JP2014194720A - Touch panel sensor, touch panel module and method for manufacturing touch panel sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a touch panel sensor having a wiring layer which has a low resistance and excellent stability in qualities and which can be easily formed.SOLUTION: The touch panel sensor includes a base layer, a wiring layer including at least a CuMn wiring layer formed on the base layer, and a CuNi cap layer formed on the CuMn wiring layer. The CuMn wiring layer is formed of a CuMn alloy having a Mn content in the range over 0 atom% up to 10 atom%, and the layer has a thickness in the range from 50 nm to 800 nm. The CuNi cap layer is formed of a CuNi alloy having a Ni content in the range from 25 mass% to 65 mass%, and has a thickness in the range from 10 nm to 150 nm.

Description

  The present invention relates to a touch panel sensor having a wiring layer that has low resistance, excellent quality stability, and is easy to form.

  Today, touch panels are widely used as input means. In many cases, the touch panel is used together with the display device as an input means for various devices in which a display device such as a liquid crystal display or a plasma display is incorporated, for example, a ticket vending machine, an ATM device, a mobile phone, or a game machine. . In such a device, the touch panel is placed on the display surface of the display device, which allows the touch panel to make a very direct input to the display device.

  Various types of touch panels have been put into practical use. Among these, what is called a capacitance method is, for example, as described in Patent Documents 1 to 5, to a touch panel sensor having a layer structure of a first electrode / interelectrode insulating layer / second electrode, and an electrode. In order to supply power and output detection signals, those having a flexible printed wiring board connected to an external connection terminal of the touch panel sensor are used. Then, a weak current is passed through the touch panel surface of the touch panel to form an electric field, and the change in capacitance value when a finger or other conductor is lightly touched is converted into a voltage drop or the like and detected. The obtained contact position is output as a signal.

  As a material constituting a wiring layer such as a sensor electrode or a lead-out wiring layer used for a touch panel sensor, a copper material having a low electrical resistance has been attracting attention because of demand for an increase in panel size and sensitivity. For example, Patent Documents 6 to 7 propose using a low-resistance Cu alloy as a wiring in a display device, although it is not a wiring layer in a touch panel sensor.

  Moreover, as for the wiring layer in a touch panel, it is common that an overcoat layer is formed so that this may be covered. However, in order to satisfy touch panel-specific functions such as the ability to detect changes in capacitance when touching the surface of the touch panel and the visibility of information displayed on the display device, the selectivity of the overcoat layer material and the adjustment of the thickness There was a problem that the degree of freedom was low. As a result, even when an overcoat layer is formed so as to cover the wiring layer, it may be difficult to sufficiently prevent the wiring layer from being oxidized by oxygen, moisture, etc. from the outside. There was a problem that was low.

  Patent Document 6 discloses that a Cu alloy is used for the wiring of the TFT, and Patent Document 7 discloses that the Cu alloy is used for the wiring of the organic EL display. The wiring layer of the touch panel sensor is not mentioned.

JP 2009-64343 A JP-A-9-146680 Japanese Patent No. 2587975 JP 2011-124332 A JP 2011-76514 A JP 2012-27159 A JP 2003-297484 A

  The present invention has been made in view of the above problems, and has as its main object to provide a touch panel sensor having a wiring layer that is low in resistance, excellent in quality stability, and easy to form.

  In order to solve the above-described problems, the present invention provides a touch panel having a base layer, a wiring layer including at least a CuMn wiring layer formed on the base layer, and a CuNi cap layer formed on the CuMn wiring layer. In the sensor, the CuMn wiring layer is made of a CuMn alloy having a Mn content in the range of more than 0 atomic% to 10 atomic% or less, and has a thickness in the range of 50 nm to 800 nm. The CuNi cap layer Provides a touch panel sensor comprising a CuNi alloy having a Ni content in the range of 25 mass% to 65 mass%, and having a thickness in the range of 10 nm to 150 nm.

  According to the present invention, when the wiring layer includes a CuMn wiring layer having a predetermined composition and thickness, the resistance can be reduced and adhesion with the base layer can be improved. Furthermore, since the CuNi cap layer having a predetermined composition and thickness is formed on the CuMn wiring layer, oxidation of the CuMn wiring layer can be suppressed and quality stability can be improved. Furthermore, since the CuMn wiring layer and the CuNi cap layer have a predetermined composition and thickness, the CuMn wiring layer and the CuNi cap layer can be simultaneously etched with the same etching solution, and can be easily formed. Can be.

  The present invention is a touch panel sensor having a base layer, a wiring layer including at least a CuMn wiring layer formed on the base layer, and a CuNi cap layer formed on the CuMn wiring layer, and connected to the touch panel sensor A touch panel module having a flexible printed wiring board, wherein the CuMn wiring layer is made of a CuMn alloy having a Mn content in a range of more than 0 atomic% to 10 atomic% or less, and a thickness in a range of 50 nm to 800 nm. The touch panel is characterized in that the CuNi cap layer is made of a CuNi alloy having a Ni content in the range of 25% by mass to 65% by mass and having a thickness in the range of 10 nm to 150 nm. Provide modules.

  According to the present invention, by having the touch panel sensor, the CuMn wiring layer has low resistance and good adhesion to the underlayer, and the oxidation of the CuMn wiring layer is suppressed and the quality stability is excellent. Can be. Furthermore, the CuMn wiring layer and the CuNi cap layer can be etched at the same time, and can be easily formed.

  The present invention has a base layer, a wiring layer including at least a CuMn wiring layer formed on the base layer, and a CuNi cap layer formed on the CuMn wiring layer, and the CuMn wiring layer contains Mn. The CuNi cap layer is made of a CuMn alloy having an amount in the range of more than 0 atomic percent and not more than 10 atomic percent and having a thickness in the range of 50 nm to 800 nm. A touch panel sensor manufacturing method comprising a CuNi alloy having a thickness in the range of 10 nm to 150 nm, wherein the base layer, the CuMn wiring layer, and the CuNi cap layer are sequentially stacked. Laminate preparation step for preparing a laminate, and simultaneous etching for simultaneously etching the CuMn wiring layer and the CuNi cap layer To provide a manufacturing method for a touch panel sensor characterized by having a degree.

  According to the present invention, by having the simultaneous etching step of simultaneously etching the CuMn wiring layer and the CuNi cap layer in the touch panel sensor, the adhesion with the base layer is low and oxidation is suppressed. A touch panel sensor having a CuMn wiring layer having excellent quality stability can be easily formed.

  The present invention has an effect of providing a touch panel sensor having a low resistance, excellent quality stability, and a wiring layer that can be easily formed.

It is a schematic plan view which shows an example of the touch panel sensor of this invention. It is the sectional view on the AA line of FIG. It is the BB sectional view taken on the line of FIG. It is CC sectional view taken on the line of FIG. It is explanatory drawing explaining the sensor electrode in this invention. It is explanatory drawing explaining the sensor electrode in this invention. It is explanatory drawing explaining the sensor electrode in this invention. It is explanatory drawing explaining the sensor electrode in this invention. It is explanatory drawing explaining the sensor electrode in this invention. It is a schematic sectional drawing which shows an example of the touchscreen module of this invention. It is process drawing which shows an example of the manufacturing method of the touch panel sensor of this invention.

