JP2015096882A - Electro-optic device, and projection type display apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electro-optic device downsized and reduced in cost, and which can be surely sealed, and to provide a projection type display apparatus including the electro-optic device.SOLUTION: An electro-optic device 50 includes a rim-like ceramic package 80 surrounding an electro-optic panel 40. The ceramic package 80 and a plate-like first sealing substrate 60 are bonded to each other with a first bonding material 91 made of an inorganic material, and the ceramic substrate 80 and a plate-like second sealing substrate 70 are bonded to each other with a second bonding material 92 made of an inorganic material. The ceramic package 80 is provided with an internal terminal 882 electrically connected to a terminal 402 of the electro-optic panel 40 in the inside thereof, and an external terminal 881 provided on a first end surface 86a in the outside thereof. The internal terminal 882 and the external terminal 881 are electrically connected via a wiring portion 889 penetrating the ceramic package 80.

Description

  The present invention relates to an electro-optical device and a projection display device.

  When an image is displayed on an electronic device such as a projection display device, light modulated by an electro-optical device such as a liquid crystal device is used. The electro-optical device includes a first substrate, a second substrate facing the first substrate, a sealing material provided between the first substrate and the second substrate, and a gap between the first substrate and the second substrate. An electro-optical material such as liquid crystal is held, and the first substrate and the second substrate are sealed with a sealing material around the electro-optical material. In the electro-optical device configured as described above, the sealing material is made of a resin composition and is permeable to moisture. For this reason, the electro-optical device cannot prevent the electro-optical material from being deteriorated by moisture.

  On the other hand, a liquid crystal panel is arranged inside a frame-shaped ceramic package, a flat front protective glass is provided between the ceramic package and the front side of the liquid crystal panel, and a curved thin rear protective glass is provided behind the liquid crystal panel. A liquid crystal display device has been proposed (see Patent Document 1).

  In the liquid crystal display device described in Patent Document 1, the ceramic package and the front protective glass are bonded, and the rear of the liquid crystal panel is sealed with the rear protective glass. Further, the wiring of the liquid crystal panel and the wiring on the package side are electrically connected by a bonding wire, and the wiring on the package side is connected to the pin-shaped external lead standing up front on the side surface of the ceramic package in the ceramic package. .

JP-A-1-222224

  However, as in the liquid crystal display device described in Patent Document 1, when a pin-like external lead that stands forward on the side surface of the ceramic package is provided, it is necessary to fix the external lead to the side surface of the ceramic package. There is a problem that the cost increases. In addition, when a pin-shaped external lead that stands up forward on the side surface of the ceramic package is provided, other structures cannot be disposed near the side surface of the liquid crystal display device, so the size of the liquid crystal display device is substantially reduced. There is a problem of increasing the size.

  In view of the above problems, an object of the present invention is to achieve downsizing and cost reduction, as well as an electro-optical device capable of performing reliable sealing, and a projection display including the electro-optical device. To provide an apparatus.

  In order to solve the above-described problem, an electro-optical device according to the present invention includes an electro-optical panel including a first substrate having terminals formed on one side thereof, and a ceramic package surrounding the electro-optical panel in plan view. A first sealing substrate that opposes the electro-optical panel and at least a region facing the display region has translucency, and a first joint that joins the first sealing substrate and the ceramic package over the entire circumference. The ceramic package includes an internal terminal electrically connected to the terminal on the electro-optical panel side of the ceramic package, and a first end surface of the ceramic package on the first sealing substrate side And an external terminal provided on one of the second end surfaces opposite to the first sealing substrate side, and electrically passing the internal terminal and the external terminal through the ceramic package. Characterized in that it and a wiring portion connected to.

  In the present invention, since the electro-optical panel is sealed by the ceramic package and the first sealing substrate, moisture hardly enters the electro-optical panel. For this reason, deterioration of the electro-optical panel due to moisture can be prevented. The terminals formed on the first substrate of the electro-optical panel are electrically connected to the internal terminals provided inside the ceramic package and the external terminals provided outside the ceramic package through a wiring portion penetrating the ceramic package. Therefore, moisture is less likely to enter the inside of the ceramic package than the structure in which the flexible wiring board connected to the electro-optical panel is drawn to the outside of the ceramic package. The external terminal is provided on one of the first end surface on the first sealing substrate side of the ceramic package and the second end surface opposite to the first sealing substrate side, and the external terminal is provided on the side surface of the ceramic package. Is not provided. For this reason, the electro-optical device can be reduced in size, and the same effect as when the electro-optical device is reduced in size can be obtained, for example, other structures can be arranged near the side surface of the electro-optical device. In addition, unlike the case where a pin-shaped external lead standing up front on the side surface of the ceramic package is provided, the manufacturing cost can be reduced.

  In the present invention, it is preferable that the external terminals are arranged along at least two side wall portions of the ceramic package on one of the first end surface and the second end surface. According to such a configuration, since there are few restrictions on the space for providing the external terminals, the external terminals can be appropriately arranged such that the external terminals can be arranged at a sufficient interval.

  In the present invention, the external terminal may be provided with a solder ball.

  In the present invention, the external terminal may be provided with a terminal pin.

  In the present invention, the first sealing substrate is provided in a first frame-like member having a first opening at least in a region facing the display region, and the first frame-like member provided in the first opening. And a first translucent plate joined over the entire circumference, and the first frame member and the ceramic package are preferably joined over the entire circumference by the first joining material. According to such a configuration, since the portion (first frame-shaped portion) to be bonded to the ceramic package in the first bonding member does not need to be a translucent material such as glass, the first sealing substrate is formed by the first bonding material. Even when heated when the ceramic package and the ceramic package are joined, the first frame member is unlikely to be deformed or damaged.

  In the present invention, the ceramic package has a frame shape, a second sealing substrate facing the electro-optical panel on the side opposite to the first sealing substrate with respect to the electro-optical panel, and the second sealing You may employ | adopt the structure which has a 2nd joining material which joins a stop board | substrate and the said ceramic package over a perimeter.

