JPWO2014132623A1 - Touch panel and touch panel manufacturing method - Google Patents

Abstract

Provided are a touch panel and a touch panel manufacturing method that are less likely to cause alignment misalignment during wiring. The touch panel has a conductive layer having transparency and a wiring for extracting a signal from the conductive layer on at least one surface of the transparent base material, and includes a protective layer for protecting the conductive layer on the transparent base material. In addition, the wiring, the conductive layer, and the protective layer are stacked in this order, and the conductive layer is patterned after the conductive layer material is stacked on the wiring.

Description

  The present invention relates to a touch panel having a pattern of a transparent conductive layer.

  2. Description of the Related Art In recent years, input devices called touch panels have emerged for reasons such as the operations that users are performing and the operations to be performed next are intuitive and easy to understand. In the touch panel, a transparent electrode is provided on a liquid crystal screen, and when a user touches a corresponding portion of the liquid crystal screen, a touch is detected by reading a change in voltage of the transparent electrode.

  Touch panels are classified into optical, resistive, capacitive, ultrasonic, electromagnetic induction, etc., depending on the sensing method. Especially for smartphones and tablet PCs for end users, an electrostatic capacity method capable of multi-touch is increasing. As a configuration example of a display device equipped with a capacitive touch panel, a display panel such as an LCD, and a display device having a shield layer for preventing noise from the LCD display panel on the observation side, A touch panel is installed on the observation side, and a cover glass or the like that is touched by a finger is mounted on the front surface of the touch panel via an adhesive layer or the like. The principle of operation of the capacitive touch panel is that when a finger touches the outermost surface layer, the change in the capacitance of the electrode in the touch panel is detected, the magnitude of the change, the place where the change has occurred, It operates by making data on the contact state of the finger and the movement of the finger.

  The capacitive touch panel requires electrodes in two directions, the X direction and the Y direction perpendicular to it, and detects the change in capacitance when the finger touches, and detects the coordinates of the position where the finger touches By doing so, the touch position and touch operation are recognized. The X electrode layer and the Y electrode layer are not in contact with each other and are stacked via an insulating film. Transparent conductive materials are mainly used for the X electrode and the Y electrode. Each electrode is formed as an electrode layer by depositing and patterning a conductive material on a substrate. The patterning shape of the electrode includes a linear shape and a diamond shape. The X-direction pattern and the Y-direction pattern are characterized in that there are fewer overlapping portions when viewed from the front in the stacking direction.

  As a conductive material used for the touch panel, ITO (indium tin oxide) has been mainly used. The reason is that both high conductivity and high transparency as the conductive layer (conductive film) can be achieved, and it is suitable for use as an electrode installed on a liquid crystal panel. However, since indium is a rare metal and may be difficult to obtain in the future, and since a vacuum process is required for film formation, it is not suitable for mass production. Therefore, development of a conductive material that replaces ITO is underway. Representative examples include carbon nanotubes and silver nanowires. Electrodes uniformly coated with carbon nanotubes and silver nanowires are conductive and transparent, and some have surpassed ITO base materials, and do not require a vacuum process for film formation. Expected to be a conductive material.

  On the other hand, the conductive surface formed by these conductive materials is weak against high humidity heat or the like as compared with the ITO base material, and the single substance may lose conductivity. Therefore, there are cases where a protective layer is provided on the conductive surface for operation. Although the durability as a conductive base material is improved by the protective layer, patterning for a capacitive touch panel becomes difficult and there is a concern that a touch panel operation may be defective.

Furthermore, in the case of a size of 5 inches or less such as a smartphone, it is strongly required to narrow a wiring storage area called a frame because a user-operable area is desired to be widened on the screen, and wiring for extracting a signal from a transparent electrode It is necessary to suppress the contact area of the transparent electrode to about 0.5 mm ² . In addition, as a result of the progress of miniaturization and weight reduction, there is an increasing demand for thinning the base material used for the touch panel.

  However, when patterning is performed in the manufacturing process of such a small touch panel, the film expands and contracts in the patterning process and the winding process, and the alignment is shifted in the X direction and the Y direction. This phenomenon becomes more prominent as the substrate becomes thinner, and there is a concern that the position of subsequent wiring printing may not match at all depending on the winding tension and the thermal history of the process.

  On the other hand, the problem can be solved to some extent by taking measures such as allowing the precision in the subsequent process in consideration of the expansion and contraction of the film in the patterning process. However, this margin becomes smaller as the required size of the touch panel becomes smaller.

Japanese Patent No. 4888608

  In Patent Document 1, a wiring is provided on a substrate and a conductive layer is further provided thereon. However, it is required to further improve the reliability of the touch panel. Furthermore, it is required to improve the reliability during patterning.

  This invention is made | formed in view of the said problem, and it is providing the touch panel manufactured by the manufacturing method of the touch panel which does not have the worry of alignment gap at the time of wiring, and its manufacturing method.

