JP2016224631A - Touch panel sensor, touch panel module and color filter with touch panel sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a touch panel sensor having a patterned copper wiring layer excellent in heat resistance, a touch panel sensor module excellent in conductivity using the touch panel sensor, and a color filter with a touch panel sensor using the touch panel sensor.SOLUTION: A touch panel sensor includes a wiring layer including a copper wiring layer on a ground layer. The copper wiring layer is a laminate having a pattern. The laminate includes an adhesion layer, a copper layer and a coating layer containing at least one of an indium zinc oxide (IZO) and an indium tin oxide (ITO), in this order from the ground layer side. The adhesion layer, the copper layer and the coating layer have the same pattern.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a touch panel sensor having a copper-containing wiring, a touch panel module, and a color filter with a touch panel sensor.

  Today, touch panels are widely used as input means. In many cases, the touch panel is used together with the display device as an input means for various devices in which a display device such as a liquid crystal display or a plasma display is incorporated, for example, a ticket vending machine, an ATM device, a mobile phone, or a game machine. . In such a device, the touch panel is placed on the display surface of the display device, which allows the touch panel to make a very direct input to the display device.

As such a touch panel, various types of touch panels have been put into practical use. In particular, capacitive touch panels are attracting attention because they can simultaneously input multiple points.
As an example of a capacitive touch panel, a touch panel sensor in which a first electrode and a second electrode orthogonal to the first electrode are stacked via an insulating layer, and each electrode and a change in capacitance are detected. One having a take-out wiring portion for forming a circuit is mentioned. The electrostatic capacitance type touch panel generates an electric field by applying a weak current to each electrode, and detects the change in capacitance when a finger or other conductor is touched lightly into a voltage drop or the like. By doing so, the contact position can be output.

  Due to demands for larger panel sizes and higher sensitivity, copper materials with low electrical resistance have been attracting attention as materials constituting wiring layers such as sensor electrodes used in touch panel sensors and lead-out wiring layers. However, the copper material has a problem that it is easily oxidized. At the time of manufacturing the touch panel sensor, when a heat treatment of 200 ° C. or higher (for example, about 230 ° C.) is performed in an air atmosphere, the problem that the resistance value increases due to oxidation of copper is significant. Further, there is a problem that the copper material is easily peeled off from the substrate or the like.

  In Patent Document 1, the wiring film is configured by a laminated structure of a first layer composed of a copper or copper alloy layer and a second layer composed of an aluminum layer or a specific aluminum alloy layer. In addition, it is described that a copper wiring film whose surface does not change color even when heat treatment at 200 ° C. or higher is performed in an air atmosphere. However, in the method of Patent Document 1, the effect of suppressing the oxidation of copper in the patterned thin wire layer is insufficient.

  Further, in Patent Document 2, a touch panel sensor including a base layer, a wiring layer including at least a specific CuMn wiring layer formed on the base layer, and a specific CuNi cap layer formed on the CuMn wiring layer. Is disclosed. According to Patent Document 2, it is supposed that the oxidation of the CuMn wiring layer can be suppressed by having the CuNi cap layer. However, even with the technique of Patent Document 2, the effect of suppressing the oxidation of copper in the patterned thin wiring layer is insufficient.

JP 2014-235724 A JP 2014-194720 A

In manufacturing the touch panel sensor, heat treatment is usually performed when forming an insulating layer, a transparent conductive layer, or the like. However, copper is easily oxidized at a high temperature, and if the oxidation resistance is not ensured, the conductivity may be reduced by high-temperature firing. In a patterned thin wiring layer, the problem of a decrease in conductivity due to oxidation due to high-temperature firing becomes significant, and therefore a copper wiring layer with higher heat resistance is required.
In addition, conventionally, when a copper layer is directly formed on a base layer such as a glass substrate or an insulating layer, the copper layer has poor adhesion, and even if a fine line pattern can be formed, it is easily peeled off when a force is applied, There was a problem that it was difficult to obtain a stable fine line pattern.

  The present invention has been made in view of the above circumstances, and includes a touch panel sensor including a patterned copper wiring layer excellent in heat resistance, a touch panel sensor module excellent in conductivity using the touch panel sensor, and the touch panel sensor. An object of the present invention is to provide a color filter with a touch panel sensor using the above.

The touch panel sensor according to the present invention is a touch panel sensor having a wiring layer including a copper wiring layer on a base layer,
The copper wiring layer is a laminate having a pattern, and the laminate is an adhesion layer, a copper layer, and at least one of indium zinc oxide (IZO) and indium tin oxide (ITO) from the base layer side. In this order, the adhesive layer, the copper layer, and the coating layer have the same pattern.

  In the touch panel sensor according to the present invention, the adhesion layer preferably contains at least one of indium zinc oxide (IZO) and indium tin oxide (ITO) from the viewpoint of improving the adhesion of the copper wiring layer. .

The present invention provides a touch panel module having the touch panel sensor according to the present invention and a printed wiring board connected to the touch panel sensor.
Further, the present invention includes a touch panel sensor according to the present invention, comprising a transparent base material and a black matrix layer provided on the upper side or the lower side of the transparent base material,
There is provided a color filter with a touch panel sensor, comprising: a color layer provided on a surface of the transparent substrate of the touch panel sensor provided with a black matrix layer.

  According to the present invention, a touch panel sensor having a patterned copper wiring layer with excellent heat resistance, a touch panel sensor module with excellent conductivity using the touch panel sensor, and a color filter with a touch panel sensor using the touch panel sensor. Can provide offer.

FIG. 1 is a schematic plan view showing an example of a touch panel sensor according to the present invention. FIG. 2 is a schematic cross-sectional view showing an example of the A-A ′ cut surface of FIG. 1. FIG. 3 is a schematic cross-sectional view showing an example of the B-B ′ cut surface of FIG. 1. FIG. 4 is a schematic cross-sectional view showing an example of the C-C ′ cut surface of FIG. 1. FIG. 5 is a schematic cross-sectional view showing an example of the D-D ′ cut surface of FIG. 1. FIG. 6 is a schematic cross-sectional view showing another example of the D-D ′ cut surface of FIG. 1. FIG. 7 is a schematic cross-sectional view showing another example of the touch panel sensor of the present invention. FIG. 8 is a schematic cross-sectional view showing another example of the touch panel sensor of the present invention. FIG. 9 is a schematic sectional view showing an example of the sensor electrode in the present invention. FIG. 10 is a schematic cross-sectional view showing another example of the sensor electrode in the present invention. FIG. 11 is a schematic sectional view showing another example of the sensor electrode in the present invention. FIG. 12 is a process diagram showing an example of a method for manufacturing a touch panel sensor according to the present invention. FIG. 13 is a process diagram showing another example of a method for manufacturing a touch panel sensor according to the present invention. FIG. 14 is a schematic cross-sectional view showing an example of a touch panel module according to the present invention. FIG. 15 is a schematic plan view of a color filter with a touch panel sensor. FIG. 16 is a process diagram illustrating an example of a method for manufacturing a color filter with a touch panel sensor.

Hereinafter, a touch panel sensor, a touch panel module, and a color filter with a touch panel sensor according to the present invention will be described in order.
In addition, in this invention, pure copper includes not only what consists only of a copper element but the thing containing the unavoidable impurity inevitably mixed in addition to a copper element.
Further, in the present invention, the copper alloy contains not only copper elements and elements intentionally mixed, but also unavoidably mixed impurities in addition to elements intentionally mixed with copper elements. It also includes what to do.
Further, “plan view” in this specification means visual recognition from the vertical direction (Z-axis direction in FIG. 1) with respect to the upper surface of the touch panel sensor. Usually, this corresponds to visual recognition from the vertical direction with respect to the upper surface of the insulating base material of the touch panel sensor.
Note that the scale of the drawings is for convenience of explanation and does not indicate an actual dimensional relationship.

A. The touch panel sensor according to the present invention is a touch panel sensor having a wiring layer including a copper wiring layer on a base layer,
The copper wiring layer is a laminate having a pattern, and the laminate is an adhesion layer, a copper layer, and at least one of indium zinc oxide (IZO) and indium tin oxide (ITO) from the base layer side. In this order, the adhesive layer, the copper layer, and the coating layer have the same pattern.
A touch panel sensor according to the present invention will be described with reference to the drawings. FIG. 1 is a schematic view showing an example of a touch panel sensor according to the present invention. 2 is a schematic cross-sectional view showing an example of the AA ′ cut surface in FIG. 1, and FIG. 3 is a schematic cross-sectional view showing an example of the BB ′ cut surface in FIG. These are schematic sectional drawings which show an example of the CC 'cut surface of FIG. 1 which is the Y direction of FIG.
As illustrated in FIGS. 1 to 4, in the touch panel sensor 20, a sensor electrode including a first electrode 6 a and a second electrode 6 b as a wiring layer on the insulating substrate 1, and a first conductive portion 7 a. In addition, a conductive portion composed of the second conductive portion 7b, a lead-out wiring layer 8, and an external connection terminal 9 are formed. Among these wiring layers, at least a part of the first conductive portion 7a, the lead-out wiring layer 8 and the external connection terminal 9 is the copper wiring layer, that is, a laminate having a pattern, and an adhesion layer from the base layer side. 2, a copper wiring layer 10 provided with a copper layer 3 and a coating layer 4 in this order.
The sensor electrode is formed in the active area 12 visible to the touch panel user, and includes the first electrode 6a and the second electrode 6b. The first electrode 6a and the second electrode 6b are transparent electrodes made of a transparent conductive material.
The conductive portion includes a first conductive portion 7a that connects the first electrodes 6a and a second conductive portion 7b that connects the second electrodes 6b. Similar to the second electrode 6b, the second conductive portion 7b is a transparent electrode made of a transparent conductive material. The lead-out wiring layer 8 is connected to the sensor electrode, is formed in the inactive area outside the active area 12, and is connected to the external connection terminal 9 at the end.

