JP2015060865A5 - - Google Patents
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- JP2015060865A5 JP2015060865A5 JP2013191938A JP2013191938A JP2015060865A5 JP 2015060865 A5 JP2015060865 A5 JP 2015060865A5 JP 2013191938 A JP2013191938 A JP 2013191938A JP 2013191938 A JP2013191938 A JP 2013191938A JP 2015060865 A5 JP2015060865 A5 JP 2015060865A5
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- JP
- Japan
- Prior art keywords
- region
- electronic control
- control device
- rib structure
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 210000000614 Ribs Anatomy 0.000 claims 33
- 239000004020 conductor Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 4
- 230000000875 corresponding Effects 0.000 claims 2
- 239000003973 paint Substances 0.000 claims 2
- 230000003014 reinforcing Effects 0.000 claims 2
- 239000011231 conductive filler Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Claims (20)
前記回路基板に実装された発熱部品と、
本体部、および前記本体部の一面における、前記発熱部品が実装された前記回路基板の領域に対応して形成された隆起部を有し、前記回路基板を支持する支持部材と、
前記支持部材の隆起部と、前記発熱部品が実装された前記回路基板の領域との間、又は前記支持部材の隆起部と前記発熱部品との間に介装された熱伝導材とを備え、
前記支持部材は、前記本体部の前記一面に形成された、それぞれ、複数の閉じた形状のリブ構造から構成される第一の領域、および第二の領域を備え、前記第一の領域における前記リブ構造に内接する円または楕円の面積は、前記第二の領域における前記リブ構造に内接する円または楕円の面積より大きく、前記第一の領域は、前記隆起部の近傍に配置され、前記第二の領域は、前記第一の領域の外側に配置されている、電子制御装置。 A circuit board;
A heat generating component mounted on the circuit board;
A support member for supporting the circuit board, including a main body part and a raised part formed on one surface of the main body part corresponding to the area of the circuit board on which the heat generating component is mounted;
A heat conductive material interposed between the raised portion of the support member and the area of the circuit board on which the heat generating component is mounted, or between the raised portion of the support member and the heat generating component;
The support member includes a first region formed of a plurality of closed-shaped rib structures formed on the one surface of the main body portion, and a second region, and the first member in the first region. The area of the circle or ellipse inscribed in the rib structure is larger than the area of the circle or ellipse inscribed in the rib structure in the second region, and the first region is disposed in the vicinity of the raised portion, The second area is an electronic control device arranged outside the first area.
前記支持部材は、さらに、前記第一の領域および前記第二の領域との間に介在された第三の領域を備え、前記第三の領域には、前記第一の領域および前記第二の領域に形成された前記リブ構造とは異なる形状を有するか、または前記第一の領域および前記第二の領域に形成された前記リブ構造の面積とは異なる面積を有する少なくとも１つのリブ構造が形成されている、電子制御装置。 The electronic control device according to claim 1.
The support member further includes a third region interposed between the first region and the second region, and the third region includes the first region and the second region. At least one rib structure having a shape different from the rib structure formed in the region or having an area different from the area of the rib structure formed in the first region and the second region is formed. An electronic control device.
前記支持部材は、前記第一の領域および前記第二の領域を囲み、前記リブ構造よりも高い側壁を備えると共に、前記側壁と前記第二の領域との間に介在された第四の領域を備え、前記第四の領域には、前記第二の領域に形成された前記リブ構造とは異なる形状を有するか、または前記第二の領域に形成された前記リブ構造の面積とは異なる面積を有する少なくとも１つのリブ構造が形成されている、電子制御装置。 The electronic control device according to claim 2,
The support member surrounds the first region and the second region, has a side wall higher than the rib structure, and has a fourth region interposed between the side wall and the second region. The fourth region has a shape different from the rib structure formed in the second region, or has an area different from the area of the rib structure formed in the second region. An electronic control device in which at least one rib structure is formed.
前記第一の領域の一部は、直接、前記側壁に連結されている、電子制御装置。 The electronic control device according to claim 3.
An electronic control unit, wherein a part of the first region is directly connected to the side wall.
前記第二の領域における断面二次モーメントは、前記第一の領域における断面二次モーメントより大きい、電子制御装置。 The electronic control device according to claim 1.
The electronic control device, wherein the cross-sectional second moment in the second region is larger than the cross-sectional second moment in the first region.
前記リブ構造は少なくとも１つのリブを有し、前記リブは、前記本体部に接続される根元部側が前記本体部に向かって、漸次、幅広くなるように傾斜または湾曲されている、電子制御装置。 The electronic control device according to claim 1.