  One aspect of the present invention for solving the above problems is a touch panel having a transparent conductive layer and a wiring for extracting a signal from the conductive layer on at least one surface of the transparent substrate, A protective layer for protecting the layer is provided, and a wiring, a conductive layer, and a protective layer are laminated in this order on a transparent substrate, and the conductive layer is patterned after laminating the material of the conductive layer on the wiring. It is a touch panel.

  Another aspect of the present invention is a touch panel having a transparent conductive layer and a wiring for extracting a signal from the conductive layer on at least one surface of the transparent base material, in order to protect the conductive layer. The conductive layer is a touch panel in which a conductive layer, a wiring, and a protective layer are laminated in this order on a transparent substrate, and the conductive layer is patterned after the wiring is laminated.

  The protective layer may be patterned, and the conductive layer may be patterned in a state where it is covered with the protective layer pattern.

  The protective layer may be patterned, and the conductive layer may be patterned in a state where it is covered with the protective layer pattern.

  The thickness of the transparent substrate may be 25 μm to 250 μm.

  Further, the thickness of the wiring may be 3 μm to 10 μm.

  Further, the wiring width and the wiring interval may be 5 μm to 100 μm, respectively.

  Further, a layer having a light transmittance of less than 1% at a wavelength of 365 nm may be further added to at least one surface of the transparent substrate.

  The protective layer may cover the entire conductive layer.

  Still another aspect of the present invention provides a conductive layer having transparency and a wiring for extracting a signal from the conductive layer on at least one surface of the transparent base material, and for protecting the conductive layer. A method for manufacturing a touch panel having a protective layer on at least one surface, wherein a wiring and a conductive layer are laminated in this order on a transparent substrate, and after the protective layer is laminated on the conductive layer, the conductive layer is etched. Is a manufacturing method of a touch panel.

  In addition, a step of etching the conductive layer after laminating the protective layer on the conductive layer in a pattern may be included.

  Still another aspect of the present invention provides a conductive layer having transparency and a wiring for extracting a signal from the conductive layer on at least one surface of the transparent base material, and for protecting the conductive layer. A method for manufacturing a touch panel having a protective layer on at least one surface, the step of laminating a conductive layer and a wiring in this order on a transparent substrate, and laminating the protective layer on the conductive layer, and then etching the conductive layer Is a method for manufacturing a touch panel.

  In addition, a step of etching the conductive layer after laminating the protective layer on the conductive layer in a pattern may be included.

  Still another aspect of the present invention provides a conductive layer having transparency and a wiring for extracting a signal from the conductive layer on at least one surface of the transparent base material, and for protecting the conductive layer. A method for manufacturing a touch panel having a protective layer on at least one surface, wherein a wiring and a conductive layer are laminated in this order on a transparent substrate, and after etching the conductive layer, the protective layer is laminated on the conductive layer. It is a manufacturing method of a touch panel including a process.

  Still another aspect of the present invention provides a conductive layer having transparency and a wiring for extracting a signal from the conductive layer on at least one surface of the transparent base material, and for protecting the conductive layer. A method for manufacturing a touch panel having a protective layer on at least one surface, the step of laminating a conductive layer and a wiring in this order on a transparent substrate, etching the conductive layer, and then laminating the protective layer on the conductive layer Is a method for manufacturing a touch panel.

  In the present invention, the wiring is first laminated on the substrate, and then the transparent conductive layer and the protective layer are laminated on the wiring in this order, or the wiring is laminated on the transparent conductive layer laminated on the substrate. Thus, by further adding a protective layer, there is no need to worry about misalignment during wiring printing on both sides, and the conductive surface can be protected by the protective layer.

  In addition, by previously patterning the protective layer to be applied on the conductive layer, residue between patterns can be reduced when the conductive layer is patterned.

  Moreover, size reduction of a touch panel unit can be achieved because the thickness of a transparent base material shall be 25 micrometers-250 micrometers (for example, 25-50 micrometers).

  Moreover, by setting the thickness of the wiring to 3 to 10 μm (for example, 3 to 6 μm), it is possible to prevent disconnection when the film is wound with a roll when the touch panel is made of RtoR. Note that if the thickness is further reduced, there may be a problem with the resistance value of the wiring.

  In particular, when making a small touch panel, it is required to make the wiring as narrow as possible so as to reduce the wiring interval. Therefore, the requirements can be met by setting the wiring width and the wiring interval to 5 μm to 100 μm (for example, 15 to 20 μm).

  In addition, by adding a layer capable of suppressing the transmittance of light having a wavelength of 365 nm to less than 1% on at least one surface of the transparent substrate, both sides are exposed simultaneously, particularly when patterning is performed by photolithography. However, the resist can be cured without causing exposure interference with each other. Accordingly, there is no need to worry about alignment shift in the process shortening and the patterning process of the thin film, and the touch panel can be configured with a single film, so that further thinning can be expected.

  Furthermore, by patterning the conductive layer before applying the protective layer, residues between patterns can be reduced when the conductive layer is patterned.

