JP2015079338A - Method for manufacturing touch panel and touch panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To intensively arrange routing wiring at a low cost when manufacturing touch panels.SOLUTION: The invention relates to a method for manufacturing the touch panels. The method for manufacturing the touch panels comprises an electrode and pedestal forming step to form an electrode 33 and a plurality of pedestals 35 by performing pattern exposure of a photosensitive layer on a substrate 20 and developing the same, and a wiring forming step to form routing wiring 38 by discharging a conductive ink 77 on the pedestals 35.

Description

  The present invention relates to a touch panel including a substrate, electrodes, and routing wiring, and a method for manufacturing the touch panel.

  For example, touch panels are widely used as touch input devices provided in electronic devices such as multifunctional mobile phones (smartphones) and portable game machines. As disclosed in, for example, Japanese Patent Application Laid-Open No. 2013-156655 (Patent Document 1), the touch panel includes a substrate [substrate 20], an electrode provided on the substrate [conductive pattern 2a], and a routing connected to the electrode. Wiring [lead line 105]. In many cases, the touch panel is used so as to overlap with a display device such as a liquid crystal display panel or an organic EL display panel. In this case, the electrodes are mainly arranged so as to overlap with the display region of the display device, and the lead wiring is arranged at the peripheral portion thereof. It is often arranged in (non-display area).

  For example, in a portable electronic device, it is generally required to reduce the size of the entire device from the viewpoint of portability. On the other hand, it is also required to secure a display area as large as possible from the viewpoint of visibility and operability. As one of the measures for satisfying both of these requirements, it can be considered to design the non-display area to be as small as possible. In other words, it is conceivable to design the wiring so as to be concentrated and arranged in a non-display area occupying a smaller area.

  In this regard, in the touch panel of Patent Document 1, the lead wiring is formed using a screen printing method using a conductive paste containing conductive particles (see paragraph 0126 of Patent Document 1). However, screen printing often causes bleeding after printing, and the ability to form fine wiring is not so high. Further, for example, Japanese Unexamined Patent Application Publication No. 2006-165422 (Patent Document 2) discloses a technique that uses an ink jet printing method to form conductive wiring such as routing wiring. However, ink jet printing often uses low-viscosity ink, so that bleeding often occurs after printing, and the ability to form fine wiring is low. That is, in these printing methods, there is a limit to reducing the area of the layout area of the routing wiring.

  On the other hand, a method of forming a wiring having a desired pattern using a photolithography method is known as a method excellent in fine wiring forming ability. It is also conceivable to form fine routing wiring using this photolithography method. However, the photolithography method not only requires a large number of processes but also requires equipment corresponding to them, and the yield is also low, resulting in high manufacturing costs.

JP 2013-156655 A JP 2006-165422 A

  Therefore, it is desired to arrange and arrange the routing wirings at a low cost when manufacturing the touch panel. In addition, it is desired to realize a touch panel in which the layout area of the routing wiring is reduced.

According to the present invention, a characteristic configuration of a manufacturing method for manufacturing a touch panel including a substrate, an electrode provided on the substrate, and a routing wiring connected to the electrode,
The photosensitive layer composed of a laminate of a photosensitive resin layer and a conductive layer provided on the substrate is subjected to pattern exposure and development, and the lead composed mainly of the electrode composed of the conductive layer and the photosensitive resin layer. An electrode pedestal forming step for forming a pedestal disposed in a region where the wiring is to be disposed;
A wiring forming step of discharging conductive ink on the pedestal and forming the routing wiring mainly composed of the conductive ink;
It is in the point including.

  According to this characteristic configuration, the touch panel is manufactured by combining the photolithography method and the discharge printing method. In the electrode pedestal formation step, the electrode pattern can be formed by using a photolithography method, and the pedestal can be formed in a region where the routing wiring is to be disposed. Since the photolithography method is excellent in the ability to form fine wiring, the width of the pedestal and the interval between the pedestals can be formed narrow. Further, in the subsequent wiring formation process, when the conductive ink is discharged onto the pedestal by the discharge printing method, the conductive ink can be stored on the pedestal due to the edge effect, so that the conductive ink does not easily spread. In addition, the presence of grooves formed between adjacent pedestals can ensure a large creepage distance between the routing wires, so that the occurrence of poor insulation due to migration of conductive particles constituting the routing wires can be suppressed in plan view. The distance between the lines can be kept small. Therefore, the routing wiring can be concentrated and arranged in a limited area.

  At this time, in the above-described characteristic configuration, the process for forming the electrode pattern and the process for forming the pedestal are at least partially shared. In other words, the pedestal is formed in accordance with the steps necessary for forming the electrode pattern. For this reason, the number of processes can be significantly reduced and cost can be reduced as compared with a case where a lead wiring is separately formed by a photolithography method.

  Hereinafter, the suitable aspect of the manufacturing method of the touchscreen which concerns on this invention is demonstrated. However, the scope of the present invention is not limited by the preferred embodiments described below.

  As one aspect, the photosensitive resin layer is a negative type, and the electrode pedestal forming step includes a step of pattern exposure with scattered light in a state where a mask corresponding to the pattern of the routing wiring is disposed on the back side of the substrate. Is preferably included.

  According to this configuration, the negative photosensitive resin layer is pattern-exposed with scattered light from the back side of the substrate, so that the cross-sectional shape of the base formed by the cured portion of the photosensitive resin layer is inverted trapezoidal. be able to. In the inverted trapezoidal pedestal, the angle formed between the upper surface and the side surface is an acute angle, so that migration of conductive particles constituting the routing wiring can be more effectively suppressed in the finished touch panel. In addition, since the edge effect can be more effectively exhibited, more conductive ink can be stored on the pedestal. Therefore, the thickness of the routing wiring can be increased and the resistance value can be reduced.

  As one aspect, in the electrode pedestal forming step, the photosensitive film in which the conductive layer is provided on the base film and the photosensitive resin layer is provided on the conductive layer is formed from the photosensitive resin layer side. A first exposure step in which exposure is performed from the base film side in a state in which a first mask corresponding to the pattern of the electrode is disposed on the front side of the base film; A second exposure step in which a second mask corresponding to the routing wiring pattern is disposed on the back side of the substrate and the base film is peeled off and exposed from the back side; and the photosensitive resin layer And a developing step of patterning the electrode and the pedestal.

  According to this configuration, by performing the first exposure process in a state where oxygen is blocked by the base film, the entire photosensitive resin layer is cured in correspondence with the electrode pattern, and portions other than the electrode pattern are not yet formed. It can be maintained as cured. Thereafter, the base film is peeled off and the second exposure step is performed in the presence of oxygen, so that after the first exposure step, the non-cured region of the photosensitive resin layer is made to correspond to the non-electrode pattern and the base pattern. Only the deep layer portion can be cured. Therefore, the subsequent development process can appropriately form a pedestal having a predetermined height on the substrate, and can reduce the step between the electrode pattern and the non-electrode pattern. Therefore, it is possible to collect and arrange the routing wiring and to suppress the appearance of the electrode pattern.

The characteristic configuration of the touch panel according to the present invention is as follows.
A substrate,
A plurality of electrodes provided via an insulating layer on the substrate;
A plurality of pedestals having an inverted trapezoidal cross-sectional shape formed integrally with the insulating layer at the peripheral edge of the substrate and having a top surface width larger than a width of a bonding surface with the substrate;
A plurality of routing wires respectively provided on the plurality of pedestals and connected to the plurality of electrodes;
It is in the point provided with.

