JP2012200673A - Apparatus for coating protective film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for coating a protective film in which a cleaning liquid strikes an annular frame retainer in cleaning and is not scattered on the top of a wafer.SOLUTION: The annular frame retaining means 49 includes: a pendulum 90 containing a weight 92 made of a ferromagnet, and a claw 94 connected to the weight and suppressing the annular frame; a support 88 disposed on the periphery of a spinner table and rotatably supporting the pendulum; a pendulum shaft 95 rotatably installing the pendulum on the support so as to be rotatable between a retaining position where the claw retains the annular frame and a release position where the claw releases the annular frame; and a weight fixing part 96 fixed on the support facing the weight and made of a permanent magnet for fixing the weight by a predetermined magnetic force with the claw located in the release position. When the rotation speed of the spinner table is not more than a predetermined speed, the magnetic force of the permanent magnet surmounts the centrifugal force of the pendulum and the weight fixing part fixes the weight, thereby locating the claw in the release position.

Description

  The present invention relates to a protective film coating apparatus for coating a water-soluble resin protective film on the surface of a wafer such as a semiconductor wafer or an optical device wafer.

  A wafer such as a silicon wafer or a sapphire wafer formed on the surface by dividing a plurality of devices such as IC, LSI, LED, etc. by dividing lines (streets) is divided into individual devices by a processing apparatus. Widely used in various electric devices such as mobile phones and personal computers.

  A dicing method using a cutting device called a dicer is widely used for dividing the wafer. In the dicing method, a wafer is cut by cutting a wafer into a wafer by rotating a cutting blade having a thickness of about 30 μm by solidifying diamond or other abrasive grains with a metal or resin at a high speed of about 30000 rpm. And split.

  On the other hand, in recent years, a laser processing groove is formed by irradiating a wafer with a pulsed laser beam having a wavelength that is absorptive to the wafer, and an external force is applied to the wafer by a breaking device, along the laser processing groove. Has been proposed (see, for example, Japanese Patent Laid-Open No. 10-305420).

  The formation of the laser processing groove by the laser processing apparatus can increase the processing speed as compared with the dicing method using the dicer, and relatively easily processes even a wafer made of a material having high hardness such as sapphire or SiC. be able to. In addition, since the processing groove can be made to have a narrow width of, for example, 10 μm or less, the amount of devices taken per wafer can be increased as compared with the case of processing by the dicing method.

  However, when the wafer is irradiated with a pulse laser beam, debris is generated due to concentration of thermal energy in the region irradiated with the pulse laser beam. When this debris adheres to the device surface, there arises a problem that the quality of the device is lowered.

  Therefore, for example, in Japanese Patent Application Laid-Open No. 2004-322168, in order to solve such a problem caused by debris, water processing such as PVA (polyvinyl alcohol) and PEG (polyethylene glycol) is applied to the processed surface of the wafer. There has been proposed a laser processing apparatus in which a protective resin is applied to cover a protective film and a wafer is irradiated with a pulsed laser beam through the protective film.

JP-A-10-305420 JP 2004-322168 A

  The wafer is supplied to the laser processing apparatus in a state where the outer peripheral portion is attached to an adhesive tape attached to an annular frame. In a conventional protective film coating apparatus mounted on a laser processing apparatus, an apparatus is often used in which a protective film is coated on a wafer with a pendulum clamp holding an annular frame.

  However, when the protective film attached to the annular frame is cleaned with the pendulum clamp holding the annular frame, the cleaning liquid hits the clamp and splashes onto the upper surface of the wafer, and the scattered cleaning liquid is applied locally to the protective film applied to the wafer. There is a problem of dissolution. When a wafer having such a protective film is laser-processed, debris generated by the laser processing is locally attached to a portion where the protective film is not formed, causing a device defect or the like.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a protective film coating apparatus in which the cleaning liquid does not hit the pendulum type clamp and scatter on the upper surface of the wafer during frame cleaning. is there.