FIG. 1 is a cross-sectional view illustrating a configuration of a display device with a touch panel according to an embodiment. FIG. 2 is a pattern of the transparent conductive layer of the touch panel according to the embodiment. FIG. 3 is a pattern of the transparent conductive layer of the touch panel according to the embodiment. FIG. 4 is a cross-sectional view illustrating a configuration of the touch panel according to the embodiment. FIG. 5 is a cross-sectional view illustrating a configuration of the touch panel according to the embodiment. FIG. 6 is a cross-sectional view illustrating the configuration of the touch panel according to the embodiment. FIG. 7 is a cross-sectional view illustrating a configuration of the touch panel according to the embodiment. FIG. 8 is a schematic diagram illustrating a manufacturing process of the touch panel according to the embodiment. FIG. 9 is a schematic diagram illustrating a manufacturing process of the touch panel according to the embodiment. FIG. 10 is a schematic diagram illustrating a manufacturing process of the touch panel according to the embodiment. FIG. 11 is a schematic view illustrating a manufacturing process of the touch panel according to the embodiment. FIG. 12 is a schematic diagram illustrating a manufacturing process of the touch panel according to the embodiment. FIG. 13 is a cross-sectional view illustrating the configuration of the touch panel according to the embodiment. FIG. 14 is a cross-sectional view illustrating a configuration of the touch panel according to the embodiment.

  Hereinafter, embodiments of the present invention will be described in detail.

  FIG. 1 is a cross-sectional view illustrating a configuration of a display device with a touch panel. The display device shown in FIG. 1 includes an LCD display panel 30, a touch panel 10 configured on the observation side (front side) of the LCD display panel 30, and an adhesive layer 50 on the observation side surface (front side) of the touch panel 10. And a shield layer 20 interposed between the LCD display panel 30 and the touch panel 10. As shown in FIG. 1, the shield layer 20 may be separated from the touch panel 10 or may be bonded to the touch panel 10 via an adhesive or the like. Further, the shield layer 20 may be included in the touch panel 10.

FIG. 2 is an enlarged view of the touch panel 10 shown in FIG. 1 as viewed from one side.
In the present embodiment, the touch panel 10 is manufactured using a plastic film (transparent substrate) having a transparent conductive layer 13 (conductive layer) laminated on one side or both sides thereof. The plastic film is not particularly limited as long as it has sufficient strength in the film-forming process and the post-process and has a smooth surface. For example, polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, polycarbonate film, polyether A sulfone film, a polysulfone film, a polyacrylate film, a polyimide film, or the like can be used. These base materials may contain additives such as an antioxidant, an antistatic agent, an anti-ultraviolet agent, a plasticizer, a lubricant, an easy-adhesive agent, and a corona treatment to improve adhesion. Low temperature plasma treatment may be performed.

  Although not shown, a UV resin layer may be provided on the plastic film. The UV resin layer is used for scratch resistance and optical adjustment of a plastic film. The material of the UV resin layer is not particularly limited as long as it has transparency and appropriate hardness and strength. Desirably, a plastic film having a refractive index equivalent or close to that of the plastic film is selected. Further, as the resin layer, not only a UV curable resin but also a thermosetting resin or the like can be used.

  Although not shown, an optical functional layer may be provided on the plastic film. The optical functional layer is intended to improve b * and transmittance by adjusting the refractive index and the like according to the material of the transparent conductive material.

  Examples of the inorganic compound used for the optical functional layer include oxides, sulfides, fluorides, and nitrides. Specifically, magnesium oxide, silicon dioxide, magnesium fluoride, aluminum fluoride, titanium oxide, zirconium oxide, zinc sulfide, tantalum oxide, zinc oxide, indium oxide, niobium oxide, tantalum oxide, or the like can be used. Since these inorganic compounds have different refractive indexes depending on the material and film thickness, it is possible to adjust the optical characteristics by forming a material according to the purpose with a specific film thickness. The optical function layer is not limited to only one layer, and may be a plurality of layers or may be omitted.

  The material of the transparent conductive layer 13 (transparent conductive material) includes any of indium oxide, zinc oxide, tin oxide, mixed oxides thereof, and other additives, carbon nanotubes, and silver nanowires. It can be selected according to the required sheet resistance value and optical characteristics, such as a nano-based material, and is not particularly limited.

  As a method of laminating the transparent conductive layer 13 on a plastic film, a spin coating method, a roller coating method, a bar coating method, a dip coating method, a gravure coating method, a curtain coating method, a die coating method, a spray coating method, a doctor coating method, a kneader Application methods such as coating methods, screen printing methods, spray printing methods, ink jet printing methods, letterpress printing methods, intaglio printing methods, printing methods such as intaglio printing methods, coating methods, etc., or vacuum deposition methods such as sputtering methods, etc. It can be used and may be used properly according to the transparent conductive material to be used.

  The LCD display panel 30 includes a substrate (array substrate) on which switching elements for driving liquid crystals are arranged and electrode layers are provided, and a color filter substrate on which opposed electrode layers are formed, with the liquid crystal layer interposed therebetween. An extremely general LCD display panel in which polarizing plates are attached to the array substrate and the color filter substrate, respectively, can be used. The driving method of the LCD display panel 30 is not particularly limited, and an IPS, TN, VA, etc. LCD display can be used.

