JP2015124124A - PRODUCTION METHOD OF SiC-METAL COMPOSITE MATERIAL BODY - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a production method of an SiC-metal composite material body, achieving prevention of variation in the thickness of a plurality of SiC-metal composite material layers having SiC filling factors different from each other.SOLUTION: The production method of an SiC-metal composite material body comprises the step of: forming a first layer body 11 by pressing a material in which a binder is added to SiC powders; forming a hot cured body 13 by heat-treating the first layer body 11 thereby curing the binder; smoothing the upper and lower surfaces 13a, 13b of the hot cured body 13; piling a material prepared by adding the binder to the SiC powder having an average grain size different from that of the first layer body 11 on the smoothed upper face 13a of the hot cured body 13 and pressing a piled body from above to form a laminate 14 formed by laminating a second layer body 12 on the hot cured body 13; heat-treating the laminate 14 to form a defatted body 15; smoothing the upper and lower surfaces 15a, 15b of the defatted body 15; burning the defatted body 15 to form a porous body; and penetrating the porous body with a melted Si to obtain an SiC-Si composite material body 20.

Description

  The present invention relates to a method for producing a SiC / metal composite body.

  A SiC / Si composite material composed of a SiC / Si (silicon carbide / silicon) composite material, which is a SiC / metal composite material body, has excellent characteristics such as light weight, high rigidity and low thermal expansion. Used in precision equipment components such as liquid crystal manufacturing equipment.

  The SiC / Si composite material body can be obtained by a non-pressure infiltration method or the like in which Si is impregnated into a molded body obtained by molding a mixture composed of a binder of SiC powder and C powder with a press machine or the like.

  High rigidity and high thermal conductivity are required for SiC / Si composite materials used in semiconductor manufacturing apparatuses and liquid crystal manufacturing apparatuses. In order to achieve high rigidity and high thermal conductivity, the SiC filling rate may be improved. In order to improve the SiC filling rate, a method of improving the initial SiC filling rate by blending SiC powders having different average particle diameters with raw materials, and C reacting with SiC, C in the raw material is used. There is a way to increase. In particular, if SiC powders having greatly different average particle sizes are mixed, the initial SiC filling rate is greatly improved.

Japanese Patent Laid-Open No. 2001-261459

  However, if the average particle diameter of the coarse SiC powder is increased in order to increase the difference in the average particle diameter of the SiC powder in order to improve the SiC filling rate, the SiC / Si composite material becomes difficult to process. There is a problem that pins of about 300 μm cannot be formed by cutting or blasting. In addition, it is thought that it will become difficult to process because the ratio of removing SiC that has been supported by Si is reduced by processing Si and the ratio of processing SiC itself increases.

  On the other hand, when the average particle size on the coarse grain side is reduced, the rate of removal of SiC supported by Si by processing Si increases, so the workability of the SiC / Si composite material improves. . However, this SiC / Si composite material has a problem that the thermal conductivity decreases due to a decrease in filling rate of SiC having a high thermal conductivity and an increase in interfacial thermal resistance due to an increase in the surface area of SiC.

  Therefore, a material obtained by adding a binder to a SiC powder having an average particle size different from that of the first layer is formed on the first layer formed by pressing a material obtained by adding a binder to the SiC powder. Forming a second layer by stacking, forming a porous body by firing a laminate in which the first layer and the second layer are laminated, and forming a porous body It is conceivable to manufacture the SiC / Si composite material by a manufacturing method including a step of obtaining a SiC / Si composite material body by infiltrating Si dissolved in the material.

  However, in this manufacturing method, when the material of the second layer is stacked on the first layer, or when the stacked layer is pressed, the upper surface of the first layer fluctuates up and down, and each layer There is a risk of variations in thickness. Thereby, for example, when cutting a pin, in order to secure the pin height, it is necessary to increase the thickness of the second layer in anticipation of variations, and the processing cost increases.

  The present invention has been made in view of these problems, and manufacture of a SiC / metal composite material capable of suppressing variation in thickness of a plurality of SiC / metal composite material layers having different SiC filling rates. It aims to provide a method.

