JP2015136775A5 - - Google Patents

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Publication number
JP2015136775A5
JP2015136775A5 JP2014010800A JP2014010800A JP2015136775A5 JP 2015136775 A5 JP2015136775 A5 JP 2015136775A5 JP 2014010800 A JP2014010800 A JP 2014010800A JP 2014010800 A JP2014010800 A JP 2014010800A JP 2015136775 A5 JP2015136775 A5 JP 2015136775A5
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JP
Japan
Prior art keywords
polishing
substrate
film thickness
substrates
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014010800A
Other languages
English (en)
Japanese (ja)
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JP6374169B2 (ja
JP2015136775A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014010800A external-priority patent/JP6374169B2/ja
Priority to JP2014010800A priority Critical patent/JP6374169B2/ja
Priority to KR1020150009142A priority patent/KR101998453B1/ko
Priority to US14/602,254 priority patent/US9524913B2/en
Priority to TW104101917A priority patent/TWI689373B/zh
Priority to SG10201500455QA priority patent/SG10201500455QA/en
Priority to CN201510032404.3A priority patent/CN104802069B/zh
Publication of JP2015136775A publication Critical patent/JP2015136775A/ja
Publication of JP2015136775A5 publication Critical patent/JP2015136775A5/ja
Publication of JP6374169B2 publication Critical patent/JP6374169B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014010800A 2014-01-23 2014-01-23 研磨方法および研磨装置 Active JP6374169B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014010800A JP6374169B2 (ja) 2014-01-23 2014-01-23 研磨方法および研磨装置
KR1020150009142A KR101998453B1 (ko) 2014-01-23 2015-01-20 연마 방법 및 연마 장치
SG10201500455QA SG10201500455QA (en) 2014-01-23 2015-01-21 Polishing method and polishing apparatus
TW104101917A TWI689373B (zh) 2014-01-23 2015-01-21 研磨方法及研磨裝置
US14/602,254 US9524913B2 (en) 2014-01-23 2015-01-21 Polishing method and polishing apparatus
CN201510032404.3A CN104802069B (zh) 2014-01-23 2015-01-22 研磨方法及研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014010800A JP6374169B2 (ja) 2014-01-23 2014-01-23 研磨方法および研磨装置

Publications (3)

Publication Number Publication Date
JP2015136775A JP2015136775A (ja) 2015-07-30
JP2015136775A5 true JP2015136775A5 (OSRAM) 2016-12-15
JP6374169B2 JP6374169B2 (ja) 2018-08-15

Family

ID=53687476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014010800A Active JP6374169B2 (ja) 2014-01-23 2014-01-23 研磨方法および研磨装置

Country Status (6)

Country Link
US (1) US9524913B2 (OSRAM)
JP (1) JP6374169B2 (OSRAM)
KR (1) KR101998453B1 (OSRAM)
CN (1) CN104802069B (OSRAM)
SG (1) SG10201500455QA (OSRAM)
TW (1) TWI689373B (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9505101B1 (en) * 2015-06-24 2016-11-29 The Boeing Company Automated sanding system and method
US11400563B2 (en) * 2018-12-07 2022-08-02 Disco Corporation Processing method for disk-shaped workpiece
KR20250085835A (ko) * 2018-12-19 2025-06-12 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP7349278B2 (ja) * 2019-07-11 2023-09-22 株式会社ディスコ 加工装置
KR102721977B1 (ko) * 2019-10-07 2024-10-28 삼성전자주식회사 반도체 기판 측정 장치, 이를 이용한 반도체 기판 처리 장치 및 반도체 소자 형성 방법
KR20230107685A (ko) * 2020-11-27 2023-07-17 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법
CN116330162A (zh) * 2023-03-10 2023-06-27 华虹半导体(无锡)有限公司 一种cmp警报方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5885138A (en) * 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
KR100253085B1 (ko) * 1997-07-10 2000-04-15 윤종용 측정장치를구비한웨이퍼폴리싱장치및폴리싱방법
US7097534B1 (en) * 2000-07-10 2006-08-29 Applied Materials, Inc. Closed-loop control of a chemical mechanical polisher
US6447370B1 (en) * 2001-04-17 2002-09-10 Speedfam-Ipec Corporation Inline metrology device
US6967715B2 (en) * 2002-12-06 2005-11-22 International Business Machines Corporation Method and apparatus for optical film measurements in a controlled environment
US7118451B2 (en) * 2004-02-27 2006-10-10 Taiwan Semiconductor Manufacturing Co., Ltd. CMP apparatus and process sequence method
JP2006093180A (ja) * 2004-09-21 2006-04-06 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP2006231471A (ja) * 2005-02-25 2006-09-07 Speedfam Co Ltd 両面ポリッシュ加工機とその定寸制御方法
ITBO20070504A1 (it) * 2007-07-20 2009-01-21 Marposs Spa Apparecchiatura e metodo per il controllo dello spessore di un elemento in lavorazione
JP2009050944A (ja) * 2007-08-24 2009-03-12 Disco Abrasive Syst Ltd 基板の厚さ測定方法および基板の加工装置
JP5305729B2 (ja) * 2008-05-12 2013-10-02 株式会社荏原製作所 研磨方法及び研磨装置、並びに研磨装置制御用プログラム
US20140141694A1 (en) * 2012-11-21 2014-05-22 Applied Materials, Inc. In-Sequence Spectrographic Sensor

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