  According to this characteristic configuration, a plurality of pedestals are provided on the substrate at the peripheral portion of the substrate, and the routing wiring is arranged on the pedestal. Therefore, the edge effect causes bleeding of the constituent material of the routing wiring. Can be suppressed. Therefore, the line-to-line distance in plan view between the lead wirings can be kept small. Further, the presence of grooves formed between adjacent pedestals makes it possible to ensure a large creepage distance between the routing wires. Therefore, it is possible to suppress the occurrence of insulation failure due to migration of the material constituting the routing wiring. Accordingly, it is possible to collect and arrange the routing wiring in a limited area while suppressing the occurrence of insulation failure, and to reduce the layout area of the routing wiring.

  Furthermore, in the above characteristic configuration, since the pedestal has an inverted trapezoidal cross-sectional shape, migration of the conductive particles constituting the routing wiring can be more effectively suppressed. In addition, since the edge effect can be more effectively exhibited, the thickness of the routing wiring can be increased, and the resistance value can be reduced.

  Hereinafter, preferred embodiments of the touch panel according to the present invention will be described. However, the scope of the present invention is not limited by the preferred embodiments described below.

  As one aspect, it is preferable that the angle formed between the upper surface and the side surface of the pedestal is 45 ° or more and 85 ° or less.

  By making the angle between the upper surface and the side surface of the pedestal to be 85 ° or less, it is possible to more effectively suppress the migration of the conductive particles constituting the routing wiring and to exhibit the edge effect more effectively. it can. These advantages appear more effectively as the angle between the upper surface and the side surface decreases. However, if the angle formed between the upper surface and the side surface is less than 45 °, the width of the bonding surface with the substrate tends to be considerably smaller than the width of the upper surface, which may hinder the stability of the pedestal. Therefore, as described above, by setting the angle between the upper surface and the side surface of the pedestal to be 45 ° or more and 85 ° or less, the effect of suppressing the migration and the effect of reducing the resistance value can be obtained while ensuring the stability of the pedestal. Can do.

Plan view of the touch panel according to the first embodiment II-II sectional view of FIG. Schematic diagram showing one aspect of the preparation process Schematic diagram showing one aspect of the preparation process Schematic diagram showing the deposition process Schematic diagram showing the first exposure process Schematic diagram showing the second exposure process Schematic diagram showing the state when the second exposure process is completed Schematic diagram showing the development process Schematic diagram showing the wiring formation process Exploded perspective view of touch panel XII-XII sectional view of FIG. Sectional drawing of the touchscreen which concerns on 2nd embodiment Schematic diagram showing the first exposure process Schematic diagram showing the second exposure process Schematic diagram showing the development process Schematic diagram showing the wiring formation process Virtual exploded perspective view of touch panel XIX-XIX sectional view of FIG. Sectional drawing of the touchscreen which concerns on 3rd embodiment Partial enlarged view of FIG. Sectional drawing which shows another aspect of a touch panel Sectional drawing which shows another aspect of a touch panel Sectional drawing which shows another aspect of a touch panel Plan view showing another aspect of the touch panel XXVI-XXVI sectional view of FIG.

[First embodiment]
A touch panel and a first embodiment of a manufacturing method thereof according to the present invention will be described with reference to the drawings. The touch panel 1 according to the present embodiment is provided in an electronic device such as a multi-function mobile phone (smart phone) or a portable game machine, and functions as a touch input device. In these electronic devices, the touch panel 1 is used by being overlapped with a display device including a liquid crystal display panel, an organic EL display panel, or the like. In portable electronic devices, it is required to downsize the entire device and to secure a large display area of the display device. In order to satisfy both of these requirements, the touch panel 1 according to the present embodiment is designed so that the non-display area becomes as small as possible. The touch panel 1 having such a narrow frame design is realized by a manufacturing method in which a photolithography method and a discharge printing method are combined. Hereinafter, the manufacturing method of the touch panel according to the present embodiment and the touch panel 1 obtained by the manufacturing method will be described in detail.

  In the drawings to be referred to in the following description, for the sake of convenience, the scale, the vertical / horizontal dimensional ratio, and the like may differ from actual products from the viewpoint of easy illustration and easy understanding. In addition, regarding the respective members that are expected to exist in plural, the specific numbers referred to in the following description and shown in the corresponding drawings are merely examples, and other numbers may naturally be used. Is possible.

  As shown in FIG. 1, the touch panel 1 according to this embodiment includes substrates 20 and 40, electrodes 33 and 53, and lead wirings 38 and 58. As shown in FIG. 2, the touch panel 1 includes a first substrate 20, a first electrode forming member 30 including the first electrode 33, a second substrate 40, and a second electrode forming member including the second electrode 53. 50. The first electrode forming member 30 is provided on the first substrate 20, the second electrode forming member 50 is provided on the second substrate 40, and the second substrate 40 is provided on the first substrate 20 and the first electrode forming member 30. And the 2nd electrode formation member 50 is arrange | positioned.

  The first substrate 20 is a member that serves as a base for forming the first electrode 33. The first substrate 20 is preferably configured using a material excellent in transparency, flexibility, insulation, and the like. Examples of materials that satisfy such requirements include general-purpose resins such as polyethylene terephthalate and acrylic resins, general-purpose engineering resins such as polyacetal resins and polycarbonate resins, and super engineering resins such as polysulfone resins and polyphenylene sulfide resins. Is exemplified. The thickness of the 1st board | substrate 20 can be 25 micrometers-100 micrometers, for example. In this embodiment, the 1st board | substrate 20 is comprised with the polyethylene terephthalate film. The first substrate 20 may be configured using a glass substrate or the like.

  The first electrode forming member 30 provided on the first substrate 20 includes a first insulating layer 32, a first electrode 33, and a first routing wiring 38. The first insulating layer 32 is disposed on the first substrate 20. The first insulating layer 32 is preferably configured using a resin material having excellent electrical insulation. In this embodiment, the 1st insulating layer 32 is comprised mainly by the photosensitive resin composition mentioned later. A plurality (five in this example) of first electrodes 33 are disposed on the first insulating layer 32. That is, a plurality of first electrodes 33 are provided on the first substrate 20 via the first insulating layer 32. As shown in FIG. 1, the plurality of first electrodes 33 are each formed by connecting a plurality of (five in this example) rhombus electrodes arranged along the X-axis direction to each other in the X-axis direction. ing. Each of the first electrodes 33 is formed so as to extend along the X-axis direction as a whole. The first electrode 33 may be formed in, for example, a stripe shape (a linear shape having a certain width), or may be formed in a wave shape or a zigzag shape. The plurality of first electrodes 33 are arranged in parallel to each other so as to be aligned in the Y-axis direction.

  The first electrode 33 is configured using a material whose capacitance changes according to the proximity / separation of an object to be detected (conductor such as a user's finger). “Capacitance” is a concept that includes both self-capacitance and mutual capacitance. That is, the first electrode 33 is configured using a material whose self-capacitance or mutual capacitance with the second electrode 53 changes according to the proximity / separation of the object to be detected. Moreover, it is preferable that the 1st electrode 33 is comprised using the material excellent in transparency. Examples of materials that satisfy such requirements include metal oxides such as tin oxide, indium oxide, antimony oxide, zinc oxide, cadmium oxide, and ITO (Indium Tin Oxide), silver nanowires, carbon nanotubes, graphene, and metals. Examples thereof include a mesh and a conductive polymer. The first electrode 33 is a transparent conductive film configured using these materials. In the present embodiment, the first electrode 33 is composed of an ITO thin film.

  Each of the first electrodes 33 is connected to the lead wiring 38. That is, the touch panel 1 (first electrode forming member 30) has a plurality of (the same number as the first electrode 33, five in this example) first lead wires 38 connected to the first electrode 33. The first routing wiring 38 is mainly composed of conductive ink made of ink containing conductive particles such as metal such as gold, silver, copper, nickel, and palladium, or carbon. The material of the conductive particles constituting the conductive ink may be a single type or a combination of a plurality of types. In the present embodiment, the first routing wiring 38 is mainly composed of conductive ink containing silver nanoparticles.