  According to the present invention, a rotatable spinner table having a suction holding surface for sucking and holding a plate-like object attached on an adhesive sheet attached to an annular frame, and a predetermined distance from each other on the outer periphery of the spinner table. A plurality of annular frame pressing means for pressing the annular frame by centrifugal force generated by rotation of the spinner table, and a protective film coating means for applying a protective film to the plate-like object sucked and held by the spinner table, An annular frame cleaning means for supplying a removing liquid for removing the protective film scattered on the annular frame to the rotating annular frame to clean the annular frame, the protective film coating apparatus comprising the annular frame The holding means includes a pendulum body including at least a weight portion including a ferromagnetic material, a claw portion connected to the weight portion and holding the annular frame, and the slider. A support portion disposed on an outer peripheral portion of the inner table and rotatably supporting the pendulum body; a pressing position where the claw portion presses the annular frame; and a release position where the claw portion releases the annular frame. A pendulum shaft that pivotably attaches the pendulum body to the support portion so that the pendulum body can rotate between the support portion and the weight portion, and is fixed to the support portion, and the claw portion is positioned at the release position. A weight fixing portion made of a permanent magnet for fixing the weight portion with a predetermined magnetic force in a state where the spinner table has a rotational speed equal to or lower than a predetermined speed, and the magnetic force of the permanent magnet is a centrifugal force of the pendulum body. When the claw portion is positioned at the release position by overcoming the pin and the weight fixing portion fixes the weight portion, and when the rotation speed of the spinner table is higher than the predetermined speed, the centrifugal force of the pendulum body Overcoming the magnetic force of the fixed part, The magnetic force of the permanent magnet, the type of the ferromagnetic material, and the mass of the pendulum body are set so that the claw portion is positioned at the pressing position by being separated from the portion, and the annular frame is cleaned by the annular frame cleaning means. In this case, a protective film coating apparatus is provided in which the rotation speed of the spinner table is set to be equal to or lower than the predetermined speed.

  According to the protective film coating apparatus of the present invention, when the rotation speed of the spinner table is lower than the predetermined speed, the pendulum type clamp is positioned at the release position and the annular frame is not clamped. By performing the cleaning, the cleaning liquid is prevented from hitting the clamp and splashing onto the upper surface of the wafer.

It is an external appearance perspective view of a laser processing apparatus. It is a perspective view of the wafer supported by the annular frame via the dicing tape. It is a block diagram of a laser beam irradiation unit. It is a partially broken perspective view of a protective film coating device. It is a side view of an annular frame pressing means. It is a longitudinal cross-sectional view of the protective film coating apparatus in a state where the spinner table is raised. It is a longitudinal cross-sectional view of a state where the spinner table is lowered and the liquid resin is ejected and then the liquid resin is spin coated on the entire surface of the wafer and a protective film is applied. It is a longitudinal cross-sectional view at the time of frame washing | cleaning. It is a longitudinal cross-sectional view of the state which wash | cleaned the wafer and removed the protective film after laser processing the wafer. It is a longitudinal cross-sectional view of the state which dried the wafer after protective film removal.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows the external appearance of a laser processing apparatus 2 that includes the protective film coating apparatus of the present invention and can perform laser processing on a wafer.

  On the front side of the laser processing apparatus 2, operation means 4 is provided for an operator to input instructions to the apparatus such as processing conditions. In the upper part of the apparatus, there is provided a display means 6 such as a CRT for displaying a guidance screen for an operator and an image taken by an imaging means described later.

  As shown in FIG. 2, on the surface of the semiconductor wafer W to be processed, the first street S1 and the second street S2 are formed orthogonally, and the first street S1 and the second street S2 are formed. A number of devices D are formed in a region partitioned by.

  The wafer W is attached to a dicing tape T that is an adhesive tape, and the outer peripheral edge of the dicing tape T is attached to an annular frame F. As a result, the wafer W is supported by the annular frame F via the dicing tape T, and a plurality of wafers (for example, 25 sheets) are accommodated in the wafer cassette 8 shown in FIG. The wafer cassette 8 is placed on a cassette elevator 9 that can move up and down.

  Behind the wafer cassette 8 is provided a loading / unloading means 10 for unloading the wafer W before laser processing from the wafer cassette 8 and loading the processed wafer into the wafer cassette 8.

  Between the wafer cassette 8 and the loading / unloading means 10, a temporary placement area 12, which is an area on which a wafer to be loaded / unloaded is temporarily placed, is provided. A wafer W is fixed in the temporary placement area 12. Positioning means 14 for positioning to the position of is arranged.

  Reference numeral 30 denotes a protective film coating apparatus according to an embodiment of the present invention, and this protective film coating apparatus 30 also serves as a cleaning apparatus for cleaning the processed wafer. In the vicinity of the temporary placement region 12, a transport unit 16 having a turning arm that sucks and transports the frame F integrated with the wafer W is disposed.

