JP2015065327A - Vacuum suction device - Google Patents
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- JP2015065327A JP2015065327A JP2013198671A JP2013198671A JP2015065327A JP 2015065327 A JP2015065327 A JP 2015065327A JP 2013198671 A JP2013198671 A JP 2013198671A JP 2013198671 A JP2013198671 A JP 2013198671A JP 2015065327 A JP2015065327 A JP 2015065327A
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- 239000000919 ceramic Substances 0.000 claims abstract description 61
- 239000002245 particle Substances 0.000 claims abstract description 47
- 239000011148 porous material Substances 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 10
- 239000002002 slurry Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000000843 powder Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002823 nitrates Chemical class 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
Description
本発明は、たとえば、ラップ等の湿式加工を行うために半導体ウエハまたはガラス基板などの対象物を真空吸着する装置に関する。 The present invention relates to an apparatus for vacuum-sucking an object such as a semiconductor wafer or a glass substrate in order to perform wet processing such as lapping.
ウエハ（試料）を支持する複数の突起が形成されているセラミックス多孔質体からなる載置部と、セラミックス多孔質体の気孔に連通する吸引孔が形成され、セラミックス多孔質体の周縁部を封止するように載置部を支持する支持部とを備えている真空吸着装置が提案されている（特許文献１参照）。 A mounting portion made of a ceramic porous body on which a plurality of protrusions for supporting a wafer (sample) are formed, and a suction hole communicating with the pores of the ceramic porous body are formed, and the peripheral portion of the ceramic porous body is sealed. There has been proposed a vacuum suction device including a support portion that supports the placement portion so as to stop (see Patent Document 1).
しかし、たとえば周辺部が中央部よりも上に反っているウエハが載置部に載置された際、このウエハが複数の突起のうち一部の突起（たとえば中央部の突起）に当接する一方、他の突起から浮き上がった状態になる。このため、ウエハの重力が一部の突起に集中的に作用し、当該一部の突起を構成するセラミックス多孔質体の脱粒に由来するパーティクルの発生頻度、ひいてはウエハへの付着頻度が高くなる可能性がある。 However, for example, when a wafer whose peripheral portion is warped above the central portion is placed on the placement portion, the wafer abuts a part of the plurality of protrusions (for example, the protrusion in the central portion). It will be in a state of being lifted from other protrusions. For this reason, the gravity of the wafer acts intensively on some of the protrusions, and the generation frequency of particles derived from the degranulation of the porous ceramic body constituting the part of the protrusions, and thus the frequency of adhesion to the wafer may increase. There is sex.
そこで、本発明は、ウエハ等の吸着対象である物体に反り等の変形が存在する場合であっても、当該物体に対するパーティクルの付着頻度の低減を図ることができる真空吸着装置を提供することを目的とする。 Therefore, the present invention provides a vacuum suction device capable of reducing the frequency of adhesion of particles to an object that is an object to be suctioned, such as a wafer, even when deformation such as warpage exists. Objective.
本発明は、次の（１）〜（７）の真空吸着装置を提供する。 The present invention provides the following vacuum suction devices (1) to (7).
（１）骨格粒子としてのセラミックス粒子が結合材粒子によって結合されることにより構成され、上端部において物体を支持する突起が上側に形成されているセラミックス多孔質体と、前記セラミックス多孔質体の側部および下部の一部に対して前記結合材粒子により封止されている界面が形成されるように接合され、当該界面とは異なる部分において前記セラミックス多孔質体の気孔に連通する吸引孔が形成されているセラミックス緻密質体と、を備え、前記セラミックス多孔質体の上部において定義される複数の領域のそれぞれにおける、前記突起の上端部の面積密度である突起上端面密度に差が生じるように、前記突起の上端面積および配置のうち一方または両方が調節されている真空吸着装置。 (1) A ceramic porous body formed by bonding ceramic particles as skeletal particles by binding material particles, and a protrusion supporting an object at the upper end portion formed on the upper side, and the side of the ceramic porous body Bonded so as to form an interface sealed with the binder particles to a part of the part and the lower part, and a suction hole communicating with the pores of the ceramic porous body is formed in a part different from the interface A dense ceramic body, and in each of a plurality of regions defined in the upper part of the ceramic porous body, a difference occurs in the protrusion upper end surface density which is the area density of the upper end portion of the protrusion. The vacuum suction apparatus in which one or both of the upper end area and the arrangement of the protrusions are adjusted.
（２）前記（１）記載の真空吸着装置において、前記複数の領域として中央領域と、前記中央領域を環状に囲む環状領域とが定義され、前記中央領域における突起上端面密度が、前記環状領域における突起上端面密度よりも低くなるように、前記突起の上端面積および配置のうち一方または両方が調節されている真空吸着装置。 (2) In the vacuum suction apparatus according to (1), a central region and an annular region that annularly surrounds the central region are defined as the plurality of regions, and a protrusion upper end surface density in the central region is defined as the annular region. A vacuum suction apparatus in which one or both of the upper end area and the arrangement of the protrusions are adjusted so as to be lower than the protrusion upper end surface density.
（３）前記（２）記載の真空吸着装置において、複数の前記環状領域のうち一の環状領域における突起上端面密度が、前記一の環状領域の外側にある他の環状領域における突起上端面密度よりも高くなるように、前記突起の上端面積および配置のうち一方または両方が調節されている真空吸着装置。 (3) In the vacuum suction device according to (2), the protrusion upper end surface density in one annular region among the plurality of annular regions is the protrusion upper end surface density in another annular region outside the one annular region. A vacuum suction apparatus in which one or both of the upper end area and the arrangement of the protrusions are adjusted so as to be higher.
（４）前記（２）記載の真空吸着装置において、前記中央領域に対する前記環状領域の突起上端面密度比が４〜２５の範囲に含まれるように、前記突起の上端面積および配置のうち一方または両方が調節されている真空吸着装置。 (4) In the vacuum suction device according to (2), one or the other of the upper end area and the arrangement of the protrusions, or the protrusion upper surface density ratio of the annular region with respect to the central region is included in the range of 4 to 25 A vacuum suction device in which both are regulated.
（５）前記（３）記載の真空吸着装置において、前記一の環状領域の前記中央領域に対する前記他の環状領域の突起上端面密度比が０．２５〜６．２５の範囲に含まれるように、前記突起の上端面積および配置のうち一方または両方が調節されている真空吸着装置。 (5) In the vacuum suction device according to (3), a protrusion upper end surface density ratio of the other annular region to the central region of the one annular region is included in a range of 0.25 to 6.25. The vacuum suction apparatus in which one or both of the upper end area and the arrangement of the protrusions are adjusted.