  Next, the extraction wiring layer 8 will be described with reference to FIGS. 5 is a schematic cross-sectional view showing an example of the DD ′ cut surface of FIG. 1, and FIG. 6 is a schematic cross-sectional view showing an example of the DD ′ cut surface of FIG. 1 different from FIG. It is. In the example of FIG. 5, a lead-out wiring layer 8 is formed on the black matrix layer 5 formed on the transparent substrate 1. Although not shown in the drawings, the wiring layer 8 may be formed directly on the transparent substrate 1. In the example of FIG. 6, the extraction wiring layer 8 is formed on the black matrix layer 5 formed on the transparent substrate 1, and the extraction wiring layer 8 is a laminated body having a pattern. In the copper wiring layer 10 provided with the adhesion layer 2, the copper layer 3, and the coating layer 4 in this order from the base layer side, the coating layer 4 also covers the side surfaces of the adhesion layer 2 and the copper layer 3. In the example of FIGS. 2 to 6, the lead-out wiring layer 8 is the copper wiring layer 10 provided with the adhesion layer 2, the copper layer 3, and the coating layer 4 in this order. For this reason, it is excellent in electrical conductivity, and even in a patterned copper wiring layer, it has excellent adhesion to the underlying layer. In the example of FIGS. 2 and 3, the base layer is the black matrix layer 5, the insulating layer 11, and the transparent substrate 1.

In the example shown in FIGS. 1-6, the 1st electroconductive part 7a, the extraction wiring layer 8, and the external connection terminal 9 were provided with the contact | adherence layer 2, the copper layer 3, and the coating layer 4 in this order as mentioned above. The copper wiring layer 10, the lead-out wiring layer 8 and the external connection terminals 9 are formed on the insulating substrate 1 and the black matrix layer 5. The first conductive portion 7a may be formed on the insulating layer 11 as in the example of FIG. For this reason, the insulating base material 1, the black matrix layer 5, the insulating layer 11 and the like may all serve as the underlying layer of the copper wiring layer 10.
In addition, the protective layer is abbreviate | omitted in FIGS. In FIG. 1, the black matrix layer 5 is omitted.

According to the present invention, the copper wiring layer having a pattern is a laminate, and has the adhesion layer 2 on the underlayer side, and the laminate includes the adhesion layer, the copper layer, and indium zinc oxide from the underlayer side. A coating layer containing at least one of an object (IZO) and indium tin oxide (ITO) is provided in this order, and the adhesion layer, the copper layer, and the coating layer have the same pattern. Since the copper layer has an adhesion layer on the base layer side in the entire pattern of the copper wiring layer and the specific coating layer on the surface side, the copper layer is hardly oxidized even at high temperature heating, and Adhesiveness with the base layer is improved, and a stable copper wiring layer pattern can be obtained. Therefore, the copper wiring layer can be thinned, and as a result, the opening of the copper wiring layer in the active area can be increased, and the area of the inactive area can be reduced to increase the area of the active area. Thereby, visibility can be improved when the touch panel sensor of the present invention is used for a display device with a touch panel.
According to the present invention, the resistance of the wiring layer can be reduced by including the copper layer having a small specific resistance. Therefore, in the touch panel sensor of the present invention, the contact position can be detected with high sensitivity, and a larger display area can be secured in a display device of the same size by thinning the copper wiring layer.
Hereinafter, each component of the touch panel sensor of the present invention will be described in detail.

1. Wiring layer The wiring layer in the present invention is formed on the base layer and includes the copper wiring layer specified in the present invention. Here, “a wiring layer includes a copper wiring layer” means that at least a part of members constituting the wiring layer may be a copper wiring layer specified in the present invention.
The copper wiring layer specified in the present invention is a laminated body having a pattern, and the laminated body includes an adhesion layer, a copper layer, indium zinc oxide (IZO) and indium tin oxide from the base layer side. A coating layer containing at least one kind of material (ITO) is provided in this order, and the adhesion layer, the copper layer, and the coating layer have the same pattern.
The pattern refers to a wiring pattern in plan view of the copper wiring layer.
The adhesion layer, the copper layer, and the covering layer have the same pattern as long as the wiring pattern in plan view of each layer, that is, the pattern of wiring in plan view is the same. Each line width (XY plane direction in FIG. 1) of each pattern of the adhesion layer, the copper layer, and the coating layer in plan view does not need to be exactly the same.
For example, the line width of any layer may be relatively small in terms of manufacturing or function, and the line widths of the adhesion layer, the copper layer, and the coating layer are gradually increased in this order. It may be smaller or gradually smaller. Further, as shown in FIG. 6, the coating layer may be a coating layer that also covers the side surfaces of the adhesion layer and the copper layer. In this case, the line width in a plan view of the pattern of the coating layer is the adhesion layer. And larger than the line width of the copper layer.
Each line width in plan view of each pattern of the adhesion layer, the copper layer, and the coating layer in the laminate of the copper wiring layers in the present invention is 40% or more of the maximum width of the layer. Can be.

(1) Copper wiring layer The copper wiring layer used in the present invention is formed on a base layer and is a laminate having a pattern. The laminate includes an adhesion layer and a copper layer from the base layer side. And a coating layer containing at least one of indium zinc oxide (IZO) and indium tin oxide (ITO) in this order. In addition to the adhesion layer, the copper layer, and the coating layer, the laminate may further include other layers as long as the effect of the present invention is not impaired, but the adhesion layer, the copper layer, and the coating layer are Preferably, they are provided adjacent to each other.

(A) Adhesion layer If the adhesion layer used for the copper wiring layer of this invention is formed with the material which improves the adhesiveness of the copper layer in a copper wiring layer, you may use a well-known material.
The adhesion layer of the present invention is an adhesion layer containing at least one of indium zinc oxide (IZO) and indium tin oxide (ITO), and is excellent in adhesion even in a patterned thin wire layer. It is preferable from the point.
Conventionally, IZO and ITO can be the same as IZO and ITO known as transparent conductive materials.
When IZO and ITO are used as the adhesion layer, it is possible to perform etching simultaneously with the copper layer and the same etching solution. Therefore, there is no additional process when patterning the adhesion layer and the copper layer, and the copper wiring layer can be easily formed.

  What is necessary is just to adjust suitably the content rate of the sum total of IZO and ITO in a contact | adherence layer in the range which does not impair the effect of this invention. From the viewpoint of excellent adhesion with the underlayer and the copper layer, the total content of IZO and ITO is preferably 90% by mass or more, more preferably 95% by mass or more, based on the total amount of the adhesion layer. 99% by mass or more is even more preferable. The adhesion layer of the present invention is preferably composed of at least one of IZO and ITO, and more preferably composed of either IZO or ITO.

  Further, the thickness of the adhesion layer may be appropriately adjusted according to the application within a range not impairing the effects of the present invention, but is preferably 1 nm or more from the viewpoint of adhesion. Among these, from the viewpoint of adhesion, the thickness of the adhesion layer is preferably 3 nm or more, and more preferably 4 nm or more. The upper limit of the thickness of the adhesion layer is preferably 100 nm or less. It is more preferable that the thickness is 20 nm or less because it is sufficient if the thickness can be adhered. Moreover, since the thickness of a copper wiring layer will become thin if the thickness of a contact | glue layer is below the said upper limit, it is easy to form a more thin copper wiring layer.

(B) Copper layer The copper in the copper layer used for the copper wiring layer may be pure copper or a copper alloy within a range having conductivity. Moreover, the copper layer which comprises a copper wiring layer may consist of only one layer, and may be a laminated body of two or more layers. For example, in the copper layer, a pure copper layer and a copper alloy layer may be provided in this order adjacent to the adhesion layer, and a first copper alloy layer and a second copper alloy layer are provided in this order adjacent to the adhesion layer. Alternatively, a copper alloy layer and a pure copper layer may be provided in this order adjacent to the adhesion layer.
When the copper layer is composed of only one layer, the copper layer can be appropriately selected from a pure copper layer or a copper alloy layer having desired conductivity (hereinafter also referred to as a pure copper layer). . The copper layer preferably includes a pure copper layer from the viewpoint of conductivity. The copper wiring layer used in the present application is a laminate, and since the adhesion layer is provided on the underlayer side, the adhesion of the copper layer is improved, and the surface on the side opposite to the underlayer side is coated with an oxidation inhibitor. Since a layer is provided, even a pure copper layer can be suitably used.
In the copper alloy layer used for the copper wiring layer, elements other than copper are not particularly limited as long as they have conductivity, and examples thereof include nickel, manganese, and zinc.

  In the copper alloy layer used in the present invention, the copper content in the copper alloy is preferably 80 atomic% or more, more preferably 90 atomic% or more, from the viewpoint of excellent conductivity. It is more preferable that it is 99 atomic% or more. In addition, the ratio of the said copper and the ratio of each metal element mentioned later are the values obtained by analyzing the film | membrane component by a X ray photoelectron spectroscopy (XPS) method, etching to a depth direction by an ion sputtering method.