The present invention relates to a touch panel sensor, a touch panel module using the same, and a manufacturing method thereof.
Hereinafter, the manufacturing method of the touch panel sensor, touch panel module, and touch panel sensor of the present invention will be described.

A. Touch Panel Sensor A touch panel sensor of the present invention is a touch panel sensor having a base layer, a wiring layer including at least a CuMn wiring layer formed on the base layer, and a CuNi cap layer formed on the CuMn wiring layer. The CuMn wiring layer is made of a CuMn alloy having a predetermined composition and has a predetermined thickness, and the CuNi cap layer is made of a CuNi alloy having a predetermined composition and has a predetermined thickness. To do.

  Such a touch panel sensor of the present invention will be described with reference to the drawings. FIG. 1 is a schematic plan view showing an example of the touch panel sensor of the present invention. 2 is a cross-sectional view taken along line AA in FIG. 1, FIG. 3 is a cross-sectional view taken along line BB in FIG. 1, and FIG. 4 is a cross-sectional view taken along line CC in FIG. As illustrated in FIGS. 1 to 4, the touch panel sensor 10 of the present invention includes an insulating base 1 and a wiring that is formed on the insulating base 1 and includes at least a CuMn wiring layer 2 having a predetermined composition and thickness. And a CuNi cap layer 3 formed on the CuMn wiring layer 2 and having a predetermined composition and thickness.

In this example, as a wiring layer, a sensor electrode composed of a first electrode 4a and a second electrode 4b, a conductive portion composed of a first conductive portion 5a and a second conductive portion 5b, and an extraction wiring layer 6 and an external connection terminal 7 are formed. Among these, the first conductive portion 5 a, the extraction wiring layer 6, and the external connection terminal 7 are the CuMn wiring layer 2, and the CuNi cap layer 3 is formed on all these CuMn wiring layers 2.
Further, the sensor electrode is formed in the active area 11 visible to the touch panel user, and includes the first electrode 4a and the second electrode 4b. The first electrode 4a and the second electrode 4b are made of a transparent conductive material. A transparent electrode made of The conductive portion includes a first conductive portion 5a that connects the first electrodes 4a and a second conductive portion 5b that connects the second electrodes 4b. The second conductive portion 5b is a second electrode 4b. It is the transparent electrode which consists of a transparent conductive material similarly to. The extraction wiring layer 6 is connected to the sensor electrode, is formed in a non-active area outside the active area 11, and is connected to the external connection terminal 7 at the end.
The first conductive portion 5a and the second conductive portion 5b are formed so that a part thereof overlaps with the insulating layer 8 in plan view, and the first conductive portion 5a is a conductive hole 12 provided in the insulating layer 8. The first electrodes 4a are connected via each other.

In this example, as described above, the first conductive portion 5a, the extraction wiring layer 6 and the external connection terminal 7 are the CuMn wiring layer 2, and the extraction wiring layer 6 and the external connection terminal 7 are on the insulating substrate 1. The first conductive portion 5a is formed on the first electrode 4a and the insulating layer 8 which are transparent electrodes. Therefore, the insulating base 1, the first electrode 4 a that is a transparent electrode, and the insulating layer 8 are all the underlying layers of the CuMn wiring layer 2.
In FIG. 1, the insulating layer is omitted.

According to the present invention, when the wiring layer includes the CuMn wiring layer, the resistance can be reduced. Therefore, the contact position can be detected with high sensitivity.
In addition, since the CuMn wiring layer has a predetermined composition and thickness, adhesion between the CuMn wiring layer and the base layer can be improved. For example, in FIGS. 1 to 4, the insulating base material 1, the first electrode 4 a which is a transparent electrode, and the insulating layer 8 are the base layers of the CuMn wiring layer 2, and the insulating base material 1, the first electrode 4 a and Adhesion with all of the insulating layer 8 can be enhanced. Therefore, the CuMn wiring layer can be formed relatively thin. As a result, the aperture ratio of the CuMn wiring layer in the active area is increased, and the area of the inactive area is reduced to increase the area of the active area. can do. Thereby, visibility can be improved when the touch panel sensor of the present invention is used for a display device with a touch panel.
Furthermore, since the CuNi cap layer having a predetermined composition and thickness is formed on the CuMn wiring layer, oxidation of the CuMn wiring layer can be suppressed. Further, since the CuNi cap layer has a predetermined composition and thickness, it can be made excellent in oxidation resistance, so that the CuMn wiring layer can be stably protected and the CuMn wiring layer has excellent quality stability. Can be. Therefore, reliability such as environmental resistance of the touch panel sensor can be improved, and the touch panel sensor can be applied to various uses.
Furthermore, since the CuMn wiring layer and the CuNi cap layer have a predetermined composition and thickness, the CuMn wiring layer and the CuNi cap layer can be simultaneously etched with the same etching solution. For this reason, there is no additional process when patterning the CuMn wiring layer and the CuNi cap layer, and the formation can be facilitated.

The touch panel sensor of the present invention has at least a base layer, a wiring layer, and a CuNi cap layer.
Hereinafter, each component of the touch panel sensor of the present invention will be described in detail.

1. Wiring layer The wiring layer in the present invention includes at least a CuMn wiring layer formed on the base layer.
In the present invention, the phrase “the wiring layer includes at least the CuMn wiring layer” may be that at least part of the members included in the wiring layer is a CuMn wiring layer. Specifically, this includes the case where only a part of the first electrode constituting the sensor electrode included as the wiring layer is formed of the CuMn wiring layer.

(1) CuMn wiring layer The CuMn wiring layer in the present invention is formed on a base layer, is made of a CuMn alloy having a predetermined composition, and has a predetermined thickness.
In addition, the CuMn alloy in this invention is not limited to what consists only of two components of Cu and Mn, The thing containing an impurity is also included.

  The Cu content in the CuMn alloy is in the range of 90 atomic% or more and less than 100 atomic%, preferably 90 atomic% or more and 99 atomic% or less, particularly 96 atomic% or more and 99 atomic%. It is preferable to be within the following range. When the Cu content is within the above range, the conductivity can be improved.

  The content of Mn in the CuMn alloy is in the range of more than 0 atomic% to 10 atomic%, preferably 1 atomic% to 10 atomic%, particularly 1 atomic% to 4 atomic%. It is preferable to be within the following range. When the content of Mn is within the above range, the adhesion between the CuMn wiring layer and the base layer can be improved. Therefore, the CuMn wiring layer can be formed relatively thin. As a result, the aperture ratio of the CuMn wiring layer in the active area is increased, and the area of the inactive area is reduced to reduce the area of the active area. Can be bigger. Thereby, visibility can be improved when the touch panel sensor of the present invention is used for a display device with a touch panel.

