JP2015069440A - Touch panel sensor and touch panel module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a touch panel sensor having a low resistance, excellent in quality stability and adhesion, and having a wiring layer easily formed.SOLUTION: A touch panel sensor includes: a foundation layer; a wiring layer which is formed on the foundation layer and includes at least a copper wiring layer in which a CuMn layer and a pure-copper layer are laminated sequentially; and a CuNi layer which is formed on the copper wiring layer.

Description

  The present invention relates to a touch panel sensor having copper wiring.

  Today, touch panels are widely used as input means. In many cases, the touch panel is used together with the display device as an input means for various devices in which a display device such as a liquid crystal display or a plasma display is incorporated, for example, a ticket vending machine, an ATM device, a mobile phone, or a game machine. . In such a device, the touch panel is placed on the display surface of the display device, which allows the touch panel to make a very direct input to the display device.

  Various types of touch panels have been put into practical use. Among these, what is called a capacitance method is, for example, as described in Patent Documents 1 to 5, to a touch panel sensor having a layer structure of a first electrode, an interelectrode insulating layer and a second electrode, and an electrode. In order to supply power and output detection signals, those having a flexible printed wiring board connected to an external connection terminal of the touch panel sensor are used. Then, a weak current is passed through the touch panel surface of the touch panel to form an electric field, and the change in capacitance value when a finger or other conductor is lightly touched is converted into a voltage drop or the like and detected. The obtained contact position is output as a signal.

  As a material constituting a wiring layer such as a sensor electrode or a lead-out wiring layer used for a touch panel sensor, a copper material having a low electrical resistance has been attracting attention because of demand for an increase in panel size and sensitivity.

  However, since the surface of the wiring layer using a copper material is likely to be oxidized, it is necessary to take an anti-oxidation measure. In the touch panel, an overcoat layer is generally formed so as to cover the wiring layer, but it is difficult to sufficiently prevent oxidation of the wiring layer in the overcoat layer. In other words, in order to satisfy touch panel-specific functions such as the ability to detect changes in capacitance when touching the surface of the touch panel and the visibility of information displayed on the display device, the material selectivity and thickness adjustment of the overcoat layer can be adjusted. The degree of freedom is low. Therefore, even when an overcoat layer is formed so as to cover the wiring layer, it may be difficult to sufficiently prevent the wiring layer from being oxidized by oxygen, moisture, etc. from outside, and the quality stability is low. There's a problem.

  Furthermore, the wiring layer using a copper material has a problem that sufficient adhesion to a glass substrate or the like cannot be ensured. In particular, in recent years, miniaturization of wiring has progressed in touch panels, and accordingly, demand for wiring adhesion has increased.

  Although it is not a technique related to the wiring layer in the touch panel sensor, for example, Patent Document 6 aims to provide a display device including a Cu alloy film having high adhesion to an insulating layer and low electrical resistivity with respect to TFT wiring. A first layer made of a Cu alloy having a predetermined composition and thickness, and a second layer made of pure Cu or a Cu alloy having a lower electrical resistivity than the first layer. A Cu alloy film having a structure has been proposed.

  Similarly, although it is not a technique related to a wiring layer in a touch panel sensor, for example, Patent Document 7 discloses low resistance, excellent patterning characteristics, and ozone generated during UV ozone treatment or oxygen plasma treatment regarding wiring of an organic EL display. A high Cu metal layer made of Cu metal or Cu alloy having a high Cu content and a low Cu metal layer made of Cu alloy having a low Cu content. A wiring having at least two layers has been proposed. Furthermore, in order to improve heat resistance and increase adhesion to the substrate, a low Cu metal layer made of a Cu alloy with a low Cu content and a high Cu metal layer made of Cu metal or a Cu alloy with a high Cu content And a wiring having three layers of a low Cu metal layer made of a Cu alloy having a low Cu content has been proposed.

JP 2009-64343 A JP-A-9-146680 Japanese Patent No. 2587975 JP 2011-124332 A JP 2011-76514 A JP 2012-27159 A JP 2003-297484 A

  In Patent Document 6, although the adhesion can be improved, there is no mention of an anti-oxidation technique for a wiring layer using a copper material. Moreover, according to the Example of patent document 7, since adhesiveness is acquired irrespective of the presence or absence of the low Cu metal layer which is an adhesive layer, it is estimated that there exists room for improvement in adhesiveness.

  In addition, when the wiring layer has a laminated structure in the touch panel sensor, there is a problem in that etching cannot be performed at the same time as the etching characteristics of each layer are different, and if the etching rate of each layer is greatly different, overetching and residue are caused.

  The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a touch panel sensor having a low resistance, excellent quality stability and adhesion, and having a wiring layer that can be easily formed.

  In order to solve the above-described problems, the present invention provides an underlayer, a wiring layer formed on the underlayer, and including at least a copper wiring layer in which a CuMn layer and a pure copper layer are sequentially laminated, and the copper wiring layer. Provided is a touch panel sensor having a formed CuNi layer. Hereinafter, pure copper may be referred to as P-Cu.

  According to the present invention, when the wiring layer includes a copper wiring layer in which a CuMn layer and a pure copper layer are laminated, resistance can be reduced and adhesion to the base layer can be improved. Further, since the CuNi layer is formed on the copper wiring layer, oxidation of the copper wiring layer can be suppressed and quality stability can be improved. Furthermore, the CuMn layer, the pure copper layer, and the CuNi layer can be simultaneously etched with the same etching solution, and a touch panel sensor having an easily formed wiring layer can be obtained.

  In the above invention, the CuMn layer is made of a CuMn alloy having a Mn content in the range of 0.1 atomic% to 20 atomic%, the thickness is in the range of 10 nm to 200 nm, and the CuNi layer Is made of a CuNi alloy having a Ni content in the range of 25 mass% to 65 mass%, and preferably has a thickness in the range of 10 nm to 150 nm. This is because, when the CuMn layer and the CuNi layer have a predetermined composition and thickness, adhesion with the underlying layer can be improved and excellent oxidation resistance can be obtained.

  The present invention also provides a touch panel having a base layer, a wiring layer formed on the base layer, and including at least a copper wiring layer in which a CuMn layer and a pure copper layer are sequentially laminated, and a CuNi layer formed on the copper wiring layer There is provided a touch panel module comprising a sensor and a flexible printed wiring board connected to the touch panel sensor.

  According to the present invention, by having the touch panel sensor, a copper wiring layer having low resistance and good adhesion to the base layer is obtained, and a wiring layer having excellent quality stability by suppressing oxidation of the copper wiring layer. be able to. Furthermore, the copper wiring layer and the CuNi layer can be etched simultaneously, and a touch panel module having a wiring layer that can be easily formed can be obtained.