Specifically, in the copper wiring layer, the surface opposite to the underlayer is the outermost surface, and from the outermost surface to the underlayer side by ion sputtering (ion species Ar ⁺ (3.0 keV), etching range 2 mm square). While repeating etching, the photoelectrons were measured using an X-ray photoelectron spectrometer, and the elemental fraction (At%) of each metal element at each measurement point was determined from the ratio of each metal element, and the profile in the depth direction Get. Of the obtained profile in the depth direction, the area value (Y (xn) in the following formula (1)) is calculated for each metal element (x1, x2... Xn) for the portion corresponding to the copper alloy layer. And the element ratio of each metal element in the whole layer can be calculated | required by following formula (2). In the present invention, the interface between the copper alloy layer or the copper layer and the adhesion layer is defined as the last measurement point where the copper element ratio exceeds 20 at%. In the present invention, since the adhesion layer may be an extremely thin layer, it may not be sufficiently detected by this measurement method. In that case, the adhesion layer can be qualitatively confirmed by a transmission electron microscope (TEM).
As the X-ray photoelectron spectrometer, a Theta-Probe manufactured by Thermo Fisher Scientific Co., Ltd. can be used, and the incident X-ray can be measured by setting the aluminum Kα ray and the measurement region to 400 μmφ.

(In formula (1), t1 is the sputtering time corresponding to the outermost surface of the copper alloy layer, t2 is the sputtering time corresponding to the interface adjacent to the copper alloy layer and the other layer (pure copper layer or adhesion layer), f (T) represents the element fraction (At%) of the measurement target metal element x at the sputtering time t, and Y (xn) is the area value of the measurement target element x in the copper alloy layer)

  The thickness of the copper layer for ensuring conductivity is not particularly limited as long as it is appropriately adjusted depending on the application, but is preferably 10 nm to 1000 nm, and more preferably 20 nm to 900 nm. If the thickness of the copper layer is not less than the above lower limit, the conductivity is excellent. Moreover, since the thickness of a copper wiring layer will become thin if the thickness of a copper layer is below the said upper limit, it is easy to form a more thin copper wiring layer.

(C) Covering layer The copper wiring layer of the present invention is a laminated body having a pattern. On the surface side opposite to the base side of the copper layer, indium zinc oxide (IZO) and indium tin oxide (ITO) A coating layer containing at least one kind is provided.
The covering layer 4 is located on the surface side opposite to the base layer of the copper wiring layer than the copper layer 3, but covers only the upper surface of the copper layer 3 opposite to the base layer as shown in FIG. As shown in FIG. 6, the upper surface and side surfaces of the adhesion layer 2 and the copper layer 3 may be covered.
The covering layer 4 preferably covers at least 90 area% or more of the upper surface of the copper layer 3 opposite to the base layer, more preferably 95 area% or more, and even more preferably 99 area% or more. .

As the IZO and ITO used for the coating layer, the same conventional IZO and ITO as transparent conductive materials can be used as in the adhesion layer.
What is necessary is just to adjust suitably the content rate of the sum total of IZO and ITO in a coating layer in the range which does not impair the effect of this invention. From the viewpoint of excellent heat resistance and oxidation resistance of the copper layer, the total content of IZO and ITO is preferably 90% by mass or more, more preferably 95% by mass or more based on the total amount of the coating layer. 99% by mass or more is even more preferable. The coating layer of the present invention is preferably composed of at least one of IZO and ITO, and more preferably composed of either IZO or ITO.

  When the same constituent material as that of the adhesion layer is used as the constituent material of the coating layer, it becomes easy to simultaneously etch the adhesion layer, the copper layer, and the coating layer with the same etching solution. Therefore, there is no additional process when patterning the coating layer, and the copper wiring layer can be easily formed. For example, when the adhesion layer / copper layer / coating layer is an IZO layer / copper layer / IZO layer or an ITO layer / copper layer / ITO layer, three layers can be etched simultaneously with the same etching solution. This is preferable from the viewpoint of high productivity.

  Moreover, the thickness of the coating layer may be appropriately adjusted according to the application within a range not impairing the effects of the present invention, but is preferably 5 nm or more from the viewpoint of heat resistance and oxidation resistance. Among these, from the viewpoint of heat resistance and oxidation resistance, the thickness of the coating layer is preferably 10 nm or more, and more preferably 20 nm or more. The upper limit of the thickness of the coating layer is preferably 100 nm or less. A thickness of 60 nm or less is more preferable because a thickness that can impart heat resistance and oxidation resistance is sufficient. Moreover, since the thickness of a copper wiring layer will become thin if the thickness of a coating layer is below the said upper limit, it is easy to form a more thin copper wiring layer.

In the present invention, the line width of the copper wiring layer is not particularly limited, and may be appropriately designed according to the application. The line width of the copper wiring layer provided on the transparent electrode is preferably 10 μm or less, preferably 1 μm or more and 5 μm or less from the viewpoint of improving the visibility of the display by reducing the visibility of the copper wiring layer itself. Even more preferred.
Moreover, the line width of the copper wiring layer used for the lead-out wiring layer or the like can be set to 2 μm to 100 μm, for example. The line width of the copper wiring layer used for the lead-out wiring layer or the like is preferably thinner, preferably 20 μm or less, from the viewpoint that the area of the inactive area can be reduced to increase the area of the active area. It is more preferable that

Moreover, when making a transparent electrode into the electroconductive metal pattern as described in Unexamined-Japanese-Patent No. 2014-203260 etc., the said electroconductive metal pattern is made into the contact | adherence layer 2, the copper layer 3, and the coating layer 4 of this invention, for example. You may form using a copper wiring layer provided with this order. In this case, the line width of the copper wiring layer is preferably 10 μm or less, more preferably 5 μm or less from the viewpoint of improving the visibility of the display, and further, it is excellent in conductivity and stably has fine wires. From the point of forming, it is still more preferable that it is 1 to 3 μm. In addition, the line width of a copper wiring layer means the line width of planar view.
Since the copper wiring layer of the present invention is a laminate and has the adhesion layer and the coating layer, even if it is such a thin wire, it has excellent heat resistance and good adhesion.

Moreover, in the copper wiring layer of this invention, it is excellent in adhesiveness and electroconductivity, and since it is excellent also in visibility, the line | wire width of the contact | adherence layer represented by following formula (3) and the copper layer adjacent to this is represented. The variation is preferably within ± 60%, and preferably within ± 40%. When the variation represented by the formula (3) is positive, the line width of the copper layer is larger than the line width of the adhesion layer. Therefore, if the variation is too large, the adhesion may be lowered. On the other hand, when the variation represented by the expression (3) is negative, the line width of the adhesion layer is larger than the line width of the copper layer. Therefore, if the variation is too large, thinning of the copper layer is hindered as a result. It is done. In the present invention, the line width of the adhesion layer is the line width of the surface of the adhesion layer opposite to the copper layer, that is, the line width of the portion adjacent to the base layer, and the line width of the copper layer is the adhesion layer of the copper layer. And the line width on the opposite surface.
Formula (3): (Line width of the copper layer−line width of the adhesion layer) / line width of the adhesion layer × 100 (%)

Moreover, in the copper wiring layer of this invention, from the point which is excellent in heat resistance, oxidation resistance, and electroconductivity and is excellent in visibility, the coating layer represented by following formula (4) and the copper layer adjacent to this The line width variation is preferably within ± 60%, more preferably within ± 40%. When the variation represented by formula (4) is positive, the copper layer has a larger line width than the coating layer, and if the variation is too large, the heat resistance and oxidation resistance may decrease. is there. On the other hand, when the variation represented by the formula (4) is negative, the line width of the coating layer is larger than the line width of the copper layer. It is done. In the present invention, the line width of the coating layer is the line width on the surface opposite to the copper layer of the coating layer, that is, the line width on the surface side of the copper wiring layer, and the line width of the copper layer is the same as that of the adhesion layer of the copper layer. The line width on the opposite surface, that is, the line width on the coating layer side surface of the copper layer.
Formula (4): (Line width of copper layer−line width of coating layer) / line width of coating layer × 100 (%)

(2) Wiring layer The wiring layer in this invention is a member which has the electroconductivity which the electricity as a power supply or an electric signal transmits. Examples of the wiring layer include a sensor electrode, a conductive portion, a lead-out wiring layer, an external connection terminal, and the like. Among these wiring layers, it is preferable that at least a part of the conductive portion, the lead-out wiring layer, and the external connection terminal is the copper wiring layer including the adhesion layer, the copper layer, and the coating layer in this order.

(A) Sensor electrode The sensor electrode in the present invention includes a first electrode and a second electrode insulated from the first electrode, is formed in the active area, and is used for detecting a contact position. In addition, the 2nd electrode insulated from the 1st electrode means that both electrodes are not electrically connected.

  When the sensor electrode is not the copper wiring layer, a transparent electrode made of a transparent conductive material can be used. Specific examples of the transparent conductive material used for forming the sensor electrode include indium tin oxide, zinc oxide, indium oxide, antimony-added tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, potassium-added zinc oxide, Silicon-doped zinc oxide, metal oxides such as zinc oxide-tin oxide system, indium oxide-tin oxide system, zinc oxide-indium oxide-magnesium oxide system, and materials in which two or more of these metal oxides are combined are used. Can be mentioned. Moreover, a non-transparent conductive material can also be used for a sensor electrode, As a non-transparent conductive material, the thing as described in Unexamined-Japanese-Patent No. 2010-238052 etc. can be used, for example. Specifically, metals such as aluminum, molybdenum, silver, and chromium, and alloys thereof can be used.

  As the planar view shape and the planar view outer peripheral shape of such a sensor electrode, JP 2011-210176 A, JP 2010-238052 A, JP 4610416 A, JP 2010-286886 A, and JP 2004. -192093, Japanese Patent Application Laid-Open No. 2010-277392, Japanese Patent Application Laid-Open No. 2011-129501, and the like.