  In the present invention, it is preferable that at least a region facing the display region is translucent in the second sealing substrate. According to this configuration, a transmissive electro-optical device can be configured.

  In the present invention, the second sealing substrate is provided in a second frame-shaped member having a second opening at least in the display region, and provided in the second opening, and extends over the entire circumference of the second frame-shaped member. It is preferable that the second frame-shaped member and the ceramic package are bonded over the entire circumference by the second bonding material. According to such a configuration, since the portion (second frame-shaped portion) to be bonded to the ceramic package in the second bonding member does not have to be a light-transmitting material such as glass, the second sealing substrate is formed by the second bonding material. Even when heated when the ceramic package and the ceramic package are joined, the second frame-shaped member is unlikely to be deformed or damaged.

It is explanatory drawing of the projection type display apparatus as an example of the electronic device to which this invention is applied. It is explanatory drawing which shows the structure of the optical unit used for the projection type display apparatus to which this invention is applied. It is explanatory drawing which shows the detailed structure of the optical unit used for the projection type display apparatus to which this invention is applied. It is explanatory drawing of the electro-optical panel used for the electro-optical apparatus to which this invention is applied. 1 is a perspective view of a first example of an electro-optical device to which the present invention is applied. FIG. FIG. 6 is an exploded perspective view of the electro-optical device shown in FIG. 5. FIG. 6 is a cross-sectional view illustrating a first example of the electro-optical device illustrated in FIG. 5. FIG. 6 is a cross-sectional view of a second example of an electro-optical device to which the invention is applied. FIG. 6 is a cross-sectional view of a third example of an electro-optical device to which the invention is applied. FIG. 10 is a perspective view of a fourth example of an electro-optical device to which the invention is applied.

  Embodiments of the present invention will be described with reference to the drawings. In the following description, as an electronic apparatus to which the present invention is applied, a projection display device using an electro-optical device including a transmissive electro-optical panel (transmissive liquid crystal panel) as a light valve will be described. In the drawings referred to in the following description, the scale and the number are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing.

[Configuration of Projection Display Device (Electronic Equipment)]
(Overall configuration of projection display device)
FIG. 1 is an explanatory diagram of a projection display device as an example of an electronic apparatus to which the present invention is applied, and FIGS. 1A and 1B show a planar configuration of a main part of the projection display device. It is explanatory drawing and explanatory drawing when a main part is seen from the side. FIG. 2 is an explanatory diagram showing the configuration of the optical unit used in the projection display device to which the present invention is applied.

  In the projection display device 1 shown in FIG. 1, a power supply unit 7 is disposed on the rear end side inside the exterior cases 2 and 5, and a light source lamp unit 8 (light source unit) is positioned adjacent to the power supply unit 7 on the front side of the device. ) And the optical unit 9 are arranged. Further, the base end side of the projection lens unit 6 is located in the center of the front side of the optical unit 9 inside the exterior case 2. On one side of the optical unit 9, an interface board 11 on which an input / output interface circuit is mounted is arranged in the front-rear direction of the apparatus, and a video board 12 on which a video signal processing circuit is mounted is parallel to the interface board 11. Has been placed. On the upper side of the light source lamp unit 8 and the optical unit 9, a control board 13 for device drive control is disposed, and speakers 14R and 14L are disposed on the left and right corners on the front end side of the device.

  Above and below the optical unit 9, intake fans 15A and 15B for cooling the inside of the apparatus are arranged. Further, an exhaust fan 16 is disposed on the side of the apparatus that is the back side of the light source lamp unit 8. Further, an auxiliary cooling fan 17 for sucking the cooling airflow from the intake fan 15A into the power supply unit 7 is disposed at a position facing the ends of the interface board 11 and the video board 12. Among these fans, the intake fan 15B mainly functions as a cooling fan for an electro-optical panel described later.

  In FIG. 2, each optical element (element) constituting the optical unit 9 includes an upper light guide 21 or a lower light guide 22 made of a metal such as Mg or Al, including the prism unit 20 constituting the color light combining means. Is supported by The upper light guide 21 and the lower light guide 22 are fixed to the upper case 3 and the lower case 4 with fixing screws.

(Detailed configuration of the optical unit 9)
FIG. 3 is an explanatory diagram showing a detailed configuration of the optical unit used in the projection display device to which the present invention is applied. As shown in FIG. 3, the optical unit 9 includes a light source lamp 805, an illumination optical system 923 having integrator lenses 921 and 922 that are uniform illumination optical elements, and a light beam W emitted from the illumination optical system 923 as red light. Color light separation optical system 924 that separates the light beams R, G, and B of green, blue. The optical unit 9 includes three transmissive electro-optical panels 40 (R), 40 (G), and 40 (B) as electro-optical panels (light valves) that modulate light beams of each color, and modulated colors. It has a prism unit 20 as a color light combining optical system for combining light beams, and a projection lens unit 6 for enlarging and projecting the combined light beams on the projection surface. In addition, a relay optical system 927 that guides the electro-optical panel 40 (B) corresponding to the blue light beam B out of the color light beams separated by the color light separation optical system 924 is provided.

  The illumination optical system 923 further includes a reflection mirror 931 so that the optical axis 1a of light emitted from the light source lamp 805 is bent at a right angle toward the front of the apparatus. The integrator lenses 921 and 922 are disposed so as to be orthogonal to each other with the reflection mirror 931 interposed therebetween.

  The color light separation optical system 924 includes a blue-green reflecting dichroic mirror 941, a green reflecting dichroic mirror 942, and a reflecting mirror 943. First, in the blue-green reflective dichroic mirror 941, the blue light beam B and the green light beam G included in the light beam W that has passed through the illumination optical system 923 are reflected at right angles to the green reflecting dichroic mirror 942 side. Head. The red light beam R passes through the blue-green reflecting dichroic mirror 941, is reflected at a right angle by the rear reflecting mirror 943, and is emitted from the red light beam emitting portion 944 to the color light combining optical system side. Next, in the green reflection dichroic mirror 942, only the green light beam G is reflected at right angles out of the blue and green light beams B and G reflected by the blue-green reflection dichroic mirror 941, and the color is emitted from the green light beam emitting portion 945. The light is emitted to the side of the photosynthetic optical system. The blue light beam B that has passed through the green reflecting dichroic mirror 942 is emitted from the blue light beam emitting portion 946 to the relay optical system 927 side. In this embodiment, the distances from the light beam emitting portion of the illumination optical system 923 to the color light beam emitting portions 944, 945, and 946 in the color light separation optical system 924 are all set to be substantially equal.