（６）前記（１）〜（５）のうちいずれか１つに記載の真空吸着装置において、前記セラミックス多孔質体の上部に複数の突起が分散配置されるように形成され、前記複数の領域のそれぞれにおける前記複数の突起の配置態様が同一である一方、前記複数の領域のそれぞれにおける前記複数の突起の上端部の面積が差別化されることにより、前記複数の領域のそれぞれにおける突起上端面密度が差別化されている真空吸着装置。 (6) In the vacuum suction device according to any one of (1) to (5), the plurality of regions are formed so that a plurality of protrusions are dispersedly arranged on an upper portion of the ceramic porous body. While the arrangement of the plurality of protrusions in each of the plurality of protrusions is the same, the upper end surfaces of the protrusions in each of the plurality of areas are differentiated by differentiating the areas of the upper ends of the plurality of protrusions in each of the plurality of areas. Vacuum suction device with differentiated density.
（７）前記（１）〜（５）のうちいずれか１つに記載の真空吸着装置において、前記セラミックス多孔質体の上部に複数の突起が分散配置されるように形成され、前記複数の領域のそれぞれにおける前記複数の突起の上端部の面積が同一である一方、前記複数の領域のそれぞれにおける前記複数の突起の配置態様が差別化されることにより、前記複数の領域のそれぞれにおける突起上端面密度が差別化されている真空吸着装置。 (7) In the vacuum suction device according to any one of (1) to (5), the plurality of regions are formed so that a plurality of protrusions are dispersedly arranged on an upper portion of the ceramic porous body. While the areas of the upper ends of the plurality of projections in each of the plurality of projections are the same, the arrangement of the plurality of projections in each of the plurality of regions is differentiated, whereby the projection upper end surface in each of the plurality of regions Vacuum suction device with differentiated density.
本発明の真空吸着装置によれば、たとえば、セラミックス多孔質体の上部における複数の領域のうち、ウエハ等の物体が当該多孔質体に載置される際に最初に当接する一の領域の突起上端面密度が、他の領域の突起上端面密度よりも相対的に低くなるように調節されている。これにより、複数の領域間で突起上端面密度に差がない場合と比較して、当該一の領域における物体と突起との当初接触面積の低減、ひいてはパーティクルの発生頻度の低減が図られる。 According to the vacuum suction device of the present invention, for example, among the plurality of regions in the upper part of the ceramic porous body, the projection of one region that first contacts when an object such as a wafer is placed on the porous body The upper end surface density is adjusted so as to be relatively lower than the protrusion upper end surface density in other regions. Thereby, compared with the case where there is no difference in the protrusion upper end surface density between the plurality of regions, it is possible to reduce the initial contact area between the object and the protrusion in the one region, and hence the generation frequency of particles.
また、複数の領域間で突起上端面密度に差がない場合と比較して、当該一の領域における物体と突起との当初非接触面積の増大、ひいてはセラミックス多孔質体の開気孔によるパーティクルの受容容量の向上が図られる。セラミックス緻密質体を通じてセラミックス多孔質体の気孔が真空吸引された際に、開気孔に入り込んだパーティクルが舞い上がることなく当該開気孔に捕捉されうるので、物体に対するパーティクルの付着頻度の低減が図られる。 In addition, compared to the case where there is no difference in the protrusion top surface density between the plurality of regions, the initial non-contact area between the object and the protrusion in the one region is increased, and as a result, particles are received by the open pores of the ceramic porous body. The capacity can be improved. When the pores of the ceramic porous body are vacuumed through the ceramic dense body, the particles that have entered the open pores can be trapped in the open pores without rising, so that the frequency of adhesion of particles to the object can be reduced.
さらに、当該真空吸引によって、当該一の領域とは異なる他の領域においても物体が突起に接触するように当該物体の変形が是正されたような形態で、物体がセラミックス多孔質体に真空吸着保持されうる、 Furthermore, the vacuum suction and retention of the object is performed on the ceramic porous body in such a form that the deformation of the object is corrected by the vacuum suction so that the object comes into contact with the protrusion in another region different from the one region. Can be,
（真空吸着装置の構成）
図１に模式的に示されている本発明の真空吸着装置は、略円板状のセラミックス多孔質体１０と、セラミックス多孔質体１０を収容するような凹部を有する略有底円筒状のセラミックス緻密質体２０とを備えている。
(Configuration of vacuum suction device)
The vacuum suction apparatus of the present invention schematically shown in FIG. 1 includes a substantially disc-shaped ceramic porous body 10 and a substantially bottomed cylindrical ceramic having a concave portion for accommodating the ceramic porous body 10. The dense body 20 is provided.
セラミックス多孔質体１０は、骨格粒子としてのセラミックス粒子が結合材粒子によって結合されることにより構成されている。セラミックス多孔質体１０の上側には、その上端部において物体を支持する複数の突起１２が上面１１から上方に突出するように形成されている。 The ceramic porous body 10 is configured by bonding ceramic particles as skeleton particles with binding material particles. On the upper side of the ceramic porous body 10, a plurality of protrusions 12 that support an object at the upper end thereof are formed so as to protrude upward from the upper surface 11.
各突起１２の形状は、任意形状が採用されるが、たとえば図２（ａ）に示されているように略円柱状に形成されていてもよく、図２（ｂ）に示されているように略円錐台状に形成されている。突起１２の上面半径ｄは０．２〜２．０［ｍｍ］、その高さｈは０．1〜０．３［ｍｍ］両者の比ｄ／ｈは１〜１０の範囲に調節される。 As the shape of each projection 12, an arbitrary shape is adopted. For example, it may be formed in a substantially cylindrical shape as shown in FIG. 2 (a), as shown in FIG. 2 (b). It is formed in a substantially truncated cone shape. The upper surface radius d of the protrusion 12 is 0.2 to 2.0 [mm], and the height h is 0.1 to 0.3 [mm]. The ratio d / h of both is adjusted to the range of 1 to 10.
セラミックス緻密質体２０は、セラミックス多孔質体１０の側部および下部の一部に対して結合材粒子により封止されている界面が形成されるように接合されている。セラミックス緻密質体２０には、当該界面とは異なる部分においてセラミックス多孔質体１０の気孔に連通する吸引孔２２が形成されている。吸引孔２２は凹部中央を上下に貫通しており、その上部において中央部から横方向に放射状に延在する溝に連通し、その下部において経路を介して真空ポンプに連通している。 The ceramic dense body 20 is bonded to the side portions of the ceramic porous body 10 and a part of the lower portion so that an interface sealed by the binder particles is formed. The ceramic dense body 20 is formed with suction holes 22 communicating with the pores of the ceramic porous body 10 at portions different from the interface. The suction hole 22 passes vertically through the center of the recess, communicates with a groove extending radially from the center at the upper part thereof, and communicates with the vacuum pump via a path at the lower part thereof.
