JP2015056592A - Die bonder and die bonding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide highly reliable die bonder and die bonding method which allow for quick and accurate die bonding.SOLUTION: A die bonder includes a recognition mark provided on a substrate or the guide or shoot of a bonding head in the proximity of the substrate, and bonding position correction means including imaging means for imaging the recognition mark and a recognition mark provided near the die bonding position of the substrate and first position correction means for correcting the position of mechanical origin used for die bonding, based on the imaging data obtained by the imaging means.

Description

  The present invention relates to a semiconductor manufacturing apparatus such as a die bonder, and relates to a highly reliable die bonder and a die bonding method.

A part of the process of assembling a package by mounting a die (semiconductor chip) on a substrate (hereinafter referred to as a substrate) such as a wiring substrate or a lead frame is a die bonding step of adsorbing the die from the wafer and bonding it to the substrate.
In the die bonding process, it is necessary to bond the die accurately to the bonding surface of the substrate. However, it is common that the substrate is supplied from upstream, conveyed to a die bonding position (bonding head table) by a conveying mechanism such as a belt, and fixed to a predetermined position on the bonding head table to perform a bonding operation. It is. Usually, heat is always applied to the bonding head table during operation. For this reason, the position of the substrate on the bonding head table changes with time, and the table offset amount shifts (shifts), so that the bonding position slightly shifts.
The origin of the mechanical position when moving the bonding head, the bond camera, or the like is the position of the mechanical origin when the apparatus is initialized. In this case, it is assumed that the substrate is fixed at a predetermined position on the bonding head table. If the predetermined position is shifted, the bonding position by the bonding head is shifted by the shifted amount (shifted amount).

There is Patent Document 1 as a conventional technique for solving this type of problem. In Patent Document 1, a reference mark is created with a laser or the like near the substrate. Next, the created reference mark and a recognition pattern provided in advance at the bonding position of the substrate are imaged, and the position of the die adjacent to the bonding position is corrected based on the imaging data obtained by the two imaging operations. The die is bonded to the substrate.
In the position correction, the reference mark and the recognition pattern are imaged, the position is specified by pattern recognition processing, and the die bonding position is corrected from the deviation of the specified position. However, if the substrate position shifts due to the change of the transport mechanism with time, the bonding position accuracy deteriorates and the bonding reliability decreases.

JP 2012-069731 A

As described above, in Patent Document 1, no consideration is given to the positional deviation of the substrate due to the positional deviation of the table due to the temporal change of the transport mechanism. Further, since the reference mark is provided in the substrate or in the vicinity of the substrate, it is easily affected by so-called disturbance such as vibration or heat generated by bonding.
An object of the present invention is to provide a highly reliable die bonder and die bonding capable of accurately and quickly bonding a die.

  In order to achieve the above object, a die bonder of the present invention comprises a recognition mark provided on a substrate or a guide of a bonding head table in the vicinity of the substrate or on a frame feeder chute, the recognition mark and a die of the substrate. Imaging means for imaging a recognition mark provided in the vicinity of the bonding position, and first position correction means for correcting the position of a mechanical origin used for die bonding based on imaging data obtained by the imaging means The first feature is that it has bonding position correcting means.

  In the die bonder according to the first aspect of the present invention, the first position correcting means is a shift for correcting the position of the mechanical origin every time the number of operations of die bonding the die to the substrate reaches a predetermined number. It is a second feature of the present invention that the amount is calculated and the offset value of the mechanical origin is updated based on the calculated amount of deviation.

  In the die bonder according to the first feature or the second feature of the present invention, the bonding position correction means further calculates the position of the recognition pattern provided on the substrate with reference to the mechanical origin, It is a third feature of the present invention that second position correction means for correcting a position for die bonding of the die at the calculated position is provided.

