JP2013242458A - Electro-optical module, projection type display device and manufacturing method of electro-optical module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electro-optical module that can prevent occurrence of a gap between a translucent plate and a heat dissipation member at one surface side of an electro-optical panel while being capable of reducing a number of components and assembly man-hours, and further to provide a projection type display device provided with the electro-optical module and a manufacturing method of the electro-optical module.SOLUTION: In an electro-optical module 10, a first translucent plate 56 made of quartz glass is provided on a second surface 51b of a first substrate 51 of an electro-optical panel 40. The first translucent plate 56 is smaller in size than the first substrate 51, and ends of the first substrate 51 are exposed from the first translucent plate 56. A metallic heat dissipation member 70 is provided to overlap with exposed portions of the first substrate 51 from the first translucent plate 56, and the first translucent plate 56 and the heat dissipation member 70 are formed of an integrally molded composite component 30.

Description

  The present invention relates to an electro-optic module used in an electronic apparatus such as a projection display device, a projection display device including the electro-optic module, and a method for manufacturing the electro-optic module.

  When an image is displayed on an electronic device such as a projection display device, light modulated by an electro-optical panel such as a liquid crystal panel is used. Such an electro-optical panel has, for example, a configuration in which an electro-optical material layer such as a liquid crystal layer is provided between a first substrate and a second substrate. A translucent plate is attached.

  In the electro-optical panel having such a configuration, when the temperature of the electro-optical panel rises due to heat generated by the electro-optical panel itself or heat generated by incidence of light source light, deterioration of the electro-optical material layer occurs. For this reason, when an electro-optical panel is mounted on an electronic device as an electro-optical module, for example, a metal frame is overlaid on the exposed portion of the electro-optical panel from the light transmitting plate, and the heat of the electro-optical panel is reduced. There has been proposed an electro-optic module having a structure that allows it to escape (see Patent Document 1).

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  However, as in the configuration described in Patent Document 1, after the translucent plate is attached to the electro-optical panel, the metal frame is overlaid on the exposed portion of the electro-optical panel from the translucent plate. In addition to the large amount of time required for assembly, there is a problem that costs increase.

  In addition, in the configuration in which the metal frame is overlapped with the exposed portion of the electro-optical panel from the translucent plate, a gap is likely to be generated between the translucent plate and the frame, and foreign matter such as dust starts from the gap. As it accumulates, there is a problem that foreign matters such as dust appear in the image.

  In view of the above problems, an object of the present invention is to reduce the number of parts and the number of assembly steps, and a gap is generated between the translucent plate and the heat dissipation member on one surface side of the electro-optical panel. It is an object of the present invention to provide an electro-optic module that can prevent this, a projection display device including the electro-optic module, and a method for manufacturing the electro-optic module.

  In order to solve the above-described problems, an electro-optical module according to the present invention includes an electro-optical panel and a transparent layer that overlaps at least an image display region of the electro-optical panel with one surface of the electro-optical panel partially exposed. A heat dissipating member made of a material having a thermal conductivity higher than that of the light transmitting plate, provided on the one surface of the electro-optical panel so as to overlap an exposed portion from the light transmitting plate; The translucent plate and the heat radiating member are formed of a composite part integrally formed.

  The “translucent” in the present invention means that it is sufficient to have at least translucency for light to be modulated and light to be transmitted.

  In the present invention, since the translucent plate is provided so as to overlap the image display region, dust hardly adheres to a position close to the electro-optical material layer. Accordingly, even when an image generated by the electro-optical panel is projected, the influence of dust is less likely to affect the image. Here, the translucent plate is provided so as to expose a part of one surface of the electro-optical panel, and has a thermal conductivity higher than that of the translucent plate so as to overlap an exposed portion of the electro-optical panel from the translucent plate. A heat dissipating member made of a high material is provided. For this reason, since the heat generated in the electro-optical panel can be efficiently released through the heat radiating member, it is possible to suppress deterioration in display quality due to the temperature increase of the electro-optical panel. Moreover, since the translucent plate and the heat radiating member are composed of integrally molded composite parts, the number of parts can be reduced and the number of assembly steps can be reduced. Moreover, since the translucent plate and the heat radiating member are integrally formed, a gap in which foreign matter such as dust is accumulated does not occur between the translucent plate and the heat radiating member. Therefore, it is possible to avoid a situation in which foreign matter such as dust accumulates in the gap and foreign matter such as dust appears in the image.

  In this invention, it is preferable that the boundary part of the said light-transmitting plate and the said heat radiating member is a continuous plane in the surface on the opposite side to the said electro-optical panel of the said composite component. According to such a configuration, since there is no step at the boundary portion between the light transmissive plate and the heat radiating member, when the cooling air flows along the light transmissive plate, the flow of the cooling air is disturbed by the step and the cooling effect is reduced. The situation can be avoided. Moreover, a situation in which foreign matter such as dust accumulates on the step does not occur.

  In the present invention, it is preferable that the translucent plate is made of glass and the heat dissipation member is made of metal. According to such a configuration, since the heat conductivity of the heat radiating member is high, the heat generated in the electro-optical panel can be efficiently released through the heat radiating member.

  In this case, the heat dissipation member is preferably a metal sintered body. Since the metal sintered body can be molded at a relatively low temperature, the light-transmitting plate is hardly deteriorated during molding.

  In the present invention, the translucent plate is smaller in size than the electro-optical panel, and in plan view, the end of the translucent plate is connected to the end of the electro-optical panel and the image over the entire circumference of the translucent plate. It is preferable that the heat dissipating member is provided so as to surround the translucent plate all around the display region. According to such a configuration, since the overlapping area between the exposed portion of the electro-optical panel from the translucent plate and the heat radiating member is large, heat generated in the electro-optical panel can be efficiently released through the heat radiating member.

  In this invention, it is preferable that the said heat radiating member comprises the parting with respect to the said electro-optical panel. According to such a configuration, it is not necessary to separately provide a parting member. Moreover, since the light-transmitting plate and the heat radiating member are made of an integrally molded composite part, no gap that causes light leakage occurs between the light-transmitting plate and the heat radiating member.

  In the present invention, the electro-optical panel includes a light-transmitting first substrate, a second substrate disposed opposite to the first substrate, and a liquid crystal provided between the first substrate and the second substrate. A configuration including a layer can be employed.

  In this case, the first substrate is an element substrate including a pixel electrode and a switching element provided corresponding to the pixel electrode, and the one surface of the electro-optical panel is the liquid crystal layer of the first substrate. It is preferable that it is comprised by the surface on the opposite side. By adopting such a configuration, the heat generated in the first substrate can be efficiently released through the heat dissipation member.

  In the present invention, it is preferable that in the composite component, both the light transmitting plate and the heat radiating member are bonded to the electro-optical panel. According to this structure, it can prevent that a translucent board and a thermal radiation member isolate | separate. In addition, since there is no air layer between the translucent plate and the electro-optical panel, it is difficult for reflection to occur when light is transmitted. Furthermore, since there is no air layer between the heat radiating member and the electro-optical panel, heat generated in the electro-optical panel can be efficiently released to the heat radiating member.

  In the present invention, a frame that supports the electro-optical panel from the side is provided, and the frame is made of a material having a higher thermal conductivity than the translucent plate, and the heat dissipation member overlaps the frame in plan view. Preferably it is. According to such a configuration, the heat generated in the electro-optical panel can be released to the frame via the heat radiating member.

  In the present invention, the composite part and the electro-optical panel are fixed by a first adhesive, and the frame and the electro-optical panel are fixed by a second adhesive different from the first adhesive. Is preferred. According to this configuration, an optimum adhesive can be used for each use site.

  For example, the first adhesive preferably has a higher visible light transmittance and thermal conductivity than the second adhesive. According to such a configuration, absorption of light emitted from the electro-optical panel and light incident on the electro-optical panel can be suppressed low. Further, the heat generated in the electro-optical panel can be efficiently released to the heat radiating member.

