JP2015065025A - Oled表示パネル - Google Patents
Oled表示パネル Download PDFInfo
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- JP2015065025A JP2015065025A JP2013198158A JP2013198158A JP2015065025A JP 2015065025 A JP2015065025 A JP 2015065025A JP 2013198158 A JP2013198158 A JP 2013198158A JP 2013198158 A JP2013198158 A JP 2013198158A JP 2015065025 A JP2015065025 A JP 2015065025A
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- 239000011347 resin Substances 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000005530 etching Methods 0.000 claims abstract description 31
- 238000007789 sealing Methods 0.000 claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 239000010408 film Substances 0.000 claims description 122
- 239000010409 thin film Substances 0.000 claims description 9
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 230000000873 masking effect Effects 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 20
- 239000002184 metal Substances 0.000 abstract description 20
- 238000012545 processing Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 91
- 229910052581 Si3N4 Inorganic materials 0.000 description 36
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 24
- 239000000377 silicon dioxide Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 7
- 239000004925 Acrylic resin Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80524—Transparent cathodes, e.g. comprising thin metal layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】
基板1上には、表示部の有機発光素子に導通している複数の金属電極2からなる端子領域6が形成される。次に、表示部及び端子領域6の表面上に、第1Si含有無機層、有機樹脂層及び第2Si含有無機層からなる積層封止膜が形成される。次に、表示部がマスクされ、第1Si含有無機層及び第2Si含有無機層に適したエッチング条件でエッチングが実行され、金属電極2上の第1Si含有無機層及び第2Si含有無機層が除去され、金属電極2の表面が露出される。
【選択図】図2
Description
(実施形態1)
(実施形態2)
(変形例)
2 金属端子
5 表示領域
6 端子領域
8 SiN層
9 SiO層
11 ガラス基板
28 第1Si含有層
30 有機樹脂層
31 第2Si含有層
Claims (7)
- 基板と、
当該基板上に形成された複数の有機発光素子を含む表示部と、
前記基板上に縞状に形成され、かつ、他の基板上の電極にそれぞれ導通可能な複数の電極と、
前記表示部上に形成され、かつ、前記基板側から順に第1Si含有無機層、有機樹脂層及び第2Si含有無機層を有する積層封止膜とを備え、
前記積層封止膜と同じ第1Si含有無機層及び有機樹脂層が前記複数の電極間に形成されている
ことを特徴とするOLED表示パネル。 - 前記第1Si含有無機層及び有機樹脂層の間にSiO層が形成されている
ことを特徴とする請求項1記載のOLED表示パネル。 - 前記第1Si含有無機層及び有機樹脂層の間にアモルファスシリコン層が形成されている
ことを特徴とする請求項1記載のOLED表示パネル。 - 前記表示部において、各有機発光素子間を区切るバンクと同じ材料の層が、前記複数の電極間に形成され、前記積層封止膜と同じ第1Si含有無機層及び有機樹脂層は、当該バンクと同じ材料の層と各電極との間に形成されている
ことを特徴とする請求項1記載のOLED表示パネル。 - 前記基板上には前記表示部を構成する有機発光素子に導通する配線が形成されており、
前記電極の表面と前記配線の表面にわたってITO薄膜がコーティングされている
ことを特徴とする請求項4記載のOLED表示パネル。 - 前記ITO薄膜は、前記おり、当該ITO薄膜は、前記各有機発光素子間を区切るバンクと同じ材料の層の表面にまで及んでいる
ことを特徴とする請求項5記載のOLED表示パネル。 - 複数の有機発光素子を含む表示部を基板上に形成し、
他の基板上の電極にそれぞれ導通可能な複数の電極を前記基板上に縞状に形成し、
前記基板側から順に第1Si含有無機層、有機樹脂層及び第2Si含有無機層を有する積層封止膜を前記表示部及び前記複数の電極上に形成し、
前記表示部をマスクして、前記第1Si含有無機層及び前記第2Si含有無機層に適したエッチング条件でエッチングを行うことにより、前記複数の電極の表面を露出させる
ことを特徴とするOLED表示パネルの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013198158A JP6189692B2 (ja) | 2013-09-25 | 2013-09-25 | Oled表示パネル |
US14/495,945 US9147857B2 (en) | 2013-09-25 | 2014-09-25 | OLED display panel |
US14/824,899 US9299961B2 (en) | 2013-09-25 | 2015-08-12 | OLED display panel |
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JP2013198158A JP6189692B2 (ja) | 2013-09-25 | 2013-09-25 | Oled表示パネル |
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JP6189692B2 JP6189692B2 (ja) | 2017-08-30 |
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Cited By (6)
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JP2015191891A (ja) * | 2014-03-27 | 2015-11-02 | ユニバーサル ディスプレイ コーポレイション | 密封封止分離oledピクセル |
JP2018004816A (ja) * | 2016-06-29 | 2018-01-11 | 株式会社ジャパンディスプレイ | 表示装置 |
JP2019050128A (ja) * | 2017-09-11 | 2019-03-28 | パイオニア株式会社 | 発光装置 |
US10297783B2 (en) | 2016-11-01 | 2019-05-21 | Japan Display Inc. | Display device with moisture protection and method for manufacturing the same |
