JP2015123994A - Carrier tape, production method and production device of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform cold plastic work using a resin material including a conductive resin layer, and form a recess part without breaking the conductive resin layer.SOLUTION: The carrier tape production device comprises: a pedestal 11 for receiving a base material 10a having a pair of conductive resin layers 1, 2 and an intermediate resin layer 3; and a press plate 12 disposed to face the pedestal 11 and having an aperture 14. When a recess part 24 is molded on the base material 10a by a punch 13, a bottom 26 of the recess part 24 projects toward the pedestal 11 side, and another bottom 27 of the base material 10a floats from the pedestal 11.

Description

  The present invention relates to a carrier tape that accommodates and conveys electronic components, a manufacturing method thereof, and a manufacturing apparatus thereof.

Conventionally, as a resin carrier tape for storing and transporting electronic components, a resin base material is processed using a cradle and a punch to form a recess, and the electronic component is stored in the recess. Yes. By the way, when the concave portion is formed by cold plastic working in the above process using a material including a conductive resin layer for the base material, the conductive resin layer of the base material may break in the vicinity of the concave portion of the base material. is there.
For this reason, a technique has been developed in which a recess is formed in a resin base material by hot plastic working and an electronic component is accommodated in the recess so as not to break.

JP 7-76390 A

  As described above, a technique has been developed in which a plastic substrate is hot plastic processed to form a recess. However, when forming a recess by hot plastic working a resin base material, it is necessary to heat the base material, so that it is difficult to improve productivity, and a heating device is also required. When the substrate is heated and processed, dimensional shrinkage occurs due to the substrate being processed at room temperature, which causes generation of dimensional errors.

  The present invention has been made in consideration of such points, and can be formed by cold plastic working without heating a resin base material, and can produce a carrier tape with high productivity and high accuracy. An object of the present invention is to provide a carrier tape, a manufacturing method thereof, and a manufacturing apparatus thereof.

  The present invention relates to a carrier tape manufacturing apparatus for forming a recess in a base material having a conductive resin layer and a support resin layer laminated on the conductive resin layer. A presser plate provided oppositely and having an opening, and a punch that is inserted into the opening of the presser plate and that forms a recess in the base material. The carrier tape manufacturing apparatus is characterized in that the bottom surface of the recess protrudes toward the cradle side, and the other bottom surface of the substrate is pulled away from the cradle.

  The present invention relates to a carrier tape manufacturing apparatus for forming a recess in a base material having a conductive resin layer and a support resin layer laminated on the conductive resin layer. The press plate is provided to face each other and has an opening, and a punch that is inserted into the press plate and forms a recess in the base material. The punch is held by the punch plate, and the press plate is a punch. Carrier tape manufacturing apparatus characterized in that when a recess is formed in a substrate by punching while being elastically held by a plate, the bottom surface of the recess of the substrate protrudes toward the cradle and the other bottom surface of the substrate is pulled away from the cradle. It is.

  The present invention is the carrier tape tape manufacturing apparatus, wherein the substrate has a pair of conductive resin layers and a support resin layer sandwiched between the pair of conductive resin layers.

  The present invention relates to a carrier tape manufacturing method in which a recess is formed in a base material having a conductive resin layer and a support resin layer laminated on the conductive resin layer, and a step of placing the base material on a cradle And a step of sandwiching the base material on the cradle between the presser plate and a step of causing the punch to enter the base material from the side of the presser plate and forming a recess in the base material by the punch. The carrier tape manufacturing method is characterized in that when the concave portion is formed in the material, the concave bottom surface of the base material protrudes toward the cradle side, whereby the other bottom surface of the base material is pulled away from the cradle.

  The present invention is the carrier tape manufacturing method, wherein the substrate has a pair of conductive resins and a support resin layer sandwiched between the pair of conductive resin layers.

  The present invention comprises a base material having a conductive resin layer and a support resin layer laminated on the conductive resin layer, and a concave portion is formed on the base material, and the bottom surface of the concave portion of the base material is the other base material. A carrier tape that protrudes outward from a bottom surface.