  The present invention is effective when applied to a case where the electro-optic module is used in a projection display device, and the projection display device includes a light source unit that emits light supplied to the electro-optic module, and the electro-optic module. A projection optical system for projecting light modulated by the module. In the case of the projection display device, strong light source light is incident on the electro-optical panel. However, according to the present invention, the temperature rise of the electro-optical panel can be suppressed low. In addition, in the case of a projection display device, there is a problem that foreign matter such as dust is noticeable when it appears in an image, but according to the present invention, it is possible to prevent foreign matter such as dust from appearing in an image. Can do.

  In addition, the present invention provides an electro-optical panel having an image display area, and is disposed on one surface side of the electro-optical panel so as to overlap at least the image display area, and a part of the one surface of the electro-optical panel. And a heat radiating member that is provided so as to overlap the part and that has a higher thermal conductivity than the translucent plate. Then, after one of the translucent plate and the heat radiating member is disposed inside a mold, the translucent plate and the heat radiating member are filled with a material constituting the other of the translucent plate and the heat radiating member. An integral molding step of integrally molding a heat dissipating member; and an overlapping step of superimposing the integrally formed light transmitting plate and the heat dissipating member on the one surface side of the electro-optic panel. Do

  According to such a configuration, since the light transmitting plate is provided so as to overlap the image display region, it is difficult for dust to adhere to a position near the electro-optical material layer. Accordingly, even when an image generated by the electro-optical panel is projected, the influence of dust is less likely to affect the image. Here, the translucent plate is provided so as to expose a part of one surface of the electro-optical panel, and has a thermal conductivity higher than that of the translucent plate so as to overlap an exposed portion of the electro-optical panel from the translucent plate. A heat dissipating member made of a high material is provided. For this reason, since the heat generated in the electro-optical panel can be efficiently released through the heat radiating member, it is possible to suppress deterioration in display quality due to the temperature increase of the electro-optical panel. Moreover, since the light-transmitting plate and the heat radiating member are integrally formed, the number of parts can be reduced and the number of assembly steps can be reduced. Moreover, since the translucent plate and the heat radiating member are integrally formed, a gap in which foreign matter such as dust is accumulated does not occur between the translucent plate and the heat radiating member. Therefore, it is possible to avoid a situation in which foreign matter such as dust accumulates starting from the gap and foreign matter such as dust appears in the image.

  In the present invention, it is preferable that the translucent plate is made of glass and the heat dissipation member is made of metal.

  In this case, it is preferable that one of the light transmitting plate and the heat dissipation member is the light transmitting plate, and the other of the light transmitting plate and the heat dissipation member is the heat dissipation member. According to such a configuration, since the glass plate forming the translucent plate is cut in advance, a portion to be discarded hardly occurs in the glass plate. Therefore, even if an expensive quartz glass substrate is used as the glass plate, an increase in cost due to disposal can be prevented.

  In the present invention, in the integral molding step, the heat dissipation member is preferably formed by a powder metallurgy method. Since the metal sintered body can be molded at a relatively low temperature, the light-transmitting plate is hardly deteriorated during the molding.

  In the present invention, after the integral molding step and before the superposition step, the translucent plate and the heat radiating member on the opposite side of the electro-optic panel are polished so that the translucent plate and the heat radiating plate are polished. It is preferable to perform a polishing step in which a boundary portion with the member is a continuous plane. According to such a configuration, since there is no step at the boundary portion between the light transmissive plate and the heat radiating member, when the cooling air flows along the light transmissive plate, the flow of the cooling air is disturbed by the step and the cooling effect is reduced. The situation can be avoided. Moreover, a situation in which foreign matter such as dust accumulates on the step does not occur.

It is explanatory drawing of the projection type display apparatus as an example of the electronic device to which this invention is applied. It is explanatory drawing which shows the structure of the optical unit used for the projection type display apparatus to which this invention is applied. It is explanatory drawing which shows the detailed structure of the optical unit used for the projection type display apparatus to which this invention is applied. It is explanatory drawing of the electro-optical panel used for the electro-optical module to which this invention is applied. It is a perspective view which shows typically a mode when the electro-optic module used for the projection type display apparatus to which this invention is applied is seen from the light emission side. It is explanatory drawing of the electro-optic module used for the projection type display apparatus to which this invention is applied. It is sectional drawing of the electro-optic module used for the projection type display apparatus to which this invention is applied. It is a disassembled perspective view when the state which decomposed | disassembled the electro-optic module used for the projection type display apparatus to which this invention is applied is seen from the light emission side.

  Embodiments of the present invention will be described with reference to the drawings. In the following description, as an electronic apparatus to which the present invention is applied, a projection display device using an electro-optic module including a transmissive electro-optic panel (transmissive liquid crystal panel) as a light valve will be described. In the drawings referred to in the following description, the scales are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing.

(Configuration of projection display device (electronic equipment))
FIG. 1 is an explanatory diagram of a projection display device as an example of an electronic apparatus to which the present invention is applied, and FIGS. 1A and 1B show a planar configuration of a main part of the projection display device. It is explanatory drawing and explanatory drawing when a main part is seen from the side. FIG. 2 is an explanatory diagram showing the configuration of the optical unit used in the projection display device to which the present invention is applied.

  In the projection display device 1 shown in FIG. 1, a power supply unit 7 is disposed on the rear end side inside the exterior case 2, and a light source lamp unit 8 (light source unit) and a power supply unit 7 are adjacent to each other on the front side of the device. An optical unit 9 is arranged. Further, the base end side of the projection lens unit 6 is located in the center of the front side of the optical unit 9 inside the exterior case 2. On one side of the optical unit 9, an interface board 11 on which an input / output interface circuit is mounted is arranged in the front-rear direction of the apparatus, and a video board 12 on which a video signal processing circuit is mounted is parallel to the interface board 11. Has been placed. On the upper side of the light source lamp unit 8 and the optical unit 9, a control board 13 for device drive control is disposed, and speakers 14R and 14L are disposed on the left and right corners on the front end side of the device.

  Above and below the optical unit 9, intake fans 15A and 15B for cooling the inside of the apparatus are arranged. Further, an exhaust fan 16 is disposed on the side of the apparatus that is the back side of the light source lamp unit 8. Further, an auxiliary cooling fan 17 for sucking the cooling airflow from the intake fan 15A into the power supply unit 7 is disposed at a position facing the ends of the interface board 11 and the video board 12. Among these fans, the intake fan 15B mainly functions as a cooling fan for an electro-optical panel described later.

  In FIG. 2, each optical element (element) constituting the optical unit 9 includes an upper light guide 21 or a lower light guide 22 made of a metal such as Mg or Al, including the prism unit 20 constituting the color light combining means. Is supported by The upper light guide 21 and the lower light guide 22 are fixed to the upper case 3 and the lower case 4 with fixing screws.

(Detailed configuration of the optical unit 9)
FIG. 3 is an explanatory diagram showing a detailed configuration of the optical unit used in the projection display device to which the present invention is applied. As shown in FIG. 3, the optical unit 9 includes a light source lamp 805, an illumination optical system 923 having integrator lenses 921 and 922 that are uniform illumination optical elements, and a light beam W emitted from the illumination optical system 923 as red light. Color light separation optical system 924 that separates the light beams R, G, and B of green, blue. The optical unit 9 includes three transmissive electro-optical panels 40 (R), 40 (G), and 40 (B) as electro-optical panels (light valves) that modulate light beams of each color, and modulated colors. It has a prism unit 20 as a color light combining optical system for combining light beams, and a projection lens unit 6 for enlarging and projecting the combined light beams on the projection surface. In addition, a relay optical system 927 that guides the electro-optical panel 40 (B) corresponding to the blue light beam B out of the color light beams separated by the color light separation optical system 924 is provided.