  In order to achieve the above object, the die bonding method of the present invention includes a first imaging step of imaging a region in which a recognition pattern is provided near a bonding position of a substrate, and the captured recognition pattern. A first position calculating step of performing image processing on the reflected area and calculating the position of the recognition pattern with reference to a mechanical origin, and a first correcting the die bonding position based on the position of the recognition pattern A position correction step, a second imaging step of imaging a region where a recognition mark is provided on a guide of a bonding head table or a frame feeder chute in the vicinity of the substrate, and the captured recognition mark Second position calculation for performing image processing on the reflected area and calculating the position of the recognition mark with reference to the mechanical origin A second position correcting step for correcting the position of the mechanical origin based on the position of the recognition mark, and a bonding step for die bonding the die to the die bonding position corrected by the first correcting step. It is a fourth feature of the present invention to have

  In the die bonding method according to the fourth aspect of the present invention, the second imaging step, the second position calculating step, and the second position correcting step include bonding the die to the substrate. The present invention calculates a deviation amount for correcting the position of the mechanical origin every time the number of work steps becomes a predetermined number of times, and updates the offset value of the mechanical origin based on the calculated deviation amount. The fifth feature.

  According to the present invention, a highly reliable die bonder and die bonding method capable of accurately and quickly bonding dies can be realized.

It is a block diagram which shows the structure of one Example of the die bonder of this invention. It is the block diagram which expanded the main feeder part 107 vicinity of the die bonder 100 of FIG. It is a block diagram for demonstrating one Example of the structure of the control part 200 of the die bonder of this invention. It is a figure for demonstrating one Example of the bonding head table of the die bonder of this invention. It is a flowchart for demonstrating one Example of the process sequence of the position correction in the die bonder of this invention. It is a figure which shows one Example of the imaging data of the recognition patterns 8 and 9 in the flowchart of FIG. It is a figure which shows one Example of the imaging data of the 1st recognition mark 6 and the 2nd recognition mark 7 in the flowchart of FIG. It is a figure which shows one Example of the imaging data of the 1st recognition mark 6 and the 2nd recognition mark 7 in the flowchart of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In addition, the following description is for describing one embodiment of the present invention, and does not limit the scope of the present invention. Accordingly, those skilled in the art can employ embodiments in which these elements or all of the elements are replaced with equivalent ones, and these embodiments are also included in the scope of the present invention.
In the description of each drawing, the same reference numerals are assigned to components having the same function, and description thereof is omitted as much as possible to avoid duplication.

FIG. 1 is a block diagram showing the configuration of an embodiment of a die bonder of the present invention. Reference numeral 100 denotes a die bonder, 101 denotes a stage of the die bonder 100, 102 denotes a magazine loader unit for carrying a frame magazine (not shown) containing substrates, 103 denotes a frame pressure unit for pushing out the substrates, and 104 denotes a substrate on the stage 101 in the downstream direction. A loader feeder unit 105 for taking out, a loader lifter unit for driving the frame magazine containing the substrate in the vertical direction, 106 an interlayer paper discharge box for discharging the interlayer paper peeled off from the substrate, and 107 a substrate taken out by the loader feeder unit 104 The main feeder section pushed out to the preform stage in the die bonding work area, 108 is a frame feeder chute section for guiding the substrate in the linear direction of the main feeder section 107, 109 is a stage heater for heating the substrate, and 110 is a die Implemented An unloader feeder unit for unloading the substrate from the stage 101 in the downstream direction, 111 a frame pressing unit for fixing the substrate during die bonding work, 112 a magazine unloader unit for unloading the substrate to the frame magazine, and 113 for static electricity , An ion blow unit that blows negative ions to the wafer, 114 a bar code reader unit that reads a bar code attached to the wafer ring, and 115 a die for pushing up the die from a wafer (not shown) of the wafer ring A push-up unit, 116 is a wafer ring holder section for holding a wafer ring, 117 is a wafer extractor, 118 is a wafer correction chute section, 119 is a wafer cassette section, and 200 is a control section.
Note that the die bonder 100 of FIG. 1 operates by the control unit 200 controlling each device in the die bonder including the frame supply device. The frame supply device includes at least a frame pressure unit 103, a loader feeder unit 104, a loader lifter unit 105, a main feeder unit 107, and a control unit 200. Details of the control unit 200 will be described later with reference to FIG.