（真空吸着装置の製造方法）
まず、骨格粒子と、結合材粒子とが、水またはアルコールとともに混合されることによりスラリーが調整される（スラリー調整工程）。原料の混合法としては、ボールミルまたはミキサーを用いた混合法等、公知の方法が採用される。水またはアルコールの添加量は特に限定されず、所望の流動性が得られるように適当に調整されればよい。骨格粒子は、平均粒子径が２０〜６０［μｍ］であるセラミックス粉末により構成されている。セラミックスとしては、アルミナまたは炭化珪素等が採用されうる。
(Manufacturing method of vacuum suction device)
First, the slurry is adjusted by mixing the skeleton particles and the binder particles together with water or alcohol (slurry adjusting step). As a raw material mixing method, a known method such as a mixing method using a ball mill or a mixer is employed. The addition amount of water or alcohol is not particularly limited, and may be appropriately adjusted so as to obtain a desired fluidity. The skeleton particles are made of ceramic powder having an average particle diameter of 20 to 60 [μm]. As the ceramic, alumina, silicon carbide, or the like can be used.
結合材粒子として二酸化珪素粉末と、１Ａ族、２Ａ族および３Ａ族の元素のそれぞれの酸化物、水酸化物、硝酸塩および炭酸塩から選ばれる少なくとも１種以上の添加物粉末とが用いられてもよい。二酸化珪素粉末の供給源としては、水を分散媒として二酸化珪素の粒子を分散させたコロイド溶液が用いられてもよい。二酸化珪素の平均粒子径は０．５［μｍ］以下であることが好ましい。二酸化珪素の添加量は、セラミックス粉末に対し、５〜３０重量％であることが好ましい。 As the binder particles, silicon dioxide powder and at least one additive powder selected from oxides, hydroxides, nitrates and carbonates of elements of Group 1A, Group 2A and Group 3A may be used. Good. As a supply source of the silicon dioxide powder, a colloidal solution in which silicon dioxide particles are dispersed using water as a dispersion medium may be used. The average particle diameter of silicon dioxide is preferably 0.5 [μm] or less. The amount of silicon dioxide added is preferably 5 to 30% by weight based on the ceramic powder.
骨格粒子との結合力を高めるために、１Ａ族、２Ａ族および３Ａ族の元素のそれぞれの酸化物、水酸化物、硝酸塩および炭酸塩のうち少なくとも１種の添加物粉末の添加量は、例えば骨格粒子を構成するセラミックス粉末に対し、酸化物換算で３〜２０重量％の範囲に含まれるように調節されることが好ましい。当該添加物粉末は二酸化珪素との反応により、骨格粒子間の強固な結合材としての役割を果たす。１Ａ族、２Ａ族および３Ａ族の元素のそれぞれの酸化物、水酸化物、硝酸塩および炭酸塩のそれぞれの平均粒子径は１．０［μｍ］以下であることが好ましい。当該粒子径が、１．０［μｍ］を超えると未反応物質として残存するためである。例えば、１Ａ族元素としてＮａ、２Ａ族元素としてＣａ、３Ａ族元素としてＢが挙げられる。 In order to increase the bonding strength with the skeletal particles, the addition amount of at least one additive powder of each of the oxides, hydroxides, nitrates and carbonates of the elements of Group 1A, Group 2A and Group 3A is, for example, The ceramic powder constituting the skeletal particles is preferably adjusted so as to be included in the range of 3 to 20% by weight in terms of oxide. The additive powder acts as a strong binder between the skeleton particles by reaction with silicon dioxide. The average particle diameter of each oxide, hydroxide, nitrate and carbonate of the elements of Group 1A, Group 2A and Group 3A is preferably 1.0 [μm] or less. This is because when the particle diameter exceeds 1.0 [μm], it remains as an unreacted substance. For example, Na as the group 1A element, Ca as the group 2A element, B as the group 3A element.
次に、セラミックス緻密質体２０の凹部および吸引孔２２が蝋または樹脂等の部材により閉塞される。その上で、凹部にスラリーが充填される（スラリー充填工程）。この際、必要に応じて、スラリーにおける残留気泡を除去するための真空脱泡のほか、スラリー中の添加物粉末の充填率を高めるための振動が加えられる。 Next, the concave portion and the suction hole 22 of the ceramic dense body 20 are closed by a member such as wax or resin. Then, the slurry is filled in the recesses (slurry filling step). At this time, if necessary, in addition to vacuum defoaming for removing residual bubbles in the slurry, vibration for increasing the filling rate of the additive powder in the slurry is applied.
さらに、凹部にスラリーが充填されたセラミックス緻密質体２０が乾燥される。その上で、セラミックス緻密質体２０がスラリーの乾燥物とともに結合材の軟化点以上の温度で熱処理される（焼成工程）。これにより、スラリー由来のセラミックス多孔質体１０が形成される。そして、ブラスト加工等の適当な加工により、セラミックス多孔質体１０の上部に突起１２が形成される（突起形成工程）。 Further, the ceramic dense body 20 in which the concave portions are filled with the slurry is dried. After that, the ceramic dense body 20 is heat-treated at a temperature equal to or higher than the softening point of the binder together with the dried slurry. Thereby, the ceramic porous body 10 derived from the slurry is formed. And the protrusion 12 is formed in the upper part of the ceramic porous body 10 by suitable processes, such as a blast process (projection formation process).
（第１実施形態））
本発明の第１実施形態としての真空吸着装置においては、図３に示されているように、半径Ｒの略円形状のセラミックス多孔質体１０の上部において半径Ｒ１の略円形状の中央領域Ａ１と、中央領域Ａ１を円環状に囲む幅Ｒ２（＝Ｒ−Ｒ１）の環状領域Ａ２とが複数の領域として定義されている。
(First Embodiment)
In the vacuum suction apparatus as the first embodiment of the present invention, as shown in FIG. 3, a substantially circular central region A1 having a radius R1 is formed on the upper part of the porous ceramic body 10 having a radius R. And an annular region A2 having a width R2 (= R−R1) surrounding the central region A1 in an annular shape is defined as a plurality of regions.
