liquid discharge part. It is a figure which shows the structure of a chuck | zipper part. It is a figure which shows the flow of a process of the board | substrate in a substrate processing apparatus. It is sectional drawing which shows a substrate processing apparatus. It is a figure which shows a chuck | zipper part and a top plate. It is sectional drawing which shows a substrate processing apparatus. It is sectional drawing which shows the board | substrate holding part vicinity in the substrate processing apparatus of a comparative example. It is a figure which shows the other example of a chuck | zipper part. It is a perspective view which shows a contact part and a some shaft. It is a top view which shows a nail | claw part. It is a figure which shows the further another example of a chuck | zipper part. It is a figure which shows the structure of a top plate moving mechanism.

  FIG. 1 is a cross-sectional view showing a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 is a single-wafer type apparatus that supplies a processing liquid to a substantially disk-shaped semiconductor substrate 9 (hereinafter simply referred to as “substrate 9”) to process the substrates 9 one by one. In FIG. 1, the application of parallel oblique lines to the cross section of a part of the configuration of the substrate processing apparatus 1 is omitted (the same applies to other cross sectional views).

  The substrate processing apparatus 1 includes a chamber 12, a top plate 123, a chamber opening / closing mechanism 131, a substrate holding unit 14, a substrate rotating mechanism 15, a liquid receiving unit 16, and a cover 17. The cover 17 covers the upper side and the side of the chamber 12.

  The chamber 12 includes a chamber main body 121 and a chamber lid portion 122. The chamber 12 has a substantially cylindrical shape with a lid and a bottom with a central axis J1 facing in the vertical direction as a center. The chamber main body 121 includes a chamber bottom portion 210 and a chamber side wall portion 214. The chamber bottom portion 210 has a substantially disc-shaped central portion 211, a substantially cylindrical inner wall portion 212 extending downward from the outer edge portion of the central portion 211, and a radially outer side from the lower end of the inner wall portion 212. A substantially annular plate-like annular bottom 213, a substantially cylindrical outer wall 215 extending upward from the outer edge of the annular bottom 213, and a substantially annular ring extending radially outward from the upper end of the outer wall 215 And a plate-like base portion 216.

  The chamber side wall portion 214 has an annular shape centering on the central axis J1. The chamber side wall portion 214 projects upward from the inner edge portion of the base portion 216. A member forming the chamber side wall portion 214 also serves as a part of the liquid receiving portion 16 as described later. In the following description, a space surrounded by the chamber side wall part 214, the outer wall part 215, the annular bottom part 213, the inner wall part 212, and the outer edge part of the central part 211 is referred to as a lower annular space 217.

  When the substrate 9 is supported by a substrate support portion 141 (described later) of the substrate holding portion 14, the lower surface 92 of the substrate 9 faces the upper surface of the central portion 211 of the chamber bottom portion 210. In the following description, the central portion 211 of the chamber bottom 210 is referred to as a “lower surface facing portion 211”.

  The chamber lid 122 has a substantially disc shape perpendicular to the central axis J1 and includes the upper portion of the chamber 12. The chamber lid 122 closes the upper opening of the chamber body 121. FIG. 1 shows a state where the chamber lid 122 is separated from the chamber main body 121. When the chamber lid 122 closes the upper opening of the chamber main body 121, the outer edge of the chamber lid 122 contacts the upper portion of the chamber side wall 214.

  The chamber opening / closing mechanism 131 moves the chamber lid 122, which is a movable part of the chamber 12, relative to the chamber body 121, which is another part of the chamber 12, in the vertical direction. The chamber opening / closing mechanism 131 is a lid raising / lowering mechanism that raises / lowers the chamber lid 122. When the chamber lid 122 moves in the vertical direction by the chamber opening / closing mechanism 131, the top plate 123 also moves in the vertical direction together with the chamber lid 122. The chamber lid 122 is in contact with the chamber main body 121 to close the upper opening, and the chamber lid 122 is pressed toward the chamber main body 121, whereby the chamber space 120 which is an internal space sealed in the chamber 12. (See FIG. 7) is formed. In other words, the chamber space 120 is sealed by closing the upper opening of the chamber body 121 by the chamber lid 122. The chamber lid part 122 and the chamber body 121 are sealed space forming parts that form the chamber space 120.

  The substrate holding unit 14 is disposed in the chamber space 120 and holds the substrate 9 in a horizontal state. That is, the substrate 9 is held by the substrate holding unit 14 in a state where one main surface 91 (hereinafter referred to as “upper surface 91”) on which a fine pattern is formed faces upwards perpendicularly to the central axis J1. The substrate holding unit 14 includes the above-described substrate support unit 141 and the chuck unit 4 provided on the substrate support unit 141. The substrate support portion 141 has a substantially annular shape centered on the central axis J1. The substrate support portion 141 includes a substantially annular plate-like support portion base 142 centered on the central axis J <b> 1 and a plurality of support pins 144 arranged on the support portion base 142 in the circumferential direction. The plurality of support pins 144 support the outer edge portion of the substrate 9 (that is, a portion near the outer periphery including the outer periphery) from below. The chuck portion 4 includes a plurality of claw portions 41. The plurality of claw portions 41 are arranged around the substrate 9 when viewed along the central axis J1. Details of the structure of the chuck portion 4 will be described later.

  The top plate 123 has a substantially disc shape perpendicular to the central axis J1. The top plate 123 is disposed below the chamber lid part 122 and above the substrate support part 141. The top plate 123 has an opening at the center. When the substrate 9 is supported by the substrate support portion 141, the upper surface 91 of the substrate 9 faces the lower surface of the top plate 123 perpendicular to the central axis J1. That is, the top plate 123 is an upper surface facing portion that faces the upper surface 91 of the substrate 9. The diameter of the top plate 123 is larger than the diameter of the substrate 9, and the outer peripheral edge of the top plate 123 is located on the outer side in the radial direction over the entire periphery of the outer peripheral edge of the substrate 9. A plurality of engaging portions 241 are arranged in the circumferential direction on the lower surface of the outer edge portion of the top plate 123. A concave portion that is recessed upward is provided at the lower portion of each engaging portion 241.

  In the state shown in FIG. 1, the top plate 123 is supported so as to be suspended by the chamber lid portion 122. Specifically, the chamber lid 122 has a substantially annular plate support 222 at the center. The plate support part 222 includes a substantially cylindrical tube part 223 centered on the central axis J1 and a substantially annular flange part 224 centered on the central axis J1. The flange part 224 spreads radially inward from the lower end of the cylindrical part 223.

  The top plate 123 includes an annular supported portion 237. The supported portion 237 includes a substantially cylindrical tube portion 238 centered on the central axis J1 and a substantially annular flange portion 239 centered on the central axis J1. The cylinder portion 238 extends upward from the upper surface of the top plate 123. The flange portion 239 extends outward from the upper end of the cylindrical portion 238 in the radial direction. The cylindrical portion 238 is located on the radially inner side of the cylindrical portion 223 of the plate support portion 222. The flange part 239 is located above the flange part 224 of the plate support part 222 and faces the flange part 224 in the vertical direction. When the lower surface of the flange portion 239 of the supported portion 237 is in contact with the upper surface of the flange portion 224 of the plate support portion 222, the top plate 123 is attached to the chamber lid portion 122 so as to be suspended from the chamber lid portion 122.

