JP2015106010A - Electro-optical module and projection type display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electro-optical module that can release the heat of an electro-optical panel from the side of a translucent plate arranged overlapped with the electro-optical panel, and a projection type display device including the electro-optical module.SOLUTION: In an electro-optical module 10, a second translucent plate 57 is arranged opposite to a second substrate 52 side of an electro-optical panel 40; and on the surface on the second substrate 52 side of the second translucent plate 57, light shielding layers 579 are formed respectively on an area which is not overlapped with an image display area 40a and overlapped with the second substrate 52 in plan view, and an overhanging surface 570 from the second substrate 52. Wall parts 61, 62, and 63 of a frame 60 are arranged opposite to each other at the light-shielding layer 579 on the overhanging surface 570, and an adhesive P is interposed between the light-shielding layer 579 and the wall parts 61, 62, and 63. With this configuration, the heat generated in the electro-optical panel 40 can be released from the second substrate 52 to the frame 60 through the light-shielding layer 579.

Description

  The present invention relates to an electro-optic module used in an electronic apparatus such as a projection display device, and a projection display device including the electro-optic module.

  When an image is displayed on an electronic device such as a projection display device, light modulated by an electro-optical panel such as a liquid crystal panel is used. Such an electro-optical panel has, for example, a configuration in which an electro-optical material layer such as a liquid crystal layer is provided between a first substrate and a second substrate. In addition, a first light transmitting plate and a second light transmitting plate are attached to the outer surface sides of the first substrate and the second substrate for the purpose of dust prevention or the like. In the electro-optical panel having such a configuration, when the temperature of the electro-optical panel rises due to heat generated by the electro-optical panel itself or heat generated by incidence of light source light, deterioration of the electro-optical material layer occurs.

  On the other hand, there is disclosed a structure in which a light transmitting plate having a size larger than that of the first substrate or the second substrate is used as the first light transmitting plate and the second light transmitting plate, and a case body is brought into contact with a side surface of the light transmitting plate. (See Patent Document 1).

JP 2000-347168 A

  However, since the electro-optic module described in Patent Document 1 uses a case body made of black synthetic resin, when the temperature of the electro-optic panel rises due to heat generated by the electro-optic panel itself or incidence of light source light, There is a problem in that the heat of the optical panel cannot be released to the case body via the translucent plate.

  In view of the above problems, an object of the present invention is to provide an electro-optic module capable of releasing heat from the electro-optic panel from the side of the light-transmitting plate disposed on the electro-optic panel, and the electro-optic module. It is to provide a projection type display device provided.

  In order to solve the above problems, an electro-optic module according to the present invention is provided between a first substrate, a second substrate disposed opposite to the first substrate, and the first substrate and the second substrate. An electro-optical panel having an electro-optical material layer, and a projecting surface that is disposed opposite to the surface of the second substrate opposite to the first substrate and projects from the second substrate to the surface of the second substrate. Of the second substrate side translucent plate provided and the surface of the second substrate side translucent plate on the second substrate side, the second substrate so as not to overlap the image display area of the electro-optic panel in plan view A light shielding layer formed on the projecting surface, a wall portion facing the light shielding layer, a frame in which the electro-optical panel is accommodated inside the wall portion, the light shielding layer, and the first light shielding layer. Interposed between the two substrates and between the light shielding layer and the wall. Characterized in that it comprises a bonding agent.

  In the present invention, a second substrate-side light transmitting plate is disposed opposite to the second substrate side of the electro-optical panel, and an image is displayed on the surface of the second substrate-side light transmitting plate on the second substrate side in a plan view. A light-shielding layer is continuously formed on a region that overlaps the second substrate without overlapping with the region, and a projecting surface from the second substrate, and a wall portion of the frame is disposed opposite to the light-shielding layer on the projecting surface. Yes. Further, an adhesive is interposed between the light shielding layer and the second substrate and between the light shielding layer and the wall portion, and no air layer is interposed. For this reason, the heat generated in the electro-optical panel can be released from the second substrate to the frame via the light shielding layer. Therefore, since the temperature increase of the electro-optical panel can be suppressed to a low level, deterioration of the electro-optical material layer due to the temperature increase of the electro-optical panel can be suppressed.

  In the present invention, the second substrate-side translucent plate is larger in size than the second substrate, the overhanging surface is formed over the entire circumference of the second substrate, and the light-shielding layer has the image display area in a plan view. Preferably, the parting is formed over the entire circumference of the overlapping area. According to such a configuration, the heat generated in the electro-optical panel can be released to the frame by using the light-shielding layer that configures the light-shielding portion for the electro-optical panel, so that the configuration can be simplified.

  In this invention, it is preferable that the said light shielding layer is formed to the edge of the said 2nd board | substrate side translucent board. According to such a configuration, since the overlapping area between the light shielding layer and the wall portion of the frame can be increased, the heat generated in the electro-optical panel can be efficiently released from the light shielding layer to the frame.

  In this invention, it has the 1st board | substrate side translucent board opposingly arranged by the surface on the opposite side to the said 2nd board | substrate of the said 1st board | substrate, The said 1st board | substrate side translucent board and the said 1st board | substrate are the said, It is preferable that the size is smaller than the second substrate side light transmitting plate. According to such a configuration, even when the size of the second substrate-side light transmitting plate is large, the electro-optical panel and the second substrate-side light transmitting plate are placed inside the frame by leading the first substrate-side light transmitting plate side first. Can be accommodated.

  In this invention, the said 1st board | substrate is provided with the overhang | projection part projected from the said 2nd board | substrate, and the terminal formed in the surface by the side of the said 2nd board | substrate of this overhang | projection part, The overlapping width between the light shielding layer and the wall portion on the opposite side across the electro-optical panel is preferably larger than the overlapping width between the light shielding layer and the wall portion in another region. When supplying the cooling gas to the electro-optic module, the side opposite to the side where the overhanging part is located is the windward side, so if the overlapping width of the light shielding layer and the frame wall part on the windward side is increased , Heat dissipation efficiency increases. Therefore, even if the second substrate side translucent plate and the frame are not excessively large, sufficient heat dissipation can be ensured from the whole electro-optical panel.

  In the present invention, a configuration in which an adhesive is interposed between the electro-optical panel and the frame can be employed. According to this configuration, since an air layer is not interposed between the electro-optical panel and the frame, the heat of the electro-optical panel is easily released to the frame.

  In the present invention, it is preferable that an air passage extending in one of the in-plane directions of the electro-optical panel is formed between the electro-optical panel and the frame. According to such a configuration, the electro-optical panel can be directly cooled by the cooling gas flowing in the air passage, so that the temperature increase of the electro-optical panel can be suppressed low.

  In the present invention, it is preferable that a heat radiating member having a higher thermal conductivity than the first substrate, the second substrate, and the second substrate side light transmitting plate is disposed between the electro-optical panel and the frame. . According to this configuration, the heat of the electro-optical panel can be released to the frame via the heat dissipation member.

  In this case, it is preferable that the heat radiating member is opposed to the light shielding layer on the protruding surface. According to this configuration, the heat of the electro-optical panel can be released to the frame via the light shielding layer and the heat radiating member.

  In the present invention, the first substrate is preferably an element substrate including a pixel electrode and a switching element provided corresponding to the pixel electrode. By adopting such a configuration, the heat generated in the first substrate can be efficiently released to the frame.

  In the present invention, the electro-optical panel is, for example, a liquid crystal panel including a liquid crystal layer as the electro-optical material layer.

  The present invention is effective when applied to a case where the electro-optic module is used in a projection display device, and the projection display device includes a light source unit that emits light supplied to the electro-optic module, and the electro-optic module. A projection optical system for projecting light modulated by the module. In the case of the projection display device, strong light source light is incident on the electro-optical panel. However, according to the present invention, the temperature rise of the electro-optical panel can be suppressed low.

  The projection display device according to the present invention preferably includes a cooling device that supplies a cooling gas to the electro-optic module. According to such a configuration, the temperature increase of the electro-optic module can be efficiently suppressed.

It is explanatory drawing of the projection type display apparatus as an example of the electronic device to which this invention is applied. It is explanatory drawing which shows the structure of the optical unit used for the projection type display apparatus to which this invention is applied. It is explanatory drawing which shows the detailed structure of the optical unit used for the projection type display apparatus to which this invention is applied. It is explanatory drawing of the electro-optical panel used for the electro-optical module to which this invention is applied. FIG. 3 is a perspective view of the electro-optic module according to Embodiment 1 of the present invention when viewed from the light emitting side. It is explanatory drawing of the electro-optic module which concerns on Embodiment 1 of this invention. 1 is a cross-sectional view of an electro-optic module according to Embodiment 1 of the present invention. FIG. 3 is an exploded perspective view when the electro-optic module according to Embodiment 1 of the present invention is disassembled when viewed from the light emitting side. It is sectional drawing of the electro-optic module which concerns on the modification 1 of Embodiment 1 of this invention. It is sectional drawing of the electro-optic module which concerns on the modification 2 of Embodiment 1 of this invention. It is sectional drawing of the electro-optic module which concerns on Embodiment 2 of this invention. It is sectional drawing of the electro-optic module which concerns on Embodiment 3 of this invention. It is sectional drawing of the electro-optic module which concerns on Embodiment 4 of this invention. FIG. 10 is a cross-sectional view of an electro-optic module according to Embodiment 5 of the present invention.

  Embodiments of the present invention will be described with reference to the drawings. In the following description, as an electronic apparatus to which the present invention is applied, a projection display device using an electro-optic module including a transmissive electro-optic panel (transmissive liquid crystal panel) as a light valve will be described. In the drawings referred to in the following description, the scales are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing.