Ｎ個の突起１２が、面積Ｓ（＝πＲ2）のセラミックス多孔質体１０の上部において、間隔が一定の三角格子の格子点に相当する箇所に配置されている。すなわち、中央領域Ａ１における突起１２の密度が、環状領域Ａ２における突起１２の密度と同一になるように複数の突起１２が配置されている。その一方、中央領域Ａ１における突起１２の径ｄ１（図３参照）が、環状領域Ａ２における突起１２の径ｄ２よりも小さく設計されている。これにより、中央領域Ａ１における突起上端面密度Ｄ１（＝ｎ×πｄ１2（ｎ＝Ｎ／Ｓ）が、環状領域Ａ２における突起上端面密度Ｄ２（＝ｎ×πｄ２2）よりも低くなるように調節されている。 N protrusions 12 are arranged on the upper portion of the ceramic porous body 10 having an area S (= πR 2 ) at locations corresponding to lattice points of a triangular lattice having a constant interval. That is, the plurality of protrusions 12 are arranged so that the density of the protrusions 12 in the central area A1 is the same as the density of the protrusions 12 in the annular area A2. On the other hand, the diameter d1 (see FIG. 3) of the protrusion 12 in the central area A1 is designed to be smaller than the diameter d2 of the protrusion 12 in the annular area A2. Thus, the protrusion upper end surface density D1 (= n × πd1 2 (n = N / S) in the central region A1 is adjusted to be lower than the protrusion upper end surface density D2 (= n × πd2 2 ) in the annular region A2. Has been.
（第２実施形態）
本発明の第２実施形態としての真空吸着装置は、図４に示されているように、中央領域Ａ１における突起１２の密度Ｎ１が、環状領域Ａ２における突起１２の密度Ｎ２よりも低くなるように複数の突起１２の配置が調節されている。一方、すべての突起１２の上端径ｄが同一に調節されている。これにより、中央領域Ａ１における突起上端面密度Ｄ１（＝Ｎ１×πｄ2）が、環状領域Ａ２における突起上端面密度Ｄ２（＝Ｎ２×πｄ2）よりも低くなるように調節されている。その他の構成は第１実施形態と同様なので説明を省略する。
(Second Embodiment)
In the vacuum suction apparatus as the second embodiment of the present invention, as shown in FIG. 4, the density N1 of the protrusions 12 in the central area A1 is lower than the density N2 of the protrusions 12 in the annular area A2. The arrangement of the plurality of protrusions 12 is adjusted. On the other hand, the upper end diameter d of all the protrusions 12 is adjusted to be the same. Thereby, the protrusion upper end surface density D1 (= N1 × πd 2 ) in the central region A1 is adjusted to be lower than the protrusion upper end surface density D2 (= N2 × πd 2 ) in the annular region A2. Since other configurations are the same as those of the first embodiment, description thereof is omitted.
（第３実施形態）
本発明の第３実施形態としての真空吸着装置においては、図５に示されているように、半径Ｒの略円形状のセラミックス多孔質体１０の上部において半径Ｒ１の略円形状の中央領域Ａ１と、中央領域Ａ１を二重に円環状に囲む幅Ｒ２、Ｒ３の内側環状領域Ａ２および外側環状領域Ａ３とが複数の領域として定義されている。
(Third embodiment)
In the vacuum suction apparatus according to the third embodiment of the present invention, as shown in FIG. 5, a substantially circular central region A1 having a radius R1 is formed on the upper part of the porous ceramic body 10 having a radius R. And an inner annular region A2 and an outer annular region A3 having widths R2 and R3 that double surround the central region A1 in an annular shape are defined as a plurality of regions.
中央領域Ａ１、内側環状領域Ａ２および外側環状領域Ａ３のそれぞれにおける突起１２の径ｄ１、ｄ２およびｄ３の大小関係が、不等式ｄ１＜ｄ３＜ｄ２により表わされるように調節されている。これにより、中央領域Ａ１、内側環状領域Ａ２および外側環状領域Ａ３のそれぞれにおける突起上端面密度Ｄ１（＝ｎ×πｄ１2）、Ｄ２（＝ｎ×πｄ２2）およびＤ３（＝ｎ×πｄ３2）の大小関係が、不等式Ｄ１＜Ｄ３＜Ｄ２により表わされるように調節されている。その他の構成は第１実施形態と同様なので説明を省略する。 The magnitude relationship between the diameters d1, d2, and d3 of the protrusions 12 in the central region A1, the inner annular region A2, and the outer annular region A3 is adjusted so as to be expressed by the inequality d1 <d3 <d2. Thereby, the protrusion upper end surface densities D1 (= n × πd1 2 ), D2 (= n × πd2 2 ), and D3 (= n × πd3 2 ) in the central region A1, the inner annular region A2, and the outer annular region A3, respectively. The magnitude relationship is adjusted as represented by the inequality D1 <D3 <D2. Since other configurations are the same as those of the first embodiment, description thereof is omitted.
（第４実施形態）
本発明の第４実施形態としての真空吸着装置においては、各領域Ａ１〜Ａ３における突起の密度Ｎ１〜Ｎ３の大小関係が不等式Ｎ１＜Ｎ３＜Ｎ２により表わされるように調節されることにより、突起上端面密度Ｄ１〜Ｄ３の大小関係が、不等式Ｄ１＜Ｄ３＜Ｄ２により表わされるように調節されている（第２実施形態参照）。その他の構成は第３実施形態と同様なので説明を省略する。
(Fourth embodiment)
In the vacuum suction apparatus as the fourth embodiment of the present invention, the magnitude relationship of the density N1 to N3 of the protrusions in each of the regions A1 to A3 is adjusted so as to be represented by the inequality N1 <N3 <N2. The magnitude relation of the end surface densities D1 to D3 is adjusted so as to be represented by the inequality D1 <D3 <D2 (see the second embodiment). Since other configurations are the same as those of the third embodiment, description thereof is omitted.
（他の実施形態）
第３または第４実施形態の変形実施形態として、各領域Ａ１〜Ａ３における突起上端面密度Ｄ１〜Ｄ３の大小関係が、不等式Ｄ１＜Ｄ２＜Ｄ３により表わされるように調節されていてもよい。
(Other embodiments)
As a modified embodiment of the third or fourth embodiment, the magnitude relationship of the protrusion upper end surface densities D1 to D3 in each of the regions A1 to A3 may be adjusted so as to be represented by the inequality D1 <D2 <D3.
前記実施形態においては円形状の中央領域Ａ１および一または複数の円環状の環状領域Ａ２（Ａ３）が複数の領域として定義されていたが、その他、さまざまな形態で複数の領域が定義され、各領域Ａｋ（ｋ＝１，２，‥）における突起上端面密度Ｄｋが差別化されていてもよい。たとえば、中央領域Ａ１または環状領域Ａ２のうち少なくとも一方が周方向について分割されることにより略扇形状の領域が複数領域として定義されてもよい。 In the embodiment, the circular central region A1 and one or a plurality of annular annular regions A2 (A3) are defined as a plurality of regions, but in addition, a plurality of regions are defined in various forms, The protrusion upper end surface density Dk in the region Ak (k = 1, 2,...) May be differentiated. For example, a substantially fan-shaped region may be defined as a plurality of regions by dividing at least one of the central region A1 and the annular region A2 in the circumferential direction.