  The second insulating layer 52, the second electrode 53, and the second routing wiring 58 constituting the second substrate 40 and the second electrode forming member 50 are the same except for the specific configuration related to the shape and arrangement of the second electrode 53. The same configuration as the one substrate 20 and the first electrode forming member 30 is provided. As shown in FIG. 1, in this embodiment, a plurality (four in this example) of second electrodes 53 are arranged side by side along the Y-axis direction that intersects (orthogonally in this example) the X-axis direction. A plurality of (six in this example) rhombus electrodes are connected to each other in the Y-axis direction. Each of the second electrodes 53 is formed so as to extend along the Y-axis direction as a whole. The plurality of second electrodes 53 are arranged in parallel to each other so as to be aligned in the X-axis direction.

  A plurality (25 in total, 5 rows and 5 columns) of diamond electrodes constituting the first electrode 33 and a plurality of diamond electrodes (a total of 24 in 6 rows and 4 columns in this example) constituting the second electrode 53 Are arranged in a complementary positional relationship in a plan view (as viewed in a direction orthogonal to the extending surface of the touch panel 1). That is, the rhombus electrode constituting the second electrode 53 is arranged in the non-arrangement region of the rhombic electrode constituting the first electrode 33, and the first electrode 33 is constituted in the non-arrangement region of the rhombus electrode constituting the second electrode 53. A diamond electrode is arranged. The plurality of first electrodes 33 and the plurality of second electrodes 53 are disposed so as to cover the display area of the display device almost entirely. The arrangement region of the first electrode 33 and the second electrode 53 corresponding to the display region of the display device is a region where an input operation is performed by the user, and this region is referred to as an “operation region O” here.

  In the present embodiment, a conductive material such as ITO is not disposed in the recessed portion formed in the first insulating layer 32. For this reason, when the touch panel 1 is of a mutual capacitance system, for example, the mutual capacitance between the first electrode 33 and the second electrode 53 is affected by a conductive material such as ITO other than the first electrode 33. There is no. Therefore, the touch panel 1 according to the present embodiment has excellent transparency and high accuracy.

  The first routing wiring 38 is provided on the peripheral edge of the first substrate 20. The first routing wirings 38 are formed so as to extend generally parallel to each other along the Y-axis direction in a region adjacent to the arrangement region (operation region O) of the plurality of first electrodes 33 in the X-axis direction. Yes. In the present embodiment, the second routing wiring 58 is provided at the peripheral edge of the second substrate 40. The second routing wiring 58 is formed so as to extend generally parallel to each other along the X-axis direction in a region adjacent to the arrangement region (operation region O) of the plurality of second electrodes 53 in the Y-axis direction. Yes. The arrangement area of the first routing wiring 38 and the second routing wiring 58 that is located outside the operation area O is an area that does not overlap with the display area of the display device. ". A plurality of external connection terminals 60 for connecting the electrodes 33 and 53 to an external processing unit are provided at the end in the Y-axis direction in the non-operation area N.

  The manufacturing method for reducing the non-operation area N of the touch panel 1 includes a preparation process (see FIGS. 3 and 4), an electrode base formation process (see FIGS. 5 to 9), and a wiring formation process (FIG. 10). In the present embodiment, the electrode pedestal forming step further includes a deposition step (see FIG. 5), a first exposure step (see FIG. 6), and a second exposure step (see FIGS. 7 and 8). And a developing step (see FIG. 9). In the present embodiment, these are executed in the order of a preparation step, a deposition step, a first exposure step, a second exposure step, a development step, and a wiring formation step. Moreover, in this embodiment, these are performed about the 1st board | substrate 20, the 1st electrode formation member 30, and the 2nd board | substrate 40 and the 2nd electrode formation member 50, respectively. Below, only the 1st board | substrate 20 and the 1st electrode formation member 30 are demonstrated, and detailed description is abbreviate | omitted regarding the 2nd board | substrate 40 and the 2nd electrode formation member 50 which can be considered similarly.

  The preparation step is a step of preparing an intermediate material suitable for the manufacturing method according to the present embodiment. In the present embodiment, the photosensitive film 10 that is the base of the insulating layers 32 and 52 and the electrodes 33 and 53 and the substrates 20 and 40 that have been prepared are prepared. As shown in FIG. 3, the photosensitive film 10 includes a base film 11 and a photosensitive layer 14. The photosensitive layer 14 is a laminate of the conductive layer 12 and the photosensitive resin layer 13. That is, the photosensitive film 10 includes a base film 11 and a laminate of the conductive layer 12 and the photosensitive resin layer 13 provided on the base film 11. A conductive layer 12 is provided on the base film 11, and a photosensitive resin layer 13 is provided on the conductive layer 12.

  The base film 11 can be configured using a polymer film. As the base film 11, a polymer film having heat resistance and solvent resistance can be preferably used. Examples of such a polymer film include a polyethylene terephthalate film, a polyethylene film, a polypropylene film, and a polycarbonate film. In the present embodiment, the base film 11 is composed of a polyethylene terephthalate film. The thickness of the base film 11 can be 5 micrometers-300 micrometers, for example. In addition, the base film 11 may be subjected to a mold release treatment in order to facilitate peeling from the photosensitive layer 14 in a second exposure step described later.

  The conductive layer 12 constituting the photosensitive layer 14 is a layer that serves as a base for the first electrode 33 and the second electrode 53. The conductive layer 12 can be a transparent conductive layer made of, for example, tin oxide, indium oxide, antimony oxide, zinc oxide, cadmium oxide, metal oxides such as ITO, silver nanowires, carbon nanotubes, conductive polymers, and the like. . In the present embodiment, an ITO thin film layer is used as the conductive layer 12. The conductive layer 12 can be formed on the entire surface of the base film 11 by, for example, a vacuum deposition method, a sputtering method, an ion plating method, a CVD method, a roll coater method, or the like. The thickness of the conductive layer 12 can be set to, for example, 5 nm to 5000 nm.

  The photosensitive resin layer 13 constituting the photosensitive layer 14 is a layer serving as a base for the first insulating layer 32 and the second insulating layer 52. In the present embodiment, the photosensitive resin layer 13 also serves as a base for a first pedestal 35 and a second pedestal 55 (see FIGS. 9 and 11) described later. As the photosensitive resin layer 13, either a negative type or a positive type can be used. In the present embodiment, a negative photosensitive resin layer 13 is used. The photosensitive resin layer 13 can be formed using, for example, a photosensitive resin composition containing a binder resin, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator. Examples of the binder resin include acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, phenol resin, ester resin, urethane resin, epoxy acrylate resin obtained by reaction of epoxy resin and (meth) acrylic acid An acid-modified epoxy acrylate resin obtained by a reaction between an epoxy acrylate resin and an acid anhydride can be exemplified. These may be used alone or in combination of two or more.

  Examples of the photopolymerizable compound having an ethylenically unsaturated bond include a compound obtained by reacting an α, β-unsaturated carboxylic acid with a polyhydric alcohol, and reacting an α, β-unsaturated carboxylic acid with a glycidyl group-containing compound. Examples thereof include urethane monomers such as (meth) acrylate compounds having urethane bonds, phthalic acid-based compounds, (meth) acrylic acid alkyl esters, and the like. These may be used alone or in combination of two or more.

  Examples of photopolymerization initiators include aromatic ketones, benzoin ether compounds, benzoin compounds, oxime ester compounds, benzyl derivatives, 2,4,5-triarylimidazole dimers, acridine derivatives, N-phenylglycine, and N-phenyl. Examples thereof include radical polymerization initiators such as glycine derivatives, coumarin compounds, and oxazole compounds. These may be used alone or in combination of two or more.

  The photosensitive resin layer 13 may further contain various additives as necessary. Examples of additives include plasticizers, fillers, antifoaming agents, flame retardants, stabilizers, adhesion-imparting agents, leveling agents, peeling accelerators, antioxidants, fragrances, imaging agents, thermal crosslinking agents and the like. Can do. These may be contained alone or in combination of two or more.