  In the above invention, the CuMn layer is made of a CuMn alloy having a Mn content in the range of 0.1 atomic% to 20 atomic%, the thickness is in the range of 10 nm to 200 nm, and the CuNi layer Is made of a CuNi alloy having a Ni content in the range of 25 mass% to 65 mass%, and preferably has a thickness in the range of 10 nm to 150 nm. This is because, when the CuMn layer and the CuNi layer have a predetermined composition and thickness, adhesion with the underlying layer can be improved and excellent oxidation resistance can be obtained.

  The present invention has an effect of providing a touch panel sensor having a low resistance, good adhesion to an underlayer, excellent quality stability, and a wiring layer that can be easily formed.

It is a schematic plan view which shows an example of the touch panel sensor of this invention. It is the sectional view on the AA line of FIG. It is the BB sectional view taken on the line of FIG. It is CC sectional view taken on the line of FIG. It is a schematic sectional drawing which shows the other example of the touchscreen sensor of this invention. It is a schematic sectional drawing which shows the other example of the touchscreen sensor of this invention. It is a schematic sectional drawing which shows an example of the sensor electrode in this invention. It is a schematic sectional drawing which shows the other example of the sensor electrode in this invention. It is a schematic sectional drawing which shows the other example of the sensor electrode in this invention. It is process drawing which shows an example of the manufacturing method of the touch panel sensor of this invention. It is a schematic sectional drawing which shows an example of the touchscreen module of this invention.

  Hereinafter, the touch panel sensor and touch panel module of the present invention will be described.

A. Touch Panel Sensor The touch panel sensor of the present invention is formed on a base layer, a wiring layer that is formed on the base layer, and includes at least a copper wiring layer in which a CuMn layer and a pure copper layer are sequentially laminated, and the copper wiring layer. It has a CuNi layer.

The touch panel sensor of the present invention will be described with reference to the drawings. FIG. 1 is a schematic plan view showing an example of the touch panel sensor of the present invention. 2 is a cross-sectional view taken along line AA in FIG. 1, FIG. 3 is a cross-sectional view taken along line BB in FIG. 1, and FIG. 4 is a cross-sectional view taken along line CC in FIG.
As illustrated in FIGS. 1 to 4, in the touch panel sensor 20, a sensor electrode including a first electrode 6 a and a second electrode 6 b as a wiring layer on the insulating substrate 1, and a first conductive portion 7 a. In addition, a conductive portion composed of the second conductive portion 7b, an extraction wiring layer 8, and an external connection terminal 9 are formed. Among these wiring layers, the first conductive portion 7a, the lead-out wiring layer 8 and the external connection terminal 9 are the copper wiring layers 4 in which the CuMn layer 2 and the pure copper layer 3 are laminated. CuNi layer 5 is formed.
The sensor electrode is formed in the active area 11 visible to the touch panel user, and includes a first electrode 6a and a second electrode 6b. The first electrode 6a and the second electrode 6b are transparent electrodes made of a transparent conductive material. is there. The conductive portion includes a first conductive portion 7a that connects between the first electrodes 6a and a second conductive portion 7b that connects between the second electrodes 6b, and the second conductive portion 7b is transparently conductive in the same manner as the second electrode 6b. It is a transparent electrode made of a conductive material. Further, the lead-out wiring layer 8 is connected to the sensor electrode, is formed in the inactive area outside the active area 11, and is connected to the external connection terminal 9 at the end.
The first conductive portion 7a and the second conductive portion 7b are formed so that parts thereof overlap in plan view with the insulating layer 10 interposed therebetween, and the first conductive portion 7a is connected with the conductive hole 12 provided in the insulating layer 10. The first electrodes 6a are connected.

In the example shown in FIGS. 1 to 4, as described above, the first conductive portion 7 a, the extraction wiring layer 8, and the external connection terminal 9 are the copper wiring layer 4 in which the CuMn layer 2 and the pure copper layer 3 are laminated, The lead-out wiring layer 8 and the external connection terminal 9 are formed on the insulating substrate 1, and the first conductive portion 7a is formed on the first electrode 6a and the insulating layer 10 which are transparent electrodes. Therefore, the insulating base 1, the first electrode 6 a that is a transparent electrode, and the insulating layer 10 are all the base layers of the copper wiring layer 4.
In FIG. 1, the insulating layer is omitted.

According to the present invention, since the copper wiring layer includes a pure copper layer having a small specific resistance, the resistance of the wiring layer can be reduced. Therefore, in the touch panel sensor of the present invention, the contact position can be detected with high sensitivity.
Moreover, according to this invention, the adhesiveness of a copper wiring layer and a base layer can be improved by laminating | stacking in order of a CuMn layer and a pure copper layer on a base layer. For example, in FIGS. 1 to 4, the insulating base material 1, the first electrode 6 a that is a transparent electrode, and the insulating layer 10 are the base layer of the CuMn layer 2 that constitutes the copper wiring layer 4. Adhesion with all of the first electrode 6a and the insulating layer 10 can be enhanced. Therefore, the copper wiring layer can be formed relatively thin. As a result, the aperture ratio of the copper wiring layer in the active area is increased, and the area of the inactive area is reduced to increase the area of the active area. be able to. Thereby, visibility can be improved when the touch panel sensor of the present invention is used for a display device with a touch panel.

  In the present invention, since the CuNi layer is formed on the copper wiring layer, oxidation of the copper wiring layer, particularly oxidation of the pure copper layer can be suppressed. In particular, since the CuNi layer is excellent in oxidation resistance, the copper wiring layer can be stably protected and a wiring layer excellent in quality stability can be obtained. Therefore, reliability such as environmental resistance of the touch panel sensor can be improved, and the touch panel sensor can be applied to various uses.

Furthermore, in the present invention, the CuMn layer, the pure copper layer, and the CuNi layer can be simultaneously etched with the same etching solution. For this reason, there is no additional process when patterning the CuMn layer, the pure copper layer, and the CuNi layer, and the wiring layer can be easily formed.
In addition, since the pure copper layer has a small specific resistance, conductivity can be ensured even if the thickness is small, and the production efficiency of the touch panel sensor can be improved.

  Hereinafter, each component of the touch panel sensor of the present invention will be described in detail.

1. Wiring layer The wiring layer in the present invention includes at least a copper wiring layer formed on a base layer, in which a CuMn layer and a pure copper layer are sequentially laminated.
Here, the phrase “the wiring layer includes at least a copper wiring layer in which a CuMn layer and a pure copper layer are sequentially laminated” may be that at least a part of the members included in the wiring layer is a copper wiring layer. Specifically, this includes the case where only a part of the first electrode constituting the sensor electrode included as the wiring layer is formed of the copper wiring layer.

(1) Copper wiring layer The copper wiring layer used for this invention is formed on a base layer, and a CuMn layer and a pure copper layer are laminated | stacked in order.

(A) CuMn layer The CuMn layer in this invention is formed on a base layer, and consists of a CuMn alloy.
In addition, a CuMn alloy is not limited to what consists only of two components of Cu and Mn, The thing containing an impurity is also included.