  The SiC / metal composite material manufacturing method of the present invention includes a step of pressing a material obtained by adding a thermosetting resin binder to SiC powder to form a first layer body, and heat-treating the first layer body. Curing the thermosetting resin binder to form a thermosetting body, smoothing the upper and lower surfaces of the thermosetting body, and on the smoothed upper surface of the thermosetting body. The second layered body is laminated on the thermosetting body by pressing from above after stacking materials obtained by adding a thermosetting resin binder to SiC powder having an average particle size different from that of the first layered body. Forming a laminated body formed by heating, degreasing the laminated body by heat treatment, forming a degreased body, smoothing the upper and lower surfaces of the degreased body, and firing the degreased body. Forming a porous sintered body and gold dissolved in the porous sintered body The impregnated, characterized in that it comprises the step of obtaining a SiC / metal composite body.

  In the method for producing a SiC / metal composite material according to the present invention, the metal is preferably Si or Al.

  In addition, you may perform simultaneously the process of shape | molding a 1st layer body, and the process of forming a thermosetting body. Further, the step of forming the degreased body includes heat-treating the laminated body to cure the thermosetting resin binder in the second layer, so that the thermosetting body originally composed of the second layer body is originally the first. Even if it consists of the process of forming the lamination | stacking thermosetting body laminated | stacked on the thermosetting body which consists of this layer body, and the process of heat-processing and degreasing this lamination | stacking thermosetting body, and forming a degreasing body Good.

  According to the method for producing a SiC / metal composite material of the present invention, in the second molding step, the second layered body is formed on the upper surface of the molding die from the thermosetting body smoothed in the first smoothing step. Stacking materials for. The thermosetting body has high strength because the thermosetting resin binder in the material of the first layer body is cured by heat treatment. Therefore, even if a material is stacked on the upper surface, and further pressed from above, the upper surface is not changed and the smoothed surface is maintained, so that the thickness of the thermosetting body does not change.

  Therefore, it is possible to suppress variation in thickness of the SiC / metal composite material layer originally composed of the thermosetting body and the SiC / metal composite material layer originally composed of the second layer body.

  In the first smoothing step, the upper and lower surfaces of the thermosetting body are smoothed to improve the flatness of the thermosetting body. Thereby, in the second molding step, if the flatness of the surface to which the molding pressure is applied is not good, there is a possibility that a piece hit or the like occurs, stress concentration occurs, and a crack or the like occurs in the thermosetting body. It is possible to eliminate the fear.

  Further, in the second smoothing step, the upper surface and the lower surface of the degreased body are smoothed to reduce the warp of the degreased body. Thereby, the curvature which arises in a SiC / metal composite material body is reduced. Since the degreased body is easier to process than the SiC / metal composite material body, it is possible to reduce the cutting cost.

  For example, when the longest dimension of the thermosetting body is 500 mm or less and the maximum dimension / thickness is 100 or less, it may be smoothed so that the flatness of the upper surface of the thermosetting body is 2 mm or less.

  However, even if the warpage of the degreased body is reduced, the SiC / metal composite body is warped.

  Therefore, in the method for producing a SiC / metal composite material of the present invention, it is preferable that the difference in the ratio of the carbon source in the material of the first layer body and the second layer body is 14% by volume or less. .

  In this case, when the longest dimension of the SiC / metal composite material body is 500 mm, the cutting thickness becomes 1 mm or less, and the cutting cost necessary for eliminating the warp of the SiC / metal composite material body can be suppressed. It becomes possible.

(A)-(e) is a schematic sectional drawing which demonstrates in order the manufacturing method of the SiC / Si composite material body which concerns on embodiment of this invention. (A)-(c) is a schematic sectional drawing which demonstrates in order the manufacturing method of the SiC / Si composite material which concerns on embodiment of this invention after FIG.1 (e).

  The manufacturing method of the SiC / Si composite material body which concerns on embodiment of this invention is demonstrated with reference to FIG.1 and FIG.2.

  The manufacturing method of the SiC / Si composite material 20 includes a mixing process, a first molding process, a first smoothing process, a second molding process, a degreasing process, a second smoothing process, a sintering process, and an impregnation process. Is included. In addition, these processes are not limited to the method demonstrated below, Arbitrary known methods can be used.