  The photosensitive resin layer 13 can be formed, for example, by applying a solution of a photosensitive resin composition dissolved in a solvent onto the conductive layer 12 formed on the base film 11 and then drying. Here, examples of the solvent include methanol, ethanol, acetone, methyl ethyl ketone, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether, and the like. These may be used alone or in combination of two or more. Moreover, application | coating can be performed by well-known methods, such as a roll coat method, a comma coat method, a gravure coat method, an air knife coat method, a die coat method, a bar coat method, a spray coat method, for example. Drying can be performed using, for example, a hot air convection dryer or the like. The thickness of the photosensitive resin layer 13 can be set to, for example, 1 μm to 200 μm after drying.

  In the present embodiment, a separator 16 is provided on the photosensitive resin layer 13 in order to facilitate handling of the photosensitive film 10. Separator 16 can be constituted using the same material (for example, polyethylene terephthalate etc.) as substrate film 11 mentioned above.

  As shown in FIG. 4, the first substrate 20 is provided in a state where two films 22 and 24 are attached to both surfaces thereof. The first substrate 20 is provided with a carrier film 22 attached to the lower surface and a protective film 24 attached to the upper surface. The carrier film 22 and the protective film 24 can be configured using the same material (for example, polyethylene terephthalate) as the base film 11 and the separator 16 described above. In the present embodiment, a second mask (second photomask) 72 described later is provided on the lower surface of the carrier film 22. In the present embodiment, a second mask 72 is provided in advance on the lower surface of the carrier film 22. The configuration of the second mask 72 will be described together with a second exposure step described later.

  The deposition process is a process of depositing the photosensitive film 10 and the first substrate 20 prepared in the preparation process. As shown in FIG. 5, in the deposition process, the separator 16 is peeled from the photosensitive film 10 to expose the photosensitive resin layer 13. Further, the protective film 24 is peeled off from the first substrate 20 with the two films 22 and 24 to expose the first substrate 20. Then, the photosensitive film 10 is attached to the exposed upper surface of the first substrate 20 from the exposed photosensitive resin layer 13 side. For example, the photosensitive film 10 is attached to the first substrate 20 by pressure bonding (thermal lamination) while heating. After completion of the deposition process, the carrier film 22 with the second mask 72, the first substrate 20, the photosensitive resin layer 13, the conductive layer 12, and the base film 11 are laminated in the order described.

  A 1st exposure process is a process of performing 1st exposure with respect to the laminated body after an adhesion process. As shown in FIG. 6, in the first exposure step, exposure is performed from the base film 11 side in a state where a first mask (first photomask) 71 is disposed on the front side of the base film 11. Specifically, first, the first mask 71 is positioned and fixed on the photosensitive resin layer 13. The first mask 71 has a first electrode formation pattern corresponding to the overall shape (see FIG. 1) of the first electrode 33 in plan view. When the photosensitive resin layer 13 is a negative type as in this embodiment, the first electrode formation pattern is a window portion (translucent portion) formed in the first mask 71. The first mask 71 is not provided with a window portion other than the first electrode formation pattern, and an arrangement planned area S for a first routing wiring 38 to be described later (finally the first routing wiring 38 is finally provided). The region scheduled to be done (see FIG. 10) is completely covered by the light-shielding part of the first mask 71.

  After fixing the first mask 71 on the base film 11, the active light L corresponding to the photosensitive characteristics of the photosensitive resin layer 13 is irradiated from the front side of the base film 11. The actinic ray L may be any ray suitable for exerting a photosensitive action on the photosensitive resin layer 13 such as ultraviolet rays and visible light. The actinic ray L can be irradiated using, for example, an ultraviolet irradiation lamp, a mercury lamp, a high pressure mercury lamp, a carbon arc lamp, a metal halide lamp, a xenon lamp, or the like. The actinic ray L can also be irradiated using, for example, a photographic flood bulb, a solar lamp, or the like. The exposure intensity and exposure time of the actinic ray L can be appropriately set according to the photosensitive characteristics of the photosensitive resin layer 13. Further, the first exposure step may be performed in the air or in the presence of an inert gas. It can also be performed in a vacuum.

  In the first exposure step, the photosensitive resin layer 13 is exposed with a pattern corresponding to the planar view shape of the first electrode 33 by irradiating the active light L in an image form through the first mask 71. Thereby, the part exposed to the actinic ray L in the photosensitive resin layer 13 can be cured corresponding to the planar view shape of the first electrode 33, and the other part can be maintained uncured ( (See FIG. 7). 7 to 10 and the like, the cured portion (cured portion 13C) of the photosensitive resin layer 13 and the uncured portion (uncured portion 13U) are displayed in different colors. In the present embodiment, since the photosensitive resin layer 13 is exposed while being disposed on the surface of the conductive layer 12 without peeling off the base film 11, the influence of oxygen is reduced even in an air environment. be able to. Therefore, there is an advantage that the exposed portion of the photosensitive resin layer 13 can be easily cured. The cured portion 13C formed in the first exposure step finally becomes a portion in contact with the first electrode 33 in the first insulating layer 32 (see FIG. 9).

  A 2nd exposure process is a process of performing 2nd exposure with respect to the laminated body after a 1st exposure process. As shown in FIG. 7, in the second exposure step, exposure is performed from the back side with the second mask 72 disposed on the back side of the first substrate 20. In the present embodiment, in the second exposure step, the active light L is irradiated from the back side in a state where the base film 11 is peeled and the conductive layer 12 is exposed. As described above, in the present embodiment, the second mask 72 is provided in advance on the lower surface of the carrier film 22. The second mask 72 has a first routing wiring formation pattern including a window portion (translucent portion) corresponding to the overall shape (see FIG. 1) of the first routing wiring 38 in plan view. The arrangement area of the first electrode 33 is not covered by the second mask 72. In the present embodiment, the second exposure step is performed in air (in the presence of oxygen).

  In the second exposure step, the photosensitive resin layer 13 is exposed with a pattern corresponding to the planar view shape of the first routing wiring 38 by irradiating the active light L in an image shape through the second mask 72. Thereby, the part corresponding to the arrangement | positioning plan area | region S (refer FIG. 10) of the 1st routing wiring 38 exposed to the actinic ray L among the photosensitive resin layers 13 is hardened, and parts other than the arrangement | positioning plan area | region S Can remain uncured (see FIG. 8). In the non-operation area N (see FIG. 1), the hardened portion 13C formed in the portion corresponding to the planned arrangement area S of the first routing wiring 38 finally becomes the arrangement planned area of the first routing wiring 38. It becomes the 1st base 35 arrange | positioned at S (refer FIG. 9). In this sense, it can be said that the second mask 72 described above has a first pedestal formation pattern corresponding to the overall shape of the first pedestal 35 in plan view.

  In the present embodiment, since the second exposure is performed after the substrate film 11 is peeled in the presence of oxygen, the reactive species generated from the photopolymerization initiator is changed in the exposed surface layer portion of the photosensitive resin layer 13. It can be deactivated by oxygen present in the vicinity. Therefore, the uncured portion 13U can be provided in the surface layer portion on the conductive layer 12 side in the photosensitive resin layer 13 (see FIG. 8). That is, among the uncured portion 13U at the completion of the first exposure step, the cured portion 13C that is additionally cured in the second exposure step is the first substrate 20 side in the photosensitive resin layer 13 (opposite to the conductive layer 12). Side) deep layer portion only. Of the cured portion 13C formed in the second exposure step, the portion other than the first pedestal 35 described above finally becomes a portion of the first insulating layer 32 where the first electrode 33 is not formed (FIG. 9). Thereby, in the operation area | region O, the level | step difference of the area | region in which the 1st electrode 33 was formed, and an area other than that can be made small. Therefore, the appearance of the pattern of the first electrode 33 can be effectively suppressed.