  The Cu content in the CuMn alloy is preferably in the range of 80 atomic% to 99.9 atomic%, and more preferably in the range of 90 atomic% to 99.9 atomic%. If the Cu content is too small, simultaneous etching of the CuMn layer, the pure copper layer and the CuNi layer may be difficult. On the other hand, when there is too much content of Cu, content of Mn will decrease relatively and the effect which improves adhesiveness with a base layer may not fully be acquired.

  The Mn content in the CuMn alloy is preferably in the range of 0.1 atomic% to 20 atomic%, and more preferably in the range of 0.1 atomic% to 10 atomic%. When the content of Mn is within the above range, the adhesion between the CuMn layer and the underlayer can be improved. Therefore, the copper wiring layer can be formed relatively thin. As a result, the aperture ratio of the copper wiring layer in the active area is increased, and the area of the inactive area is reduced to increase the area of the active area. can do. Thereby, visibility can be improved when the touch panel sensor of the present invention is used for a display device with a touch panel.

  Here, the compounding ratio of Cu and Mn can be measured by collecting a CuMn layer from a touch panel sensor and providing the collected CuMn layer for a general metal alloy analysis method. As a more specific example, there is a method of measuring the compounding ratio of Cu and Mn contained in the CuMn layer by performing a depth profile of time-of-flight secondary ion mass spectrometry (TOF-SIMS).

  The thickness of the CuMn layer is not particularly limited as long as desired adhesion can be obtained, but it is preferably within a range of 10 nm to 200 nm, and more preferably within a range of 30 nm to 100 nm. If the thickness of the CuMn layer is too thick, simultaneous etching of the CuMn layer, the pure copper layer, and the CuNi layer may be difficult. On the other hand, if the thickness of the CuMn layer is too thin, the effect of improving the adhesion with the underlying layer may not be sufficiently obtained.

  The method of forming the CuMn layer is not particularly limited as long as the CuMn layer can be formed with high accuracy, but a method of etching simultaneously with the pure copper layer and the CuNi layer described later is preferable. Specifically, after a CuMn layer, a pure copper layer, and a CuNi layer are sequentially laminated on the underlayer, a resist is formed in a pattern on the CuNi layer, and the CuNi layer, the pure copper layer, and the CuMn layer are etched using the resist as a mask. And a method of forming the same pattern.

  The method for forming the CuMn layer, the pure copper layer, and the CuNi layer is not particularly limited as long as it is a method capable of forming a film with a uniform thickness. For example, a vacuum deposition method, a sputtering method, a CVD method, and the like. And a film forming method using a dry process such as an ion plating method.

  The etching solution used for etching is not particularly limited as long as it can etch the CuMn layer, the pure copper layer, and the CuNi layer. Specific examples include an aqueous phosphonitrate solution containing phosphoric acid, nitric acid and acetic acid, a system in which an oxidizing agent represented by hydrogen peroxide and sulfuric acid is mixed, hydrobromic acid, hydrohalic acid, and the like. .

(B) Pure copper layer The pure copper layer in this invention is formed on the said CuMn layer, and consists of pure copper.
Here, "pure copper" refers to a material having a specific resistance smaller than that of the CuMn alloy.
In addition, pure copper is not limited to what consists only of copper, The thing containing an impurity is also included. Even if impurities are contained, a pure copper layer having excellent conductivity can be obtained.

  The Cu content in the pure copper is not particularly limited as long as the specific resistance is smaller than that of the CuMn alloy, but is preferably 99.95% by mass or more, and more preferably 99.99% by mass or more. Is preferred.

  Although the thickness of a pure copper layer will not be specifically limited if desired electroconductivity is obtained, It is preferable that it is 10 nm or more. In addition, the upper limit of the thickness of the pure copper layer is preferably a thickness that satisfies a sheet resistance of 0.05Ω / □, specifically, 900 nm or less. When the thickness of the pure copper layer is within the above range, excellent conductivity can be obtained.

  The method for forming the pure copper layer is not particularly limited as long as it is a method capable of forming the pure copper layer with high accuracy. However, as described above, a method of etching simultaneously with the CuMn layer and the CuNi layer is preferable.

(2) Wiring layer The wiring layer in this invention is a member which has the electroconductivity to which the electricity as a power supply or an electric signal is transmitted.

  Such wiring layers can include those commonly used for touch panel sensors. Specifically, a sensor electrode including a first electrode and a second electrode that are used to detect a contact position and insulated from each other, a first conductive portion that connects between the first electrodes, and a second electrode that connects between the second electrodes. Examples include a conductive part including a conductive part, a lead-out wiring layer connected to the sensor electrode, an external connection terminal formed at the end of the lead-out wiring layer and used for connection to other members such as a flexible printed wiring board.

  In the present invention, at least a part of the wiring layer may be a copper wiring layer in which a CuMn layer and a pure copper layer are laminated, and all of the wiring layers may be copper wiring layers. Among them, the wiring layer formed in the inactive area, in particular, the wiring layer including the extraction wiring layer and the external connection terminal is preferably a copper wiring layer. This is because the use of a copper wiring layer can suppress the resistance to a low level and consume less power.

(A) Sensor electrode The sensor electrode in the present invention includes a first electrode and a second electrode insulated from the first electrode, is formed in the active area, and is used for detecting a contact position.
In addition, the 2nd electrode insulated from the 1st electrode means that both electrodes are not electrically connected.

  When the sensor electrode is not the copper wiring layer, a transparent electrode made of a transparent conductive material can be used. As the transparent conductive material used for forming the sensor electrode, specifically, indium tin oxide called ITO, zinc oxide, indium oxide, antimony-added tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, Potassium-doped zinc oxide, silicon-doped zinc oxide, metal oxides such as zinc oxide-tin oxide, indium oxide-tin oxide, zinc oxide-indium oxide-magnesium oxide, and two or more of these metal oxides Examples include composite materials. Moreover, a non-transparent conductive material can also be used for a sensor electrode, and what is described in Unexamined-Japanese-Patent No. 2010-238052 etc. can be used as a non-transparent conductive material, for example. Specifically, metals such as aluminum, molybdenum, silver, and chromium, and alloys thereof can be used.

  As the planar view shape and the planar view outer shape of such a sensor electrode, JP 2011-210176 A, JP 2010-238052 A, JP 4610416 A, JP 2010-286886 A, and JP 2004. -192093, JP2010-277392A, JP2011-129501A, and the like can be the same as a sensor electrode in a general touch panel sensor.

  Examples of the shape of the sensor electrode in plan view include a planar shape that does not include an opening, a mesh shape that has an opening, and the like. In the case where the sensor electrode is not formed of a copper wiring layer, a mesh shape is preferable. This is because the visibility when the touch panel sensor of the present invention is used in a display device with a touch panel can be improved.