  The present invention is the carrier tape, wherein the base material includes a pair of conductive resin layers and a support resin layer sandwiched between the pair of conductive resin layers.

  As described above, according to the present invention, a carrier tape having a recess can be easily and easily obtained by placing a base material on a cradle and then allowing a punch to enter the base material from the presser plate side. it can. In this case, the bottom surface of the recess protrudes toward the cradle side, and the other bottom surface of the base material is pulled away from the cradle side, so that the contact surface between the substrate and the punch is relatively compressed from above and below. As a result, the conductive resin layer is not broken even in cold plastic working, and a concave portion having a smooth surface can be accurately formed.

FIGS. 1A to 1E are operation process diagrams showing a manufacturing method using a carrier tape manufacturing apparatus according to the present invention. FIGS. 2A to 2D are views showing details of a method for producing a carrier tape according to the present invention. FIG. 3 is a side sectional view showing the carrier tape body. FIG. 4 is a side sectional view showing a base material for producing the carrier tape 10. FIG. 5 is a diagram showing a carrier tape manufacturing apparatus as a comparative example. 6A, 6B, and 6C are views showing a method for manufacturing a carrier tape as a comparative example.

BEST MODE FOR CARRYING OUT THE INVENTION

  Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 are views showing an embodiment of the present invention.

  First, the entire carrier tape body will be described with reference to FIGS. As shown in FIG. 3, the carrier tape body 20 is made of a resin base material 10 a, the carrier tape 10 having a recess 24, an electronic component 25 housed in the recess 24, and a cover material covering the opening of the recess 24. 21.

  Among these, the carrier tape 10 is made of, for example, a resin base material 10a having a thickness of 0.3 mm. Further, the bottom surface 26 of the recess 24 of the base material 10a protrudes outward (downward) from the other bottom surface 27, and the protruding height is about 0.1 mm.

  For this reason, the height of the concave portion 24 of the carrier tape 10 is 0.4 mm. Further, the depth in the recess 24 is 0.25 mm, and the bottom surface 26 of the recess 24 has a thickness of 0.15 mm.

  Here, the resin base material 10a was sandwiched between a pair of polystyrene (PS) conductive resin layers 1 and 2 kneaded with a conductive material and a pair of conductive resin layers 1 and 2. A base material having an intermediate resin layer (support resin layer) 3 made of acrylonitrile, butadiene, and styrene copolymer synthetic resin (ABS) can be used (see FIG. 4). The conductive resin 1 and the intermediate resin layer (supporting resin layer) 3 are used as the base material 10a without using a three-layered laminate having the pair of conductive resin layers 1.2 and the intermediate resin layer 3. You may use the laminated body of the 2 layer structure which has.

  Further, the lid member 21 covers the opening of the recess 24 in which the electronic component 25 is accommodated. The lid member 21 is made of, for example, plastic or paper, and is applied to the carrier tape 10 by a method such as thermocompression bonding. It is stuck.

  The carrier tape 10 is provided with a transport opening (not shown) in a portion other than the recess 24.

  Next, a carrier tape manufacturing apparatus will be described with reference to FIG.

  As shown in FIGS. 1 (a), (b), (c), (d), and (e), the carrier tape manufacturing apparatus is provided with a cradle 11 for receiving a resin base material 10a, and facing the cradle 11. A holding plate 12 having an opening 14 and a polygonal punch 13 inserted into the opening 14 of the holding plate 12 and forming a recess 24 in the base material 10a are provided.

  The punch 13 is held by a punch plate 15. The punch plate 15 is fixed to a drive ram 18 that moves in the vertical direction. Further, the presser plate 12 is elastically held on the cradle 11 via a spring 12 </ b> A, and the presser plate 12 can be pressed by a support bar 16. The support bar 16 is elastically held by the spring 17 on the punch plate 15.

Next, the manufacturing method of a carrier tape is demonstrated with reference to FIG. 1 (a)-(e) and FIG. 2 (a)-(d). First, the resin base material 10a is placed on the cradle 11, and at this time, the resin base material 10a is disposed between the cradle 11 and the presser plate 12 (FIGS. 1A and 2A). )reference).
As shown in FIG. 1 (a), stroke stoppers 28a and 28b are respectively provided on the cradle 11 and the punch plate 15, and the drive ram 18 is at the top dead center.