  First, in the mixing step, a thermosetting resin binder (hereinafter simply referred to as a binder) or the like is added to and mixed with SiC powder, which is a raw material powder, to produce a forming raw material. The mixing method may be either wet or dry, and for example, a mixer such as a ball mill or a vibration mill can be used. A small amount of an additive such as a sintering aid may be added.

  The SiC powder preferably has a high purity, and the purity is preferably 96% or more, more preferably 98% or more.

  Referring to FIG. 2C, the composition of the SiC powder is varied so that SiC / Si composite body 20 includes SiC / Si composite material layers 21 and 22 having different SiC filling rates. Here, the case where the SiC / Si composite material body 20 having the SiC / Si composite material layers 21 and 22 having two different SiC filling rates is manufactured will be described. However, the SiC / Si composite material body 20 may include a SiC / Si composite material layer having three or more different SiC filling rates.

  In order to increase the SiC filling rate, it is only necessary to increase the difference in average particle diameter when blending the SiC powder. And you may add C powder as needed.

  On the other hand, in order to reduce the SiC filling rate, it is sufficient to reduce the difference in average particle diameter when blending the SiC powder, or only SiC powder having the same average particle diameter may be used. And although C powder may be added, it is preferable to reduce the addition amount.

  Therefore, the raw material of the 1st layer body 11 for forming the SiC / Si composite material layer 21 which has a high SiC filling rate is set as the mixing | blending which has coarse SiC powder with a big average particle diameter. The raw material of the second layer body 12 for forming the SiC / Si composite material layer 22 having a low SiC filling rate is blended so that SiC powder having a small average particle diameter is the coarsest SiC powder.

  The binder is particularly preferably a phenol resin, but resins such as polyvinyl alcohol (PVA), methyl cellulose (MC), isoban, and polyethyleneimine are also preferable. The binder can be added from the lower limit value capable of retaining the molded body up to an amount of 100% by volume of the void volume generated when the SiC powder and C powder are tapped into the mold. More preferably, it is 20-30 volume%.

  The forming raw material obtained in the mixing step is press-molded into an appropriate shape in the first and second forming steps. The method is not particularly limited, and a known molding method such as uniaxial press molding or pressure casting can be used.

  In the first forming step, as shown in FIG. 1A, a forming raw material for forming the first layer body 11 is put into a forming die 31. And as shown in FIG.1 (b), after applying the molding pressure of 0.1-5.0 Mpa, the temperature of the shaping | molding die 31 is hold | maintained at 90-150 degreeC for 1-3 hours, Then, the shaping | molding die 31 is cooled. And demold. Thereby, the thermosetting body 13 (refer FIG.1 (c)) in which the binder in the 1st layer body 11 was thermosetted is obtained.

  The first molding step is also a thermosetting step in which the first layer body 11 is heat-treated to cure the binder and form the thermosetting body 13. Note that the temperature range and holding time may be appropriately determined in consideration of production efficiency, binder type, and the like. The binder need not be completely heat-cured, and may be cured to such an extent that the thermosetting body 13 can be satisfactorily cut in the first smoothing step.

  Next, in the first smoothing step, the upper surface 13a and the lower surface 13b of the thermosetting body 13 are cut and smoothed. If the flatness of the surface to which the molding pressure is applied is not good in the second molding step, it will be good because, for example, a piece hitting will occur, stress concentration will occur, and the thermoset 13 will crack. This is because the SiC / Si composite material body 20 cannot be obtained.

  In addition, when the longest dimension of the thermosetting body 13 is 500 mm or less and the maximum dimension / thickness is 100 or less, it cuts so that the flatness of the upper surface 13a and the lower surface 13b of the thermosetting body 13 may be 2 mm or less. The upper limit of flatness may be increased as the maximum dimension is increased or as the maximum dimension / thickness is increased.

  Next, in the second molding step, as shown in FIG. 1 (d), the thermosetting body 13 smoothed in the first smoothing step is put into a molding die 31. Then, the molding material for forming the second layer body 12 is put into the molding die 31 so as to be stacked on the upper surface 13 a of the thermosetting body 13.