  The wafer W carried out to the temporary placement region 12 is adsorbed by the transport means 16 and transported to the protective film coating apparatus 30. In the protective film coating apparatus 30, as will be described in detail later, the processed surface of the wafer W is coated with a protective film.

  The wafer W whose processing surface is coated with a protective film is attracted by the conveying means 16 and conveyed onto the chuck table 18 and is sucked by the chuck table 18, and the frame F is fixed by a plurality of fixing means (clamps) 19. As a result, the chuck table 18 is held.

  The chuck table 18 is configured to be rotatable and reciprocally movable in the X-axis direction. Above the movement path of the chuck table 18 in the X-axis direction, an alignment unit 20 that detects a street of the wafer W to be laser processed. Is arranged.

  The alignment unit 20 includes an imaging unit 22 that images the surface of the wafer W, and can detect a street to be laser processed by image processing such as pattern matching based on an image acquired by imaging. The image acquired by the imaging unit 22 is displayed on the display unit 6.

  A laser beam irradiation unit 24 that irradiates the wafer W held on the chuck table 18 with a laser beam is disposed on the left side of the alignment means 20. The casing 26 of the laser beam irradiation unit 24 accommodates laser beam oscillation means and the like which will be described in detail later, and a condenser 28 that condenses the laser beam on the wafer to be processed at the tip of the casing 26. Is installed.

  In the casing 26 of the laser beam irradiation unit 24, a laser beam oscillation means 34 and a laser beam modulation means 36 are disposed as shown in the block diagram of FIG.

  As the laser beam oscillation means 34, a YAG laser oscillator or a YVO4 laser oscillator can be used. The laser beam modulating unit 36 includes a repetition frequency setting unit 38, a laser beam pulse width setting unit 40, and a laser beam wavelength setting unit 42.

  The repetition frequency setting means 38, the laser beam pulse width setting means 40, and the laser beam wavelength setting means 42 constituting the laser beam modulation means 36 are of known forms, and detailed description thereof is omitted in this specification.

  The wafer W which has been subjected to laser processing by the laser beam irradiation unit 24 is held by the conveying means 32 which is movable in the Y-axis direction after moving the chuck table 18 in the X-axis direction, and is covered with a protective film that also serves as a cleaning device It is conveyed to the device 30. The protective film coating apparatus 30 cleans the wafer by rotating the wafer W at a low speed (for example, 800 to 1000 rpm) while spraying water from the cleaning nozzle.

  After cleaning, the wafer W is dried by rotating the wafer W at high speed (for example, 1500 to 2000 rpm) to dry the wafer W, and then the wafer W is adsorbed by the conveying means 16 and returned to the temporary storage area 12 and further carried out. The wafer W is returned to the original storage location of the wafer cassette 8 by the insertion means 10.

  Next, the protective film coating apparatus 30 according to the embodiment of the present invention will be described in detail with reference to FIGS. 4 to 10. First, referring to FIG. 4, a partially broken perspective view of the protective film coating apparatus 30 is shown.

  The protective film coating apparatus 30 includes a spinner table mechanism 44 and a cleaning water receiving mechanism 46 that surrounds the spinner table mechanism 44. The spinner table mechanism 44 includes a spinner table 48, an electric motor 50 that rotationally drives the spinner table 48, and a support mechanism 52 that supports the electric motor 50 so as to be movable in the vertical direction.

  The spinner table 48 includes a suction chuck 48a formed of a porous material, and the suction chuck 48a communicates with suction means (not shown). Accordingly, the spinner table 48 holds the wafer on the suction chuck 48a by placing the wafer on the suction chuck 48a and applying a negative pressure by suction means (not shown).

  The spinner table 48 is connected to the output shaft 50 a of the electric motor 50. The support mechanism 52 includes a plurality of (three in the present embodiment) support legs 54 and a plurality of (three in the present embodiment) air cylinders 56 respectively connected to the support legs 54 and attached to the electric motor 50. It consists of.

  The support mechanism 52 configured as described above operates the air cylinder 56 to move the electric motor 50 and the spinner table 48 at the wafer loading / unloading position, which is the rising position shown in FIG. 6, and the lowered position, shown in FIG. It can be positioned at a certain work position.

  The cleaning water receiving mechanism 46 is attached to the cleaning water receiving container 58, three support legs 60 (only two are shown in FIG. 4) that support the cleaning water receiving container 58, and the output shaft 50 a of the electric motor 50. Cover member 62.