  Examples of the planar shape of the sensor electrode in the present invention include those having an opening formed in a planar shape or mesh shape not including the opening. In addition, when a sensor electrode is formed in the said copper wiring layer provided with the contact | adherence layer, the copper layer, and the coating layer in this order, it is preferable that it is mesh shape. This is because the visibility when the touch panel sensor of the present invention is used in a display device with a touch panel can be improved.

  When the sensor electrode has a mesh shape, the aperture ratio of the sensor electrode varies depending on the type of the touch panel sensor of the present invention, but is preferably 90% or more, and more preferably 93% or more. It is preferable that it is 95% or more especially. This is because when the touch panel sensor of the present invention is used in a display device with a touch panel sensor, the touch panel sensor can have excellent visibility. Note that the aperture ratio of the sensor electrode refers to the ratio of the area of the opening to the area of the sensor electrode.

  Further, the line width of the sensor electrode in the case where the sensor electrode is mesh-shaped is not particularly limited as long as the contact position can be accurately detected, but is preferably 10 μm or less, and more preferably 5 μm or less. Preferably, it is 1 μm or more and 3 μm or less. This is because when the touch panel sensor of the present invention is used in a display device with a touch panel, the visibility of information displayed on the display device can be improved.

  Moreover, as a planar view outer periphery shape of a sensor electrode, polygonal shapes, such as planar view substantially square shape, are mentioned, for example.

As a formation location with respect to the insulation base material of the 1st electrode and 2nd electrode in this invention, when the touch panel sensor of this invention is used for the display apparatus with a touch panel, it forms in the active area of an insulation base material, and both are insulated. There is no particular limitation as long as it is formed as described above. For example, as illustrated in FIG. 4 described above, both may be formed on one surface of the same insulating substrate, and as illustrated in FIG. 7, on different insulating substrates. It may be formed, may be formed via an insulating layer as illustrated in FIG. 8, and further, one of the same insulating base materials as illustrated in FIG. It may be formed respectively on the surface and the other surface.
Moreover, about the code | symbol in FIGS. 7-9, since it shows the member same as FIGS. 1-4, description here is abbreviate | omitted.

(B) Conductive part The conductive part in this invention contains the 1st conductive part and 2nd conductive part which connect between the 1st electrodes which comprise the said sensor electrode, and between 2nd electrodes, respectively. In addition, the first conductive part and the second conductive part are usually formed so that a part thereof overlaps in plan view.

When the conductive part is not the copper wiring layer, the material of the conductive part is not particularly limited as long as it has conductivity, and can be the same as the sensor electrode described above.
Moreover, the planar view shape of an electroconductive part can be made into the same shape as a conventionally well-known touch panel sensor.

The locations where the first conductive portion and the second conductive portion are formed are particularly limited as long as the first conductive portion and the second conductive portion can be stably connected to each other and are formed so as to be insulated from each other. Is not to be done. For example, when the first electrode and the second electrode are formed on different surfaces or different members as shown in FIGS. 7 to 9, the first conductive portion and the second conductive portion are respectively It is formed on the same surface as the first electrode and the second electrode.
When both the first electrode and the second electrode are formed on one surface of the same insulating base material, the first conductive portion and the second conductive portion are formed via an insulating layer. .

(C) Extraction wiring layer The extraction wiring layer in this invention is connected to a sensor electrode.
As the location where the lead-out wiring layer is formed, it is appropriately set according to the type and application of the touch panel sensor of the present invention, but when the touch panel sensor of the present invention is used in a display device with a touch panel, It is formed in an inactive area. It is also a preferred aspect that the extraction wiring layer is formed on a black matrix. The copper wiring layer of the present invention is suitably used as a lead-out wiring layer because it has excellent adhesion even when formed on a black matrix.

When the extraction wiring layer is not the copper wiring layer, the conductive material used for forming the extraction wiring layer is, for example, silver, gold, chromium, platinum, aluminum alone, or an alloy mainly composed of any of these. Etc. As the metal alloy, APC, that is, silver / palladium / copper alloy is generally used. Further, as the metal composite, MAM (Mo—Al—Mo, that is, a three-layer structure of molybdenum, aluminum, and molybdenum) can be used.
The line width of the extraction wiring layer can be set to, for example, about 2 μm to 100 μm.

(D) External connection terminal The external connection terminal in the present invention is connected to the lead-out wiring layer and used for connection to a flexible printed wiring board or the like.
The location of the external connection terminal and the material of the external connection terminal when the external connection terminal is not the copper wiring layer can be the same as those of the extraction wiring layer described above.

  The terminal width, thickness and plan view shape of the external connection terminals, and the interval between the external connection terminals in the external connection terminal portion can be the same as those of a general touch panel sensor. Specifically, it can be the same as that described in JP 2011-210176 A.

2. Underlayer In the underlayer in the present invention, a copper wiring layer is formed adjacent to the underlayer. Examples of such a base layer include an insulating base layer, an insulating layer, and an insulating base layer such as a black matrix layer. The underlayer may be a single layer or a laminate of a plurality of layers. As a base layer laminated in a plurality of layers, for example, in a base layer in which a black matrix layer is formed on a part of an insulating base material, an insulating material on which the black matrix layer on the insulating base material is not formed The case where a copper wiring layer is formed on a base material is mentioned.
Hereinafter, the underlayer will be described.

(1) Insulating base material When the base layer in the present invention is an insulating base material, examples of the copper wiring layer formed on the insulating base material include a conductive portion, a lead-out wiring layer, and an external connection terminal.

The insulating substrate supports the wiring layer and the like. The material constituting the insulating base is not particularly limited as long as it has insulating properties, and may be a material having transparency or a material having non-transparency. When the touch panel sensor of the present invention is used for a display device with a touch panel, the insulating base material is preferably a transparent base material made of a material having transparency. This is because excellent visibility can be obtained.
In the present invention, the terms “transparent” and “transparency” mean that an operator of a display device with a touch panel using the touch panel sensor of the present invention is not visually recognized from the operation surface unless otherwise specified. There is no transparency. Therefore, it includes colorless and transparent and colored transparency that does not impede visibility, is not defined by strict transmittance, and can be appropriately determined according to the use of the touch panel sensor. As the transparent substrate, for example, a substrate having a total light transmittance (according to JIS K7361-1) in the visible light wavelength region of 85% or more is preferable.

  In addition to general soda lime glass, the materials constituting the insulating substrate include inorganic materials such as chemically reinforced soda lime glass and chemically reinforced aluminosilicate glass; polyester resins such as polyethylene terephthalate (PET), acrylic Resin materials such as polycarbonate resin and polycarbonate. When the inorganic material is selected, it is possible to increase the strength of the touch panel sensor and widen the setting range of manufacturing conditions such as heating temperature. On the other hand, when a resin material is selected, the touch panel sensor can be reduced in weight, and flexibility can be imparted to the touch panel sensor.

The thickness of the insulating substrate is not particularly limited as long as it can stably support the copper wiring layer and the like, and is appropriately selected depending on the material. For example, when the insulating substrate is made of an inorganic material such as glass, it is preferably within a range of 0.3 mm to 1.5 mm. Moreover, when an insulating base material consists of resin materials, it is preferable that it is a film form which has flexibility, and specifically, it is preferable to set it as the range of 25 micrometers-300 micrometers.
In addition, as a form of an insulating base material, the film form which has flexibility may be sufficient, and plate shape may be sufficient.

The insulating substrate may be a single layer or a plurality of layers.
In addition, as a layer laminated | stacked when the said insulating base material consists of multiple layers, a hard-coat layer, an adhesion adjustment layer, a low-refractive-index layer, a high-refractive-index layer, etc. other than the layer which consists of the said material are mentioned. it can.

(2) Insulating layer When the base layer in the present invention is an insulating layer, examples of the copper wiring layer formed on the insulating layer include a conductive portion.

  The insulating layer is formed to prevent a short circuit between the first electrode and the second electrode constituting the sensor electrode or between the first conductive portion and the second conductive portion. The material for forming the insulating layer is not particularly limited as long as it has a desired insulating property, and any of a thermoplastic resin, a thermosetting resin, and a photocurable resin can be suitably used. . Among these, a cured product of a photocurable resin is preferable from the viewpoint of excellent moldability and mechanical strength. Especially, it is preferable that it is a hardened | cured material of the resin composition containing at least 1 type chosen from the group which consists of an acrylate type, an epoxy type, and a polyester type photocurable resin.

  The location where the insulating layer is formed can be general to the touch panel sensor and is not particularly limited. When both the first electrode and the second electrode constituting the sensor electrode are formed on one surface of the same insulating base material, for example, the insulating layer 11 as shown in the example of FIG. 2 has the first electrode 6a. , Formed between the second electrode 6b and the second conductive portion 7b and the first conductive portion 7a, and having a conductive hole 12 for connecting the first conductive portion 7a and the first electrode 6a. It may be a hall type. Further, as shown in the examples of FIGS. 10 to 11, an island type in which the second conductive portion 7 b is formed in an island shape via the insulating layer 11 on the first conductive portion 7 a made of a copper wiring layer. Also good. 10 and FIG. 11 correspond to the schematic cross-sectional view taken along the line A-A ′ and the schematic cross-sectional view taken along the line B-B ′ of FIG. 1 in the same manner as FIGS. 2 and 3 described above.

  The thickness of the insulating layer is not particularly limited as long as it can prevent a short circuit between the first electrode and the second electrode or between the first conductive part and the second conductive part. Can be general. For example, it can be in the range of 0.5 μm to 3.0 μm.