  Condensing lenses 951 and 952 are arranged on the emission side of the emission portions 944 and 945 of the red light beam and the green light beam of the color light separation optical system 924, respectively. Therefore, the red light beam and the green light beam emitted from each light emitting part are incident on these condenser lenses 951 and 952 and are collimated.

  The collimated red and green light beams R and G are incident on the electro-optical panels 40 (R) and 40 (G) after their polarization directions are aligned by the polarizing plates 160 (R) and 160 (G). Modulated and image information corresponding to each color light is added. That is, the electro-optical panels 40 (R) and 40 (G) are switching-controlled by an image signal corresponding to image information by a driving unit (not shown), thereby modulating each color light passing therethrough. Is called. As such driving means, known means can be used as they are.

  On the other hand, the blue light beam B is guided to the corresponding electro-optical panel 40 (B) through the relay optical system 927 and further aligned in the polarization direction by the polarizing plate 160 (B). Modulation is performed according to the image information. The relay optical system 927 is disposed on the front side of the condensing lens 974, the incident-side reflecting mirror 971, the emitting-side reflecting mirror 972, the intermediate lens 973 disposed between these mirrors, and the electro-optical panel 40 (B). Condensing lens 953 is comprised. As for the length of the optical path of each color beam, that is, the distance from the light source lamp 805 to each liquid crystal panel, the blue beam B is the longest, and the light amount loss of this beam is the greatest. However, the light loss can be suppressed by interposing the relay optical system 927.

  Each color light beam modulated through each electro-optical panel 40 (R), 40 (G), 40 (B) is incident on the polarizing plate 161 (R), 161 (G), 161 (B). The transmitted light is incident on the prism unit 20 (cross dichroic prism) and synthesized. The synthesized color image is enlarged and projected onto a projection surface 1b such as a screen at a predetermined position via a projection lens unit 6 having a projection optical system such as a projection lens.

[Configuration of electro-optical panel 40]
FIG. 4 is an explanatory diagram of the electro-optical panel 40 used in the electro-optical device to which the present invention is applied. FIGS. 4A and 4B each show the electro-optical panel 40 and each component of the second substrate. It is the top view seen from the side, and its HH 'sectional drawing.

  4 and the drawings to be described later, the traveling direction of the light source light is indicated by an arrow L11, and the traveling direction of the display light after the light source light is modulated by the electro-optical panel 40 is indicated by an arrow L12, which is shown in FIG. The flow of cooling air supplied to the electro-optical panel 40 by the intake fan 15B or the like is indicated by an arrow A. In the following description, one of the directions intersecting each other in the in-plane direction of the electro-optical panel 40 and the electro-optical device is defined as the X direction, the other is defined as the Y direction, and the direction intersecting the X direction and the Y direction is defined as the Z direction. To do. In the drawings referred to below, one side in the X direction is the X1 side, the other side is the X2 side, one side in the Y direction is the Y1 side, the other side is the Y2 side, and one side in the Z direction (light source) The side on which light is incident) is shown as the Z1 side, and the other side (the side on which the display light is emitted) is shown as the Z2 side.

  In the projection display device 1 described with reference to FIGS. 1 to 3, when the electro-optical panels 40 (R), 40 (G), and 40 (B) are mounted on the optical unit 9, the electro-optical panel 40 ( R), 40 (G), and 40 (B) are mounted as electro-optical devices 50 (R), 50 (G), and 50 (B), which will be described later. Here, the electro-optical panels 40 (R), 40 (G), and 40 (B) have the same configuration, and include the electro-optical panels 40 (R), 40 (G), and 40 (B). The electro-optical devices 50 (R), 50 (G), and 50 (B) also have the same configuration for red (R), green (G), and blue (B). Accordingly, in the following description, for the electro-optical panels 40 (R), 40 (G), 40 (B) and the electro-optical devices 50 (R), 50 (G), 50 (B), etc., the corresponding colors are used. It demonstrates without attaching | subjecting (R) (G) (B) which shows.

  As shown in FIG. 4, in the electro-optical panel 40, the light-transmitting first substrate 51 (element substrate) and the light-transmitting second substrate 52 (counter substrate) are separated by a sealing material 407 through a predetermined gap. It is pasted together. The first substrate 51 and the second substrate 52 are made of quartz glass, heat-resistant glass or the like. In this embodiment, the first substrate 51 and the second substrate 52 are made of quartz glass. In this embodiment, the electro-optical panel 40 is a liquid crystal panel, and the liquid crystal as the electro-optical material 450 is held in a region surrounded by the sealing material 407 between the first substrate 51 and the second substrate 52. The sealing material 407 is provided in a frame shape along the outer edge of the second substrate 52. The sealing material 407 is a photocuring adhesive layer, a thermosetting adhesive layer, or a resin material having both photocuring properties and thermosetting properties. A gap material such as glass fiber or glass bead is blended for setting the distance to a predetermined value.

  In this embodiment, the first substrate 51 has a quadrangular shape and includes end portions 511, 512, 513, and 514 each having four sides. Similarly to the first substrate 51, the second substrate 52 has a quadrangular shape and includes end portions 521, 522, 523, and 524 having four sides. A display area 40a that emits modulated light is provided as a square area in the approximate center of the electro-optical panel 40. Corresponding to this shape, the sealing material 407 is also provided in a substantially rectangular shape, and a rectangular frame-shaped peripheral region 40c is provided between the inner peripheral edge of the sealing material 407 and the outer peripheral edge of the display region 40a.