  In the touch panel 10, a transparent conductive layer 13a patterned in, for example, a diamond shape is formed on one surface, and a transparent conductive layer 13b similarly patterned in a diamond shape is formed on the other surface. The layer 13a and the transparent conductive layer 13b on the other side are arranged so that the rhombus portions do not overlap each other. An enlarged view of the touch panel showing this arrangement state is shown in FIG. In the patterning of the transparent conductive layer 13 (patterning for forming a diamond-like pattern), for example, steps of resist coating, exposure, etching, and resist stripping are performed to form a conductive pattern portion and a non-conductive pattern portion. As a patterning method, any method such as photolithography, screen printing, and laser patterning may be used. Also, the resist is not photosensitive and may be cured by drying. In that case, the exposure process replaces the drying process.

  FIG. 4 shows a configuration diagram of the touch panel 10 according to the present embodiment. In FIG. 4, a wiring 12 for taking out a signal from the transparent conductive layer 13 is laminated on the transparent base material 11, and a transparent conductive layer 13 (conductive layer) is laminated on the wiring 12 to protect the transparent conductive layer 13. Layer 14 is laminated. As a method of laminating the wiring 12, screen printing, gravure offset printing, patterning by photolithography, or the like can be used. When it is desired to reduce the film thickness of the wiring 12, gravure offset printing is preferably used. Subsequent to the lamination of the wiring 12, the lamination of the transparent conductive layer 13 and the patterning of the transparent conductive layer 13 are performed. The patterning method may be any method as long as it is as described above, and the user can select an optimum method. However, the photolithography method is particularly preferably used in terms of pattern miniaturization. In this way, by first printing the wiring 12 and laminating the transparent conductive layer 13 thereon, the conventional method, such as when the wiring is applied after patterning of the transparent electrode, due to shrinkage of the base material, etc. Misalignment between the transparent electrode pattern and the wiring cannot occur. Furthermore, the transparent conductive layer 13 is protected by laminating the protective layer 14 thereon. The protective layer 14 is formed after patterning of the transparent conductive layer 13, for example. In addition, depending on the combination of the material of the protective layer 14 and the transparent conductive layer 13, there are those in which the transparent conductive layer 13 can be etched even when the protective layer 14 is laminated on the transparent conductive layer 13, but the conductive layer 13 and the protective layer 13 Whatever material 14 is, by patterning the transparent conductive layer 13 and then laminating the protective layer 14, etching can be performed in a short time or etching residues can be eliminated.

  Specifically, the protective layer 14 is preferably a photocurable resin such as a monomer or a crosslinkable oligomer having a trifunctional or higher functional acrylate that can be expected to be three-dimensionally crosslinked.

  Trifunctional or higher acrylate monomers include trimethylolpropane triacrylate, isocyanuric acid EO-modified triacrylate, pentaerythritol triacrylate, dipentaerythritol triacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate Ditrimethylolpropane tetraacrylate, pentaerythritol tetraacrylate, polyester acrylate and the like are preferable. Particularly preferred are isocyanuric acid EO-modified triacrylates and polyester acrylates. These may be used alone or in combination of two or more. In addition to these tri- or higher functional acrylates, so-called acrylic resins such as epoxy acrylate, urethane acrylate and polyol acrylate can be used in combination.

  As the crosslinkable oligomer, acrylic oligomers such as polyester (meth) acrylate, polyether (meth) acrylate, polyurethane (meth) acrylate, epoxy (meth) acrylate, and silicone (meth) acrylate are preferable. Specific examples include polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, bisphenol A type epoxy acrylate, polyurethane diacrylate, cresol novolac type epoxy (meth) acrylate, and the like.

  The protective layer 14 may contain additives such as a photopolymerization initiator. When a photopolymerization initiator is added, radical generating photopolymerization initiators include benzoin and its alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzyl methyl ketal, acetophenone, 2, 2 , -Dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, and other acetophenones, methylanthraquinone, 2-ethylanthraquinone, 2-amylanthraquinone and other anthraquinones, thioxanthone, 2,4-diethylthioxanthone, 2, 4 -Thioxanthones such as diisopropylthioxanthone, ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal, benzophenone, 4,4-bismeth Le benzophenones such aminobenzophenone and azo compounds, and the like. These can be used alone or as a mixture of two or more thereof, and further, tertiary amines such as triethanolamine and methyldiethanolamine, benzoic acid derivatives such as 2-dimethylaminoethylbenzoic acid and ethyl 4-dimethylaminobenzoate, etc. It can be used in combination with a photoinitiator aid or the like.

