JP2015138907A5 - - Google Patents

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Publication number
JP2015138907A5
JP2015138907A5 JP2014010397A JP2014010397A JP2015138907A5 JP 2015138907 A5 JP2015138907 A5 JP 2015138907A5 JP 2014010397 A JP2014010397 A JP 2014010397A JP 2014010397 A JP2014010397 A JP 2014010397A JP 2015138907 A5 JP2015138907 A5 JP 2015138907A5
Authority
JP
Japan
Prior art keywords
substrate
mold
mold resin
exposed
boundary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014010397A
Other languages
English (en)
Japanese (ja)
Other versions
JP6194804B2 (ja
JP2015138907A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014010397A priority Critical patent/JP6194804B2/ja
Priority claimed from JP2014010397A external-priority patent/JP6194804B2/ja
Priority to PCT/JP2015/000074 priority patent/WO2015111376A1/ja
Priority to CN201580005263.4A priority patent/CN106415825B/zh
Priority to US15/104,255 priority patent/US9601442B2/en
Publication of JP2015138907A publication Critical patent/JP2015138907A/ja
Publication of JP2015138907A5 publication Critical patent/JP2015138907A5/ja
Application granted granted Critical
Publication of JP6194804B2 publication Critical patent/JP6194804B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014010397A 2014-01-23 2014-01-23 モールドパッケージ Expired - Fee Related JP6194804B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014010397A JP6194804B2 (ja) 2014-01-23 2014-01-23 モールドパッケージ
PCT/JP2015/000074 WO2015111376A1 (ja) 2014-01-23 2015-01-09 モールドパッケージ
CN201580005263.4A CN106415825B (zh) 2014-01-23 2015-01-09 模塑封装
US15/104,255 US9601442B2 (en) 2014-01-23 2015-01-09 Half-mold type mold package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014010397A JP6194804B2 (ja) 2014-01-23 2014-01-23 モールドパッケージ

Publications (3)

Publication Number Publication Date
JP2015138907A JP2015138907A (ja) 2015-07-30
JP2015138907A5 true JP2015138907A5 (enExample) 2016-03-10
JP6194804B2 JP6194804B2 (ja) 2017-09-13

Family

ID=53681191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014010397A Expired - Fee Related JP6194804B2 (ja) 2014-01-23 2014-01-23 モールドパッケージ

Country Status (4)

Country Link
US (1) US9601442B2 (enExample)
JP (1) JP6194804B2 (enExample)
CN (1) CN106415825B (enExample)
WO (1) WO2015111376A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10796976B2 (en) * 2018-10-31 2020-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of forming the same
KR102825809B1 (ko) * 2020-07-10 2025-06-27 삼성전자주식회사 언더필이 구비된 반도체 패키지 및 이의 제조 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100386061B1 (ko) 1995-10-24 2003-08-21 오끼 덴끼 고오교 가부시끼가이샤 크랙을방지하기위한개량된구조를가지는반도체장치및리이드프레임
JPH1020483A (ja) 1996-06-28 1998-01-23 Toppan Printing Co Ltd 感光性樹脂組成物
KR100255108B1 (en) * 1997-06-18 2000-05-01 Samsung Electronics Co Ltd Chip card
JP3332814B2 (ja) * 1997-08-12 2002-10-07 アピックヤマダ株式会社 基板用モールド金型及び成形された基板
JPH11340378A (ja) * 1998-05-22 1999-12-10 Sanken Electric Co Ltd 半導体発光装置の製造方法
JP3619773B2 (ja) * 2000-12-20 2005-02-16 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2003304004A (ja) * 2002-04-11 2003-10-24 Citizen Electronics Co Ltd 光伝送チップ及び取付構造
FI119400B (fi) * 2003-03-14 2008-10-31 Outotec Oyj Menetelmä prosessin säätämiseksi
JP2006269486A (ja) * 2005-03-22 2006-10-05 Renesas Technology Corp 半導体装置の製造方法
JP2010141295A (ja) * 2008-10-20 2010-06-24 United Test & Assembly Center Ltd 基板上シュリンクパッケージ
JP5051189B2 (ja) 2009-07-10 2012-10-17 アイシン・エィ・ダブリュ株式会社 電子回路装置
JP5794156B2 (ja) 2012-01-24 2015-10-14 株式会社デンソー モールドパッケージの製造方法
JP6115505B2 (ja) 2013-06-21 2017-04-19 株式会社デンソー 電子装置

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