JP2015135255A5 - - Google Patents
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- Publication number
- JP2015135255A5 JP2015135255A5 JP2014006162A JP2014006162A JP2015135255A5 JP 2015135255 A5 JP2015135255 A5 JP 2015135255A5 JP 2014006162 A JP2014006162 A JP 2014006162A JP 2014006162 A JP2014006162 A JP 2014006162A JP 2015135255 A5 JP2015135255 A5 JP 2015135255A5
- Authority
- JP
- Japan
- Prior art keywords
- base
- test jig
- semiconductor test
- metal
- jig according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 33
- 239000004065 semiconductor Substances 0.000 claims description 26
- 239000012212 insulator Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 7
- 239000000523 sample Substances 0.000 claims description 6
- 238000010998 test method Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014006162A JP6233039B2 (ja) | 2014-01-16 | 2014-01-16 | 半導体試験治具、測定装置、試験方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014006162A JP6233039B2 (ja) | 2014-01-16 | 2014-01-16 | 半導体試験治具、測定装置、試験方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015135255A JP2015135255A (ja) | 2015-07-27 |
JP2015135255A5 true JP2015135255A5 (zh) | 2016-06-30 |
JP6233039B2 JP6233039B2 (ja) | 2017-11-22 |
Family
ID=53767181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014006162A Active JP6233039B2 (ja) | 2014-01-16 | 2014-01-16 | 半導体試験治具、測定装置、試験方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6233039B2 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020026293A1 (ja) * | 2018-07-30 | 2020-02-06 | 株式会社日立ハイテクノロジーズ | 半導体検査装置及びプローブユニット |
TWI679424B (zh) * | 2019-03-29 | 2019-12-11 | 矽品精密工業股份有限公司 | 檢測裝置及其製法 |
CN112858735B (zh) * | 2021-01-14 | 2022-08-16 | 强一半导体(苏州)有限公司 | 一种多节mems探针关键尺寸测量用探针装载载物台 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4244778B2 (ja) * | 2003-10-21 | 2009-03-25 | 株式会社村田製作所 | チップ型電子部品の特性測定装置 |
JP4894248B2 (ja) * | 2005-12-01 | 2012-03-14 | セイコーエプソン株式会社 | 電子デバイスの外部信号入力方法 |
JP2009128189A (ja) * | 2007-11-22 | 2009-06-11 | Fuji Electric Device Technology Co Ltd | 素子試験装置及び素子試験方法 |
JP2012163515A (ja) * | 2011-02-09 | 2012-08-30 | Toyota Motor Corp | 半導体検査装置 |
JP5696624B2 (ja) * | 2011-09-02 | 2015-04-08 | 三菱電機株式会社 | 半導体試験治具 |
TWI447414B (zh) * | 2012-06-07 | 2014-08-01 | 矽品精密工業股份有限公司 | 測試裝置及測試方法 |
-
2014
- 2014-01-16 JP JP2014006162A patent/JP6233039B2/ja active Active
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