  In this embodiment, the first substrate 51 is larger in size than the second substrate 52, and the four end portions 511, 512, 513, 514 of the first substrate 51 are respectively the end portions 521, 522, 523, It projects outward from 524. Therefore, around the second substrate 52, step portions 40s, 40t, 40u, and 40v are formed by the first substrate 51 and the end portions 521, 522, 523, and 524 of the second substrate 52, and the step portion 40s. , 40t, 40u, 40v, the first substrate 51 is exposed from the second substrate 52. Of the four end portions 511, 512, 513, and 514, the end portion 514 located on one side Y1 in the Y direction is larger than the end portion 524 of the second substrate 52 than the other end portions 511, 512, and 513. The data line driving circuit 401 and a plurality of terminals 402 are formed along the end portion 514 on the first surface 51 a of the first substrate 51. A scanning line driving circuit 404 is formed on the first substrate 51 along the end portions 511 and 512.

  Of the first surface 51a and the second surface 51b of the first substrate 51, the first surface 51a facing the second substrate 52 corresponds to the light-transmitting pixel electrode 405a and the pixel electrode 405a in the display region 40a. Pixels including pixel transistors (switching elements / not shown) are formed in a matrix, and an alignment film 416 is formed on the upper side of the pixel electrode 405a. Further, on the first surface 51a of the first substrate 51, a dummy pixel electrode 405b that is formed simultaneously with the pixel electrode 405a is formed in the peripheral region 40c. For the dummy pixel electrode 405b, a configuration in which the dummy pixel transistor is electrically connected, a configuration in which the dummy pixel transistor is not provided, and a configuration in which the dummy pixel electrode is directly electrically connected to the wiring, or a floating state in which no potential is applied The structure which exists in is adopted.

  Of the first surface 52 a and the second surface 52 b of the second substrate 52, a light-transmitting common electrode 421 is formed on the first surface 52 a facing the first substrate 51. An alignment film 426 is formed. The common electrode 421 is formed across a plurality of pixels as a substantially entire surface of the second substrate 52 or as a plurality of strip-like electrodes. In this embodiment, the common electrode 421 is formed over a substantially entire surface of the second substrate 52. . In addition, a light shielding layer 408 is formed on the first surface 52 a of the second substrate 52 on the lower layer side of the common electrode 421. In this embodiment, the light shielding layer 408 is formed in a frame shape extending along the outer peripheral edge of the display region 40 a, and the display region 40 a is defined by the inner edge of the light shielding layer 408. The outer peripheral edge of the light shielding layer 408 is in a position with a gap between the inner peripheral edge of the sealing material 407 and the light shielding layer 408 and the sealing material 407 are not covered. In the second substrate 52, a light shielding layer formed simultaneously with the light shielding layer 408 may be formed as a black matrix or a black stripe in a region overlapping with a region sandwiched between adjacent pixel electrodes 405a.

  On the first substrate 51, an inter-substrate conduction electrode for establishing electrical continuity between the first substrate 51 and the second substrate 52 in a region overlapping the corner portion of the second substrate 52 outside the sealing material 407. 409 is formed. An inter-substrate conductive material 409a containing conductive particles is disposed between the inter-substrate conductive electrode 409 and the second substrate 52, and the common electrode 421 of the second substrate 52 includes the inter-substrate conductive material 409a and the substrate. It is electrically connected to the first substrate 51 side via the inter-connection electrode 409. For this reason, a common potential is applied to the common electrode 421 from the first substrate 51 side. The sealing material 407 is provided along the outer peripheral edge of the second substrate 52 with substantially the same width dimension. However, the sealing material 407 is provided so as to pass through the inside avoiding the inter-substrate conduction electrode 409 in a region overlapping the corner portion of the second substrate 52.

  In the electro-optical panel 40 having such a configuration, in this embodiment, since the pixel electrode 405a and the common electrode 421 are formed of a light-transmitting conductive film such as an ITO film, the electro-optical panel 40 is a transmissive liquid crystal panel. In the case of such a transmissive liquid crystal panel (electro-optical panel 40), light is incident while light incident from one of the first substrate 51 and the second substrate 52 is transmitted through the other substrate and emitted. Is done. In this embodiment, light (indicated by an arrow L11) incident from the second substrate 52 is transmitted through the first substrate 51 and emitted as modulated light (indicated by an arrow L12). For this reason, the second substrate 52 is disposed on one side Z1 in the Z direction, and the first substrate 51 is disposed on the other side Z2 in the Z direction. Note that when the common electrode 421 is formed using a light-transmitting conductive film and the pixel electrode 405a is formed using a reflective conductive film, a reflective liquid crystal panel can be formed. In the case of a reflective liquid crystal panel, light incident from the second substrate 52 side is modulated while being reflected and emitted by the first substrate 51 side. Since the electro-optical panel 40 of this embodiment is used as a light valve in the above-described projection display device (liquid crystal projector), no color filter is formed. However, when the electro-optical panel 40 is used as a direct-view color display device for an electronic apparatus such as a mobile computer or a mobile phone, a color filter is formed on the second substrate 52.

[First example of electro-optical device 50]
(Overall configuration of electro-optical device 50)
FIG. 5 is a perspective view of a first example of an electro-optical device to which the present invention is applied. FIGS. 5A and 5B are schematic views of the electro-optical device 50 viewed from one side Z1 in the Z direction. And a perspective view schematically showing the electro-optical device 50 as viewed from the other side Z2 in the Z direction. 6 is an exploded perspective view of the electro-optical device shown in FIG. FIG. 7 is a sectional view showing a first example of the electro-optical device 50 shown in FIG. In FIG. 7, the sealing material 407 and the electro-optical material 450 are not shown. In FIGS. 5 and 6, the number of terminals 402 and external terminals 881 is smaller than that in FIG.

  As shown in FIGS. 5, 6, and 7, the electro-optical device 50 of this embodiment is disposed on the opposite side of the electro-optical panel 40 and the first substrate 51 of the electro-optical panel 40 from the second substrate 52. The flat first sealing substrate 60, the flat second sealing substrate 70 disposed on the opposite side of the first substrate 51 with respect to the second substrate 52 of the electro-optical panel 40, and the electric in plan view. A frame-shaped ceramic package 80 surrounding the first substrate 51 and the second substrate 52 of the optical panel 40 is provided. The electro-optical panel 40 includes a light-transmitting first substrate 51 and a light-transmitting second substrate 52 facing the first substrate 51, and the electro-optical panel 40 is provided between the first substrate 51 and the second substrate 52. Is provided with a sealing material 407 and an electro-optical material 450 (see FIG. 4).

