201204486 六、發明說明： 【發明所屬之技術領域】 、 —種複合㈣壓製程，尤指多層板如壓合_合等方式層 疊而成之複合材，並對複合材表面沖壓成形之沖壓製程。 【先前技術】 按，複合㈣衫層板材合或黏合等方式層疊而成，而 複合材表面欲形成有孔洞時，大多會以沖壓製程對複合材進行沖 φ壓’請參閱第—圖至第三圖所示，係為習知沖壓製程之動作流程 圖，由圖中可清楚看出’在複合材Α利用沖頭Β沖屢成形時沖 頭B為會由複合材A ―側朝向複合材A位移，並穿過複合材a使 複合材A形成有鏤空部A2，但在複合材A形成鎮空部A2後沖頭 B會朝原本之行進方向反向雌複錄A，此時各複合材A相鄰之 板材Μ，在鏤空部A2處會產生分離形成有_ A3，此間隙^對 於複合材A而言可能是非常的小，但若複合材A為電路基板時， _其影響就相當的大，且在現今電子產品趨向輕薄短小，使電路基 板趨於小型化’單位面積上的電路越來越密集，此間隙Μ即會影 響到電路的設置，且相鄰板材A1產生分離也會使原本相鄰板材ai 之電性連接產生斷路，再者，目前設置於複合材A上之電子元件 的體積趨於微小化（如：微處理器、發光二極體等），而且單位面 積上的密紐也愈來愈高’使電子元件的總發熱量職乎逐年升 咼而相鄰板材A1產生分離也會使複合材a之導熱與散熱能力下 降而無法有效排除電子元件所產生的熱。 201204486 然而，為了解決上述沖壓製程對複合材所產生之問題，目前 相關業者皆以切削製程來取代沖壓製程，以避免產生沖壓製程所 造成之問題，但切削製程不但耗時耗工，且無法有效的大量生產， 以致加工速度趕不上複合材之需求量，且成本相對會提高非常的 多。 是以，要如何可使沖壓製程有效的利用於複合材，即為從事 此相關行業業者所亟欲研究與改良之課題所在。 【發明内容】 本發明之主要目的乃在於，於一層以上之板材所層疊製成之 複合材上，利用沖壓製程沖壓切削形成有鏤空部，且鏤空部處之 相鄰板材之間不會產生間隙。 為達上述目的，本發明之複合材係層疊有一層以上之板材， 當複合材賴設備於表面進行雜製程時，賴設備所設置 之上模座與τ難會分麻持於複合材之上下表面，再使上模座 與下模座之崎設置之相沖缝合材，科頭於沖歸合材使 複合材形成有鏤空部後，沖頭不會於鏤空部_向沖壓之相反方 向脫離’以避免_賴方向之板材’因鏤球處與沖賴邊產 生反向摩擦而翹起，使相鄰板材於鏤空部處產生間隙。 【實施方式】 、 明參閱第四圖至第九圖所示，由第四圖中可 發 明之沖壓製雜__設備2對複合材丨進行賴，複合材丄 係以-層以上之板材u，以壓合或黏合方式層細職，而沖壓 201204486 設備2係設置有上難21與下模座22，而上難a與下模座四 分別設置有相對之上模穴211與下模穴221，且上模穴2ΐι内設置 有沖頭烈，當沖壓設備2對複合材！進㈣壓時請參閱第五圖 至第七圖所示，係先將複合材1置放於下模座22表面，使複合材 !底面婦於下模座22表面，在使上難21朝向下麵&位移， 以讓上模㈣之底面轉於複合材丨表面，使複合材丨穩固定定 位於上模座21與下模座22之間，續將沖頭23由上模穴211朝向 並進入下模穴22卜而在位移的過程巾會沖壓切削複合材i，使複 合材1形成有鏤空部12，在移動上模座21座朝向遠離複合材丨 義，而沖頭23留在下模座22之下模穴221内，此時為將複合 材1朝向朝向上模座21移動以脫離沖頭23，即完成對複合材1 之賴製程，請參閱第八圖所示，當複合材！取出沖壓設備2後 上模座21為會再次朝向下難Μ移動，使㈣23進人上模座21 之上模穴221内’並使上模座21朝向遠離下模座22位移，將沖 碩帶，下模座22，即可再次對複合材！進行沖壓製程。 疋以，本發明為可解決習知技術中所產生之問題，其關鍵技 術在於，本侧之沖頭23於複合材丨上沖壓形成鏤空部I〗後， 各板材U於鏤空部12處’會因沖頭23之擠壓而略朝向沖壓方向 形成擠料f曲，而使相鄰之板材u在鏤空部12處除了原先壓人 或黏合之緊貼外，更會因擠_曲而緊密結合，且沖頭Μ不會於 鎮空部12内朝向沖壓之相反方向脫離，也就不會讓沖頭23與各 板材11之鏤空部12邊緣產生反向摩擦，以避免遠離沖壓方向201204486 VI. Description of the invention: [Technical field to which the invention pertains], a composite (four) pressing process, especially a composite material in which a multi-layer board is laminated, such as a lamination-integration method, and a stamping process for forming a surface of a composite material. [Prior Art] According to the composite (four) shirt layer laminated or bonded, etc., when the surface of the composite is to be formed with holes, most of the composites will be punched and pressed by the stamping process. Please refer to the first to the first As shown in the three figures, it is a flow chart of the conventional stamping process. It can be clearly seen from the figure that the punch B is made of composite material A-side facing composite material when the composite material is repeatedly formed by punching and punching. A displacement, and through the composite material a, the composite material A is formed with the hollow portion A2, but after the composite material A forms the hollow portion A2, the punch B will reverse the female direction A in the original traveling direction, at this time each compound The sheet adjacent to the material A is separated by _A3 at the hollow portion A2. This gap ^ may be very small for the composite material A, but if the composite material A is a circuit board, the influence is It is quite large, and in today's electronic products tend to be light and thin, so that the circuit board tends to be miniaturized. The circuit on the unit area is