  A development process is a process of performing a development process with respect to the laminated body after a 2nd exposure process. As shown in FIG. 9, in the developing process, the photosensitive resin layer 13 is developed to pattern the first electrode 33 and the first pedestal 35. The development process can be performed by, for example, wet development using a developer. Specifically, first, a developer corresponding to the chemical properties of the photosensitive resin layer 13 is prepared. For example, when alkaline development is performed, a sodium carbonate solution, a potassium hydroxide solution, alkali ethylaminoethanol, tetramethylammonium hydroxide, diethanolamine, or the like can be used as a developer. For example, when organic development is performed, a polar solvent such as N-methyl-2-pyrrolidone, N-acetyl-2-pyrrolidone, or N, N-dimethylacetamide can be used as a developer. These polar solvents may be used alone or in combination with other solvents such as water, methanol, ethanol and the like. The development can be performed by, for example, a spray method, a dip method, a paddle method, or the like.

  In the development process, the uncured portion 13U of the photosensitive resin layer 13 that remains uncured even after the completion of the second exposure process is removed. That is, the surface layer portion other than the first electrode 33 in the operation region O, the surface layer portion of the region S in which the first routing wiring 38 is to be disposed in the non-operation region N, and the first routing wiring 38 in the non-operation region N. All the layers other than the planned arrangement region S are removed. Thereby, the first electrode 33 having a predetermined pattern is formed on the first substrate 20 via the first insulating layer 32. As described above, the level difference between the region where the first electrode 33 is formed and the other region is very small. A first pedestal 35 having a predetermined pattern is formed on the first substrate 20 in accordance with the formation of the first electrode 33. At this time, the first electrode 33 is patterned in the operation area O, and the first pedestal 35 is patterned in the non-operation area N. In the present embodiment, the first pedestal 35 is formed in a rectangular cross section.

  Thus, in the present embodiment, in the electrode pedestal forming process including the deposition process, the first exposure process, the second exposure process, and the development process, in accordance with the formation of the first electrode 33 by photolithography, A first pedestal 35 is also formed. That is, the photosensitive layer 14 formed of a laminate of the photosensitive resin layer 13 and the conductive layer 12 provided on the first substrate 20 is divided into two patterns through the first mask 71 and the second mask 72. And then developed. As a result, the first electrode 33 made of the conductive layer 12 and the plurality of first pedestals 35 mainly composed of the photosensitive resin layer 13 and arranged in the planned arrangement area S of the first routing wiring 38 are partially formed. It is formed by a common process. In the present embodiment, since the photolithography method having excellent fine wiring forming ability is used, the width of the first pedestal 35 and the interval between the first pedestals 35 adjacent to each other can be formed very small. For example, a width and interval of about 10 μm to 50 μm, preferably about 20 μm to 30 μm can be realized. Of course, it goes without saying that the first pedestal 35 may be formed with a width and interval of 50 μm or more.

  The manufacturing method according to the present embodiment may further include a third exposure step after completion of the electrode pedestal formation step (development step). In the third exposure step, a third exposure is performed on the cured portion 13C of the photosensitive resin layer 13 constituting the first insulating layer 32, the first electrode 33, and the first pedestal 35 formed in the electrode pedestal forming step. It is a process of performing. In the third exposure step, the actinic ray L may be irradiated from either the front side or the back side. In this third exposure step, the cured portion 13C of the photosensitive resin layer 13 is again irradiated with the actinic ray L so that the cured portion 13C can be completely cured.

  The wiring formation process is a process of forming the first routing wiring 38 on the first substrate 20 on which the first electrode 33 and the first pedestal 35 are formed. In the present embodiment, the first routing wiring 38 is formed by a discharge printing method. Specifically, the first routing wiring 38 is formed by an ink jet printing method. As shown in FIG. 10, in the wiring formation step, a droplet of conductive ink 77 is discharged from the discharge nozzle 76 using a discharge device (an inkjet device in this example) 75.

  The conductive ink 77 is made of a dispersion liquid containing conductive particles and a dispersion medium for dispersing the conductive particles. Examples of the conductive particles include metals such as gold, silver, copper, nickel, and palladium, or fine particles such as carbon. The particle diameter of the conductive particles can be, for example, 1 nm to 100 nm. In this example, the conductive ink 77 includes silver nanoparticles as conductive particles. Note that the surface of the conductive particles may be coated with an organic substance or the like. Examples of the dispersion medium include water, alcohols, hydrocarbon compounds, ether compounds, polar compounds, and the like. These may be used alone or in combination of two or more kinds.

  The viscosity of the conductive ink 77 is preferably 50 mPa · s or less from the viewpoint of suppressing clogging at the discharge nozzle 76. In the present embodiment, from the viewpoint of enabling the conductive ink 77 to be thickened, it is preferable to use the conductive ink 77 having a viscosity of, for example, 20 mPa · s to 50 mPa · s. Examples of the inkjet method for discharging the droplets of the conductive ink 77 include a pressure vibration method, a charge control method, an electromechanical conversion method, an electrothermal conversion method, and an electrostatic suction method. The amount of the conductive ink 77 ejected by the ink jet method can be, for example, 1 pL to 300 pL per drop. Discharge printing (inkjet printing in this example) has an advantage of high on-demand characteristics, and a desired amount of material can be appropriately arranged on a target member with high positional accuracy using a minimum necessary material. Have

  The droplets of the conductive ink 77 are discharged onto the planned arrangement area S of the first routing wiring 38 on the first substrate 20. That is, the droplets of the conductive ink 77 are ejected onto the first pedestal 35. Here, the first pedestal 35 is formed to have a predetermined thickness, and there is a step at the boundary portion between the upper surface of the first pedestal 35 and the upper surface of the first substrate 20 around it. For this reason, even if the discharged conductive ink 77 spreads on the first pedestal 35, the conductive ink 77 hardly diffuses beyond the edge of the step. That is, such an edge effect can effectively prevent the conductive ink 77 from bleeding. Further, since the effect of the surface tension of the conductive ink 77 is enhanced by the edge effect, the amount of liquid retained in the conductive ink 77 on the first pedestal 35 can be increased. As a result, the width of the discharged conductive ink 77 is regulated to match the width of the first pedestal 35, and the thickness of the conductive ink 77 is directly discharged onto the first substrate 20, for example. It becomes larger than the case.

  Thereafter, the conductive ink 77 disposed on the first substrate 20 is dried to evaporate the dispersion medium contained in the conductive ink 77. The dispersion medium can be evaporated by a heating method using a hot plate, an oven, a light source, hot air, or the like. As a result, the conductive particles constituting the conductive ink 77 are arranged in the planned arrangement region S (on the first pedestal 35) on the first substrate 20, and the first routing wiring 38 is formed.

  As is clear from the above description, the line width of the first routing wiring 38 matches the width of the first pedestal 35. The interval between the first routing wires 38 adjacent to each other (interline distance) is equal to the interval between the first pedestals 35 adjacent to each other. Therefore, although the first routing wiring 38 is formed by the discharge printing method, the line width can be suppressed to about 20 μm to 30 μm, for example. Further, the distance between the lines can be suppressed to about 20 μm to 30 μm, for example. That is, it is possible to achieve fine wiring formation of “L / S (line width / interline distance) = 20/20 to 30/30”. Of course, it is needless to say that L / S = 30/30 or more may be used according to the specifications required for the touch panel 1.