Further, the frame magazine set in the magazine loader unit 102 accommodates a substrate as a mounted member. Similarly, the frame magazine set in the magazine unloader unit 112 accommodates a substrate on which a die is mounted by this die bonder. Further, the wafer extractor 117 takes out the wafer ring from the wafer cassette set in the wafer cassette unit 119 and conveys it to the wafer ring holder unit 116. The wafer cassette unit 119 is set with a wafer cassette that accommodates a plurality of stages of wafer rings.
FIG. 1 is a plan view of the die bonder 100 as viewed from above, and the X direction is upstream (left of the drawing) and downstream (right of the drawing). The substrate as the mounted member is die-bonded while being transported from upstream to downstream along the X direction.

In the die bonder of FIG. 1, the substrate stored in the frame magazine set in the magazine loader unit 102 is taken out from the frame magazine by the frame supply device. The frame supply device carries the taken-out substrate into the preform stage in the work area. At the die bonding position (mounting area) formed on the carried-in substrate, the interlayer paper is peeled off, the adhesive is applied, and the main feeder unit 107 transports the bonding head table (described later) to the working area. .
In the bonding head table, the bonding head interlocks with the die push-up unit 115 to suck the die from the wafer ring holder unit 116 and performs die bonding at a predetermined die bonding position on the substrate.

FIG. 2 is an enlarged block diagram of the vicinity of the main feeder portion 107 of the die bonder 100 of FIG. Reference numeral 141 denotes a substrate, 221 denotes a bond camera, and 143 denotes a guide rail of the bond camera 142. In FIG. 1, the substrate 141, the bond camera 221 and the guide rail 143 are omitted. The substrate 141 is carried and fixed on a bonding head table described later.
In FIG. 2, when the substrate 141 is carried into the bonding head table of the main feeder unit 107, the bond camera 221 moves along the guide rail 143, and the substrate 141 is imaged. The image is output to the image processing unit 220 of the control unit 200. The image processing unit 220 of the control unit 200 analyzes the input image of the substrate 141, confirms the bonding position, and outputs it to the CPU substrate unit. The CPU unit 201 corrects the bonding position based on the output of the image processing unit 220 and bonds the die to a predetermined position.

FIG. 3 is a block diagram for explaining an embodiment of the configuration of the control unit 200 of the frame supply apparatus of the present invention. Reference numeral 200 denotes a control unit, 201 a CPU (Central Processing Unit) unit, 210 a motor control unit, 220 an image processing unit, 230 an I / O (Input / Output) unit, 240 an operation panel, and 250 a hard disk. The CPU unit 201 controls the motor control unit 210, the image processing unit 220, the I / O unit 230, the operation panel 240, and the hard disk 250.
The motor control unit 210 controls the main feeder motor 211. The motor control unit 210 controls the main feeder pawl motor 212. The motor control unit 210 controls the bond camera motor 213.
Further, the image processing unit 220 controls the bond camera 221.
Furthermore, the I / O unit 230 controls the buzzer sounding unit 231 and the rotating lamp display unit 232.
In addition, the operation panel 240 controls the display unit 241 of the die bonder 100 and causes the display unit 241 to display a data input screen, a data input screen for displaying an error, and an error.
Further, the hard disk 250 controls a control program unit 251 that stores control programs for the die bonder 100 and the wafer supply apparatus 200 and a data storage / reading unit 252 for storing and reading data.