getting denser and denser. This gap will affect the circuit setting, and the adjacent board A1 will be separated. Will cause the electrical connection of the adjacent adjacent plate ai to be broken. Furthermore, the volume of electronic components currently placed on the composite material A tends to be small (eg, microprocessors, light-emitting diodes, etc.), and the denseness of the unit area is becoming higher and higher. The total heat generation is increased year by year, and the separation of the adjacent sheets A1 also causes the heat conduction and heat dissipation capability of the composite material a to be lowered, so that the heat generated by the electronic components cannot be effectively excluded. 201204486 However, in order to solve the problems caused by the above-mentioned stamping process on the composite material, the relevant manufacturers have replaced the stamping process with a cutting process to avoid the problems caused by the stamping process, but the cutting process is not only time-consuming and labor-intensive, but also ineffective. The mass production, so that the processing speed can not keep up with the demand for composite materials, and the cost will increase very much. Therefore, how to make the stamping process effective for the composite material is the subject of research and improvement that the industry in this related industry wants to study and improve. SUMMARY OF THE INVENTION The main object of the present invention is to form a hollow portion by stamping and cutting on a composite material formed by laminating one or more sheets, and no gap is formed between adjacent sheets at the hollow portion. . In order to achieve the above object, the composite material of the present invention is laminated with more than one layer of the board. When the composite material is placed on the surface for the miscellaneous process, the mold base and the τ are difficult to be placed under the composite material. On the surface, the upper mold base and the lower mold base are arranged to punch the suture material. After the head is formed into a hollowed portion, the punch is not separated from the hollow portion _ toward the opposite direction of the punching. 'To avoid the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ [Embodiment] As shown in the fourth to ninth drawings, the stamping machine __device 2 which can be invented in the fourth figure is used for the composite material, and the composite material is made of a layer of more than - In the press-bonding or bonding manner, the second unit is provided with the upper die 21 and the lower die base 22, and the upper die a and the lower die base 4 are respectively provided with the upper die cavity 211 and the lower die cavity. 221, and there is a punch in the upper mold hole 2ΐι, when the stamping equipment 2 pairs of composite materials! When entering the (four) pressure, please refer to the fifth figure to the seventh figure. First, the composite material 1 is placed on the surface of the lower mold base 22, so that the composite material is placed on the surface of the lower mold base 22, so that it is difficult to face 21 The following & displacement, so that the bottom surface of the upper mold (4) is turned to the surface