[Embodiment 1]
(Projection type display device (electronic equipment) as a whole)
FIG. 1 is an explanatory diagram of a projection display device as an example of an electronic apparatus to which the present invention is applied, and FIGS. 1A and 1B show a planar configuration of a main part of the projection display device. It is explanatory drawing and explanatory drawing when a main part is seen from the side. FIG. 2 is an explanatory diagram showing the configuration of the optical unit used in the projection display device to which the present invention is applied.

  In the projection display device 1 shown in FIG. 1, a power supply unit 7 is disposed on the rear end side inside the exterior cases 2 and 5, and a light source lamp unit 8 (light source unit) is positioned adjacent to the power supply unit 7 on the front side of the device. ) And the optical unit 9 are arranged. Further, the base end side of the projection lens unit 6 is located in the center of the front side of the optical unit 9 inside the exterior case 2. On one side of the optical unit 9, an interface board 11 on which an input / output interface circuit is mounted is arranged in the front-rear direction of the apparatus, and a video board 12 on which a video signal processing circuit is mounted is parallel to the interface board 11. Has been placed. On the upper side of the light source lamp unit 8 and the optical unit 9, a control board 13 for device drive control is disposed, and speakers 14R and 14L are disposed on the left and right corners on the front end side of the device.

  Above and below the optical unit 9, intake fans 15A and 15B for cooling the inside of the apparatus are arranged. Further, an exhaust fan 16 is disposed on the side of the apparatus that is the back side of the light source lamp unit 8. Further, an auxiliary cooling fan 17 for sucking the cooling airflow from the intake fan 15A into the power supply unit 7 is disposed at a position facing the ends of the interface board 11 and the video board 12. Among these fans, the intake fan 15B functions as a cooling fan (cooling device) for the electro-optical panel 40 described later.

  In FIG. 2, each optical element (element) constituting the optical unit 9 includes an upper light guide 21 or a lower light guide 22 made of a metal such as Mg or Al, including the prism unit 20 constituting the color light combining means. Is supported by The upper light guide 21 and the lower light guide 22 are fixed to the upper case 3 and the lower case 4 with fixing screws.

(Detailed configuration of the optical unit 9)
FIG. 3 is an explanatory diagram showing a detailed configuration of the optical unit used in the projection display device to which the present invention is applied. As shown in FIG. 3, the optical unit 9 includes a light source lamp 805, an illumination optical system 923 having integrator lenses 921 and 922 that are uniform illumination optical elements, and a light beam W emitted from the illumination optical system 923 as red light. Color light separation optical system 924 that separates the light beams R, G, and B of green, blue. The optical unit 9 includes three transmissive electro-optical panels 40 (R), 40 (G), and 40 (B) as electro-optical panels (light valves) that modulate light beams of each color, and modulated colors. It has a prism unit 20 as a color light combining optical system for combining light beams, and a projection lens unit 6 for enlarging and projecting the combined light beams on the projection surface. In addition, a relay optical system 927 that guides the electro-optical panel 40 (B) corresponding to the blue light beam B out of the color light beams separated by the color light separation optical system 924 is provided.

  The illumination optical system 923 further includes a reflection mirror 931 so that the optical axis 1a of light emitted from the light source lamp 805 is bent at a right angle toward the front of the apparatus. The integrator lenses 921 and 922 are disposed so as to be orthogonal to each other with the reflection mirror 931 interposed therebetween.

  The color light separation optical system 924 includes a blue-green reflecting dichroic mirror 941, a green reflecting dichroic mirror 942, and a reflecting mirror 943. First, in the blue-green reflective dichroic mirror 941, the blue light beam B and the green light beam G included in the light beam W that has passed through the illumination optical system 923 are reflected at right angles to the green reflecting dichroic mirror 942 side. Head. The red light beam R passes through the blue-green reflecting dichroic mirror 941, is reflected at a right angle by the rear reflecting mirror 943, and is emitted from the red light beam emitting portion 944 to the color light combining optical system side. Next, in the green reflection dichroic mirror 942, only the green light beam G is reflected at right angles out of the blue and green light beams B and G reflected by the blue-green reflection dichroic mirror 941, and the color is emitted from the green light beam emitting portion 945. The light is emitted to the side of the photosynthetic optical system. The blue light beam B that has passed through the green reflecting dichroic mirror 942 is emitted from the blue light beam emitting portion 946 to the relay optical system 927 side. In this embodiment, the distances from the light beam emitting portion of the illumination optical system 923 to the color light beam emitting portions 944, 945, and 946 in the color light separation optical system 924 are all set to be substantially equal.

  Condensing lenses 951 and 952 are arranged on the emission side of the emission portions 944 and 945 of the red light beam and the green light beam of the color light separation optical system 924, respectively. Therefore, the red light beam and the green light beam emitted from each light emitting part are incident on these condenser lenses 951 and 952 and are collimated.

  The collimated red and green light beams R and G are incident on the electro-optical panels 40 (R) and 40 (G) after their polarization directions are aligned by the polarizing plates 160 (R) and 160 (G). Modulated and image information corresponding to each color light is added. That is, the electro-optical panels 40 (R) and 40 (G) are switching-controlled by an image signal corresponding to image information by a driving unit (not shown), thereby modulating each color light passing therethrough. Is called. As such driving means, known means can be used as they are.

  On the other hand, the blue light beam B is guided to the corresponding electro-optical panel 40 (B) through the relay optical system 927 and further aligned in the polarization direction by the polarizing plate 160 (B). Modulation is performed according to the image information. The relay optical system 927 is disposed on the front side of the condensing lens 974, the incident-side reflecting mirror 971, the emitting-side reflecting mirror 972, the intermediate lens 973 disposed between these mirrors, and the electro-optical panel 40 (B). Condensing lens 953 is comprised. As for the length of the optical path of each color beam, that is, the distance from the light source lamp 805 to each liquid crystal panel, the blue beam B is the longest, and the light amount loss of this beam is the greatest. However, the light loss can be suppressed by interposing the relay optical system 927.

  Each color light beam modulated through each electro-optical panel 40 (R), 40 (G), 40 (B) is incident on the polarizing plate 161 (R), 161 (G), 161 (B). The transmitted light is incident on the prism unit 20 (cross dichroic prism) and synthesized. The synthesized color image is enlarged and projected onto a projection surface 1b such as a screen at a predetermined position via a projection lens unit 6 having a projection lens system.

(Configuration of electro-optical panel 40)
FIG. 4 is an explanatory diagram of the electro-optical panel 40 used in the electro-optical module to which the present invention is applied, and FIGS. 4A and 4B each show the electro-optical panel 40 together with each component of the second substrate. It is the top view seen from the side, and its HH 'sectional drawing.

  In FIG. 4 and FIGS. 5 to 8 to be described later, the traveling direction of the light source light is indicated by an arrow L11, and the traveling direction of the display light after the light source light is modulated by the electro-optical panel 40 is indicated by an arrow L12. The flow of cooling air (cooling gas) supplied to the electro-optical panel 40 by the intake fan 15B shown in FIG. In the following description, one of the in-plane directions of the electro-optic panel 40 and the electro-optic module 10 is the X-axis direction, the other is the Y-axis direction, and intersects the X-axis direction and the Y-axis direction. Let the direction be the Z-axis direction. In the drawings referred to below, one side in the X-axis direction (side on which the flexible wiring board 40i is provided) is the X1 side, the other side is the X2 side, and one side in the Y-axis direction is the Y1 side. The other side is the Y2 side, one side in the Z-axis direction (the side on which the light source light is incident) is the Z1 side, and the other side (the side on which the display light is emitted) is the Z2 side.

  In the projection display device 1 described with reference to FIGS. 1 to 3, when the electro-optical panels 40 (R), 40 (G), and 40 (B) are mounted on the optical unit 9, the electro-optical panel 40 ( R), 40 (G), and 40 (B) are mounted as electro-optic modules 10 (R), 10 (G), and 10 (B), which will be described later. The electro-optic modules 40 (R), 40 (G), and 40 (B) have the same configuration, and the electro-optic module includes the electro-optic panels 40 (R), 40 (G), and 40 (B). 10 (R), 10 (G), and 10 (B) have the same configuration for red (R), green (G), and blue (B). Therefore, in the following description, for the electro-optical panels 40 (R), 40 (G), 40 (B), the electro-optical modules 10 (R), 10 (G), 10 (B), etc., the corresponding colors are used. It demonstrates without attaching | subjecting (R) (G) (B) which shows.

  As shown in FIG. 4, in the electro-optical panel 40, the light-transmitting first substrate 51 (element substrate) and the light-transmitting second substrate 52 (counter substrate) are separated by a sealing material 407 through a predetermined gap. It is pasted together. Quartz, heat-resistant glass or the like is used for the first substrate 51 and the second substrate 52, and quartz is used for the first substrate 51 and the second substrate 52 in this embodiment. In this embodiment, the electro-optical panel 40 is a liquid crystal panel, and a liquid crystal layer as an electro-optical material layer 450 is held in a region surrounded by the sealing material 407 between the first substrate 51 and the second substrate 52. Yes. The sealing material 407 is provided in a frame shape along the outer edge of the second substrate 52. The sealing material 407 is a photo-curing adhesive, a thermosetting adhesive, or an adhesive having both photo-curing and thermosetting, and the distance between the two substrates is set to a predetermined value. Gap materials such as glass fiber or glass beads are blended.

  In this embodiment, the first substrate 51 has a quadrangular shape in plan view and includes side surfaces 511, 512, 513, and 514 each having four sides. Similarly to the first substrate 51, the second substrate 52 is quadrangular in plan view, and includes side surfaces 521, 522, 523, and 524 having four sides. At substantially the center of the electro-optical panel 40, an image display area 40a that emits modulated light is provided as a rectangular area in plan view. Corresponding to this shape, the sealing material 407 is also provided in a substantially square shape, and a rectangular frame-shaped peripheral region 40c is provided between the inner peripheral edge of the sealing material 407 and the outer peripheral edge of the image display region 40a.