The bonding head table portion of the present invention will be described with reference to FIG. FIG. 4 is a view for explaining an embodiment of the bonding head table of the die bonder of the present invention. FIG. 4 is a diagram showing the bonding head table 10 of the main feeder unit 107 described in FIG. The figure on the left is a plan view, and the figure on the right is a view of the plan view from the right side.
The bonding head table 10 includes at least a table main body 3 and two side guides 4 that are provided on the upper portion of the table main body 3 and sandwich the substrate 141 from both sides.
The table main body 3 includes a suction mechanism (not shown) for sucking and fixing the substrate 141 and a heating mechanism (not shown) for heating the substrate 141. Further, for example, a stopper (not shown) may be provided on the downstream side as a positioning mechanism in the advancing direction when the main feeder unit carries the substrate 141 from the upstream side.

The guide 4 is provided with a first recognition mark 6 and a second recognition mark 7 on the upper surface. In addition, recognition patterns 8 and 9 are provided in advance near the die bonding position 1 of the substrate 141 in order to calculate the position of the die bonding position 1.
The CPU unit 201 of the die bonder 100 controls the motor control unit 210 and the image processing unit 220. In response to this control, the motor control unit 210 controls the bond camera motor 213 to move the bond camera 221 to a position where the area where the recognition patterns 8 and 9 are reflected on the substrate 141 can be imaged. The image processing unit 220 controls the bond camera 220 in accordance with the control of the CPU 201 to capture an area in which the recognition patterns 8 and 9 are reflected on the substrate 141 and cause the image processing unit 220 to output captured image data. Next, the image processing unit 220 performs image processing on the input imaging data, calculates the die bonding position 1, and outputs it to the CPU unit 201.
The CPU unit 201 controls each device based on the input die bonding position 1 and bonds the die adsorbed from the wafer ring holder unit 116 to the die bonding position 1 on the substrate 141.

Next, the first recognition mark 6 and the second recognition mark 7 will be described. As described in the background art, conventionally, when the substrate position is shifted due to the change of the transport mechanism with time, the bonding position accuracy is deteriorated, and the bonding reliability is lowered.
Therefore, in the present invention, the position correction is performed by the first recognition mark 6 and the second recognition mark 7 every time the number of operations N for die bonding the die to the substrate 141 reaches the predetermined number K (N and N). K is a natural number).
For example, the relative position between the position of the mechanical origin and the first recognition mark 6 and the second recognition mark 7 described above does not change even if the transport mechanism changes with time. Therefore, if the positions of the first recognition mark 6 and the second recognition mark 7 are determined by image processing, the position of the mechanical origin is determined. Next, a shift amount of the relative position between the positions of the first recognition mark 6 and the second recognition mark 7 and the recognition patterns 8 and 9 on the substrate 141 is calculated. The die bonding position is calculated by correcting the position of the mechanical origin based on the calculated deviation amount, and die bonding is performed at the calculated die bonding position.

Position correction by the first recognition mark 6 and the second recognition mark 7 and the recognition patterns 8 and 9 on the substrate 141 in the above-described die bonder of the present invention will be further described with reference to FIGS. 5, 6, and 7. . FIG. 5 is a flowchart for explaining an embodiment of the position correction processing procedure in the die bonder of the present invention. The process of FIG. 5 is a flowchart in a state where the substrate 141 is carried into the bonding head table 10 and the bonding head is sucking the die. In parallel with or before or after the processing operation of FIG. 4, processing such as substrate loading / unloading and die pick-up is performed in the background.
These processes are executed by the CPU portion 201 of the die bonder 100 by controlling each device.
FIG. 6 is a diagram showing an example of the imaging data of the recognition patterns 8 and 9 in the flowchart of FIG. FIG. 7 is a diagram showing an example of image data of the first recognition mark 6 and the second recognition mark 7 in the flowchart of FIG.

First, in the initial setting step S101, the mechanical origin position P _f (xp, yp) is set to xp = 0 and yp = 0. Further, N = 1 and K = 100. Here, N and K are natural numbers, and K is a numerical value that determines how many times die bonding is performed to perform an operation of correcting the position of the mechanical origin. In this embodiment, the position of the mechanical origin is corrected after the die bonding is performed 100 times.