  When the sensor electrode is mesh-shaped, the aperture ratio of the sensor electrode varies depending on the type of the touch panel sensor of the present invention, but is preferably 90% or more, and more preferably 93% or more. In particular, it is preferably 95% or more. This is because when the touch panel sensor of the present invention is used in a display device with a touch panel sensor, the touch panel sensor can have excellent visibility. In addition, the aperture ratio of a sensor electrode means the ratio of the area of the opening part which occupies for the area of a sensor electrode.

  Further, the line width of the sensor electrode in the case where the sensor electrode has a mesh shape is not particularly limited as long as the contact position can be accurately detected, but is preferably in the range of 1 μm to 10 μm. Of these, the range of 2 to 7 μm is preferable, and the range of 3 to 5 μm is particularly preferable. This is because when the touch panel sensor of the present invention is used in a display device with a touch panel, the visibility of information displayed on the display device can be improved.

  Moreover, as a planar view outer periphery shape of a sensor electrode, polygonal shapes, such as planar view substantially square shape, are mentioned, for example.

When the touch panel sensor of the present invention is used in a display device with a touch panel, the first electrode and the second electrode are formed in the active area of the insulating base material so that both are insulated. There is no particular limitation as long as it is formed. For example, the first electrode 6a and the second electrode 6b may be formed on one surface of the same insulating substrate 1 as illustrated in FIG. 4 described above, and the first electrode as illustrated in FIG. 6a and the second electrode 6b may be formed on different insulating base materials 1, and the first electrode 6a and the second electrode 6b may be formed through the insulating layer 10 as illustrated in FIG. Furthermore, as illustrated in FIG. 7, the first electrode 6 a and the second electrode 6 b may be formed on one surface and the other surface of the same insulating substrate 1, respectively.
5 to 7 correspond to the cross-sectional view taken along the line CC in FIG. 1 as in FIG. 4 described above.

(B) Conductive part The conductive part in this invention contains the 1st conductive part and 2nd conductive part which connect between the 1st electrodes which comprise the said sensor electrode, and between 2nd electrodes, respectively. Further, normally, the first conductive portion and the second conductive portion are formed so that a part thereof overlaps in plan view.

  When the conductive part is not a copper wiring layer, the material of the conductive part is not particularly limited as long as it has conductivity, and can be the same as the sensor electrode described above.

  As a planar view shape of a conductive part, it can be made common to a touch panel sensor. The shape of the conductive part in plan view can be the same as that of the sensor electrode.

  Further, the external shape of the conductive portion in plan view can be general to the touch panel sensor, and examples thereof include a line shape having a width narrower than that of the sensor electrode in plan view.

  The location where the first conductive portion and the second conductive portion are formed is particularly limited as long as the first conductive portion and the second conductive portion can be stably connected to each other and are formed so as to be insulated from each other. It is not a thing. For example, when the first electrode and the second electrode are formed on different surfaces or different members as shown in FIGS. 5 to 7, the first conductive portion and the second conductive portion are the first electrode and the first electrode, respectively. It is formed on the same surface as the two electrodes. Further, when both the first electrode and the second electrode are formed on one surface of the same insulating base material, the first conductive portion and the second conductive portion are formed via the insulating layer.

(C) Extraction wiring layer The extraction wiring layer in this invention is connected to a sensor electrode.

  As the location where the lead-out wiring layer is formed, it is appropriately set according to the type and application of the touch panel sensor of the present invention, but when the touch panel sensor of the present invention is used in a display device with a touch panel, Formed in an inactive area.

  When the lead-out wiring layer is not a copper wiring layer, the conductive material used for forming the lead-out wiring layer is, for example, silver, gold, chromium, platinum, aluminum alone, or an alloy mainly composed of any of these. Is mentioned. As the metal alloy, APC, that is, silver, palladium, or copper alloy is generally used. As the metal composite, MAM, that is, a three-layer structure of molybdenum, aluminum, and molybdenum can also be applied.

  The line width of the extraction wiring layer can be, for example, about 0.01 mm to 0.2 mm.

(D) External connection terminal The external connection terminal in the present invention is connected to the lead-out wiring layer and used for connection to a flexible printed wiring board or the like.

  About the formation location of such an external connection terminal, and the material of the external connection terminal when the external connection terminal is not a copper wiring layer, it can be the same as that of the above-mentioned extraction wiring layer.

  The terminal width, thickness and plan view shape of the external connection terminals, and the interval between the external connection terminals in the external connection terminal portion can be the same as those of a general touch panel sensor. Specifically, it can be the same as that described in JP2011-210176A.

2. CuNi layer The CuNi layer in this invention is formed on the said copper wiring layer, and consists of a CuNi alloy.
Note that the CuNi alloy is not limited to one composed only of two components of Cu and Ni, but also includes those containing impurities.

  The Cu content in the CuNi layer is not particularly limited as long as simultaneous etching of the CuNi layer and the copper wiring layer is possible, but is in the range of 35% by mass to 75% by mass. It is preferable that it is in the range of 60 mass%-70 mass% especially. This is because when the Cu content is within the above range, the CuNi layer and the copper wiring layer can be easily etched simultaneously.

  The content of Ni in the CuNi layer is not particularly limited as long as desired oxidation resistance can be obtained. For example, it is preferably in the range of 25% by mass to 65% by mass, and more preferably 30% by mass. It is preferable to be within a range of ˜40% by mass. When the Ni content is within the above range, the CuNi layer can be made excellent in oxidation resistance.

  The CuNi layer may or may not have conductivity, but preferably has conductivity. For example, it can be easily connected to another member such as a flexible printed wiring board through a CuNi layer formed on the copper wiring layer.

  The formation location of the CuNi layer is not particularly limited as long as the CuNi layer is formed on the copper wiring layer, but is preferably formed on all the wiring layers formed as the copper wiring layer. In particular, it is preferably formed only on the copper wiring layer. This is because oxidation of the copper wiring layer can be suppressed and quality deterioration can be suppressed. Further, the effect of simultaneous etching of the CuNi layer and the copper wiring layer can be made remarkable.

The CuNi layer is formed on the copper wiring layer so as to cover the copper wiring layer, that is, the upper part of the copper wiring layer opposite to the base layer side of the copper wiring layer. However, it is preferable to form so as to cover all of the upper part of the copper wiring layer. This is because oxidation of the copper wiring layer can be suppressed and quality deterioration can be suppressed. Further, the effect of simultaneous etching of the CuNi layer and the copper wiring layer can be made remarkable.
When the CuNi layer is formed at the same timing as the copper wiring layer by simultaneous etching, the CuNi layer is not usually formed on the side surface of the copper wiring layer.

  The formation position of the CuNi layer with respect to the copper wiring layer is not limited as long as the oxidation of the copper wiring layer can be suppressed. For example, another layer may be formed between the CuNi layer and the copper wiring layer. It is preferably formed directly on the wiring layer. This is because oxidation of the copper wiring layer can be suppressed and quality deterioration can be suppressed. Further, the effect of simultaneous etching of the CuNi layer and the copper wiring layer can be made remarkable.