  In the substrate processing apparatus 1, the plate support part 222 of the chamber cover part 122 supports the top plate 123 in a state where the chamber cover part 122 is spaced upward from the chamber body 121, so that the top plate 123 is supported by the substrate support part 141. On the other hand, they are arranged at positions that are spaced apart upward (hereinafter referred to as “separated positions”). Actually, the chamber cover 122 is supported by a chamber opening / closing mechanism 131, and the chamber opening / closing mechanism 131 and the chamber cover 122 substantially support the top plate 123 that is the upper surface facing portion. It is.

  The substrate rotation mechanism 15 is a so-called hollow motor. The substrate rotation mechanism 15 includes an annular stator portion 151 centered on the central axis J1 and an annular rotor portion 152. The rotor portion 152 includes a substantially annular permanent magnet. The surface of the permanent magnet is molded with PTFE resin. The rotor portion 152 is disposed in the lower annular space 217 in the chamber 12. The support portion base 142 of the substrate support portion 141 is connected to the upper portion of the rotor portion 152 via a connection member. The support portion base 142 is disposed above the rotor portion 152.

  The stator portion 151 is disposed outside the chamber 12 and around the rotor portion 152, that is, outside in the radial direction with the central axis J1 as the center. In the present embodiment, the stator portion 151 is fixed to the outer wall portion 215 and the base portion 216 of the chamber bottom portion 210 and is positioned below the liquid receiving portion 16. Stator portion 151 includes a plurality of coils arranged in the circumferential direction about central axis J1.

  When current is supplied to the stator portion 151, a rotational force about the central axis J1 is generated between the stator portion 151 and the rotor portion 152. Thereby, the rotor part 152 rotates in a horizontal state around the central axis J1. Due to the magnetic force acting between the stator portion 151 and the rotor portion 152, the rotor portion 152 floats in the chamber 12 without contacting the chamber 12 directly or indirectly, and the substrate 9 is centered on the central axis J1. Are rotated together with the substrate support 141 in a floating state. Thus, the rotating body including the rotor portion 152 rotates in a non-contact state with other members that do not rotate.

  The liquid receiving part 16 includes a cup part 161, a cup part moving mechanism 162, and a cup facing part 163. The cup portion 161 has an annular shape centered on the central axis J <b> 1, and is located on the entire outer circumference in the radial direction of the chamber 12. The cup part moving mechanism 162 moves the cup part 161 in the vertical direction. The cup part moving mechanism 162 is disposed on the radially outer side of the cup part 161. The cup moving mechanism 162 is arranged at a position different from the chamber opening / closing mechanism 131 in the circumferential direction. The cup facing part 163 is located below the cup part 161 and faces the cup part 161 in the vertical direction. The cup facing portion 163 is a part of a member that forms the chamber side wall portion 214. The cup facing portion 163 has an annular liquid receiving recess 165 positioned on the radially outer side of the chamber side wall portion 214.

  The cup part 161 includes a side wall part 611, an upper surface part 612, and a bellows 617. The side wall portion 611 has a substantially cylindrical shape centered on the central axis J1. The upper surface portion 612 has a substantially annular plate shape centered on the central axis J1, and extends from the upper end portion of the side wall portion 611 radially inward and radially outward. The lower part of the side wall part 611 is located in the liquid receiving recessed part 165 of the cup facing part 163.

  The bellows 617 has a substantially cylindrical shape centered on the central axis J1, and can be expanded and contracted in the vertical direction. The bellows 617 is provided over the entire circumference around the side wall 611 outside the side wall 611 in the radial direction. The bellows 617 is formed of a material that does not allow gas or liquid to pass through. The upper end portion of the bellows 617 is connected to the lower surface of the outer edge portion of the upper surface portion 612 over the entire circumference. In other words, the upper end portion of the bellows 617 is indirectly connected to the side wall portion 611 via the upper surface portion 612. The connection portion between the bellows 617 and the upper surface portion 612 is sealed, and passage of gas or liquid is prevented. A lower end portion of the bellows 617 is indirectly connected to the chamber body 121 via the cup facing portion 163. Even at the connecting portion between the lower end portion of the bellows 617 and the cup facing portion 163, the passage of gas or liquid is prevented.

  A substantially cylindrical upper nozzle 181 centering on the central axis J1 is attached to the center of the chamber lid 122. The upper nozzle 181 is fixed to the chamber lid 122 so as to face the central portion of the upper surface 91 of the substrate 9. The upper nozzle 181 can be inserted into the central opening of the top plate 123. A lower nozzle 182 is attached to the center of the lower surface facing portion 211 of the chamber bottom portion 210. The lower nozzle 182 faces the center of the lower surface 92 of the substrate 9. A plurality of heated gas supply nozzles 180 are further attached to the lower surface facing portion 211. The plurality of heated gas supply nozzles 180 are arranged at, for example, equiangular intervals in the circumferential direction around the central axis J1.

  FIG. 2 is a block diagram showing the gas-liquid supply unit 18 and the gas-liquid discharge unit 19 included in the substrate processing apparatus 1. The gas-liquid supply unit 18 includes a chemical solution supply unit 183, a pure water supply unit 184, an IPA supply unit 185, and an inert gas supply unit in addition to the heating gas supply nozzle 180, the upper nozzle 181 and the lower nozzle 182 described above. 186 and a heated gas supply unit 187. The chemical solution supply unit 183, the pure water supply unit 184, and the IPA supply unit 185 are each connected to the upper nozzle 181 through a valve. The lower nozzle 182 is connected to the pure water supply unit 184 via a valve. The upper nozzle 181 is also connected to an inert gas supply unit 186 through a valve. The upper nozzle 181 has a liquid discharge port in the center and a gas jet port around it. Therefore, precisely, a part of the upper nozzle 181 is a part of a broad gas supply part that supplies gas into the chamber 12. The lower nozzle 182 has a liquid discharge port in the center. The plurality of heating gas supply nozzles 180 are connected to the heating gas supply unit 187 via valves.

  The first discharge path 191 connected to the liquid receiving recess 165 of the liquid receiving unit 16 is connected to the gas-liquid separation unit 193. The gas-liquid separation unit 193 is connected to the outer exhaust unit 194, the chemical solution recovery unit 195, and the drainage unit 196 through valves. The second discharge path 192 connected to the chamber bottom 210 of the chamber 12 is connected to the gas-liquid separator 197. The gas-liquid separation unit 197 is connected to the inner exhaust unit 198 and the drainage unit 199 via valves. Each configuration of the gas-liquid supply unit 18 and the gas-liquid discharge unit 19 is controlled by the control unit 10. The chamber opening / closing mechanism 131, the substrate rotating mechanism 15, and the cup moving mechanism 162 (see FIG. 1) are also controlled by the control unit 10.