  Thereafter, the support bar 16 is lowered by the drive ram 18, and the presser plate 12 is pressed by the support bar 16 to come into contact with the base material 10a (see FIGS. 1B and 2B).

Next, the drive ram 18 further descends, and the punch 14 held by the punch plate 15 enters the base material 10a from above the base material 10a. At this time, the recess 24 is formed in the base material 10a, and the bottom surface 26 of the recess 24 protrudes toward the cradle 11 so that the other bottom surface 27 of the base material 10a is lifted and separated from the cradle 11 (FIG. 1 ( c) and FIG. 2 (c)).
In FIG. 1C, the stroke stopper 28a on the cradle 11 side comes into contact with the stroke stopper 28b on the punch plate 15 side, and the drive ram 18 reaches the bottom dead center.

  When the bottom surface 26 of the recess 24 protrudes toward the cradle 11, the entire base material 10 a is also lifted, whereby the base material 10 a pushes up the holding plate 12 that is elastically held.

  Thereafter, the drive ram 18 is raised and the punch 13 is pulled out from the base material 10a, and then the presser plate 12 is raised by the spring 12A, thereby obtaining the carrier tape 10 formed by forming the recess 24 in the base material 10a. (See FIG. 1 (d) and FIG. 2 (d)). Thereafter, the drive ram 18 reaches top dead center (see FIG. 1 (e)).

  According to the present embodiment, when the recess 24 is formed on the base material 10a, the recess 24 can be easily formed without applying a large forming pressure to the punch 13 by projecting the bottom surface 26 of the recess 24 downward. it can. Further, since the bottom surface 27 of the base material other than the bottom surface 26 of the recess 24 can be lifted from the cradle 11 when the recess 24 is formed, for example, the recess 24 is formed by providing a groove into which the recess 24 enters. Compared to the case, the carrier tape 10 after forming the recess 24 can be easily pulled out and discharged in the horizontal direction. That is, when a groove into which the concave portion 24 enters is provided on the cradle 11, it is difficult to pull out and discharge the carrier tape 10 in the horizontal direction.

Next, the behavior of the base material 10a when forming the recess 24 in the base material 10a will be described. When the resin base material 10a is pressed by the punch 13, an internal pressure S1 is generated in the base material 10a, and the entire portion of the base material 10a that is not pressed by the reaction force S2 of the internal pressure S1 pushes up the presser plate 12. (See FIG. 2 (c)). Thus, when the part of the base material 10a which is not pressurized raises to S3 direction, the base material 10a has the effect of a comparatively up-and-down pressing process, Thereby, the upper conductive resin layer 1, The recess 24 can be formed in the base material 10a without breaking 2.
Here, a comparative example of the present invention will be described with reference to FIGS. In the comparative example shown in FIGS. 5 and 6, a groove 11 a into which the concave portion 24 of the base material 10 a enters is provided on the cradle 11.
As shown in FIGS. 5 and 6, when the groove 11a is provided on the cradle 11, when the base material 10a is pressurized with the punch 13, an internal pressure S1 is generated in the base material 10a (see FIG. 6A). ). At this time, the portion of the base material 10a not pressed by the reaction force S2 of the internal pressure S1 pushes up the presser plate 12 in the S3 direction, but the internal pressure S1 and the reaction force S2 in the base material 10a by the groove 11a on the cradle 11 are. Are smaller (see FIG. 6B). For this reason, the force which pushes up the presser plate 12 from the base material 10a is also weakened, and the effect of the vertical pressing process is reduced.
Thus, when both the internal pressure S1 and the reaction force S2 when processing the base material 10a with the punch 13 are lowered, the fracture surface length of the base material 10a is increased, and therefore the recess 24 formed on the base material 10a. The cross-sectional shape is a trapezoid whose lower side is larger than the upper side (see FIG. 6C).
In this case, since the fractured surface length becomes longer in the recess 24 of the base material 10a, the pair of conductive resin layers 1 and 2 are particularly broken in the base material 10a. Further, it is difficult to pull out the carrier tape 10 after forming the recess 24 in the horizontal direction due to the groove 11a provided on the cradle 11.
On the other hand, according to the present embodiment, since the cradle 11 has a flat surface without a groove, when the base material 10a is pressurized with the punch 13, a large internal pressure S1 is generated in the base material 10a. In addition, the reaction force S2 of the internal pressure S1 can be sufficiently increased. For this reason, the part of the base material 10a which is not pressurized can be raised largely, and the effect of a comparatively big up-and-down pressing process can be provided with respect to the base material 10a. In this case, the fracture surface length does not increase in the recess 24 of the substrate 10a, and the pair of conductive resins 1 and 2 of the substrate 10a do not break. Moreover, the cross-sectional shape of the recessed part 24 maintains a rectangular shape, and the recessed part 24 can be shape | molded accurately.