  As shown in FIG. 6, the washing water receiving container 58 includes a cylindrical outer wall 58a, a bottom wall 58b, and an inner wall 58c. A hole 51 into which the output shaft 50a of the electric motor 50 is inserted is provided at the center of the bottom wall 58b, and the inner wall 58c is formed so as to protrude upward from the periphery of the hole 51.

  As shown in FIG. 4, a waste liquid port 59 is provided on the bottom wall 58 b, and a drain hose 64 is connected to the waste liquid port 59. The cover member 62 is formed in a disc shape, and includes a cover portion 62a that protrudes downward from the outer peripheral edge thereof.

  When the electric motor 50 and the spinner table 48 are positioned at the work position shown in FIG. 7, the cover member 62 configured as described above has a gap on the outside of the inner wall 58 c constituting the cleaning water receiving container 58. It is positioned to polymerize.

  The protective film coating apparatus 30 includes a coating unit 66 that coats a liquid resin on the unprocessed semiconductor wafer held by the spinner table 48. The application unit 66 includes a discharge nozzle 68 that discharges the liquid resin toward the processed surface of the wafer before processing held by the spinner table 48, and an approximately L-shaped arm 70 that supports the discharge nozzle 68.

  The coating means 66 further includes a liquid resin discharge position corresponding to the central portion of the wafer W supported by the spinner table 48 with the discharge nozzle 68 supported by the arm 70, and a retracted position shown in FIG. And an electric motor 72 capable of normal / reverse rotation that swings between the two. The discharge nozzle 68 is connected to a liquid resin supply source (not shown) via an arm 70.

  The protective film coating device 30 also serves as a cleaning device for cleaning the wafer after laser processing. Therefore, the protective film coating apparatus 30 includes cleaning water supply means 74 and air supply means 76 for cleaning the processed wafer held on the spinner table 48.

  The cleaning water supply means 74 includes a cleaning water nozzle 78 that ejects cleaning water toward the processed wafer held by the spinner table 48, an arm 80 that supports the cleaning water nozzle 78, and a cleaning that is supported by the arm 80. The electric motor 82 is configured to be able to rotate normally and reversely so as to swing the water nozzle 78. The cleaning water jet nozzle 78 is connected to a cleaning water supply source (not shown) via the arm 80.

  The air supply means 76 includes an air nozzle 84 that blows air toward the cleaned wafer held by the spinner table 48, an arm 86 that supports the air nozzle 84, and a positive that swings the air nozzle 84 that is supported by the arm 86. An electric motor (not shown) capable of rotating and reversing is provided. The air nozzle 84 is connected to an air supply source (not shown) via an arm 86.

  The spinner table 48 is provided with four pendulum type annular frame pressing means 49 for pressing the annular frame F. The annular frame pressing means 49 includes a support portion 88 fixed to the spinner table 48 and a pendulum body (clamp) 90 that is rotatably attached to the support portion 88. The pendulum body 90 is rotatably attached to the support portion 88 via a pendulum shaft 95. A snap ring 98 prevents the pendulum shaft 98 from coming off.

  The pendulum body 90 is made of, for example, a ferromagnetic material such as iron, and includes a weight portion 92 and a claw portion 94 that presses an annular frame F formed integrally with the weight portion 92. A weight fixing portion 96 made of a permanent magnet is attached to the support portion 88.

  When the rotation speed of the spinner table 48 is equal to or lower than a predetermined speed, the pendulum body 90 is fixed by the magnetic force of the weight fixing portion 96 overcoming the centrifugal force of the pendulum body 90 and the weight portion 92 is attracted to the weight fixing portion 96 and fixed. The portion 94 is positioned at the release position shown in FIG. 5, and when the rotation speed of the spinner table 48 is higher than a predetermined speed, the centrifugal force of the pendulum body 90 overcomes the magnetic force of the weight fixing portion 96 and the weight portion 90 becomes the weight fixing portion 96. The magnetic force of the weight fixing portion 96, the type of the ferromagnetic material of the pendulum body 90, and the mass thereof are set so that the claw portion 94 is positioned at a pressing position where the claw portion 94 presses the annular frame F.

  The pendulum body 90 does not need to be entirely formed of a ferromagnetic material, and a part of the weight portion 92 that is attracted by the magnetic force of the weight fixing portion 96 may be formed of a ferromagnetic material. In the present embodiment, the predetermined speed is set to 1000 rpm.