  The mixing ratio of Cu and Mn can be measured by collecting the CuMn wiring layer from the touch panel sensor and providing the CuMn wiring layer collected for a general metal alloy analysis method. As a more specific example, there is a method of measuring the compounding ratio of Cu and Mn contained in the CuMn wiring layer by performing a depth profile of time-of-flight secondary ion mass spectrometry (TOF-SIMS).

  The thickness of the CuMn wiring layer in the present invention is in the range of 50 nm to 800 nm, preferably in the range of 150 nm to 800 nm, and more preferably in the range of 150 nm to 330 nm. When the thickness of the CuMn wiring layer is within the above range, excellent conductivity can be obtained.

  The method for forming the CuMn wiring layer in the present invention is not particularly limited as long as the CuMn wiring layer can be formed with high accuracy, but it is preferable to perform etching simultaneously with the CuNi cap layer described later. Specifically, a CuMn wiring layer is formed on the base layer, and then a CuNi cap layer is formed on the CuMn wiring layer. Thereafter, a patterned resist is formed on the CuNi cap layer, and the CuNi cap layer and the CuMn wiring layer are etched using the resist as a mask to form the same pattern.

  The etching solution used for etching is not particularly limited as long as it can etch the CuMn wiring layer and the CuNi cap layer. Specific examples include an aqueous phosphonitrate solution containing phosphoric acid, nitric acid and acetic acid, a system in which an oxidizing agent represented by hydrogen peroxide and sulfuric acid is mixed, hydrobromic acid, hydrohalic acid, and the like. .

  The method for forming the CuMn wiring layer and the CuNi cap layer is not particularly limited as long as it is a method capable of forming a film with a uniform thickness. For example, vacuum deposition, sputtering, CVD, ion Examples thereof include a film forming method using a dry process such as a plating method.

(2) Wiring layer The wiring layer in this invention is a member which has the electroconductivity to which the electricity as a power supply or an electric signal is transmitted.

  Such wiring layers can include those commonly used for touch panel sensors. Specifically, a sensor electrode including a first electrode used for detection of a contact position and a second electrode insulated from the first electrode, and a conductive portion connecting the first electrode and the second electrode, respectively. A first conductive portion and a second conductive portion; a lead-out wiring layer connected to the sensor electrode; an external connection terminal formed at the end of the lead-out wiring layer and used for connection to another member such as a flexible printed wiring board; Can be mentioned.

  In the present invention, at least a part of the wiring layer may be a CuMn wiring layer, and all of the wiring layers may be CuMn wiring layers. In particular, in the present invention, the wiring layer formed in the inactive area among the wiring layers, in particular, the wiring layer including the extraction wiring layer and the external connection terminal is preferably a CuMn wiring layer. This is because by using the CuMn wiring layer, the resistance can be reduced and the power consumption can be reduced.

(A) Sensor electrode The sensor electrode in the present invention includes a first electrode and a second electrode insulated from the first electrode, is formed in an active area, and is used for detecting a contact position.
In addition, the 2nd electrode insulated from the 1st electrode means that both electrodes are not electrically connected.

  When the sensor electrode is not the CuMn wiring layer, it can be a transparent electrode made of a transparent conductive material. Specific examples of the transparent conductive material used for forming the sensor electrode include indium tin oxide (ITO), zinc oxide, indium oxide, antimony-added tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, and potassium added. Zinc oxide, silicon-doped zinc oxide, metal oxides such as zinc oxide-tin oxide, indium oxide-tin oxide, zinc oxide-indium oxide-magnesium oxide, and two or more of these metal oxides are combined. Materials. Moreover, a non-transparent conductive material can also be used for a sensor electrode, As a non-transparent conductive material, the thing as described in Unexamined-Japanese-Patent No. 2010-238052 etc. can be used, for example. Specifically, metals such as aluminum, molybdenum, silver, and chromium, and alloys thereof can be used.

  As the planar view shape and the planar view outer shape of such a sensor electrode, JP 2011-210176 A, JP 2010-238052 A, JP 4610416 A, JP 2010-286886 A, and JP 2004. -192093, JP2010-277392A, JP2011-129501A, and the like can be the same as a sensor electrode in a general touch panel sensor.

  Examples of the planar view shape of the sensor electrode in the present invention include those formed in a planar shape or mesh shape not including an opening and having an opening. In the case where the sensor electrode is formed of a CuMn wiring layer, a mesh shape is preferable. This is because the visibility when the touch panel sensor of the present invention is used in a display device with a touch panel can be improved.

  When the sensor electrode has a mesh shape, the aperture ratio of the sensor electrode varies depending on the type of the touch panel sensor of the present invention, but is preferably 90% or more, and more preferably 93% or more. It is preferable that it is 95% or more especially. This is because when the touch panel sensor of the present invention is used in a display device with a touch panel sensor, the touch panel sensor can have excellent visibility. Note that the aperture ratio of the sensor electrode refers to the ratio of the area of the opening to the area of the sensor electrode.

  Further, the line width of the sensor electrode in the case where the sensor electrode has a mesh shape is not particularly limited as long as the contact position can be accurately detected, but is preferably in the range of 1 μm to 10 μm. Of these, the range of 2 to 7 μm is preferable, and the range of 3 to 5 μm is particularly preferable. This is because when the touch panel sensor of the present invention is used in a display device with a touch panel, the visibility of information displayed on the display device can be improved.

  Moreover, as a planar view outer periphery shape of a sensor electrode, polygonal shapes, such as planar view substantially square shape, are mentioned, for example.

As a formation location with respect to the insulation base material of the 1st electrode and 2nd electrode in this invention, when the touch panel sensor of this invention is used for the display apparatus with a touch panel, it forms in the active area of an insulation base material, and both are insulated. There is no particular limitation as long as it is formed as described above. For example, as illustrated in FIG. 2 and FIG. 3 or FIG. 5 and FIG. 6 described above, both may be formed on one surface of the same insulating substrate, and are illustrated in FIG. Thus, they may be formed on different insulating base materials, and may be formed via an insulating layer as illustrated in FIG. 8, and further illustrated in FIG. In addition, it may be formed on one surface and the other surface of the same insulating substrate.
5 and 6 are schematic diagrams showing an example of the case where both the first electrode and the second electrode are formed on one surface of the same insulating base material as in FIGS. 2 and 3 described above. It is sectional drawing, and is the AA sectional view taken on the line of FIG. 1, and the BB sectional drawing, respectively.
Moreover, about the code | symbol in FIGS. 5-9, since it shows the member same as FIGS. 1-4, description here is abbreviate | omitted.

(B) Conductive part The conductive part in this invention contains the 1st conductive part and 2nd conductive part which connect between the 1st electrodes which comprise the said sensor electrode, and between 2nd electrodes, respectively. Further, the first conductive portion and the second conductive portion are usually formed so that a part thereof overlaps in plan view.

  When the conductive part is not a CuMn wiring layer, the material of the conductive part is not particularly limited as long as it has conductivity, and can be the same as the sensor electrode described above.

  As a planar view shape of a conductive part, it can be made common to a touch panel sensor. The shape of the conductive part in plan view can be the same as that of the sensor electrode.