  The illumination optical system 923 further includes a reflection mirror 931 so that the optical axis 1a of light emitted from the light source lamp 805 is bent at a right angle toward the front of the apparatus. The integrator lenses 921 and 922 are disposed so as to be orthogonal to each other with the reflection mirror 931 interposed therebetween.

  The color light separation optical system 924 includes a blue-green reflecting dichroic mirror 941, a green reflecting dichroic mirror 942, and a reflecting mirror 943. First, in the blue-green reflective dichroic mirror 941, the blue light beam B and the green light beam G included in the light beam W that has passed through the illumination optical system 923 are reflected at right angles to the green reflecting dichroic mirror 942 side. Head. The red light beam R passes through the blue-green reflecting dichroic mirror 941, is reflected at a right angle by the rear reflecting mirror 943, and is emitted from the red light beam emitting portion 944 to the color light combining optical system side. Next, in the green reflection dichroic mirror 942, only the green light beam G is reflected at right angles out of the blue and green light beams B and G reflected by the blue-green reflection dichroic mirror 941, and the color is emitted from the emission portion 945 of the green light beam. The light is emitted to the side of the photosynthetic optical system. The blue light beam B that has passed through the green reflecting dichroic mirror 942 is emitted from the blue light beam emitting portion 946 to the relay optical system 927 side. In this embodiment, the distances from the light beam emitting portion of the illumination optical system 923 to the color light beam emitting portions 944, 945, and 946 in the color light separation optical system 924 are all set to be substantially equal.

  Condensing lenses 951 and 952 are arranged on the emission side of the emission portions 944 and 945 of the red light beam and the green light beam of the color light separation optical system 924, respectively. Therefore, the red light beam and the green light beam emitted from each light emitting part are incident on these condenser lenses 951 and 952 and are collimated.

  The collimated red and green light beams R and G are incident on the electro-optical panels 40 (R) and 40 (G) after their polarization directions are aligned by the polarizing plates 160 (R) and 160 (G). Modulated and image information corresponding to each color light is added. That is, the electro-optical panels 40 (R) and 40 (G) are switching-controlled by an image signal corresponding to image information by a driving unit (not shown), thereby modulating each color light passing therethrough. Is called. As such driving means, known means can be used as they are.

  On the other hand, the blue light beam B is guided to the corresponding electro-optical panel 40 (B) through the relay optical system 927 and further aligned in the polarization direction by the polarizing plate 160 (B). Modulation is performed according to the image information. The relay optical system 927 is disposed on the front side of the condensing lens 974, the incident-side reflecting mirror 971, the emitting-side reflecting mirror 972, the intermediate lens 973 disposed between these mirrors, and the electro-optical panel 40 (B). Condensing lens 953 is comprised. As for the length of the optical path of each color beam, that is, the distance from the light source lamp 805 to each liquid crystal panel, the blue beam B is the longest, and the light amount loss of this beam is the greatest. However, the light loss can be suppressed by interposing the relay optical system 927.

  Each color light beam modulated through each electro-optical panel 40 (R), 40 (G), 40 (B) is incident on the polarizing plate 161 (R), 161 (G), 161 (B). The transmitted light is incident on the prism unit 20 (cross dichroic prism) and synthesized. The synthesized color image is enlarged and projected onto a projection surface 1b such as a screen at a predetermined position via a projection lens unit 6 having a projection lens system.

(Configuration of electro-optical panel 40)
FIG. 4 is an explanatory diagram of the electro-optical panel 40 used in the electro-optical module to which the present invention is applied, and FIGS. 4A and 4B each show the electro-optical panel 40 together with each component of the second substrate. It is the top view seen from the side, and its HH 'sectional drawing.

  In FIG. 4 and FIGS. 5 to 8 to be described later, the traveling direction of the light source light is indicated by an arrow L11, and the traveling direction of the display light after the light source light is modulated by the electro-optical panel 40 is indicated by an arrow L12. The flow of cooling air supplied to the electro-optical panel 40 by the intake fan 15B shown in FIG. In the following description, one of the in-plane directions of the electro-optic panel 40 and the electro-optic module is defined as the X-axis direction, the other as the Y-axis direction, and the direction intersecting the X-axis direction and the Y-axis direction. Is the Z-axis direction. In the drawings referred to below, one side in the X-axis direction (side on which the flexible wiring board 40i is provided) is the X1 side, the other side is the X2 side, and one side in the Y-axis direction is the Y1 side. The other side is the Y2 side, the one side in the Z-axis direction (the side on which the light source light is incident) is the Z1 side, and the other side (the side from which the display light is emitted) is the Z2 side.

  In the projection display device 1 described with reference to FIGS. 1 to 3, when the electro-optical panels 40 (R), 40 (G), and 40 (B) are mounted on the optical unit 9, the electro-optical panel 40 ( R), 40 (G), and 40 (B) are mounted as electro-optic modules 10 (R), 10 (G), and 10 (B), which will be described later. Here, the electro-optical panels 40 (R), 40 (G), and 40 (B) have the same configuration, and include the electro-optical panels 40 (R), 40 (G), and 40 (B). The electro-optic modules 10 (R), 10 (G), and 10 (B) have the same configuration for red (R), green (G), and blue (B). Therefore, in the following description, for the electro-optical panels 40 (R), 40 (G), 40 (B), the electro-optical modules 10 (R), 10 (G), 10 (B), etc., the corresponding colors are used. It demonstrates without attaching | subjecting (R) (G) (B) which shows.

  As shown in FIG. 4, in the electro-optical panel 40, the light-transmitting first substrate 51 (element substrate) and the light-transmitting second substrate 52 (counter substrate) are separated by a sealing material 407 through a predetermined gap. It is pasted together. The first substrate 51 and the second substrate 52 are made of quartz glass, heat-resistant glass or the like. In this embodiment, the first substrate 51 and the second substrate 52 are made of quartz glass. In this embodiment, the electro-optical panel 40 is a liquid crystal panel, and a liquid crystal layer as an electro-optical material layer 450 is held in a region surrounded by the sealing material 407 between the first substrate 51 and the second substrate 52. Yes. The sealing material 407 is provided in a frame shape along the outer edge of the second substrate 52. The sealing material 407 is a photo-curing adhesive, a thermosetting adhesive, or an adhesive having both photo-curing and thermosetting, and the distance between the two substrates is set to a predetermined value. Gap materials such as glass fiber or glass beads are blended.

  In this embodiment, the first substrate 51 has a quadrangular shape and includes end portions 511, 512, 513, and 514 each having four sides. Similarly to the first substrate 51, the second substrate 52 has a quadrangular shape and includes end portions 521, 522, 523, and 524 having four sides. At substantially the center of the electro-optical panel 40, an image display area 40a for emitting modulated light is provided as a square area. Corresponding to this shape, the sealing material 407 is also provided in a substantially square shape, and a rectangular frame-shaped peripheral region 40c is provided between the inner peripheral edge of the sealing material 407 and the outer peripheral edge of the image display region 40a.

  In this embodiment, the first substrate 51 is larger in size than the second substrate 52, and the four end portions 511, 512, 513, 514 of the first substrate 51 are respectively the end portions 521, 522, 523, It projects outward from 524. Therefore, around the second substrate 52, step portions 40s, 40t, 40u, and 40v are formed by the first substrate 51 and the end portions 521, 522, 523, and 524 of the second substrate 52, and the step portion 40s. , 40t, 40u, 40v, the first substrate 51 is exposed from the second substrate 52. Of the four end portions 511, 512, 513, and 514, the end portion 514 located on one side Y 1 in the Y-axis direction is closer to the end portion 524 of the second substrate 52 than the other end portions 511, 512, and 513. The first substrate 51 is formed with a data line driving circuit 401 and a plurality of terminals 402 along the end portion 514. A scanning line driving circuit 404 is formed on the first substrate 51 along the end portions 511 and 512. A flexible wiring board 40 i is connected to the terminal 402, and various potentials and various signals are input to the first board 51 through the flexible wiring board 40 i. In the first substrate 51, a reinforcing adhesive 41 is applied so as to straddle the end portion 514 and the flexible wiring substrate 40i.

