JP6457897B2 - Touch input sensor and manufacturing method thereof - Google Patents

Description

  The present invention relates to a touch input sensor and a manufacturing method thereof.

  For example, a touch input sensor such as a touch panel is used as an input device provided in an electronic device such as a multi-function mobile phone (smart phone) or a portable game machine. The touch input sensor includes, for example, a transparent substrate [substrate 101] and a pair of transparent electrodes for X coordinate detection and Y coordinate detection [transparent] as disclosed in JP 2013-156655 A (Patent Document 1). Electrodes 103, 104]. Further, the touch input sensor includes lead wirings (lead wirings 105) respectively connected to the pair of transparent electrodes.

  In the touch input sensor of Patent Document 1, a photosensitive resin layer and a conductive film are laminated on a transparent substrate, and the laminate is subjected to pattern exposure, and then an uncured portion is exposed in the presence of oxygen and then developed. Is manufactured through a procedure of forming a transparent electrode made of a conductive pattern. In the manufacturing method of Patent Document 1, a transparent electrode for X coordinate detection is formed through each of the above-described steps of “lamination → pattern exposure → exposure in the presence of oxygen → development”, and then the same process is performed to detect Y coordinate. The transparent electrode is formed. Then, routing wiring is formed during or after the formation of the transparent electrode (see paragraphs 0124 to 0126 of Patent Document 1).

  However, when a touch input sensor is manufactured by the method as described above, there are cases where it is not easy to align the transparent electrode for X coordinate detection and the transparent electrode for Y coordinate detection. In order to perform this alignment with high accuracy, it is conceivable that a photosensitive resin layer and a conductive film are laminated on both sides of the transparent substrate, and pattern exposure is simultaneously performed from both sides. However, the light-shielded region of the photosensitive resin layer on one side of the transparent substrate is supposed to be left uncured, but is cured by the exposure action from the opposite side. For this reason, during the subsequent exposure in the presence of oxygen, the entire photosensitive resin layer on both sides of the transparent substrate has already been cured (with this, the conductive film is entirely retained on the photosensitive resin layer. Therefore, a desired transparent electrode pattern cannot be obtained.

JP 2013-156655 A

  When manufacturing a touch input sensor, a technique capable of forming transparent electrodes having a desired pattern shape on both surfaces of a transparent substrate with high positional accuracy is required.

A method for manufacturing a touch input sensor according to the present invention includes:
A transparent substrate, a pair of transparent electrodes provided in each of the input receiving regions on both sides of the transparent substrate and extending in a direction crossing each other, and a pair of transparent electrodes provided in a peripheral region located at the periphery of the input receiving region A wiring for connecting to each of the electrodes, and a method of manufacturing a touch input sensor comprising:
A first photosensitive resin layer having thermosetting properties, a transparent conductive film layer, a metal thin film layer formed of a material different from the transparent conductive film layer on both sides of the transparent substrate, respectively, and from the transparent substrate side, and A step of laminating the second photosensitive resin layer in this order (hereinafter referred to as “lamination step”);
A mask is disposed so as to cover the second photosensitive resin layers on both sides, and a first pattern exposure is performed with actinic rays from both sides, and the transparent electrode and the routing wiring are formed on the metal thin film layer. A step of forming a resist pattern having a shape corresponding to the shape (hereinafter referred to as “first exposure step”);
Etching the metal thin film layer on both sides using the resist pattern as a mask to pattern the metal thin film layer (hereinafter referred to as “etching process”);
Using the patterned metal thin film layer as a mask, second pattern exposure with actinic rays is performed from both sides in an oxygen atmosphere, and the first photosensitive resin layer is made to correspond to the shape of the transparent electrode and the routing wiring. A step of curing (hereinafter referred to as “second exposure step”),
A step of removing uncured portions exposed to the outside of the first photosensitive resin layer (hereinafter referred to as “development step”);
The whole is heated to cure the uncured portion sandwiched between the metal thin film layers on both sides as viewed from the direction orthogonal to the transparent substrate in the first photosensitive resin layer (hereinafter referred to as the following) , "Heating process").
Removing the metal thin film layer remaining in the input receiving area (hereinafter referred to as “removing process”);
including.

  According to this configuration, in the step of laminating the first photosensitive resin layer and the transparent conductive film layer on both surfaces of the transparent substrate, the metal thin film layer used as the constituent material of the lead-out wiring is further laminated. By using the layer, transparent electrodes having a desired pattern shape can be formed on both surfaces of the transparent substrate with high positional accuracy.

  More specifically, in the laminating step, a metal thin film layer and a second photosensitive resin layer are further laminated on the first photosensitive resin layer and the transparent conductive film layer that are respectively laminated on both surfaces of the transparent substrate. Among these, the second photosensitive resin layer is subjected to exposure from both sides in the first exposure step, and becomes a resist pattern (patterned resist layer) corresponding to the shape of the transparent electrode and the lead wiring. At this time, since the metal thin film layer is provided on the entire transparent substrate side adjacent to the second photosensitive resin layer on both sides, the actinic rays from both sides are shielded by both metal thin film layers. The first photosensitive resin layers on both sides are not cured. That is, the metal thin film layer functions as an overall light shielding mask for the first photosensitive resin layer in the first exposure step.

  In the subsequent etching process, the pattern shape of the resist pattern is transferred to the metal thin film layer, and a metal thin film pattern (patterned metal thin film layer) corresponding to the shapes of the transparent electrode and the lead-out wiring is obtained. The portion removed by etching becomes a light-transmitting portion through which actinic rays are transmitted, and the portion remaining without being removed becomes a light-shielding portion that blocks transmission of actinic rays. For this reason, the metal thin film pattern derived from the metal thin film layer can be used as a light-shielding mask pattern in the second exposure step performed in an oxygen atmosphere thereafter. The actinic rays irradiated from both sides and transmitted through the respective light-transmitting portions are affected by oxygen inhibition, and the first photosensitive resin layer is cured except for the surface layer portion on the exposed surface side. Therefore, the first photosensitive resin layers on both sides of the transparent substrate can be cured according to the shape of the metal thin film pattern, and a transparent electrode pattern with a low step can be formed with high positional accuracy.

  Here, the pair of transparent electrodes of the touch input sensor that intersect with each other usually have a portion overlapping when viewed from the direction orthogonal to the transparent substrate, and accordingly, the metal thin film patterns on both sides are also orthogonal to the transparent substrate. It will have the part which overlaps seeing from a direction. Therefore, the portion of the first photosensitive resin layer sandwiched between the metal thin film layers on both sides is shielded from both sides in the second exposure step and remains uncured thereafter. Will be maintained. In the present invention, since the transparent conductive film layer and the metal thin film layer on the first photosensitive resin layer are laminated and integrated, unlike the case of using a normal photomask in the second exposure step, the subsequent development step In FIG. 5, the uncured portion of the first photosensitive resin layer sandwiched between the metal thin film layers is not removed. Therefore, in the subsequent heating step, the uncured portion that has not been removed can be cured, and the transparent conductive film layer can be fixedly held on the portion, and the overlapping portions of the pair of transparent electrodes are appropriately formed. be able to. As a result, a transparent electrode having a desired pattern shape can be formed on both surfaces of the transparent substrate.