  At this time, in the electrode pedestal forming step, the first electrode 33 that is primarily formed according to a conventional method and the first pedestal 35 that is additionally formed in the present embodiment are partially shared. Formed in the process. In other words, a part of a process necessary for forming the first electrode 33 having a predetermined shape is used, and accordingly, the first pedestal serving as a stage on which the conductive ink 77 is placed in the subsequent wiring formation process. 35 is formed. For this reason, the additional process required in order to form the 1st base 35 as such a mounting base can be minimized. Further, in the present embodiment, in the second exposure step, the first pedestal 35 is formed simultaneously with the formation of the low-step first insulating layer 32 by curing the deep layer portion of the photosensitive resin layer 13. For this reason, when it is considered on the premise that the first insulating layer 32 having a low step is formed in order to suppress the pattern appearance, the first pedestal 35 can be formed without requiring a substantial additional process. .

  After the first pedestal 35 is formed on the first substrate 20, the first routing wiring 38 can be formed in a wiring forming process substantially consisting of a single process using the discharge printing method. At this time, as described above, the combination of the formation of the first pedestal 35 by the photolithography method having excellent fine wiring forming ability and the formation of the first routing wiring 38 by the ink jet printing method capable of printing with high positional accuracy. Very fine wiring can be formed. In addition to the formation of the first electrode 33, even if the first routing wiring 38 is separately formed using a photolithography method, a fine wiring can be formed similarly. However, in such a method, the number of steps for forming the first routing wiring 38 increases. On the other hand, the manufacturing method according to the present embodiment can significantly reduce the number of steps for forming the first routing wiring 38 while being capable of forming a fine wiring, and at a very low cost. is there.

  In the touch panel 1 according to the present embodiment, the first substrate 20 on which the first electrode 33 and the like are formed as described above and the second substrate 40 on which the second electrode 53 and the like are similarly formed are superimposed. (See FIG. 11). FIG. 11 is an exploded perspective view of a portion excluding the external connection terminal 60. The touch panel 1 according to the present embodiment is provided at the peripheral edge of the first substrate 20, the plurality of first electrodes 33 provided on the first substrate 20 via the first insulating layer 32, and the first substrate 20. And a plurality of first routing wires 38 respectively connected to the plurality of first electrodes 33. The touch panel 1 is provided on the second substrate 40, a plurality of second electrodes 53 provided on the second substrate 40 via the second insulating layer 52, and a peripheral portion of the second substrate 40. And a plurality of second routing wires 58 connected to the second electrode 53, respectively.

  In such a configuration, the touch panel 1 according to the present embodiment is characterized by the following points. First, it further includes a plurality of pedestals 35 and 55 formed integrally with the insulating layers 32 and 52 on the periphery of the substrates 20 and 40. Second, a plurality of first routing wires 38 are provided on the plurality of first pedestals 35, respectively, and a plurality of second routing wires 58 are provided on the plurality of second pedestals 55, respectively.

  According to the touch panel 1 having such a configuration, the arrangement area (non-operation area N) of the lead wirings 38 and 58 can be reduced in size. As described above, L / S = 20/20 to about 30/30 can be achieved. Even in this case, due to the presence of the groove formed between the pedestals 35 and 55 adjacent to each other, the creepage distance between the adjacent routing wires 38 and 58 (along the surface of the intervening member). Large minimum distance) can be secured. Therefore, it is possible to suppress the occurrence of insulation failure due to the migration of the conductive particles constituting the routing wirings 38 and 58. Therefore, it is possible to collect and arrange the routing wires 38 and 58 in a limited area while suppressing the occurrence of such a problem.

  Further, in the present embodiment, the liquid retention amount of the conductive ink 77 on the pedestals 35 and 55 can be increased by the edge effect, so that the thickness (vertical thickness) of the routing wirings 38 and 58 can be increased. it can. Therefore, even when the line width is narrow, the cross-sectional areas of the lead wirings 38 and 58 can be ensured to be larger than a predetermined size, and the resistance value can be suppressed small.

  In the present embodiment, since the first routing wiring 38 is formed on the first pedestal 35, as shown in FIG. 12, the step between the first electrode 33 and the first routing wiring 38 connected to the first electrode 33 is provided. Is very small. For this reason, each first routing wiring 38 can be easily connected to the corresponding first electrode 33. In addition, the reliability of the electrical connection at the connection portion 38a between the first lead wiring 38 and the corresponding first electrode 33 can be maintained over a long period of time. The same applies to the second routing wiring 58 (see FIG. 11). Therefore, the productivity of the touch panel 1 can be improved and the reliability as a product can be increased.

  In the present embodiment, in the development process, the surface layer portion of the photosensitive resin layer 13 other than the first electrode 33 in the operation region O is removed, and finally in the hollow portion formed in the first insulating layer 32. No conductive material such as ITO is disposed. For this reason, for example, when the touch panel 1 is a mutual capacitance system, the mutual capacitance between the first electrode 33 and the second electrode 53 is not affected. Therefore, the touch panel 1 having excellent transparency and high accuracy can be realized.

[Second Embodiment]
A second embodiment of a touch panel and a manufacturing method thereof according to the present invention will be described with reference to the drawings. As shown in FIG. 13, in the touch panel 1 according to the present embodiment, the second electrode forming member 50 is arranged directly on the first electrode forming member 30 without providing the second substrate 40 (see FIG. 2). This is different from the first embodiment. Along with this, the manufacturing method of the touch panel 1 is also partially different from the first embodiment. Therefore, in the following, differences from the first embodiment will be mainly described. Note that the points not particularly specified are the same as those in the first embodiment.

  In the present embodiment, the second routing wiring 58 is provided on the first substrate 20 together with the first routing wiring 38 (see FIG. 18). The second routing wiring 58 is formed so as to extend substantially parallel to each other along the X-axis direction in a region adjacent to the arrangement region (operation region O) of the plurality of first electrodes 33 in the Y-axis direction. Yes. For this reason, the second mask 72 provided on the carrier film 22 attached to the first substrate 20 has a planar view shape (see FIG. 1) in which both the first routing wiring 38 and the second routing wiring 58 are combined. Corresponding routing wiring formation patterns are provided. For this reason, in the electrode pedestal forming step (first electrode pedestal forming step) for the first layer, the second pedestal 55 and the first pedestal 35 are simultaneously formed on the first substrate 20.

  Then, in this embodiment, the electrode base formation process (2nd electrode base formation process) about the 2nd layer is performed with respect to the result by a 1st electrode base formation process. More specifically, first, the second-layer photosensitive film 10 is directly applied onto the first electrode 33 formed in the first electrode pedestal forming step (see FIG. 14). The photosensitive film 10 is attached to the exposed upper surface of the first electrode 33 from the exposed photosensitive resin layer 13 side. Then, as shown in FIG. 14, in the state which positioned the 3rd mask 73 which has the 2nd electrode formation pattern corresponding to the planar view shape of the 2nd electrode 53 on the photosensitive resin layer 13, rather than the base film 11 Actinic light L is irradiated from the front side. Then, as shown in FIG. 15, the actinic ray L is irradiated in the state which peeled the base film 11 and exposed the conductive layer 12. FIG. The irradiation with the actinic ray L may be performed from the front side as shown in FIG. 15, or may be performed from the back side as in the first embodiment. Thereafter, a second electrode 53 having a predetermined pattern is formed on the first electrode 33 through the second insulating layer 52 by performing a developing process for the second layer (see FIG. 16).

  After that, as shown in FIG. 17, the liquid of the conductive ink 77 is discharged onto the first pedestal 35 and the second pedestal 55 (see FIG. 18) formed on the first substrate 20 using the discharge device 75. Let the drops be ejected. Thereafter, the first routing wiring 38 and the second routing wiring 58 are formed by drying the conductive ink 77.