前記実施形態では各突起１２の上端面積または配置密度の差別化によって各領域における突起上端面密度が差別化されていたが、上端面積および配置密度の両方の差別化によって各領域における突起上端面密度が差別化されていてもよい。 In the embodiment, the protrusion upper end surface density in each region is differentiated by differentiating the upper end area or the arrangement density of each protrusion 12. However, the protrusion upper end surface density in each region is differentiated by both the upper end area and the arrangement density. May be differentiated.
複数の突起１２が離散的に配置されるのではなく、複数の突起１２の一部または全部がまとめられたような連続した突起が形成されていてもよい。 Instead of the plurality of protrusions 12 being discretely arranged, continuous protrusions in which some or all of the plurality of protrusions 12 are collected may be formed.
（作用効果）
図６（ａ）（ｂ）に破線で示されているように、中央部よりも周縁部が反り上がっている状態のウエハＷが吸着保持対象である場合について考察する。
(Function and effect)
Consider the case where the wafer W in which the peripheral edge is warped rather than the central portion is the object to be sucked and held, as indicated by broken lines in FIGS. 6 (a) and 6 (b).
本発明の第１および第２実施形態の真空吸着装置によれば、図６（ａ）に示されているように、ウエハＷがセラミックス多孔質体１０に載置された際、ウエハＷは中央領域Ａ１に配置されている突起１２に接触する一方、環状領域Ａ２に配置されている突起１２から離間している。本発明の第１および第２実施形態の真空吸着装置によれば、前記のように中央領域Ａ１（ウエハＷが最初に当接する一の領域）の突起上端面密度Ｄ１が、環状領域Ａ２の突起上端面密度Ｄ２よりも相対的に低くなるように調節されている。これにより、複数の領域Ａ１およびＡ２の間で突起上端面密度Ｄ１およびＤ２に差がない場合（Ｄ１＝Ｄ２の場合）と比較して、中央領域Ａ１におけるウエハＷと突起１２との当初接触面積（Ｄ１×πＲ１2）の低減、ひいてはパーティクルの発生頻度の低減が図られる。 According to the vacuum suction apparatus of the first and second embodiments of the present invention, when the wafer W is placed on the ceramic porous body 10 as shown in FIG. While contacting the projection 12 disposed in the region A1, the projection 12 is disposed apart from the projection 12 disposed in the annular region A2. According to the vacuum suction devices of the first and second embodiments of the present invention, as described above, the protrusion upper end surface density D1 of the central area A1 (one area where the wafer W first contacts) is the protrusion of the annular area A2. It is adjusted to be relatively lower than the upper end surface density D2. As a result, the initial contact area between the wafer W and the protrusion 12 in the central area A1 as compared with the case where there is no difference in the protrusion upper end surface densities D1 and D2 between the plurality of areas A1 and A2 (when D1 = D2). Reduction of (D1 × πR1 2 ), and hence the generation frequency of particles can be achieved.
また、複数の領域Ａ１およびＡ２の間で突起上端面密度Ｄ１およびＤ２に差がない場合（Ｄ１＝Ｄ２の場合）と比較して、中央領域Ａ１におけるウエハＷと突起１２との当初非接触面積（上面１１）の増大、ひいてはセラミックス多孔質体１０の開気孔によるパーティクルの受容容量の向上が図られる。セラミックス緻密質体２０を通じてセラミックス多孔質体１０の気孔が真空吸引された際に、開気孔に入り込んだパーティクルが舞い上がることなく当該開気孔に捕捉されうるので、ウエハＷに対するパーティクルの付着頻度の低減が図られる。 Further, compared with the case where there is no difference in the protrusion upper end surface densities D1 and D2 between the plurality of areas A1 and A2 (when D1 = D2), the initial non-contact area between the wafer W and the protrusion 12 in the central area A1. The increase of the (upper surface 11), and hence the capacity of receiving particles due to the open pores of the ceramic porous body 10 is improved. When the pores of the ceramic porous body 10 are vacuumed through the ceramic dense body 20, the particles that have entered the open pores can be trapped in the open pores without rising, so that the frequency of particle adhesion to the wafer W can be reduced. Figured.
さらに、当該真空吸引によって、図６（ａ）に実線で示されているように、環状領域Ａ２においてもウエハＷが突起１２に接触するように当該ウエハＷの変形が是正されたような形態で、物体がセラミックス多孔質体に真空吸着保持されうる。 Further, as shown by a solid line in FIG. 6A, the deformation of the wafer W is corrected by the vacuum suction so that the wafer W comes into contact with the protrusion 12 even in the annular region A2. The object can be held by vacuum suction on the ceramic porous body.
本発明の第３および第４実施形態の真空吸着装置によれば、本発明の第１および第２実施形態の真空吸着装置による作用効果に加えて、次のような作用効果が奏される。すなわち、セラミックス緻密質体２０を通じてセラミックス多孔質体１０の気孔が真空吸引される際、ウエハＷと突起１２との接触範囲は中心から径方向外側に徐々に拡張されていく。ここで、ウエハＷとの間隔が比較的小さい内側環状領域Ａ２における突起１２よりも、当該間隔が比較的大きい外側環状領域Ａ３における突起１２のほうが、ウエハＷと当接する際の衝撃が大きくなると推察される。 According to the vacuum suction device of the third and fourth embodiments of the present invention, in addition to the function and effect of the vacuum suction device of the first and second embodiments of the present invention, the following function and effect are exhibited. That is, when the pores of the ceramic porous body 10 are vacuum-sucked through the ceramic dense body 20, the contact range between the wafer W and the protrusions 12 is gradually expanded radially outward from the center. Here, it is inferred that the protrusion 12 in the outer annular region A3 having a relatively large interval has a larger impact when contacting the wafer W than the protrusion 12 in the inner annular region A2 having a relatively small interval with the wafer W. Is done.
しかるに、内側環状領域Ａ２における突起上端面密度Ｄ２が、外側環状領域Ａ３における突起上端面密度Ｄ３よりも低くなるように調節されているので、当該大小関係が逆の場合（Ｄ２＜Ｄ３の場合）と比較して、ウエハＷと外側環状領域Ａ３における突起１２との当接に由来するパーティクルの発生頻度の低減が図られる。 However, since the protrusion upper end surface density D2 in the inner annular region A2 is adjusted to be lower than the protrusion upper end surface density D3 in the outer annular region A3, the magnitude relationship is reversed (when D2 <D3). As compared with the above, the occurrence frequency of particles derived from the contact between the wafer W and the protrusion 12 in the outer annular region A3 can be reduced.