  Thereafter, in the removing step, the transparency of the input receiving area can be ensured by removing the metal thin film layer remaining in the input receiving area. Therefore, the visibility of the display screen of the display device can be ensured even when the touch input sensor is applied to a touch panel that is overlapped with the display device. At that time, since the metal thin film layer and the transparent conductive film layer are formed of different materials, only the metal thin film layer can be easily selectively removed. In addition, the metal thin film pattern still remaining in the peripheral region after the removing step can be used as it is as the lead wiring. In addition, since the transparent conductive film layer that is the basis of the transparent electrode and the metal thin film layer that is the basis of the routing wiring are integrated in the laminate, it is easy to ensure electrical connection between the transparent electrode and the routing wiring, and touch Reliability as an input sensor can also be improved.

The touch input sensor manufactured in this way has the following structure. That is,
A touch input sensor,
A transparent substrate;
A first support layer laminated on the first surface side of the transparent substrate;
A first transparent electrode laminated on the first carrier layer in the input receiving area;
A first routing wiring provided in a peripheral region located at a peripheral edge of the input receiving region and connected to the first transparent electrode;
A second support layer laminated on the second surface side of the transparent substrate;
A second transparent electrode stacked in the second receiving layer in the input receiving region and extending in a direction intersecting the first transparent electrode;
A second routing wiring provided in the peripheral region and connected to the second transparent electrode,
The first support layer has a constant thickness and a first base disposed in contact with the transparent substrate; a first raised portion that protrudes from the first base toward the opposite side of the transparent substrate; Including
The second carrier layer has a constant thickness and a second base portion disposed in contact with the transparent substrate; a second raised portion that protrudes from the second base portion toward the opposite side of the transparent substrate; Including
The first transparent electrode is composed of a transparent conductive film layer laminated on the first raised portion in the input receiving area,
The second transparent electrode is composed of a transparent conductive film layer laminated on the second raised portion in the input receiving area,
The first routing wiring is composed of a laminate of a transparent conductive film layer and a metal thin film layer formed of a material different from the transparent conductive film layer, which is stacked on the first raised portion in the peripheral region. ,
The second routing wiring is composed of a laminate of a transparent conductive film layer and a metal thin film layer formed of a material different from the transparent conductive film layer, which is laminated on the second raised portion in the peripheral region. ing.

  Hereinafter, preferred embodiments of the present invention will be described. However, the scope of the present invention is not limited by the preferred embodiments described below.

  As one aspect, in the step of curing the uncured portion, it is preferable to heat the whole in a state where a surface protective layer is laminated on the metal thin film layer in the peripheral region.

  According to this structure, it can suppress effectively that the surface of the metal thin film layer used as the base of routing wiring is oxidized during a heating process. Moreover, in the removal process after the heating process, only the metal thin film layer remaining in the input receiving region can be easily removed.

  As one aspect, it is preferable that the thickness of the metal thin film layer is 0.1 μm or more and 10 μm or less.

  When the thickness of the metal thin film layer is less than 0.1 μm, the function of the metal thin film layer as a light shielding mask may be insufficient in the first exposure process and the second exposure process. On the other hand, when the thickness of the metal thin film layer exceeds 10 μm, the time required for the etching process and the removal process is significantly increased, and the thickness of the touch input sensor may be significantly increased. Therefore, by setting the thickness of the metal thin film layer to 0.1 μm or more and 10 μm or less as described above, it is possible to sufficiently ensure the function of the metal thin film layer as a light shielding mask in the first exposure process and the second exposure process. . In addition, the time required for manufacturing the touch input sensor can be reduced, and the thickness of the touch input sensor can be reduced. Therefore, a thin touch input sensor can be manufactured appropriately and efficiently.

  As one aspect, it is preferable that the transparent conductive film layer includes metal nanowires.

  According to this configuration, the oxygen permeability in the transparent conductive film layer can be sufficiently ensured, so that oxygen inhibition is appropriately caused in the surface layer portion of the first photosensitive resin layer in the second exposure step under an oxygen atmosphere. be able to. Therefore, a transparent electrode pattern with a low step can be formed satisfactorily, and the appearance of the transparent electrode pattern can be suppressed.

  In one embodiment, the metal nanowire is a silver nanowire, and the metal thin film layer preferably contains copper.

  According to this configuration, a touch input sensor including a transparent electrode excellent in conductivity and transparency and a routing wiring excellent in conductivity can be appropriately manufactured at a relatively low cost.

  Further features and advantages of the present invention will become more apparent from the following description of exemplary and non-limiting embodiments described with reference to the drawings.

The top view of the touch input sensor concerning an embodiment II-II sectional view of FIG. III-III sectional view of FIG. Sectional view showing photosensitive conductive film Schematic diagram showing the lamination process Schematic diagram showing the first exposure process Schematic diagram showing the first development process Schematic diagram showing the etching process Schematic diagram showing one aspect of the second exposure process Schematic diagram showing one state at the completion of the second exposure step Schematic diagram showing one aspect of the second exposure process Schematic diagram showing one state at the completion of the second exposure step Schematic diagram showing one aspect of the second development process Schematic diagram showing one aspect of the second development process Schematic diagram showing the heating process Schematic diagram showing the removal process

  The touch input sensor 1 of the present embodiment is a touch panel or the like that is provided in an electronic device such as a multi-function mobile phone (smart phone) or a portable game machine, and functions as an input device. In these electronic devices, the touch input sensor 1 is used by being overlapped with a display device such as a liquid crystal display panel or an organic EL (electroluminescence) display panel. Hereinafter, the touch input sensor 1 of this embodiment and the manufacturing method thereof will be described in detail.

  In the drawings referred to in the following description, the scale, the vertical and horizontal dimension ratios, and the like may be displayed differently from the actual product from the viewpoint of ease of illustration and ease of understanding. . Regarding the respective members that are expected to exist in plural, the specific numbers mentioned in the following description and shown in the corresponding drawings are merely examples, and other numbers can naturally be used. It is.

  As shown in FIGS. 1 to 3, the touch input sensor 1 includes a transparent substrate 10, support layers 12 and 22, transparent electrodes 14 and 24, and routing wires 16 and 26. The support layers 12 and 22 and the transparent electrodes 14 and 24 have a rectangular input reception set in the central region of the transparent substrate 10 when viewed from a direction orthogonal to the transparent substrate 10 (hereinafter referred to as “plan view”). It is provided in region I. The lead wirings 16 and 26 are provided in a peripheral area P having a rectangular frame shape that is set in the peripheral area of the transparent substrate 10 and is positioned in the peripheral area of the input receiving area I in a plan view. The first support layer 12, the first transparent electrode 14, and the first routing wiring 16 are provided on one surface (first surface 10 a) side of the transparent substrate 10, and the second support layer 22 and the second transparent electrode 24 are provided. The second routing wiring 26 is provided on the other surface (second surface 10 b) side of the transparent substrate 10. On the first surface 10a side of the transparent substrate 10, the first support layer 12 and the first transparent electrode 14 are laminated in this order from the transparent substrate 10 side, and on the second surface 10b side of the transparent substrate 10 from the transparent substrate 10 side. The second support layer 22 and the second transparent electrode 24 are laminated in this order. The touch input sensor 1 according to the present embodiment includes the transparent electrodes 14 and 24 on both surfaces of a single transparent substrate 10, thereby reducing the thickness of the entire sensor.