US10749123B2 (en) | 2014-03-27 | 2020-08-18 | Universal Display Corporation | Impact resistant OLED devices |
JP2021504873A (ja) * | 2017-11-30 | 2021-02-15 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | 表示パネル、その封止方法及び表示装置 |
Families Citing this family (6)
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CN105469732B (zh) * | 2014-09-05 | 2019-02-05 | 联想(北京)有限公司 | 显示装置和电子设备 |
CN105118844A (zh) * | 2015-07-01 | 2015-12-02 | 深圳市华星光电技术有限公司 | 一种柔性显示面板的制备方法及柔性显示面板 |
JP6775376B2 (ja) * | 2016-10-14 | 2020-10-28 | 株式会社ジャパンディスプレイ | 表示装置 |
US10409080B2 (en) * | 2017-02-01 | 2019-09-10 | Facebook Technologies, Llc | Spherical display using flexible substrates |
CN106898264B (zh) * | 2017-03-06 | 2019-10-22 | 武汉华星光电技术有限公司 | 一种可折叠面板及其制作方法 |
CN107134543B (zh) * | 2017-04-24 | 2019-05-07 | 深圳市华星光电半导体显示技术有限公司 | 阵列基板及制造方法、显示装置 |
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US20060220056A1 (en) * | 2005-03-30 | 2006-10-05 | Lee Kwan H | Light emitting display and method of manufacturing the same |
US20070054430A1 (en) * | 2005-09-07 | 2007-03-08 | Kenji Nishigaki | Method of fabricating organic electroluminescent devices |
JP2012209215A (ja) * | 2011-03-30 | 2012-10-25 | Seiko Epson Corp | 有機el装置の製造方法、電子機器 |
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US6866901B2 (en) | 1999-10-25 | 2005-03-15 | Vitex Systems, Inc. | Method for edge sealing barrier films |
US6822264B2 (en) * | 2001-11-16 | 2004-11-23 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
KR102110226B1 (ko) * | 2013-09-11 | 2020-05-14 | 삼성디스플레이 주식회사 | 표시패널 및 그 제조방법 |
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- 2013-09-25 JP JP2013198158A patent/JP6189692B2/ja active Active
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2014
- 2014-09-25 US US14/495,945 patent/US9147857B2/en active Active
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- 2015-08-12 US US14/824,899 patent/US9299961B2/en active Active
Patent Citations (4)
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US20060220056A1 (en) * | 2005-03-30 | 2006-10-05 | Lee Kwan H | Light emitting display and method of manufacturing the same |
JP2006286600A (ja) * | 2005-03-30 | 2006-10-19 | Samsung Sdi Co Ltd | 発光表示装置及び発光表示装置の製造方法 |
US20070054430A1 (en) * | 2005-09-07 | 2007-03-08 | Kenji Nishigaki | Method of fabricating organic electroluminescent devices |
JP2012209215A (ja) * | 2011-03-30 | 2012-10-25 | Seiko Epson Corp | 有機el装置の製造方法、電子機器 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015191891A (ja) * | 2014-03-27 | 2015-11-02 | ユニバーサル ディスプレイ コーポレイション | 密封封止分離oledピクセル |
US10749123B2 (en) | 2014-03-27 | 2020-08-18 | Universal Display Corporation | Impact resistant OLED devices |
US10910590B2 (en) | 2014-03-27 | 2021-02-02 | Universal Display Corporation | Hermetically sealed isolated OLED pixels |
US11997866B2 (en) | 2014-03-27 | 2024-05-28 | Universal Display Corporation | Hermetically sealed isolated OLED pixels |
JP2018004816A (ja) * | 2016-06-29 | 2018-01-11 | 株式会社ジャパンディスプレイ | 表示装置 |
US10297783B2 (en) | 2016-11-01 | 2019-05-21 | Japan Display Inc. | Display device with moisture protection and method for manufacturing the same |
JP2019050128A (ja) * | 2017-09-11 | 2019-03-28 | パイオニア株式会社 | 発光装置 |
JP2021504873A (ja) * | 2017-11-30 | 2021-02-15 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | 表示パネル、その封止方法及び表示装置 |
JP7275447B2 (ja) | 2017-11-30 | 2023-05-18 | 京東方科技集團股▲ふん▼有限公司 | 表示パネル、その封止方法及び表示装置 |
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US9147857B2 (en) | 2015-09-29 |
JP6189692B2 (ja) | 2017-08-30 |
US20150349297A1 (en) | 2015-12-03 |
US20150084025A1 (en) | 2015-03-26 |
US9299961B2 (en) | 2016-03-29 |
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