Next, in recognition pattern imaging step S102, the bond camera 221 images a predetermined area on the substrate 141 where the recognition pattern 8 and the recognition pattern 9 appear.
In FIG. 6, only the substrate 141, the die bonding position 1, the recognition marks 8 and 9, and the mechanical origin position P ₀ are shown for easy understanding. Note that “(quotation mark)” is a position of the substrate and the pattern (recognition mark and die bonding position) that is a reference in the case of correcting the position due to the variation in the pattern of the substrate 141. The mechanical origin position P ₀ (xp, yp) is a position where the bonding head stops when the die bonder 100 is initialized, for example. After the initial setting step S101, xp = 0 and yp = 0.

Next, in the recognition pattern position calculation step S103, the image data captured in the recognition pattern imaging step S102 is subjected to image processing, and the position coordinates m1 (x1, y1) of the recognition pattern 8 and the position coordinates m2 (x2, x2) of the recognition pattern 9 are processed. y2) is calculated. This position coordinate is a distance from the position P ₀ of the mechanical origin.
At this time, the positional deviation amount Δm1 (Δx1, Δy1) of the recognition pattern 8 can be calculated as follows when the positional coordinate m10 when there is no deviation is (x10, y10).
Δx1 = x10−x1
Δy1 = y10−y1
Further, the positional deviation amount Δm2 (Δx2, Δy2) of the recognition pattern 9 can be calculated as follows when the positional coordinate m20 when there is no deviation is (x20, y20).
Δx2 = x20−x1
Δy2 = y20−y1

Next, in the bonding head movement amount calculating step 104, first, the die bonding position 1 is based on the calculated position coordinate m1 (x1, y1) of the recognition pattern 8 and the position coordinate m2 (x2, y2) of the recognition pattern 9. The center coordinates d (xd, yd) are calculated. Incidentally, the position coordinates also becomes the distance from the mechanical origin P _0.
At this time, the positional deviation amount Δd (Δxd, Δyd) of the center coordinate d can be calculated as follows, where the positional coordinate d ₀ when there is no deviation is (xd0, yd0).
Δdx = xd0−xd
Δdy = yd0−yd
By correcting this positional deviation amount Δd with respect to the original amount of movement of the bonding head obtained from the position of the pattern serving as a reference for position correction, die bonding can be performed at an accurate position.

  Next, in die bonding step S105, the die is die-bonded to the corrected die bonding position calculated in bonding head movement amount calculating step 104.

Next, in N value addition step S106, 1 is added to N (N = N + 1).
Next, it is determined whether or not the value of N is smaller than the value of K. When the value of N is smaller than the value of K (N <K), the process returns to the recognition pattern imaging step S102, and the next die bonding is repeated. On the other hand, if the value of N is equal to or greater than the value of K (N ≧ K), the process proceeds to the process of recognition mark imaging step S108.

  Next, the recognition mark imaging step S108 and the recognition mark position coordinate calculation step S109 are executed to detect the deviation amount of the mechanical origin.

The reason for executing steps S108 and 109 will be described with reference to FIG. In FIG. 7, for easy understanding, the substrate 141, the die bonding position 1, the recognition marks 8 and 9, the shifted mechanical origin position P _f , the first recognition mark 6, the second recognition mark 7, and the mechanical origin. Only the position P ₀ and the position P _f of the shifted mechanical origin are shown. Further, since the displacement amount of the mechanical origin due to the displacement of the bonding head table is quite small and is difficult to illustrate, FIG. 7 shows the displacement amount with emphasis.
In FIG. 7, the bonding head table is displaced due to a change with time due to thermal influence, and the mechanical origin position P ₀ (xp = 0, yp = 0) is relatively displaced, and the displaced mechanical origin position. P _f (xp = Δxp, yp = Δyp).
Therefore, the position P _f of the shift mechanical origin as a reference, even calculates the position correction amount by a bonding head moving amount calculation step 104 (see FIG. 6), displaced from the position P ₀ of the mechanical origin Machinery since not be corrected shift amount to the position P _f of specific origin, the die bonding position shifts.