  The thickness of the CuNi layer is not particularly limited as long as it can suppress oxidation of the copper wiring layer, and has a film shape covering the copper wiring layer, that is, an opening such as a pinhole. It only has to be a thing that can not be. If oxidation can be prevented on the surface of the CuNi layer, the barrier property against moisture can be sufficiently exhibited, and oxidation of the copper wiring layer can be greatly suppressed. Specifically, the thickness of such a CuNi layer is preferably in the range of 10 nm to 150 nm, and more preferably in the range of 30 nm to 80 nm. This is because the CuNi layer can be stably formed when the thickness of the CuNi layer is within the above range.

  The method for forming the CuNi layer is not particularly limited as long as the CuNi layer can be formed with high accuracy. Specifically, the method described in the section “1. Copper wiring layer” may be used. it can.

3. Underlayer In the underlayer in the present invention, a copper wiring layer is formed thereon.
Examples of such an underlayer include an insulating base material, an insulating layer, and a transparent electrode made of a transparent conductive material. In addition, the underlayer may be a single layer or a laminate of a plurality of layers.
Hereinafter, the underlayer will be described.

(1) Insulating base material When the base layer in the present invention is an insulating base material, examples of the copper wiring layer formed on the insulating base material include an extraction wiring layer and an external connection terminal.

The insulating substrate supports the wiring layer and the like. The material constituting the insulating substrate is not particularly limited as long as it has insulating properties, and may be a material having transparency or a material having non-transparency. When the touch panel sensor of the present invention is used for a display device with a touch panel, the insulating base material is preferably made of a transparent material. This is because excellent visibility can be obtained.
In the present invention, the terms “transparent” and “transparency” mean that an operator of a display device with a touch panel using the touch panel sensor of the present invention is not visually recognized from the operation surface unless otherwise specified. There is no transparency. Therefore, it includes colorless and transparent and colored transparency that does not impede visibility, is not defined by strict transmittance, and can be appropriately determined according to the use of the touch panel sensor.

  Examples of the material constituting the insulating base include inorganic materials such as glass, polyester resins such as polyethylene terephthalate, resin materials such as acrylic resins and polycarbonate. When an inorganic material such as glass is selected, it is possible to increase the strength of the touch panel sensor and widen the setting range of manufacturing conditions such as heating temperature. On the other hand, when a resin material is selected, the touch panel sensor can be reduced in weight, and flexibility can be imparted to the touch panel sensor.

The thickness of the insulating substrate is not particularly limited as long as it can stably support a copper wiring layer and the like, and is appropriately selected according to the material. For example, when the insulating substrate is made of an inorganic material such as glass, it is preferably within a range of 0.3 mm to 1.5 mm. Moreover, when an insulating base material consists of resin materials, it is preferable that it is a flexible film form, and specifically, it is preferable to set it as the range of 50 micrometers-300 micrometers.
In addition, as a form of an insulating base material, the film form which has flexibility may be sufficient, and plate shape may be sufficient.

The insulating substrate may be a single layer or a plurality of layers.
In addition, as a layer laminated | stacked when an insulating base material consists of multiple layers, a hard-coat layer, an adhesion adjustment layer, a low-refractive-index layer, a high-refractive-index layer, etc. can be mentioned besides the layer which consists of the said material. .

(2) Insulating layer When the base layer in this invention is an insulating layer, as a copper wiring layer formed on an insulating layer, a conductive part is mentioned, for example.

  The insulating layer is formed to prevent a short circuit between the first electrode and the second electrode constituting the sensor electrode or between the first conductive portion and the second conductive portion. The material for forming the insulating layer is not particularly limited as long as it has a desired insulating property, and materials generally used for touch panel sensors can be used. For example, a light-transmitting acrylic resin, siloxane resin, and the like can be given, and among these, a photosensitive siloxane resin can be preferably used.

The insulating layer can be formed at a location common to a touch panel sensor. For example, as shown in FIG. 4, the first electrode 6 a and the second electrode 6 b constituting the sensor electrode are formed on the insulating base 1. When formed on the same surface, as shown in FIGS. 2 and 3, the insulating layer 10 is formed between the first electrode 6a, the second electrode 6b and the second conductive portion 7b and the first conductive portion 7a, As shown in FIGS. 8 and 9, the insulating layer 10 of the first conductive portion 7a has a hole type formed so as to have a conductive hole 12 for connecting the first conductive portion 7a and the first electrode 6a. There is an island type that is formed in an island shape only in the lower layer. Further, as illustrated in FIGS. 5 and 6, when the first electrode 6 a and the second electrode 6 b are formed on different members, the insulating layer includes the first electrode, the first conductive portion, the second electrode, and the like. You may form between 2nd electroconductive parts.
8 and 9 correspond to the cross-sectional view taken along the line AA and the cross-sectional view taken along the line BB in FIG. 1, respectively, similarly to the above-described FIGS. The reference numerals in FIGS. 8 to 9 are the same as those in FIGS.

  The thickness of the insulating layer is not particularly limited as long as it can prevent a short circuit between the first electrode and the second electrode or between the first conductive portion and the second conductive portion. It can be general. For example, it can be in the range of 0.5 μm to 3.0 μm.

  The method of forming the insulating layer is not particularly limited as long as the insulating layer can be formed with high accuracy, and a method of applying an insulating layer forming material to the substrate surface and then patterning by a photolithography technique, Or the method of forming by printing methods, such as screen printing, can be mentioned. It is also possible to process a film or sheet having insulating properties, appropriate light transmittance and optical isotropy into a desired shape and laminating it on a predetermined substrate surface as an insulating film. .

(3) Transparent electrode When the base layer in the present invention is a transparent electrode made of a transparent conductive material, examples of the copper wiring layer formed on the transparent electrode include a conductive portion.

The transparent electrode is made of a transparent conductive material and constitutes a sensor electrode.
Note that the transparent conductive material and the sensor electrode can be the same as those described in the section “1. Wiring layer (2) Wiring layer (a) Sensor electrode”, and thus the description thereof is omitted here. To do.

4). Touch Panel Sensor The touch panel sensor of the present invention has at least a base layer, a wiring layer, and a CuNi layer, but may have other members as necessary. Such other members include an insulating layer or a wiring layer formed to prevent a short circuit between the first electrode and the second electrode constituting the sensor electrode or between the first conductive portion and the second conductive portion. And a protective layer formed so as to cover the surface.

(1) Insulating layer An insulating layer is formed in order to prevent the short circuit between the 1st electrode and 2nd electrode which comprise a sensor electrode, or between a 1st electroconductive part and a 2nd electroconductive part.
Since the detailed contents of the insulating layer are described in the above section “3. Underlayer (2) Insulating layer”, description thereof is omitted here.

(2) Protective layer The protective layer is formed so as to cover the wiring layer.
The protective layer is not particularly limited as long as it has insulating properties, but preferably has transparency. Examples of the protective layer having insulation and transparency include those made of an inorganic material such as acrylic resin or SiO ₂ .