  The first sealing substrate 60 has a rectangular planar shape larger than that of the first substrate 51, and at least the display region 40a has translucency. In the present embodiment, the first sealing substrate 60 includes a first frame-shaped member 61 in which at least a region facing the display region 40 a is the first opening 611 and glass disposed inside the first opening 611. The 1st translucent board 62, etc. are provided, and the 1st frame-shaped member 61 and the 1st translucent board 62 are joined over the perimeter. The first frame member 61 is made of, for example, metal and has a light shielding property.

  The second sealing substrate 70 has a rectangular planar shape larger than that of the second substrate 52, and at least a region facing the display region 40a has translucency. In the present embodiment, the second sealing substrate 70 includes a second frame member 71 having at least the display area 40a as the second opening 711, and a second glass or the like disposed inside the second opening 711. A light transmitting plate 72 is provided, and the second frame-like member 71 and the second light transmitting plate 72 are joined over the entire circumference. The second frame member 71 is made of, for example, metal and has a light shielding property.

  The ceramic package 80 has a quadrangular frame shape and has four side wall portions 81, 82, 83, 84. Side wall portions 87 extending in the Z direction are formed on the side wall portions 81, 82, 83, 84, and a portion 871 extending to one side Z <b> 1 in the Z direction in the side plate portion 87 is a second sealing substrate. A portion 872 that covers the side surface 70 and extends to the other side Z2 in the Z direction in the side plate portion 87 covers the side surface of the first sealing substrate 60.

  Further, in the Z direction, the first end face 86a on the first sealing substrate 60 side (the other side Z2 in the Z direction) of the ceramic package 80 is the same as the surface on the other side Z2 in the Z direction of the first sealing substrate 60. The second end face 86b on the second sealing substrate 70 side (one side Z1 in the Z direction) of the ceramic package 80 is located at the same position as the surface on the one side Z1 in the Z direction of the second sealing substrate 70. is there.

  Further, the side wall portions 81, 82, 83, 84 are adjacent to the first plate portion 89 projecting inward (on the electro-optical panel 40 side) on the other side Z 2 in the Z direction with respect to the first plate portion 89. The second plate portion 85 protrudes inward at the position, and the second plate portion 85 protrudes from the first plate portion 89 toward the electro-optical panel 40 side.

  Of the second plate portion 85, an internal terminal 882 is formed on the surface on one side Z <b> 1 in the Z direction of the second plate portion 85 formed on the side wall portion 81. The internal terminal 882 and the terminal 402 of the electro-optical panel 40 are electrically connected by a wiring material 403 such as a bonding wire or a flexible wiring board.

  In the ceramic package 80, a plurality of external terminals 881 are formed on the first end surface 86a of the first end surface 86a and the second end surface 86b. The external terminal 881 and the internal terminal 882 are electrically connected via a wiring portion 889 that penetrates the side wall portion 81.

  The ceramic package 80 having such a configuration is designed by mixing and pulverizing ceramic raw material powder, an organic binder, an organic solvent, and the like, and then designing a plurality of molded green sheets in accordance with the shape of the ceramic package 80, and then a plurality of green sheets. Are laminated and fired. Therefore, the ceramic package 80 includes a plurality of layers. The ceramic package 80 according to the present embodiment includes the first layer 80a, the second layer 80b, the third layer 80c, and the first layer 80c from the other side Z2 in the Z direction toward the one side Z1. It has a four-layer structure in which four layers 80d are stacked. Further, the green sheet is perforated and printed with a conductor pattern. By such conductor pattern printing, the ceramic package 80 has the internal terminals 882, the external terminals 881, and the wiring embedded in the ceramic package 80. Part 889 is configured.

(Detailed configuration of electro-optical device 50)
As shown in FIG. 7, the first sealing substrate 60 includes a first frame-shaped member 61 and a first light-transmitting plate 62 positioned inside the first opening 611 of the first frame-shaped member 61. In this embodiment, the first frame-like member 61 and the first light transmitting plate 62 are integrally formed products. For this reason, the 1st frame-shaped member 61 and the 1st translucent board 62 are joined over the perimeter in the step which shape | molded the 1st sealing substrate 60. FIG. In the first sealing substrate 60, the first frame member 61 is made of metal, for example, aluminum around the first light transmitting plate 62 in a state where the glass first light transmitting plate 62 is disposed in the mold. It is manufactured by sintering powders such as copper and iron. At that time, it is preferable to use a slip casting method. In the slip casting method, a powder for sintering is mixed with a solvent to form a slurry, and the slurry is injected into a mold. Therefore, since it is not necessary to pressurize, the crack of a sintered part etc. can be prevented. In this embodiment, there is no step at the boundary between the first frame-shaped member 61 and the first translucent plate 62, and the plane is a continuous plane. Such a configuration can be realized by polishing. In addition, after arrange | positioning the 1st frame-shaped member 61 in a metal mold | die, the 1st sealing substrate 60 may be manufactured by filling low melting glass between the 1st frame-shaped member 61 and a metal mold | die.

  Similarly to the first sealing substrate 60, the second sealing substrate 70 includes a second frame-shaped member 71 and a second translucent plate 72 located inside the second opening 711 of the second frame-shaped member 71. In this embodiment, the second frame-like member 71 and the second translucent plate 72 are integrally formed products. For this reason, the 2nd frame-shaped member 71 and the 2nd translucent board 72 are joined over the perimeter in the step which shape | molded the 2nd sealing substrate 70. FIG. In the second sealing substrate 70, the second frame member 71 is made of metal, for example, aluminum around the second light transmitting plate 72 in a state where the glass second light transmitting plate 72 is disposed in the mold. It is manufactured by sintering powders such as copper and iron. In this embodiment, there is no step at the boundary between the second frame-shaped member 71 and the second translucent plate 72, and the plane is a continuous plane. Alternatively, the second sealing substrate 70 may be manufactured by placing the second frame member 71 in the mold and then filling low melting point glass between the second frame member 71 and the mold.