  The addition amount of the photopolymerization initiator is 0.1% by weight or more and 10% by weight or less, and preferably 0.5% by weight or more and 5% by weight or less with respect to the main component resin. Less than the lower limit is not preferable because the cured film layer is insufficiently cured. Moreover, when exceeding an upper limit, since yellowing of a cured film layer will be produced or a weather resistance will fall, it is unpreferable. The light used for curing the photocurable resin is ultraviolet rays, electron beams, or gamma rays, and in the case of electron beams or gamma rays, it is not always necessary to contain a photopolymerization initiator or a photoinitiating aid. As these radiation sources, high-pressure mercury lamps, xenon lamps, metal halide lamps, accelerated electrons, and the like can be used.

  FIG. 5 shows another configuration diagram of the touch panel 10 according to the present embodiment. Unlike FIG. 4, the transparent conductive layer 13 is laminated on the transparent substrate 11, and the wiring 12 is laminated thereon. After the wiring 12 is laminated, the transparent conductive layer 13 is patterned. Also in this case, since the transparent conductive layer 13 is patterned after the wiring 12 is attached, the alignment deviation between the transparent electrode and the wiring 12 does not occur. Moreover, the etching residue of the to-be-etched part can be eliminated by attaching the protective layer 14 after patterning the conductive layer 13. Note that the patterning method and the method of laminating the wiring 12 can be the same as those in FIG.

  In any of the examples shown in FIGS. 4 and 5 and FIG. 14 described later, the thickness of the transparent substrate 11 is preferably 25 μm to 250 μm. The thickness of the wiring 12 is preferably 3 μm to 10 μm. Moreover, it is preferable that the width | variety of the wiring 12 and the space | interval of the wiring 12 shall be 5 micrometers-100 micrometers respectively. More preferably, the thickness of the transparent substrate 11 is 25 μm to 50 μm. The wiring 12 has a thickness of 3 μm to 5 μm. Further, the width of the wiring 12 and the interval between the wirings 12 are 15 μm to 20 μm, respectively.

  FIG. 8 shows a state in which the wiring 12 and the transparent conductive layer 13 are laminated when the touch panel 10 of FIG. 4 is viewed from directly above the transparent substrate 11 (illustration of the protective layer 14 is omitted). FIG. 9 shows a state in which the wiring 12 and the transparent conductive layer 13 are laminated when the touch panel 10 of FIG. 5 is viewed from directly above the transparent base material 11 (illustration of the protective layer 14 is omitted). The wiring 12 is not laminated on the patterned transparent conductive layer 13, but the transparent conductive layer 13 is laminated (solid) on a flat film, and the wiring 12 is pre-patterned. is there.

  Specifically, the touch panel manufacturing method in the case of FIG. 8 includes a wiring laminating step of laminating the wiring 12 on the transparent substrate 11, a conductive layer laminating step of laminating the transparent conductive layer 13 after the wiring laminating step, and a transparent conductive layer. A pattern forming step of patterning 13. In FIG. 8, after the patterned wiring 12 is laminated, the transparent conductive layer 13 is laminated with a solid coating. In addition, a pattern formation process is performed after the protective layer lamination process of pattern-printing the pattern of the protective layer 14, for example.

  The touch panel manufacturing method in the case of FIG. 9 includes a conductive layer laminating step of laminating the transparent conductive layer 13 on the transparent substrate 11, a wiring laminating step of laminating the wiring 12 after the conductive layer laminating step, and patterning the transparent conductive layer 13. Including a pattern forming step. In FIG. 9, after the transparent conductive layer 13 is laminated with a solid coating, the patterned wiring 12 is laminated. In addition, a pattern formation process is performed after the protective layer lamination process of pattern-printing the pattern of the protective layer 14, for example.

  The protective layer 14 can be used as a resist for patterning the transparent conductive layer 13 by selecting a material. For example, when the transparent conductive layer 13 is desired to be patterned by wet etching, the protective layer 14 is formed on the transparent conductive layer 13 in a pattern shape to be etched using a UV resin layer that is not affected by the etchant used as the material of the protective layer 14. Then, a desired pattern can be obtained as a pattern of the transparent conductive layer 13 only by etching the transparent conductive layer 13. As shown in FIG. 10, the wiring 12 and the transparent conductive layer 13 may be provided in this order on the transparent base 11 in this order, or the transparent conductive layer 13 and the wiring 12 may be provided on the transparent base 11. You may implement after attaching in this order. By carrying out like this, the electrically conductive film residue at the time of patterning can be eliminated. Further, the protective layer 14 can be further uniformly formed on the patterned protective layer 14 as necessary.

  In FIG. 14, the block diagram of the touch panel 10 which concerns on this embodiment manufactured with the manufacturing method of the touch panel in the case of FIG. 10 is shown. In the example shown in FIG. 14, a wiring 12 for taking out a signal from the transparent conductive layer 13 is laminated on the transparent substrate 11, and a patterned transparent conductive layer 13 is laminated thereon, and the transparent conductive layer 13 is formed on the transparent conductive layer 13. The patterned protective layer 14 is laminated. That is, the transparent conductive layer 13 has a pattern formed by patterning while being covered with the pattern of the protective layer 14. In addition, unlike FIG. 14, the transparent conductive layer 13 patterned on the transparent base material 11 may be laminated | stacked, and the wiring 12 may be laminated | stacked on it. Further, the patterned protective layer 14 is disposed only on the surface of the patterned transparent conductive layer 13, but may be laminated not only on the surface of the patterned transparent conductive layer 13 but also on the surface of the wiring 12. .

