JP2015095717A - 表面実装型水晶発振器 - Google Patents
表面実装型水晶発振器 Download PDFInfo
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- JP2015095717A JP2015095717A JP2013233274A JP2013233274A JP2015095717A JP 2015095717 A JP2015095717 A JP 2015095717A JP 2013233274 A JP2013233274 A JP 2013233274A JP 2013233274 A JP2013233274 A JP 2013233274A JP 2015095717 A JP2015095717 A JP 2015095717A
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- Prior art keywords
- recess
- crystal oscillator
- ceramic sheet
- chip
- bottom wall
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- 239000013078 crystal Substances 0.000 title claims abstract description 60
- 239000000919 ceramic Substances 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 229910052737 gold Inorganic materials 0.000 claims description 22
- 239000010931 gold Substances 0.000 claims description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 20
- 239000010408 film Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000011104 metalized film Substances 0.000 claims description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- 239000011733 molybdenum Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 33
- 230000007547 defect Effects 0.000 abstract description 3
- 239000012212 insulator Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 11
- 239000004020 conductor Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 230000009193 crawling Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Wire Bonding (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
2・・・底壁
3・・・第1枠壁
4・・・第2枠壁
5・・・容器本体
7・・・水晶振動子
8・・・水晶保持端子
9・・・導電性接着剤
10・・・ICチップ
11・・・IC端子
12・・・パッド
13・・・金バンプ
14・・・配線パターン
15・・・メタライズ膜
16・・・ロー材(銀ロー)
17・・・シールリング
18・・・金属カバー
19・・・実装端子
20・・・アンダーフィル
20A・・・絶縁膜
21・・・ビア
22・・・オーバーハング
23・・・導体パターン
23A・・・金メッキ
30・・・第1凹部
40・・・第2凹部。
Claims (8)
- 多層セラミックシートで成形された容器本体に振動子収容部とICチップを収容するICチップ搭載部を有し、水晶振動子を収容した前記振動子収容部を金属カバーで封止すると共に、前記ICチップを搭載部に樹脂の注入と硬化でアンダーフィルを形成した表面実装型水晶発振器であって、
前記振動子収容部は、前記容器本体を構成する底壁の一方の面に第1の枠壁で形成した第1凹部からなり、
前記ICチップ搭載部は、前記底壁の他方の面に2層以上の多層セラミックシートの第2の枠壁で形成した第2凹部からなり、
前記ICチップ搭載部を構成する前記第2凹部を構成する前記第2の枠壁の開口端面に実装端子を有し、
前記実装端子を有する開口端面を構成する最上層を含む多層のセラミックシートを当該第2凹部の内側にオーバーハングさせて庇を形成し、
前記第2凹部に注入した前記樹脂液の前記実装端子の表面への這い上がり前記オーバーハング部の庇で阻止することを特徴とする表面実装型水晶発振器。 - 請求項1において、
前記オーバーハング部は、第2凹部の開口内端の全周に設けたことを特徴とする表面実装型水晶発振器。 - 請求項1において、
前記オーバーハング部は、第2凹部の開口内端の前記実装端子に隣接する部分のみに設けたことを特徴とする表面実装型水晶発振器。 - 請求項1乃至3の何れかにおいて、
前記第2凹部を構成する第2の枠壁を構成する多層セラミックシートは2層で構成され、
前記2層のセラミックシートの最上層を前記オーバーハングさせて庇を形成したことを特徴とする表面実装型水晶発振器。 - 請求項1乃至4の何れかにおいて、
前記セラミックシートの最上層の前記庇の前記第2凹部の底壁に面した表面に金膜を有することを特徴とする表面実装型水晶発振器。 - 請求項1乃至4の何れかにおいて、
前記最上層のセラミックシートと次のセラミックシートの間に金属層を有し、前記庇の前記第2凹部の底壁に面した表面に前記金属層が延在して露出して形成されていることを特徴とする表面実装型水晶発振器。 - 請求項6において、
前記金属層の前記露出している部分の表面に金膜を有することを特徴とする表面実装型水晶発振器。 - 請求項6又は7において、
前記第2凹部の底壁に設けられる配線パターンはタングステン、もしくはモリブデンのメタライズ膜にニッケルメッキと金メッキを施したものであり、前記金属層は配線パターンと同じタングステン、もしくはモリブデンのメタライズ膜にニッケルメッキと金メッキを施したもので構成されていることを特徴とする表面実装型水晶発振器。
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JP2013233274A JP6258007B2 (ja) | 2013-11-11 | 2013-11-11 | 表面実装型水晶発振器 |
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JP2013233274A JP6258007B2 (ja) | 2013-11-11 | 2013-11-11 | 表面実装型水晶発振器 |
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JP2015095717A true JP2015095717A (ja) | 2015-05-18 |
JP6258007B2 JP6258007B2 (ja) | 2018-01-10 |
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JP2013233274A Active JP6258007B2 (ja) | 2013-11-11 | 2013-11-11 | 表面実装型水晶発振器 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017046206A (ja) * | 2015-08-27 | 2017-03-02 | 京セラクリスタルデバイス株式会社 | 圧電デバイス |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077247A (ja) * | 1999-08-31 | 2001-03-23 | Kinseki Ltd | 電子部品容器 |
JP2003318336A (ja) * | 2002-04-25 | 2003-11-07 | Kyocera Corp | 電子部品装置及び製造方法 |
JP2004214255A (ja) * | 2002-12-27 | 2004-07-29 | Casio Comput Co Ltd | 電子部品の接続構造 |
JP2009124619A (ja) * | 2007-11-19 | 2009-06-04 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
JP2010050536A (ja) * | 2008-08-19 | 2010-03-04 | Nippon Dempa Kogyo Co Ltd | 水晶発振器 |
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2013
- 2013-11-11 JP JP2013233274A patent/JP6258007B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077247A (ja) * | 1999-08-31 | 2001-03-23 | Kinseki Ltd | 電子部品容器 |
JP2003318336A (ja) * | 2002-04-25 | 2003-11-07 | Kyocera Corp | 電子部品装置及び製造方法 |
JP2004214255A (ja) * | 2002-12-27 | 2004-07-29 | Casio Comput Co Ltd | 電子部品の接続構造 |
JP2009124619A (ja) * | 2007-11-19 | 2009-06-04 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
JP2010050536A (ja) * | 2008-08-19 | 2010-03-04 | Nippon Dempa Kogyo Co Ltd | 水晶発振器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017046206A (ja) * | 2015-08-27 | 2017-03-02 | 京セラクリスタルデバイス株式会社 | 圧電デバイス |
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