  The ceramic package 80 includes a surface on the other side Z2 in the Z direction of each side wall portion 81, 82, 83, 84 (a surface on the other side Z2 in the Z direction of the second plate portion 85) and the first side of the first sealing substrate 60. The surface of one frame-like member 61 on one side Z1 in the Z direction is joined to the entire circumference by a first joining material 91 made of an inorganic material. In addition, the ceramic package 80 includes a surface on one side Z1 in the Z direction of each side wall portion 81, 82, 83, 84 (a surface on one side Z1 in the Z direction of the first plate portion 89) and the second sealing substrate 70. The surface of the second frame member 71 on the other side Z2 in the Z direction is joined to the entire circumference by a second joining material 92 made of an inorganic material.

  The first bonding material 91 and the second bonding material 92 are made of a low melting point metal material. For example, the first bonding material 91 and the second bonding material 92 are made of an alloy material (gold solder) of Au (gold) and Sn (tin) or the like, and are low melting point metals. Therefore, in a state where the first bonding material 91 is disposed between the ceramic package 80 and the first frame member 61 of the first sealing substrate 60, the first bonding material 91 is heated to a temperature equal to or higher than the melting point of the first bonding material 91. If the ceramic package 80 is pressed in the Z direction toward the first frame member 61 of the first sealing substrate 60 while being heated, the first sealing substrate 60 and the ceramic package 80 are bonded by the first bonding material 91. Joined over the entire circumference. The first bonding material 91 may be provided on either the first sealing substrate 60 side or the ceramic package 80 side in the stage before bonding, but in this embodiment, the first sealing substrate 60 is provided. A first bonding material 91 is provided on this side. In addition, in a state where the second bonding material 92 is disposed between the ceramic package 80 and the second frame member 71 of the second sealing substrate 70, the second bonding material 92 is heated to a temperature equal to or higher than the melting point of the second bonding material 92. If the second frame-like member 71 of the second sealing substrate 70 is pressed in the Z direction toward the ceramic package 80 while heating the second sealing substrate 70, the second sealing substrate 70 and the ceramic package 80 become the second bonding material 92. Are joined all around. The second bonding material 92 may be provided on either the second sealing substrate 70 side or the ceramic package 80 side before the bonding, but in this embodiment, on the ceramic package 80 side. A second bonding material 92 is provided.

  In this embodiment, a first light transmissive material layer 93 is provided at least in the display region 40a between the first substrate 51 and the first sealing substrate 60. In the display region 40a, the first substrate 51 and There is no air layer between the first sealing substrate 60 and the first sealing substrate 60. Further, a second light transmissive material layer 94 is provided at least in the display region 40a between the second substrate 52 and the second sealing substrate 70. In the display region 40a, the second substrate 52 and the second sealing substrate 70 are provided. There is no air layer between the sealing substrate 70 and the sealing substrate 70. For this reason, reflection hardly occurs between the first substrate 51 and the first sealing substrate 60 or between the second substrate 52 and the second sealing substrate 70. Therefore, the quality of the display image can be improved.

  In the electro-optical device 50 configured as described above, as the first light transmissive material layer 93 and the second light transmissive material layer 94, a light transmissive adhesive layer having an adhesive ability can be used, and an adhesive ability can be used. It is also possible to use a filler that does not have. In any case, it is preferable that the first light transmissive material layer 93 and the second light transmissive material layer 94 have elasticity such as a gel material. According to such a configuration, dimensional errors of the first sealing substrate 60, the second sealing substrate 70, the ceramic package 80, and the like are caused by elastic deformation of the first light transmissive material layer 93 or the second light transmissive material layer 94. Can be absorbed.

(Configuration of external terminal 881 etc.)
In the electro-optical device 50 of this embodiment, a plurality of internal terminals 882 are formed on one side Z <b> 1 of the second plate portion 85 in the Z direction on the side wall portion 81 of the ceramic package 80. Therefore, the plurality of internal terminals 882 are made of a conductor formed on the surface on the one side Z1 in the Z direction of the second layer 80b of the ceramic package 80.

  On the other hand, the plurality of external terminals 881 are formed on the first end face 86 a on the first sealing substrate 60 side (the other side Z <b> 2 in the Z direction) in the side wall portion 81 of the ceramic package 80. For this reason, the plurality of external terminals 881 are made of a conductor formed on the surface on the other side Z2 in the Z direction of the first layer 80a of the ceramic package 80.

  Therefore, the wiring portion 889 that electrically connects the internal terminal 882 and the external terminal 881 has the conductor 883 formed on the surface on the one side Z1 in the Z direction of the second layer 80b of the ceramic package 80. An internal terminal 882 is formed by a part of the conductor 883. The wiring portion 889 includes a conductor 884 provided inside the through hole 80s that penetrates the second layer 80b, and a surface on the other side Z2 in the Z direction of the second layer 80b (or the Z direction of the first layer 80a). The conductor 885 formed on the one side Z1) and the conductor 886 provided inside the through hole 80t that penetrates the first layer 80a.

  In the electro-optical device 50 configured as described above, the external terminal 881 is connected to the flexible wiring substrate 101 connected to the first end face 86 a of the ceramic package 80. Accordingly, power can be supplied to the electro-optical panel 40 via the flexible wiring board 101.

(Main effects of the first example)
As described above, in the electro-optical device 50 of this embodiment, the first sealing substrate 60, the second sealing substrate 70, and the ceramic package 80 surround the first substrate 51 and the second substrate 52 of the electro-optical panel 40. Covered. Further, the ceramic package 80 and the first sealing substrate 60 are sealed by the first bonding material 91, and the ceramic package 80 and the second sealing substrate 70 are sealed by the second bonding material 92. Therefore, the first substrate 51 and the second substrate 52 of the electro-optical panel 40 are surrounded by the first sealing substrate 60, the second sealing substrate 70, the ceramic package 80, the first bonding material 91, and the second bonding material 92. It is sealed. In addition, since the first bonding material 91 and the second bonding material 92 are made of an inorganic material, moisture is less likely to permeate than the resin-based bonding material. Therefore, deterioration of the electro-optical material 450 due to moisture can be prevented.