  11 and 12 are diagrams showing a state in which the wiring 12, the transparent conductive layer 13, and the protective layer 14 are stacked when each of FIGS. 6 and 7 is viewed from directly above. The wiring 12 is not laminated on the patterned transparent conductive layer 13, but the transparent conductive layer 13 is laminated with a solid coating, and the wiring 12 is pre-patterned.

  Specifically, the touch panel manufacturing method in the case of FIG. 11 includes a wiring laminating process for laminating the wiring 12 on the transparent substrate 11, a conductive layer laminating process for laminating the transparent conductive layer 13 after the wiring laminating process, and a transparent conductive layer. A pattern forming step of patterning 13. In FIG. 11, after the patterned wirings 12 are laminated, the transparent conductive layer 13 is laminated with a solid coating. Thereafter, the protective layer 14 is laminated through a pattern forming step of the transparent conductive layer 13. The protective layer 14 may cover the entire transparent conductive layer 13.

  The touch panel manufacturing method in the case of FIG. 12 includes a conductive layer laminating step of laminating the transparent conductive layer 13 on the transparent substrate 11, a wiring laminating step of laminating the wiring 12 after the conductive layer laminating step, and patterning the transparent conductive layer 13. Including a pattern forming step. In FIG. 12, after the transparent conductive layer 13 is laminated with a solid coating, the patterned wiring 12 is laminated. Thereafter, the protective layer 14 is laminated through a pattern forming step of the transparent conductive layer 13. The protective layer 14 may cover the entire transparent conductive layer 13.

  It is preferable to provide the layer 15 on the transparent substrate 11 so that the transmittance of light having a wavelength of 365 nm is less than 1%. In FIG. 13, the figure when such a layer 15 is added on the transparent base material 11 is shown. FIG. 13 shows a touch panel in which a UV absorbing layer 15 is laminated and cured on the surface of the transparent substrate 11. In FIG. 13, the UV absorption layer 15 is directly laminated on the transparent substrate 11, and the wiring 12 and the transparent conductive layer 13 are formed on the UV absorption layer 15. When patterning the transparent conductive layer 13 laminated on the transparent substrate 11, a photolithography method can be suitably used. The light emitted from the UV light source 17 is shielded by the photomask 16, cures a photoresist layer (not shown) provided on the transparent conductive layer 13, and partially transmits the light. However, the light irradiated from the UV light source 17 cannot pass through to the back side of the transparent substrate 11 because the UV absorption layer 15 exists, and does not interfere with the photoresist on the back side. The same applies to light irradiated from the back surface. That is, if separate photomasks are installed on the front and back of the transparent substrate 11, a pattern necessary for the touch panel can be simultaneously formed on each surface. For this reason, shortening of a process and damage to the transparent base material 11 can be reduced. The UV absorption layer 15 may be provided only on one side of the transparent substrate 11 or may be provided on both sides. Furthermore, this layer 15 may be configured by mixing, for example, a UV absorber with the above-described UV resin layer. As the UV absorber, for example, ULS-935LH manufactured by Otsuka Oil Co., Ltd. may be used.

  Examples of the present invention are shown below. However, the technical scope of the present invention is not limited to these examples. The present invention can be implemented by appropriately combining or omitting the features of the embodiments.

Example 1
A PET substrate (hereinafter referred to as “substrate”) having a thickness of 50 μm was prepared as a transparent substrate with a roll, and a UV curable resin was applied and cured on both surfaces of the substrate with a die coater to form a resin layer. This resin layer is mixed with a UV-absorbing resin having a transmittance of light having a wavelength of 365 nm of 0.7%. Subsequently, silver wiring with a thickness of 3 μm was printed on both surfaces of the substrate by gravure offset printing. Next, a coating liquid (coating liquid for transparent conductive layer) in which silver nanowires were dispersed was applied from above and cured by a die coater. Further, a negative laminating film resist was applied to both sides of the substrate by a roll laminator, and development was performed after exposure and curing from above the photomask. And after image development, after etching with cupric chloride aqueous solution, the resist was peeled off with sodium hydroxide aqueous solution, and the diamond pattern as shown in FIG. 2 was formed in both surfaces of the base material. Then, the protective layer which protects a transparent conductive layer was attached by screen printing, and it was set as the pattern for touchscreens. The film was cut, and an FPC terminal was attached to the wiring to form a touch panel, and normal operation was confirmed.