  In this embodiment, the first substrate 51 is larger in size than the second substrate 52, and the four side surfaces 511, 512, 513, 514 of the first substrate 51 are respectively larger than the side surfaces 521, 522, 523, 524 of the second substrate 52. Projects outward. Therefore, around the second substrate 52, step portions 40s, 40t, 40u, and 40v are formed by the first substrate 51 and the side surfaces 521, 522, 523, and 524 of the second substrate 52, and the step portions 40s, At 40 t, 40 u, and 40 v, the first substrate 51 is in a state of protruding from the second substrate 52.

  Of the first surface 51a and the second surface 51b of the first substrate 51, the first surface 51a opposite to the second substrate 52 corresponds to the image display region 40a, the translucent pixel electrode 405a and the pixel electrode 405a. Pixels including pixel transistors (switching elements / not shown) are formed in a matrix, and an alignment film 416 is formed on the upper side of the pixel electrode 405a. Further, on the first surface 51a of the first substrate 51, a dummy pixel electrode 405b that is formed simultaneously with the pixel electrode 405a is formed in the peripheral region 40c. For the dummy pixel electrode 405b, a configuration in which the dummy pixel transistor is electrically connected, a configuration in which the dummy pixel transistor is not provided, and a configuration in which the dummy pixel electrode is directly electrically connected to the wiring, or a floating state in which no potential is applied The structure which exists in is adopted.

  Further, in the first substrate 51, the side surface 514 located on one side Y1 in the Y-axis direction protrudes larger from the side surface 524 of the second substrate 52 than the other side surfaces 511, 512, and 513. A data line driving circuit 401 and a plurality of terminals 402 are formed along the side surface 514 on the surface (first surface 51 a) on the second substrate 52 side. A scanning line driving circuit 404 is formed on the first substrate 51 along the side surfaces 511 and 512. A flexible wiring board 40 i is connected to the terminal 402, and various potentials and various signals are input to the first board 51 through the flexible wiring board 40 i. In the first substrate 51, a reinforcing adhesive 41 is applied so as to straddle the side surface 514 and the flexible wiring substrate 40i.

  Of the first surface 52 a and the second surface 52 b of the second substrate 52, a light-transmitting common electrode 421 is formed on the first surface 52 a facing the first substrate 51. An alignment film 426 is formed. The common electrode 421 is formed across a plurality of pixels as a substantially entire surface of the second substrate 52 or as a plurality of strip-like electrodes. In this embodiment, the common electrode 421 is formed over a substantially entire surface of the second substrate 52. . In addition, a light shielding layer 408 is formed on the first surface 52 a of the second substrate 52 on the lower layer side of the common electrode 421. In this embodiment, the light shielding layer 408 is formed in a frame shape extending along the outer peripheral edge of the image display region 40 a, and the image display region 40 a is defined by the inner edge of the light shielding layer 408. The outer peripheral edge of the light shielding layer 408 is in a position with a gap between the inner peripheral edge of the sealing material 407 and the light shielding layer 408 and the sealing material 407 are not covered. In the second substrate 52, a light shielding layer formed simultaneously with the light shielding layer 408 may be formed as a black matrix or a black stripe in a region overlapping with a region sandwiched between adjacent pixel electrodes 405a.

  On the first substrate 51, an inter-substrate conduction electrode for establishing electrical continuity between the first substrate 51 and the second substrate 52 in a region overlapping the corner portion of the second substrate 52 outside the sealing material 407. 409 is formed. An inter-substrate conductive material 409a containing conductive particles is disposed between the inter-substrate conductive electrode 409 and the second substrate 52, and the common electrode 421 of the second substrate 52 includes the inter-substrate conductive material 409a and the substrate. It is electrically connected to the first substrate 51 side via the inter-connection electrode 409. For this reason, a common potential is applied to the common electrode 421 from the first substrate 51 side. The sealing material 407 is provided along the outer peripheral edge of the second substrate 52 with substantially the same width dimension. However, the sealing material 407 is provided so as to pass through the inside avoiding the inter-substrate conduction electrode 409 in a region overlapping the corner portion of the second substrate 52.

  In the electro-optical panel 40 having such a configuration, in this embodiment, since the pixel electrode 405a and the common electrode 421 are formed of a light-transmitting conductive film such as an ITO film, the electro-optical panel 40 is a transmissive liquid crystal panel. In the case of such a transmissive liquid crystal panel (electro-optical panel 40), light is incident while light incident from one of the first substrate 51 and the second substrate 52 is transmitted through the other substrate and emitted. Is done. In this embodiment, light (indicated by an arrow L11) incident from the second substrate 52 is transmitted through the first substrate 51 and emitted as modulated light (indicated by an arrow L12). For this reason, the second substrate 52 is disposed on one side Z1 in the Z-axis direction, and the first substrate 51 is disposed on the other side Z2 in the Z-axis direction. Note that when the common electrode 421 is formed using a light-transmitting conductive film and the pixel electrode 405a is formed using a reflective conductive film, a reflective liquid crystal panel can be formed. In the case of a reflective liquid crystal panel, light incident from the second substrate 52 side is modulated while being reflected and emitted by the first substrate 51 side. Since the electro-optical panel 40 of this embodiment is used as a light valve in the above-described projection display device (liquid crystal projector), no color filter is formed. However, when the electro-optical panel 40 is used as a direct-view color display device for an electronic apparatus such as a mobile computer or a mobile phone, a color filter is formed on the second substrate 52.

(Overall configuration of electro-optic module 10)
FIG. 5 is a perspective view of the electro-optic module according to Embodiment 1 of the present invention when viewed from the light emitting side. FIG. 6 is an explanatory diagram of the electro-optic module according to Embodiment 1 of the present invention. FIGS. 6A, 6B, and 6C are plan views of the electro-optic module when viewed from the light emitting side. They are a side view seen from the other side X2 of the X-axis direction, and a bottom view when seen from the light incident side. FIG. 7 is a cross-sectional view of the electro-optic module according to Embodiment 1 of the present invention. FIGS. 7A and 7B are a YZ cross-sectional view and an XZ cross-sectional view of the electro-optic module. FIG. 8 is an exploded perspective view when the electro-optic module according to Embodiment 1 of the present invention is disassembled when viewed from the light emitting side.

  As shown in FIGS. 5 to 8, in order to mount the electro-optical panel 40 on the optical unit 9 of the projection display device 1, the electro-optical module 10 in which the electro-optical panel 40 is held by a frame 60 for the purpose of reinforcement or the like. And In the electro-optic module 10 of the present embodiment, in addition to the electro-optic panel 40 and the frame 60, a first light-transmitting plate 56, a second light-transmitting plate 57, and an incident-side light shielding plate 80 described below are used. . Hereinafter, the detailed configuration of the electro-optic module 10 will be described with reference to FIG.

(Structure of the 1st translucent board 56 and the 2nd translucent board 57)
As shown in FIGS. 4B and 7, in this embodiment, when the electro-optical module 10 is configured using the electro-optical panel 40, the second surface 51 b (outer surface / first substrate 51) of the first substrate 51. The first light transmitting plate 56 (first substrate side light transmitting plate) is attached to the second substrate 52 on the opposite side of the second substrate 52 with an adhesive or the like, and the second surface 52b of the second substrate 52 (outer surface / second surface). A second light transmitting plate 57 (second substrate side light transmitting plate) is surface-bonded to the surface of the substrate 52 opposite to the first substrate 51 with an adhesive. The first light transmitting plate 56 and the second light transmitting plate 57 are each configured as dust-proof glass, and dust and the like are formed on the outer surface (second surface 51b) of the first substrate 51 and the outer surface (second surface) of the second substrate 52. 52b) is prevented from adhering. For this reason, even if dust adheres to the electro-optical panel 40, the dust is separated from the electro-optical material layer 450. Therefore, in the projection type display device 1 described with reference to FIG. 1 and the like, dust is in a defocused state, so that it is possible to suppress the dust from appearing as an image on the projected image.

  Quartz, heat resistant glass, or the like is used for the first light transmitting plate 56 and the second light transmitting plate 57. In the present embodiment, quartz is used for the first light transmitting plate 56 and the second light transmitting plate 57, similarly to the first substrate 51 and the second substrate 52, and the thickness thereof is 1.1 to 1.2 mm. It is. The second light transmitting plate 57 may be a light transmitting plate having a relatively high thermal conductivity, such as quartz or sapphire.

  The first light transmissive plate 56 has a quadrangular shape having a size larger than that of the first substrate 51 in plan view, and the side surfaces 561, 562, 563, and 564 of the first light transmissive plate 56 are respectively in plan view in the first substrate 51. The side surfaces 511, 512, 513, and 514 of the second substrate 52 and the side surfaces 521, 522, 523, and 524 of the second substrate 52 are located outside. Therefore, an overhanging surface is formed around the first substrate 51 on the surface of the first light transmitting plate 56 on the first substrate 51 side.

  Similarly to the first light transmissive plate 56, the second light transmissive plate 57 has a quadrangular shape larger than the first substrate 51 and the second substrate 52 in a plan view, and the side surfaces 571, 572 of the second light transmissive plate 57, 573 and 574 are located outside the side surfaces 511, 512, 513, and 514 of the first substrate 51 and the side surfaces 521, 522, 523, and 524 of the second substrate 52 in plan view. Therefore, an overhanging surface 570 is formed around the second substrate 52 on the surface of the second light transmitting plate 57 on the second substrate 52 side.