  In addition, since the first sealing substrate 60 and the second sealing substrate 70 are flat, they can be manufactured at low cost and the assembly of the electro-optical device 50 is easy. In addition, since the first sealing substrate 60 and the second sealing substrate 70 have a flat plate shape, the first sealing substrate and the second sealing substrate 70 are deformed or damaged even when heated when bonded to the ceramic package 80. Is unlikely to occur.

  Further, the terminal 402 of the electro-optical panel 40 is electrically connected to the internal terminal 882 of the ceramic package 80, and the internal terminal 882 is electrically connected to the external terminal 881 via the wiring portion 889 that penetrates the ceramic package 80. Has been. For this reason, moisture is less likely to enter the inside of the ceramic package 80 than the structure in which the flexible wiring board connected to the electro-optical panel 40 is drawn to the outside of the ceramic package 80.

  The external terminal 881 is provided on the first end face 86 a of the ceramic package 80, and the external terminal 881 is not provided on the side surface of the ceramic package 80. Therefore, the electro-optical device 50 can be reduced in size, and other structures can be disposed near the side surface of the electro-optical device 50. For example, the same effects as those obtained when the electro-optical device 50 is reduced in size can be obtained. Play. Further, unlike the case where the pin-shaped external leads that stand up frontward on the side surface of the ceramic package 80 are provided, the manufacturing cost can be reduced.

  Further, the sealing by the first bonding material 91 and the second bonding material 92 is performed between the ceramic package 80 and the first sealing substrate 60 and between the ceramic package 80 and the second sealing substrate 70. Therefore, when the first bonding material 91 and the second bonding material 92 are provided, excessive thermal stress is not easily applied to the first substrate 51 and the second substrate 52. Therefore, the first substrate 51 and the second substrate 52 are unlikely to be deformed or damaged by heat.

  In the first sealing substrate 60 and the second sealing substrate 70, the first frame member 61 and the second frame member 71 are made of metal. For this reason, the heat generated in the electro-optical panel 40 can be efficiently released via the first frame-shaped member 61 and the second frame-shaped member 71.

  Further, in the first sealing substrate 60 and the second sealing substrate 70, the first frame member 61 and the first light transmission plate 62 are integrally formed products, and the second frame member 71 and the second light transmission plate 72. Is an integrally molded product. For this reason, since it is not necessary to perform the process of joining the 2nd frame-shaped member 71 and the 2nd light transmission board 72 between the 1st frame-shaped member 61 and the 1st light transmission board 62, it is 1st sealing. The manufacturing cost of the substrate 60 or the second sealing substrate 70 and the manufacturing cost of the electro-optical device 50 can be reduced. The first light transmissive plate 62 and the second light transmissive plate 72 function as a dust proof plate that prevents foreign substances such as dust from directly adhering to the electro-optical panel 40. For this reason, it is difficult for foreign matter to appear in the projected image.

[Second Example of Electro-Optical Device 50]
FIG. 8 is a cross-sectional view of a second example of an electro-optical device to which the present invention is applied. In FIG. 8, the sealing material 407 and the electro-optical material 450 are not shown. In addition, since the basic configuration of this example is the same as that of the first example, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 8, in this example, solder balls 103 are provided on the external terminals 881. For this reason, the rigid substrate 102 or the like can be connected to the external terminal 881 using the solder ball 103.

[Third example of electro-optical device 50]
FIG. 9 is a cross-sectional view of a third example of the electro-optical device to which the invention is applied. In FIG. 9, illustration of the sealing material 407 and the electro-optical material 450 is omitted. In addition, since the basic configuration of this example is the same as that of the first example, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 9, in this example, the external terminal 881 is provided with a terminal pin 104 erected from the first end face 86a toward the other side Z2 in the Z direction. The terminal pin 104 is fixed in a state in which a part thereof is fitted inside the through hole 80t. According to such a configuration, the connector 105 or the like can be connected using the terminal pin 104.

[Fourth Example of Electro-Optical Device 50]
FIG. 10 is a perspective view of a fourth example of an electro-optical device to which the present invention is applied. FIGS. 10A and 10B are schematic views of the electro-optical device 50 as viewed from one side Z1 in the Z direction. And a perspective view schematically showing the electro-optical device 50 as viewed from the other side Z2 in the Z direction. In FIG. 10, the number of external terminals 881 is less than the actual number.

  In the above configuration example, the external terminal 881 is provided only along the side wall 81 of the ceramic package 80. However, in this embodiment, the external terminal 881 is provided with at least two side walls of the ceramic package 80 as shown in FIG. Are arranged along the section. More specifically, the external terminals 881 are arranged along the side wall part 81 and are also provided along the side wall part 83 facing the side wall part 81. Furthermore, the external terminals 881 are also arranged along the side wall portions 82 and 84 located between the side wall portions 81 and 83.

  According to such a configuration, since there are few restrictions on the space where the external terminal 881 is provided, the external terminal 881 can be appropriately disposed, for example, the external terminal 881 can be disposed at a sufficient interval. Therefore, the electro-optical device 50 is suitable for supplying power and inputting signals to a large number of terminals 402 of the electro-optical panel 40 via the ceramic package 80.

  In the case of such a configuration, a flexible wiring board may be connected to each of the side wall parts 81, 82, 83, 84, and each side wall part of the rectangular frame-shaped flexible wiring board is connected to the side wall parts 81, 82, 83, 84 may be connected.

  In FIG. 10, the first example is used as a base. However, as in the second example, when the solder ball 103 is used, a configuration in which the external terminals 881 are provided along a plurality of side walls may be adopted. Good. In the case of such a configuration, the rigid substrate 102 may be connected to each of the side wall portions 81, 82, 83, 84, and each side wall portion of the rectangular frame-shaped rigid substrate 102 is connected to the side wall portions 81, 82, 83, 84 may be connected.