  The method for forming the insulating layer is not particularly limited as long as the insulating layer can be formed with high accuracy, and a method of applying the insulating layer forming material to the substrate surface and then patterning by a photolithography technique. Alternatively, a method of forming by a printing method such as screen printing can be given. It is also possible to process a film or sheet that exhibits insulating properties, appropriate light transmission properties, and optical isotropy into a desired shape, and can be laminated on a predetermined substrate surface as an insulating film. .

(3) Black matrix layer In this invention, a black matrix layer is a layer which has light-shielding property. When used as a base layer of the copper wiring layer, the black matrix layer can be appropriately selected from conventionally known black matrix layers having insulating properties. In the present invention, since the copper wiring layer has excellent conductivity and can be thinned, for example, an in-cell type touch sensor in which a copper wiring layer is provided on a patterned black matrix layer for a color filter. It is also applicable to.

  The black matrix layer preferably includes a resin and a black pigment, and among them, a cured product of a photocurable resin and a black pigment are preferable because of excellent moldability and mechanical strength. The same photocurable resin as that for the insulating layer can be selected and used. As the black pigment, a known black pigment may be appropriately selected and used, and examples thereof include black organic pigments, mixed color organic pigments, and inorganic pigments.

  The thickness of the black matrix layer is not particularly limited. From the point of light-shielding property, 0.5-5 micrometers is preferable and 1-3 micrometers is more preferable.

[Method for manufacturing touch panel sensor]
In the present invention, the touch panel sensor manufacturing method is not particularly limited as long as it can form the copper wiring layer having a pattern including the adhesion layer, the copper layer, and the coating layer in this order on the base layer. .
From the viewpoint of improving the adhesion between the underlayer and the copper wiring layer, it is preferable that the adhesion layer and the copper layer are sequentially formed on the underlayer, and the adhesion layer and the copper layer are etched at a time. That is, in the present invention, a method for manufacturing a touch panel sensor, which includes a step of sequentially laminating an adhesion layer and a copper layer on a base layer and simultaneously etching the adhesion layer and the copper layer is preferable. Furthermore, from the point of productivity, the manufacturing of the touch panel sensor includes a step of sequentially laminating an adhesion layer, a copper layer, and a coating layer on the base layer, and simultaneously etching the adhesion layer, the copper layer, and the coating layer. The method is preferred.
In addition, the manufacturing method of the said touch panel sensor may have another process in the range which does not impair the effect of this invention. Hereinafter, a preferable method for manufacturing a touch panel sensor will be described.

  FIG. 12 is a process diagram illustrating an example of a method for manufacturing a touch panel sensor. First, the black matrix layer resin composition is applied to one surface of the insulating base material in a pattern, or applied to the entire surface and developed into a desired pattern by a known method. 5 is formed (FIG. 12A). Next, although not shown, a laminated body in which a transparent electrode layer made of a transparent conductive material such as ITO is laminated on one surface of an insulating base material by sputtering, and a resist is formed in a desired pattern on the laminated body. After the formation, the transparent electrode layer is etched using iron chloride or the like using the resist as a mask, and the resist is peeled off, so that the first electrode 6a is formed on the insulating substrate 1 as illustrated in FIG. Then, a second electrode (not shown) and a second conductive portion 7b are formed. The first electrode 6a, the second electrode, and the second conductive portion 7b are transparent electrodes made of a transparent conductive material. Next, as shown in FIG. 12C, an insulating layer forming layer 11a is formed, exposed and developed using a mask, and the insulating layer 11 having conductive holes 15 as shown in FIG. Form. Thereafter, as shown in FIG. 12 (e), the adhesion layer 2a is formed on the insulating base material 1 on which the first electrode 6a, the second electrode, the second conductive portion 7b, and the insulating layer 11 made of a transparent electrode are formed. The copper layer 3a and the coating layer 4a are sequentially laminated. Next, as shown in FIG. 12 (f), a resist 16 is formed in a desired pattern on the laminate, and the adhesion layer 2a, the copper layer 3a, and the coating layer 4a are etched 17 to obtain FIG. As shown in (g), the adhesion layer 2, the copper layer 3, and the coating layer 4 which have the same pattern by planar view are obtained. As the etching, simultaneous etching may be performed using the same etching solution, or sequential etching may be performed using two or more kinds of etching solutions according to the material. Thereafter, as shown in FIG. 12H, the touch panel sensor 20 can be obtained by forming the protective layer 13 so as to cover the first electrode 6a and the second electrode.

FIG. 13 is an enlarged view of a part of a process diagram showing an example of a method for manufacturing a touch panel sensor in the case where the covering layer 4 also covers the side surfaces of the adhesion layer 2 and the copper layer 3 as shown in FIG. It is.
In FIG. 12E, the same pattern as shown in FIG. 13A is obtained in the same manner as in FIGS. 12A to 12G except that the coating layer 4a is not laminated. A laminate including the adhesion layer 2 and the copper layer 3 in this order is obtained. Next, as shown in FIG. 13 (b), the base layer (insulating layer 11), the adhesion layer 2 having the same pattern in plan view, and the laminated body provided with the copper layer 3 in this order are covered. Layer 4a is laminated.
Next, as shown in FIG. 13 (c), the line width of the pattern of the stacked body is increased so as to cover the side surface on the stacked body of the adhesion layer 2 and the copper layer 3 having the same pattern in plan view. Then, a resist 16 is formed, and the coating layer 4a is etched 17. As a result, as shown in FIG. 13D, the coating layer 4 covers the side surfaces of the adhesion layer 2 and the copper layer 3, and has the adhesion layer 2 having the same pattern in plan view, the copper layer 3, and the coating. Layer 4 is obtained.

A method for sequentially laminating the adhesion layer, the copper layer, and the coating layer on the base layer is not particularly limited, and examples thereof include a vapor deposition method, a sputtering method, and a chemical vapor deposition (CVD) method. The formation method of the adhesion layer, the copper layer, and the coating layer may be the same or different.
The resulting laminate of the adhesion layer, the copper layer, and the coating layer, or the laminate of the adhesion layer and the copper layer is then subjected to an etching process to form a desired pattern. The etching method may be appropriately selected from conventionally known methods, and among these, a wet etching method using an etching solution is preferable.
As an etchant used for etching, it is preferable to select and use an etchant that can etch the adhesion layer, the copper layer, and the coating layer. Specific examples include a phosphorous nitric acid aqueous solution containing phosphoric acid, nitric acid, and acetic acid, a system in which an oxidizing agent represented by hydrogen peroxide and sulfuric acid is mixed, hydrobromic acid, hydrohalic acid, and the like. For example, when the adhesion layer and the coating layer are IZO layers, the adhesion layer, the copper layer, and the coating layer can be simultaneously etched, for example, with the phosphorous acid solution. For example, when the adhesion layer and the coating layer are ITO layers, the adhesion layer, the copper layer, and the coating layer can be simultaneously etched with, for example, an aqueous hydrogen peroxide solution.

  In the present invention, in order to form a desired touch panel sensor, before forming the copper wiring layer, a desired transparent conductive layer, black matrix layer, insulating layer, etc. are formed on an insulating substrate, A stratum may be prepared.

  The method for forming the transparent conductive layer on the insulating substrate is not particularly limited, and a conventionally known method can be appropriately selected and used. For example, a vapor deposition method, a sputtering method, a chemical vapor deposition (CVD) method, etc. are mentioned. The transparent conductive layer obtained by the method is usually subjected to an etching process in order to obtain a desired pattern. The etching method may be appropriately selected from conventionally known methods, and may be a wet etching method using an etchant or a dry etching method.

  The formation method of an insulating layer and a black matrix layer is not specifically limited, A conventionally well-known method can be selected suitably and can be used. When forming an insulating layer thru | or a black matrix layer using the composition containing the said ionizing radiation curable resin, it can form by printing the said resin composition in a desired pattern shape, and hardening | curing by light irradiation. .

  Further, after the copper wiring layer is formed, a protective layer (insulating layer) for protecting the copper wiring layer may be further formed.

B. Touch Panel Module A touch panel module according to the present invention includes the touch panel sensor according to the present invention and a printed wiring board connected to the touch panel sensor.

  Such a touch panel module will be described with reference to the drawings. FIG. 14 is a schematic cross-sectional view showing an example of the touch panel module of the present invention. A touch panel module 50 of the present invention shown in FIG. 14 has the touch panel sensor 20 and a printed wiring board 51 connected to the touch panel sensor 20, and further has an overcoat layer 52 and a cover lens 53 on the touch panel sensor 20. It is what has.

  According to the present invention, by having the touch panel sensor according to the present invention described above, the copper wiring layer should have low resistance, high heat resistance and high oxidation resistance, and good adhesion to the base layer. Can do.

The touch panel module of the present invention has at least a touch panel sensor and a printed wiring board. Moreover, the touch panel module of this invention has a cover lens normally. In the touch panel module, the insulating base material constituting the touch panel sensor may also serve as a cover lens, and the cover lens may be separately disposed on the touch panel sensor. When the cover lens is separately provided on the touch panel sensor, an overcoat layer is formed between the touch panel sensor and the cover lens.
Hereinafter, each structure of the touch panel module of this invention is demonstrated in detail.
The touch panel sensor according to the present invention can be the same as the content described in the section “A. Touch panel sensor”, and thus the description thereof is omitted here.

1. Printed wiring board The printed wiring board used in the present invention is connected to the touch panel sensor. In the present invention, the printed wiring board may be rigid or a flexible printed wiring board.

  A touch panel drive driver IC that drives the touch panel is connected to the printed wiring board, and supplies power to the electrodes, outputs detection signals, and the like. Such printed wiring boards are described in JP 2009-64343 A, JP 9-146680 A, JP 2587975, JP 2011-124332 A, JP 2011-76514 A, and the like. Such a touch panel can be generally used. When it is set as a reflexible printed wiring board, what has a back side connection terminal formed on the front side connection terminal formed on one surface and the other surface as a connection terminal, for example is mentioned.