of the composite material, so that the composite material is firmly fixed between the upper mold base 21 and the lower mold base 22, and the punch 23 is continuously oriented from the upper mold cavity 211 And entering the lower mold cavity 22, and in the process of the displacement, the cutting material is stamped and cut, so that the composite material 1 is formed with the hollow portion 12, and the movable mold base 21 is moved away from the composite material, and the punch 23 is left under the movement. In the cavity 221 below the die holder 22, at this time, the composite material 1 is moved toward the upper die holder 21 to be separated from the punch 23, that is, the process of the composite material 1 is completed, as shown in the eighth figure, when compounding material! After the punching device 2 is taken out, the upper die holder 21 is moved to face downward again, so that (4) 23 enters the upper die holder 21 above the die hole 221 and the upper die holder 21 is displaced away from the lower die holder 22, With the lower mold base 22, you can pair the composite again! Carry out the stamping process. Therefore, the present invention is capable of solving the problems in the prior art, and the key technique is that after the punch 23 of the present side is stamped on the composite material to form the hollow portion I, each sheet U is at the hollow portion 12' Due to the extrusion of the punch 23, the extrusion material f is formed slightly toward the punching direction, so that the adjacent plate material u is tightly pressed at the hollow portion 12 in addition to the original pressing or bonding. In combination, the punch Μ does not detach in the opposite direction of the punching in the hollow portion 12, so that the punch 23 and the edge of the hollow portion 12 of each plate 11 are not reversely rubbed to avoid moving away from the punching direction.
f C 201204486 輸输，崎其朝向擠 細之相反方_起，讓相_u於鏤空部_產生間隙。 在請參閲針縣軒二_^由財 明之沖屋設備2之沖頭23由上模以】“ 本發 並在位移的過程中沖㈣如材：:向並進入下歡221， 材1後’為完全進入下模座22之f C 201204486 Ins and outs, the opposite side of the squeezing of the squeezing direction, so that the phase _u in the hollow part _ creates a gap. Please refer to the needle county Xuan 2 _ ^ by the Zhao Ming rushing equipment 2 punch 23 from the upper mold to] "this hair and in the process of displacement (four) as follows:: and into the next Huan 221, material 1 After 'for complete access to the lower mold base 22
内’此時’上模座21為會向上移動讓制者可將複 合材⑽或移動，再使上模座21躺下難22位移，讓上模 座21之底面抵持於複合材！表面，以讓複合材！穩固定定位於上 模座2!與下模座22之間，續使沖由下模穴221朝向並進入 上模穴2U，而在位移的過程中會沖顧合材i，使複合材！形成 有鏤空部12，藉此，以可使沖頭23於上模座21與下模座烈之間 來回於複合材1上形成柯之鏤” 12或是於獨之複合材】上 形成鏤空部12，同樣的，沖頭23不會於鏤空部12内朝向沖壓之 相反方向脫離，以避免_沖壓方向板材u，因鏤空部12處與沖 頭23侧邊產生摩擦，進而使其朝向擠料彎曲之相反方向輕起，讓 相鄰板材11於鏤空部12處產生間隙。 在明參閱第十二圖與第十三圖所示，由第十二圖中可清楚看 出，該沖頭23於上下二端之侧表面凹設有缺槽231，俾使沖頭23 於複合材1上沖壓出鏤空部12時，可減少各板材u之鏤空部12 邊緣與沖頭23摩擦之距離。 【圖式簡單說明】 第一圖係為習知沖壓製程之動作流程圖（一）。 201204486 第二圖係為習知沖壓製程之動作流程圖（二）。 第三圖係為習知沖壓製程之動作流細（三）。 第四圖係為本發明沖壓製程較佳實施方式之動作絲圖㈠。 第五圖係為本發明沖壓製程較佳實施方式之動作流程圖（二）。 第六圖係為本發明沖壓製錄佳實施方式之動作流程圖（三）。 第七圖係為本發明沖難錄佳實施方式之動作餘圖（四）。 第八圖係為本發明沖縣織佳實施方式之動倾程圖（五）。 第九圖係為第六圖之放大圖。 第十圖係為本發财壓製輯-較佳實施方式之動作流程圖 (一）。 第十-圖料本發财難程再-較佳實财狀動作 (二）。 第十-®係為本發财難程再—較佳實施方式之動作流程圖 (三）。 第十二圖係為本發明沖頭之侧視圖。 