5. Manufacturing method of touch panel sensor The manufacturing method of the touch panel sensor of the present invention includes a laminate preparation step of preparing a laminate in which an underlayer, a CuMn layer, a pure copper layer, and a CuNi layer are sequentially laminated, and a CuMn layer, a pure copper layer, and a CuNi layer. It is preferable to have a simultaneous etching step of simultaneously etching.

Such a touch panel sensor manufacturing method of the present invention will be described with reference to the drawings. FIG. 10 is a process diagram showing an example of a method for manufacturing a touch panel sensor of the present invention. First, although not shown, after preparing a laminate in which a transparent electrode layer made of a transparent conductive material such as ITO is laminated on one surface of an insulating substrate by sputtering, and forming a resist in a pattern on the laminate The transparent electrode layer is etched using iron chloride or the like using the resist as a mask, and the resist is peeled off, so that the first electrode 6a and the second electrode are formed on the insulating substrate 1 as illustrated in FIG. (Not shown) and the second conductive portion 7b are formed. The first electrode 6a, the second electrode, and the second conductive portion 7b are transparent electrodes made of a transparent conductive material. Next, as shown in FIG. 10B, an insulating layer forming layer 10a is formed, exposed and developed using a mask, and the insulating layer 10 having conductive holes 12 as shown in FIG. 10C is formed. Form. Thereafter, as shown in FIG. 10 (d), the CuMn layer 2a and the pure copper are formed on the insulating base material 1 on which the first electrode 6a, the second electrode, the second conductive portion 7b, and the insulating layer 10 made of transparent electrodes are formed. A laminated body in which the layer 3a and the CuNi layer 5a are laminated in this order is prepared, and a resist 21 is formed in a pattern on the laminated body. Next, as shown in FIG. 10E, by simultaneously etching the CuMn layer 2a, the pure copper layer 3a, and the CuNi layer 5a using the same etching solution, as shown in FIG. CuMn layer 2, pure copper layer 3, and CuNi layer 5 are obtained. In this case, the first conductive portion 7a and the extraction wiring layer 8 are the copper wiring layer 4 in which the CuMn layer 2 and the pure copper layer 3 are laminated, and the CuNi layer 5 has the same pattern as the first conductive portion 7a and the extraction wiring layer 8. It is formed. Then, as shown in FIG.10 (g), the touch panel sensor 20 can be obtained by forming the protective layer 13 so that the 1st electrode 6a and the 2nd electrode may be covered.
In this example, the insulating base 1, the first electrode 6 a which is a transparent electrode, and the insulating layer 10 are the underlayer of the copper wiring layer 4.

When simultaneously etching the CuMn layer, the pure copper layer, and the CuNi layer, they can be simultaneously etched with the same etching solution.
At this time, it is preferable to select the etching conditions such as the etching solution so that the time required for etching the CuNi layer is within a range of ± 20% of the time required for etching the CuMn layer and the pure copper layer.

B. Touch Panel Module The touch panel module of the present invention is a base layer, a wiring layer formed on the base layer, a wiring layer including at least a copper wiring layer in which a CuMn layer and a pure copper layer are sequentially stacked, and CuNi formed on the copper wiring layer A touch panel sensor having a layer and a flexible printed wiring board connected to the touch panel sensor are provided.
Hereinafter, the flexible printed wiring board may be referred to as FPC.

  Such a touch panel module will be described with reference to the drawings. FIG. 11 is a schematic cross-sectional view showing an example of the touch panel module of the present invention. A touch panel module 50 illustrated in FIG. 11 includes a touch panel sensor 20, an FPC 51 connected to the touch panel sensor 20, an overcoat layer 52 and a cover lens 53 disposed on the touch panel sensor 20.

  According to the present invention, by having the touch panel sensor described above, a copper wiring layer having low resistance and good adhesion to the base layer can be obtained, and oxidation of the copper wiring layer is suppressed and excellent quality stability is achieved. A wiring layer can be formed. Furthermore, the CuNi layer and the copper wiring layer can be etched at the same time, and the wiring layer can be easily formed.

  The touch panel module of the present invention has at least a touch panel sensor and an FPC. Moreover, the touch panel module of this invention has a cover lens normally. In the touch panel module, the insulating base material constituting the touch panel sensor may also serve as a cover lens, and the cover lens may be separately disposed on the touch panel sensor. When the cover lens is separately provided on the touch panel sensor, an overcoat layer is formed between the touch panel sensor and the cover lens.

  Since the touch panel sensor has been described in detail in the section “A. Touch panel sensor”, description thereof is omitted here. Hereinafter, other configurations of the touch panel module of the present invention will be described in detail.

1. FPC
The FPC used in the present invention is connected to the touch panel sensor.

  A touch panel drive driver IC for driving the touch panel is connected to the FPC to supply power to the electrodes, output detection signals, and the like. As such FPC, as described in JP 2009-64343 A, JP 9-146680 A, JP 2587975 A, JP 2011-124332 A, JP 2011-76514 A, and the like. It can be generally used for touch panels. For example, what has a front side connection terminal formed on one surface of a flexible substrate and a back side connection terminal formed on the other surface as a connection terminal is mentioned.

  The flexible substrate is not particularly limited as long as it has desired insulating properties, and examples thereof include a flexible polyimide film having a thickness of about 25 μm.

  Further, the connection terminal is not particularly limited as long as it has desired conductivity. For example, it can be the same as the external connection terminal in the touch panel sensor.

The FPC has a flexible substrate and connection terminals, but may have other configurations as necessary. As such other configurations, for example, a wiring connected to the connection terminal, a protective layer formed so as to cover the wiring, and the like can be cited. When the input information processing unit or the touch panel module of the present invention is used in a display device with a touch panel, it may have a control unit such as a video information processing unit.
The wiring can be the same as the extraction wiring layer. Moreover, as a protective layer, if it has insulation, it will not specifically limit, For example, what consists of a polyimide resin can be mentioned.
Further, the connection method of the FPC with the touch panel sensor is not particularly limited as long as it is a method capable of electrically connecting the two, for example, an external connection terminal formed on the touch panel sensor, and an FPC. An anisotropic conductive film as disclosed in Japanese Patent Application Laid-Open No. 2010-278025 is disposed between the connection terminals formed on the substrate and heat-pressed.

2. Overcoat layer The overcoat layer in this invention is formed on one surface of the said touchscreen sensor, and adhere | attaches a touchscreen sensor and a cover lens.

  Such an overcoat layer is not particularly limited as long as it can adhere the touch panel sensor and the cover lens with a desired adhesive force, and preferably has transparency. This is because when the touch panel module of the present invention is used in a display device with a touch panel, the touch panel module can be excellent in visibility.