  At this time, the thermosetting body 13 has high strength because the binder in the molding material of the first layer body 11 is thermoset. Therefore, even if the molding material for forming the second layer body 12 is stacked on the upper surface 13a, and further pressed from above, the upper surface 13a does not fluctuate and keeps the smoothed surface. The thickness of the thermosetting body 13 does not change.

  And as shown in FIG.1 (e), after applying the molding pressure of 2.0-5.0 Mpa, after hold | maintaining the temperature of the shaping | molding die 31 at 110-150 degreeC for 1-3 hours, the shaping | molding die 31 is cooled. And demold. As a result, the binder in the second layer body 12 was thermally cured, and the thermosetting body 13 originally being the first layer body 11 and the thermosetting body originally being the second layer body 12 were laminated. A laminate 14 is obtained. The second molding step is also a thermosetting step in which the second layer body 12 is heat-treated to cure the binder to form a thermoset.

  Next, as shown in FIG. 2A, in the degreasing step, the binder in the thermosetting body is completely carbonized to obtain the degreased body 15 in the laminate 14 obtained in the second molding step. . In the degreasing step, it is preferable to perform heat treatment in a vacuum atmosphere, for example, in a temperature range of 250 to 1000 ° C. at a temperature increase rate of 30 ° C./hr or less. However, the temperature range and the temperature increase rate may be appropriately determined in consideration of production efficiency and the like. A trace amount of carbon component generated by carbonization remains in the molded body.

  Next, in the second smoothing step, the upper surface 15a and the lower surface 15b of the degreased body 15 are cut and smoothed. This is because in the second molding step and the degreasing step, the organic component in the binder is thermally decomposed and the second layer body 12 is contracted to cause the degreased body 15 to warp. This is because if this warp is left as it is, a large warp is generated in the obtained SiC / Si composite material body 20, and the cost of cutting required to eliminate this warp increases.

  When the longest dimension of the degreased body 15 is 500 mm or less and the maximum dimension / thickness is 100 or less, cutting is performed so that the flatness of the upper surface 15a and the lower surface 15b of the degreased body 15 is 1.0 mm or less. The upper limit of flatness may be increased as the maximum dimension is increased or as the maximum dimension / thickness is increased.

  Next, the degreased body 15 is subjected to deoxygenation treatment in a sintering step to obtain a porous sintered body (not shown). The deoxygenation treatment is held in a vacuum atmosphere at, for example, a temperature range of 1300 to 1410 ° C. for 5 to 20 hours. More preferably, baking is performed in a vacuum atmosphere at a temperature range of 1350 to 1410 ° C. for 15 to 20 hours. Further, the pressure of the sintering atmosphere is not limited and can be any pressure from a reduced pressure, a normal pressure to a pressure of several atmospheres, but a normal pressure is preferable from the viewpoint of cost.

  You may grind the porous sintered compact obtained by baking by a mechanical means as needed. If the porous sintered body is formed in a predetermined shape in advance, the obtained SiC / Si composite material body 20 becomes a near net, and processing required for obtaining the final shape can be reduced.

  Then, the obtained porous sintered body is impregnated with dissolved metal Si in the impregnation step. The impregnation treatment is preferably performed by a non-pressure permeation method, but may be performed by other methods such as a pressure permeation method. When performing non-pressure permeation, for example, it is heated to 1550 ° C. in a vacuum atmosphere, and further heated to 1645 ° C. in an inert gas atmosphere, and held for 10 hours, more preferably 20 to 30 hours. A part of the metal Si reacts with the carbon component remaining in the porous sintered body to produce β-SiC, but most of the metal Si impregnates the pores.

  In this way, as shown in FIG. 2B, it is possible to obtain the SiC / Si composite material body 20 in which the two SiC / Si composite material layers 21 and 22 having different SiC filling rates are laminated. The SiC / Si composite material body 20 has little variation in the thickness of the first and second SiC / Si composite material layers 21 and 22.

  In addition, as shown in FIG. 2C, the SiC / Si composite material body 20 may be ground by mechanical means to form ribs, pins, or the like as necessary.

  As shown in FIGS. 2B and 2C, the SiC / Si composite body 20 includes a first SiC / Si composite material layer 21 and a second SiC / Si composite material having different SiC filling rates. The layer 22 is in contact. That is, a layer made of a joined body or the like is not interposed between these layers 21 and 22.