  Further, as in the third example, when the terminal pin 104 is used, a configuration in which the external terminal 881 is provided along a plurality of side walls may be employed. In such a configuration, the connector 105 may be connected to each of the side wall parts 81, 82, 83, 84, and each side wall part of the rectangular tubular connector 105 is connected to the side wall parts 81, 82, 83, 84. You may connect.

[Other embodiments]
In the above embodiment, the external terminals 881 are provided on the first end face 86a of the ceramic package 80, but the external terminals 881 may be provided on the second end face 86b of the ceramic package 80.

  In the above embodiment, the first light-transmissive material layer 93 is provided between the first substrate 51 and the first sealing substrate 60, and the second light-transmitting material layer 93 is provided between the second substrate 52 and the second sealing substrate 70. Although the translucent material layer 94 is provided, there is a gap between at least one of the first substrate 51 and the first sealing substrate 60 and between the second substrate 52 and the second sealing substrate 70. May be provided. According to such a configuration, there is an advantage that heat at the time of bonding by the first bonding material 91 or the second bonding material 92 is not easily transmitted to the electro-optical panel 40.

  In the above embodiment, the case where the transmissive electro-optical panel 40 is used is exemplified, but the reflective electro-optical panel 40 (reflective liquid crystal panel), organic electroluminescence display panel, plasma display panel, FED, etc. The present invention may be applied when a (Field Emission Display) panel, an SED (Surface-Conduction Electron-Emitter Display) panel, an LED (Light Emitting Diode) display panel, an electrophoretic display panel, or the like is used. In this case, the side from which the electro-optical panel 40 display light is emitted is directed toward the first sealing substrate 60. In this case, in the second sealing substrate 70, the display region 40a does not need to have translucency. Alternatively, the bottom plate portion may be provided in the ceramic package 80 without providing the second sealing substrate 70, and the one side Z1 in the Z direction may be sealed by the bottom plate portion.

  In the said embodiment, although the front projection type display apparatus which projects from the direction which observes a projected image as a projection type display apparatus was illustrated, the rear projection type display apparatus which projects from the opposite side to the direction which observes a projected image The present invention may be applied to a projection display device used for the above.

  As for the electro-optical device to which the present invention is applied, in addition to the electronic device (projection display device) described above, a head mounted display, a mobile phone, a personal digital assistant (PDA), a digital camera, a liquid crystal television, You may use as a direct view type display apparatus in electronic devices, such as a car navigation apparatus, a videophone, a POS terminal, and an apparatus provided with a touch panel.

1 .... Projection type display device, 50 ... Electro-optical device, 40 ... Electro-optical panel (liquid crystal panel), 40a ... Display area, 51 ... First substrate (element substrate), 52 ... Second substrate ( Counter substrate), 60... First sealing substrate, 61... First frame member, 62... First translucent plate, 70... Second sealing substrate, 71. .. Second translucent plate, 80 .. Ceramic package, 80a .. First layer, 80b .. Second layer, 80c .. Third layer, 80d .. Fourth layer, 80s, 80t .. Through hole, 81-84 .. side wall part, 85 .. second plate part, 86a .. first end face, 86b .. second end face, 87 .. side plate part, 89 .. first plate part, 91. Material 92 .. Second bonding material 102 .. Terminal 407 .. Seal material 450 .. Electro-optic material 611 .. First opening 711 · The second opening, 881 ... external terminals, 882 ... internal terminal, 889 ... wire portion

Claims (10)

An electro-optical panel including a first substrate having terminals formed on one side;
A ceramic package surrounding the electro-optic panel in plan view;
A first sealing substrate facing the electro-optical panel and having at least a region facing the display region having translucency;
A first bonding material for bonding the first sealing substrate and the ceramic package over the entire circumference;
Have
The ceramic package includes an internal terminal electrically connected to the terminal on the electro-optical panel side of the ceramic package, a first end surface of the ceramic package on the first sealing substrate side, and the first sealing substrate. An external terminal provided on one of the second end surfaces opposite to the side, and a wiring portion that penetrates the ceramic package and electrically connects the internal terminal and the external terminal. Electro-optical device characterized.   2. The electro-optical device according to claim 1, wherein the external terminals are arranged along at least two side wall portions of the ceramic package on one of the first end surface and the second end surface.   The electro-optical device according to claim 1, wherein a solder ball is provided on the external terminal.   The electro-optical device according to claim 1, wherein the external terminal is provided with a terminal pin. The first sealing substrate includes a first frame-shaped member having a first opening at least in the display region, and a first light-transmitting member provided in the first opening and bonded to the first frame-shaped member. A board,
5. The electro-optical device according to claim 1, wherein the first frame-shaped member and the ceramic package are bonded over the entire circumference by the first bonding material. 6. The ceramic package has a frame shape,
A second sealing substrate facing the electro-optical panel on the side opposite to the first sealing substrate with respect to the electro-optical panel;
A second bonding material for bonding the second sealing substrate and the ceramic package over the entire circumference;
The electro-optical device according to claim 1, wherein the electro-optical device is provided.   The electro-optical device according to claim 6, wherein at least a region of the second sealing substrate facing the display region is translucent. The second sealing substrate is provided in a second frame-shaped member having a second opening at least in a region facing the display region, and provided in the second opening, and extends over the entire circumference of the second frame-shaped member. A second translucent plate joined,
The electro-optical device according to claim 7, wherein the second frame-shaped member and the ceramic package are bonded over the entire circumference by the second bonding material.   The electro-optical panel includes: a second substrate facing the first substrate; a sealing material provided between the first substrate and the second substrate; and a space between the first substrate and the second substrate. The electro-optical device according to claim 1, further comprising: an electro-optical material held on the electro-optical material. A projection display device comprising the electro-optical device according to any one of claims 1 to 9,
A light source unit that emits light supplied to the electro-optical device;
A projection optical system that projects light modulated by the electro-optical device;
A projection display device characterized by comprising:

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