  As shown in FIG. 19, in the present embodiment, the second routing wiring 58 is formed so as to increase in thickness in the vicinity region V of the connection portion 58 a with the corresponding second electrode 53 as the connection portion 58 a is approached. . In the present embodiment, a step substantially corresponding to the thickness of the second insulating layer 52 occurs between the upper surface of the second pedestal 55 formed on the first substrate 20 and the upper surface of the second electrode 53. In the vicinity region V, the thickness of the second routing wiring 58 is formed so as to gradually increase so as to fill this step. In the present embodiment, since the routing wirings 38 and 58 are formed using an ink jet method capable of discharging a desired amount of the conductive ink 77 with high positional accuracy, such thickness setting can be easily realized. it can. The thickness of the second routing wiring 58 may gradually change with a uniform inclination as shown in FIG. 19, or may change stepwise so as to form a stepped shape. In this way, it is possible to maintain the reliability of the electrical connection at the connection point between the second routing wiring 58 and the corresponding second electrode 53 over a long period of time. Therefore, the reliability as the touch panel 1 can be improved.

  Also in the touch panel 1 according to the present embodiment, as in the first embodiment, the occurrence of insulation failure due to the migration of the conductive particles constituting the routing wirings 38 and 58 is suppressed, and the arrangement region (non-operation) Region N) is effectively reduced in size. Moreover, in this embodiment, since the 2nd board | substrate 40 is abbreviate | omitted compared with said 1st embodiment, there also exists an advantage that the thinning of the whole touch panel 1 can be achieved.

[Third embodiment]
A third embodiment of a touch panel and a manufacturing method thereof according to the present invention will be described with reference to the drawings. The touch panel 1 according to the present embodiment is different from the first embodiment in the three-dimensional shape of the pedestals 35 and 55. Therefore, in the following, differences from the first embodiment will be mainly described. Note that the points not particularly specified are the same as those in the first embodiment.

  As shown in FIG. 20, in this embodiment, the 1st base 35 is formed in the cross-sectional trapezoid shape. In the present embodiment, the cross-sectional shape of the first pedestal 35 is an inverted trapezoidal shape. That is, as shown in an enlarged view in FIG. 21, the first pedestal 35 has a cross-sectional shape in which the width A of the upper surface 35 a is set larger than the width B of the bonding surface 35 b with the first substrate 20. (A> B). By using such a first pedestal 35 having an inverted trapezoidal cross section, the occurrence of insulation failure due to migration can be more effectively suppressed. Further, since the edge effect can be more effectively exhibited, the thickness of the first routing wiring 38 can be increased, and the resistance value can be suppressed to be small.

  As the angle θ (0 ° <θ <90 °) formed by the upper surface 35a and the side surface 35c of the first pedestal 35 becomes smaller, the effect of suppressing migration and the effect of reducing resistance value appear more effectively. By making the formed angle θ a significant acute angle (for example, 85 ° or less), the migration of the conductive particles constituting the first routing wiring 38 can be more effectively suppressed, and the edge effect is more effectively exhibited. Can be made. However, as the width B of the bonding surface 35b of the first pedestal 35 with the first substrate 20 decreases, the stability of the first pedestal 35 decreases. Considering this point, it is preferable that the width B of the bonding surface 35b is, for example, half or more of the width A of the upper surface 35a (B ≧ A / 2). The width B of the joint surface 35b is determined depending on the width A of the upper surface 35a, the height h of the first pedestal 35, and the angle θ formed by the upper surface 35a and the side surface 35c. The formed angle θ depends on the height h of the first pedestal 35, but is preferably 45 ° or more, for example. In this way, it is possible to obtain a migration suppressing effect and a resistance value reducing effect while ensuring the stability of the pedestal. The same applies to the second pedestal 55. Such pedestals 35 and 55 having inverted trapezoidal shapes can be formed by irradiating the scattering active light beam L from the back side in the second exposure step.

[Other Embodiments]
Finally, other embodiments of the touch panel and the manufacturing method thereof according to the present invention will be described. Note that the configurations disclosed in the following embodiments can be applied in combination with the configurations disclosed in other embodiments as long as no contradiction arises. Similarly, the individual configurations disclosed in each of the above embodiments can be appropriately combined within a range where no contradiction occurs.

(1) In each touch panel 1 described in each of the above embodiments, as shown in FIG. 22, for example, a protective layer 65 covering the first pedestal 35 and the first routing wiring 38 may be further provided. Examples of the material constituting the protective layer 65 include carbon, polyester resin, vinyl resin, acrylic resin, polyurethane resin, alkyd resin, and nitrocellulose resin. Among these, a carbon protective layer can be preferably used as the protective layer 65. By providing such a protective layer 65, it is possible to more effectively suppress the occurrence of insulation failure due to migration. The protective layer 65 may be further provided so as to cover the second pedestal 55 and the second routing wiring 58.

(2) In the second embodiment, the configuration is such that the second routing wiring 58 is formed so as to increase in thickness in the vicinity region V of the connection portion 58a with the corresponding second electrode 53 as it approaches the connection portion 58a. Described as an example. However, the embodiment of the present invention is not limited to this. For example, the second routing wiring 58 may be formed so as to have a uniform thickness in the vicinity region V as well as other regions.

(3) In the third embodiment, the configuration in which the cross-sectional shapes of the pedestals 35 and 55 are inverted trapezoids has been described as an example. However, the embodiment of the present invention is not limited to this. For example, the cross-sectional shape of the first pedestal 35 may be a regular trapezoidal shape in which the width B of the bonding surface 35b with the first substrate 20 is larger than the width A of the upper surface 35a. In this case, the angle θ formed by the upper surface 35a and the side surface 35c of the first pedestal 35 can be set to 90 ° <θ <120 °, for example. The same applies to the second pedestal 55. Even when the pedestals 35 and 55 having a regular trapezoidal cross section are used, the routing wirings 38 and 58 are formed on the pedestals 35 and 55 by the discharge printing method so that the touch panel 1 can be routed at a low cost. The wirings 38 and 58 can be arranged collectively.

(4) In each of the above embodiments, the configuration in which the routing wires 38 and 58 are arranged only on the pedestals 35 and 55 has been described as an example. However, the embodiment of the present invention is not limited to this. For example, as shown in FIG. 23, the first routing wiring 38 may be disposed not only on the first pedestal 35 but also in the groove 36 between the first pedestals 35 adjacent to each other. In this way, the line-to-line distance between the first routing wires 38 adjacent to each other along the extending direction of the first substrate 20 in a plan view can be made substantially zero. That is, it is possible to achieve the formation of extremely fine wiring such as “L / S = 20/0 to 30/0”. Therefore, the arrangement area (non-operation area N) of the first routing wiring 38 can be greatly reduced. The same applies to the second routing wiring 58.

(5) In each touch panel 1 described in each of the above embodiments, for example, as shown in FIG. 24, a dummy electrode 34 is further provided in a recessed portion in the first insulating layer 32 where the first electrode 33 is not formed. May be. Although the dummy electrode 34 has the same shape and arrangement as the first electrode 33, it is a dummy electrode that is not connected to an external processing unit (provided independently of the processing unit). The dummy electrode 34 is preferably configured using the same material as the first electrode 33. The dummy electrode 34 can be formed by photolithography using the first mask 71 having an appropriate pattern together with the first electrode 33 when the electrode pedestal forming process is performed. Alternatively, the dummy electrode 34 can be formed by, for example, a discharge method after the electrode pedestal formation process (development process). By providing such a dummy electrode 34, the entire operation region O is covered by the first electrode 33 and the dummy electrode 34 which are made of the same material as each other. Can be suppressed. Similarly, a dummy electrode 54 may be further provided in a recessed portion of the second insulating layer 52 where the second electrode 53 is not formed. In this way, the appearance of the pattern of the second electrode 53 can be further effectively suppressed.