  The transparent substrate 10 is a member serving as a base for providing the first transparent electrode 14 and the second transparent electrode 24. The transparent substrate 10 is preferably configured using a material excellent in flexibility, insulation and the like in addition to transparency. The transparent substrate 10 can be made of, for example, a general-purpose resin such as polyethylene terephthalate or acrylic resin, a general-purpose engineering resin such as polyacetal resin or polycarbonate resin, or a super engineering resin such as polysulfone resin or polyphenylene sulfide resin. . In the present embodiment, the transparent substrate 10 is composed of a polyethylene terephthalate film. Note that the transparent substrate 10 may be formed of a glass substrate or the like. The thickness of the transparent substrate 10 can be set to, for example, 25 μm to 100 μm.

  As shown in FIG. 2, the first support layer 12 is disposed on the first surface 10 a of the transparent substrate 10. The first carrier layer 12 includes a first base portion 12A and a plurality of first raised portions 12B. The first base portion 12 </ b> A is disposed in contact with the first surface 10 a of the transparent substrate 10. The first base portion 12A is formed to have a certain thickness. The first raised portion 12B is formed so as to rise from the first base portion 12A toward the side opposite to the transparent substrate 10. A plurality of (in this example, five) first transparent electrodes 14 are arranged on the first raised portion 12B of the first carrier layer 12. That is, a plurality of first transparent electrodes 14 are provided on the first surface 10 a of the transparent substrate 10 via the first support layer 12. As shown in FIG. 1, each of the plurality of first transparent electrodes 14 is formed by connecting a plurality (five in this example) of rhombus electrodes arranged side by side in the X-axis direction to each other in the X-axis direction. Has been. Each of the first transparent electrodes 14 is formed so as to extend along the X-axis direction as a whole. The plurality of first transparent electrodes 14 are arranged in parallel to each other so as to be aligned in the Y-axis direction.

  As shown in FIG. 2, the second support layer 22 is disposed on the second surface 10 b of the transparent substrate 10. The second carrier layer 22 includes a second base portion 22A and a plurality of second raised portions 22B. The second base portion 22 </ b> A is disposed in contact with the second surface 10 b of the transparent substrate 10. The second base portion 22A is formed to have a certain thickness. The second raised portion 22B is formed so as to protrude from the second base portion 22A toward the opposite side of the transparent substrate 10. On the second raised portion 22 </ b> B of the second carrier layer 22, a plurality (four in this example) of second transparent electrodes 24 are arranged. That is, a plurality of second transparent electrodes 24 are provided on the second surface 10 b of the transparent substrate 10 via the second support layer 22. As shown in FIG. 1, a plurality of (six in this example) a plurality of second transparent electrodes 24 are arranged side by side along the Y-axis direction intersecting (orthogonal in this example) in the X-axis direction. The rhomboid electrodes are connected to each other in the Y-axis direction. Each of the second transparent electrodes 24 is formed so as to extend along the Y-axis direction as a whole. The plurality of second transparent electrodes 24 are arranged in parallel to each other so as to be aligned in the X-axis direction.

  The plurality of rhombus electrodes constituting the first transparent electrode 14 and the plurality of rhombus electrodes constituting the second transparent electrode 24 are arranged in a complementary positional relationship in plan view. That is, the rhombus electrode constituting the second transparent electrode 24 is arranged in the non-arrangement region of the rhombus electrode constituting the first transparent electrode 14, and the first transparent electrode is arranged in the non-arrangement region of the rhombus electrode constituting the second transparent electrode 24. The rhombus electrode which comprises 14 is arrange | positioned. The plurality of first transparent electrodes 14 and the plurality of second transparent electrodes 24 are disposed so as to cover the input receiving area I corresponding to the display area of the display device almost entirely. In addition, the 1st connection piece part which connects the mutually adjacent rhombus electrodes in the 1st transparent electrode 14 to an X-axis direction, and the 2nd connection which connects the mutually adjacent rhombus electrodes in the 2nd transparent electrode 24 to a Y-axis direction. The one part is arranged so as to overlap in plan view.

  It is preferable that the 1st support layer 12 and the 2nd support layer 22 are comprised using the resin material excellent in transparency and electrical insulation. Moreover, it is preferable that the 1st support layer 12 and the 2nd support layer 22 are comprised using the resin material which has moderate hardness and mechanical strength. In the present embodiment, the support layers 12 and 22 are mainly composed of a photosensitive resin described later.

  The 1st transparent electrode 14 and the 2nd transparent electrode 24 are comprised using the material excellent in electroconductivity in addition to transparency. The transparent electrodes 14 and 24 are, for example, metal nanowires or carbons made of metal oxides such as tin oxide, indium oxide, zinc oxide, and ITO (Indium Tin Oxide), gold, silver, copper, nickel, and alloys thereof. It is composed of nanotubes, graphene, metal mesh, conductive polymer, and the like. The transparent electrodes 14 and 24 are transparent conductive film layers formed using these materials. In this embodiment, the transparent electrodes 14 and 24 are comprised by the silver nanowire which is 1 type of metal nanowire.

  Each of the first transparent electrodes 14 is connected to the first routing wiring 16. Each of the second transparent electrodes 24 is connected to the second routing wiring 26. The routing wirings 16 and 26 include a first layer made of the same material as that of the transparent electrodes 14 and 24 and a second layer made of a metal such as gold, silver, copper, nickel, aluminum, molybdenum, and chromium. It consists of a laminate. A connection terminal 28 is provided at the end of the routing wirings 16 and 26 opposite to the transparent electrodes 14 and 24. The transparent electrodes 14 and 24 are connected to a control unit (not shown) via the lead wirings 16 and 26 and the connection terminals 28. The touch input sensor 1 detects a current flowing according to a change in capacitance generated in the transparent electrodes 14 and 24 when a conductor such as a user's finger or a stylus approaches or separates, so that the touch by the user is detected. An operation and a touch position can be detected.

  The manufacturing method of the touch input sensor 1 includes a lamination process, a first exposure process (including a first development process), an etching process, a second exposure process, a second development process, a heating process, and a removal process. These are executed in the order described.

  The laminating step is a step of laminating various material layers on which the support layers 12 and 22, the transparent electrodes 14 and 24, and the routing wirings 16 and 26 are based on both surfaces of the transparent substrate 10. In addition, in the laminating process, in addition to them, a material layer used for patterning the routing wirings 16 and 26 and the transparent electrodes 14 and 24 is also laminated. Specifically, in the lamination step, the first photosensitive resin layer 32, the transparent conductive film layer 34, the metal thin film layer 44, and the second photosensitive resin are formed on both sides of the transparent substrate 10 from the transparent substrate 10 side. The layers 42 are stacked in this order.