  In the present embodiment, a light shielding layer 579 is provided on the surface of the second light transmitting plate 57 on the second substrate 52 side so as not to overlap with the image display region 40a in the plan view but on the second substrate 52 and on the projecting surface 570. It is integrally formed continuously. For this reason, as shown in FIG. 8, the light shielding layer 579 includes a first portion 579 a formed inside the outer edge of the second substrate 52 and outside the image display region 40 a of the electro-optical panel 40, and the second substrate 52. And a second portion 579b extending from the outer edge to the overhanging surface 570. The light shielding layer 579 performs light shielding on the incident side together with a light shielding plate 80 described later. In this embodiment, the light shielding layer 579 is formed up to the edge of the surface of the second light transmitting plate 57 on the second substrate 52 side. The light shielding layer 579 is formed by, for example, laminating a chromium layer (metal layer / light reflecting layer) and a chromium oxide layer (metal compound layer / light absorbing layer) from the second light transmitting plate 57 side, and has reflectivity. ing. For this reason, the light shielding layer 579 has a higher thermal conductivity than the second light transmitting plate 57.

  Here, the width dimension of the projecting surface 570 of the second translucent plate 57 from the second substrate 52 is such that the width dimension on the side surface 574 side is larger than the width dimension on the other side surfaces 571, 572, 573 side. is there. For this reason, as for the width dimension of the light shielding layer 579 formed by the projecting surface 570, the width dimension on the side surface 574 side is larger than the width dimension on the other side surfaces 571, 572, and 573 side. In particular, the width dimension of the light shielding layer 579 is larger than the width dimension facing the frame 60 on the other side surfaces 571, 572, 573, and the width dimension facing the frame 60 on the side surface 574 side.

(Configuration of frame 60)
In this embodiment, the frame 60 is a rectangular frame-shaped resin member or metal member having a rectangular opening 68 at the center, and the first light transmitting plate 56, the electro-optical panel 40, and the second member in plan view. A frame portion including four wall portions 61, 62, 63, and 64 surrounding the translucent plate 57 is provided. In the wall portions 61, 62, 63, 64, connecting portions (corner portions) between adjacent wall portions are prismatic connecting portions 651, 652, 653, 654. The frame 60 has a higher thermal conductivity than the first substrate 51, the second substrate 52, the first light transmissive plate 56, and the second light transmissive plate 57. For example, the frame 60 is a molded product in which a metal layer is provided on the surface of a resin member, or a metal member such as aluminum, copper, or iron. In this embodiment, the frame 60 is a metal member made of aluminum or the like.

  In the frame 60, the wall portion 61 faces the side surface 561 of the first light transmission plate 56 and the side surface of the electro-optical panel 40, and the wall portion 62 is the side surface 562 of the first light transmission plate 56 and the side surface of the electro-optical panel 40. The wall 63 opposes the side surface 563 of the first light transmissive plate 56 and the side surface of the electro-optical panel 40. On the other hand, the wall portion 64 is formed in a flat plate shape extending along the overhanging portion 515 on the other side Z2 in the Z-axis direction with respect to the overhanging portion 515 of the first substrate 51. Therefore, the flexible wiring board 40 i can be drawn out of the frame 60 so as to extend toward one side in the Y-axis direction along the in-plane direction of the electro-optical panel 40. The wall portion 64 faces the side surface 564 of the first light transmissive plate 56, but does not face the side surface of the electro-optical panel 40. Therefore, in this embodiment, the frame 60 accommodates the first light transmitting plate 56, the electro-optical panel 40, and the second light transmitting plate 57 inside by the wall portions 61, 62, 63.

  In the frame 60, a plate-shaped light shielding portion 67 protrudes inward from the end of the other side Z2 of the wall portions 61, 62, 63, 64 in the Z-axis direction. The plate-shaped light shielding portion 67 is a first light transmitting plate. In FIG. 56, it overlaps the surface opposite to the side where the electro-optical panel 40 is located. The plate-shaped light-shielding portion 67 is formed with an opening 670 in a region overlapping the image display region 40 a of the electro-optical panel 40, and the plate-shaped light-shielding portion 67 serves as a parting part on the emission side with respect to the electro-optical panel 40. Function. Here, the thickness dimension of the plate-shaped light shielding part 67 is considerably smaller than the thickness dimension (dimension in the Z-axis direction) of the wall parts 61, 62, 63, 64. Note that the surface of the frame 60 facing the other side Z2 in the Z-axis direction is blackened by painting or the like.

  The second translucent plate 57 is larger in size than the first translucent plate 56, the first substrate 51, and the second substrate 52, and the side surfaces 571, 572, 573, and 574 of the second translucent plate 57 are the first translucent plate. It is located outside the plate 56, the first substrate 51 and the second substrate 52. For this reason, the inner side surfaces of the wall portions 61, 62, 63 extend linearly from the position facing the side surfaces 561, 562, 563 of the first light transmitting plate 56 to the one side Z1 in the Z-axis direction, And then face the side surfaces 571, 572, 573 of the second light transmitting plate 57. For this reason, when the electro-optic module 10 is assembled, the first light-transmitting plate 56 and the second light-transmitting plate 57 are attached to the electro-optical panel 40, and then the first light-transmitting light is transmitted from one side Z1 of the frame 60 in the Z-axis direction. The electro-optical panel 40 can be provided inside the frame 60 with the plate 56 side leading.

  The inner surfaces of the wall portions 61, 62, and 63 are bent along the protruding surface 570 of the second light transmitting plate 57 from the second substrate 52 and the side surfaces 571, 572, and 573 of the second light transmitting plate 57. Corner portions 618, 628, and 638 are formed. Therefore, the frame 60 can position the second light transmitting plate 57 by the corner portions 618, 628, 638. Further, the frame 60 is opposed to the projecting surface 570 of the second light transmitting plate 57 from the second substrate 52 and the side surfaces 571, 572, 573 of the second light transmitting plate 57 by the corner portions 618, 628, 638, As a result, the wall portions 61, 62, 63 of the frame 60 are opposed to the light shielding layer 579 formed on the surface of the second light transmitting plate 57 on the second substrate 52 side.

  An adhesive P is interposed between the frame 60 and the first light transmitting plate 56, the electro-optical panel 40 (the first substrate 51 and the second substrate 52), and the second light transmitting plate 57. For this reason, the adhesive P is also interposed between the wall portions 61, 62, 63 of the frame 60 and the light shielding layer 579, and no air layer is interposed.

  Note that, on one side Z1 of the wall portion 63 in the Z-axis direction, the end portion on the other side Y2 in the Y-axis direction is a tapered surface 637, which is indicated by an intake fan 15B shown in FIG. When cooling air is supplied to the electro-optic module 10, the cooling air is efficiently guided to one side Z1 of the electro-optic module 10 in the Z-axis direction. Further, when the cooling air is supplied to the electro-optic module 10, the cooling air is also guided to the other side Z <b> 2 of the electro-optic module 10 in the Z-axis direction.

(Configuration of light-shielding plate 80 on the incident side)
On the light incident side (one side Z1 in the Z-axis direction) with respect to the frame 60, a plate-shaped light shielding plate 80 made of a metal plate or a resin plate is disposed so as to overlap. In this embodiment, the light shielding plate 80 is made of metal. The light shielding plate 80 includes a rectangular end plate portion 87 that overlaps the frame 60 on the light incident side, and an opening 88 that overlaps the image display region 40 a of the electro-optical panel 40 is formed in the end plate portion 87. ing. The opening 88 is smaller than the opening 68 of the frame 60, and the end plate part 87 protrudes inside the opening 68 on the entire circumference of the opening 68. For this reason, the end plate part 87 of the light shielding plate 80 functions as a parting part that limits the range in which light enters the electro-optical panel 40.

  The light shielding plate 80 includes side plate portions 81, 82, 83, 84 extending from the outer edge of the end plate portion 87. Among these side plate portions 81, 82, 83, 84, the side plate portions 81, 82 located on both sides in the X-axis direction are separated from the end portions of the end plate portions 87 so as to overlap the outer surfaces of the wall portions 61, 62. It is bent at a substantially right angle toward the other side Z2 in the axial direction. In this embodiment, the side plate portions 81 and 82 are provided at two locations that are separated from each other in the Y-axis direction, and engagement holes 810 and 820 are formed in the two side plate portions 81 and 82, respectively. On the other hand, protrusions 617 and 627 that fit into the engagement holes 810 and 820 are formed on the outer surfaces of the wall portions 61 and 62 of the frame 60. Therefore, the light shielding plate 80 is coupled to the frame 60 by the side plate portions 81 and 82 provided so as to sandwich the frame 60 from both sides and engages with the outer surface of the frame 60, and is integrated with the frame 60. In this state, a panel housing portion having the end plate portion 87 of the light shielding plate 80 as a bottom portion is formed inside the frame 60, and the first light transmitting plate 56 and the second light transmitting plate 57 are provided in the panel housing portion. The affixed electro-optical panel 40 is accommodated. Here, protrusions 619 and 629 are formed on the outer surfaces of the walls 61 and 62 on the sides of the protrusions 617 and 627, and the protrusions 619 and 629 are used for positioning the side plate portions 81 and 82. It is.

  In the electro-optic module 10 configured as described above, the end portion 60t on the one side Z2 in the Z-axis direction of the walls 61, 62, 63 is in the same plane as the end surface on the one side Z2 in the Z-axis direction of the light shielding plate 80. There is no level difference between the light shielding plate 80 and the end portion 60t on one side Z2 in the Z-axis direction of the wall portions 61, 62, 63. For this reason, when the cooling air is supplied to the electro-optic module 10 as indicated by the arrow A, the cooling air smoothly flows on one side Z1 of the electro-optic module 10 in the Z-axis direction.