  Of the first surface 51a and the second surface 51b of the first substrate 51, the first surface 51a opposite to the second substrate 52 corresponds to the image display region 40a, the translucent pixel electrode 405a and the pixel electrode 405a. Pixels including pixel transistors (switching elements / not shown) are formed in a matrix, and an alignment film 416 is formed on the upper side of the pixel electrode 405a. Further, on the first surface 51a of the first substrate 51, a dummy pixel electrode 405b that is formed simultaneously with the pixel electrode 405a is formed in the peripheral region 40c. For the dummy pixel electrode 405b, a configuration in which the dummy pixel transistor is electrically connected, a configuration in which the dummy pixel transistor is not provided, and a configuration in which the dummy pixel electrode is directly electrically connected to the wiring, or a floating state in which no potential is applied The structure which exists in is adopted.

  Of the first surface 52 a and the second surface 52 b of the second substrate 52, a light-transmitting common electrode 421 is formed on the first surface 52 a facing the first substrate 51. An alignment film 426 is formed. The common electrode 421 is formed across a plurality of pixels as a substantially entire surface of the second substrate 52 or as a plurality of strip-like electrodes. In this embodiment, the common electrode 421 is formed over a substantially entire surface of the second substrate 52. . In addition, a light shielding layer 408 is formed on the first surface 52 a of the second substrate 52 on the lower layer side of the common electrode 421. In this embodiment, the light shielding layer 408 is formed in a frame shape extending along the outer peripheral edge of the image display region 40 a, and the image display region 40 a is defined by the inner edge of the light shielding layer 408. The outer peripheral edge of the light shielding layer 408 is in a position with a gap between the inner peripheral edge of the sealing material 407 and the light shielding layer 408 and the sealing material 407 are not covered. In the second substrate 52, a light shielding layer formed simultaneously with the light shielding layer 408 may be formed as a black matrix or a black stripe in a region overlapping with a region sandwiched between adjacent pixel electrodes 405a.

  On the first substrate 51, an inter-substrate conduction electrode for establishing electrical continuity between the first substrate 51 and the second substrate 52 in a region overlapping the corner portion of the second substrate 52 outside the sealing material 407. 409 is formed. An inter-substrate conductive material 409a containing conductive particles is disposed between the inter-substrate conductive electrode 409 and the second substrate 52, and the common electrode 421 of the second substrate 52 includes the inter-substrate conductive material 409a and the substrate. It is electrically connected to the first substrate 51 side via the inter-connection electrode 409. For this reason, a common potential is applied to the common electrode 421 from the first substrate 51 side. The sealing material 407 is provided along the outer peripheral edge of the second substrate 52 with substantially the same width dimension. However, the sealing material 407 is provided so as to pass through the inside avoiding the inter-substrate conduction electrode 409 in a region overlapping the corner portion of the second substrate 52.

  In the electro-optical panel 40 having such a configuration, in this embodiment, since the pixel electrode 405a and the common electrode 421 are formed of a light-transmitting conductive film such as an ITO film, the electro-optical panel 40 is a transmissive liquid crystal panel. In the case of such a transmissive liquid crystal panel (electro-optical panel 40), light is incident while light incident from one of the first substrate 51 and the second substrate 52 is transmitted through the other substrate and emitted. Is done. In this embodiment, light (indicated by an arrow L11) incident from the second substrate 52 is transmitted through the first substrate 51 and emitted as modulated light (indicated by an arrow L12). For this reason, the second substrate 52 is disposed on one side Z1 in the Z-axis direction, and the first substrate 51 is disposed on the other side Z2 in the Z-axis direction. Note that when the common electrode 421 is formed using a light-transmitting conductive film and the pixel electrode 405a is formed using a reflective conductive film, a reflective liquid crystal panel can be formed. In the case of a reflective liquid crystal panel, light incident from the second substrate 52 side is modulated while being reflected and emitted by the first substrate 51 side. Since the electro-optical panel 40 of this embodiment is used as a light valve in the above-described projection display device (liquid crystal projector), no color filter is formed. However, when the electro-optical panel 40 is used as a direct-view color display device for an electronic apparatus such as a mobile computer or a mobile phone, a color filter is formed on the second substrate 52.

(Overall configuration of electro-optic module 10)
FIG. 5 is a perspective view schematically showing a state when the electro-optic module used in the projection display device 1 to which the present invention is applied is viewed from the light emitting side. FIG. 6 is an explanatory diagram of the electro-optic module used in the projection display device 1 to which the present invention is applied. FIGS. 6A, 6B, and 6C show the electro-optic module as viewed from the light emitting side. 4 is a plan view, a side view seen from the other side X2 in the X-axis direction, and a bottom view seen from the light incident side. FIG. 7 is a cross-sectional view of the electro-optic module used in the projection display device 1 to which the present invention is applied. FIGS. 7A and 7B are a YZ sectional view and an XZ sectional view of the electro-optic module. is there. FIG. 8 is an exploded perspective view when the electro-optic module used in the projection display device 1 to which the present invention is applied is seen from the light emitting side.

  As shown in FIGS. 5 to 8, in order to mount the electro-optical panel 40 in the optical unit 9 of the projection display device 1, an electro-optical module in which the electro-optical panel 40 is held by a frame 60 for the purpose of reinforcement or the like. 10 is assumed. Further, in the electro-optic module 10 of this embodiment, in addition to the electro-optic panel 40 and the frame 60, a first light-transmissive plate 56, a second light-transmissive plate 57, a heat radiating member 70, and an incident-side parting member 80 described below. Is used. Hereinafter, the detailed configuration of the electro-optic module 10 will be described with reference to FIG.

(Structure of the 1st translucent board 56 and the 2nd translucent board 57)
As shown in FIG. 7 and the like, in this embodiment, when the electro-optic module 10 is configured using the electro-optic panel 40, the second surface 51b of the first substrate 51 (outer surface / second substrate 52 of the first substrate 51 and The first translucent plate 56 is affixed to the second surface 52b of the second substrate 52 (the outer surface / the surface opposite to the first substrate 51 of the second substrate 52). The 2nd translucent board 57 is stuck by the adhesive agent etc. The first light transmitting plate 56 and the second light transmitting plate 57 are each configured as dust-proof glass, and dust and the like are formed on the outer surface (second surface 51b) of the first substrate 51 and the outer surface (second surface) of the second substrate 52. 52b) is prevented from adhering. For this reason, even if dust adheres to the electro-optical panel 40, the dust is separated from the electro-optical material layer 450. Therefore, it is possible to suppress dust from being projected as an image on the image projected from the projection display device 1 described with reference to FIG. Quartz glass, heat-resistant glass, or the like is used for the first light transmitting plate 56 and the second light transmitting plate 57. In this embodiment, the first light transmitting plate 56 and the second light transmitting plate 57 include the first substrate. Like 51 and the 2nd board | substrate 52, quartz glass is used and the thickness is 1.1-1.2 mm.

  Here, the first light transmitting plate 56 is provided so as to overlap at least the image display region 40 a of the electro-optical panel 40 with a part of the second surface 51 b of the first substrate 51 exposed. More specifically, the first light transmission plate 56 has a rectangular shape smaller in size than the first substrate 51, and the end portions 561, 562, 563, and 564 of the first light transmission plate 56 are respectively the first light transmission light. It is located inside the end portions 511, 512, 513, 514 of the first substrate 51 in the entire circumference of the plate 56, and the end portions 511, 512, 513, 514 of the first substrate 51 and the end portions of the image display area 40a. Located between.