  As the material for the overcoat layer, those generally used for touch panels disclosed in JP-A-2009-37312 can be used. For example, reactive vinyls such as acrylates and methacrylates are used. Examples thereof include those made of a curable resin such as a photocurable resin having a group, an acrylic pressure-sensitive adhesive, and an optically transparent double-sided tape called OCA tape. Among them, those using acrylic materials can be preferably used. It is because it can be made excellent in adhesiveness and transparency by being an acrylic adhesive or OCA using an acrylic material. Acrylic materials tend to have higher oxygen permeability and moisture permeability than resin materials that cover metal wiring of electronic circuits such as polyimide. On the other hand, in the present invention, since the CuNi layer is formed on the copper wiring layer, oxidation of the copper wiring layer can be suppressed, and the effect of the present invention can be made more remarkable. .

  The thickness of the overcoat layer is not particularly limited as long as the touch panel sensor and the cover lens can be bonded with a desired adhesive force. For example, the thickness of the overcoat layer can be in the range of 1 μm to 500 μm, and in particular, 20 μm to It is preferable to be in the range of 500 μm. It is because it can be made excellent in transparency. Moreover, although the barrier property of oxygen and moisture to the copper wiring layer is reduced due to the thin thickness, the CuNi layer is formed as described above in the present invention, so that the oxidation of the copper wiring layer is effectively suppressed. can do. For this reason, the effect of this invention can be made more remarkable.

  The formation location of the overcoat layer is not particularly limited as long as both the touch panel sensor and the cover lens can be bonded with a desired adhesive force, and may be the entire surface where both are in contact with each other. It may be formed in a pattern only in an inactive area that is outside the area.

3. Cover Lens The cover lens in the present invention protects the touch panel sensor from scratches and the like.

  The material constituting such a cover lens is not particularly limited as long as it can have a desired protective property, such as chemically tempered glass, soda glass, quartz glass, and alkali-free glass. Glass, polycarbonate, polyacrylic acid ester, polymethacrylic acid ester and other resins, and other inorganic materials.

  The cover lens may be non-transparent, but preferably has transparency when the touch panel module of the present invention is used in a display device with a touch panel.

  The thickness of the cover lens is not particularly limited as long as a desired protective property can be exhibited, and is appropriately set according to the material constituting the cover lens.

  The cover lens may be composed of a single layer made of the above materials, or may be a laminate of a plurality of layers. As what consists of a plurality of layers, for example, those obtained by laminating layers made of different materials among the above materials, and those having a functional layer such as an antireflection layer or an antifouling layer in addition to the layers made of the above materials Can be mentioned. Moreover, when a cover lens consists of glass, you may have a scattering prevention film on the surface side as a functional layer.

4). Touch Panel Module The touch panel module of the present invention includes at least the touch panel sensor and the flexible printed wiring board, but may have other configurations as necessary. As such other configurations, in addition to the overcoat layer and the cover lens described above, for example, it is formed on the surface opposite to the surface on which the cover lens of the touch panel sensor is formed, and the reliability of the touch panel sensor is improved. The back surface protective film which bonded together the protective film for this through the contact bonding layer can be mentioned. The film and the adhesive layer are not particularly limited as long as the reliability of the touch panel sensor can be improved.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples.

[Example 1]
First, as a foundation layer, a transparent glass base material having a thickness of 0.5 mm (blue plate tempered glass manufactured by Nippon Sheet Glass Co., Ltd.) is used. On the transparent glass base material, a CuMn layer having the composition and thickness shown in Table 1 below, P A Cu layer and a CuNi layer were formed in this order by a sputtering method to produce a laminate.
Next, a positive photosensitive resin (resist) was applied on the CuNi layer and patterned by photolithography. Thereafter, the laminate was simultaneously etched using a phosphorous acetic acid-based etching solution.

[Example 2]
An ITO film having a thickness of 30 nm was formed as a base layer on a transparent glass substrate (Nippon Sheet Glass Co., Ltd. blue plate tempered glass) having a thickness of 0.5 mm, and a CuMn layer, a P-Cu layer, and a CuNi layer are shown in the table below. A laminate was produced in the same manner as in Example 1 except that the composition and thickness shown in 2 were used, and the laminate was simultaneously etched.

[Example 3]
A transparent curable resin-containing coating material (catalog number A-13, manufactured by KOLON Co., Ltd.) is applied as a base layer on a transparent glass substrate (Nihon Sheet Glass Co., Ltd. blue plate tempered glass) having a thickness of 0.5 mm. A laminate was produced in the same manner as in Example 1 except that the 1.5 μm insulating layer was formed, and that the CuMn layer, the P—Cu layer and the CuNi layer had the composition and thickness shown in Table 3 below. The laminate was etched at the same time.

[Comparative Example 1]
A laminate was prepared in the same manner as in Example 1 except that the CuMn layer, the P—Cu layer, and the CuNi layer were formed with the compositions and thicknesses shown in Table 4 below, and the laminate was simultaneously etched.

[Comparative Example 2]
A laminate was produced in the same manner as in Example 2 except that the CuMn layer, the P-Cu layer, and the CuNi layer were formed with the compositions and thicknesses shown in Table 4 below, and the laminate was simultaneously etched.

[Comparative Example 3]
A laminate was prepared in the same manner as in Example 3 except that the CuMn layer, the P—Cu layer, and the CuNi layer were formed with the compositions and thicknesses shown in Table 4 below, and the laminate was simultaneously etched.

[Evaluation]
1. Adhesiveness About the obtained laminated body, the adhesiveness of a base layer and a CuMn layer was evaluated by the evaluation method according to a JISK5600 crosscut test.
A: Peeling is not confirmed in any lattice of the laminate of the CuMn layer, the P—Cu layer, and the CuNi layer.
B: It is confirmed that the laminated body of the CuMn layer, the P—Cu layer, and the CuNi layer is partially peeled along the edge of the cut.
C: It is confirmed that the laminated body of the CuMn layer, the P—Cu layer, and the CuNi layer is peeled entirely along the edges of the cut or the entire lattice.

2. Etching property The etching property when the laminated body of the CuMn layer, the P-Cu layer and the CuNi layer was simultaneously etched was evaluated.
A: The laminated body of the CuMn layer, the P—Cu layer, and the CuNi layer is etched without any cracks or wrinkles up to the fine line.
B: Although the laminated body of the CuMn layer, the P-Cu layer, and the CuNi layer can be etched, a part of the thin line pattern and the flicker are confirmed.
C: Although the laminated body of the CuMn layer, the P—Cu layer, and the CuNi layer can be etched, the fine line pattern has a chipping or wrinkle, or the fine line pattern does not remain or is not etched at all.

3. Patterning (thin wire adhesion)
After simultaneous etching of the laminate of the CuMn layer, P-Cu layer and CuNi layer, a tape peeling test was performed, and the adhesion of the fine line pattern to the underlayer was evaluated with a microscope.
A: Peeling of the fine line pattern and chipping of the pattern edge are not confirmed at all.
B: Peeling of the fine line pattern and chipping of the pattern edge are slightly confirmed.
C: Peeling of the fine line pattern and chipping of the pattern edge are confirmed.