【主要元件符號說明】 卜複合材 11、 板材 12、 鏤空部 2、沖壓設備 21、上模座 201204486 211、上模穴 22、 下模座 221、下模穴 23、 沖頭 231、缺槽 A、複合材 # A1、板材 A2、鏤空部 A3、間隙 B、沖頭The inner 'this time' upper mold base 21 is moved upwards so that the maker can move the composite material (10) or move, and then the upper mold base 21 is laid down and difficult to displace 22, so that the bottom surface of the upper mold base 21 is held against the composite material! Surface to make the composite! It is fixedly positioned between the upper die holder 2! and the lower die holder 22, and continues to pass the lower die cavity 221 toward and into the upper die cavity 2U, and in the process of displacement, the composite material i is made to make the composite material! The hollow portion 12 is formed, whereby the punch 23 can be formed on the composite material 1 between the upper mold base 21 and the lower mold base to form a hollow on the composite material 1 or a hollow composite material. In the same manner, the punch 23 is not disengaged in the opposite direction of the punching in the hollow portion 12, so as to avoid the sheet material u in the punching direction, because the side portion of the hollow portion 12 and the punch 23 are rubbed, thereby causing the portion to be squeezed. Lightening in the opposite direction of the bending of the material causes the adjacent sheet material 11 to create a gap at the hollow portion 12. As shown in the twelfth and thirteenth drawings, it can be clearly seen from the twelfth figure that the punch A notch 231 is recessed in the side surface of the upper and lower ends, so that when the punch 23 punches the hollow portion 12 on the composite material 1, the distance between the edge of the hollow portion 12 of each of the plates u and the punch 23 can be reduced. [Simple description of the diagram] The first diagram is the flow chart of the conventional stamping process (1). 201204486 The second diagram is the flow chart of the conventional stamping process (2). The third diagram is the conventional stamping process. The action flow is fine (3). The fourth figure is the preferred embodiment of the stamping process of the present invention. Figure 5 is a flow chart (2) of the preferred embodiment of the stamping process of the present invention. Figure 6 is a flow chart (3) of the preferred embodiment of the stamping and recording system of the present invention. It is the action residual diagram (4) of the implementation method of the invention. The eighth figure is the dynamic tilt diagram (5) of the implementation method of the Chongxian weaving method of the present invention. The ninth figure is the enlarged view of the sixth figure. The tenth figure is the action flow chart (1) of the current financial suppression series - the preferred embodiment. The tenth - picture material is rich in the financial process - the better real financial action (2). This is the flow chart of the life-saving process of the preferred embodiment (3). The twelfth figure is the side view of the punch of the present invention. [Description of the main components] The composite material 11, the plate 12, hollowed out 2, stamping equipment 21, upper mold base 201204486 211, upper mold cavity 22, lower mold base 221, lower mold cavity 23, punch 231, notch A, composite material # A1, sheet A2, hollow portion A3, gap B ,shower