  The flexible substrate is not particularly limited as long as it has a desired insulating property, and examples thereof include a flexible polyimide film having a thickness of about 25 μm.

  Further, the connection terminal is not particularly limited as long as it has desired conductivity. For example, the connection terminal can be the same as the external connection terminal in the touch panel sensor.

The flexible printed wiring board according to the present invention includes the flexible substrate and the connection terminal, but may have other configurations as necessary.
Examples of such other configurations include a wiring connected to the connection terminal and a protective layer formed so as to cover the wiring. In addition, when the input information processing unit or the touch panel module of the present invention is used in a display device with a touch panel, a control unit such as a video information processing unit may be included.
The wiring can be the same as the extraction wiring layer. In addition, the protective layer is not particularly limited as long as it has insulating properties, and examples thereof include those made of polyimide resin.
Further, the connection method of the flexible printed wiring board with the touch panel sensor is not particularly limited as long as it is a method capable of electrically connecting both, but for example, an external connection formed on the touch panel sensor. An anisotropic conductive film as disclosed in JP 2010-278025 A is disposed between the terminal and the connection terminal formed on the flexible printed wiring board, and a method of thermocompression bonding can be exemplified. .

2. Overcoat layer The overcoat layer in this invention is formed on one surface of the said touch panel sensor, and adhere | attaches the said touch panel sensor and a cover lens.

  Such an overcoat layer is not particularly limited as long as it can adhere the touch panel sensor and the cover lens with a desired adhesive force, and preferably has transparency. This is because when the touch panel module of the present invention is used in a display device with a touch panel, the touch panel module can be excellent in visibility.

  Moreover, as a material of the said overcoat layer, what is generally used for the touchscreen disclosed by Unexamined-Japanese-Patent No. 2009-37312 etc. can be used, For example, reactivity of an acrylate type, a methacrylate type, etc. Examples thereof include those made of a curable resin such as a photocurable resin having a vinyl group, acrylic pressure-sensitive adhesives, optical transparent double-sided tapes (OCA (Optical Clear Adhesive) tapes), and the like. In the present invention, an acrylic material can be preferably used. It is because it can be made excellent in adhesiveness and transparency by being an acrylic adhesive or OCA using an acrylic material.

  The thickness of the overcoat layer is not particularly limited as long as the touch panel sensor and the cover lens can be bonded with a desired adhesive force, and can be, for example, in the range of 1 μm to 500 μm. It is preferably within the range of 20 μm to 500 μm. It is because it can be made excellent in transparency.

  The overcoat layer is not particularly limited as long as it can adhere both the touch panel sensor and the cover lens with a desired adhesive force. Alternatively, it may be formed in a pattern only in the inactive area outside the active area.

3. Cover Lens The cover lens in the present invention protects the touch panel sensor from scratches and the like.

  The material constituting such a cover lens is not particularly limited as long as it can have a desired protective property, such as chemically tempered glass, soda glass, quartz glass, and alkali-free glass. Glass, polycarbonate, polyacrylic acid ester, polymethacrylic acid ester and other resins, and other inorganic materials.

  The cover lens in the present invention may be non-transparent, but is preferably transparent when the touch panel module of the present invention is used in a display device with a touch panel.

  The thickness of the cover lens is not particularly limited as long as a desired protective property can be exhibited, and is appropriately set according to the material constituting the cover lens.

  The cover lens may be composed of a single layer made of the above material, or may be a laminate of a plurality of layers. As what consists of a plurality of layers, for example, those obtained by laminating layers made of different materials among the above materials, and those having a functional layer such as an antireflection layer or an antifouling layer in addition to the layers made of the above materials Can be mentioned. Moreover, when a cover lens consists of glass, you may have a scattering prevention film on the surface side as a functional layer.

A conventionally well-known thing can be suitably selected for the other structure of a touch panel module.
The touch panel module of the present invention can be suitably used for various devices such as ticket machines, ATM devices, mobile phones, game machines, notebook computers, and the like in which display devices such as liquid crystal displays and plasma displays are incorporated.

C. Color filter with touch panel sensor The color filter with touch panel sensor according to the present invention is:
A touch panel sensor according to the present invention, comprising a transparent base material, and a black matrix layer provided on the upper side or the lower side of the transparent base material;
And a colored layer provided on the surface of the transparent substrate of the touch panel sensor on which the black matrix layer is provided.

Such a color filter with a touch panel sensor will be described with reference to the drawings. FIG. 15 is a schematic plan view showing an example of a color filter with a touch panel sensor of the present invention.
A color filter 40 with a touch panel sensor of the present invention shown in FIG. 15 includes a touch panel sensor 20 including a transparent base material 22 and a black matrix layer 23 provided on the upper side of the transparent base material 22, and a transparent base of the touch panel sensor 20. It has the colored layer 28 (28 (R), 28 (G), 28 (B)) provided in the surface in which the black matrix layer 23 of the material 22 was provided. The black matrix layer 23 of the touch panel sensor 20 has an opening through which the glass substrate 22a is exposed, and a plurality of types of colored layers 28 (28 (R (R)) are covered so that a predetermined opening (22a in FIG. 15) is covered. ), 28 (G) 28 (B)).

FIG. 16 is a process diagram showing an example of a method for manufacturing the color filter 40 with a touch panel sensor of the present invention in the example of FIG. First, the black matrix layer resin composition is applied to one surface of the transparent substrate 22 in a pattern, or in a plan view by a known method such as application to the entire surface and development to a desired pattern. The black matrix layer 23 is formed in a pattern having an opening (22a in FIG. 15) of the transparent substrate (FIG. 16 (a)).
Next, the adhesion layer 2a, the copper layer 3a, and the coating layer 4a are sequentially laminated on the black matrix layer 23. Next, as described above, a resist is formed in a desired pattern on the laminate, and the adhesion layer 2a, the copper layer 3a, and the coating layer 4a are etched, so that a plan view as shown in FIG. A copper wiring layer 27 including the adhesion layer 2, the copper layer 3, and the coating layer 4 having the same pattern in this order is obtained (FIG. 16B). The copper wiring layer 27 functions as a first electrode and an extraction wiring layer.
Next, a plurality of types of colored layers 28 (28 (R), 28 (G) 28 are provided so that a predetermined opening (22a in FIG. 15) of the black matrix layer 23 is covered on the surface on which the black matrix layer 23 is provided. (B)) is formed (FIG. 16C).
Next, it is preferable to further form an overcoat layer 29 on the surface provided with the colored layer 28 (FIG. 16D). Further, it is preferable to further form a photo spacer 30 on the overcoat layer 29 on the surface provided with the colored layer 28 (FIG. 16E). The photo spacer is preferably provided so as to overlap the black matrix when viewed from the normal direction of the transparent substrate 22.
Furthermore, the patterned transparent electrode layer 31 is appropriately formed on the lower side of the transparent substrate 22, that is, the side opposite to the side where the colored layer 28 is provided, and the second electrode of the touch panel sensor is formed. Thus, the color filter 40 with a touch panel sensor can be obtained (FIG. 16F).

  According to the color filter with a touch panel sensor of the present invention, by having the touch panel sensor according to the present invention described above, the copper wiring layer has a low resistance, a high heat resistance and a high oxidation resistance, and has an adhesiveness with the base layer. It can be good.

  The color filter with a touch panel sensor of the present invention has at least a color layer of the touch panel sensor and the color filter. The black matrix layer for forming the opening of the colored layer of the color filter is provided on the upper side or the lower side of the transparent substrate, and is included in the base layer of the copper wiring layer of the touch panel sensor 20. Alternatively, a black matrix layer may be provided on the surface of the transparent substrate included in the touch panel sensor 20 on the side opposite to the surface on which the copper wiring layer is provided.

  In the color filter with a touch panel sensor of the present invention, preferably, as shown in FIG. 15, the wiring layer 27 including a copper wiring layer is seen from the normal direction of the transparent substrate 22 of the color filter 40 with a touch panel sensor. The black matrix is preferably provided so as to overlap the black matrix. Thereby, the display of the display device using the color filter with the touch panel sensor is not hindered and becomes good.

Hereinafter, each structure of the color filter with a touch panel sensor of this invention is demonstrated in detail. The color filter with a touch panel sensor of the present invention may further include a known configuration that the touch panel sensor and the color filter may have.
In addition, about the touch panel sensor in this invention, if it selects suitably so that a transparent base material and the black matrix layer provided in the upper side or the lower side of the said transparent base material may be included, the term of said "A. touch panel sensor". Therefore, the description is omitted here.

1. Colored layer
The colored layer used in the present invention is provided on the surface of the transparent substrate of the touch panel sensor on which the black matrix layer is provided, and usually has a plurality of colored layers.

  The color layers of the plurality of colors are not particularly limited as long as they can produce a desired color when the color filter with a touch panel sensor of the present invention is used in a display device, and are used for general color filters. A colored layer of each color can be used. Usually, three colored layers of a red colored layer, a green colored layer, and a blue colored layer are used.

  The colored layers of a plurality of colors are usually formed in a pattern so that the colored layers are regularly arranged. The arrangement pattern of the colored layers of multiple colors is not particularly limited as long as it can form a wiring layer on the black matrix layer that defines the arrangement pattern, and a general arrangement pattern should be applied. Can do. Examples of the arrangement pattern include a stripe type, a mosaic type, a triangle type, and a four-pixel arrangement type. Further, the area of each colored layer is not particularly limited, and is appropriately adjusted according to the resolution of the display device in which the color filter with a touch panel sensor of the present invention is used.