  Further, the external shape of the conductive portion in plan view can be general to the touch panel sensor, and examples thereof include a line shape having a width narrower than that of the sensor electrode in plan view.

The locations where the first conductive portion and the second conductive portion are formed are particularly limited as long as the first conductive portion and the second conductive portion can be stably connected to each other and are formed so as to be insulated from each other. Is not to be done. For example, when the first electrode and the second electrode are formed on different surfaces or different members as shown in FIGS. 7 to 9, the first conductive portion and the second conductive portion are respectively The first electrode and the second electrode may be formed on the same surface.
When both the first electrode and the second electrode are formed on one surface of the same insulating base material, the first conductive portion and the second conductive portion are formed via an insulating layer. Can be.

(C) Extraction wiring layer The extraction wiring layer in this invention is connected to a sensor electrode.

  As the location where the lead-out wiring layer is formed, it is appropriately set according to the type and application of the touch panel sensor of the present invention, but when the touch panel sensor of the present invention is used in a display device with a touch panel, It is formed in an inactive area.

  When the lead-out wiring layer is not a CuMn wiring layer, the conductive material used for forming the lead-out wiring layer is, for example, silver, gold, chromium, platinum, aluminum alone, or an alloy mainly composed of any of these. Is mentioned. As the metal alloy, APC, that is, a silver / palladium alloy is generally used. Further, as the metal composite, MAM (Mo—Al—Mo, that is, a three-layer structure of molybdenum, aluminum, and molybdenum) can be used.

  The line width of the extraction wiring layer can be, for example, about 0.01 mm to 0.2 mm.

(D) External connection terminal The external connection terminal in the present invention is connected to the lead-out wiring layer and used for connection to a flexible printed wiring board or the like.

  The location where the external connection terminal is formed and the material of the external connection terminal when the external connection terminal is not a CuMn wiring layer can be the same as those of the extraction wiring layer described above.

  The terminal width, thickness and plan view shape of the external connection terminals, and the interval between the external connection terminals in the external connection terminal portion can be the same as those of a general touch panel sensor. Specifically, it can be the same as that described in JP2011-210176A.

2. CuNi Cap Layer The CuNi cap layer in the present invention is formed on a CuMn wiring layer, is made of a CuNi alloy having a predetermined composition, and has a predetermined thickness.
In addition, the CuNi alloy in this invention is not limited to what consists only of two components of Cu and Ni, The thing containing an impurity is also included.

  The Cu content in the CuNi alloy is in the range of 35% by mass to 75% by mass, and more preferably in the range of more than 50% by mass and 70% by mass or less. When the Cu content is within the above range, the CuNi cap layer can be easily etched simultaneously with the CuMn wiring layer described above, and further excellent oxidation resistance can be obtained.

  The content of Ni in the CuNi alloy is preferably in the range of 25% by mass to 65% by mass, and particularly preferably in the range of 30% by mass to less than 50% by mass. When the Ni content is within the above range, excellent oxidation resistance can be obtained.

  The distribution of Cu and Ni in the CuNi cap layer is not particularly limited as long as the oxidation of the CuMn wiring layer can be suppressed. Such a distribution can be the same as the contents described in the section “1. Wiring layer (1) CuMn wiring layer”, and the description thereof is omitted here.

  The formation location of the CuNi cap layer is not particularly limited as long as it is formed on the CuMn wiring layer, but it is preferably formed on all the wiring layers formed as the CuMn wiring layer. In particular, it is preferably formed only on the CuMn wiring layer. Oxidation of the CuMn wiring layer can be suppressed, and quality deterioration can be prevented. Further, the effect of simultaneous etching of the CuNi cap layer and the CuMn wiring layer can be made remarkable.

The CuNi cap layer is formed on the CuMn wiring layer in a plan view so as to cover the upper part of the CuMn wiring layer, that is, the surface opposite to the surface of the CuMn wiring layer on the base layer side. Although it is formed, it is preferable that it is formed so as to cover all of the upper part of the CuMn wiring layer. This is because oxidation of the CuMn wiring layer can be suppressed and quality deterioration can be prevented. Further, the effect of simultaneous etching of the CuNi cap layer and the CuMn wiring layer can be made remarkable.
When the CuNi cap layer and the CuMn wiring layer are formed at the same timing by simultaneous etching, the CuNi cap layer is not usually formed on the side surface of the CuMn wiring layer.

The formation position of the CuNi cap layer with respect to the CuMn wiring layer is not particularly limited as long as oxidation of the CuMn wiring layer can be suppressed.
The CuNi cap layer may be formed through another layer between the CuNi cap layer, but in the present invention, it is preferably formed directly on the CuMn wiring layer. This is because the oxidation of the CuMn wiring layer can be effectively suppressed and quality deterioration can be prevented. Further, the effect of simultaneous etching of the CuNi cap layer and the CuMn wiring layer can be made remarkable.

  The thickness of the CuNi cap layer is preferably in the range of 10 nm to 150 nm, particularly preferably in the range of 30 nm to 80 nm. When the thickness of the CuNi cap layer is within the above range, the CuNi cap layer can have no opening such as a pinhole, and oxidation on the surface of the CuNi cap layer can be prevented. Moreover, if oxidation can be prevented on the surface of the CuNi cap layer, the barrier property against moisture can be sufficiently exhibited, and as a result, oxidation of the CuMn wiring layer can be effectively suppressed. Moreover, when the thickness of the CuNi cap layer is within the above range, the CuNi cap layer can be stably formed, and the CuMn wiring layer can be electrically connected to other members via the CuNi cap layer.

  The formation method of the CuNi cap layer in the present invention is not particularly limited as long as the CuNi cap layer can be formed with high accuracy. Specifically, the above-mentioned “1. Wiring layer (1) CuMn wiring layer” The method described in the section can be used.

3. Underlayer In the underlayer in the present invention, a CuMn wiring layer is formed.
Examples of such an underlayer include an insulating base material, an insulating layer, and a transparent electrode made of a transparent conductive material.

(1) Insulating base material When the ground layer in the present invention is an insulating base material, examples of the CuMn wiring layer formed on the insulating base material include an extraction wiring layer and an external connection terminal.

The insulating substrate supports the wiring layer and the like. The material constituting the insulating base is not particularly limited as long as it has insulating properties, and may be a material having transparency or a material having non-transparency. When the touch panel sensor of the present invention is used for a display device with a touch panel, the insulating base material is preferably made of a transparent material. This is because excellent visibility can be obtained.
In the present invention, the terms “transparent” and “transparency” mean that an operator of a display device with a touch panel using the touch panel sensor of the present invention is not visually recognized from the operation surface unless otherwise specified. There is no transparency. Therefore, it includes colorless and transparent and colored transparency that does not impede visibility, is not defined by strict transmittance, and can be appropriately determined according to the use of the touch panel sensor.

  Examples of the material constituting the insulating substrate include inorganic materials such as glass, polyester resins such as polyethylene terephthalate (PET), acrylic resins, and resin materials such as polycarbonate. When an inorganic material such as glass is selected, it is possible to increase the strength of the touch panel sensor and widen the setting range of manufacturing conditions such as heating temperature. On the other hand, when a resin material is selected, the touch panel sensor can be reduced in weight, and flexibility can be imparted to the touch panel sensor.

