JP2015078901A5 - - Google Patents
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- Publication number
- JP2015078901A5 JP2015078901A5 JP2013216044A JP2013216044A JP2015078901A5 JP 2015078901 A5 JP2015078901 A5 JP 2015078901A5 JP 2013216044 A JP2013216044 A JP 2013216044A JP 2013216044 A JP2013216044 A JP 2013216044A JP 2015078901 A5 JP2015078901 A5 JP 2015078901A5
- Authority
- JP
- Japan
- Prior art keywords
- accommodation chamber
- holders
- sensor
- sensor units
- assembled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004308 accommodation Effects 0.000 description 4
- 230000001070 adhesive Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N precursor Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013216044A JP6279284B2 (ja) | 2013-10-17 | 2013-10-17 | 温度センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013216044A JP6279284B2 (ja) | 2013-10-17 | 2013-10-17 | 温度センサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015078901A JP2015078901A (ja) | 2015-04-23 |
| JP2015078901A5 true JP2015078901A5 (fi) | 2016-11-17 |
| JP6279284B2 JP6279284B2 (ja) | 2018-02-14 |
Family
ID=53010434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013216044A Active JP6279284B2 (ja) | 2013-10-17 | 2013-10-17 | 温度センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6279284B2 (fi) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019002892A (ja) * | 2017-06-20 | 2019-01-10 | 矢崎総業株式会社 | 温度センサ |
| JP6778844B2 (ja) * | 2018-06-15 | 2020-11-04 | 株式会社芝浦電子 | 温度センサおよび調理器具 |
| JP6785925B2 (ja) * | 2019-02-15 | 2020-11-18 | 株式会社芝浦電子 | 温度センサおよび温度センサの製造方法 |
| CN111578982B (zh) * | 2019-02-15 | 2022-02-22 | 株式会社芝浦电子 | 温度传感器及温度传感器的制造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06307943A (ja) * | 1993-04-20 | 1994-11-04 | Nippondenso Co Ltd | サーミスタ式温度センサ |
| JP5260236B2 (ja) * | 2008-03-19 | 2013-08-14 | 日本特殊陶業株式会社 | 温度センサおよびその製造方法 |
| JP5437304B2 (ja) * | 2010-04-28 | 2014-03-12 | 株式会社デンソー | 温度センサ素子及びその製造方法、温度センサ |
| JP5523982B2 (ja) * | 2010-08-16 | 2014-06-18 | 株式会社芝浦電子 | 温度センサ |
| JP5872582B2 (ja) * | 2011-11-16 | 2016-03-01 | 株式会社芝浦電子 | 温度センサおよび機器 |
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2013
- 2013-10-17 JP JP2013216044A patent/JP6279284B2/ja active Active