  Hereinafter, the operation of the protective film coating apparatus 30 configured as described above will be described. The semiconductor wafer W before processing is transported to the spinner table 48 of the protective film coating device 30 by the turning motion of the wafer transport means 16 and sucked and held by the suction chuck 48a.

  At this time, the spinner table 48 is positioned at the wafer loading / unloading position shown in FIG. 6, and the discharge nozzle 68, the cleaning nozzle 78 and the air nozzle 84 are isolated from above the spinner table 48 as shown in FIGS. It is positioned at the standby position.

  If the unprocessed wafer W is held on the spinner table 48 of the protective film coating apparatus 30, a protective film coating process is performed in which a liquid resin is discharged onto the surface that is the processed surface of the wafer W to apply the protective film. .

  To carry out the protective film application step, the air cylinder 56 is driven and the spinner table 48 is moved in the direction of arrow A in FIG. Further, after the discharge nozzle 68 of the coating means 66 is positioned at the position shown in FIG. 7 and the liquid resin is discharged onto the wafer W, the electric motor 50 is driven to rotate the spinner table 48 in the R1 direction at 2000 rpm for discharge. The coated liquid resin is spin-coated on the entire surface of the wafer W.

  Since the spinner table 48 is rotated at a relatively high speed of 2000 rpm, the centrifugal force of the pendulum body 90 overcomes the magnetic force of the weight fixing part 96 and the weight part 92 is disengaged from the weight fixing part 96 so that the claw part 94 of the pendulum body 90 is moved. The annular frame F is clamped (pressed).

  Since the spinner table 48 is rotated at a rotational speed of 2000 rpm with the annular frame F clamped by the claw portion 94 of the pendulum body 90 as described above, the annular frame F is rotated at the time of spin coating of the liquid resin on the wafer W. It is fixed to the table 48, and a protective film can be formed by spin coating the liquid resin evenly on the surface of the wafer W.

  The liquid resin for forming the protective film is preferably a water-soluble resist such as PVA (polyvinyl alcohol), PEG (polyethylene glycol), PEO (polyethylene oxide).

  After applying the protective film, as shown in FIG. 8, the spinner table 48 is moved from 100 to 100 while supplying cleaning water 79 consisting of pure water and air from the cleaning water nozzle 78 connected to the pure water source and the air source to the annular frame F. The annular frame F is cleaned by rotating at a low speed of 200 rpm.

  In this cleaning process, the spinner table 48 is rotated at a low speed, so that the magnetic force of the weight fixing portion 96 overcomes the centrifugal force of the pendulum body 90 and the weight portion 92 is attracted and fixed to the weight fixing portion 96. The claw portion 94 is positioned at the release position.

  Therefore, when the annular frame F is cleaned, the cleaning water is prevented from hitting the claw portion 94 of the pendulum body 90 and splashing onto the upper surface of the wafer as in the prior art, and the protective film on which the scattered cleaning water is applied to the wafer W is locally applied. It is prevented from dissolving in.

  If the protective film is applied to the surface of the semiconductor wafer W by the protective film application process, the spinner table 48 is positioned at the wafer loading / unloading position shown in FIG. 6 and the wafer W held on the spinner table 48 is sucked and held. Is released.

  The wafer W on the spinner table 48 is transported to the chuck table 18 by the wafer transport means 16 and sucked and held by the chuck table 18. Further, the chuck table 18 moves in the X-axis direction, and the wafer W is positioned immediately below the imaging means 22.

  Image processing such as pattern matching for aligning the condenser 28 of the laser beam irradiation unit 24 that irradiates a laser beam with the imaging unit 22 and irradiating the laser beam with the first street S1 is performed. The laser beam irradiation position alignment is performed on the first street S1. The chuck table 18 is rotated 90 degrees, and the same alignment is performed on the second street S2.

  In this way, if the first and second streets S1 and S2 of the wafer W held on the chuck table 18 are detected and alignment of the laser beam irradiation position is performed, the chuck table 18 is moved to the laser beam. Is moved to the laser beam irradiation region where the condenser 28 for irradiating the wafer W is located, and has a wavelength which absorbs the wafer W from the condenser 28 along the first street S1 or the second street S2 of the wafer W. A laser processing groove is formed by irradiating the wafer W with a laser beam (for example, 355 nm) through the protective film.