(Example 2)
A PET substrate (hereinafter referred to as “substrate”) having a thickness of 50 μm was prepared as a transparent substrate with a roll, and a UV curable resin was applied and cured on both surfaces of the substrate with a die coater to form a resin layer. Next, a silver wiring having a thickness of 3 μm was printed on one side of the substrate by gravure offset printing. Next, a coating liquid (coating liquid for transparent conductive layer) in which silver nanowires were dispersed was applied from above and cured by a die coater. Further, a negative laminating film resist was applied to one side of the base material by a roll laminator, and after exposure and curing from above the photomask, development was performed. Then, after development, after etching with cupric chloride aqueous solution, the resist was peeled off with sodium hydroxide aqueous solution to form a diamond pattern as shown in FIG. Then, the protective layer which protects a transparent conductive layer was attached by screen printing, and it was set as the pattern for touchscreens. In the same procedure, after forming a diamond pattern on the other surface, these films were cut and bonded together. Thereafter, an FPC terminal was attached to the wiring to form a touch panel, and normal operation was confirmed.

(Example 3)
A PET substrate having a thickness of 50 μm was prepared by a roll, and a UV curable resin was applied to both surfaces of the substrate by a die coater and cured. This resin layer is mixed with a UV-absorbing resin such that the transmittance of light having a wavelength of 365 nm is 0.7%. Subsequently, silver wiring with a thickness of 3 μm was printed on both surfaces of the substrate by gravure offset printing. Next, a transparent conductive layer was formed by applying and curing a coating liquid in which silver nanowires were dispersed from above, using a die coater. Next, a protective layer for protecting the transparent conductive layer was laminated as a resist on the transparent conductive layer by screen printing in a pattern. Next, the transparent conductive layer was etched with an aqueous cupric chloride solution, and a diamond pattern (pattern having a shape shown in FIG. 2) in which a protective layer was laminated on the transparent conductive layer was formed on both sides as a touch panel pattern. The film was cut, and an FPC terminal was attached to the wiring to form a touch panel, and normal operation was confirmed.

Example 4
A PET substrate having a thickness of 50 μm was prepared by a roll, and a UV curable resin was applied to both surfaces of the substrate by a die coater and cured. Next, a silver wiring having a thickness of 3 μm was printed on one side of the substrate by gravure offset printing. Next, a transparent conductive layer was formed by applying and curing a coating liquid in which silver nanowires were dispersed from above, using a die coater. Next, a protective layer for protecting the transparent conductive layer was laminated as a resist on the transparent conductive layer by screen printing in a pattern. Next, the transparent conductive layer was etched with a cupric chloride aqueous solution to form a diamond pattern (pattern having a shape shown in FIG. 2) in which a protective layer was laminated on the transparent conductive layer as a touch panel pattern. In the same procedure, after forming a diamond pattern on the other surface of the substrate, these films were cut and bonded, and then FPC terminals were attached to the wirings to make a touch panel, and normal operation was confirmed.

(Example 5)
A PET substrate having a thickness of 50 μm was prepared by a roll, and a UV curable resin was applied to both surfaces of the substrate by a die coater and cured. This resin layer is mixed with a UV-absorbing resin such that the transmittance of light having a wavelength of 365 nm is 0.7%. Subsequently, silver wiring with a thickness of 3 μm was printed on both surfaces of the substrate by gravure offset printing. Next, a transparent conductive layer was formed by applying and curing a coating liquid in which silver nanowires were dispersed from above, using a die coater. Next, after pasting a dry film resist (DFR) on the transparent conductive layers on both sides with a roll laminator, a diamond pattern for a capacitive touch panel (pattern having the shape shown in FIG. 2) was drawn 2 Exposure was performed simultaneously on both sides using a single photomask, the dry film resist was cured in a touch panel pattern, and a resist pattern was formed in the touch panel pattern by developing a sodium carbonate aqueous solution as a developer. Next, the transparent conductive layer was etched with an aqueous cupric chloride solution, and the resist was removed to form the transparent conductive layer in a touch panel pattern. Then, the protective layer was laminated on the pattern by printing it on the entire touch panel pattern by screen printing and drying it. The film was cut, and an FPC terminal was attached to the wiring to form a touch panel, and normal operation was confirmed.

(Example 6)
A PET substrate having a thickness of 50 μm was prepared by a roll, and a UV curable resin was applied to both surfaces of the substrate by a die coater and cured. Subsequently, this roll base material was divided | segmented and the silver wiring of 3 micrometers thickness was printed by the gravure offset printing on the single side | surface of one roll. Next, a transparent conductive layer was formed by applying and curing a coating liquid in which silver nanowires were dispersed from above, using a die coater. Next, after pasting a dry film resist (DFR) on the transparent conductive layer with a roll laminator, a photomask on which a diamond pattern for an electrostatic capacitance touch panel (the X pattern having the shape shown in FIG. 2) is drawn. Exposure was performed, the dry film resist was cured in a touch panel pattern, and a resist pattern was formed in the touch panel pattern by developing a sodium carbonate aqueous solution as a developer. Next, the transparent conductive layer was etched with an aqueous cupric chloride solution, and the resist was peeled off to form a transparent conductive layer in the diamond X pattern for the touch panel. After that, the protective layer was laminated on the entire X pattern by printing on the entire pattern by screen printing and drying. In the same procedure, a silver wiring and a transparent conductive layer were laminated on one side of the other roll. After forming the transparent conductive layer in a diamond Y pattern, a protective layer was laminated by screen printing. After these films were cut and pasted together, FPC terminals were attached to the wirings to form a touch panel, and normal operation was confirmed.