The thickness of the insulating substrate is not particularly limited as long as it can stably support a CuMn wiring layer and the like, and is appropriately selected depending on the material. For example, when the insulating substrate is made of an inorganic material such as glass, it is preferably within a range of 0.3 mm to 1.5 mm. Moreover, when an insulating base material consists of resin materials, it is preferable that it is a flexible film form, and specifically, it is preferable to set it as the range of 50 micrometers-300 micrometers.
In addition, as a form of an insulating base material, the film form which has flexibility may be sufficient, and plate shape may be sufficient.

The insulating substrate may be a single layer or a plurality of layers.
In addition, as a layer laminated | stacked when the said insulating base material consists of multiple layers, a hard-coat layer, an adhesion adjustment layer, a low-refractive-index layer, a high-refractive-index layer, etc. other than the layer which consists of the said material are mentioned. it can.

(2) Insulating layer When the base layer in the present invention is an insulating layer, examples of the CuMn wiring layer formed on the insulating layer include a conductive portion.

  The insulating layer is formed to prevent a short circuit between the first electrode and the second electrode constituting the sensor electrode or between the first conductive portion and the second conductive portion. The material for forming the insulating layer is not particularly limited as long as it has a desired insulating property, and materials generally used for touch panel sensors can be used. For example, a light-transmitting acrylic resin, siloxane resin, and the like can be given, and among these, a photosensitive siloxane resin can be preferably used.

  The insulating layer can be formed at a location common to a touch panel sensor. For example, both the first electrode and the second electrode constituting the sensor electrode are formed on one surface of the same insulating substrate. 2 to 3, the insulating layer 8 is formed between the first electrode 4a, the second electrode 4b, and the second conductive portion 5b and the first conductive portion 5a. 5a and a hole type formed so as to have a conductive hole 12 for connecting the first electrode 4a, or as shown in FIGS. 5 to 6, the insulating layer 8 is an island only under the first conductive portion 5a. Island type formed in a shape. Also, as shown in FIGS. 7 to 8, the insulating layer 8 is formed between the first electrode 4a and the first conductive part and the second electrode 4b and the second conductive part constituting the sensor electrode and the conductive part. Also good.

  The thickness of the insulating layer is not particularly limited as long as it can prevent a short circuit between the first electrode and the second electrode or between the first conductive part and the second conductive part. Can be general. For example, it can be in the range of 0.5 μm to 3.0 μm.

  The method for forming the insulating layer is not particularly limited as long as the insulating layer can be formed with high accuracy, and a method of applying the insulating layer forming material to the substrate surface and then patterning by a photolithography technique. Alternatively, a method of forming by a printing method such as screen printing can be given. It is also possible to process a film or sheet that exhibits insulating properties, appropriate light transmission properties, and optical isotropy into a desired shape, and can be laminated on a predetermined substrate surface as an insulating film. .

(3) Transparent electrode When the ground layer in this invention is a transparent electrode which consists of a transparent conductive material, as a CuMn wiring layer formed on a transparent electrode, an electroconductive part is mentioned, for example.

The transparent electrode is made of a transparent conductive material and constitutes a sensor electrode.
Note that the transparent conductive material and the sensor electrode can be the same as those described in the section “1. Wiring layer (2) Wiring layer (a) Sensor electrode”, and thus the description thereof is omitted here. To do.

4). Touch Panel Sensor The touch panel sensor of the present invention has at least a base layer, a wiring layer, and a CuNi cap layer, but may have other members as necessary.
Such other members include an insulating layer or a wiring layer formed to prevent a short circuit between the first electrode and the second electrode constituting the sensor electrode or between the first conductive portion and the second conductive portion. And a protective layer formed so as to cover the surface.

(1) Insulating layer The said insulating layer is formed in order to prevent the short circuit between the 1st electrode and 2nd electrode which comprise a sensor electrode, or between a 1st electroconductive part and a 2nd electroconductive part.
The detailed contents of the insulating layer can be the same as those described in the above section “3. Underlayer (2) Insulating layer”, and thus the description thereof is omitted here.

(2) Protective layer The protective layer is not particularly limited as long as it has insulating properties. However, when the protective layer is formed so as to cover the wiring layer, it has transparency. Preferably there is.
Examples of the protective layer having insulation and transparency include those made of an inorganic material such as acrylic resin or SiO ₂ .

B. Touch Panel Module The touch panel module of the present invention includes a touch panel sensor having a base layer, a wiring layer including at least a CuMn wiring layer formed on the base layer, and a CuNi cap layer formed on the CuMn wiring layer, and the touch panel. A touch panel module having a flexible printed wiring board connected to a sensor, wherein the CuMn wiring layer is made of a CuMn alloy having a predetermined composition, has a predetermined thickness, and the CuNi cap layer has a predetermined composition. It is made of a CuNi alloy having a predetermined thickness.
Hereinafter, the flexible printed wiring board may be referred to as FPC.

  Such a touch panel module will be described with reference to the drawings. FIG. 10 is a schematic cross-sectional view showing an example of the touch panel module of the present invention. A touch panel module 50 of the present invention shown in FIG. 10 has the touch panel sensor 10 and the FPC 20 connected to the touch panel sensor 10, and further has an overcoat layer 30 and a cover lens 40 on the touch panel sensor 10. It is.

  According to the present invention, by having the touch panel sensor described above, the CuMn wiring layer has low resistance and good adhesion to the base layer, and the oxidation of the CuMn wiring layer is suppressed and excellent in quality stability. Can be. Furthermore, the CuNi cap layer and the CuMn wiring layer can be etched at the same time, and can be easily formed.

The touch panel module of the present invention has at least a touch panel sensor and an FPC. Moreover, the touch panel module of this invention has a cover lens normally. In the touch panel module, the insulating base material constituting the touch panel sensor may also serve as a cover lens, and the cover lens may be separately disposed on the touch panel sensor. When the cover lens is separately provided on the touch panel sensor, an overcoat layer is formed between the touch panel sensor and the cover lens.
Hereinafter, each structure of the touch panel module of this invention is demonstrated in detail.
The touch panel sensor according to the present invention can be the same as the content described in the section “A. Touch panel sensor”, and thus the description thereof is omitted here.

1. FPC
The FPC used in the present invention is connected to the touch panel sensor.

  A touch panel drive driver IC for driving the touch panel is connected to the FPC to supply power to the electrodes, output detection signals, and the like. As such FPC, as described in JP 2009-64343 A, JP 9-146680 A, JP 2587975 A, JP 2011-124332 A, JP 2011-76514 A, and the like. It can be generally used for touch panels. For example, the connection terminal includes one having a front side connection terminal formed on one surface of the flexible substrate and a back side connection terminal formed on the other surface.

  The flexible substrate is not particularly limited as long as it has a desired insulating property, and examples thereof include a flexible polyimide film having a thickness of about 25 μm.

  Further, the connection terminal is not particularly limited as long as it has desired conductivity. For example, the connection terminal can be the same as the external connection terminal in the touch panel sensor.

