JP2015111067A5 - - Google Patents
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- Publication number
- JP2015111067A5 JP2015111067A5 JP2013253110A JP2013253110A JP2015111067A5 JP 2015111067 A5 JP2015111067 A5 JP 2015111067A5 JP 2013253110 A JP2013253110 A JP 2013253110A JP 2013253110 A JP2013253110 A JP 2013253110A JP 2015111067 A5 JP2015111067 A5 JP 2015111067A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- electronic component
- sensor module
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
- 230000002093 peripheral Effects 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013253110A JP6030539B2 (ja) | 2013-12-06 | 2013-12-06 | センサモジュール及び物理量測定センサ |
| US14/560,818 US9772242B2 (en) | 2013-12-06 | 2014-12-04 | Physical quantity measuring sensor including an O-ring between a cylindrical portion and a cylindrical projection |
| EP14196600.2A EP2889599B1 (de) | 2013-12-06 | 2014-12-05 | Sensor zur Messung einer physikalischen Größe und Sensormodul |
| CN201410730593.7A CN104697699B (zh) | 2013-12-06 | 2014-12-05 | 物理量测定传感器以及传感器模块 |
| CN201911064121.1A CN110763392A (zh) | 2013-12-06 | 2014-12-05 | 物理量测定传感器以及传感器模块 |
| US15/641,807 US10113926B2 (en) | 2013-12-06 | 2017-07-05 | Ceramic sensor module including diaphragm and cylindrical portion integrated with the diaphragm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013253110A JP6030539B2 (ja) | 2013-12-06 | 2013-12-06 | センサモジュール及び物理量測定センサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015111067A JP2015111067A (ja) | 2015-06-18 |
| JP2015111067A5 true JP2015111067A5 (de) | 2015-12-24 |
| JP6030539B2 JP6030539B2 (ja) | 2016-11-24 |
Family
ID=53525991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013253110A Active JP6030539B2 (ja) | 2013-12-06 | 2013-12-06 | センサモジュール及び物理量測定センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6030539B2 (de) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4966039A (en) * | 1988-04-21 | 1990-10-30 | Marelli Autronica S.P.A. | Electrical force and/or deformation sensor, particularly for use as a pressure sensor |
| JP2002310826A (ja) * | 2001-02-08 | 2002-10-23 | Tgk Co Ltd | 圧力センサの調整方法 |
| JP2006078379A (ja) * | 2004-09-10 | 2006-03-23 | Tgk Co Ltd | 圧力センサおよびその製造方法 |
| US8476087B2 (en) * | 2011-04-21 | 2013-07-02 | Freescale Semiconductor, Inc. | Methods for fabricating sensor device package using a sealing structure |
-
2013
- 2013-12-06 JP JP2013253110A patent/JP6030539B2/ja active Active
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