JP2015060865A5 - - Google Patents

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Publication number
JP2015060865A5
JP2015060865A5 JP2013191938A JP2013191938A JP2015060865A5 JP 2015060865 A5 JP2015060865 A5 JP 2015060865A5 JP 2013191938 A JP2013191938 A JP 2013191938A JP 2013191938 A JP2013191938 A JP 2013191938A JP 2015060865 A5 JP2015060865 A5 JP 2015060865A5
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JP
Japan
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region
electronic control
control device
rib structure
main body
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JP2013191938A
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English (en)
Japanese (ja)
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JP6250997B2 (ja
JP2015060865A (ja
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Priority to JP2013191938A priority Critical patent/JP6250997B2/ja
Priority claimed from JP2013191938A external-priority patent/JP6250997B2/ja
Publication of JP2015060865A publication Critical patent/JP2015060865A/ja
Publication of JP2015060865A5 publication Critical patent/JP2015060865A5/ja
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Publication of JP6250997B2 publication Critical patent/JP6250997B2/ja
Expired - Fee Related legal-status Critical Current
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JP2013191938A 2013-09-17 2013-09-17 電子制御装置 Expired - Fee Related JP6250997B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013191938A JP6250997B2 (ja) 2013-09-17 2013-09-17 電子制御装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013191938A JP6250997B2 (ja) 2013-09-17 2013-09-17 電子制御装置

Publications (3)

Publication Number Publication Date
JP2015060865A JP2015060865A (ja) 2015-03-30
JP2015060865A5 true JP2015060865A5 (cg-RX-API-DMAC10.html) 2016-02-04
JP6250997B2 JP6250997B2 (ja) 2017-12-20

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ID=52818183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013191938A Expired - Fee Related JP6250997B2 (ja) 2013-09-17 2013-09-17 電子制御装置

Country Status (1)

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JP (1) JP6250997B2 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6540358B2 (ja) * 2015-08-13 2019-07-10 沖電気工業株式会社 放熱構造、筐体および携帯端末
JP2017199846A (ja) * 2016-04-28 2017-11-02 本田技研工業株式会社 電子制御装置
JP6597476B2 (ja) * 2016-05-20 2019-10-30 日亜化学工業株式会社 配線基体の製造方法並びに配線基体及びそれを用いた発光装置。
JP7257893B2 (ja) * 2019-06-25 2023-04-14 日立Astemo株式会社 電子制御装置
TWI896542B (zh) * 2019-07-23 2025-09-11 德商漢高股份有限及兩合公司 高熱通量多元件總成之熱管理
JPWO2021161566A1 (cg-RX-API-DMAC10.html) 2020-02-14 2021-08-19
JP2022044463A (ja) * 2020-09-07 2022-03-17 昭和電工マテリアルズ株式会社 電磁波シールド用焼結体付き樹脂構造体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2973864B2 (ja) * 1995-04-11 1999-11-08 ダイキン工業株式会社 スイッチボックスのパワーデバイス支持構造
JPH1195871A (ja) * 1997-09-17 1999-04-09 Matsushita Electric Ind Co Ltd 電子機器の放熱構造
JP2003289191A (ja) * 2002-03-28 2003-10-10 Denso Corp 電子制御装置
JP4187596B2 (ja) * 2003-06-26 2008-11-26 Ｄｘアンテナ株式会社 電子機器の放熱構造
JP2006059706A (ja) * 2004-08-20 2006-03-02 Toyo Tire & Rubber Co Ltd リブ付き基板及びその製造方法
JP4350762B2 (ja) * 2007-03-19 2009-10-21 レノボ・シンガポール・プライベート・リミテッド 携帯式コンピュータ
JP5151933B2 (ja) * 2008-11-27 2013-02-27 株式会社Ｉｈｉ 電子機器用放熱器
JP5222838B2 (ja) * 2009-12-21 2013-06-26 日立オートモティブシステムズ株式会社 制御装置

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