The FPC in the present invention has the flexible substrate and the connection terminal, but may have other configurations as necessary.
Examples of such other configurations include a wiring connected to the connection terminal and a protective layer formed so as to cover the wiring. In addition, when the input information processing unit or the touch panel module of the present invention is used in a display device with a touch panel, a control unit such as a video information processing unit may be included.
The wiring can be the same as the extraction wiring layer. In addition, the protective layer is not particularly limited as long as it has insulating properties, and examples thereof include those made of polyimide resin.
In addition, the connection method of the FPC with the touch panel sensor is not particularly limited as long as both can be electrically connected. For example, an external connection terminal formed on the touch panel sensor, A method of disposing an anisotropic conductive film as disclosed in JP 2010-278025 A between the connection terminals formed on the FPC and thermocompression bonding can be exemplified.

2. Overcoat layer The overcoat layer in this invention is formed on one surface of the said touch panel sensor, and adhere | attaches the said touch panel sensor and a cover lens.

  Such an overcoat layer is not particularly limited as long as it can adhere the touch panel sensor and the cover lens with a desired adhesive force, and preferably has transparency. This is because when the touch panel module of the present invention is used in a display device with a touch panel, the touch panel module can be excellent in visibility.

  Moreover, as a material of the said overcoat layer, what is generally used for the touchscreen disclosed by Unexamined-Japanese-Patent No. 2009-37312 etc. can be used, For example, reactivity of an acrylate type, a methacrylate type, etc. Examples thereof include those made of a curable resin such as a photocurable resin having a vinyl group, acrylic pressure-sensitive adhesives, and optically transparent double-sided tapes (OCA (Optical Clear Adhesive) tapes). In the present invention, an acrylic material can be preferably used. It is because it can be made excellent in adhesiveness and transparency by being an acrylic adhesive or OCA using an acrylic material. Acrylic materials tend to have higher oxygen permeability and moisture permeability than resin materials that cover metal wiring of electronic circuits such as polyimide. On the other hand, in the present invention, since the CuNi cap layer is formed on the CuMn wiring layer, oxidation of the CuMn wiring layer can be suppressed, and the effect of the present invention becomes more remarkable. be able to.

  The thickness of the overcoat layer is not particularly limited as long as the touch panel sensor and the cover lens can be bonded with a desired adhesive force, and can be, for example, in the range of 1 μm to 500 μm. It is preferably within the range of 20 μm to 500 μm. It is because it can be made excellent in transparency. Further, although the barrier property of oxygen and moisture to the CuMn wiring layer is reduced due to the thin thickness, the present invention is effective in oxidizing the CuMn wiring layer because the CuNi cap layer is formed as described above. Can be suppressed. For this reason, the effect of this invention can be made more remarkable.

  The overcoat layer is not particularly limited as long as it can adhere both the touch panel sensor and the cover lens with a desired adhesive force. Alternatively, it may be formed in a pattern only in the inactive area outside the active area.

3. Cover Lens The cover lens in the present invention protects the touch panel sensor from scratches and the like.

  The material constituting such a cover lens is not particularly limited as long as it can have a desired protective property, such as chemically tempered glass, soda glass, quartz glass, and alkali-free glass. Glass, polycarbonate, polyacrylic acid ester, polymethacrylic acid ester and other resins, and other inorganic materials.

  The cover lens in the present invention may be non-transparent, but is preferably transparent when the touch panel module of the present invention is used in a display device with a touch panel.

  The thickness of the cover lens is not particularly limited as long as a desired protective property can be exhibited, and is appropriately set according to the material constituting the cover lens.

  The cover lens may be composed of a single layer made of the above material, or may be a laminate of a plurality of layers. As what consists of a plurality of layers, for example, those obtained by laminating layers made of different materials among the above materials, and those having a functional layer such as an antireflection layer or an antifouling layer in addition to the layers made of the above materials Can be mentioned. Moreover, when a cover lens consists of glass, you may have a scattering prevention film on the surface side as a functional layer.

4). Touch Panel Module The touch panel module of the present invention has at least the touch panel sensor and the flexible printed wiring board, but may have other configurations as necessary.
In addition to the overcoat layer and the cover lens described above, for example, such a configuration is formed on the surface of the touch panel sensor opposite to the surface on which the cover lens is formed, thereby improving the reliability of the touch panel sensor. The back surface protective film which bonded together the protective film for through the adhesive layer can be mentioned. The film and the adhesive layer are not particularly limited as long as the reliability of the touch panel sensor can be improved.

C. Method for Manufacturing Touch Panel Sensor A method for manufacturing a touch panel sensor according to the present invention includes a base layer, a wiring layer including at least a CuMn wiring layer formed on the base layer, and a CuNi cap layer formed on the CuMn wiring layer. The CuMn wiring layer is made of a CuMn alloy having a predetermined composition and has a predetermined thickness, and the CuNi cap layer is made of a CuNi alloy having a predetermined composition and manufacturing a touch panel sensor having a predetermined thickness. A method for preparing a laminate in which the underlayer, the CuMn wiring layer, and the CuNi cap layer are sequentially laminated, and simultaneous etching for simultaneously etching the CuMn wiring layer and the CuNi cap layer. And a process.

Such a touch panel sensor manufacturing method of the present invention will be described with reference to the drawings. FIG. 11 is a process diagram showing an example of a method for manufacturing a touch panel sensor of the present invention. As illustrated in FIG. 11A, an insulating base material 1 is prepared, and a laminate in which a transparent electrode layer made of a transparent conductive material such as ITO is laminated on one surface of the insulating base material 1 by sputtering. After preparing and forming a resist in a pattern, the transparent electrode layer is etched using iron chloride or the like using the resist as a mask, and the resist is removed to remove the first electrode 4a, the second electrode (not shown), and the first Two conductive portions 5b are formed. The first electrode 4a, the second electrode, and the second conductive portion 5b are transparent electrodes made of a transparent conductive material. Next, as shown in FIG. 11 (b), an insulating layer forming layer 8 ′ is formed, exposed and developed using a mask, and the insulating layer 8 having conductive holes 12 as shown in FIG. 11 (c). Form. Thereafter, as shown in FIG. 11D, the insulating base material 1 on which the first electrode 4a, the second electrode, the second conductive portion 5b, and the insulating layer 8 made of transparent electrodes are formed, and the CuMn wiring layer 2 ′. A laminated body in which the CuNi cap layer 3 ′ is laminated in this order is prepared, and a resist 13 is formed in a pattern on the laminated body. Next, as shown in FIG. 11E, by simultaneously etching the CuMn wiring layer 2 ′ and the CuNi cap layer 3 ′ using an etching solution, as shown in FIG. A wiring layer 2 and a CuNi cap layer 3 are obtained. In this case, the first conductive portion 5 a and the extraction wiring layer 6 are the CuMn wiring layer 2, and the CuNi cap layer 3 is formed in the same pattern as the first conductive portion 5 a and the extraction wiring layer 6. Then, as shown in FIG.11 (g), the touchscreen sensor 10 can be obtained by forming the protective layer 9 so that the 1st electrode 4a and the 2nd electrode may be covered.
In addition, FIG.11 (d) is a laminated body preparation process, and FIG.11 (e)-(f) is a simultaneous etching process.
In this example, the insulating base 1, the first electrode 4 a that is a transparent electrode, and the insulating layer 8 are the underlayer of the CuMn wiring layer 2.