（実施例）
平均粒子径５０［μｍ］のアルミナ粉末（純度７５％）と、結合材粒子を構成する粒子径６．８［μｍ］の硼珪酸ガラス（ＳｉＯ2＋Ｂ2Ｏ3）とが混合されることによりスラリーが調製された。骨格粒子に対する結合材粒子の質量比は１５に調節された。セラミックス緻密質体およびスラリーの乾燥物が１０００［℃］で３［ｈｒ］にわたって熱処理された。スラリー由来のセラミックス多孔質体１０の上部がブラスト加工されることにより突起１２が形成された。
(Example)
By mixing alumina powder having an average particle diameter of 50 [μm] (purity 75%) and borosilicate glass (SiO 2 + B 2 O 3 ) having a particle diameter of 6.8 [μm] constituting the binder particles. A slurry was prepared. The mass ratio of binder particles to skeletal particles was adjusted to 15. The ceramic dense body and the dried slurry were heat-treated at 1000 [° C.] for 3 [hr]. The upper part of the ceramic porous body 10 derived from the slurry was blasted to form the protrusions 12.
（実施例１）
第１実施形態にしたがって、中央領域Ａ１（半径Ｒ１＝１０２［ｍｍ］）における突起１２の上端面の径ｄ１が０．２［ｍｍ］に調節され、環状領域Ａ２（幅Ｒ２＝５１［ｍｍ］）における突起１２の上端面の径ｄ２が１．０［ｍｍ］に調節されることにより、実施例１の真空吸着装置が製造された。突起１２の間隔は２．０［ｍｍ］に調節された。突起上端面密度比Ｄ１：Ｄ２が１：２５に調節された。
Example 1
According to the first embodiment, the diameter d1 of the upper end surface of the protrusion 12 in the central region A1 (radius R1 = 102 [mm]) is adjusted to 0.2 [mm], and the annular region A2 (width R2 = 51 [mm]). The vacuum suction device of Example 1 was manufactured by adjusting the diameter d2 of the upper end surface of the protrusion 12 in 1.0) to 1.0 [mm]. The interval between the protrusions 12 was adjusted to 2.0 [mm]. The protrusion upper end surface density ratio D1: D2 was adjusted to 1:25.
（実施例２）
環状領域Ａ２における突起１２の上端面の径ｄ２が１．２［ｍｍ］に調節されることにより、突起上端面密度比Ｄ１：Ｄ２が１：３６に変更されたほかは、実施例１と同様の条件下で実施例２の真空吸着装置が製造された。
(Example 2)
The same as Example 1 except that the diameter d2 of the upper end surface of the protrusion 12 in the annular region A2 is adjusted to 1.2 [mm], whereby the protrusion upper end surface density ratio D1: D2 is changed to 1:36. The vacuum suction device of Example 2 was manufactured under the conditions described above.
（実施例３）
第２実施形態にしたがって、中央領域Ａ１（半径Ｒ１＝１０２［ｍｍ］）における突起１２の上端面の径ｄ１が０．２［ｍｍ］に、突起１２の間隔は４．０［ｍｍ］に調節された。環状領域Ａ２（幅Ｒ２＝５１［ｍｍ］）における突起上端面の径ｄ２が０．２［ｍｍ］に、突起１２の間隔が２．０［ｍｍ］に調節されることにより、実施例３の真空吸着装置が製造された。突起上端面密度比Ｄ１：Ｄ２が１：４に調節された。
(Example 3)
According to the second embodiment, the diameter d1 of the upper end surface of the protrusion 12 in the central region A1 (radius R1 = 102 [mm]) is adjusted to 0.2 [mm], and the distance between the protrusions 12 is adjusted to 4.0 [mm]. It was done. The diameter d2 of the upper end surface of the protrusion in the annular region A2 (width R2 = 51 [mm]) is adjusted to 0.2 [mm], and the distance between the protrusions 12 is adjusted to 2.0 [mm]. A vacuum suction device was manufactured. The protrusion upper end surface density ratio D1: D2 was adjusted to 1: 4.
（実施例４）
第３実施形態にしたがって、中央領域Ａ１（半径Ｒ１＝１０２［ｍｍ］）における突起１２の上端面の径ｄ１が０．２［ｍｍ］に調節され、内側環状領域Ａ２（幅Ｒ２＝５１［ｍｍ］）における突起１２の上端面の径ｄ２が１．０［ｍｍ］に調節され、かつ、外側環状領域Ａ３（幅Ｒ３＝７７［ｍｍ］）における突起１２の上端面の径ｄ３が０．５［ｍｍ］に調節されることにより、実施例４の真空吸着装置が製造された。各領域Ａ１〜Ａ３における突起上端面密度Ｄ１〜Ｄ３の大小関係が、不等式Ｄ１＜Ｄ３＜Ｄ２により表わされる。突起上端面密度比Ｄ１：Ｄ２：Ｄ３が１：２５：６.２５に調節された。
Example 4
According to the third embodiment, the diameter d1 of the upper end surface of the protrusion 12 in the central region A1 (radius R1 = 102 [mm]) is adjusted to 0.2 [mm], and the inner annular region A2 (width R2 = 51 [mm] ]), The diameter d2 of the upper end surface of the projection 12 is adjusted to 1.0 [mm], and the diameter d3 of the upper end surface of the projection 12 in the outer annular region A3 (width R3 = 77 [mm]) is 0.5. By adjusting to [mm], the vacuum suction device of Example 4 was manufactured. The magnitude relationship of the protrusion upper end surface densities D1 to D3 in the respective regions A1 to A3 is represented by the inequality D1 <D3 <D2. The protrusion upper end surface density ratio D1: D2: D3 was adjusted to 1: 25: 6.25.
（実施例５）
内側環状領域Ａ２における突起１２の上端面の径ｄ２が１．０［ｍｍ］に調節され、かつ、外側環状領域Ａ３における突起１２の上端面の径ｄ３が０．２８［ｍｍ］に調節されることにより、突起上端面密度比Ｄ１：Ｄ２：Ｄ３が１：２５：２.０に変更されたほかは、実施例４と同様の条件下で実施例５の真空吸着装置が製造された。
(Example 5)
The diameter d2 of the upper end surface of the projection 12 in the inner annular region A2 is adjusted to 1.0 [mm], and the diameter d3 of the upper end surface of the projection 12 in the outer annular region A3 is adjusted to 0.28 [mm]. Thus, the vacuum suction device of Example 5 was manufactured under the same conditions as in Example 4 except that the protrusion upper end surface density ratio D1: D2: D3 was changed to 1: 25: 2.0.