(Method for manufacturing electro-optic module 10)
In the manufacturing process of the electro-optical module 10 described with reference to FIGS. 5 to 8, first, the entire surface of the first light-transmitting plate 56 and the entire surface of the second light-transmitting plate 57 are bonded to both surfaces of the electro-optical panel 40. Affix with. Next, the electro-optical panel 40 is provided on the inner side of the frame 60 so that the first light-transmitting plate 56 side precedes from one side Z1 of the frame 60 in the Z-axis direction. As a result, the first light transmissive plate 56 abuts on the plate-shaped light shielding portion 67, and the first light transmissive plate 56 and the electro-optical panel 40 are positioned in the Z-axis direction. Further, the side surfaces 561, 562, 563, 564 of the first light transmitting plate 56 abut on the inner side surfaces of the wall portions 61, 62, 63, 64 of the frame 60, and the first light transmitting plate 56 and the electro-optical panel 40 are in contact with each other. Positioning in the X-axis direction and the Y-axis direction is performed. At that time, the adhesive P is applied in advance to the inside of the frame 60 or the like. Next, the light shielding plate 80 is coupled to the frame 60, and the adhesive P is cured in this state.

  Further, the frame 60 may be used for positioning the second light transmissive plate 57 when the second light transmissive plate 57 is attached to the second substrate 52 of the electro-optical panel 40. More specifically, after the first light transmitting plate 56 is attached to the first substrate 51 of the electro-optical panel 40, the electro-optical panel 40 attached with the first light transmitting plate 56 is accommodated inside the frame 60. At that time, the adhesive P is applied to the inside of the frame 60. Next, the second light transmitting plate 57 is inserted from the opening 68 of the frame 60, and the second light transmitting plate 57 is positioned in the X axis direction and the Y axis direction by the frame 60. The second substrate 52 of the electro-optical panel 40 is overlapped with an adhesive. Thereafter, the light shielding plate 80 is coupled to the frame 60, and the adhesive P is cured in this state.

(Main effects of this form)
As described above, in the electro-optic module 10 of the present embodiment, the second light transmissive plate 57 is disposed to face the second substrate 52 side of the electro optic panel 40, and the second light transmissive plate 57 has the second light transmissive plate 57. On the surface on the substrate 52 side, a light shielding layer 579 is continuously formed on a region that overlaps the second substrate 52 without overlapping the image display region 40a in a plan view, and a protruding surface 570 from the second substrate 52. The wall portions 61, 62, and 63 of the frame 60 are disposed to face the light shielding layer 579 of the overhanging surface 570. Here, the light shielding layer 579 has higher thermal conductivity than the second light transmitting plate 57. In addition, an adhesive when the second light transmitting plate 57 is attached to the second substrate 52 is interposed between the light shielding layer 579 and the second substrate 52, and the light shielding layer 579 and the walls 61, 62, 63, An adhesive P is interposed between the two. For this reason, no air layer is interposed between the light shielding layer 579 and the second substrate 52 and between the light shielding layer 579 and the wall portions 61, 62, 63. For this reason, the heat generated in the electro-optical panel 40 can be released from the second substrate 52 to the frame 60 via the light shielding layer 579. Therefore, since the temperature increase of the electro-optical panel 40 can be suppressed low, deterioration of the electro-optical material layer 450 due to the temperature increase of the electro-optical panel 40 can be suppressed.

  The second translucent plate 57 is larger in size than the second substrate 52 and has an overhanging surface 570 formed around the entire circumference of the second substrate 52. The overhanging surface 570 has an image display area in plan view. A light shielding layer 579 is formed so as to surround the entire circumference of the region overlapping with 40a. For this reason, since the heat generated in the electro-optical panel 40 can be released to the frame 60 by using the light-shielding layer 579 that forms a parting for the electro-optical panel 40, the configuration can be simplified. Further, since the light shielding layer 579 is formed up to the outer edge of the second light transmitting plate 57, the overlapping area between the light shielding layer 579 and the wall portions 61, 62, 63 of the frame 60 can be widened. Therefore, the heat generated in the electro-optical panel 40 can be efficiently released from the light shielding layer 579 to the frame 60.

  In this embodiment, the adhesive P is interposed between the electro-optical panel 40 and the frame 60, and no air layer is interposed. Therefore, the heat of the electro-optical panel 40 is easily released to the frame 60 via the adhesive P.

  Further, the frame 60 has the light shielding layer 579 of the projecting surface 570 from the second substrate 52 of the second light transmitting plate 57 and the side surfaces 571, 572, 573 of the second light transmitting plate 57 by the corner portions 618, 628, 638. Therefore, the overlapping area of the second light transmitting plate 57 and the frame 60 is large. Further, the adhesive P is interposed between the frame 60 and the side surfaces 571, 572, 573 of the second light transmitting plate 57, and no air layer is present. For this reason, the heat generated in the electro-optical panel 40 can be released to the frame 60 also from the side surfaces 571, 572, 573 of the second light transmitting plate 57. Therefore, the temperature rise of the electro-optical panel 40 can be suppressed low.

  If a structure in which the second light transmission plate 57 is overlapped with the end portion 60t on the one side Z1 in the Z-axis direction of the frame 60 is adopted, the area where the second light transmission plate 57 and the cooling air are in contact with each other is enlarged. In this embodiment, the frame 60 faces the side surfaces 571, 572, 573 of the second light transmitting plate 57. Therefore, there is an advantage that the second light transmission plate 57 can be positioned in the X-axis direction and the Y-axis direction by the frame 60.

  In this embodiment, since the plate-shaped light shielding portion 67 is provided on the frame 60, it is not necessary to arrange the light shielding plate on the first light transmitting plate 56 side. Moreover, the thickness dimension of the plate-shaped light-shielding part 67 is considerably smaller than the thickness dimension (dimension in the Z-axis direction) of the wall parts 61, 62, 63, 64. For this reason, as shown by the arrow A, when the flow of cooling air is formed along the surface of the other side Z2 in the Z-axis direction of the electro-optic module 10 by the intake fan 15B shown in FIG. Smoothly enters the opening 670 of the light shielding portion 67 and flows from the other side Y2 in the Y-axis direction to the one side Y1. For this reason, the heat generated in the electro-optical panel 40 can be released to the cooling air via the first light transmitting plate 56.

[Variation 1 of Embodiment 1]
FIG. 9 is a cross-sectional view of an electro-optical module 10 according to a first modification of the first embodiment of the present invention. FIGS. 9A and 9B are a YZ cross-sectional view and an XZ cross-sectional view of the electro-optical module. It is. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 9, also in the electro-optic module 10 of this embodiment, the second light transmitting plate 57 is larger in size than the second substrate 52 and formed on the projecting surface 570 from the second substrate 52 as in the first embodiment. The wall portions 61, 62, and 63 of the frame 60 are disposed to face the light shielding layer 579 with an adhesive P interposed therebetween.

  In this embodiment, unlike the first embodiment, the light shielding plate 80 is not used, and only the light shielding layer 579 constitutes a parting on the incident side. Therefore, on one side Z1 in the Z-axis direction where the second light transmissive plate 57 is located, the end 60t of the frame 60 and the surface of the second light transmissive plate 57 opposite to the second substrate 52 are the same. The light shielding plate 80 and the end portion 60t of the frame 60 are overhanging in the same plane.

  Therefore, in this embodiment, there is no step due to the light shielding plate 80 on the one side Z1 of the second light transmitting plate 57 in the Z-axis direction. Therefore, as shown by the arrow A, when the cooling air flow is formed along the surface of the other side Z2 in the Z-axis direction of the electro-optic module 10 by the intake fan 15B shown in FIG. The two light-transmitting plates 57 smoothly flow from the other side Y2 in the Y-axis direction to the one side Y1 along the surface on the one side Z1 in the Z-axis direction. Therefore, the heat generated in the electro-optical panel 40 can be released to the cooling air via the second light transmitting plate 57 and the frame 60. Further, since there is no step due to the light shielding plate 80 on the one side Z1 in the Z-axis direction of the second light transmitting plate 57, foreign matters such as dust do not accumulate in the step.

[Modification 2 of Embodiment 1]
10 is a cross-sectional view of an electro-optical module 10 according to a second modification of the first embodiment of the present invention. FIGS. 10A and 10B are a YZ cross-sectional view and an XZ cross-sectional view of the electro-optical module. It is. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 10, also in the electro-optic module 10 of the present embodiment, the second light transmitting plate 57 is larger than the second substrate 52 and formed on the projecting surface 570 from the second substrate 52 as in the first embodiment. The wall portions 61, 62, and 63 of the frame 60 are disposed to face the light shielding layer 579 with an adhesive P interposed therebetween.

  In this embodiment, unlike the first embodiment and the first modification of the first embodiment, a light shielding layer 569 for parting is formed on the surface of the first light transmitting plate 56 on the electro-optical panel 40 side, and the frame 60 is not formed with a plate-shaped light shielding portion 67 (see FIG. 7). Further, on the other side Z2 in the Z-axis direction where the first light transmissive plate 56 is located, the end 60s of the frame 60 and the surface opposite to the first substrate 51 of the first light transmissive plate 56 are the same. It protrudes in the plane, and there is no level difference caused by the plate-shaped light shielding portion 67. The light shielding layer 569 is formed by laminating a chromium oxide layer (metal compound layer / light absorption layer) and a chromium layer (metal layer / light reflection layer) from the first light transmitting plate 56 side. Since other configurations are the same as those of the first embodiment and the first modification of the first embodiment, this embodiment has substantially the same effects as the first embodiment and the first modification of the first embodiment.

  Thus, in the present embodiment, there is no step due to the plate-shaped light shielding portion 67 on the other side Z2 of the first translucent plate 56 in the Z-axis direction. Accordingly, as shown by the arrow A, when the flow of cooling air is formed along the surface of the other side Z2 in the Z-axis direction of the electro-optic module 10 by the intake fan 15B shown in FIG. The light smoothly flows from the other side Y2 in the Y-axis direction to the one side Y1 along the surface of the other side Z2 in the Z-axis direction of the light transmitting plate 56. Therefore, the heat generated in the electro-optical panel 40 can be released to the cooling air via the first light transmitting plate 56 and the frame 60. Further, since there is no step due to the plate-shaped light-shielding portion 67 on the other side Z2 in the Z-axis direction of the first light transmitting plate 56, foreign matters such as dust do not accumulate at the step.