  According to the present invention, by having the simultaneous etching step of simultaneously etching the CuMn wiring layer and the CuNi cap layer in the touch panel sensor described above, the adhesion with the base layer is low and the oxidation is suppressed. Thus, a touch panel sensor having a CuMn wiring layer having excellent quality stability can be easily formed.

The manufacturing method of the touch panel sensor of this invention has a laminated body preparation process and a simultaneous etching process.
Hereinafter, each process of the touch panel sensor of the present invention will be described in detail.

1. Laminated body preparation process The laminated body preparation process in this invention is a process of preparing the laminated body by which the base layer, the CuMn wiring layer, and the CuNi cap layer were laminated | stacked in order.
Note that the underlayer may be a single layer or a laminate of a plurality of layers.

  The formation method, thickness, constituent material, and the like of the base layer, the CuMn wiring layer, and the CuNi cap layer in this step are the same as the contents described in the section “A. Touch panel sensor”, and thus the description thereof is omitted here. .

2. Simultaneous etching step The simultaneous etching step in the present invention is a step of simultaneously etching the CuMn wiring layer and the CuNi cap layer.

When simultaneously etching the CuMn wiring layer and the CuNi cap layer, the CuMn wiring layer and the CuNi cap layer are simultaneously etched with the same etching solution.
At this time, it is preferable to select an etching condition such as an etching solution so that the time required for etching the CuNi cap layer is within a range of ± 20% of the time ratio required for etching the CuMn wiring layer.

  In this step, the method for simultaneously etching the CuMn wiring layer and the CuNi cap layer and the specific description of the obtained CuMn wiring layer and the CuNi cap layer are the same as those described in the above section “A. Touch panel sensor”. Therefore, explanation here is omitted.

3. Manufacturing method of touch panel sensor Although the manufacturing method of the touch panel sensor of this invention has the said laminated body preparation process and a simultaneous etching process, it may have another process as needed.
Examples of such other processes usually include a sensor electrode forming process for forming a sensor electrode, an insulating layer forming process for forming an insulating layer, and the like.

  About the said sensor electrode formation process and an insulating layer formation process, since the method generally used for manufacture of a touch panel sensor can be used, description here is abbreviate | omitted.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples.

[Examples 1 to 15]
First, a transparent glass base material (blue plate tempered glass manufactured by Nippon Sheet Glass Co., Ltd.) having a thickness of 0.5 mm is used as a base layer, and a CuMn wiring layer and a CuNi having the composition and thickness shown in Table 1 below are formed on the transparent glass base material. A cap layer was formed by a sputtering method to produce a laminate.
Next, a positive photosensitive resin (resist) was applied on the CuNi cap layer and patterned by photolithography. Thereafter, the CuMn wiring layer and the CuNi cap layer were etched at the same time using a phosphorous acetate acetic acid-based etchant.

[Examples 16 to 30]
Table 1 below shows the formation of an ITO film with a thickness of 30 nm as a base layer on a transparent glass substrate (Nihon Sheet Glass Co., Ltd. blue plate tempered glass) having a thickness of 0.5 mm, and a CuMn wiring layer and a CuNi cap layer. A laminate was produced in the same manner as in Examples 1 to 15 except that the composition and thickness were changed, and the CuMn wiring layer and the CuNi cap layer were etched simultaneously.

[Examples 31 to 45]
A transparent curable resin-containing coating material (catalog number A-13, manufactured by KOLON Co., Ltd.) is applied as a base layer on a transparent glass base material (blue plate tempered glass manufactured by Nippon Sheet Glass Co., Ltd.) having a thickness of 0.5 mm. A laminate was prepared in the same manner as in Examples 1 to 15 except that a 1.5 μm insulating layer was formed, and that the CuMn wiring layer and the CuNi cap layer had the compositions and thicknesses shown in Table 1 below. The layer and the CuNi cap layer were etched simultaneously.

[Comparative Examples 1-15]
Implemented except that the CuMn wiring layer and CuNi cap layer have the composition and thickness shown in Table 2 below, or the CuNi cap layer was not formed, or instead of the CuNi cap layer, a Ni, Ti or IZO layer was formed. A laminate was prepared in the same manner as in Examples 1 to 15, and the CuMn wiring layer and the cap layer were simultaneously etched.

[Comparative Examples 16 to 30]
Implemented except that the CuMn wiring layer and CuNi cap layer have the composition and thickness shown in Table 2 below, or the CuNi cap layer was not formed, or instead of the CuNi cap layer, a Ni, Ti or IZO layer was formed. A laminate was prepared in the same manner as in Examples 16 to 30, and the CuMn wiring layer and the cap layer were etched simultaneously.

[Comparative Examples 31-45]
Implemented except that the CuMn wiring layer and CuNi cap layer have the composition and thickness shown in Table 2 below, or the CuNi cap layer was not formed, or instead of the CuNi cap layer, a Ni, Ti or IZO layer was formed. A laminate was prepared in the same manner as in Examples 31 to 45, and the CuMn wiring layer and the cap layer were etched simultaneously.

[Evaluation]
1. Adhesiveness About the obtained laminated body, the adhesiveness of a base layer and a CuMn wiring layer was evaluated by the evaluation method according to a JISK5600 crosscut test.
A: Peeling is not confirmed in any lattice eye of the CuMn wiring layer.
B: It is confirmed that the CuMn wiring layer is partially peeled along the edge of the cut.
C: It is confirmed that the CuMn wiring layer is completely peeled off along the edges of the cut or the grid eyes are peeled off entirely.

2. Etching property The etching property when the CuMn wiring layer and the cap layer were simultaneously etched was evaluated.
A: The CuMn wiring layer and the cap layer are etched without any cracks or wrinkles up to the fine line.
B: Although the CuMn wiring layer and the cap layer can be etched, a part of the thin line pattern and a flicker are confirmed.
C: Although the CuMn wiring layer and the cap layer can be etched, the fine line pattern has chipping or flickering, or the fine line pattern does not remain or is not etched at all.

3. Patterning (thin wire adhesion)
After simultaneous etching of the CuMn wiring layer and the cap layer, a tape peeling test was performed, and the adhesion of the fine line pattern to the underlayer was evaluated with a microscope.
A: Peeling of the fine line pattern and chipping of the pattern edge are not confirmed at all.
B: Peeling of the fine line pattern and chipping of the pattern edge are slightly confirmed.
C: Peeling of the fine line pattern and chipping of the pattern edge are confirmed.

4). Heat resistance The obtained laminate was taken out after being placed in an oven at 230 degrees for 30 minutes, and the state of the CuMn wiring layer was observed and evaluated with the naked eye.
A: A state of discoloration in the CuMn wiring layer is not confirmed at all.
B: Rust generation is slightly confirmed on the surface of the CuMn wiring layer.
C: Generation of rust is confirmed on the surface of the CuMn wiring layer.