  By the way, in the impregnation step, β-SiC produced by reaction of a part of metal Si with the carbon component remaining in the porous sintered body is larger in thermal expansion than α-SiC of SiC powder as raw material powder. The coefficient is large. For this reason, of the first and second layer bodies 11 and 12, the layer having a larger proportion of the carbon source amount in the molding material has a higher shrinkage rate during cooling after the impregnation step. Thereby, the SiC / Si composite material body 20 is warped.

  Also from the following examples, the larger the difference in the proportion of the carbon source amount in the molding material for forming the first layer body 11 and the second layer body 12, the more the SiC / Si composite material body 20 It can also be seen from the fact that the warpage generated in the Since the SiC / Si composite material 20 is difficult to process, a large cutting cost is required to eliminate this warpage.

  Therefore, in the present embodiment, in the second smoothing step, the upper surface 15a and the lower surface 15b of the degreased body 15 are smoothed to reduce the warp of the degreased body 15. Since the degreased body 15 is easier to process than the SiC / Si composite material body 20, these cutting costs are not large.

  However, even if the warpage of the degreased body 15 is reduced, the SiC / Si composite material body 20 is warped. Therefore, in consideration of the cutting cost necessary for eliminating the warp of the SiC / Si composite material body 20, when the longest dimension of the SiC / Si composite material body is 500 mm, the cutting thickness is 1 mm or less. Thus, it is preferable that the difference in the proportion of the carbon source amount is adjusted to 14% by volume or less by appropriately adjusting the kind and addition amount of the binder and the addition amount of the powder C.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to this. For example, in the first smoothing step, the upper surface 13a of the thermosetting body 13 is flattened over the entire surface so that the thicknesses of the first and second SiC / Si composite material layers 21 and 22 are as a whole. The case where the uniform SiC / Si composite material body 20 is obtained over the entire length has been described. However, the present invention is not limited to this, and in the first smoothing step, when cutting the upper surface 13a of the thermosetting body 13, the upper surface 13a is smoothed so that the thickness of the thermosetting body 13 partially changes. The SiC / Si composite material body 20 in which the thicknesses of the first and second SiC / Si composite material layers 21 and 22 are partially different may be obtained.

  In the impregnation step, the case where the porous sintered body is impregnated with metal Si to obtain the SiC / Si composite material body 20 has been described. However, in the impregnation step, the porous sintered body may be impregnated with metal Al to obtain a SiC / Al composite material body.

  Hereinafter, the present invention will be described in detail with specific examples and comparative examples of the present invention.

[Example 1]
In Example 1, as a raw material powder of the first layered body 11, SiC powder having an average particle size of 200 μm (NG90 made by Taiyo Random Co., Ltd.) and 60% by weight of SiC powder having an average particle size of 17 μm (Shinano Denki Smelting Co., Ltd.) 40% by weight of GP # 800) manufactured by the company was prepared. Further, 13% by weight of phenol resin (OI-305A manufactured by Dainippon Ink and Chemicals Co., Ltd., residual carbon ratio 50%) and C beads (AT-No. 40C manufactured by Oriental Sangyo Co., Ltd.) are used as thermoplastic binders. 9% by weight of residual carbon ratio 100%).

  Then, in the first molding step, the molding material of the first layer body 11 is mixed, put into a molding die 31 of 510 mm × 500 mm, and the molding die 31 is applied while applying a molding pressure of 1.5 MPa by a uniaxial press. After holding the temperature at 150 ° C. for 1 hour, the mold 31 was cooled and removed. Thereby, the thermosetting body 13 which hardened the binder in the 12-mm-thick 1st layer body 11 was obtained.

  Next, in the first smoothing step, the upper surface 13a and the lower surface 13b of the obtained thermosetting body 13 were cut and smoothed. Thereby, the thermosetting body 13 became thickness 10mm and flatness 0.2mm.