  The second light transmitting plate 57 is provided so as to overlap at least the image display area 40 a of the electro-optical panel 40 with a part of the second surface 52 b of the second substrate 52 exposed. More specifically, the second light transmissive plate 57 is a quadrangle substantially the same size as the first light transmissive plate 56, and is smaller in size than the second substrate 52. Therefore, the end portions 571, 572, 573, and 574 of the second light transmitting plate 57 are positioned inside the end portions 521, 522, 523, and 524 of the second substrate 52 along the entire circumference of the second light transmitting plate 57. The second substrate 52 is located between the end portions 521, 522, 523, and 524 and the end portion of the image display area 40a. Therefore, a step portion is formed around the second light transmitting plate 57 by the end portions 571, 572, 573 and 574 of the second light transmitting plate 57 and the second surface 52 b of the second substrate 52.

(Configuration of frame 60)
In this embodiment, the frame 60 is a rectangular frame-shaped resin member or metal member having a rectangular opening 68 at the center, and four wall portions 61, 62, 63 surrounding the electro-optic panel 40, A frame portion including 64 is provided. In the four wall portions 61, 62, 63, 64, connecting portions (corner portions) between adjacent frame portions are prismatic connecting portions 651, 652, 653, 654. In this embodiment, the frame 60 is a metal member made of aluminum or the like.

  In the frame 60, the inner surface of the frame 60 of the wall portions 61, 62, 63, 64 corresponds to the shape of the end in a state where the first light transmitting plate 56 and the second light transmitting plate 57 are attached to the electro-optical panel 40. It has a multistage structure. However, unlike the inner surface of the wall portions 61, 62, 63, only one step portion is formed on the inner surface of the wall portion 64 located on one side Y1 in the Y-axis direction. The outside of the step portion is a plate-like portion 64 f that spreads in the in-plane direction of the electro-optical panel 40. For this reason, the flexible wiring board 40 i can be pulled out of the frame 60 so as to extend along the in-plane direction of the electro-optic panel 40.

(Structure of the parting member 80 on the incident side)
On the light incident side (one side Z1 in the Z-axis direction) with respect to the frame 60, a plate-shaped parting member 80 made of a metal plate or a resin plate is disposed so as to overlap. In this embodiment, the parting member 80 is made of metal. The parting member 80 includes a rectangular end plate portion 87 that overlaps the frame 60 on the light incident side, and an opening portion 88 that overlaps the opening portion 68 of the frame 60 is formed in the end plate portion 87. The opening 88 is smaller than the opening 68 of the frame 60, and the end plate part 87 protrudes inside the opening 68 on the entire circumference of the opening 68. For this reason, the end plate part 87 of the parting member 80 functions as a parting part that restricts a range in which light enters the electro-optical panel 40.

  The parting member 80 includes side plate portions 81, 82, 83, 84 extending from the outer edge of the end plate portion 87. Of these side plate portions 81, 82, 83, 84, the side plate portion 83 located on the other side Y 2 in the Y-axis direction extends so as to overlap the surface of one side Z 1 of the wall portion 63 in the Z-axis direction. The tip side is bent obliquely along the shape of the wall 63. Further, the side plate portion 84 located on the one side Y1 in the Y-axis direction extends so as to overlap the surface of the wall portion 64 on the one side Z1 in the Z-axis direction, and the front end side follows the shape of the wall portion 64. It is bent diagonally.

  The side plate portion 81 located on the other side X2 in the X-axis direction is bent at a substantially right angle from the end portion of the end plate portion 87 toward the other side Z2 in the Z-axis direction so as to overlap the outer surface of the wall portion 61. . In this embodiment, the side plate portions 81 are provided at two locations that are separated from each other in the Y-axis direction, and an engagement hole 810 is formed in each of the two side plate portions 81. On the other hand, a protrusion 617 that fits into each of the two engagement holes 810 is formed on the outer surface of the wall 61 of the frame 60. Further, the side plate portion 82 located on one side X1 in the X-axis direction is bent at a substantially right angle from the end portion of the end plate portion 87 toward the other side Z2 in the Z-axis direction so as to overlap the outer surface of the wall portion 62. ing. In this embodiment, the side plate portions 82 are provided at two locations that are separated from each other in the Y-axis direction, and an engagement hole 820 is formed in each of the two side plate portions 82. On the other hand, on the outer side surface of the wall portion 62 of the frame 60, similarly to the outer side surface of the wall portion 61, a protrusion 627 that fits in each of the two engagement holes 820 is formed. Therefore, the parting member 80 is connected to the frame 60 by the side plate portions 81 and 82 provided so as to sandwich the frame 60 from both sides and engages with the outer surface of the frame 60, and is integrated with the frame 60. As a result, a panel housing portion whose bottom is the end plate portion 87 of the parting member 80 is formed inside the frame 60, and the first light transmitting plate 56 and the second light transmitting plate 57 are attached to the panel housing portion. The electro-optical panel 40 is accommodated.

  Further, on the outer surface of the wall portion 61 of the frame 60, a protrusion 69 is formed at a position sandwiched between the protrusions 617, and a similar protrusion 69 is also formed on the outer surface of the wall portion 62 of the frame 60. Has been. When the electro-optic module 10 is assembled, the protrusion 69 engages with a temporary fastener 90 described later with reference to FIG. Further, a protrusion 67 is formed between the protrusion 617 and the protrusion 69 on the outer surface of the wall portion 61 of the frame 60, and a similar protrusion 67 is also formed on the outer surface of the wall portion 62 of the frame 60. Is formed. The protrusion 67 has a function of defining the positions of the side plate portions 81 and 82 of the parting member 80.

  In the present embodiment, the frame-like end plate portion 87 of the parting member 80 is used as the incident side cut-off. However, the light-shielding layer is provided in a region overlapping the end plate portion 87 in the second translucent plate 57, and the light shielding is performed. The parting and parting member 80 may perform parting on the incident side.

(Configuration of heat dissipation member 70 and composite member 30)
In this embodiment, the first light transmitting plate 56 has a rectangular shape smaller in size than the first substrate 51 in plan view, and the second surface 51b of the first substrate 51 has end portions 511, 512, and 513 over the entire circumference. 514 is exposed from the first light transmissive plate 56 along the line 514. Therefore, in this embodiment, the heat radiating member 70 is provided on the second surface 51b of the first substrate 51 so as to overlap the portion exposed from the first light transmitting plate 56 on the other side Z2 in the Z-axis direction. The outer peripheral portion of 70 overlaps the frame 60 on the other side Z2 in the Z-axis direction. The heat radiating member 70 is made of a material having higher thermal conductivity than the first light transmissive plate 56. More specifically, the heat dissipation member 70 is made of a metal such as aluminum, copper, or iron, and in this embodiment, the heat dissipation member 70 is made of a sintered body. In this embodiment, the entire surface of the heat radiating member 70 is blackened by painting or the like.

  The heat radiating member 70 includes a rectangular frame portion 76 that overlaps the outer peripheral region of the second surface 51b over the entire circumference of the first substrate 51. The rectangular frame portion 76 includes four wall portions 71, 72, 73, and 74. Including. In addition, an opening 78 is formed in a region of the heat dissipation member 70 that overlaps the image display region 40 a of the electro-optical panel 40, and the first light transmissive plate 56 is disposed in the opening 78. Here, the opening 78 and the first translucent plate 56 are approximately the same size as the image display area 40a of the electro-optical panel 40, and the other side Z2 in the Z-axis direction with respect to the image display area 40a of the electro-optical panel 40. Are completely overlapping.

  In this embodiment, the glass first light transmitting plate 56 and the metal heat radiating member 70 are formed as an integrally molded composite member 30. For this reason, there is no gap between the first translucent plate 56 and the rectangular frame portion 76. Further, in the composite member 30, the surface opposite to the side where the electro-optical panel 40 is located (the surface on the other side Z <b> 2 in the Z-axis direction) is located at the boundary portion between the first light transmission plate 56 and the rectangular frame portion 76. There is no step and it is a continuous plane.