The electronic control device, wherein the rib structure includes at least one rib, and the rib is inclined or curved so that a base portion connected to the main body gradually becomes wider toward the main body.
前記本体部の一面および前記リブ構造の表面に、前記本体部の材料および前記リブ構造の材料よりも放射率が高い放熱用塗料が設けられている、電子制御装置。 The electronic control device according to claim 6.
An electronic control device, wherein a heat radiation paint having a higher emissivity than that of the material of the main body and the material of the rib structure is provided on one surface of the main body and the surface of the rib structure.
前記回路基板に実装された発熱部品と、
本体部、および前記本体部の一面における、前記発熱部品が実装された前記回路基板の領域に対応して形成された隆起部を有し、前記回路基板を支持する支持部材と、
前記支持部材の隆起部と、前記発熱部品が実装された前記回路基板の領域との間、又は前記支持部材の隆起部と前記発熱部品との間に介装された熱伝導材とを備え、
前記支持部材は、前記本体部の前記一面に形成された、それぞれ、複数の閉じた形状のリブ構造から構成される第一の領域、および第二の領域を備え、前記第一の領域における前記リブ構造の高さは、前記第二の領域における前記リブ構造の高さより低く、前記第一の領域は、前記隆起部の近傍に配置され、前記第二の領域は、前記第一の領域の外側に配置されている、電子制御装置。 A circuit board;
A heat generating component mounted on the circuit board;
A support member for supporting the circuit board, including a main body part and a raised part formed on one surface of the main body part corresponding to the area of the circuit board on which the heat generating component is mounted;
A heat conductive material interposed between the raised portion of the support member and the area of the circuit board on which the heat generating component is mounted, or between the raised portion of the support member and the heat generating component;
The support member includes a first region formed of a plurality of closed-shaped rib structures formed on the one surface of the main body portion, and a second region, and the first member in the first region. The height of the rib structure is lower than the height of the rib structure in the second region, the first region is disposed in the vicinity of the raised portion, and the second region is the height of the first region. Electronic control device arranged on the outside.
前記第二の領域におけるリブ構造は、前記第一の領域におけるリブ構造との接続部において、前記第一の領域に向けて漸次高さが低下する傾斜部を有し、前記第一の領域における前記リブ構造に、高さ方向においてなだらかに連接している、電子制御装置。 The electronic control device according to claim 8.
In the rib structure in the second region, the connection portion of the rib structure in the first region has an inclined portion which gradually height toward the first region is reduced, the first region An electronic control device that is smoothly connected to the rib structure in the height direction.
前記第一の領域および前記第二の領域に形成された前記リブ構造は、複数のリブが連接して構成され、前記第二の領域に形成された前記リブ構造の少なくとも１つの前記リブの中間部に、前記リブより幅広く形成された補強部が形成されている、電子制御装置。 The electronic control device according to claim 8.
The rib structure formed in the first region and the second region is formed by connecting a plurality of ribs, and is intermediate between at least one of the rib structures formed in the second region. An electronic control device in which a reinforcing part formed wider than the rib is formed in the part.
前記リブ構造を構成するリブは、前記本体部の前記一面に接続される根元部の少なくとも一部が、前記本体部側に向かって、漸次、幅広くなるように傾斜または湾曲されている、電子制御装置。 The electronic control device according to claim 10,
The ribs constituting the rib structure are electronically controlled such that at least a part of a base portion connected to the one surface of the main body portion is inclined or curved so as to gradually become wider toward the main body portion side. apparatus.
前記第一の領域に形成された前記補強部は、前記本体部の前記一面に接続される根元部側が前記本体部に向かって、漸次、幅広くなるように傾斜または湾曲されている、電子制御装置。 The electronic control device according to claim 10,
The reinforcing part formed in the first region is inclined or curved so that a base part side connected to the one surface of the main body part gradually becomes wider toward the main body part. .
前記本体部の前記一面および少なくとも前記第一の領域における前記リブ構造の表面に、前記本体部の材料および前記リブ構造の材料よりも放射率が高い放熱用塗料が設けられている、電子制御装置。 The electronic control device according to claim 12, wherein
An electronic control device, wherein a heat radiation paint having a higher emissivity than that of the material of the main body and the material of the rib structure is provided on the surface of the rib structure in the one surface and at least the first region of the main body. .