  In the present embodiment, the first photosensitive resin layer 32 and the transparent conductive film layer 34 are laminated on the transparent substrate 10 using the photosensitive conductive film 3 shown in FIG. The photosensitive conductive film 3 includes a base film 31, a transparent conductive film layer 34 disposed on the base film 31, and a first photosensitive resin layer 32 disposed on the transparent conductive film layer 34. ing. In the present embodiment, the separator 36 is disposed on the first photosensitive resin layer 32.

  The base film 31 can be configured using a polymer film. The base film 31 is configured using a material having excellent heat resistance and solvent resistance. The base film 31 can be composed of, for example, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a polycarbonate film, or the like. In this embodiment, the base film 31 is composed of a polyethylene terephthalate film. The thickness of the base film 31 can be 5 micrometers-300 micrometers, for example.

  The transparent conductive film layer 34 is a layer serving as a base for the first transparent electrode 14 and the second transparent electrode 24. Further, in the present embodiment, the transparent conductive film layer 34 becomes a base of the first routing wiring 16 and the second routing wiring 26 together with the metal thin film layer 44. The transparent conductive layer 34 is made of, for example, metal nanowires, carbon nanotubes, graphene, metals made of metal oxides such as tin oxide, indium oxide, zinc oxide, and ITO, gold, silver, copper, nickel, and alloys thereof. A mesh, a conductive polymer, or the like can be used. In addition, when the transparent conductive film layer 34 is comprised by metal nanowire, metal nanowire is on the surface layer of the photosensitive resin layer 32 in "lamination | stacking" of the photosensitive resin layer 32 and the transparent conductive film layer 34. The contained form is also included. That is, the photosensitive resin layer 32 and the transparent conductive film layer 34 composed of metal nanowires do not necessarily have to be completely separated from each other.

  In the present embodiment, a thin film layer of silver nanowire which is a kind of metal nanowire is used as the transparent conductive film layer 34. The silver nanowire is a fine silver wire having an outer diameter of a nanometer unit (for example, several nm to several hundred nm). Since the silver nanowire is very fine and cannot be visually recognized by the human eye, the thin film layer of the silver nanowire is excellent in transparency. Moreover, since it is excellent also in oxygen permeability, it can be suitably used when oxygen inhibition is desired even when the transparent conductive film layer 34 is interposed during exposure with the actinic ray L. The transparent conductive film layer 34 may be configured to have a network structure in which silver nanowires exhibiting a planar distribution are in contact with each other, for example. The transparent conductive film layer 34 can be entirely formed on the base film 31 by, for example, a vacuum deposition method, a sputtering method, an ion plating method, a CVD method, a roll coater method, or the like. The thickness of the transparent conductive film layer 34 can be set to, for example, 5 nm to 5 μm.

  The first photosensitive resin layer 32 is a layer that serves as a base for the first carrier layer 12 and the second carrier layer 22. In the present embodiment, the photosensitive resin constituting the first photosensitive resin layer 32 is a resin having a property of causing a chemical change or a structural change by actinic rays L (specifically, ultraviolet rays). In the present embodiment, a negative photosensitive resin (photocurable resin) is used. Moreover, the negative photosensitive resin which comprises the 1st photosensitive resin layer 32 of this embodiment also has thermosetting (thermosetting photocurable resin). The photosensitive resin composition constituting the photosensitive resin having such properties includes, for example, a binder resin, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator.

  Examples of the binder resin include acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, phenol resin, ester resin, urethane resin, epoxy acrylate resin obtained by reaction of epoxy resin and (meth) acrylic acid An acid-modified epoxy acrylate resin obtained by a reaction between an epoxy acrylate resin and an acid anhydride can be used. These may be used alone or in combination of two or more.

  Examples of the photopolymerizable compound having an ethylenically unsaturated bond include a compound obtained by reacting an α, β-unsaturated carboxylic acid with a polyhydric alcohol, and reacting an α, β-unsaturated carboxylic acid with a glycidyl group-containing compound. Or a urethane monomer such as a (meth) acrylate compound having a urethane bond, a phthalic compound, a (meth) acrylic acid alkyl ester, or the like can be used. These may be used alone or in combination of two or more.

  Examples of photopolymerization initiators include aromatic ketones, benzoin ether compounds, benzoin compounds, oxime ester compounds, benzyl derivatives, 2,4,5-triarylimidazole dimers, acridine derivatives, N-phenylglycine, and N-phenyl. Radical polymerization initiators such as glycine derivatives, coumarin compounds, and oxazole compounds can be used. These may be used alone or in combination of two or more.

  The photosensitive resin composition may further contain various additives as necessary. Examples of additives include plasticizers, fillers, antifoaming agents, flame retardants, stabilizers, adhesion-imparting agents, leveling agents, peeling accelerators, antioxidants, fragrances, imaging agents, thermal crosslinking agents and the like. Can do. These may be contained alone or in combination of two or more.

  The first photosensitive resin layer 32 is formed, for example, by applying a solution of the above resin composition dissolved in a solvent onto the transparent conductive film layer 34 formed on the base film 31 and then drying. Can do. As the solvent, for example, methanol, ethanol, acetone, methyl ethyl ketone, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether, or the like can be used. These may be used alone or in combination of two or more. Moreover, application | coating can be performed by well-known methods, such as a roll coat method, a comma coat method, a gravure coat method, an air knife coat method, a die coat method, a bar coat method, a spray coat method, for example. Drying can be performed using, for example, a hot air convection dryer or the like. The thickness of the 1st photosensitive resin layer 32 can be 1 micrometer-200 micrometers after drying, for example.

  The separator 36 is provided to facilitate handling of the photosensitive conductive film 3. Separator 36 can be constituted using the same material (for example, polyethylene terephthalate etc.) as substrate film 31 mentioned above.

  In the present embodiment, two photosensitive conductive films 3 are prepared, the separator 36 is peeled off from each photosensitive conductive film 3, and the first photosensitive resin layer 32 is exposed. 1 is applied to the transparent substrate 10 from the photosensitive resin layer 32 side. At this time, for example, the two photosensitive conductive films 3 may be attached to both surfaces of the transparent substrate 10 by performing pressure bonding (thermal lamination) while heating to a temperature of 80 ° C. to 120 ° C.