  In the above embodiment, the presser plate 12 may be elastically held by the punch plate 15 using the spring 17 and the presser plate 12 may be placed on the base material 10a so as to be movable in the vertical direction. In this case, when the concave portion 24 is formed in the base material 10a, the base material 10a rises as the bottom surface 26 of the concave portion 24 protrudes downward. The upward movement of the presser plate 12 absorbs the rise of the base material 10a. be able to.

DESCRIPTION OF SYMBOLS 1, 2 Conductive resin layer 3 Intermediate resin layer 10 Carrier tape 10a Base material 11 Receiving base 12 Holding plate 12A Spring 13 Punch 14 Open hole 15 Punch plate 17 Spring 18 Drive ram 20 Carrier tape body 24 Recess 25 Electronic component 26 Bottom surface 27 Bottom

Claims (7)

In a carrier tape manufacturing apparatus that molds a recess with respect to a substrate having a conductive resin layer and a support resin layer laminated on the conductive resin layer,
A cradle for receiving a substrate;
A presser plate provided facing the cradle and having an opening;
A punch that is inserted into the opening of the presser plate and that forms a recess in the substrate;
A carrier tape manufacturing apparatus, wherein when a recess is formed in a substrate by punching, the bottom surface of the recess of the substrate protrudes toward the cradle side, and the other bottom surface of the substrate is pulled away from the cradle. In a carrier tape manufacturing apparatus that molds a recess with respect to a substrate having a conductive resin layer and a support resin layer laminated on the conductive resin layer,
A cradle for receiving a substrate;
A presser plate provided facing the cradle and having an opening;
A punch that is inserted into the opening of the presser plate and that forms a recess in the substrate;
The punch is held by the punch plate,
The holding plate is elastically held by the punch plate,
A carrier tape manufacturing apparatus, wherein when a recess is formed in a substrate by punching, the bottom surface of the recess of the substrate protrudes toward the cradle side, and the other bottom surface of the substrate is pulled away from the cradle.   The carrier tape manufacturing apparatus according to claim 1 or 2, wherein the substrate has a pair of conductive resin layers and a support resin layer sandwiched between the pair of conductive resin layers. In the carrier tape manufacturing method of forming a recess with respect to a substrate having a conductive resin layer and a support resin layer laminated on the conductive resin layer,
Placing the substrate on the cradle; and
Sandwiching the base material on the cradle between the press plate,
Including a step of causing a punch to enter the base material from the side of the press plate and forming a recess in the base material by the punch,
A method for producing a carrier tape, comprising: forming a concave portion on a substrate by punching, wherein the bottom surface of the concave portion of the substrate protrudes toward the cradle side, whereby the other bottom surface of the substrate is separated from the cradle.   The carrier tape manufacturing method according to claim 4, wherein the substrate has a pair of conductive resins and a support resin layer sandwiched between the pair of conductive resin layers.   It consists of a base material having a conductive resin layer and a supporting resin layer laminated on the conductive resin layer, and a concave portion is formed on the base material, and the concave bottom surface of the base material is outward from the other bottom surface of the base material. Carrier tape characterized by protruding into   The carrier tape according to claim 6, wherein the base material has a pair of conductive resin layers and a support resin layer sandwiched between the pair of conductive resin layers.

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