[Modification 3 of Embodiment 1]
In the embodiment, both the plate-shaped light shielding portion 67 and the light-shielding plate 80 are omitted, but a configuration in which the light-shielding plate 80 is left while the plate-shaped light shielding portion 67 is omitted may be employed.

[Embodiment 2]
FIG. 11 is a cross-sectional view of the electro-optical module 10 according to Embodiment 2 of the present invention, and FIGS. 11A and 11B are a YZ cross-sectional view and an XZ cross-sectional view of the electro-optical module. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 11, also in the electro-optic module 10 of the present embodiment, the second light transmitting plate 57 is larger in size than the second substrate 52 and formed on the projecting surface 570 from the second substrate 52 as in the first embodiment. The wall portions 61, 62, and 63 of the frame 60 are disposed to face the light shielding layer 579 with an adhesive P interposed therebetween. Further, the inner surfaces of the walls 61 and 62 located on the one side X1 and the other side X2 in the X-axis direction in the frame 60 are the side surfaces 561 and 562 of the first light transmission plate 56 and the electric It faces the side surface of the optical panel 40.

  In the present embodiment, unlike the first embodiment, the wall portion 63 of the frame 60 has an end portion 60s on the other side Z2 in the Z-axis direction at a height position between the first substrate 51 and the second substrate 52. . For this reason, the inner side surface of the wall portion 63 faces the side surface 523 of the second substrate 52, but does not face the side surface 563 of the first light transmitting plate 56 and the side surface 513 of the first substrate 51. Further, the adhesive P is not provided between the electro-optical panel 40 and the frame 60. For this reason, a hollow air passage S1 extending in the Y-axis direction is formed on one side X1 in the X-axis direction between the electro-optical panel 40 and the frame 60, and the other side X2 in the X-axis direction. In addition, a hollow air passage S2 extending in the Y-axis direction is formed. Further, the air passages S1 and S2 are open on both the one side Y1 and the other side Y2 in the Y-axis direction.

  Here, the first light transmission plate 56 is smaller in size than the first substrate 51, and the side surfaces 561, 562, 563, 564 of the first light transmission plate 56 and the wall portions 61, 62, 63, 64 of the first frame 60. There is a gap between them. Further, the adhesive P is not provided between the side surfaces 561, 562, 563, 564 of the first light transmitting plate 56 and the wall portions 61, 62, 63, 64 of the first frame 60.

  In the electro-optic module 10 configured as described above, the light shielding plate 70 having the same configuration as the light shielding plate 80 is disposed on the other side Z2 in the Z-axis direction with respect to the first light transmitting plate 56, and the light shielding is performed. Similar to the light shielding plate 80, the plate 70 is coupled by a hook mechanism or the like. For this reason, the plate-like light shielding part 67 (see FIG. 7 and the like) is not formed on the frame 60, and the light shielding layer 569 (see FIG. 10) is not formed on the first light transmitting plate 56.

  Further, the gaps between the side surfaces 561 and 562 of the first light transmission plate 56 and the wall portions 61 and 62 of the frame 60 are closed by the light shielding plate 70. Further, the end portion 60s on the other side Z2 in the Z-axis direction of the wall portion 63 of the frame 60 is a flat surface and is opposed to the light shielding plate 70 with a wide gap. Since other configurations are the same as those in the first embodiment, this embodiment has substantially the same effects as those in the first embodiment.

  As described above, in the present embodiment, the ventilation paths S1 and S2 extending in the Y-axis direction are configured between the electro-optical panel 40 and the frame 60. For this reason, as shown by the arrow A, when the cooling air is supplied to the electro-optic module 10 from the other side Y2 in the Y-axis direction by the intake fan 15B shown in FIG. 1, the cooling air passes through the ventilation paths S1 and S2. In doing so, the electro-optical panel 40 is directly cooled. Therefore, the temperature increase of the electro-optical panel 40 can be suppressed low.

  In addition, there are gaps between the side surfaces 561 and 562 of the first light transmitting plate 56 and the wall portions 61 and 62 of the frame 60, but since these gaps are blocked by the light shielding plate 70, the cooling air flows. There is no leakage from the air passages S1, S2. Therefore, the electro-optical panel 40 can be efficiently cooled by the cooling air passing through the ventilation paths S1 and S2.

  Further, when cooling air is supplied to the electro-optic module 10 from the other side Y2 in the Y-axis direction, the end 60s on the other side Z2 in the Z-axis direction of the wall part 63 of the frame 60 and the light shielding plate 70 cause the cooling air to flow. It functions as a guide portion that smoothly guides to the air passages S1 and S2. Therefore, the cooling air is efficiently guided to the air passages S1 and S2.

[Modification of Embodiment 2]
In the electro-optic module 10 described in the second embodiment, as described in the first modification of the first embodiment, the configuration in which the light shielding plate 80 is not used allows the cooling air to be transmitted to the second light transmitting plate. 57 may flow smoothly from the other side Y2 in the Y-axis direction to the one side Y1 along the surface on the one side Z1 in the Z-axis direction.

[Embodiment 3]
FIG. 12 is a cross-sectional view of the electro-optic module 10 according to Embodiment 3 of the present invention. FIGS. 12A and 12B are a YZ cross-sectional view and an XZ cross-sectional view of the electro-optic module. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 12, also in the electro-optic module 10 of the present embodiment, the second light transmitting plate 57 is larger in size than the second substrate 52 and formed on the projecting surface 570 from the second substrate 52, as in the first embodiment. The wall portions 61, 62, and 63 of the frame 60 are disposed to face the light shielding layer 579 with an adhesive P interposed therebetween. Further, the inner surfaces of the walls 61 and 62 located on the one side X1 and the other side X2 in the X-axis direction in the frame 60 are the side surfaces 561 and 562 of the first light transmission plate 56 and the electric It faces the side surface of the optical panel 40.

  Further, in the present embodiment, as in the second embodiment, in the wall portion 63 of the frame 60, the end portion 60s on the other side Z2 in the Z-axis direction is at a height position between the first substrate 51 and the second substrate 52. is there. For this reason, the inner side surface of the wall portion 63 faces the side surface 523 of the second substrate 52, but does not face the side surface 563 of the first light transmitting plate 56 and the side surface 513 of the first substrate 51. In this embodiment, the first light transmitting plate 56 is larger in size than the first substrate 51, and a light blocking layer 569 for parting is formed on the surface of the first light transmitting plate 56 on the electro-optical panel 40 side. Yes. For this reason, the plate-shaped light shielding part 67 is not formed in the frame 60.

  In the present embodiment, the adhesive P is not provided between the side surfaces 561, 562, 563, 564 of the first light transmitting plate 56 and the frame 60, or between the electro-optical panel 40 and the frame 60. . For this reason, a hollow air passage S1 extending in the Y-axis direction is formed on one side X1 in the X-axis direction between the electro-optical panel 40 and the frame 60, and the other side X2 in the X-axis direction. In addition, a hollow air passage S2 extending in the Y-axis direction is formed. Further, the air passages S1 and S2 are open on both the one side Y1 and the other side Y2 in the Y-axis direction. Note that there are gaps between the side surfaces 561, 562, 563, 564 of the first light transmitting plate 56 and the wall portions 61, 62, 63, 64 of the first frame 60. Is not provided. However, the first light transmission plate 56 is larger in size than the first substrate 51, and the side surfaces 561, 562, 563, 564 of the first light transmission plate 56 and the wall portions 61, 62, 63, 64 of the first frame 60, The gap between is narrow. Since other configurations are the same as those in the first and second embodiments, this embodiment has substantially the same effects as those in the first and second embodiments.

  As described above, in the present embodiment, the ventilation paths S1 and S2 extending in the Y-axis direction are configured between the electro-optical panel 40 and the frame 60. For this reason, as shown by the arrow A, when the cooling air is supplied to the electro-optic module 10 from the other side Y2 in the Y-axis direction by the intake fan 15B shown in FIG. 1, the cooling air passes through the ventilation paths S1 and S2. In doing so, the electro-optical panel 40 is directly cooled. Therefore, the temperature increase of the electro-optical panel 40 can be suppressed low.

  In this embodiment, there are gaps between the side surfaces 561, 562, 563, and 564 of the first light transmitting plate 56 and the wall portions 61, 62, 63, and 64 of the first frame 60. When manufacturing the module 10, the space between the side surfaces 561, 562, 563, 564 of the first light transmitting plate 56 and the wall portions 61, 62, 63, 64 of the first frame 60 may be filled with the adhesive P. According to such a configuration, it is possible to prevent leakage of cooling air from the air passages S1 and S2. Further, since there are no gaps between the side surfaces 561, 562, 563, 564 of the first light transmitting plate 56 and the wall parts 61, 62, 63, 64 of the first frame 60, foreign substances such as dust accumulate in the gaps. There is nothing. Further, since there are no gaps between the side surfaces 561, 562, 563, 564 of the first light transmission plate 56 and the wall portions 61, 62, 63, 64 of the first frame 60, the cooling air is supplied to the first light transmission plate 56. Smoothly flows from the other side Y2 in the Y-axis direction to the one side Y1 along the surface of the other side Z2 in the Z-axis direction.

[Modification of Embodiment 3]
In the electro-optic module 10 described in the above-described third embodiment, as described in the first modification of the first embodiment, the configuration in which the light shielding plate 80 is not used allows the cooling air to be transmitted to the second light-transmitting plate. 57 may flow smoothly from the other side Y2 in the Y-axis direction to the one side Y1 along the surface on the one side Z1 in the Z-axis direction.