(6) In each touch panel 1 described in each of the above embodiments, as shown in FIGS. 25 and 26, for example, the first insulating layer 32 and the first electrode 33 may be provided in a mesh shape. That is, the first insulating layer 32 may be provided in a mesh shape on the first substrate 20, and the first electrode 33 may be provided on each convex portion of the mesh-like first insulating layer 32. In this way, the portion where the first insulating layer 32 and the first electrode 33 are not formed on the first substrate 20 exists substantially uniformly over the entire operation region O. The transparency of the region O can be improved. Thereby, the visibility of the touch panel 1 can be improved. Similarly, the second insulating layer 52 and the second electrode 53 may be provided on the second substrate 40 in a mesh shape. In this way, the transparency of the operation area O can be further improved, and the visibility of the touch panel 1 can be further improved.

(7) In each of the above embodiments, an example in which the touch panel 1 is manufactured using the photosensitive film 10 having the conductive layer 12 has been described. However, the embodiment of the present invention is not limited to this. For example, you may manufacture the touch panel 1 using the photosensitive film 10 which consists of the base film 11 and the photosensitive layer 14 without having the conductive layer 12. FIG. In this case, the first electrode 33 may be formed on the convex portion by, for example, a discharge method after forming the first insulating layer 32 having the convex portion and the concave portion in the same manner as each of the above embodiments. . The same applies to the formation of the second electrode 53.

(8) In each of the above embodiments, the example in which the first insulating layer 32 and the first electrode 33 and the second insulating layer 52 and the second electrode 53 are formed by the photolithography method using the photosensitive film 10 has been described. . However, the embodiment of the present invention is not limited to this. The first insulating layer 32 and the first electrode 33 and / or the second insulating layer 52 and the second electrode 53 may be formed by, for example, a discharge method.

(9) In each of the above-described embodiments, the example using the photosensitive film 10 including the negative photosensitive resin layer 13 has been described. However, the embodiment of the present invention is not limited to this. For example, the photosensitive film 10 including the positive photosensitive resin layer 13 may be used. In this case, the first mask 71 is formed so as to have an electrode formation pattern corresponding to positive photosensitive characteristics, and the second mask 72 is formed so as to have a pedestal formation pattern corresponding to positive photosensitive characteristics.

(10) In each of the above embodiments, the example (mask exposure method) in which pattern exposure is performed through the first mask 71 and the second mask 72 in the first exposure step and the second exposure step has been described. However, the embodiment of the present invention is not limited to this. For example, pattern exposure may be performed by a direct drawing method using a laser exposure method or the like. Alternatively, in the electrode pedestal forming process, instead of the first exposure process, the second exposure process, and the development process, the electrodes 33 and 53, the pedestals 35 and 55, etc. may be directly patterned by laser irradiation.

(11) In each of the above embodiments, the example in which the second mask 72 is provided in advance on the back side of the first substrate 20 prepared in the preparation process via the carrier film 22 has been described. However, the embodiment of the present invention is not limited to this. For example, the second mask 72 may be positioned and fixed on the back side of the first substrate 20 for the first time when the second exposure process is performed.

(12) In each of the above-described embodiments, in the second exposure step, the configuration in which the exposure is performed from the back side in the state where the second mask 72 is disposed on the back side from the first substrate 20 has been described as an example. However, the embodiment of the present invention is not limited to this. For example, you may expose from the conductive layer 12 side in the state which has arrange | positioned the 2nd mask 72 in the front side rather than the conductive layer 12. FIG.

(13) In each of the above embodiments, the example in which the second exposure step is performed in the air (in the presence of oxygen) with the base film 11 peeled and the conductive layer 12 exposed is described. However, the embodiment of the present invention is not limited to this. For example, the second exposure process may be performed in a vacuum or in an inert gas atmosphere with the entire operation region O shielded from light. Or you may perform a 2nd exposure process, without peeling the base film 11, in the state which light-shielded the whole operation area | region O. FIG. In this case, the step between the region where the electrodes 33 and 53 are formed and the other region is larger than in the above embodiments, but the arrangement region (non-operation region N) of the routing wirings 38 and 58 is downsized. Can be planned. In addition, since the height of the pedestals 35 and 55 is increased (in other words, the depth of the groove between the pedestals 35 and 55 adjacent to each other is increased), the occurrence of insulation failure due to migration can be further effectively suppressed. Can do.

(14) In each of the above-described embodiments, an example in which wet development is performed using a developer in the development process has been described. However, the embodiment of the present invention is not limited to this. For example, you may perform dry development which develops by contact with developing gas, such as oxygen plasma.

(15) The application target of the touch panel and the manufacturing method thereof according to the present invention is not limited to the multi-function mobile phone and the portable game machine mentioned in the above embodiments. In addition to this, the present invention is also applied to, for example, a tablet, a conventional mobile phone, a PDA (Personal Digital Assistant), a portable music player, an in-vehicle navigation device, a PND (Portable Navigation Device), a digital camera, a digital video camera, etc. Is possible.

(16) Regarding other configurations, it should be understood that the embodiments disclosed herein are illustrative in all respects and that the scope of the present invention is not limited thereby. Those skilled in the art will readily understand that modifications can be made as appropriate without departing from the spirit of the present invention. Accordingly, other embodiments modified without departing from the spirit of the present invention are naturally included in the scope of the present invention.

  The present invention can be used for, for example, a touch panel provided in a portable electronic device.

1: Touch panel 10: Photosensitive film 11: Base film 14: Photosensitive layer 12: Conductive layer 13: Photosensitive resin layer 20: First substrate (substrate)
32: First insulating layer (insulating layer)
33: First electrode (electrode)
35: First pedestal (pedestal)
35a: upper surface 35b: bonding surface 35c: side surface 38: first routing wiring (leading wiring)
40: Second substrate (substrate)
52: Second insulating layer (insulating layer)
53: Second electrode (electrode)
55: Second pedestal (pedestal)
58: Second lead wiring (lead wiring)
71: First mask 72: Second mask 77: Conductive ink N: Non-operation area S: Planned arrangement area A: Upper surface width B: Bonding surface width θ: Angle formed by the upper surface and the side surface

Claims (5)

A manufacturing method for manufacturing a touch panel comprising a substrate, an electrode provided on the substrate, and a lead wiring connected to the electrode,
The photosensitive layer composed of a laminate of a photosensitive resin layer and a conductive layer provided on the substrate is subjected to pattern exposure and development, and the lead composed mainly of the electrode composed of the conductive layer and the photosensitive resin layer. An electrode pedestal forming step for forming a pedestal disposed in a region where the wiring is to be disposed;
A wiring forming step of discharging conductive ink on the pedestal and forming the routing wiring mainly composed of the conductive ink;
A method for manufacturing a touch panel including: The photosensitive resin layer is a negative type,
The touch panel manufacturing method according to claim 1, wherein the electrode pedestal forming step includes a step of performing pattern exposure with scattered light in a state where a mask corresponding to the pattern of the routing wiring is disposed on the back side of the substrate. The electrode pedestal forming step includes:
A deposition step in which the conductive film is provided on the base film and the photosensitive film on which the photosensitive resin layer is provided is attached to the substrate from the photosensitive resin layer side;
In a state where a first mask corresponding to the pattern of the electrode is arranged on the front side of the base film, a first exposure step of exposing from the base film side,
A second exposure step in which a second mask corresponding to the pattern of the routing wiring is disposed on the back side of the substrate, and the base film is peeled off and exposed from the back side;
Developing the photosensitive resin layer and patterning the electrode and the pedestal;
The manufacturing method of the touch panel of Claim 1 or 2 containing. A substrate,
A plurality of electrodes provided via an insulating layer on the substrate;
A plurality of pedestals having an inverted trapezoidal cross-sectional shape formed integrally with the insulating layer at the peripheral edge of the substrate and having a top surface width larger than a width of a bonding surface with the substrate;
A plurality of routing wires respectively provided on the plurality of pedestals and connected to the plurality of electrodes;
Touch panel equipped with.   The touch panel according to claim 4, wherein an angle formed by the upper surface and the side surface of the pedestal is 45 ° or more and 85 ° or less.

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