As described above, it is necessary to correct the displaced mechanical origin.
Therefore, in the recognition mark imaging step S108, a predetermined area in which the first recognition mark 6 provided in a place where the bond camera 221 is less subject to change due to thermal influence is reflected, and a predetermined area in which the second recognition mark 7 is reflected. An image of the area is taken. If simultaneous imaging is possible, simultaneous imaging may be performed.

Next, in the position coordinate calculation step S109 of the recognition mark, the image data captured in the recognition mark imaging step S108 is subjected to image processing, and the position coordinate p1 (xp1, yp1) of the first recognition mark 6 and the second recognition pattern are processed. 9 position coordinates p2 (xp2, yp2) are calculated. This position coordinate is a distance from the position P _f of the displaced mechanical origin.
At this time, the positional deviation amount Δp1 (Δxp1, Δyp1) of the first recognition mark 6 can be calculated as follows when the positional coordinates p10 when there is no deviation is (xp10, yp10).
Δxp1 = xp10−xp1
Δyp1 = yp10−yp1
Further, the positional deviation amount Δp2 (Δxp2, Δyp2) of the second recognition mark 7 can be calculated as follows when the positional coordinates p20 when there is no deviation is (xp20, yp20).
Δxp2 = xp20−xp2
Δyp2 = yp20−yp2
The difference between the mechanical origin position P _f and the mechanical origin position P ₀ with no deviation is calculated from the two deviation amounts of the X axis and the Y axis, taking the deviation in the rotational direction into account. Is calculated as a displacement amount Δmp (Δxp, Δyp).
Then, the calculated shift amount is input as an offset value. That is, in the initial setting step S101, the mechanical origin position P _f (xp, yp) is set to xp = 0 and yp = 0.

According to FIG. 8, the positions of the first recognition mark 6 and the second recognition mark 7 are calculated by image processing based on the position P _f of the mechanical origin, and the difference from the position P ₀ of the mechanical origin when there is no deviation is calculated. It will be explained that it can be used as an offset value. In FIG. 8, it is necessary to calculate in advance the positions of the first recognition mark 6 and the second recognition mark 7 by image processing from the position P ₀ of the mechanical origin when there is no deviation in FIG. Then, the position coordinates (xp10, yp10) of the first recognition mark 6 and the position coordinates p20 of the second recognition mark 7 are registered (xp20, yp20). Then, with reference to the position _{P f} of the mechanical origin shifted in step S108, S109, position coordinates p1 of the first recognition mark 6 and the second recognition mark 7 and (xp1, yp1) p2 and (xp2, yp2) calculate. Then, by obtaining the difference between the position coordinates of these recognition marks, the position (difference) between the position P _f of the mechanical origin that has been displaced with reference to the position P ₀ of the mechanical origin when there is no deviation is the amount of displacement. As required. By updating this deviation amount as an offset value, it can be applied to the next position correction (steps SS102 to S104), so that the die bonding operation can be executed while correcting the deviation of the mechanical origin.

Next, in the die bonding end possibility determination step S110, it is determined whether or not a die bonding work stop command or a required number of die bondings have been completed. If a stop command has been issued or if it is determined to end, die bonding is terminated. On the other hand, if there is no stop command or it is not determined to end, the process proceeds to recognition pattern imaging step S102, and die bonding is repeated.
In the embodiment of FIG. 5, the recognition pattern imaging and the recognition mark imaging are executed in separate steps. However, they may be executed simultaneously. For example, in the recognition mark imaging step S102, the recognition mark may be imaged together with the recognition pattern to obtain imaging data, and the recognition arc imaging step S108 may be omitted.