  In the present embodiment, the chemical solution supplied from the chemical solution supply unit 183 to the substrate 9 via the upper nozzle 181 is an etching solution such as hydrofluoric acid or an aqueous tetramethylammonium hydroxide solution. The pure water supply unit 184 supplies pure water (DIW: Deionized Water) to the substrate 9 via the upper nozzle 181 or the lower nozzle 182. The IPA supply unit 185 supplies isopropyl alcohol (IPA) onto the substrate 9 through the upper nozzle 181. In the substrate processing apparatus 1, a processing liquid supply unit that supplies a processing liquid other than the above may be provided.

Further, the inert gas supply unit 186 supplies an inert gas into the chamber 12 via the upper nozzle 181. The heated gas supply unit 187 supplies a heated gas (for example, a high-temperature inert gas heated to 120 to 130 ° C.) to the lower surface 92 of the substrate 9 through the plurality of heated gas supply nozzles 180. In the present embodiment, the gas used in the inert gas supply unit 186 and the heating gas supply unit 187 is nitrogen (N ₂ ) gas, but may be other than nitrogen gas.

  FIG. 3 is a diagram illustrating a partial configuration of the chuck portion 4. As described above, the chuck portion 4 is provided on the substrate support portion 141, and a part of the chuck portion 4 is provided inside an annular support portion base 142 centered on the central axis J <b> 1. In FIG. 3, a part of the configuration within the support portion base 142 and the contact portion accommodating portion 431 described later is shown in a cross section by a plane including the central axis J <b> 1 (the same applies to FIGS. 6 and 9). The chuck portion 4 includes the plurality of claw portions 41 and the transmission mechanism 42 described above. As described above, the plurality of claw portions 41 are arranged in the circumferential direction around the substrate 9 supported by the plurality of support pins 144. The number of the plurality of claw portions 41 is at least 3, and in each combination of two claw portions 41 adjacent in the circumferential direction among the at least three claw portions 41, the two claw portions 41 and the central axis J1 The angle formed by the line connecting the two is less than 180 degrees. The at least three claw portions 41 are preferably provided at equiangular intervals in the circumferential direction. In the present embodiment, four claw portions 41 are provided at equiangular intervals in the circumferential direction.

  The transmission mechanism 42 includes a contact portion 43 provided for each claw portion 41 and a plurality of bars 44 and 45. The contact portion 43 is a bar member extending in the vertical direction, and a part thereof is disposed in the contact portion accommodating portion 431 provided on the upper surface of the support portion base 142. An annular upper support portion 432 and a lower support portion 433 are provided in the contact portion accommodating portion 431, and the contact portion 43 is movable in the vertical direction by the upper and lower support portions 432 and 433. Supported. A lower end portion of the contact portion 43 is disposed in an internal space 143 formed in the support portion base 142. A bar 44 is disposed in the internal space 143, and one end portion of the bar 44 is connected to the lower end portion of the contact portion 43 via a pin 421. A long hole 441 extending in the longitudinal direction of the bar 44 is formed in the bar 44, and the pin 421 is inserted into the long hole 441. The bar 44 is supported by a bar support portion 440 provided in the internal space 143 so as to be rotatable about a rotation axis perpendicular to the paper surface of FIG.

  The other end of the bar 44 is connected via a pin 422 to the lower end of another bar 45 that extends approximately in the vertical direction. A long hole 451 extending in the longitudinal direction of the bar 45 is formed in the bar 45, and the pin 422 is inserted into the long hole 451. A communication hole 145 that communicates with the internal space 143 is provided on the upper surface of the support base 142, and the bar 45 is inserted into the communication hole 145. The bar 45 is supported by a bar support portion 450 fixed around the communication hole 145 so as to be rotatable about a rotation axis perpendicular to the paper surface of FIG. In the bar 45, a portion above the bar support portion 450 is disposed outside the internal space 143 of the support portion base 142, and the periphery thereof is covered with a substantially cylindrical bellows 423. A claw portion 41 is attached to the upper end portion of the bar 45. The bellows 423 is formed of a material that does not allow the passage of gas or liquid. A connection part between the bellows 423 and the claw part 41, a connection part between the bellows 423 and the bar support part 450, a connection part between the bar support part 450 and the support part base 142, and the contact part accommodating part 431 and the support part base 142. The connection part is sealed and the passage of gas or liquid is prevented.

  A disc portion 434 centered on the contact portion 43 is attached to the contact portion 43. The disc part 434 is disposed between the upper support part 432 and the lower support part 433 in the contact part accommodating part 431. Between the disc part 434 and the lower side support part 433, the spring 435 surrounding the circumference | surroundings of the contact part 43 is provided. The disk portion 434 and the contact portion 43 are urged upward by the spring 435, and the disk portion 434 contacts the lower surface of the upper support portion 432 as shown in FIG. In a state in which the disc portion 434 is in contact with the lower surface of the upper support portion 432, the end portion of the bar 44 on the bar 45 side is positioned below the end portion on the contact portion 43 side, and the bar 45 is in the vertical direction. Approximately upright along. Thereby, the nail | claw part 41 is arrange | positioned in the position spaced apart from the edge of the board | substrate 9 on the outer side (on the opposite side to the central axis J1). An elastic member 436 formed of rubber or the like is provided on a part (or all) of the contact portion 43, and the contact portion 43 can be slightly expanded and contracted in the longitudinal direction. The configuration included in the transmission mechanism 42 is provided for each of the plurality of claw portions 41.

  FIG. 4 is a diagram illustrating a processing flow of the substrate 9 in the substrate processing apparatus 1. In the substrate processing apparatus 1, as shown in FIG. 1, in a state where the chamber lid part 122 is spaced apart from the chamber body 121 and located above, and the cup part 161 is separated from the chamber lid part 122 and located below. The substrate 9 is carried into the chamber 12 by an external transport mechanism and supported from below by the substrate support 141 (step S10). Hereinafter, the state of the chamber 12 and the cup part 161 shown in FIG. 1 is referred to as an “open state”. The opening between the chamber lid part 122 and the chamber side wall part 214 has an annular shape centering on the central axis J1, and is hereinafter referred to as “annular opening 81”. In the substrate processing apparatus 1, the chamber lid 122 is separated from the chamber main body 121, whereby an annular opening 81 is formed around the substrate 9 (that is, radially outside). In step S <b> 10, the substrate 9 is carried in via the annular opening 81.

  When the substrate 9 is carried in, the chamber opening / closing mechanism 131 lowers the chamber lid 122 from the position shown in FIG. 1 to the position shown in FIG. 5 (position close to the chamber body 121). Further, the cup portion 161 rises from the position shown in FIG. 1 to the position shown in FIG. 5, and is located over the entire circumference on the radially outer side of the annular opening 81. In the following description, the state of the chamber 12 and the cup part 161 shown in FIG. 5 is referred to as a “first sealed state”. Further, the position of the cup part 161 shown in FIG. 5 is referred to as a “liquid receiving position”, and the position of the cup part 161 shown in FIG. The cup part moving mechanism 162 moves the cup part 161 in the vertical direction between a liquid receiving position radially outside the annular opening 81 and a retracted position below the liquid receiving position.