  In the composite member 30, an outer peripheral thin plate portion 711 is formed from the wall portion 71 toward the other side X <b> 2 in the X-axis direction in the rectangular frame portion 76 of the heat radiating member 70, and from the wall portion 72 of the rectangular frame portion 76. An outer peripheral thin plate portion 721 is formed toward one side X1 in the X-axis direction. Here, the dimension in the X-axis direction of the wall portion 71 is smaller than the separation distance in the X-axis direction between the first light transmitting plate 56 and the wall portion 61 of the frame 60, and the dimension in the X-axis direction of the wall portion 72 is The distance between the first translucent plate 56 and the wall portion 62 of the frame 60 is smaller than the distance in the X-axis direction. Therefore, the wall portion 71 enters between the end portion 561 of the first light transmitting plate 56 and the wall portion 61 of the frame 60, and the side of the second surface 51 b of the first substrate 51 where the end portion 511 is located. Overlapping. Further, the wall portion 72 enters between the end portion 562 of the first translucent plate 56 and the wall portion 62 of the frame 60, and the side of the second surface 51 b of the first substrate 51 where the end portion 512 is located. Overlapping. Further, the wall 73 overlaps the wall 63 of the frame 60 and overlaps the side of the second surface 51 b of the first substrate 51 where the end 513 is located. The wall 74 faces the wall 64 of the frame 60 and overlaps the side of the second surface 51b of the first substrate 51 where the end 514 is located. Therefore, the heat of the electro-optical panel 40 due to the heat generated by the electro-optical panel 40 itself or the incidence of light source light is released through the first substrate 51 and the wall portions 71, 72, 73, 74 of the heat dissipation member 70. Can do.

  When the composite member 30 is disposed on the other side Z2 in the Z-axis direction with respect to the electro-optical panel 40, the opening 78 of the heat radiating member 70 overlaps the image display area 40a of the electro-optical panel 40, and the heat radiating member 70 It functions as a parting for the optical panel 40. In the composite member 30, the first light transmitting plate 56 and the heat radiating member 70 have the same thickness, and the surface of the composite member 30 opposite to the side where the electro-optical panel 40 is located (Z-axis). On the other side Z2 in the direction), there is no step at the boundary portion between the first light transmitting plate 56 and the rectangular frame portion 76, and it is a continuous plane. For this reason, there is no step between the first light transmitting plate 56 and the rectangular frame portion 76, and therefore, as indicated by an arrow A, the other side in the Z-axis direction of the electro-optical panel 40 by the intake fan 15B shown in FIG. When the flow of the cooling air is formed along the surface of the side Z2, the cooling air smoothly flows on the surface of the composite member 30. Therefore, the heat generated in the electro-optical panel 40 is converted into the cooling air through the composite member 30. I can escape.

  Further, in the heat radiating member 70, the outer surface of the wall portion 74 located on the one side Y1 in the Y-axis direction (the surface on the other side Z2 in the Z-axis direction) has a plurality at the end located on the one side Y1 in the Y-axis direction. The recesses 747 are formed, and the plurality of recesses 747 are arranged at predetermined intervals in the X-axis direction. For this reason, when the flow of cooling air is formed along the surface of the other side Z2 of the electro-optical panel 40 in the Z-axis direction, the portion sandwiched between the recess 747 and the recess 747 functions as a heat radiating fin. For this reason, when the heat generated in the electro-optical panel 40 is released to the heat radiating member 70, the heat can be efficiently released from the wall 74 to the cooling air.

(Adhesive fixing configuration with adhesives P1 and P2)
The composite member 30 configured as described above is adhered to the second surface 51b of the first substrate 51 of the electro-optical panel 40 with an adhesive P1. In the composite member 30, the first translucent plate 56 and the first substrate 51 are fixed by the adhesive P <b> 1 over the entire surface, and the heat dissipation member 70 and the first substrate 51 are fixed over the entire surface by the adhesive P <b> 1. Therefore, in the composite member 30, the first light transmitting plate 56 and the heat radiating member 70 are directly joined without using an adhesive during molding, but are fixed via the first substrate 51. Thereby, it can prevent that the 1st translucent board 56 and the thermal radiation member 70 isolate | separate. In addition, since there is no air layer between the first light transmissive plate 56 and the electro-optical panel 40, reflection hardly occurs when light is transmitted. Further, since there is no air layer between the heat radiating member 70 and the electro-optical panel 40, the heat generated in the electro-optical panel 40 can be efficiently released to the heat radiating member 70.

  Further, in the composite member 30, the outer peripheral side of the heat dissipation member 70 is fixed by the frame 60 and the adhesive P <b> 2, and the adhesive P <b> 2 also has a function of bonding the first substrate 51 and the frame 60. . Here, the adhesive P1 and the adhesive P2 can use the same type of adhesive, and according to such a configuration, management of the adhesive and the like are easy.

  Moreover, you may use a different kind of adhesive agent as the adhesive agent P1 and the adhesive agent P2. According to this configuration, an optimum adhesive can be used for each use site. For example, about adhesive P1 (1st adhesive), what has the transmittance | permeability with respect to visible light and heat conductivity higher than adhesive P2 (2nd adhesive) can be used. According to such a configuration, it is possible to suppress the light emitted from the electro-optical panel 40 from being absorbed by the adhesive P1. Further, the heat generated in the electro-optical panel 40 can be efficiently released to the heat radiating member 70 through the adhesive P1. On the other hand, since the adhesive P2 may have lower visible light transmittance and thermal conductivity than the adhesive P1, the degree of freedom in selecting a material is increased.

(Method for manufacturing electro-optic module 10)
In the manufacturing process of the electro-optical module 10 described with reference to FIGS. 5 to 8, first, after performing an integral molding process for manufacturing the composite member 30, the composite member 30 is overlaid on one surface side of the electro-optical panel 40. An overlaying process is performed, and then a panel housing process is performed in which the electro-optical panel 40 with the composite member 30 attached is disposed inside the frame 60. In this embodiment, the polishing process for the composite member 30 is performed after the integral molding process and before the overlapping process.

  More specifically, first, in the integral molding step, after arranging one member of the glass first light transmitting plate 56 and the metal heat radiating member 70 in the mold, a material constituting the other member is used. The first translucent plate 56 and the heat radiating member 70 are filled into the mold to form an integrated composite member 30.

  In this embodiment, one member is a glass first light transmitting plate 56, and the other member is a metal heat radiating member 70. Therefore, after cutting a glass substrate such as a large quartz glass substrate into the first light transmitting plate 56 having a single size, the first light transmitting plate 56 is disposed at a predetermined position with respect to the mold. Next, a material constituting the heat radiating member 70 is filled between the mold and the first light transmitting plate 56. As such a material, in this embodiment, a sintering powder such as an aluminum-based sintering powder, a copper-based sintering powder, and an iron-based sintering powder is filled between the mold and the first translucent plate 56. Thereafter, heating and cooling are performed, and the first light transmissive plate 56 and the heat radiating member 70 form an integrated composite member 30. According to such a powder metallurgy method, since the molten metal can be molded at a lower temperature than a method in which a molten metal is poured between the mold and the first light transmitting plate 56, the first light transmitting plate 56 is deteriorated. Can be prevented. Moreover, according to said method, since the glass plate which forms the 1st translucent board 56 is cut | disconnected previously, the part which should be discarded does not generate | occur | produce easily in a glass plate. Therefore, even if an expensive quartz glass substrate is used as the glass plate, an increase in cost due to disposal can be prevented.

  In manufacturing the composite member 30 by the powder metallurgy method, a metal powder injection molding method or a slip cast method may be used. In the slip casting method, a powder for sintering is mixed with a solvent to form a slurry, and the slurry is injected into a mold. Therefore, since it is not necessary to pressurize, the crack of a sintered part (heat radiating member) etc. can be prevented.