4). Heat resistance The obtained laminated body was taken out after being placed in an oven at 230 degrees for 30 minutes, and the state of the laminated body of the CuMn layer, the P-Cu layer and the CuNi layer was visually observed and evaluated.
A: A state of discoloration in the laminate of the CuMn layer, the P—Cu layer, and the CuNi layer is not confirmed at all.
B: Generation | occurrence | production of rust is confirmed slightly on the laminated body surface of a CuMn layer, a P-Cu layer, and a CuNi layer.
C: Generation | occurrence | production of rust is confirmed on the laminated body surface of a CuMn layer, a P-Cu layer, and a CuNi layer.

5. Reliability A touch panel sensor was manufactured as shown below, and the reliability of the wiring layer was evaluated.
An ITO film having a thickness of 30 nm was formed on the surface of the transparent glass substrate by sputtering using a transparent glass substrate having a thickness of 0.5 mm (Nippon Sheet Glass Co., Ltd. blue plate tempered glass). Then, a positive photosensitive resin (resist) was formed on the ITO film, and the ITO film was patterned by a photolithography method, thereby forming the first electrode, the second electrode, and the second conductive portion.
Next, a transparent curable resin-containing coating material is applied to the entire surface of the transparent glass substrate formed above by a spin coating method to form an insulating layer forming layer, and then partially exposed by a photolithography technique. The insulating layer forming layer was patterned to leave the surface and cover the first electrode, the second electrode, and the second conductive portion, thereby forming an insulating layer.
Next, a CuMn layer, a P-Cu layer, and a CuNi layer having the compositions and thicknesses shown in Tables 1 to 4 below were formed in this order by a sputtering method. Next, a positive photosensitive resin (resist) was applied on the CuNi layer on the surface of the wiring layer and patterned by photolithography. Here, the resist pattern has a pattern corresponding to a bridge portion (first conductive portion) for connecting the first electrodes, an extraction wiring layer, and a connection terminal. Then, the laminated body of the CuMn layer, the P-Cu layer, and the CuNi layer was simultaneously etched using a phosphoric acid acetic acid-based etching solution.
Finally, a transparent curable resin-containing coating material is applied to the entire surface of the transparent glass substrate subjected to the above patterning by a spin coating method to further form a protective layer forming layer, and subsequently by a photolithography method. The protective layer forming layer is patterned so as to cover the first electrode, the first conductive portion (bridge portion), the second electrode, the second conductive portion, and the lead-out wiring layer, leaving the connection terminal pattern. did.
In this way, a touch panel sensor having a sensor electrode, a lead-out wiring layer, and a connection terminal was obtained. In this touch panel sensor, the first conductive portion, the lead-out wiring layer, and the connection terminal are constituted by a CuMn layer and a P—Cu layer, and a CuNi layer is formed on the P—Cu layer. The lead-out wiring layer and the connection terminal are formed on the transparent glass substrate, and the first conductive portion is formed on the ITO film and the insulating layer.
Next, a cover glass (OA-10 manufactured by Nippon Sheet Glass Co., Ltd.) is bonded to the touch panel sensor using an optical transparent adhesive sheet, installed in a high temperature and high humidity tank having a temperature of 60 degrees and a humidity of 95%, and a wiring layer. The state of the 1st electroconductive part comprised from this, the extraction wiring layer, and the connection terminal was observed and evaluated with the naked eye.
Here, in Examples 1 to 3 (No. 1 to 109) and Comparative Examples 1 to 3 (No. 1 to 9), a stack of CuMn layers, P-Cu layers, and CuNi layers shown in Tables 1 to 4 below. When the body composition and thickness were the same, the same touch panel sensor was evaluated.

Reliability was evaluated according to the following criteria.
A: As a result of being left in a high-temperature and high-humidity tank for 1000 hours, no corrosion was observed.
B: As a result of being left in a high-temperature and high-humidity tank for 800 hours, no corrosion was confirmed.
C: As a result of being left in a high-temperature and high-humidity tank for 250 hours, no corrosion was observed.

  The results are shown in Tables 1 to 4.

From the results of Tables 1 to 4, when the CuMn layer, the P—Cu layer, and the CuNi layer were sequentially laminated, all of adhesion, etching property, patterning property, heat resistance, and reliability were good. Specifically, by forming a CuNi layer on the CuMn layer and the P—Cu layer, it was possible to obtain heat resistance and reliability, that is, excellent oxidation resistance. Furthermore, since the CuMn layer was formed in contact with the underlayer, the adhesion between the CuMn layer and the underlayer could be improved, and good patternability could be obtained. Adhesion was good when the underlayer was a glass substrate, ITO electrode, or insulating layer.
In Table 4, no. 2, 3, 5, 6, 8, and 9 have a Ni content of 100% by mass, and therefore it is impossible to pattern the laminate of the CuMn layer, the P-Cu layer, and the Ni layer, and the reliability is evaluated. I couldn't.

DESCRIPTION OF SYMBOLS 1 ... Insulating base material 2 ... CuMn layer 3 ... Pure copper layer 4 ... Copper wiring layer 5 ... CuNi layer 6a ... 1st electrode 6b ... 2nd electrode 7a ... 1st electroconductive part 7b ... 2nd electroconductive part 8 ... Extraction wiring layer 9 ... External connection terminal 10 ... Insulating layer 11 ... Active area 12 ... Conductive hole 20 ... Touch panel sensor 21 ... Resist 50 ... Touch panel module 51 ... Flexible printed wiring board 52 ... Overcoat layer 53 ... Cover lens

Claims (4)

An underlayer,
A wiring layer formed on the underlayer and including at least a copper wiring layer in which a CuMn layer and a pure copper layer are sequentially laminated;
A touch panel sensor comprising: a CuNi layer formed on the copper wiring layer. The CuMn layer is made of a CuMn alloy having a Mn content in the range of 0.1 atomic% to 20 atomic%, and has a thickness in the range of 10 nm to 200 nm.
2. The touch panel according to claim 1, wherein the CuNi layer is made of a CuNi alloy having a Ni content in a range of 25 mass% to 65 mass% and having a thickness in a range of 10 nm to 150 nm. Sensor. A touch panel sensor having a base layer, a wiring layer formed on the base layer and including at least a copper wiring layer in which a CuMn layer and a pure copper layer are sequentially laminated, and a CuNi layer formed on the copper wiring layer;
A touch panel module, comprising: a flexible printed wiring board connected to the touch panel sensor. The CuMn layer is made of a CuMn alloy having a Mn content in the range of 0.1 atomic% to 20 atomic%, and has a thickness in the range of 10 nm to 200 nm.
The touch panel according to claim 3, wherein the CuNi layer is made of a CuNi alloy having a Ni content in a range of 25 mass% to 65 mass%, and has a thickness in a range of 10 nm to 150 nm. Sensor module.

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