  In the cup portion 161 located at the liquid receiving position, the side wall portion 611 faces the annular opening 81 in the radial direction. Further, the upper surface of the inner edge portion of the upper surface portion 612 is in contact with the lip seal 232 at the lower end of the outer edge portion of the chamber lid portion 122 over the entire circumference. Between the chamber cover part 122 and the upper surface part 612 of the cup part 161, the seal part which prevents passage of gas and a liquid is formed. Thereby, a sealed space (hereinafter referred to as “enlarged sealed space 100”) surrounded by the chamber body 121, the chamber lid portion 122, the cup portion 161, and the cup facing portion 163 is formed. In the enlarged sealed space 100, the chamber space 120 between the chamber lid portion 122 and the chamber body 121 and the side space 160 surrounded by the cup portion 161 and the cup facing portion 163 communicate with each other via the annular opening 81. It is one space formed by this.

  Further, in the first sealed state, as shown in FIG. 6, the upper end portion of the abutting portion 43 protruding upward from the abutting portion accommodating portion 431 is formed in the concave portion 242 of the lower portion of each engaging portion 241 of the top plate 123. fit. As a result, the top plate 123 is connected to the support base 142 of the substrate support 141. In other words, the relative position in the rotation direction (circumferential direction) of the top plate 123 with respect to the substrate support 141 is fixed. In the following description, a position where the top plate 123 is connected to the substrate support portion 141 is referred to as a “connection position”. When the chamber lid 122 is lowered, the rotation position of the support base 142 is controlled by the substrate rotation mechanism 15 so that the engagement portion 241 and the contact portion 43 are fitted. Actually, magnets 437 and 243 are provided on the upper end surface of each abutting portion 43 and the surface in the concave portion 242 of the engaging portion 241 facing the upper end surface, and between these magnets 437 and 243. The engaging portion 241 and the contact portion 43 are firmly coupled to each other by the magnetic force (attraction) acting on the.

  At this time, as shown in FIG. 5, the flange portion 239 of the supported portion 237 is spaced above the flange portion 224 of the plate support portion 222, and the plate support portion 222 and the supported portion 237 do not contact each other. In other words, the support of the top plate 123 by the plate support part 222, that is, the indirect support of the top plate 123 by the chamber opening / closing mechanism 131 is released. For this reason, the top plate 123 can be rotated by the substrate rotating mechanism 15 together with the substrate holding unit 14 and the substrate 9 held by the substrate holding unit 14 independently of the chamber lid 122.

  As shown in FIG. 6, the contact portion 43 is pushed downward by the weight of the top plate 123 until the lower surface of the engagement portion 241 contacts the upper surface of the contact portion accommodating portion 431. The end of the bar 44 on the side of the bar 45 moves above the end on the side of the contact part 43, and the bar 45 is inclined so that the upper end of the bar 45 approaches the substrate 9. As a result, the claw portion 41 comes into contact with the edge (side surface) of the substrate 9 on the support pin 144, and the edge is pushed by the claw portion 41 toward the central axis J1. Actually, the forces acting on the plurality of contact portions 43 are transmitted to the plurality of claw portions 41, respectively, and the plurality of claw portions 41 arranged in the circumferential direction cause the different portions of the edge of the substrate 9 to have substantially the same force. It is pushed toward the central axis J1. As a result, the substrate 9 is firmly held by the chuck portion 4 while the center of the substrate 9 is disposed on the central axis J1 (step S11). Even when the size (diameter) of the substrate 9 supported by the substrate support portion 141 varies, the amount of contraction of the elastic member 436 of the contact portion 43 changes, so that the lower surface of the engagement portion 241 is changed. It abuts on the upper surface of the abutting portion accommodating portion 431. Accordingly, the vertical distance between the lower surface of the top plate 123 and the upper surface 91 of the substrate 9 is kept constant.

  When the substrate 9 is held, the substrate rotation mechanism 15 shown in FIG. 5 starts rotating the substrate 9 at a constant rotation speed (which is a relatively low rotation speed, hereinafter referred to as “steady rotation speed”). . In addition, the supply of the inert gas (here, nitrogen gas) from the inert gas supply unit 186 (see FIG. 2) to the expanded sealed space 100 is started, and the gas in the expanded sealed space 100 by the outer exhaust unit 194 is started. Starts to be discharged. As a result, after a predetermined time has elapsed, the enlarged sealed space 100 becomes an inert gas filled state filled with an inert gas (that is, a low oxygen atmosphere with a low oxygen concentration). Note that the supply of the inert gas to the enlarged sealed space 100 and the discharge of the gas in the enlarged sealed space 100 may be performed from the open state shown in FIG.

  Next, the heated gas is ejected from the plurality of heated gas supply nozzles 180 toward the lower surface 92 of the rotating substrate 9. Thereby, the substrate 9 is heated. And supply of a chemical | medical solution is started toward the center part of the upper surface 91 of the board | substrate 9 from the upper nozzle 181 (step S12). The chemical solution from the upper nozzle 181 is continuously supplied to the upper surface 91 of the rotating substrate 9. The chemical solution on the upper surface 91 spreads to the outer peripheral portion of the substrate 9 by the rotation of the substrate 9, and the entire upper surface 91 is covered with the chemical solution.

  While the chemical liquid is being supplied from the upper nozzle 181, the ejection of the heated gas from the heated gas supply nozzle 180 is also continued. Thereby, etching with respect to the upper surface 91 with a chemical | medical solution is performed, heating the board | substrate 9 uniformly at about desired temperature. As a result, the uniformity of the chemical treatment for the substrate 9 can be improved. When supplying the chemical solution from the upper nozzle 181, the lower surface of the top plate 123 positioned at the connection position extends along the upper surface 91 of the substrate 9 so as to cover the substrate 9 above the substrate 9, and the upper surface 91 of the substrate 9. Is close to. As described above, the treatment with the chemical solution for the substrate 9 is performed in a very narrow space between the lower surface of the top plate 123 and the upper surface 91 of the substrate 9. Thereby, the uniformity of the chemical treatment for the substrate 9 can be further improved.

  In the enlarged sealed space 100, the chemical liquid scattered from the upper surface 91 of the rotating substrate 9 is received by the cup portion 161 via the annular opening 81 and guided to the liquid receiving recess 165. The chemical liquid guided to the liquid receiving recess 165 flows into the gas-liquid separator 193 via the first discharge path 191 shown in FIG. In the chemical solution recovery unit 195, the chemical solution is recovered from the gas-liquid separation unit 193 and is reused after impurities and the like are removed from the chemical solution through a filter or the like.