  Further, when the composite member 30 is manufactured, the first light transmitting plates 56 may be arranged one by one in the mold, but a plurality of first light transmitting plates 56 are arranged at predetermined intervals in the mold. Alternatively, a large composite member may be manufactured by filling the sintering powder between the first light-transmitting plates 56. According to this method, since a large composite member can be manufactured, a plurality of single-sized composite members 30 can be manufactured simultaneously by cutting the large composite member. Therefore, the manufacturing cost of the composite member 30 can be reduced.

  Further, in the integral molding process, fine unevenness may be formed on the side end surface of the first light transmissive plate 56, and the heat radiating member 70 may be integrally molded on the first light transmissive plate 56. According to such a configuration, since one side bites into the other side between the first light transmissive plate 56 and the heat radiating member 70, the bonding strength between the first light transmissive plate 56 and the heat radiating member 70 can be increased. it can.

  Next, in the polishing step, the surface of the composite member 30 opposite to the electro-optical panel 40 is polished so that the boundary portion between the first light transmitting plate 56 and the heat dissipation member 70 is a continuous plane. In such a polishing process, it is preferable to polish both surfaces of the composite member 30. According to such a configuration, the burr can be removed even if a burr at the time of molding occurs on either side of both surfaces of the composite member 30 during the integral molding. In manufacturing the composite member 30 by the powder metallurgy method, after manufacturing the large composite member, the large composite member is polished in a lump, and then the large composite member is combined into a plurality of single-size composites. The member 30 may be cut. According to such a method, polishing of the composite member 30 can be performed efficiently.

  Next, in the overlapping step, the composite member 30 is overlapped on the second surface 51 b of the first substrate 51 of the electro-optical panel 40. Further, the adhesive P1 is interposed between the composite member 30 and the electro-optical panel 40, and the composite member 30 and the electro-optical panel 40 are fixed by the adhesive P1. In that case, adhesive P1 is apply | coated to both between the 1st board | substrate 51 and the 1st translucent board 56, and between the 1st board | substrate 51 and the heat radiating member 70, and the 1st translucent board 56 and a 1st board | substrate. 51 is fixed to the entire surface by the adhesive P1, and the heat dissipation member 70 and the first substrate 51 are fixed to the entire surface by the adhesive P1. The adhesive P1 is adjusted between the first light transmitting plate 56 and the first substrate 51 when the composite member 30 and the first light transmitting plate 56 are stacked by adjusting the application amount of the adhesive P1. You may make it spread between the thermal radiation member 70 and the 1st board | substrate 51. FIG.

  Before or after the overlapping process, the second light transmitting plate 57 is bonded and fixed to the electro-optical panel 40. Further, in this embodiment, the heat radiating member 70 of the composite member 30 is used as a part. Therefore, after the composite member 30 is manufactured so that the stray light can be absorbed by the heat radiating member 70 when the light emitted from the electro-optic module 10 returns as stray light, the Z-axis direction of the heat radiating member 70 is printed by printing or the like. A black light absorption layer is formed on the other surface (the surface opposite to the side where the electro-optical panel 40 is located).

  Next, in the panel accommodation step, after the incident-side parting member 80 is attached to the frame 60, the second light transmitting plate 57 and the composite member 30 (the first light transmitting plate 56 and the heat radiating member 70) are placed inside the frame 60. Is accommodated. At this time, the electro-optical panel 40 is provided on the inner side of the frame 60 so that the second light-transmitting plate 57 side precedes the display light emission side (the other side Z2 in the Z-axis direction) of the frame 60. Further, the adhesive P2 is interposed between the electro-optical panel 40 and the frame 60 and between the heat dissipation member 70 of the composite member 30 and the frame 60, and the electro-optical panel 40, the frame 60, and the composite member 30 are bonded. Fix with agent P2. During the bonding process, as shown by a two-dot chain line in FIG. 5, the electro-optical panel 40, the frame 60, and the composite member 30 are held until the adhesive P <b> 2 is cured by the plate-shaped temporary fastener 90. The adhesion process can be easily performed. Here, the temporary fastener 90 is directed to the composite member 30 on the other side Z2 in the Z-axis direction, and from both ends of the end-plate part 95 in the X-axis direction toward one side Z1 in the Z-axis direction. The side plate portion 91 is formed with an engagement hole 910 that fits into the projection 69 of the frame 60. Therefore, if the temporary stopper 90 is disposed so that the composite member 30 is covered by the end plate portion 95 and the engagement hole 910 of the side plate portion 91 is fitted into the protrusion 69, the electro-optical panel 40, the frame 60, and the composite member 30 can be temporarily fixed. Further, the temporary fastener 90 can be easily removed simply by removing the engagement hole 910 of the side plate 91 from the protrusion 69.

(Main effects of this form)
As described above, in the electro-optic module 10 of the present embodiment, the first transparent surface of the first substrate 51 is overlapped with the second transparent surface 51b (the surface opposite to the second substrate 52) so as to overlap the image display region 40a. Since the optical plate 56 is provided, dust hardly adheres to a position (first substrate 51) close to the electro-optical material layer 450 (liquid crystal layer). Therefore, even when an image generated by the electro-optical panel 40 is projected, the dust is in a defocused state, so that the influence of the dust is difficult to affect the image.

  The first light transmissive plate 56 is provided so as to expose a part of the second surface 51 b of the first substrate 51, and at least one of the exposed portions of the first substrate 51 from the first light transmissive plate 56. A heat radiating member 70 made of a material having a higher thermal conductivity than that of the first light-transmitting plate 56 is provided so as to be overlapped in contact with each other. For this reason, the heat generated in the electro-optical panel 40 can be efficiently released through the heat dissipation member 70. Therefore, it is possible to suppress the deterioration of display quality due to the temperature increase of the electro-optical panel 40. Moreover, the heat radiating member 70 is metal, and its heat conductivity is higher than the 1st translucent board 56 (quartz glass). Therefore, the heat generated in the electro-optical panel 40 can be efficiently released through the heat dissipation member 70.

  Here, since the 1st translucent board 56 and the heat radiating member 70 consist of the composite member 30 integrally molded, while being able to reduce a number of parts, an assembly man-hour can be reduced. Further, since the first light transmissive plate 56 and the heat radiating member 70 are composed of the integrally formed composite member 30, there is no gap between the first light transmissive plate 56 and the heat radiating member 70 in which foreign matter such as dust accumulates. . Therefore, it is possible to avoid a situation in which foreign matter such as dust accumulates starting from the gap and foreign matter such as dust appears in the image.

  Further, since the first light transmissive plate 56 and the heat radiating member 70 are composed of the integrally formed composite member 30, a large step does not occur between the first light transmissive plate 56 and the heat radiating member 70. Therefore, when the cooling air is caused to flow along the first light-transmitting plate 56, it is possible to avoid a situation in which the cooling air flow is disturbed by the step and the cooling effect is reduced. In addition, it is difficult for foreign matter such as dust to accumulate on the steps. In addition, in this embodiment, after the composite member 30 is manufactured in the integral molding process, the surface of the composite member 30 opposite to the electro-optical panel 40 is polished to boundary the first light transmitting plate 56 and the heat radiating member 70. Is a continuous plane. For this reason, a level | step difference does not generate | occur | produce between the 1st translucent board 56 and the heat radiating member 70. FIG. Therefore, when the cooling air is caused to flow along the first light transmission plate 56, it is possible to reliably avoid a situation in which the cooling air flow is disturbed by the step and the cooling effect is reduced. Moreover, a situation in which foreign matter such as dust accumulates on the step does not occur.