  Thereafter, the metal thin film layer 44 is entirely laminated on the exposed surface of the transparent conductive film layer 34 in a state where the base film 31 is peeled and the transparent conductive film layer 34 is exposed. The metal thin film layer 44 is a layer serving as a basis for the first routing wiring 16 and the first routing wiring 26 in cooperation with the transparent conductive film layer 34. The metal thin film layer 44 may be opaque. The metal thin film layer 44 can be made of a metal material such as gold, silver, copper, nickel, aluminum, molybdenum, and chromium. However, the material constituting the metal thin film layer 44 is different from the material constituting the transparent conductive film layer 34. For example, when the constituent material of the transparent conductive film layer 34 is silver nanowire, the constituent material of the metal thin film layer 44 is a metal material other than silver, and in this case, for example, copper is preferable. Although the thickness of the metal thin film layer 44 is not specifically limited, For example, it is preferable that they are 0.1 micrometer or more and 10 micrometers or less. With such a thickness setting, as will be described in detail later, it is possible to sufficiently ensure the function of the metal thin film layer 44 as a light shielding mask in the first exposure process and the second exposure process. Further, it is possible to avoid an excessively long cycle time of the touch input sensor 1 or an excessively thick touch input sensor 1. More preferably, it is 0.5 μm or more and 3 μm or less, for example. The metal thin film layer 44 can be laminated on the transparent conductive film layer 34 by using various film forming methods such as vapor deposition, transfer, lamination, and electrolytic plating.

  In the laminating step, the second photosensitive resin layer 42 is further entirely laminated on the exposed surface of the metal thin film layer 44. The second photosensitive resin layer 42 is used to perform a specific function only in the manufacturing stage of the touch input sensor 1, and a member derived from the second photosensitive resin layer 42 is a touch input sensor 1 after completion. Is absent. If the photosensitive resin which comprises the 2nd photosensitive resin layer 42 has a property which produces a chemical change or a structural change by actinic light L (specifically ultraviolet rays), it will be negative type and positive type. Any of these types may be used (the following description assumes a negative type). The second photosensitive resin layer 42 is formed on the metal thin film layer 44 using, for example, a photosensitive film having a structure similar to the photosensitive conductive film 3 (however, a transparent conductive film layer is not provided; not shown). Can be stacked.

  Thus, in the laminating step, as shown in FIG. 5, the first photosensitive resin layer 32, the transparent conductive material is formed on the first surface 10 a of the transparent substrate 10 toward one side (upper side in FIG. 5). The film layer 34, the metal thin film layer 44, and the second photosensitive resin layer 42 are laminated in this order. Similarly, the first photosensitive resin layer 32, the transparent conductive film layer 34, the metal thin film layer 44, and the second surface are formed on the second surface 10b of the transparent substrate 10 toward the other side (the lower side in FIG. 5). The photosensitive resin layers 42 are laminated in this order. At this time, as described above, when the transparent conductive film layer 34 is composed of metal nanowires, the metal nanowires constituting the transparent conductive film layer 34 are opposite to the transparent substrate 10 in the photosensitive resin layer 32. The form contained in the surface layer of the side may be sufficient.

  A 1st exposure process is a process of performing the 1st exposure by the active light L from the both sides of the lamination direction with respect to the laminated body obtained at a lamination process. As shown in FIG. 6, in the first exposure step, a photomask 52 (first photomask) is disposed so as to cover the second photosensitive resin layers 42 on both sides, and the active light L is applied from both sides. A first pattern exposure is performed. One of the photomasks 52 has a first formation pattern corresponding to the overall shape (see FIG. 1) of the first transparent electrode 14 and the first routing wiring 16 in plan view. The other of the photomasks 52 has a second formation pattern corresponding to the overall shape of the second transparent electrode 24 and the second routing wiring 26 in plan view. When the 2nd photosensitive resin layer 42 is a negative type like this assumption example, a 1st formation pattern and a 2nd formation pattern are the window parts (translucent part) formed in the photomask 52. FIG. .

  The alignment of the two photomasks 52 can be performed easily and with high accuracy using a mask alignment mechanism (including a position sensor and a position adjustment mechanism) provided in the exposure apparatus. Specifically, for example, alignment marks are formed in advance on each of the two photomasks 52, and relative position information is obtained by detecting the relative positions of the alignment marks of both photomasks 52 with a position sensor such as a camera, for example. . Then, based on the obtained relative position information, the position adjustment mechanism moves the two photomasks 52 so that the alignment marks that make a pair overlap each other by aligning the centers, thereby positioning the two photomasks 52. Good to do.

  Then, the ultraviolet rays as the active light L are irradiated from both sides. In the present embodiment, ultraviolet rays as the active light L are simultaneously irradiated from both sides. The actinic ray L can be irradiated using, for example, an ultraviolet irradiation lamp. The exposure intensity and exposure time of the actinic ray L can be appropriately set according to the photosensitive characteristics of the second photosensitive resin layer 42. In the first exposure step, double-sided simultaneous exposure is performed with the photomasks 52 disposed on both sides of the laminate, and the second photosensitive resin layer 42 on the metal thin film layer 44 is formed according to the pattern shape of the photomask 52. Cure in pattern. In addition, since the metal thin film layer 44 is provided on the entire surface of the transparent substrate 10 with respect to the second photosensitive resin layer 42 on both sides, the actinic rays L from both sides of the both sides of the thin metal film 44 are provided. The light is shielded by the layer 44, and the first photosensitive resin layer 32 is not cured.

  After the double-sided simultaneous exposure, the uncured portion of the second photosensitive resin layer 42 is removed by a normal development process (first development process) with the photomask 52 removed. As a result, as shown in FIG. 7, the cured second photosensitive resin layer 42 having a shape corresponding to the shapes of the transparent electrodes 14, 24 and the routing wirings 16, 26 is formed on the metal thin film layers 44 on both sides. A resist pattern 43 is formed.

  An etching process is a process of etching the specific part of the metal thin film layer 44 in the laminated body after the completion of the first exposure process. In the etching process, the resist pattern 43 obtained in the first exposure process functions as an anticorrosion member that prevents dissolution and erosion of the metal thin film layer 44. The composition of the etching solution may be appropriately set according to the constituent material of the metal thin film layer 44. In the etching process, as shown in FIG. 8, the metal thin film layer 44 on both sides is etched using the resist pattern 43 made of the cured second photosensitive resin layer 42 as a mask (etching mask), and the metal thin film layer 44 is patterned. Specifically, the metal thin film layer 44 on the first surface 10a side of the transparent substrate 10 has a shape corresponding to the overall shape (see FIG. 1) of the first transparent electrode 14 and the first routing wiring 16 in plan view. Pattern. Further, the metal thin film layer 44 on the second surface 10b side of the transparent substrate 10 is patterned into a shape corresponding to the overall shape of the second transparent electrode 24 and the second routing wiring 26 in plan view. Thus, the pattern shape of the resist pattern 43 on both sides is transferred to the metal thin film layer 44 on both sides, and a metal thin film pattern 45 is obtained. When the etching process is completed, the resist pattern 43 (cured second photosensitive resin layer 42) may be removed.

  A 2nd exposure process is a process of performing the 2nd exposure by the active light L from the both sides of the lamination direction with respect to the laminated body after completion of an etching process. In the second exposure process, the metal thin film pattern 45 (patterned metal thin film layer 44) obtained in the etching process functions as a light-shielding mask pattern that blocks transmission of the actinic ray L with a certain pattern. As shown in FIGS. 9 and 11, in the second exposure step, the second pattern exposure with the active light L is performed from both sides using the metal thin film pattern 45 as a mask (second photomask). The metal thin film layer 44 is laminated and integrated with the transparent conductive film layer 34, and the high-precision alignment of the metal thin film patterns 45 on both sides has already been completed when the first exposure process is completed. 9 corresponds to a part of the part shown in FIG. 2, and FIG. 11 corresponds to a part of the part shown in FIG.