  When a predetermined time (for example, 60 to 120 seconds) elapses from the supply start of the chemical solution from the upper nozzle 181, supply of the chemical solution from the upper nozzle 181 and supply of the heating gas from the heating gas supply nozzle 180 are stopped. Then, the substrate rotation mechanism 15 makes the rotation speed of the substrate 9 higher than the steady rotation speed for a predetermined time (for example, 1 to 3 seconds), and the chemical solution is removed from the substrate 9.

  Subsequently, the chamber lid portion 122 and the cup portion 161 move downward in synchronization. Then, as shown in FIG. 7, the lip seal 231 at the lower end of the outer edge portion of the chamber lid portion 122 is in contact with the upper portion of the chamber side wall portion 214, whereby the annular opening 81 is closed, and the chamber space 120 becomes the side space 160. And sealed in an isolated state. The cup part 161 is located at the retracted position as in FIG. Hereinafter, the state of the chamber 12 and the cup part 161 shown in FIG. 7 is referred to as a “second sealed state”. In the second sealed state, the substrate 9 directly faces the inner wall of the chamber 12, and there is no other liquid receiving part therebetween.

  Even in the second sealed state, similarly to the first sealed state, the plurality of claws 41 of the chuck portion 4 push the edge of the substrate 9 toward the central axis J1, whereby the substrate 9 is firmly held. Further, the holding of the top plate 123 by the plate support unit 222 is released, and the top plate 123 rotates together with the substrate holding unit 14 and the substrate 9 independently of the chamber lid unit 122.

  When the chamber space 120 is sealed, the gas discharge by the outer exhaust part 194 (see FIG. 2) is stopped and the gas discharge in the chamber space 120 by the inner exhaust part 198 is started. Then, the supply of pure water to the substrate 9 is started by the pure water supply unit 184 (step S13).

  Pure water from the pure water supply unit 184 is continuously supplied from the upper nozzle 181 to the central portion of the upper surface 91 of the substrate 9. The pure water from the pure water supply unit 184 is also continuously supplied from the lower nozzle 182 to the central portion of the lower surface 92 of the substrate 9. Pure water discharged from the upper nozzle 181 and the lower nozzle 182 is supplied to the substrate 9 as a cleaning liquid.

  The pure water spreads to the outer peripheral portions of the upper surface 91 and the lower surface 92 by the rotation of the substrate 9 and scatters from the outer peripheral edge of the substrate 9 to the outside. Pure water splashing from the substrate 9 is received by the inner wall of the chamber 12 (that is, the inner walls of the chamber lid portion 122 and the chamber side wall portion 214), and the second discharge path 192, the gas-liquid separation portion 197, and the discharge portion shown in FIG. It is discarded through the liquid part 199 (the same applies to the drying process of the substrate 9 described later). Thereby, in the chamber space 120, the cleaning of the chamber 12 is substantially performed together with the cleaning process for the substrate 9 with pure water. Actually, a part of pure water splashing from the substrate 9 rebounds to the central axis J1 side on the inner wall of the chamber 12, but the upper surface 91 of the substrate 9 is covered with the top plate 123, so that the inner wall of the chamber 12 is covered. Is prevented from adhering to the upper surface 91 of the substrate 9.

  When a predetermined time has elapsed from the start of the supply of pure water, the supply of pure water from the pure water supply unit 184 is stopped. The heated gas is ejected from the plurality of heated gas supply nozzles 180 toward the lower surface 92 of the substrate 9. Thereby, the substrate 9 is heated. Further, the rotation speed of the substrate 9 is made sufficiently higher than the steady rotation speed in a state where the heating gas is continuously ejected from the heating gas supply nozzle 180. As a result, pure water is removed from the substrate 9, and the substrate 9 is dried (step S14). When a predetermined time has elapsed from the start of drying of the substrate 9, the rotation of the substrate 9 is stopped. Prior to the drying process of the substrate 9, IPA may be supplied from the upper nozzle 181 onto the upper surface 91 of the substrate 9, and pure water may be replaced with IPA on the upper surface 91. Further, the drying process of the substrate 9 may be performed in a reduced pressure atmosphere lower than the atmospheric pressure by reducing the chamber space 120 by the inner exhaust unit 198.

  Thereafter, as the chamber lid 122 is raised, as shown in FIG. 1, the chamber 12 is opened, and the top plate 123 is disposed at a spaced position with respect to the substrate support 141. In step S14, since the top plate 123 rotates together with the substrate support 141, almost no liquid remains on the lower surface of the top plate 123, and the liquid falls from the top plate 123 onto the substrate 9 when the chamber lid 122 is raised. There is no.

  In a state where the top plate 123 is disposed at the separated position, the engaging portion 241 and the contact portion 43 shown in FIG. 3 are separated in the vertical direction, and the contact portion 43 is moved to FIG. It is arranged at the position shown. Thereby, the bar 45 is substantially upright in the vertical direction, and the claw portion 41 is separated from the edge of the substrate 9 to the outside (on the side opposite to the central axis J1). That is, the holding of the substrate 9 by the chuck portion 4 is released (step S15). Thereafter, the substrate 9 is unloaded from the chamber 12 by an external transport mechanism (step S16), and the processing of the substrate 9 by the substrate processing apparatus 1 is completed. Actually, the processes in steps S <b> 10 to S <b> 16 are repeated for the other substrates 9.

  FIG. 8 is a cross-sectional view showing the vicinity of the substrate holder in the substrate processing apparatus of the comparative example. In the substrate processing apparatus of the comparative example, the substrate holding unit 95 includes a substantially annular substrate support unit 96 that supports the outer edge portion of the substrate 9 from the lower side, and the outer edge portion of the substrate 9 supported by the substrate support unit 96 on the upper side. And a substrate pressing portion 97 for pressing from the substrate. The substrate support portion 96 includes a substantially annular plate-like support portion base 960 and a plurality of first contact portions 961 fixed to the upper surface of the support portion base 960. The plurality of first contact portions 961 are arranged in the circumferential direction. Arranged. The substrate pressing portion 97 includes a plurality of second contact portions 971 fixed to the lower surface of the top plate 123, and the plurality of second contact portions 971 are arranged in the circumferential direction. On the lower surface of the outer edge portion of the top plate 123, a plurality of engagement portions 951 are arranged in the circumferential direction, and on the upper surface of the support portion base 960, a plurality of engagement pins 952 are arranged in the circumferential direction. When the top plate 123 is disposed at the coupling position, the engaging portion 951 and the engaging pin 952 are fitted, and the top plate 123 and the substrate support portion 96 are coupled. In the substrate processing apparatus of the comparative example, the substrate pressing portion 97 presses the substrate 9 against the substrate supporting portion 96 by the weight of the top plate 123, so that the substrate 9 is moved from above and below by the substrate pressing portion 97 and the substrate supporting portion 96. Sandwiched.