  Next, as a raw material powder for the second layer 12, SiC powder having an average particle diameter of 90 μm (GP # 180 manufactured by Shinano Denki Smelting Co., Ltd.) is 70% by weight, and SiC powder having an average particle diameter of 12 μm (manufactured by Shinano Electric) 30% by weight of GP # 1200) manufactured by Nen Co., Ltd. was prepared. And 12 weight% of phenol resin (Dai Nippon Ink Chemical Co., Ltd. OI-305A, residual carbon ratio 50%) and C beads (AT-No. 40C made by Oriental Sangyo Co., Ltd.) are used as the thermoplastic binder. And 15% by weight of residual carbon ratio). The binder of the first layer body 11 and the second layer body 12, the addition amount of C beads, and the carbon of the difference between the first layer body 11 and the second layer body 12 and these layer bodies 11 and 12 Source amounts are listed in Table 1.

  Next, in the second molding step, the thermosetting body 13 was placed in the molding die 31 and the molding material of the second layer 12 was added from above the upper surface 13a of the thermosetting body 13. In this state, the mold 31 was held at 150 ° C. for 1 hour while applying a molding pressure of 3.0 MPa with a uniaxial press, and then the mold 31 was cooled and removed. Thereby, the laminated body 14 in which the layer in which the binder in the second layer body 12 was thermally cured was laminated on the thermosetting body 13 was obtained.

  Next, in the degreasing step, the obtained laminate 14 was degreased by heating in a vacuum atmosphere at a temperature range of 250 to 1000 ° C. at a temperature rising rate of 28 ° C./hr. Thereby, the degreased body 15 was obtained.

  Next, in the second smoothing step, the upper surface 15a and the lower surface 15b of the obtained degreased body 15 were cut and smoothed. As a result, the degreased body 15 had a thickness of 10 mm, which was originally the thermosetting body 13, a thickness of 10 mm, which was originally the second layer 12, and a flatness of 0.2 mm.

  Next, in the sintering step, the smoothed degreased body 15 is heated in a vacuum atmosphere at a temperature range of 1300 to 1410 ° C. at a rate of temperature increase of 22 ° C./hr to perform a sintering process, and a porous sintered body Got.

  Thereafter, in the impregnation step, the obtained porous sintered body is brought into contact with Si heated to a melting point or higher (manufactured by NIPPON DENKO CO., LTD.) In a vacuum atmosphere up to 1550 ° C. and thereafter in an inert gas atmosphere. The SiC / Si composite material is maintained by maintaining at a temperature of 1645 ° C. for 24 hours to react the molten Si with C contained in the porous sintered body to form SiC, and simultaneously impregnate the pores with Si. Body 20 was obtained.

  And the flatness of the upper surface and lower surface of the obtained SiC / Si composite material body 20 was measured, respectively, and the curvature was calculated | required from this. The warpage was as small as 0.08%. Table 2 shows the thickness, flatness, warpage, and presence of cracks.

[Examples 2 to 5, 21]
In Examples 2 to 5 and 21, using the same raw materials as in Example 1, the first layer body 11 and the second layer body 12, the addition amounts of binder and C beads described in Table 1 were added. In the same manner as in Example 1, a SiC / Si composite material body 20 was produced.

  Then, in the same manner as in Example 1, the warp of the SiC / Si composite material body 20 was obtained. In Examples 2 to 5, the warpage was as small as 0.18% or less.

  In Example 21, the warp of the SiC / Si composite material 20 was 0.22%. This is considered to be because the difference in the ratio of the carbon source amount in the materials constituting the first layer body 11 and the second layer body 12 was as large as 14.4% by volume.

[Examples 6 to 10]
In Examples 6 to 10, using the same raw materials as in Example 1, the first layer body 11 and the second layer body 12, respectively, the same amount of binder and C beads as in Examples 1 to 5 were added. And SiC / Si composite material body 20 was produced like Example 1-5 except having made the flatness in the 1st smoothing process into the value indicated in Table 2.

  Then, in the same manner as in Example 1, the warp of the SiC / Si composite material body 20 was obtained. The warpage was as small as 0.19% or less.

[Examples 11 to 15]
In Examples 11 to 15, using the same raw materials as in Example 1 and the first layer body 11 and second layer body 12, the addition amount of binder and C beads described in Table 1 were added, A SiC / Si composite material 20 was produced in the same manner as in Example 1 except that the thickness of the thermosetting body was 4 mm and the thickness of the second layer body was 16 mm.