前記第一の領域および前記第二の領域に形成された前記リブ構造は、内部空間が閉じた円、楕円または多角形形状のいずれかである、電子制御装置。 The electronic control device according to claim 1 or 8,
The said rib structure formed in said 1st area | region and said 2nd area | region is an electronic control apparatus which is either a circle | round | yen, ellipse, or polygonal shape with which internal space was closed.
前記第一の領域および前記第二の領域に形成された前記リブ構造は、内部空間が閉じた正六角形形状を有する、電子制御装置。 The electronic control device according to claim 14.
The said rib structure formed in said 1st area | region and said 2nd area | region is an electronic control apparatus which has regular hexagon shape with which internal space was closed.
前記支持部材は、前記側壁に一体成形され、全体が均一な厚さの固定部を有し、前記固定部の厚さは、前記リブ構造の高さより大きい、電子制御装置。 The electronic control device according to claim 3.
The support member is integrally formed with the side wall and has a fixed portion having a uniform thickness as a whole, and the thickness of the fixed portion is larger than the height of the rib structure.
前記熱伝導材は、前記発熱部品と前記隆起部との間に介装されている、電子制御装置。 The electronic control device according to claim 1 or 8,
The electronic control device, wherein the heat conductive material is interposed between the heat generating component and the raised portion.
前記熱伝導材は、前記発熱部品が実装された前記回路基板と前記隆起部との間に介装されている、電子制御装置。 The electronic control device according to claim 1 or 8,
The electronic control device, wherein the heat conducting material is interposed between the circuit board on which the heat generating component is mounted and the raised portion.
前記熱伝導材は、熱伝導率が０．２Ｗ／ｍＫ以上、室温での弾性率が１ＫＰａ以上１ＭＰａ以下の樹脂と熱伝導性フィラとの混合物である、電子制御装置。 The electronic control device according to claim 1 or 8,
The electronic control device, wherein the thermal conductive material is a mixture of a resin having a thermal conductivity of 0.2 W / mK or more and an elastic modulus at room temperature of 1 KPa or more and 1 MPa or less and a thermal conductive filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013191938A JP6250997B2 (en) | 2013-09-17 | 2013-09-17 | Electronic control unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013191938A JP6250997B2 (en) | 2013-09-17 | 2013-09-17 | Electronic control unit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015060865A JP2015060865A (en) | 2015-03-30 |
| JP2015060865A5 true JP2015060865A5 (en) | 2016-02-04 |
| JP6250997B2 JP6250997B2 (en) | 2017-12-20 |
Family
ID=52818183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013191938A Active JP6250997B2 (en) | 2013-09-17 | 2013-09-17 | Electronic control unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6250997B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6540358B2 (en) * | 2015-08-13 | 2019-07-10 | 沖電気工業株式会社 | Heat dissipation structure, case and portable terminal |
| JP2017199846A (en) * | 2016-04-28 | 2017-11-02 | 本田技研工業株式会社 | Electronic control device |
| JP6597476B2 (en) * | 2016-05-20 | 2019-10-30 | 日亜化学工業株式会社 | Wiring substrate manufacturing method, wiring substrate, and light-emitting device using the same. |
| JP7257893B2 (en) * | 2019-06-25 | 2023-04-14 | 日立Astemo株式会社 | electronic controller |
| US20230155448A1 (en) | 2020-02-14 | 2023-05-18 | Nidec Corporation | Inverter device, motor, and motor unit |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2973864B2 (en) * | 1995-04-11 | 1999-11-08 | ダイキン工業株式会社 | Switch box power device support structure |
| JPH1195871A (en) * | 1997-09-17 | 1999-04-09 | Matsushita Electric Ind Co Ltd | Heat radiation structure of electronic equipment |
| JP2003289191A (en) * | 2002-03-28 | 2003-10-10 | Denso Corp | Electronic control device |
| JP4187596B2 (en) * | 2003-06-26 | 2008-11-26 | Ｄｘアンテナ株式会社 | Heat dissipation structure of electronic equipment |
| JP2006059706A (en) * | 2004-08-20 | 2006-03-02 | Toyo Tire & Rubber Co Ltd | Substrate with rib and its manufacturing method |
| JP4350762B2 (en) * | 2007-03-19 | 2009-10-21 | レノボ・シンガポール・プライベート・リミテッド | Portable computer |
| JP5151933B2 (en) * | 2008-11-27 | 2013-02-27 | 株式会社Ｉｈｉ | Heat sink for electronic equipment |
| JP5222838B2 (en) * | 2009-12-21 | 2013-06-26 | 日立オートモティブシステムズ株式会社 | Control device |
-
2013
- 2013-09-17 JP JP2013191938A patent/JP6250997B2/en active Active
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