According to the above embodiment, a highly reliable die bonder and die bonding method capable of accurately and quickly bonding dies can be realized.
If the rotational direction shift is not taken into consideration, the first recognition mark 6 and the second recognition mark 7 and the two recognition marks are not necessary and only one is required.
Further, one recognition mark is provided on each of the two side guides, such as the first recognition mark 6 and the second recognition mark 7. However, two recognition marks may be provided on one guide.
Further, the number of recognition marks may be one instead of two, or three or more.
Furthermore, the place where the recognition mark is provided is not limited to the guide. Any location that is near the substrate 141, is not on the substrate 141, is less subject to changes due to heat, and can be imaged by the bond camera 220 (for example, a frame feeder chute, etc.). .

  1: die bonding position, 3: table body, 4: guide, 6: first recognition mark, 7: second recognition mark, 8, 9: recognition pattern, 10: bonding head table, 100: die bonder, 101: Stage: 102: Magazine loader unit, 103: Frame pressure unit, 104: Loader feeder unit, 105: Loader lifter unit, 106: Interlayer paper discharge box, 107: Main feeder unit, 108: Frame feeder chute unit, 109: Stage heater, 110: Unloader feeder unit, 111: Frame pressing unit, 112: Magazine unloader unit, 113: Ion blow unit, 114: Bar code reader unit, 115: Die push-up unit, 116: Wafer ring holder unit, 117: Wafer extractor 118: Wafer correction chute unit, 119: Wafer cassette unit, 141: Substrate, 143: Guide rail, 200: Control unit, 201: CPU unit, 210: Motor control unit, 211: Main feeder motor, 212: Main feeder claw Motor, 213: bond camera motor, 220: image processing unit, 221: bond camera, 230: I / O unit, 231: buzzer sounding unit, 232: rotating lamp display unit, 240: operation panel, 241: display unit, 250 : Hard disk, 251: control program section, 252: storage / reading section.

Claims (5)

A recognition mark provided on the guide or chute of the bonding head table in the vicinity of the substrate or the substrate;
An imaging means for imaging the recognition mark and a recognition mark provided in the vicinity of the die bonding position of the substrate, and a mechanical origin position used for die bonding is corrected based on imaging data obtained by the imaging means. Bonding position correction means comprising first position correction means for
A die bonder characterized by comprising:   2. The die bonder according to claim 1, wherein the first position correction unit calculates a deviation amount for correcting the position of the mechanical origin every time the number of operations of die bonding the die to the substrate reaches a predetermined number. A die bonder, wherein the offset value of the mechanical origin is updated based on the calculated deviation amount.   3. The die bonder according to claim 1, wherein the bonding position correction unit further calculates a position of a recognition pattern provided on the substrate based on the mechanical origin, and sets the calculated position to the calculated position. A die bonder comprising second position correcting means for correcting a position for die bonding the die. A first imaging step of imaging an area in which a recognition pattern is provided near a bonding position of the substrate;
A first position calculating step of performing image processing on a region in which the captured recognition pattern is reflected and calculating a position of the recognition pattern based on a mechanical origin;
A first position correcting step of correcting a die bonding position based on the position of the recognition pattern;
A second imaging step of imaging an area in which a recognition mark is provided on a guide or chute of a bonding head table in the vicinity of the substrate;
A second position calculating step of performing image processing on a region where the captured recognition mark is reflected and calculating the position of the recognition mark with reference to the mechanical origin;
A second position correcting step for correcting the position of the mechanical origin based on the position of the recognition mark;
A bonding step of die bonding the die to the die bonding position corrected by the first correction step;
A die bonding method characterized by comprising:   5. The die bonding method according to claim 4, wherein the second imaging step, the second position calculating step, and the second position correcting step are the number of operations of the bonding step of die bonding the die to the substrate. A die bonding method characterized in that a deviation amount for correcting the position of the mechanical origin is calculated each time a predetermined number of times, and the offset value of the mechanical origin is updated based on the calculated deviation amount.

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