（実施例６）
第３実施形態の変形実施形態にしたがって、中央領域Ａ１（半径Ｒ１＝１０２［ｍｍ］）における突起１２の上端面の径ｄ１が０．２［ｍｍ］に調節され、内側環状領域Ａ２（幅Ｒ２＝５１［ｍｍ］）における突起１２の上端面の径ｄ２が０．４［ｍｍ］に調節され、かつ、外側環状領域Ａ３（幅Ｒ３＝７７［ｍｍ］）における突起１２の上端面の径ｄ３が１．２［ｍｍ］に調節されることにより、実施例６の真空吸着装置が製造された。各領域Ａ１〜Ａ３における突起上端面密度Ｄ１〜Ｄ３の大小関係が、不等式Ｄ１＜Ｄ２＜Ｄ３により表わされる。突起上端面密度比Ｄ１：Ｄ２：Ｄ３が１：４：３６に調節された。
(Example 6)
According to a modified embodiment of the third embodiment, the diameter d1 of the upper end surface of the protrusion 12 in the central region A1 (radius R1 = 102 [mm]) is adjusted to 0.2 [mm], and the inner annular region A2 (width R2) = 51 [mm]), the diameter d2 of the upper end surface of the protrusion 12 is adjusted to 0.4 [mm], and the diameter d3 of the upper end surface of the protrusion 12 in the outer annular region A3 (width R3 = 77 [mm]). Was adjusted to 1.2 [mm], whereby the vacuum suction device of Example 6 was manufactured. The magnitude relationship of the protrusion upper end surface densities D1 to D3 in the respective regions A1 to A3 is represented by the inequality D1 <D2 <D3. The protrusion upper end surface density ratio D1: D2: D3 was adjusted to 1: 4: 36.
（実施例７）
内側環状領域Ａ２における突起１２の上端面の径ｄ２が０．６［ｍｍ］に調節され、かつ、外側環状領域Ａ３における突起１２の上端面の径ｄ３が１．８［ｍｍ］に調節されることにより、突起上端面密度比Ｄ１：Ｄ２：Ｄ３が１：９：８１に変更されたほかは、実施例６と同様の条件下で実施例７の真空吸着装置が製造された。
(Example 7)
The diameter d2 of the upper end surface of the protrusion 12 in the inner annular region A2 is adjusted to 0.6 [mm], and the diameter d3 of the upper end surface of the protrusion 12 in the outer annular region A3 is adjusted to 1.8 [mm]. Thus, the vacuum suction device of Example 7 was manufactured under the same conditions as in Example 6 except that the protrusion upper end surface density ratio D1: D2: D3 was changed to 1: 9: 81.
（実施例８）
第４実施形態にしたがって、中央領域Ａ１（半径Ｒ１＝１０２［ｍｍ］）における突起１２の間隔は１０［ｍｍ］に調節される。内側環状領域Ａ２（幅Ｒ２＝５１［ｍｍ］）における突起１２の間隔が３［ｍｍ］に調節され、かつ、外側環状領域Ａ３（幅Ｒ３＝７７［ｍｍ］）における突起１２の間隔が４［ｍｍ］に調節されることによって実施例８の真空吸着装置が製造された。突起１２の径を０．２［ｍｍ］と調節された。各領域Ａ１〜Ａ３における突起上端面密度Ｄ１〜Ｄ３の大小関係が、不等式Ｄ１＜Ｄ３＜Ｄ２により表わされる。突起上端面密度比Ｄ１：Ｄ２：Ｄ３が１：１１：６.２５に調節された。
(Example 8)
According to the fourth embodiment, the interval between the protrusions 12 in the central region A1 (radius R1 = 102 [mm]) is adjusted to 10 [mm]. The interval between the projections 12 in the inner annular region A2 (width R2 = 51 [mm]) is adjusted to 3 [mm], and the interval between the projections 12 in the outer annular region A3 (width R3 = 77 [mm]) is 4 [ mm] was adjusted to produce the vacuum suction device of Example 8. The diameter of the protrusion 12 was adjusted to 0.2 [mm]. The magnitude relationship of the protrusion upper end surface densities D1 to D3 in the respective regions A1 to A3 is represented by the inequality D1 <D3 <D2. The protrusion upper end surface density ratio D1: D2: D3 was adjusted to 1: 11: 6.25.
（比較例）
（比較例１）
中央領域Ａ１および環状領域Ａ２の区分なく、突起１２の上端面の径ｄが１．２［ｍｍ］に調節された。その他は第１実施例と同様の製造条件下で比較例１の真空吸着装置が製造された。
(Comparative example)
(Comparative Example 1)
The diameter d of the upper end surface of the protrusion 12 was adjusted to 1.2 [mm] without dividing the central region A1 and the annular region A2. Other than that, the vacuum suction apparatus of Comparative Example 1 was manufactured under the same manufacturing conditions as in the first example.
（比較例２）
中央領域Ａ１（半径Ｒ１＝１０２［ｍｍ］）における突起１２の上端面の径ｄ１が０．６［ｍｍ］に調節され、環状領域Ａ２（幅Ｒ２＝５５［ｍｍ］）における突起１２の上端面の径ｄ２が０．２［ｍｍ］に調節された。その他は第１実施例と同様の製造条件下で比較例２の真空吸着装置が製造された。
(Comparative Example 2)
The diameter d1 of the upper end surface of the protrusion 12 in the central region A1 (radius R1 = 102 [mm]) is adjusted to 0.6 [mm], and the upper end surface of the protrusion 12 in the annular region A2 (width R2 = 55 [mm]). The diameter d2 was adjusted to 0.2 [mm]. Other than that, the vacuum suction device of Comparative Example 2 was manufactured under the same manufacturing conditions as in the first example.
（評価）
表１には、実施例および比較例のそれぞれの真空吸着装置により基板Ｗの真空吸着保持が５回にわたり繰り返された場合の、当該基板Ｗに対するパーティクルの平均付着個数の観測結果が示されている。基板Ｗに対するパーティクルの付着個数は、レーザー式のウエハ表面検査装置により計測された。
(Evaluation)
Table 1 shows the observation results of the average number of adhered particles to the substrate W when the vacuum suction holding of the substrate W is repeated five times by the respective vacuum suction devices of the example and the comparative example. . The number of particles attached to the substrate W was measured by a laser type wafer surface inspection apparatus.
表１から明らかなように、実施例１〜８の真空吸着装置によれば、比較例１〜２の真空吸着装置よりも基板Ｗに対するパーティクルの付着数量の低減が図られている。第３および第４実施形態にしたがった実施例４、５および８の真空吸着装置によれば、第１および第２実施形態にしたがった実施例１〜３の真空吸着装置、および、その他の実施例６および７の真空吸着装置よりも基板Ｗに対するパーティクルの付着数量のさらなる低減が図られている。 As is apparent from Table 1, according to the vacuum suction devices of Examples 1 to 8, the number of adhered particles to the substrate W is reduced as compared with the vacuum suction devices of Comparative Examples 1 and 2. According to the vacuum suction devices of Examples 4, 5 and 8 according to the third and fourth embodiments, the vacuum suction devices of Examples 1 to 3 according to the first and second embodiments, and other implementations The number of adhered particles to the substrate W is further reduced as compared with the vacuum suction apparatuses of Examples 6 and 7.