[Embodiment 4]
FIG. 13 is a cross-sectional view of the electro-optic module 10 according to Embodiment 4 of the present invention, and FIGS. 13A and 13B are a YZ sectional view and an XZ sectional view of the electro-optic module. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 13, also in the electro-optic module 10 of the present embodiment, the second light transmitting plate 57 is larger in size than the second substrate 52 and formed on the projecting surface 570 from the second substrate 52 as in the first embodiment. The wall portions 61, 62, and 63 of the frame 60 are disposed to face the light shielding layer 579 with an adhesive P interposed therebetween.

  In this embodiment, for the purpose of improving heat dissipation from the electro-optical panel 40 (the first substrate 51 and the second substrate 52) to the frame 60, the electro-optical panel 40 and the second light transmitting plate are provided inside the frame 60. A heat radiating member 30 having a rectangular frame shape is arranged around 57, and the heat radiating member 30 overlaps the surface of the light shielding plate 80 on the side where the electro-optical panel 40 is located. In this embodiment, the heat dissipation member 30 is a metal member such as aluminum, copper, or iron, and has a higher thermal conductivity than the first substrate 51, the second substrate 52, and the second light transmitting plate 57.

  The heat dissipating member 30 includes a wall portion 31 positioned between the electro-optical panel 40 and the wall portion 61 of the frame 60, a wall portion 32 positioned between the electro-optical panel 40 and the wall portion 62 of the frame 60, A wall portion 33 is provided between the optical panel 40 and the wall portion 63 of the frame 60. Here, on one side Y <b> 1 in the Y-axis direction, the wall portion 64 of the frame 60 is not configured to face the electro-optical panel 40 on one side in the Y-axis direction, and the wall portion of the electro-optical panel 40 and the frame 60. The heat dissipating member 30 is not disposed between 64 and 64. However, the heat radiating member 30 is formed with a wall portion 34 facing the overhanging portion 515 of the first substrate 51 on one side Z1 in the Z-axis direction, and the wall portion 34 is formed on the side surface 524 of the second substrate 52. Facing one side Y1 in the Y-axis direction. Therefore, the heat radiating member 30 includes the wall portion 34 facing the side surface 524 of the second substrate 52, and the wall portion 31 extending between the side surface 521 of the second substrate 52 and the frame 60 from one end side of the wall portion 34. A wall 32 extending between the side surface 522 of the second substrate 52 and the frame 60 from one end side of the wall 34, and between the second substrate 52 and the frame 60 at a position facing the wall 34. And a wall portion 33 extending in the direction. In this embodiment, when the heat radiating member 30 is viewed in plan, the width dimension of the wall part 34 is larger than the width dimension of the wall parts 31, 32, 33.

  In the heat radiating member 30, the outer surfaces of the wall portions 31, 32, 33 facing the wall portions 61, 62, 63 of the frame 60 extend linearly in the Z-axis direction. On the other hand, the inner side surfaces of the wall portions 31, 32, and 33 have a multi-stage shape that is bent along the outer shape of the electro-optical panel 40 and the second light transmitting plate 57. Therefore, the inner surfaces of the walls 31, 32, 33 are the side surfaces 511, 512, 513 of the first substrate 51, the projecting surface of the first surface 51 a of the first substrate 51 from the second substrate 52, and the second substrate 52. The side surfaces 521, 522, and 523, the projecting surface 570 of the second light transmitting plate 57 from the second substrate 52, and the side surfaces 571, 572, and 573 of the second light transmitting plate 57 are opposed to each other. Moreover, the edge part of the other side Z2 of the Z-axis direction of wall part 31,32,33 opposes the 1st translucent board 56, and the edge part of one side Z1 of the wall part 31,32,33 in the Z-axis direction is The second substrate 52 and the frame 60 are opposed to the light shielding layer 579 formed on the protruding surface 570 of the second light transmitting plate 57.

  On the other hand, the wall portion 34 faces the light shielding layer 579 formed on the side surface 524 of the second substrate 52 and the protruding surface 570 of the second light transmitting plate 57.

In this embodiment, the overlapping width of the light shielding layer 579 and the wall portions 31, 32, 33, 34 of the heat radiating member 30 has the following relationship: wall portion 31 = wall portion 32≈wall portion 33 <wall portion 34
It is in.

  In this embodiment, the flexible wiring board 40i and the wall portion 34 of the heat dissipation member 30 face each other, and the portion of the overhang 515 that protrudes from the flexible wiring board 40i and the wall portion 34 of the heat dissipation member 30 face each other. Yes. For this reason, the flexible wiring board 40i is bent to the side opposite to the heat radiating member 30, or an insulating material such as a coating layer is disposed between the flexible wiring board 40i and the wall portion 34 of the heat radiating member 30 to It is preferable to prevent a short circuit between the substrate 40 i and the heat dissipation member 30. In addition, an insulating material such as a coating layer is disposed between the portion of the overhanging portion 515 that protrudes from the flexible wiring board 40 i and the wall portion 34 of the heat radiating member 30. It is preferable to prevent a short circuit with the conductive layer.

  In the electro-optic module 10 configured in this way, between the first light transmissive plate 56 and the frame 60, between the electro-optic panel 40 and the heat radiating member 30, between the second light transmissive plate 57 and the heat radiating member 30, The adhesive P is interposed between the second light transmitting plate 57 and the frame 60 and between the heat dissipation member 30 and the frame 60, and no air layer is interposed. Accordingly, the adhesive P is interposed between the wall portions 31, 32, 33, and 34 and the light shielding layer 579, and no air layer is interposed. However, the adhesive P is not interposed between the overhanging portion 515 of the first substrate 51 of the electro-optical panel 40 and the heat radiating member 30 or between the flexible wiring board 40 i and the heat radiating member 30. Is intervening. Since the other configuration is the same as that of the first embodiment and the like, this embodiment has substantially the same effect as that of the first embodiment.

  As described above, in this embodiment, the heat radiating member 30 is disposed between the frame 60 and the electro-optical panel 40, and the heat radiating member 30 is a surface of the projecting portion 515 of the first substrate 51 on the second substrate 52 side. The wall portion 34 faces the light shielding layer 579 formed on the side surface 524 of the second substrate 52 and the protruding surface 570 of the second light transmitting plate 57. Further, the heat dissipation member 30 includes wall portions 31 and 32 extending from both end sides of the wall portion 34 toward the side surfaces 521 and 522 of the second substrate 52 and the frame 60. Therefore, the frame 60 does not exist at a position facing the side surface 514 on the side where the overhanging portion 515 of the first substrate 51 is located or the side surface 524 of the second substrate 52, but on the side where the overhanging portion 515 is located, After the heat generated in the electro-optical panel 40 is released to the wall portions 31 and 32 via the wall portion 34 of the heat radiating member 30, it can be further released to the frame 60. Therefore, even if the electro-optic module 10 is not enlarged, the temperature variation and the temperature rise of the entire electro-optic panel 40 can be suppressed to a low level. Therefore, the electro-optic material layer 450 is deteriorated due to the temperature rise of the electro-optic panel 40. Can be suppressed.

  In particular, when a molded product in which a metal layer is provided on the surface of a resin member is used as the frame 60, or when the heat dissipation member 30 has higher thermal conductivity than the frame 60 depending on the type of metal material, the electro-optical panel 40 Heat can be efficiently released to the heat radiating member 30. Therefore, by using the heat radiating member 30, temperature variations and temperature rise of the entire electro-optical panel 40 can be suppressed to a low level. Also, when the heat dissipation member 30 has a larger heat capacity than the frame 60, such as when a thin frame 60 is used, or when the frame 60 has a thin portion, the heat of the electro-optical panel 40 is efficiently transmitted to the heat dissipation member 30. Since it can escape well, by using the heat radiating member 30, the temperature variation and temperature rise of the whole electro-optical panel 40 can be suppressed low.

  Further, the wall portions 31, 32, and 33 of the heat dissipation member 30 are the end portions on the side where the side surfaces 511, 512, and 513 of the first substrate 51 are located, and the sides on which the side surfaces 521, 522, and 523 of the second substrate 52 are located. Therefore, the heat of the electro-optical panel 40 is transferred to the end portions located on the side surfaces 511, 512, and 513 of the first substrate 51 and the side surfaces of the second substrate 52. It is possible to escape to the frame 60 through the heat dissipating member 30 from the end portions located on the side of 521, 522, 523. Further, an adhesive P is interposed between the electro-optical panel 40 and the heat radiating member 30, between the second light transmitting plate 57 and the heat radiating member 30, and between the heat radiating member 30 and the frame 60. Is not present. Accordingly, the heat of the electro-optical panel 40 can be efficiently released to the frame 60 through the heat dissipation member 30.

  Moreover, the width dimension of the wall part 34 is larger than the width dimension of the wall parts 31 and 32 in planar view. For this reason, the heat generated in the electro-optical panel 40 can be efficiently released to the heat radiating member 30 from the side where the protruding portion 515 is located.

[Modification of Embodiment 4]
The electro-optic module 10 described in the third embodiment adopts a configuration that does not use the light shielding plate 80 or the plate-shaped light shielding portion 67 as described in the first, second, and third modifications of the first embodiment. Also good.

[Embodiment 5]
FIG. 14 is a cross-sectional view of the electro-optical module 10 according to Embodiment 5 of the present invention, and FIGS. 14A and 14B are a YZ cross-sectional view and an XZ cross-sectional view of the electro-optical module. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 14, also in the electro-optic module 10 of this embodiment, the second light transmitting plate 57 is larger in size than the second substrate 52 and formed on the projecting surface 570 from the second substrate 52, as in the first embodiment. The wall portions 61, 62, and 63 of the frame 60 are disposed to face the light shielding layer 579 with an adhesive P interposed therebetween.