  The material for the colored layer is the same as that used for the colored layer of a general color filter. For example, a resin material containing a colorant can be used.

  The thickness of the colored layer is not particularly limited as long as a good image display can be performed when the color filter with a touch panel sensor of the present invention is used in a display device. Specifically, the thickness is 1 μm to 3 μm. It can be set within the range.

  The method for forming the colored layer is not particularly limited as long as it can form a colored layer having a desired thickness without mixing colors. For example, a known method such as a photolithography method or an inkjet method is used. Can do.

2. Other Configurations The color filter with a touch panel sensor of the present invention only needs to have the touch panel sensor of the present invention and a colored layer, and may have other members as necessary. Other members are appropriately selected according to the use of the color filter with a touch panel sensor of the present invention, and examples thereof include an overcoat layer, a transparent electrode layer, a photo spacer, and an alignment film. Since these members are the same as those of a general color filter, description thereof is omitted here.

Hereinafter, the present invention will be specifically described with reference to examples. These descriptions do not limit the present invention.
[Example 1: Production of touch panel sensor]
(1) Formation of black matrix layer
A black matrix forming resin composition containing carbon black and a bisphenol fluorene epoxy acrylate adduct is applied onto a soda lime glass substrate having a thickness of 0.5 mm and 150 mm square, dried, and then subjected to pattern exposure. By development, a black matrix layer having a thickness of 1.3 μm and having openings was formed. The opening was formed to be the active area 12 of FIG. 1 (see FIGS. 1 and 12A).
(2) Formation of transparent electrode layer An ITO layer was formed on the entire surface of the glass substrate by a DC magnetron sputtering method on the surface side of the obtained glass substrate having the black matrix layer. Next, a resist coating film was formed in a sensor electrode pattern, and the ITO layer was etched with 47% hydrobromic acid (etching solution) at room temperature (23 ° C.) to form a sensor electrode (FIG. 12B). reference).
(3) Formation of insulating layer On the surface side of the obtained glass substrate having the black matrix layer, an insulating resin layer forming resin composition containing an acrylic polymer, an acrylic monomer, and a photopolymerization initiator was applied. After drying (see FIG. 12C), pattern exposure was performed and development was performed, so that an insulating layer having a thickness of 1.5 μm was formed at a portion where the first electrode and the second electrode of the sensor electrode intersect. (See FIG. 12D).
By this drying step (230 degrees 30 minutes), the ITO layer produced in all steps was baked and crystallized from an amorphous state.
(4) Formation of copper wiring layer On the surface side of the base material having the black matrix layer, an IZO layer as an adhesion layer, a copper layer, and an IZO layer as a coating layer were formed in this order by a DC magnetron sputtering method. (Refer FIG.12 (e)). Next, a resist coating film is formed in a plan view pattern of the copper wiring layer (see FIG. 12 (f)), and at room temperature (23 ° C.), an etching solution (phosphorous nitrate acetic acid) having the following composition is used to form an IZO layer and a copper layer. And an IZO layer are etched simultaneously, and a pattern of a copper wiring layer in which an adhesion layer (IZO layer) having a thickness of 10 nm, a copper layer having a thickness of 250 nm, and a covering layer (IZO layer) having a thickness of 50 nm are stacked in this order. Obtained (see FIG. 12 (g)). The copper wiring layer serving as a conductive portion used for connection between the sensor electrodes has an underlayer as an insulating layer, and the lead-out wiring layer has a glass substrate and a black matrix layer as the underlayer. The lead-out wiring layer includes a portion having a fine line pattern with a line / space of 15 μm / 15 μm on the glass substrate and the black matrix, respectively. The touch panel sensor of Example 1 was obtained as described above.
<Composition of etching solution for IZO layer and copper layer>
・ 48% by mass of phosphoric acid
・ Nitric acid 3 mass% or less ・ Acetic acid 34 mass%
・ 15% by weight or more of water

[Example 2: Production of touch panel sensor]
Example 2 is the same as Example 1 except that in the formation of the copper wiring layer of Example 1, an adhesion layer (IZO layer) having a thickness of 5 nm was formed instead of the adhesion layer (IZO layer) having a thickness of 10 nm. Similarly, the touch panel sensor of Example 2 was obtained.
[Example 3: Production of touch panel sensor]
Example 3 is the same as Example 1 except that in the formation of the copper wiring layer of Example 1, a 20 nm thick adhesive layer (IZO layer) was formed instead of the 10 nm thick adhesive layer (IZO layer). Similarly, the touch panel sensor of Example 3 was obtained.

[Example 4: Production of touch panel sensor]
In Example 4, instead of forming the copper wiring layer of Example 1, a touch panel sensor of Example 4 was obtained in the same manner as Example 1 except that the copper wiring layer was formed as follows.
<Copper wiring layer formation>
An ITO layer, a copper layer, and an ITO layer as a coating layer were formed in this order on the surface side of the substrate having the black matrix layer by a DC magnetron sputtering method. Next, a resist coating film is formed in a plan view pattern of the copper wiring layer, and at 30 ° C., the ITO layer of the coating layer, the copper layer, and the ITO layer of the adhesion layer are simultaneously etched with hydrogen peroxide water, and from the base layer side A copper wiring layer pattern was obtained in which an ITO layer having a thickness of 10 nm, a copper layer having a thickness of 250 nm, and an ITO layer having a thickness of 50 nm were laminated in this order. The copper wiring layer serving as a conductive portion used for connection between the sensor electrodes has an underlayer as an insulating layer, and the lead-out wiring layer has a glass substrate and a black matrix layer as the underlayer. The lead-out wiring layer includes a portion having a fine line pattern with a line / space of 15 μm / 15 μm on the glass substrate and the black matrix, respectively. The touch panel sensor of Example 4 was obtained as described above.

[Example 5: Production of touch panel sensor]
In Example 5, instead of forming the copper wiring layer of Example 1, a touch panel sensor of Example 5 was obtained in the same manner as Example 1 except that the copper wiring layer was formed as follows.
<Copper wiring layer formation>
An ITO layer and a copper layer were formed in this order as an adhesion layer on the surface side having the black matrix layer of the substrate by a DC magnetron sputtering method. Next, a resist coating film is formed in a plan view pattern of the copper wiring layer, and at the room temperature (23 ° C.), the copper layer and the ITO layer of the adhesion layer are simultaneously etched with hydrogen peroxide at 30 ° C. A pattern of a copper wiring layer in which an adhesion layer (ITO layer) and a copper layer with a thickness of 250 nm were laminated in this order was obtained (FIG. 13A). Further, an ITO layer was formed as a coating layer on the copper wiring layer by DC magnetron sputtering (FIG. 13B). A resist coating film 16 is formed in a pattern in which the wiring is formed with a width 3 μm wider than the line width of the planar pattern of the copper wiring layer, and 47% hydrobromic acid (at room temperature (23 ° C.)) By etching 17 the ITO layer with an etching solution (FIG. 13C), a copper wiring layer pattern in which the upper and side surfaces of the copper wiring layer 3 were also coated with the coating layer 4 (ITO layer) of 50 nm was obtained. (FIG. 13D).
The copper wiring layer serving as a conductive portion used for connection between the sensor electrodes has an underlayer as an insulating layer, and the lead-out wiring layer has a glass substrate and a black matrix layer as the underlayer. The lead-out wiring layer includes a portion having a fine line pattern with a line / space of 15 μm / 15 μm on the glass substrate and the black matrix, respectively. The touch panel sensor of Example 5 was obtained as described above.

[Example 6: Production of color filter with touch panel sensor]
(1) Formation of black matrix layer A black matrix forming resin composition containing carbon black and a bisphenolfluorene epoxy acrylate adduct is applied onto a soda-lime glass substrate having a thickness of 0.5 mm and a square of 150 mm. After drying, pattern exposure was performed and development was performed to obtain a black matrix layer having a thickness of 1.3 μm and having openings as shown in FIG. 15 (FIGS. 15 and 16A).
(2) Formation of copper wiring layer On the surface side of the base material having the black matrix layer, an IZO layer, a copper layer, and an IZO layer as a coating layer were formed in this order by a DC magnetron sputtering method. Next, a resist coating film is formed in a plan view pattern of the copper wiring layer, and as an adhesion layer at room temperature (23 ° C.), using the IZO layer and the copper layer etching solution (phosphorous nitrate acetic acid) used in Example 1. The IZO layer, the copper layer, and the IZO layer as the coating layer are simultaneously etched, and the adhesion layer (IZO layer) having a thickness of 10 nm, the copper layer having a thickness of 250 nm, and the copper layer having a thickness of 50 nm are formed on the black matrix layer. A copper wiring layer pattern was obtained in which coating layers (IZO layers) were laminated in this order (FIGS. 15 and 16B).