  In the second exposure step, ultraviolet rays as actinic rays L are irradiated from both sides. In the present embodiment, ultraviolet rays as the active light L are simultaneously irradiated from both sides. The exposure intensity and exposure time of the actinic ray L can be appropriately set according to the photosensitive characteristics of the first photosensitive resin layer 32. In the second exposure step, double-sided simultaneous exposure is performed in an oxygen atmosphere, and the first photosensitive resin layer 32 on the transparent substrate 10 is cured into a pattern according to the pattern shape of the metal thin film pattern 45. At this time, as shown in FIG. 10 corresponding to FIG. 9 and FIG. 12 corresponding to FIG. 11, the actinic rays L irradiated from both sides and transmitted through the respective light transmitting portions (portions where the metal thin film layer 44 is not provided) Under the influence of oxygen inhibition, the deep layer portion other than the surface layer portion of the irradiation-side first photosensitive resin layer 32 and the opposite first photosensitive resin layer 32 are cured. At that time, whether or not the entire first photosensitive resin layer 32 on the opposite side is cured is determined depending on the presence or absence of the metal thin film layer 44 behind the first photosensitive resin layer 32. In FIGS. 10 and 12, the cured portion (cured portion 32C) and the uncured portion (uncured portion 32U) of the first photosensitive resin layer 32 are indicated by different hatchings. doing.

  A more specific description will be given with reference to the examples of FIGS. In the region (a) where the metal thin film layer 44 exists only on the second surface 10b side of the transparent substrate 10, the actinic ray L from the first surface 10a side is the first photosensitive resin layer on the first surface 10a side. The deep layer portion 32 and the entire first photosensitive resin layer 32 on the second surface 10b side are cured. In this region, the actinic ray L from the second surface 10b side is shielded by the metal thin film layer 44 on the second surface 10b side and does not contribute to the photocuring of the first photosensitive resin layer 32. In the region (b) where the metal thin film layer 44 exists only on the first surface 10a side of the transparent substrate 10, the actinic ray L from the second surface 10b side is the first photosensitive resin layer on the second surface 10b side. The deep layer portion 32 and the entire first photosensitive resin layer 32 on the first surface 10a side are cured. In this region, the actinic ray L from the first surface 10a side is shielded by the metal thin film layer 44 on the first surface 10a side and does not contribute to the photocuring of the first photosensitive resin layer 32.

  In the region (c) where the metal thin film layer 44 does not exist on any surface side of the transparent substrate 10, the actinic ray L from both surfaces is a deep layer portion of the first photosensitive resin layer 32 on the first surface 10 a side. Then, the deep layer portion of the first photosensitive resin layer 32 on the second surface 10b side is cured. In the region (d) where the metal thin film layer 44 exists on both the first surface 10 a side and the second surface 10 b side of the transparent substrate 10, the actinic rays L from both surfaces are shielded by the metal thin film layers 44 on both surfaces. As a result, the entire first photosensitive resin layer 32 on both sides remains uncured.

  In the region (a) or (b), the part where the entire first photosensitive resin layer 32 is cured on one side of the transparent substrate 10 is combined, and the first transparent electrode 14, the first routing wiring 16, and the first Most of the two transparent electrodes 24 and the second routing wiring 26 are formed. In this way, in the second exposure step, the first photosensitive resin layer 32 is cured in accordance with the shapes of the transparent electrodes 14 and 24 and the routing wirings 16 and 26. However, at this time, in the finally obtained touch input sensor 1, a portion where the first transparent electrode 14 and the second transparent electrode 24 overlap in plan view is not yet cured.

  The second development step is a step of performing development processing on the laminated body after completion of the second exposure step. In the present embodiment, the second development step corresponds to the “development step” referred to in the “Summary of Invention” section. In the second development step, the uncured portion 32U of the first photosensitive resin layer 32 that remains uncured even after the completion of the second exposure step is partially removed. The second development step can be performed by wet development using a developer, dry development using a developing gas, or the like. In the present embodiment, as shown in FIG. 13 corresponding to FIG. 10 and FIG. 14 corresponding to FIG. 12, in the second development step, the uncured portion exposed to the outside in the first photosensitive resin layer 32, respectively. Remove 32U. Here, “exposed outside” in this specification is a concept including being in a state of facing the outside only through the transparent conductive film layer 34.

  On the other hand, as shown in FIG. 14, the uncured portion 32U of the first photosensitive resin layer 32 that is covered with the metal thin film layer 44 and is not exposed to the outside is not removed. That is, in the touch input sensor 1 finally obtained from the uncured portion 32U of the first photosensitive resin layer 32, the portion that is the basis of the portion where the transparent electrodes 14 and 24 overlap each other in plan view is not removed. It remains as it is. In the second development step, the metal thin film layer 44 functions as a “removal prevention layer” that prevents even a necessary portion of the uncured portion 32U of the first photosensitive resin layer 32 from being removed.

  If the second exposure process is performed using a normal photomask instead of the metal thin film pattern 45 and the normal development process is performed with the photomask removed in the subsequent second development process, Inconvenience occurs. That is, when the photomask is removed, the transparent electrodes 14 and 24 overlap each other in plan view in the touch input sensor 1 finally obtained in the uncured portion 32U of the first photosensitive resin layer 32. Even the part is exposed to the outside. For this reason, in the second development step, the uncured portion 32U of the first photosensitive resin layer 32 including the portion is removed, and finally, the transparent electrodes 14 and 24 cannot be appropriately formed. On the other hand, in this embodiment, the metal thin film pattern 45 (metal thin film layer 44) is laminated and integrated with the transparent conductive film layer 34 through the second exposure process and the second development process. Does not occur.

  Thus, in the second development step, as shown in FIG. 13, the transparent electrodes 14 and 24 made of the patterned transparent conductive layer 34 are overlapped with each other in the input receiving areas I on both sides of the transparent substrate 10 (in a plan view). (See FIG. 14). In addition, in the peripheral regions P on both surfaces of the transparent substrate 10, routing wirings 16 and 26 each including a patterned transparent conductive film layer 34 and a metal thin film layer 44 are formed.

  A heating process is a process of heat-processing with respect to the laminated body after the completion of a 2nd exposure process. In the heating step, for example, the laminate is allowed to stand in a heating means such as an electric heater for a certain period of time to heat the entire laminate. At this time, the laminate is heated to a temperature of, for example, 80 ° C. or higher and 250 ° C. or lower (preferably 100 ° C. or higher and 180 ° C. or lower). In the present embodiment, since the photosensitive resin constituting the first photosensitive resin layer 32 also has thermosetting properties, the uncured portion 32U still remaining at that time is cured by heat treatment. Can do. In the present embodiment, when the second development process is completed, the uncured portion 32U of the first photosensitive resin layer 32 that is sandwiched between the metal thin film layers 44 on both sides in a plan view and remains uncured. Is entirely cured by a heating process. As a result, as shown in FIG. 15, the transparent conductive film layer 34 can be fixedly held also in this portion, and the portions of the transparent electrodes 14 and 24 that overlap each other in plan view can be appropriately formed. As a result, the transparent electrodes 14 and 24 having a desired pattern shape can be appropriately formed on both surfaces of the transparent substrate 10 including the portion where the transparent electrodes 14 and 24 overlap.