  In this embodiment, the first light transmissive plate 56 has a rectangular shape smaller in size than the first substrate 51 in plan view, and the first light transmissive plate 56 is disposed on the entire circumference of the second surface 51 b of the first substrate 51. An overhanging surface 55 from the first translucent plate 56 is formed so as to surround it. Corresponding to such a configuration, on the inner side surfaces of the four wall portions 61, 62, 63, 64 of the frame 60, the projecting surface 55 from the first light transmitting plate 56 of the first substrate 51, and the first light transmitting plate Outward corner portions 610, 620, 630, and 640 that are bent along the side surfaces 561, 562, 563, and 564 of the 56 are formed. For this reason, the frame 60 has the protruding surface 55 from the first light transmitting plate 56 of the first substrate 51 and the side surfaces 561, 562, 563 of the first light transmitting plate 56 by the corner portions 610, 620, 630, 640. 564. Also in the electro-optic module 10 having such a configuration, the electro-optic panel 40 can be provided on the inner side of the frame 60 so that the first light-transmitting plate 56 side precedes the one side Z1 of the frame 60 in the Z-axis direction. At that time, the first light transmitting plate 56 abuts on the plate-shaped light shielding portion 67, and the protruding surface 55 of the first substrate 51 abuts on the corner portions 610, 620, 630, 640 of the frame 60, and the first light transmitting plate 56 and the electro-optical panel 40 are positioned in the Z-axis direction. Further, the side surfaces 561, 562, 563, 564 of the first light transmitting plate 56 abut on the corner portions 610, 620, 630, 640, and the X axis direction and the Y axis direction of the first light transmitting plate 56 and the electro-optical panel 40. Positioning is performed.

Here, the overlapping width of the overhanging surface 55 and the wall portions 61, 62, 63, 64 of the frame 60 has the following relationship: wall portion 61 = wall portion 62≈wall portion 63 <wall portion 64
It has become. That is, on the side of the first substrate 51 where the overhang portion 515 to which the flexible wiring substrate 40 i is connected is located, the overlapping width of the overhang surface 55 and the frame 60 is large. Since the other configuration is the same as that of the first embodiment and the like, this embodiment has the same effect as that of the first embodiment.

  As described above, in the present embodiment, the first light transmitting plate 56 is provided so that a part of the second surface 51b of the first substrate 51 protrudes from the first light transmitting plate 56 of the first substrate 51. Corner portions 610, 620, 630, 640 of the frame 60 are opposed to the projecting surface 55 and the side surfaces 561, 562, 563, 564 of the first light transmitting plate 56. Further, an adhesive P is interposed between the projecting surface 55 of the first substrate 51 from the first light transmitting plate 56 and the frame 60 and between the side surfaces 511, 512 and 513 of the first substrate 51 and the frame 60. , No air layer intervenes. Therefore, the heat generated in the electro-optical panel 40 can be efficiently released from the first substrate 51 and the first light transmitting plate 56 to the frame 60. Further, since the overlapping width of the frame 60 and the overhanging surface 55 on the side where the flexible wiring board 40i is located is wide, the electro-optical panel 40 on the side where the flexible wiring board 40i is located (the side where the overhanging portion 515 is located). The heat generated in step 1 can be efficiently released from the first substrate 51 to the frame 60.

[Modification of Embodiment 5]
In the electro-optic module 10 described in the fifth embodiment, as described in the first, second, and third modifications of the first embodiment, a configuration that does not use the light shielding plate 80 or the plate-shaped light shielding portion 67 is adopted. Also good. Further, in the fifth embodiment, the adhesive P is interposed between the electro-optical panel 40 and the frame 60. However, as in the second and third embodiments, ventilation is performed between the electro-optical panel 40 and the frame 60. The paths S1 and S2 may be configured. Further, as in the fourth embodiment, the heat dissipation member 30 may be interposed between the electro-optical panel 40 and the frame 60.

[Other embodiments]
In the above embodiment, the size relationship of the overlapping widths of the light shielding layer 579 and the wall portions 61, 62, 63 of the frame 60 is as follows.
However, the following conditions were satisfied: wall portion 61 = wall portion 62 <wall portion 63
It is preferable that When the cooling gas is supplied to the electro-optic module 10, the side opposite to the side where the overhanging portion 515 is located (the side where the wall portion 63 is located) is taken up, so that the light shielding layer 579 on the upwind side is If the overlapping width with the frame 60 is increased, the heat radiation efficiency is increased. Accordingly, sufficient heat dissipation can be ensured from the whole electro-optical panel 40 without excessively increasing the size of the second light transmitting plate 57 and the frame 60 in the X-axis direction.

  In the above-described embodiment, the wall portions 61, 62, 63, and 64 of the frame 60 extend in the Y-axis direction (the direction in which the cooling gas flows) on the other Z2 surface and the one Z1 surface in the Z-axis direction. By providing existing ribs, the surface area of the frame 60 may be expanded and the heat dissipation of the frame 60 may be enhanced.

  In the above-described embodiment, the electro-optical module 10 including the transmissive electro-optical panel 40 is illustrated, but the present invention may be applied to the electro-optical module 10 including the reflective electro-optical panel 40.

  In the said embodiment, although the front projection type display apparatus which projects from the direction which observes a projected image as a projection type display apparatus was illustrated, the rear projection type display apparatus which projects from the opposite side to the direction which observes a projected image The present invention may be applied to a projection display device used for the above.

  In the above embodiment, the liquid crystal panel has been described as an example of the electro-optical panel. However, the present invention is not limited to this, and the organic electroluminescence display panel, plasma display panel, FED (Field Emission Display) panel, SED The present invention may be applied to an electro-optic module using a (Surface-Conduction Electron-Emitter Display) panel, an LED (light emitting diode) display panel, an electrophoretic display panel, or the like.

  As for the electro-optic module to which the present invention is applied, in addition to the electronic device (projection display device) described above, a head-mounted display, a mobile phone, an information portable terminal (PDA: Personal Digital Assistants), a digital camera, a liquid crystal television, You may use as a direct view type display apparatus in electronic devices, such as a car navigation apparatus, a videophone, a POS terminal, and an apparatus provided with a touch panel.

1 .. Projection type display device 10... Electro-optic module 30... Heat dissipation member 40.. Electro-optical panel (liquid crystal panel) 40 a · Image display area 51 · · First substrate (element substrate) 52 .. Second substrate (counter substrate), 521-524 .. Side surface (first side surface), 55 .. Overhang surface of first substrate, 56 .. First translucent plate (first substrate side translucent plate) 57 .. Second light transmitting plate (second substrate side light transmitting plate), 570 .. Overhang surface of second light transmitting plate, 579 .. Light shielding layer, 60 .. Frame, 80 .. Light shielding plate, 450.・ Electro-optical material layer (liquid crystal layer), P ・ ・ Adhesive, S1, S2 ・ ・ Ventilation path

Claims (14)

An electro-optic panel comprising a first substrate, a second substrate disposed opposite to the first substrate, and an electro-optic material layer provided between the first substrate and the second substrate;
A second substrate-side translucent plate that is disposed opposite to the surface of the second substrate opposite to the first substrate, and has a projecting surface that projects from the second substrate on the surface of the second substrate;
Of the surface on the second substrate side of the second substrate-side translucent plate, formed on a region that overlaps the second substrate so as not to overlap with the image display region of the electro-optical panel in plan view, and the projecting surface. A shading layer,
A frame provided with a wall portion facing the light shielding layer, and the electro-optical panel accommodated inside the wall portion;
An adhesive interposed between each of the light shielding layer and the second substrate and between the light shielding layer and the wall;
An electro-optic module comprising: The second substrate side translucent plate is larger in size than the second substrate, and the protruding surface is formed over the entire circumference of the second substrate,
The electro-optical module according to claim 1, wherein the light shielding layer is formed over the entire circumference of a region overlapping the image display region in plan view.   The electro-optic module according to claim 1, wherein the light shielding layer is formed up to an edge of the second substrate side light transmitting plate. A first substrate-side translucent plate disposed opposite to the surface of the first substrate opposite to the second substrate;
4. The electro-optic module according to claim 1, wherein the first substrate-side light-transmitting plate and the first substrate are smaller in size than the second substrate-side light-transmitting plate. 5. . The first substrate includes a projecting portion that projects from the second substrate, and a terminal formed on a surface of the projecting portion on the second substrate side,
The overlapping width of the light shielding layer and the wall portion on the opposite side of the electro-optical panel with respect to the overhanging portion is larger than the overlapping width of the light shielding layer and the wall portion in other regions. The electro-optic module according to claim 1, wherein the electro-optic module is provided.   The electro-optic module according to any one of claims 1 to 5, wherein an adhesive is interposed between the electro-optic panel and the frame.   6. A ventilation path extending in one of the in-plane directions of the electro-optical panel is formed between the electro-optical panel and the frame. The electro-optic module according to one item.   The heat radiating member having higher thermal conductivity than the first substrate, the second substrate, and the second substrate side translucent plate is disposed between the electro-optical panel and the frame. The electro-optic module according to any one of 1 to 5.   The electro-optic module according to claim 8, wherein the heat radiating member is opposed to the light shielding layer on the projecting surface.   The electro-optical module according to claim 1, wherein the light shielding layer includes at least one of a metal layer and a metal compound layer.   The electro-optic module according to claim 1, wherein the first substrate is an element substrate including a pixel electrode and a switching element provided corresponding to the pixel electrode.   The electro-optical module according to claim 11, wherein the electro-optical panel is a liquid crystal panel including a liquid crystal layer as the electro-optical material layer. An electronic apparatus comprising the electro-optic module according to any one of claims 1 to 12,
A light source unit that emits light supplied to the electro-optic module;
A projection optical system for projecting light modulated by the electro-optic module;
A projection display device characterized by comprising:   The projection display device according to claim 13, further comprising a cooling device that supplies a cooling gas to the electro-optic module.