  At this time, even if debris is generated by the laser beam irradiation, the debris is blocked by the protective film and does not adhere to the electronic circuit of the device D, the bonding pad, and the like.

  When the laser processing grooves are formed along the first street S1 and the second street S2 of the semiconductor wafer W in this way, the chuck table 18 is first returned to the position where the wafer W is sucked and held. Release suction hold of W.

  The wafer W is transported to the spinner table 48 of the protective film coating apparatus 30 by the transport means 32, and is sucked and held by the suction chuck 48a. At this time, the discharge nozzle 68, the washing water nozzle 78, and the air nozzle 84 are positioned at a standby position separated from the upper side of the spinner table 48, as shown in FIGS.

  Then, as shown in FIG. 9, the spinner table 48 is rotated in the direction of arrow R1 at, for example, 800 rpm while spraying cleaning water 79 composed of pure water and air from a cleaning water nozzle 78 connected to the pure water source and the air source. Thus, the wafer W is washed to remove the protective film. Since the spinner table 48 is rotated at a low speed equal to or lower than a predetermined speed, the claw portion 94 of the pendulum body 90 is positioned at the release position, and the wafer W is cleaned.

  When the cleaning process is completed, a drying process is performed. That is, the cleaning water nozzle 78 is positioned at the standby position, and the outlet of the air nozzle 84 is positioned above the wafer W held on the spinner table 48.

  Then, as shown in FIG. 10, the air is blown from the air nozzle 84 toward the wafer W held on the spinner table 48 while rotating the spinner table 48 at 1500 to 2000 rpm, which is faster than a predetermined speed, and the surface of the wafer W is discharged. dry.

  In this drying process, since the spinner table 48 is rotated at 1500 to 2000 rpm, which is faster than a predetermined speed, the claw part 94 of the pendulum body 90 is subjected to the drying process while clamping the annular frame F as shown in FIG.

  After the wafer W is dried, the wafer W is adsorbed by the conveying means 16 and returned to the temporary storage area 12, and the wafer W is returned to the original storage location of the wafer cassette 8 by the carry-in / out means 10.

2 Laser processing device 18 Chuck table 24 Laser beam irradiation unit 28 Condenser 30 Protective film coating device 48 Spinner table 49 Annular frame pressing means 66 Liquid resin coating means 68 Discharge nozzle 74 Cleaning means 78 Washing water nozzle 76 Drying means 84 Air nozzle 90 Pendulum body 92 Weight part 94 Claw part 96 Weight fixing part injection port

Claims (1)

A rotatable spinner table having a suction holding surface for sucking and holding a plate-like object attached to an adhesive sheet attached to an annular frame, and a plurality of spinner tables arranged at predetermined intervals on the outer periphery of the spinner table An annular frame pressing means for pressing the annular frame by a centrifugal force generated by the rotation of the spinner table, a protective film applying means for applying a protective film to a plate-like object sucked and held by the spinner table, and an annular frame on the annular frame. An annular frame cleaning means for supplying a removing liquid for removing the scattered protective film to the rotating annular frame to wash the annular frame, and a protective film coating apparatus comprising:
The annular frame pressing means includes a pendulum body including a weight part including at least a ferromagnetic body, and a claw part connected to the weight part and holding the annular frame;
A support portion disposed on an outer peripheral portion of the spinner table and rotatably supporting the pendulum body;
A pendulum shaft that pivotally attaches the pendulum body to the support portion so that the pawl portion can pivot between a pressing position where the pawl portion presses the annular frame and a release position where the pawl portion releases the annular frame. When,
A weight fixing portion made of a permanent magnet that is disposed facing the weight portion and fixes the weight portion with a predetermined magnetic force in a state where the claw portion is positioned at the release position;
When the rotation speed of the spinner table is lower than a predetermined speed, the magnetic force of the permanent magnet overcomes the centrifugal force of the pendulum body, and the weight fixing portion fixes the weight portion so that the claw portion is positioned at the release position. When the rotation speed of the spinner table is higher than the predetermined speed, the centrifugal force of the pendulum body overcomes the magnetic force of the weight fixing portion, and the weight portion is separated from the weight fixing portion, so that the claw portion is in the holding position. The magnetic force of the permanent magnet, the type of the ferromagnetic material, and the mass of the pendulum body are set so as to be positioned at
The protective film coating apparatus, wherein a rotation speed of the spinner table when the annular frame is cleaned by the annular frame cleaning means is set to be equal to or lower than the predetermined speed.

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