  In this heating step, it is preferable to perform the heat treatment in a state where the surface protective layer 48 (see FIG. 16) is laminated on the metal thin film layer 44 in the peripheral region P. The surface protective layer 48 is, for example, an organic passivation layer. In this way, it is possible to effectively suppress oxidation of the surface of the metal thin film layer 44 that is the source of the routing wirings 16 and 26 during the heating process.

  The removing process is a process of removing the unnecessary metal thin film layer 44 from the laminated body after the completion of the heating process. In the removing step, the metal thin film layer 44 still remaining in the input receiving area I after the heating step is removed. This removal step can be performed by, for example, an etching process. In this case, the surface protective layer 48 additionally laminated in the heating step functions as a corrosion preventing member for preventing dissolution and erosion of the metal thin film layer 44 in the peripheral region P. The composition of the etching solution may be appropriately set according to the constituent material of the metal thin film layer 44 and the constituent material of the transparent conductive film layer 34. That is, the composition of the etching solution is preferably set so as not to exert a dissolving action on the transparent conductive film layer 34 and to selectively exert a dissolving action only on the metal thin film layer 44.

  Thus, by the removal process, as shown in FIG. 16, only the metal thin film layer 44 in the input receiving region I is selectively removed while the metal thin film layer 44 (metal thin film pattern 45) in the peripheral region P is left. To do. Thereby, the visibility of the view area of the touch input sensor 1 (area corresponding to the display screen of the display device arranged to overlap the touch input sensor 1 on the touch panel) can be ensured. In addition, the metal thin film layer 44 (metal thin film pattern 45) still remaining in the peripheral region P after the removing step can be used as the routing wirings 16 and 26 as they are. The metal thin film pattern 45 in the peripheral region P is not surface oxidized under the protection by the surface protective layer 48, and the transparent conductive film layer 34 and the metal thin film layer 44 are laminated and integrated. It is easy to ensure an electrical connection at a connection portion between the wiring 24 and the lead wirings 16 and 26. Therefore, the reliability as the touch input sensor 1 can also be improved.

As described above, according to the manufacturing method of the present embodiment, at the stage of laminating the first photosensitive resin layer 32 and the transparent conductive film layer 34 on both surfaces of the transparent substrate 10, the routing wirings 16 and 26 are formed. A metal thin film layer 44 used as a constituent material is further laminated. The metal thin film layer 44 plays the following roles (a) to (d) in manufacturing the touch input sensor 1.
(A) A light shielding mask for the entire surface of the first photosensitive resin layer 32 in the first exposure step (b) A light shielding mask pattern for the first photosensitive resin layer 32 in the second exposure step (c) Second development In the process, the removal prevention layer (d) for the necessary portion of the uncured portion 32U of the first photosensitive resin layer 32. The constituent material of the routing wirings 16 and 26 in the touch input sensor 1 after completion.

  As described above, according to the manufacturing method of this embodiment, the transparent electrodes 14 and 24 having desired pattern shapes are formed on both surfaces of the transparent substrate 10 by causing the metal thin film layer 44 to exhibit various functions in each process in the manufacturing stage. Can be formed with high positional accuracy.

And the touch input sensor 1 manufactured as mentioned above is provided with the following structures. That is, the touch input sensor 1
A transparent substrate 10;
A first support layer 12 laminated on the first surface 10a side of the transparent substrate 10,
A first transparent electrode 14 stacked on the first carrier layer 12 in the input receiving area I;
A first routing wiring 16 provided in the peripheral area P located at the peripheral edge of the input receiving area I and connected to the first transparent electrode 14;
A second carrier layer 22 laminated on the second surface 10b side of the transparent substrate 10,
A second transparent electrode 24 laminated in the input receiving region I and extending in a direction intersecting the first transparent electrode 14;
A second routing wire 26 provided in the peripheral region P and connected to the second transparent electrode 24;
Is provided. And
The first carrier layer 12 has a first base portion 12A having a certain thickness and disposed in contact with the transparent substrate 10, and a first raised portion that protrudes from the first base portion 12A toward the opposite side of the transparent substrate 10. 12B,
The second support layer 22 has a constant thickness and is disposed in contact with the transparent substrate 10, and a second raised portion that protrudes from the second base portion 22 </ b> A toward the opposite side of the transparent substrate 10. 22B. further,
The first transparent electrode 14 is composed of a transparent conductive film layer 34 laminated on the first raised portion 12B in the input receiving area I,
The second transparent electrode 24 is composed of a transparent conductive film layer 34 laminated on the second raised portion 22B in the input receiving area I,
The first routing wiring 16 is a lamination of a transparent conductive film layer 34 and a metal thin film layer 44 formed of a material different from the transparent conductive film layer 34, which is laminated on the first raised portion 12 </ b> B in the peripheral region P. Composed of things
The second routing wiring 26 is a lamination of a transparent conductive film layer 34 and a metal thin film layer 44 formed of a material different from the transparent conductive film layer 34, which is laminated on the second raised portion 22 </ b> B in the peripheral region P. It consists of things.

  The transparent conductive film layer 34 constituting the first transparent electrode 14 and the transparent conductive film layer 34 constituting the first routing wiring 16 are at the same level (the same position in the stacking direction), and the outside ( A metal thin film layer 44 constituting the first routing wiring 16 is disposed at a position in the stacking direction adjacent to the side opposite to the transparent substrate 10. Similarly, the transparent conductive film layer 34 that constitutes the second transparent electrode 24 and the transparent conductive film layer 34 that constitutes the second routing wiring 26 are at the same level. A metal thin film layer 44 that constitutes the second routing wiring 26 is disposed.

  Since the touch input sensor 1 having such a structure includes the transparent electrodes 14 and 24 on both surfaces of the single transparent substrate 10, it is a very thin sensor. In addition, since the transparent electrodes 14 and 24 are formed on the both surfaces of the transparent substrate 10 with a desired pattern shape and formed with high position accuracy, high position detection accuracy can be ensured and the function as an input device is excellent. ing. Further, since the supporting layers 12 and 22 including the base portions 12A and 22A and the raised portions 12B and 22B respectively support the transparent electrodes 14 and 24 at the raised portions 12B and 22B, the step between the electrode pattern and the non-electrode pattern. Can be reduced. Therefore, it can suppress that the pattern appearance of the transparent electrodes 14 and 24 arises. Furthermore, since the connection portion between the transparent electrodes 14 and 24 and the routing wirings 16 and 26 is realized by a portion where the transparent conductive film layer 34 and the metal thin film layer 44 are laminated and integrated, electrical connection at the portion is performed. Easy to secure. Therefore, the touch input sensor 1 with high reliability is obtained.