(Comparative example)
A PET substrate having a thickness of 50 μm was prepared by a roll, and a UV curable resin was applied to both surfaces of the substrate by a die coater and cured. Subsequently, the transparent conductive layer was formed by apply | coating and hardening the coating liquid which disperse | distributed silver nanowire on the single side | surface of this base material with a die coater. Furthermore, using a roll laminator, a negative dry film resist is laminated, exposed and cured from above the photomask, developed, etched with an aqueous cupric chloride solution, and then the resist is removed with an aqueous sodium hydroxide solution As a result, a diamond pattern (pattern having the shape shown in FIG. 2) was formed. In the same procedure, a diamond pattern was formed on the other side of the substrate. After that, when wiring printing was performed by gravure offset printing, the substrate was deformed due to the influence of heat between processes, and wiring printing could not be performed normally.

  From the above, the effectiveness of the present invention was confirmed.

  The present invention is useful for a touch panel having a pattern of a transparent conductive layer.

10 Touch Panel 11 Transparent Base Material 12 Wiring 13 Transparent Conductive Layer (Conductive Layer)
DESCRIPTION OF SYMBOLS 14 Protective layer 15 UV absorption layer 16 Photomask 17 UV light source 20 Shield layer 30 LCD display panel 40 Front panel layer 50 Adhesive layer

Claims (15)

A touch panel having a conductive layer having transparency and wiring for taking out a signal from the conductive layer on at least one surface of the transparent substrate,
A protective layer for protecting the conductive layer;
On the transparent substrate, the wiring, the conductive layer, and the protective layer are laminated in this order,
The said conductive layer is a touch panel formed by laminating | stacking the material of the said conductive layer on the said wiring. A touch panel having a conductive layer having transparency and wiring for taking out a signal from the conductive layer on at least one surface of the transparent substrate,
A protective layer for protecting the conductive layer;
On the transparent substrate, the conductive layer, the wiring, and the protective layer are laminated in this order,
The touch panel, wherein the conductive layer is patterned after the wiring is stacked. The protective layer is patterned,
The touch panel according to claim 1, wherein the conductive layer is patterned by being covered with the pattern of the protective layer. The protective layer is patterned,
The touch panel according to claim 2, wherein the conductive layer is patterned by being covered with the pattern of the protective layer.   The touch panel as described in any one of Claims 1 thru | or 4 whose thickness of the said transparent base material is 25 micrometers-250 micrometers.   The touch panel according to claim 1, wherein the wiring has a thickness of 3 μm to 10 μm.   The touch panel according to claim 1, wherein a width of the wiring and a distance between the wirings are 5 μm to 100 μm, respectively.   The touch panel as described in any one of Claims 1 thru | or 7 which further adds the layer whose transmittance | permeability of the light of wavelength 365nm is less than 1% to the at least one surface of the said transparent base material.   The touch panel according to claim 1, wherein the protective layer covers the entire conductive layer. A transparent conductive layer and a wiring for extracting a signal from the conductive layer are provided on at least one surface of the transparent substrate, and a protective layer for protecting the conductive layer is provided on at least one surface. A touch panel manufacturing method,
A method of manufacturing a touch panel, comprising: laminating the wiring and the conductive layer in this order on the transparent substrate, and etching the conductive layer after laminating the protective layer on the conductive layer.   The touch panel manufacturing method according to claim 10, further comprising: etching the conductive layer after laminating the protective layer on the conductive layer in a pattern. A transparent conductive layer and a wiring for extracting a signal from the conductive layer are provided on at least one surface of the transparent substrate, and a protective layer for protecting the conductive layer is provided on at least one surface. A touch panel manufacturing method,
The manufacturing method of a touch panel including the process of laminating | stacking the said conductive layer and the said wiring on the said transparent base material in this order, laminating | stacking the said protective layer on the said conductive layer, and etching the said conductive layer. The manufacturing method of the touch panel of Claim 12 including the process of etching the said conductive layer, after laminating | stacking the said protective layer on the said conductive layer in pattern shape. A transparent conductive layer and a wiring for extracting a signal from the conductive layer are provided on at least one surface of the transparent substrate, and a protective layer for protecting the conductive layer is provided on at least one surface. A touch panel manufacturing method,
A method for manufacturing a touch panel, comprising: laminating the wiring and the conductive layer in this order on the transparent substrate, etching the conductive layer, and then laminating the protective layer on the conductive layer. A transparent conductive layer and a wiring for extracting a signal from the conductive layer are provided on at least one surface of the transparent substrate, and a protective layer for protecting the conductive layer is provided on at least one surface. A touch panel manufacturing method,
The manufacturing method of a touch panel including the process of laminating | stacking the said conductive layer and the said wiring on the said transparent base material in this order, etching the said conductive layer, and laminating | stacking the said protective layer on the said conductive layer.

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