  By the way, in the substrate processing apparatus, the diameter of the substrate 9 to be carried in slightly varies due to warpage of the substrate 9 or manufacturing errors. In order to cope with such fluctuations, in the substrate processing apparatus of the comparative example, the plurality of first contact portions 961 in the support portion base 960 are matched with the substrate 9 having the maximum diameter in the SEMI (Semiconductor Equipment and Materials International) standard. The position and shape, and the positions and shapes of the plurality of second contact portions 971 on the top plate 123 are determined. Therefore, in the substrate processing apparatus of the comparative example, when the substrate 9 having a diameter smaller than the maximum diameter in the above standard is carried in, when the processing liquid is supplied to the substrate 9 or when acceleration / deceleration of the rotation of the substrate 9 is performed. The position of the substrate 9 on the substrate support 96 may fluctuate (that is, the substrate 9 moves slightly). In this case, the substrate 9 and the contact portions 961 and 971 are rubbed to generate contaminants, and the contact portions 961 and 971 are worn. Further, if the position of the substrate 9 varies greatly, the substrate 9 may be damaged. In the substrate processing apparatus of the comparative example, the end surface of the first contact portion 961 is an inclined surface for alignment. However, even if such an inclined surface is provided, the substrate 9 is not necessarily aligned accurately. Absent.

  On the other hand, in the substrate processing apparatus 1, the substrate support portion 141 is provided with the chuck portion 4 having the plurality of claw portions 41 and the transmission mechanism 42, and when the top plate 123 is positioned at the coupling position, Each contact portion 43 of the transmission mechanism 42 is pushed in the vertical direction by its own weight. The transmission mechanism 42 causes the plurality of claw portions 41 to push the edge of the substrate 9 toward the central axis J <b> 1 by transmitting the force acting on each contact portion 43 to the corresponding claw portion 41. Thereby, even if the diameter of the board | substrate 9 carried in fluctuates, the board | substrate 9 can be hold | maintained from the outer side with the some nail | claw part 41 using the dead weight of the top plate 123 arrange | positioned at a connection position. Realized. As a result, the position of the substrate 9 on the substrate support portion 141 can be prevented from fluctuating when the processing liquid is supplied to the substrate 9 or when the rotation of the substrate 9 is accelerated / decelerated. Can be prevented. Further, the center of the substrate 9 is arranged on the central axis J1 by the plurality of claw portions 41, that is, the substrate 9 is aligned with the rotation center, so that the substrate 9, the substrate support portion 141, and the top plate are aligned. The center of gravity of the rotating body including 123 can be arranged (balanced) in the vicinity of the central axis J1, and the rotating body can be rotated stably.

  Further, the top plate 123 disposed at the connection position is close to the upper surface 91 of the substrate 9 and covers the upper surface 91. Thereby, in the process of supplying the processing liquid to the rotating substrate 9, the processing liquid scattered from the outer edge portion of the substrate 9 is prevented from splashing on the inner wall of the chamber 12 and reattaching to the upper surface 91 of the substrate 9. Further, in the substrate holding unit 14, the transmission mechanism 42 includes the elastic member 436, and the elastic member 436 is elastically deformed when the size of the substrate 9 supported by the substrate support unit 141 varies. Thereby, the distance between the top plate 123 and the board | substrate 9 in a connection position can be kept constant. As a result, even if the size of the substrate 9 varies, the substrate 9 can be processed under certain conditions.

  In the substrate processing apparatus 1, the substrate rotation mechanism 15 includes an annular rotor portion 152 centered on the central axis J <b> 1 and an annular stator portion 151 that faces the rotor portion 152 in the radial direction with a gap. The substrate support unit 141 is connected to the rotor unit 152, and the substrate support unit 141 and the rotor unit 152 rotate without contacting the chamber 12 in the chamber 12. Thus, even when it is not possible to transmit a driving force from a power source such as electricity or compressed air to the chuck portion 4 provided in the substrate support portion 141, the substrate processing apparatus 1 having the above structure The substrate 9 can be held while being aligned with respect to the rotation center.

  FIG. 9 is a diagram illustrating another example of the chuck portion. The transmission mechanism 42a of the chuck portion 4a in FIG. 9 includes an abutting portion 43 and a plurality of shafts 46 and 47 provided for each claw portion 41a. The internal structure of the contact part 43 and the contact part accommodating part 431 is the same as that of FIG.

  FIG. 10 is a perspective view showing the contact portion 43 and the plurality of shafts 46 and 47. In FIG. 10, other components are not shown for convenience of illustration. As shown in FIG. 9, a shaft 46 extending in a direction perpendicular to the central axis J1 (lateral direction in FIG. 9) is disposed in the internal space 143 of the support base 142. The shaft 46 is supported by a pair of shaft support portions 460 so as to be rotatable about its central axis J2. As shown in FIG. 10, one end of a bar 461 extending in a direction perpendicular to the central axis J2 of the shaft 46 is fixed to one end of the shaft 46, and the other end of the bar 461 is in contact with the other end. The lower end of the portion 43 is connected via a pin 424. A long hole 462 extending in the longitudinal direction of the bar 461 is formed in the bar 461, and the pin 424 is inserted into the long hole 462.

  As shown in FIG. 9, a lower portion of another shaft 47 extending in the vertical direction is disposed in the internal space 143 of the support portion base 142. The shaft 47 is supported by the shaft support portion 470 so as to be rotatable about its central axis J3. As shown in FIG. 10, one end of a bar 463 extending in a direction perpendicular to the central axis J <b> 2 of the shaft 46 is fixed to the other end of the shaft 46, and the other end of the bar 463 is fixed to the shaft 47. Is connected to the upper portion of the pin via a pin 425. A long hole 464 extending in the longitudinal direction of the bar 463 is formed in the bar 463, and the pin 425 is inserted into the long hole 464.

  FIG. 11 is a plan view showing one claw portion 41a, and shows the claw portion 41a viewed along the vertical direction. As shown in FIGS. 9 and 11, the claw portion 41a has a claw portion main body 411 whose shape viewed along the vertical direction is elliptical. An upper surface 412 of the claw body 411 is an inclined surface whose height gradually decreases from one end of the elliptical long axis toward the other end. On the upper surface 412 of the claw body 411, a protrusion 413 that protrudes upward is provided near the position where the height is the largest. The protrusion 413 has an inverted truncated cone shape in which the upper diameter is larger than the lower diameter. The claw portion main body 411 is fixed to the upper surface of the covered claw portion support base 410.

  In the shaft 47, the portion excluding the lower portion is disposed outside the internal space 143 of the support portion base 142, and the upper end portion of the shaft 47 is fixed to the lower surface of the lid portion of the claw portion support base 410. The periphery of the portion of the shaft 47 disposed outside the internal space 143 is surrounded by the side wall portion of the claw support base 410. The connecting portion between the side wall portion of the claw support base 410 and the support portion base 142 is sealed in a state where both can slide.