[Other Embodiments]
(1) In the above embodiment, in the laminating step, the first photosensitive resin layer 32 and the transparent conductive film layer 34 are laminated on both surfaces of the transparent substrate 10 using the two photosensitive conductive films 3, and then The configuration in which the metal thin film layer 44 and the second photosensitive resin layer 42 are sequentially stacked has been described as an example. However, without being limited to such a configuration, for example, the first photosensitive resin layer 32, the transparent conductive film layer 34, the metal thin film layer 44, and the second photosensitive resin are formed on both surfaces of the transparent substrate 10. The layers 42 may be sequentially stacked.

(2) The above embodiment has been described assuming that the photosensitive resin constituting the second photosensitive resin layer 42 is a negative type. However, the photosensitive resin constituting the second photosensitive resin layer 42 is not limited to such a configuration, and may be a positive type. In this case, the first formation pattern and the second formation pattern that the photomask 52 used in the first exposure step has become a main body portion (light-shielding portion) of the photomask 52.

(3) In the above embodiment, the configuration in which the ultraviolet rays as the actinic rays L are irradiated in the first exposure step and the second exposure step has been described as an example. However, the present invention is not limited to such a configuration, and the actinic ray L can be used as long as it is a light ray suitable for exerting a photosensitive action on the first photosensitive resin layer 32 and the second photosensitive resin layer 42. For example, visible light or X-rays may be used.

(4) In the above embodiment, the configuration in which the heat treatment is performed in a state where the surface protective layer 48 is laminated on the metal thin film layer 44 in the peripheral region P in the heating step has been described as an example. However, the present invention is not limited to such a configuration. For example, when some surface oxidation of the routing wirings 16 and 26 is allowed, the metal thin film layer 44 in the peripheral region P is left exposed. Heat treatment may be performed.

(5) In the above embodiment, the first transparent electrode 14 and the second transparent electrode 24 have been described as an example of a configuration in which a plurality of rhombus electrodes are connected to each other. However, without being limited to such a configuration, the transparent electrodes 14 and 24 may be formed in, for example, a stripe shape (a linear shape having a constant width), a wavy shape, or a zigzag shape. The shape of the first formation pattern and the second formation pattern of the photomask 52 is determined according to the planar view shape of the transparent electrodes 14 and 24.

  Note that the configurations disclosed in each of the above-described embodiments (including the above-described embodiments and other embodiments; the same applies hereinafter) are applied in combination with the configurations disclosed in the other embodiments unless a contradiction arises. It is also possible.

  Regarding other configurations, it should be understood that the embodiments disclosed herein are illustrative in all respects and that the scope of the present invention is not limited thereby. Those skilled in the art will readily understand that modifications can be made as appropriate without departing from the spirit of the present invention. Accordingly, other embodiments modified without departing from the spirit of the present invention are naturally included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Touch input sensor 10 Transparent substrate 10a 1st surface 10b 2nd surface 12 1st support layer 12A 1st base 12B 1st protruding part 14 1st transparent electrode 16 1st routing wiring 22 2nd support layer 22A 2nd base 22B 1st Two raised portions 24 Second transparent electrode 26 Second routing wiring 32 First photosensitive resin layer 32C Cured portion 32U Uncured portion 34 Transparent conductive layer 42 Second photosensitive resin layer 43 Resist pattern 44 Metal thin film layer 45 Metal Thin film pattern 48 Surface protective layer I Input reception area P Peripheral area L Actinic ray

Claims (6)

A transparent substrate, a pair of transparent electrodes provided in each of the input receiving regions on both sides of the transparent substrate and extending in a direction crossing each other, and a pair of transparent electrodes provided in a peripheral region located at the periphery of the input receiving region A wiring for connecting to each of the electrodes, and a method of manufacturing a touch input sensor comprising:
A first photosensitive resin layer having thermosetting properties, a transparent conductive film layer, a metal thin film layer formed of a material different from the transparent conductive film layer on both sides of the transparent substrate, respectively, and from the transparent substrate side, and Laminating in order of the second photosensitive resin layer;
A mask is disposed so as to cover the second photosensitive resin layers on both sides, and a first pattern exposure is performed with actinic rays from both sides, and the transparent electrode and the routing wiring are formed on the metal thin film layer. Forming a resist pattern having a shape corresponding to the shape;
Etching the metal thin film layer on both sides using the resist pattern as a mask, and patterning the metal thin film layer;
Using the patterned metal thin film layer as a mask, second pattern exposure with actinic rays is performed from both sides in an oxygen atmosphere, and the first photosensitive resin layer is made to correspond to the shape of the transparent electrode and the routing wiring. Curing and
Of the first photosensitive resin layer, removing the uncured portion exposed outside,
Heating the whole and curing the uncured portion sandwiched between the metal thin film layers on both sides as seen from the direction orthogonal to the transparent substrate in the first photosensitive resin layer;
Removing the metal thin film layer remaining in the input receiving area;
A method for manufacturing a touch input sensor.   The method for manufacturing a touch input sensor according to claim 1, wherein in the step of curing the uncured portion, the whole is heated in a state where a surface protective layer is laminated on the metal thin film layer in the peripheral region.   The method for manufacturing a touch input sensor according to claim 1, wherein a thickness of the metal thin film layer is 0.1 μm or more and 10 μm or less.   The said transparent conductive film layer is a manufacturing method of the touch input sensor as described in any one of Claim 1 to 3 containing metal nanowire.   The method of manufacturing a touch input sensor according to claim 4, wherein the metal nanowire is a silver nanowire, and the metal thin film layer includes copper. A transparent substrate;
A first support layer laminated on the first surface side of the transparent substrate;
A first transparent electrode laminated on the first carrier layer in the input receiving area;
A first routing wiring provided in a peripheral region located at a peripheral edge of the input receiving region and connected to the first transparent electrode;
A second support layer laminated on the second surface side of the transparent substrate;
A second transparent electrode stacked in the second receiving layer in the input receiving region and extending in a direction intersecting the first transparent electrode;
A second routing wiring provided in the peripheral region and connected to the second transparent electrode,
The first support layer has a constant thickness and a first base disposed in contact with the transparent substrate; a first raised portion that protrudes from the first base toward the opposite side of the transparent substrate; Including
The second carrier layer has a constant thickness and a second base portion disposed in contact with the transparent substrate; a second raised portion that protrudes from the second base portion toward the opposite side of the transparent substrate; Including
The first transparent electrode is composed of a transparent conductive film layer laminated on the first raised portion in the input receiving area,
The second transparent electrode is composed of a transparent conductive film layer laminated on the second raised portion in the input receiving area,
The first routing wiring is composed of a laminate of a transparent conductive film layer and a metal thin film layer formed of a material different from the transparent conductive film layer, which is stacked on the first raised portion in the peripheral region. ,
The second routing wiring is composed of a laminate of a transparent conductive film layer and a metal thin film layer formed of a material different from the transparent conductive film layer, which is laminated on the second raised portion in the peripheral region. Touch input sensor.

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