(3) Formation of Color Filter Colored Layer A red curable resin composition having the following composition is applied by spin coating (coating thickness 2.5 μm), dried by pattern exposure and developed, and then the substrate is placed at 230 ° C. in an atmosphere of 30 ° C. By leaving it for a minute, a red colored layer pattern (28 (R) in FIGS. 15 and 16C) was formed in a region where a red pixel was to be formed.
Next, by using the green curable resin composition having the following composition, in the same process as the red colored layer, the pattern of the green colored layer (28 in FIG. 15 and FIG. 16 (c) ( G)) was formed.
Further, by using the blue curable resin composition having the following composition, in the same process as the red colored layer, the pattern of the blue colored layer (see 28 ( B)) and a colored layer composed of three colors of red (R), green (G), and blue (B) was formed.
<Composition of curable resin composition>
Copolymer resin solution (solid content 50%): 16 parts by weight Methyl methacrylate: 63 parts by weight Acrylic acid: 12 parts by weight Methacrylic acid-2-hydroxyethyl: 6 parts by weight
Diethylene glycol dimethyl ether: 88 parts by weight. 2,2′-azobis (2-methylbutyronitrile) 7 parts by weight. Glycidyl methacrylate: 7 parts by weight Triethylamine: 0.4 parts by weight Hydroquinone: 0.2 parts by weight Dipentaerythritol pentaacrylate: 24 parts by weight • Orthocresol novolac type epoxy resin: 4 parts by weight • 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one: 4 parts by weight • diethylene glycol dimethyl ether : 52 parts by weight <Composition of red curable resin composition>
・ C. I. Pigment Red 177: 10 parts by weight • BYK161 (manufactured by BYK Chemie): 3 parts by weight • The above curable resin composition: 5 parts by weight • 3-methoxybutyl acetate: 82 parts by weight <Composition of green curable resin composition>
・ C. I. Pigment Green 36: 10 parts by weight • BYK161 (by Big Chemie): 3 parts by weight • The above curable resin composition: 5 parts by weight • 3-methoxybutyl acetate: 82 parts by weight <Composition of Blue Curable Resin Composition>
・ C. I. Pigment Blue 15: 6: 10 parts by weight. BYK161 (manufactured by BYK Chemie): 3 parts by weight. The curable resin composition: 5 parts by weight. 3-methoxybutyl acetate: 82 parts by weight.

(4) Overcoat layer formation On the substrate on which the colored layer has been formed as described above, the curable resin composition is applied by a spin coating method, dried, developed by pattern exposure, and then the substrate is heated to 230 ° C. By leaving it under for 30 minutes, an overcoat layer having a film thickness of 1.2 μm was formed (FIG. 16D).

(5) Photospacer formation On the substrate on which the colored layer and the overcoat layer have been formed as described above, the curable resin composition is applied by a spin coating method, dried, developed by pattern exposure, and then the substrate is 230. A stationary spacer having a film thickness of 3.2 μm was formed by leaving it in an atmosphere of 30 ° C. for 30 minutes (FIG. 16E). The color filter was produced by the above.
(6) Backside sensor electrode formation An ITO layer was formed on the entire surface of the glass substrate by DC magnetron sputtering on the surface of the glass substrate opposite to the surface having the black matrix layer. Next, a resist coating film is formed in a sensor electrode pattern, the ITO layer is etched with 47% hydrobromic acid (etching solution) at room temperature (23 ° C.), and then left in a 230 ° C. atmosphere for 30 minutes. Thus, ITO was crystallized to form a sensor electrode (FIG. 16F).

[Comparative Example 1: Production of comparative touch panel sensor 1]
Comparative Example 1 was performed in the same manner as in Example 1 except that the IZO layer as the adhesion layer was not formed and the copper layer and the IZO layer as the coating layer were formed in this order in (4) of Example 1. A comparative touch panel sensor was obtained.

[Comparative Example 2: Production of comparative touch panel sensor 2]
In Example 1 (4), a comparison was made in the same manner as in Example 1 except that an IZO layer and a copper layer as adhesion layers and a copper alloy layer containing 25% by mass of nickel as a coating layer were formed in this order. A comparative touch panel sensor 2 of Example 2 was obtained.

(Adhesion 1 evaluation)
About the touchscreen sensor obtained by the said Example and the comparative example, the adhesiveness of the part which has the fine line pattern whose line / space of an extraction wiring layer is 15 micrometers / 15 micrometers was evaluated, respectively.
Specifically, each portion having a fine line pattern with a line / space of 15 μm / 15 μm on the glass substrate and on the black matrix is 10 × 10 at 1 μm intervals according to the cross-cut test of JIS K 5600. Mass was prepared and evaluated using Nichiban CT405AP-24. The results are shown in Table 1.
<Adhesion 1 evaluation criteria>
A: There was no peeling.
B: A part of the fine line was peeled off.
C: All of the fine lines were peeled off.

(Adhesion 2 evaluation)
(1) Manufacture of Evaluation Substrate An IZO layer having a thickness of 10 nm as an adhesion layer is formed on the glass substrate, the black matrix layer, and the insulating layer by the sputtering method described in (4) of Example 1, respectively. A copper wiring layer in which a 250 nm thick copper layer and a 50 nm IZO layer as a coating layer were laminated in this order was formed, and this was used as an adhesion evaluation substrate. In addition, the glass substrate, the black matrix layer, and the insulating layer were respectively the same as those in Example 1, and had the same film thickness.
The thickness of the IZO layer as the adhesion layer was changed to 5 nm and 20 nm, and substrates for adhesion evaluation corresponding to Examples 2 to 3 were similarly produced.
An ITO layer having a thickness of 10 nm, a copper layer having a thickness of 250 nm, and a coating are formed on the glass substrate, the black matrix layer, and the insulating layer, respectively, as an adhesion layer by the sputtering method described in (4) of Example 4. A copper wiring layer in which a 50 nm thick ITO layer was laminated in this order was formed as a layer, and this was used as an adhesion evaluation substrate.
Further, on the glass substrate, the black matrix layer, and the insulating layer, in Example 4 (4), the IZO layer as the adhesion layer was not formed, and the copper layer and the IZO layer as the coating layer A substrate for adhesion evaluation corresponding to Comparative Example 1 was produced in the same manner as the substrate for adhesion evaluation corresponding to Example 1, except that the layers were formed in this order.
(2) Adhesiveness 2 Evaluation The adhesiveness of the copper wiring layer on the evaluation board was created in accordance with JIS K 5600 cross-cut test by creating 10 × 10 masses at 1 μm intervals and using Nichiban CT405AP-24. evaluated. The results are shown in Table 1.
<Adhesion 2 evaluation criteria>
A: No peeling B: Peeling was observed at 4 squares or less.
C: Peeling was observed at 5 squares or more.

[Summary of results]
As shown in Comparative Example 1, the conventional copper wiring layer having no adhesion layer was inferior in adhesion to any underlayer, and particularly poor in adhesion on the black matrix layer. For this reason, the conventional copper wiring layer having poor adhesion is difficult to be thinned, and has been a cause of a decrease in yield.
Since the copper wiring layer of the present invention is a copper wiring layer having an adhesion layer on the base layer side, the adhesion is excellent. According to the present invention, it has been clarified that a thin copper wiring layer having excellent adhesion can be formed on the black matrix layer.

2. Evaluation of heat resistance The heat resistance of the copper wiring layer of the touch panel sensor obtained in the examples and comparative examples was evaluated by resistance value fluctuations before and after performing oven baking at 230 degrees for 30 minutes six times.
In the touch panel sensors of Examples 1 to 5 and Comparative Example 2, the resistance value of the touch panel sensor at the time of manufacture was compared with the resistance value after the obtained touch panel sensor was oven-baked six times at 230 degrees for 30 minutes. On the other hand, in the copper wiring layer of the color filter with a touch panel sensor of Example 6, since the copper wiring layer was oven-baked six times at 230 degrees 30 minutes when manufacturing the color filter with the touch panel sensor, The resistance value was compared with the resistance value after manufacturing the color filter with the touch panel sensor.

[Summary of results]
As shown in Comparative Example 2, the copper wiring layer coated with the CuNi-based alloy varied in the wiring resistance value due to firing. On the other hand, as shown in Examples 1 to 6, the resistance value was maintained in the copper wiring layer covering the upper surface of the copper layer or the upper surface and the side surfaces with the ITO layer or the IZO layer. It has been clarified that a fine copper wiring layer free from fluctuations in the resistance value of the wiring can be formed by coating the copper wiring layer with the coating layer specified in the present invention.

DESCRIPTION OF SYMBOLS 1 Insulation base material 2 Adhesion layer 3 Copper layer 4 Cover layer 5 Black matrix layer 6a 1st electrode 6b 2nd electrode 7a 1st electroconductive part 7b 2nd electroconductive part 8 Takeout wiring layer 9 External connection terminal 10 Copper wiring layer 11 Insulating layer DESCRIPTION OF SYMBOLS 12 Active area 13 Transparent electrode layer 14 Protective layer 15 Conductive hole 16 Resist 17 Exposure 20 Touch panel sensor 22 Transparent base material 22a Transparent base material (opening part)
23 Black matrix layer 24 Adhesion layer 25 Copper layer 26 Coating layer 27 Copper wiring layer (extraction wiring layer)
28 Colored layer 29 Overcoat layer 30 Photo spacer 31 Transparent conductive layer 32 External connection terminal 40 Color filter with touch panel sensor 50 Touch panel module 51 Printed wiring board 52 Overcoat layer 53 Cover lens

Claims (4)

A touch panel sensor having a wiring layer including a copper wiring layer on a base layer,
The copper wiring layer is a laminate having a pattern, and the laminate is an adhesion layer, a copper layer, and at least one of indium zinc oxide (IZO) and indium tin oxide (ITO) from the base layer side. A touch panel sensor comprising: a coating layer containing s in this order, wherein the adhesion layer, the copper layer, and the coating layer have the same pattern.   The touch panel sensor according to claim 1, wherein the adhesion layer contains at least one of indium zinc oxide (IZO) and indium tin oxide (ITO).   A touch panel module comprising the touch panel sensor according to claim 1 and a printed wiring board connected to the touch panel sensor. The touch panel sensor according to claim 1 or 2, comprising a transparent substrate and a black matrix layer provided on the upper side or the lower side of the transparent substrate,
A color filter with a touch panel sensor, comprising: a color layer provided on a surface provided with a black matrix layer of a transparent base material of the touch panel sensor.