  Then, in the same manner as in Example 1, the warp of the SiC / Si composite material body 20 was obtained. The warpage was as small as 0.18% or less.

[Examples 16 to 20]
In Examples 16 to 20, using the same raw materials as in Example 1, the first layer body 11 and the second layer body 12, respectively, the same amount of binder and C beads as in Examples 11 to 15 were added. Then, a SiC / Si composite material 20 was produced in the same manner as in Examples 11 to 15 except that the flatness in the first smoothing step was set to the value described in Table 2.

  Then, in the same manner as in Example 1, the warp of the SiC / Si composite material body 20 was obtained. The warpage was as small as 0.12% or less.

[Comparative Example 1]
In Comparative Example 1, the same molding material as that of Example 11 was used for the first layer body 11 and the second layer body 12. And the thermosetting body 13 was obtained like Example 11. FIG.

  However, unlike Example 11, the first smoothing step of smoothing the upper surface 13a and the lower surface 13b of the thermosetting body 13 was not performed. The flatness of the upper surface 13a and the lower surface 13b of the thermosetting body 13 was 2.8 mm.

  Then, in the second molding step, the thermosetting body 13 is put in the molding die 31, and the molding material of the second layer 12 is charged from above the upper surface 13a of the thermosetting body 13, and in this state, When a molding pressure of 3.0 MPa was applied with a uniaxial press, cracks occurred in the thermoset 13. This is considered to be because local stress was generated because the flatness of the thermosetting body 13 became good.

[Comparative Example 2]
In Comparative Example 2, the same molding material as that of Example 11 was used for the first layer body 11 and the second layer body 12. Then, a degreased body 15 was obtained in the same manner as in Example 11.

  However, unlike Example 11, the second smoothing step of smoothing the upper surface 15a and the lower surface 15b of the degreased body 15 was not performed. The flatness of the upper surface 15a and the lower surface 15b of the degreased body 15 was 2.8 mm.

  Thereafter, in the same manner as in Example 11, a SiC / Si composite material body 20 was obtained.

  However, the warp of the SiC / Si composite material body 20 was 0.98%, which was very large. This is probably because the warping of the degreased body 15 was further increased during cooling after the impregnation step because the second smoothing step was not performed.

  DESCRIPTION OF SYMBOLS 11 ... 1st layer body, 12 ... 2nd layer body, 13 ... Thermosetting body, 13a ... Upper surface of thermosetting body, 13b ... Lower surface of thermosetting body, 14 ... Laminated body, 15 ... Degreased body, 15a ... Upper surface of degreased body, 15b ... Lower surface of degreased body, 20 ... SiC / Si composite material body, 21 ... First SiC / Si composite material layer, 22 ... Second SiC / Si composite material layer, 31 ... Mold.

Claims (4)

A step of pressing a material obtained by adding a thermosetting resin binder to SiC powder and molding the first layer body;
Heat-treating the first layer body to cure the thermosetting resin binder to form a thermosetting body;
Smoothing the upper and lower surfaces of the thermoset,
On the smoothed upper surface of the thermosetting body, after pressing a material obtained by adding a thermosetting resin binder to SiC powder having an average particle size different from that of the first layer body, pressing from above, Forming a laminate formed by laminating a second layer on the thermoset; and
Heat treating the laminate to degrease and form a degreased body;
Smoothing the upper and lower surfaces of the degreased body;
Firing the degreased body to form a porous sintered body;
A method of manufacturing a SiC / metal composite material, comprising the step of infiltrating a metal dissolved in the porous sintered body to obtain a SiC / metal composite material.   The method for producing a SiC / metal composite material according to claim 1, wherein the metal is Si or Al.   When the longest dimension of the thermosetting body is 500 mm or less and the maximum dimension / thickness is 100 or less, the thermosetting body is smoothed so that the flatness of the upper surface of the thermosetting body is 2 mm or less. Or the manufacturing method of the SiC / metal composite material body of 2. The SiC according to any one of claims 1 to 3, wherein a difference in a ratio of a carbon source in a material of the first layer body and the second layer body is 14% by volume or less. / Method for producing metal composite material.