  In a state where the top plate 123 is located at the separated position and the disk portion 434 is in contact with the lower surface of the upper support portion 432 by the bias of the spring 435 as indicated by a two-dot chain line in FIG. However, the upper surface 412 of the claw body 411 is disposed at a position slightly away from the protrusion 413. As shown by the solid line in FIG. 9, when the contact portion 43 is pushed downward by the weight of the top plate 123 located at the connection position, the shaft 46 shown in FIG. 10 rotates about the central axis J2. The shaft 47 rotates about the central axis J3. As a result, the claw body 411 rotates around the central axis J3 from the rotation position indicated by the two-dot chain line in FIG. 11 to the rotation position indicated by the solid line, as indicated by the solid line in FIG. The side surface of the protruding portion 413 contacts the edge of the substrate 9 while the substrate 9 moves slightly upward. In other words, the outer edge portion of the substrate 9 bites into the recess formed by the side surface of the protruding portion 413 and the upper surface 412 of the claw portion main body 411. Actually, forces acting on the plurality of contact portions 43 are transmitted to the plurality of claw portions 41a arranged along the outer edge of the substrate 9, respectively, and different portions of the edge of the substrate 9 are transmitted by the plurality of claw portions 41a. Are pushed toward the central axis J1 with substantially the same force. In this way, in the chuck portion 4a shown in FIG. 9, it is realized that the substrate 9 is held while being aligned with the center of rotation using the weight of the top plate 123 arranged at the connection position.

  FIG. 12 is a diagram illustrating still another example of the chuck portion. 12 is provided on the top plate 123. As shown in FIG. In FIG. 12, the cross section by the surface containing the central axis J1 is shown about the top plate 123 and a part of structure in the contact part accommodating part 431. In FIG. The chuck portion 4b includes a plurality of claw portions 41 and a transmission mechanism 42b. The plurality of claw portions 41 are arranged around the substrate 9 when viewed along the central axis J1. The transmission mechanism 42b has a structure similar to that obtained by inverting the transmission mechanism 42 in FIG. 3 in the vertical direction.

  Specifically, the transmission mechanism 42 b includes an abutting portion 43 provided for each claw portion 41 and a plurality of bars 44 and 45. The contact portion 43 is supported by the upper support portion 432 and the lower support portion 433 so as to be movable in the vertical direction. A substantially cylindrical contact portion receiving portion 431 is provided on the lower surface of the top plate 123, and the lower support portion 433 is provided in the contact portion receiving portion 431. An upper end portion of the contact portion 43 is disposed in an internal space 124 formed in the top plate 123. A bar 44 is arranged in the internal space 124, and one end portion of the bar 44 is connected to the upper end portion of the contact portion 43 via a pin 421. A long hole 441 extending in the longitudinal direction of the bar 44 is formed in the bar 44, and the pin 421 is inserted into the long hole 441. The bar 44 is supported by the bar support portion 440 so as to be rotatable about a rotation axis perpendicular to the paper surface of FIG.

  The other end of the bar 44 is connected to the upper end of another bar 45 via a pin 422. A long hole 451 extending in the longitudinal direction of the bar 45 is formed in the bar 45, and the pin 422 is inserted into the long hole 451. The bar 45 is supported by the bar support portion 450 so as to be rotatable about a rotation axis perpendicular to the paper surface of FIG. In the bar 45, a portion below the bar support portion 450 is disposed outside the internal space 124 of the top plate 123. The periphery of the bar 45 in the vicinity of the lower side of the bar support 450 is covered with a diaphragm seal 427. A claw portion 41 is attached to the lower end portion of the bar 45.

  The disc part 434 attached to the contact part 43 is disposed between the upper support part 432 and the lower support part 433. A spring 435 surrounding the periphery of the contact portion 43 is provided between the disc portion 434 and the upper support portion 432. The disk portion 434 and the contact portion 43 are urged downward by the spring 435. In a state where the top plate 123 is located at the separated position and the disc portion 434 is in contact with the upper surface of the lower support portion 433 as indicated by a two-dot chain line in FIG. 12, the inclination angle of the bar 45 with respect to the vertical direction is small. Thus, the claw portion 41 is separated from the edge of the substrate 9 to the outside.

  An engaging portion 241a that protrudes upward is provided on the upper surface of the support portion base 142, and when the top plate 123 is located at the coupling position, the abutting portion that protrudes downward from the abutting portion accommodating portion 431. The lower end portion of 43 fits into the recess 242a at the top of the engaging portion 241a. As a result, the top plate 123 is connected to the substrate support portion 141. Further, as indicated by a solid line in FIG. 12, the contact portion 43 is pushed upward by the substrate support portion 141 until the upper surface of the engagement portion 241 a contacts the lower surface of the contact portion accommodating portion 431. Thereby, the bar 45 is inclined so that the lower end portion of the bar 45 approaches the substrate 9, and the claw portion 41 comes into contact with the edge of the substrate 9. Actually, the forces acting on the plurality of contact portions 43 are transmitted to the plurality of claw portions 41 arranged along the outer edge of the substrate 9, respectively, and the plurality of claw portions 41 are different parts of the edge of the substrate 9. Is pushed toward the central axis J1. In this way, in the chuck portion 4b shown in FIG. 12, it is possible to hold the substrate 9 while aligning it with the center of rotation using the weight of the top plate 123 arranged at the connection position. In addition, the chuck part is provided in the substrate support part 141 from the viewpoint of preventing the processing liquid splashed from the upper surface 91 of the substrate 9 from splashing and adhering to the upper surface 91 by the components of the transmission mechanism connected to the claw part. It is preferred that

  The substrate processing apparatus 1 can be variously modified.

  Various structures other than those described above may be employed as a transmission mechanism that transmits the force acting on the contact portion to the plurality of claw portions. For example, in the transmission mechanism 42 a of FIG. 9, a screw may be formed at an end portion of the shaft 46 on the shaft 47 side, and the screw may be screwed into the shaft 47 because it is provided on the shaft 47. In this case, when the contact portion 43 moves in the vertical direction, the shaft 46 rotates about the central axis J2, and the shaft 47 linearly extends in the direction along the upper surface 91 of the substrate 9 (left-right direction in FIG. 9). Moving. Further, the transmission mechanism interlocks the force acting on one or a plurality of contact portions 43 in addition to the structure that transmits the force acting on the contact portion 43 provided for each claw portion only to the claw portion. And a structure for transmitting to a plurality of claws.

  When the size of the substrate 9 supported by the substrate support portion 141 varies, the elastic member that is elastically deformed so that the distance between the top plate 123 and the substrate 9 at the connection position is constant is the contact of the transmission mechanism. It may be provided other than the contact part 43. When the distance between the top plate 123 and the substrate 9 at the coupling position is allowed to slightly vary depending on the size of the substrate 9, the elastic member may be omitted from the transmission mechanism.

  In the above-described embodiment, the chamber opening / closing mechanism 131 that is a sealed space opening / closing mechanism also serves as (a part of) the opposed portion support mechanism that supports the top plate 123 that is the upper surface opposed portion, whereby the structure of the substrate processing apparatus 1 is configured. Although simplified, depending on the design of the substrate processing apparatus 1, the facing portion support mechanism may be provided separately from the chamber opening / closing mechanism 131.