5. Reliability A touch panel sensor was manufactured as shown below, and the reliability of the wiring layer was evaluated.
An ITO film having a thickness of 30 nm was formed on the surface of the transparent glass substrate by sputtering using a transparent glass substrate having a thickness of 0.5 mm (Nippon Sheet Glass Co., Ltd. blue plate reinforced glass). Then, a positive photosensitive resin (resist) was formed on the ITO film, and the ITO film was patterned by a photolithography method, thereby forming the first electrode, the second electrode, and the second conductive portion.
Next, a transparent curable resin-containing coating material is applied to the entire surface of the transparent glass substrate formed above by a spin coating method to form an insulating layer forming layer, and then partially exposed by a photolithography technique. The insulating layer forming layer was patterned to leave the surface and cover the first electrode, the second electrode, and the second conductive portion, thereby forming an insulating layer.
Next, a CuMn wiring layer and a CuNi cap layer having the compositions and thicknesses shown in Table 1 and Table 2 below were formed in this order by the sputtering method. Next, a positive photosensitive resin (resist) was applied on the CuNi cap layer on the surface of the transparent glass substrate, and patterned by a photolithography method. Here, the resist pattern has a pattern corresponding to a bridge portion (first conductive portion) for connecting the first electrodes, a lead-out wiring layer, and a connection terminal. Thereafter, the CuMn wiring layer and the CuNi cap layer were simultaneously etched using a phosphoric acid acetic acid-based etching solution.
Finally, a transparent curable resin-containing coating material is applied to the entire surface of the transparent glass substrate subjected to the above patterning by a spin coating method to further form a protective layer forming layer, and subsequently by a photolithography method. The protective layer forming layer is patterned so as to cover the first electrode, the first conductive portion (bridge portion), the second electrode, the second conductive portion, and the lead-out wiring layer, leaving the connection terminal pattern. did.
In this way, a touch panel sensor having sensor electrodes, lead wirings, and connection terminals was obtained. In this touch panel sensor, the first conductive portion, the lead-out wiring layer, and the connection terminal are composed of a CnMn wiring layer, and a CuNi cap layer is formed on these CuMn wiring layers. The lead-out wiring layer and the connection terminal are formed on the transparent glass substrate, and the first conductive portion is formed on the ITO film and the insulating layer.
Next, a cover glass (OA-10 manufactured by Nippon Sheet Glass Co., Ltd.) is bonded to the touch panel sensor using an optical transparent adhesive sheet, and is placed in a high-temperature and high-humidity tank having a temperature of 60 degrees and a humidity of 95%. The state of the first conductive part composed of layers, the lead-out wiring layer, and the connection terminal was observed and evaluated with the naked eye.
Here, in Examples 1 to 45 and Comparative Examples 1 to 45, when the compositions and thicknesses of the CnMn wiring layer and the CuNi cap layer shown in Table 1 and Table 2 below were the same, the same touch panel sensor was evaluated.

Reliability was evaluated according to the following criteria.
A: As a result of being left in a high-temperature and high-humidity tank for 1000 hours, no corrosion was observed.
B: As a result of being left in a high-temperature and high-humidity tank for 800 hours, no corrosion was confirmed.
C: As a result of being left in a high-temperature and high-humidity tank for 250 hours, no corrosion was observed.

  The results are shown in Tables 1 and 2.

From the results of Tables 1 and 2, when the CuMn wiring layer and the CuNi cap layer have a predetermined composition and thickness, all of adhesion, etching property, patterning property, heat resistance and reliability were good. Specifically, heat resistance and reliability, that is, excellent oxidation resistance could be obtained by having a CuNi cap layer having a predetermined composition and thickness on the CuMn wiring layer. Furthermore, when the CuMn wiring layer has a predetermined composition and thickness, the adhesion between the CuMn wiring layer and the underlying layer can be improved, and good patterning properties can also be obtained. Adhesion was good when the underlayer was a glass substrate, ITO electrode, or insulating layer.
In Table 2, in Comparative Examples 14, 29 and 44, since the cap layer was made of Ti, simultaneous etching of the CuMn wiring layer and the cap layer was impossible, and reliability could not be evaluated. In Comparative Examples 2, 11, 13, 17, 26, 28, 32, 41, and 43, since the cap layer is made of Ni, patterning of the CuMn wiring layer and the cap layer itself is impossible, and reliability is evaluated. I couldn't.

DESCRIPTION OF SYMBOLS 1 ... Insulation base material 2, 2 '... CuMn wiring layer 3, 3' ... CuNi cap layer 4a ... 1st electrode 4b ... 2nd electrode 5a ... 1st electroconductive part 5b ... 2nd electroconductive part 6 ... Extraction wiring layer 7 ... External connection terminal 8 ... Insulating layer 9 ... Protective layer 10 ... Touch panel sensor 11 ... Active area 12 ... Conductive hole 13 ... Resist 20 ... Flexible printed wiring board 30 ... Overcoat layer 40 ... Cover lens 50 ... Touch panel module

Claims (3)

An underlayer,
A wiring layer including at least a CuMn wiring layer formed on the base layer;
A touch panel sensor having a CuNi cap layer formed on the CuMn wiring layer,
The CuMn wiring layer is made of a CuMn alloy having a Mn content in the range of more than 0 atomic% to 10 atomic% or less, and has a thickness in the range of 50 nm to 800 nm.
The CuNi cap layer is made of a CuNi alloy having a Ni content in the range of 25% by mass to 65% by mass, and has a thickness in the range of 10 nm to 150 nm. A touch panel sensor having a base layer, a wiring layer including at least a CuMn wiring layer formed on the base layer, and a CuNi cap layer formed on the CuMn wiring layer;
A touch panel module having a flexible printed wiring board connected to the touch panel sensor,
The CuMn wiring layer is made of a CuMn alloy having a Mn content in the range of more than 0 atomic% to 10 atomic% or less, and has a thickness in the range of 50 nm to 800 nm.
The touch panel module according to claim 1, wherein the CuNi cap layer is made of a CuNi alloy having a Ni content in a range of 25% by mass to 65% by mass and having a thickness in a range of 10 nm to 150 nm. An underlayer, a wiring layer including at least a CuMn wiring layer formed on the underlayer, and a CuNi cap layer formed on the CuMn wiring layer;
The CuMn wiring layer is made of a CuMn alloy having a Mn content in the range of more than 0 atomic% to 10 atomic% or less, and has a thickness in the range of 50 nm to 800 nm.
The CuNi cap layer is a method for manufacturing a touch panel sensor comprising a CuNi alloy having a Ni content in a range of 25% by mass to 65% by mass, and having a thickness in a range of 10 nm to 150 nm.
A laminate preparation step of preparing a laminate in which the base layer, the CuMn wiring layer, and the CuNi cap layer are sequentially laminated;
And a simultaneous etching step of simultaneously etching the CuMn wiring layer and the CuNi cap layer.

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