  In addition, the first light transmitting plate 56 is smaller in size than the first substrate 51, and the end portions 561, 562, 563, and 564 of the first light transmitting plate 56 are the first substrate on the entire circumference of the first light transmitting plate 56. It overlaps between 51 edge part 511,512,513,514 and the edge part of the image display area 40a. Further, the rectangular frame portion 76 of the heat radiating member 70 is provided so as to surround the first translucent plate 56 around the entire circumference. For this reason, since the overlapping area of the exposed part from the 1st translucent board 56 of the 1st board | substrate 51 and the heat radiating member 70 is large, the heat | fever which generate | occur | produced in the electro-optical panel 40 is efficiently released via the heat radiating member 70. Can do.

  Further, the heat radiating member 70 overlaps an exposed portion of the first substrate 51, which is an element substrate including a pixel electrode and a switching element, of the first substrate 51 and the second substrate 52. For this reason, when light passes through the electro-optical panel 40, heat generation in the first substrate 51 is larger than that in the second substrate 52. In this embodiment, the heat dissipation member 70 is an element substrate (first substrate 51) that generates large heat. ), The heat generated in the electro-optic panel 40 can be efficiently released.

  Moreover, in this embodiment, since the heat radiating member 70 of the composite member 30 is used for parting, it is not necessary to perform parting on the emission side by another member. In addition, since the first light transmissive plate 56 and the heat radiating member 70 are composed of the composite member 30 that is integrally formed, there is no gap between the first light transmissive plate 56 and the heat radiating member 70. Therefore, light leakage from between the first light transmissive plate 56 and the heat radiating member 70 does not occur.

[Other embodiments]
In the above embodiment, in the integral molding step, after the first light transmitting plate 56 is arranged in the mold, the material constituting the heat dissipation member 70 is filled between the first light transmitting plate 56 and the mold. After disposing the heat radiating member 70 in the mold, the composite member 30 may be manufactured by filling low-melting glass between the heat radiating member 70 and the mold.

  In the above embodiment, the first light transmitting plate 56 is smaller in size than the electro-optical panel 40 and the heat radiating member 70 is provided so as to surround the first light transmitting plate 56 around the entire circumference. The present invention may be applied to the electro-optic module 10 that is exposed only from a part of the end portion of the first light-transmitting plate 56 and the heat radiating member 70 is disposed so as to overlap the exposed portion.

  In the above-described embodiment, the electro-optical module 10 including the transmissive electro-optical panel 40 is illustrated, but the present invention may be applied to the electro-optical module 10 including the reflective electro-optical panel 40.

  In the said embodiment, although the front projection type display apparatus which projects from the direction which observes a projected image as a projection type display apparatus was illustrated, the rear projection type display apparatus which projects from the opposite side to the direction which observes a projected image The present invention may be applied to a projection display device used for the above.

  In the above embodiment, the liquid crystal panel has been described as an example of the electro-optical panel. However, the present invention is not limited to this, and the organic electroluminescence display panel, plasma display panel, FED (Field Emission Display) panel, SED The present invention may be applied to an electro-optic module using a (Surface-Conduction Electron-Emitter Display) panel, an LED (light emitting diode) display panel, an electrophoretic display panel, or the like.

  As for the electro-optic module to which the present invention is applied, in addition to the electronic device (projection display device) described above, a head-mounted display, a mobile phone, an information portable terminal (PDA: Personal Digital Assistants), a digital camera, a liquid crystal television, You may use as a direct view type display apparatus in electronic devices, such as a car navigation apparatus, a videophone, a POS terminal, and an apparatus provided with a touch panel.

1 .... Projection type display device, 10 .... Electro-optical module, 30..Composite member, 40..Electro-optical panel (liquid crystal panel), 40a..Image display area, 51..First substrate (element substrate), 52 .. Second substrate (opposite substrate) 56 .. First light transmitting plate 57.. Second light transmitting plate 60.. Frame 70.. Heat dissipation member 80. Optical material layer (liquid crystal layer), P1 ... adhesive (first adhesive), P2 ... adhesive (second adhesive)

Claims (18)

An electro-optic panel;
A light-transmitting plate that overlaps at least an image display area of the electro-optical panel in a state in which one surface of the electro-optical panel is partially exposed;
Of one surface of the electro-optic panel, provided to overlap the exposed portion from the light transmissive plate, a heat dissipation member made of a material having a higher thermal conductivity than the light transmissive plate,
Have
The electro-optic module, wherein the translucent plate and the heat radiating member are composed of a composite part integrally formed.   2. The electro-optic according to claim 1, wherein a boundary portion between the translucent plate and the heat radiating member is a continuous plane on a surface of the composite part opposite to the electro-optic panel. module.   The electro-optic module according to claim 1, wherein the translucent plate is made of glass, and the heat dissipation member is made of metal.   The electro-optical module according to claim 3, wherein the heat radiating member is a metal sintered body. The translucent plate is smaller in size than the electro-optical panel,
In plan view, the end of the translucent plate is located between the end of the electro-optical panel and the end of the image display region on the entire circumference of the translucent plate,
5. The electro-optic module according to claim 1, wherein the heat radiating member is provided so as to surround the translucent plate all around. 5.   The electro-optical module according to claim 5, wherein the heat radiating member forms a parting with respect to the electro-optical panel.   The electro-optical panel includes a translucent first substrate, a second substrate disposed opposite to the first substrate, and a liquid crystal layer provided between the first substrate and the second substrate. The electro-optic module according to claim 1, wherein the electro-optic module is provided. The first substrate is an element substrate including a pixel electrode and a switching element provided corresponding to the pixel electrode,
The electro-optical module according to claim 7, wherein the one surface of the electro-optical panel is configured by a surface of the first substrate opposite to the liquid crystal layer.   9. The electro-optic module according to claim 1, wherein both the light-transmitting plate and the heat dissipating member of the composite part are bonded to the electro-optic panel. A frame for supporting the electro-optic panel from the side;
The frame is made of a material having a higher thermal conductivity than the translucent plate,
The electro-optic module according to claim 1, wherein the heat dissipation member overlaps the frame in a plan view. The composite part and the electro-optical panel are fixed by a first adhesive,
The electro-optic module according to claim 10, wherein the frame and the electro-optic panel are fixed by a second adhesive different from the first adhesive.   The electro-optic module according to claim 11, wherein the first adhesive has a higher visible light transmittance and thermal conductivity than the second adhesive. A projection display device comprising the electro-optic module according to any one of claims 1 to 12,
A light source unit that emits light supplied to the electro-optic module;
A projection optical system for projecting light modulated by the electro-optic module;
A projection display device characterized by comprising: An electro-optical panel having an image display area, and disposed so as to overlap at least the image display area on one surface side of the electro-optical panel and to expose a part of the one surface of the electro-optical panel And a heat radiating member made of a material having a higher thermal conductivity than that of the light transmissive plate.
After one of the light transmissive plate and the heat radiating member is disposed inside a mold, the light transmissive plate and the heat radiating member are filled with a material constituting the other of the light transmissive plate and the heat radiating member. An integral molding process for integrally molding
An overlapping step of superimposing the integrally formed light-transmitting plate and the heat radiating member on the one surface side of the electro-optical panel;
A method for manufacturing an electro-optic module, comprising:   The method of manufacturing an electro-optic module according to claim 14, wherein the translucent plate is made of glass, and the heat dissipation member is made of metal. One of the translucent plate and the heat dissipation member is the translucent plate,
The method of manufacturing an electro-optic module according to claim 15, wherein the other of the light transmitting plate and the heat radiating member is the heat radiating member.   17. The method of manufacturing an electro-optic module according to claim 16, wherein in the integral molding step, the heat radiating member is formed by a powder metallurgy method. After the integral molding process and before the superposition process,
Polishing the surface of the translucent plate and the heat radiating member opposite to the electro-optical panel, and performing a polishing step to make a boundary plane between the translucent plate and the heat radiating member a continuous plane. The method of manufacturing an electro-optic module according to claim 14.

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