  In the example shown in FIG. 13, a top plate moving mechanism 126 that moves the top plate 123 in the vertical direction is provided as a facing portion support mechanism. The top plate moving mechanism 126 includes a first magnet 261, a second magnet 262, and a magnet moving mechanism 263. Each of the first magnet 261 and the second magnet 262 has a substantially annular shape centered on the central axis J1. A cylindrical top plate shaft portion 235 formed of a non-magnetic material is provided on the top surface of the top plate 123, and the first magnet 261 is an outer peripheral surface of the top plate shaft portion 235 inside the top plate shaft portion 235. It is arranged along. The second magnet 262 is disposed so as to surround the top plate shaft portion 235 in the annular hole 264 formed in the chamber lid portion 122. The second magnet 262 moves up and down in the annular hole 264 by the magnet moving mechanism 263. As a result, the top plate 123 can move relative to the substrate support portion 141 between a separation position where the top plate 123 is spaced upward with respect to the substrate support portion 141 and a connection position where the top plate 123 is connected to the substrate support portion 141. It becomes possible.

  Further, the chamber opening / closing mechanism 131 may raise and lower the chamber lid 122 relative to the chamber main body 121, and the chamber main body 121 may move up and down relative to the chamber lid 122 whose position is fixed. Also in this case, the chamber main body 121 is raised and the upper end portion of the chamber main body 121 is brought close to or in contact with the chamber lid portion 122, so that the top plate 123 is brought into a non-contact state with the chamber lid portion 122 and disposed at the coupling position. (See FIG. 5 or FIG. 7). Further, the chamber main body 121 is lowered and separated from the chamber lid portion 122, so that the top plate 123 is suspended from a part of the chamber lid portion 122 located above the chamber main body 121 and arranged at the separation position (see FIG. 1). As described above, the opposed portion support mechanism that selectively arranges the top plate 123 at the separation position and the connection position can be realized by various structures.

  In the substrate processing apparatus 1, an annular plate-like member facing only the outer edge portion of the upper surface 91 of the substrate 9 may be provided as the upper surface facing portion. Also in this case, in the process of supplying the processing liquid to the rotating substrate 9, the processing liquid splashing from the outer edge of the substrate 9 rebounds on the inner wall of the chamber 12 and reattaches to the upper surface 91 of the substrate 9. This is prevented by the annular plate-like member disposed in the frame. As described above, the substrate processing apparatus 1 is provided with the upper surface facing portion facing at least the outer edge portion of the upper surface 91 of the substrate 9.

  The shapes and structures of the stator portion 151 and the rotor portion 152 of the substrate rotation mechanism 15 may be variously changed. For example, the stator part 151 may be provided inside the rotor part 152 (center axis J1 side). The rotor unit 152 does not necessarily need to rotate in a floating state, and a structure such as a guide for mechanically supporting the rotor unit 152 is provided in the chamber 12, and the rotor unit 152 rotates along the guide. Good. Further, the substrate rotation mechanism 15 is not necessarily a hollow motor. For example, a substrate rotation mechanism that rotates a shaft fixed to the lower surface of the disk-shaped substrate support 141 may be used.

  In the substrate processing apparatus 1, the substrate support 141, the rotor 152 of the substrate rotation mechanism 15, the top plate 123, and the chucks 4, 4 a and 4 b are provided in the chamber 12 which is a sealed space forming unit and sealed. The processing for the substrate 9 is performed in the internal space, but depending on the design of the substrate processing apparatus, the processing for the substrate 9 may be performed in the open space.

  The substrate processed by the substrate processing apparatus 1 is not limited to a semiconductor substrate, and may be a glass substrate or another substrate.

  The configurations in the above-described embodiments and modifications may be combined as appropriate as long as they do not contradict each other.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 4, 4a, 4b Chuck part 9 Substrate 12 Chamber 15 Substrate rotation mechanism 41, 41a Claw part 42, 42a, 42b Transmission mechanism 43 Contact part 91 Upper surface 120 Chamber space 121 Chamber body 122 Chamber lid part 123 Top plate 126 Top plate moving mechanism 131 Chamber opening / closing mechanism 141 Substrate support portion 151 Stator portion 152 Rotor portion 181 Upper nozzle 436 Elastic member J1 Central axis

Claims (6)

A substrate processing apparatus for processing a substrate,
A substrate support portion for supporting the substrate from the lower side in a state where the upper surface, which is one main surface of the substrate, is directed upward,
A rotation mechanism for rotating the substrate support portion about a central axis perpendicular to the substrate;
An upper surface facing portion facing at least an outer edge portion of the upper surface;
A facing portion support mechanism that selectively disposes the upper surface facing portion at a separating position that is spaced upward with respect to the substrate supporting portion and a connecting position that is coupled to the substrate supporting portion;
A chuck portion provided on one of the substrate support portion or the upper surface facing portion;
With
The chuck portion is
At least three claws disposed around the substrate when viewed along the central axis;
A contact portion that is pushed in by the other of the substrate support portion or the upper surface facing portion when the upper surface facing portion is located at the coupling position, and the force acting on the contact portion is configured to transmit the force to the at least three claw portions A transmission mechanism that causes the at least three claw portions to push the edge of the substrate toward the central axis,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The transmission mechanism includes an elastic member;
When the size of the substrate supported by the substrate support portion varies, the elastic member is elastically deformed, so that the distance between the upper surface facing portion and the substrate at the connection position is kept constant. A substrate processing apparatus. The substrate processing apparatus according to claim 1, wherein:
The rotation mechanism is
A rotor centered around the central axis, and including a permanent magnet;
A stator portion that is annularly opposed to the rotor portion in the radial direction centered on the central axis, and that generates a rotational force about the central axis between the rotor portion;
With
The substrate processing apparatus, wherein the rotor part is connected to the substrate support part. The substrate processing apparatus according to claim 3, wherein
Further comprising a sealed space forming part that forms a sealed internal space in which processing for the substrate is performed,
The substrate processing apparatus, wherein the substrate support portion, the rotor portion of the rotation mechanism, the upper surface facing portion, and the chuck portion are disposed in the sealed space forming portion. The substrate processing apparatus according to claim 4,
The sealed space forming part is
A chamber body having an upper opening;
A chamber lid for closing the upper opening of the chamber body;
With
The chamber lid is also a part of the opposed portion support mechanism, the chamber lid is raised and lowered relative to the chamber body;
When the upper surface facing portion is located at the separated position, the upper surface facing portion is suspended from a part of the chamber lid portion located above the chamber body,
The substrate processing apparatus, wherein when the upper surface facing portion is positioned at the coupling position, the upper surface facing portion is in a non-contact state with the chamber lid portion in contact with or close to the chamber body. A substrate processing apparatus according to any one of claims 1 to 5,
A nozzle that supplies a predetermined chemical solution between the upper surface facing portion that extends along the upper surface so as to cover the substrate when positioned at the connection position, and the upper surface of the substrate; Substrate processing apparatus.

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