Ｄ１：Ｄ２が１：４〜２５の範囲に含まれる実施例１および３の真空吸着装置によれば、Ｄ１：Ｄ２が１：４〜２５の範囲から外れている実施例２の真空吸着装置よりも基板Ｗに対するパーティクルの付着数量の低減が図られている。Ｄ２：Ｄ３が１：０．２５〜６．２５の範囲に含まれる実施例４の真空吸着装置によれば、Ｄ２：Ｄ３が１：０．２５〜６．２５の範囲から外れている実施例５の真空吸着装置よりも基板Ｗに対するパーティクルの付着数量の低減が図られている。 According to the vacuum suction device of Examples 1 and 3 in which D1: D2 is included in the range of 1: 4-25, the vacuum suction device of Example 2 in which D1: D2 is out of the range of 1: 4-25. In addition, the number of particles attached to the substrate W is reduced. According to the vacuum suction device of Example 4 in which D2: D3 is included in the range of 1: 0.25 to 6.25, Example in which D2: D3 is out of the range of 1: 0.25 to 6.25 The number of adhered particles to the substrate W is reduced compared to the vacuum suction device 5.
１０‥セラミックス多孔質体、１２‥突起、２０‥セラミックス緻密質体、２２‥吸引孔。 DESCRIPTION OF SYMBOLS 10 ... Ceramic porous body, 12 ... Protrusion, 20 ... Ceramic dense body, 22 ... Suction hole.
Claims (7)
前記セラミックス多孔質体の側部および下部の一部に対して前記結合材粒子により封止されている界面が形成されるように接合され、当該界面とは異なる部分において前記セラミックス多孔質体の気孔に連通する吸引孔が形成されているセラミックス緻密質体と、を備え、
前記セラミックス多孔質体の上部において定義される複数の領域のそれぞれにおける、前記突起の上端部の面積密度である突起上端面密度に差が生じるように、前記突起の上端面積および配置のうち一方または両方が調節されていることを特徴とする真空吸着装置。 A ceramic porous body composed of ceramic particles as skeleton particles bonded by a binder particle, and a protrusion supporting an object at the upper end formed on the upper side;
The ceramic porous body is bonded so as to form an interface sealed with the binder particles to a part of the side portion and the lower portion of the ceramic porous body, and the pores of the ceramic porous body are different from the interface. A ceramic dense body in which a suction hole communicating with is formed,
One of the upper end area and the arrangement of the protrusions so that a difference occurs in the protrusion upper end surface density which is the area density of the upper end part of the protrusions in each of the plurality of regions defined in the upper part of the ceramic porous body, or A vacuum suction device characterized in that both are adjusted.
前記複数の領域として中央領域と、前記中央領域を環状に囲む環状領域とが定義され、前記中央領域における突起上端面密度が、前記環状領域における突起上端面密度よりも低くなるように、前記突起の上端面積および配置のうち一方または両方が調節されていることを特徴とする真空吸着装置。 The vacuum suction apparatus according to claim 1,
A central area and an annular area surrounding the central area are defined as the plurality of areas, and the protrusion upper end surface density in the central area is lower than the protrusion upper end surface density in the annular area. One or both of the upper end area and the arrangement of the vacuum suction device are adjusted.
複数の前記環状領域のうち一の環状領域における突起上端面密度が、前記一の環状領域の外側にある他の環状領域における突起上端面密度よりも高くなるように、前記突起の上端面積および配置のうち一方または両方が調節されていることを特徴とする真空吸着装置。 The vacuum suction device according to claim 2,
The upper end area and the arrangement of the protrusions so that the protrusion upper end surface density in one annular region of the plurality of annular regions is higher than the protrusion upper end surface density in another annular region outside the one annular region. One or both of them are adjusted, and the vacuum suction device is characterized.
前記中央領域に対する前記環状領域の突起上端面密度比が４〜２５の範囲に含まれるように、前記突起の上端面積および配置のうち一方または両方が調節されていることを特徴とする真空吸着装置。 The vacuum suction device according to claim 2,
One or both of the upper end area and the arrangement of the projections are adjusted so that the projection upper end surface density ratio of the annular region to the central region is in the range of 4 to 25. .
前記一の環状領域の前記中央領域に対する前記他の環状領域の突起上端面密度比が０．２５〜６．２５の範囲に含まれるように、前記突起の上端面積および配置のうち一方または両方が調節されていることを特徴とする真空吸着装置。 The vacuum suction device according to claim 3.
One or both of the upper end area and the arrangement of the protrusions are included such that the protrusion upper end surface density ratio of the other annular region with respect to the central region of the one annular region is included in the range of 0.25 to 6.25. A vacuum suction device characterized by being adjusted.
前記セラミックス多孔質体の上部に複数の突起が分散配置されるように形成され、
前記複数の領域のそれぞれにおける前記複数の突起の配置態様が同一である一方、前記複数の領域のそれぞれにおける前記複数の突起の上端部の面積が差別化されることにより、前記複数の領域のそれぞれにおける突起上端面密度が差別化されていることを特徴とする真空吸着装置。 In the vacuum suction device according to any one of claims 1 to 5,
A plurality of protrusions are formed in a distributed manner on the ceramic porous body,
While the arrangement form of the plurality of protrusions in each of the plurality of regions is the same, the areas of the upper ends of the plurality of protrusions in each of the plurality of regions are differentiated, thereby each of the plurality of regions. A vacuum suction device characterized in that the protrusion upper end surface density is differentiated.
前記セラミックス多孔質体の上部に複数の突起が分散配置されるように形成され、
前記複数の領域のそれぞれにおける前記複数の突起の上端部の面積が同一である一方、前記複数の領域のそれぞれにおける前記複数の突起の配置態様が差別化されることにより、前記複数の領域のそれぞれにおける突起上端面密度が差別化されていることを特徴とする真空吸着装置。 In the vacuum suction device according to any one of claims 1 to 5,
A plurality of protrusions are formed in a distributed manner on the ceramic porous body,
While the areas of the upper end portions of the plurality of protrusions in each of the plurality of regions are the same, the arrangement of the plurality of protrusions in each of the plurality of regions is differentiated, thereby each of the plurality of regions. A vacuum suction device characterized in that the protrusion upper end surface density is differentiated.
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