JP2015054314A - Cleaning device - Google Patents

Cleaning device Download PDF

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JP2015054314A
JP2015054314A JP2013191059A JP2013191059A JP2015054314A JP 2015054314 A JP2015054314 A JP 2015054314A JP 2013191059 A JP2013191059 A JP 2013191059A JP 2013191059 A JP2013191059 A JP 2013191059A JP 2015054314 A JP2015054314 A JP 2015054314A
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cleaning
foreign matter
cleaned
path
cleaning liquid
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JP6446769B2 (en
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洋哉 石田
Hiroya Ishida
洋哉 石田
守屋 裕之
Hiroyuki Moriya
裕之 守屋
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Ricoh Co Ltd
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Ricoh Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a cleaning device capable of cleaning with high efficiency.SOLUTION: A cleaning device 30 removes foreign objects adhering to a passage of a passage formation component 41 of an ink discharge head with a cleaning fluid. The cleaning device 30 includes: a recovery passage which recovers the cleaning fluid used for cleaning a cleaned surface; a foreign object sensor 72 which is disposed in a measurement passage of the recovery passage and detects the size and the number of foreign objects contained in the cleaning fluid flowing through a duct; and a sequencer 74 which determines whether to continue cleaning of a cleaned object or end the cleaning on the basis of the size and the number of the foreign objects that are detected by the foreign object sensor 72.

Description

本発明は、被洗浄対象物の被洗浄面に付着した異物を洗浄液で除去する洗浄装置に関する。   The present invention relates to a cleaning apparatus that removes foreign matter adhering to a surface to be cleaned of a target object with a cleaning liquid.

半導体産業や精密機器産業において、ミクロンオーダー、サブミクロンオーダーの清浄度管理が必要とされている。ここで、洗浄される異物はその大きさが微小になるほど、被洗浄対象に対しての付着力が大きくなる。このため、ミクロンオーダー、サブミクロンオーダーの微小な異物の洗浄は困難であり、異物が許容レベルまで充分に除去されるまでは長い時間が必要とされる。   In the semiconductor industry and precision equipment industry, cleanliness management on the micron order and submicron order is required. Here, as the size of the foreign matter to be cleaned becomes smaller, the adhesion to the object to be cleaned increases. For this reason, it is difficult to clean minute foreign matters on the micron order and submicron order, and a long time is required until the foreign matters are sufficiently removed to an acceptable level.

また、被洗浄対象における異物の付着量のばらつきを見越して充分な洗浄時間を設定すると、異物付着量が少ない被洗浄対象に対しては既に許容レベルまで異物が除去されているにもかかわらず、所定の時間が経過するまで洗浄を継続することがあり、無駄が発生する。さらに、被洗浄対象の異物の付着量が想定した付着量より多い場合は、所定の時間が経過するまで洗浄を継続しても異物が洗浄しきれない。   In addition, if a sufficient cleaning time is set in anticipation of variations in the amount of foreign matter adhered to the object to be cleaned, the foreign object has already been removed to an acceptable level for the object to be cleaned with a small amount of foreign matter attached. Cleaning may be continued until a predetermined time elapses, resulting in waste. Furthermore, when the adhesion amount of the foreign object to be cleaned is larger than the assumed adhesion amount, the foreign object cannot be completely cleaned even if the cleaning is continued until a predetermined time elapses.

これに対処するため、特許文献1には、被洗浄対象を通過し、異物が混入した洗浄液中の異物の総量を算出し、異物の総量があらかじめ設定された閾値に達したことを検知して、洗浄を終了することで洗浄時間の洗浄を効率化するものが記載されている。   In order to deal with this, Patent Document 1 calculates the total amount of foreign matter in the cleaning liquid that has passed through the object to be cleaned and mixed with foreign matter, and detects that the total amount of foreign matter has reached a preset threshold. In addition, it is described that the cleaning in the cleaning time is made efficient by terminating the cleaning.

同じく、特許文献2には、槽内の洗浄液をサンプリングして異物の数を測定し、異物の数が許容レベルまで低下した時点で洗浄を終了することで個々の被洗浄対象の異物の付着量のばらつきに応じた洗浄を行い、洗浄の効率化を図るものが記載されている。   Similarly, Patent Document 2 measures the number of foreign matters by sampling the cleaning liquid in the tank, and ends the cleaning when the number of foreign matters is reduced to an allowable level, thereby allowing the amount of foreign matters to be cleaned to adhere. It is described that cleaning is performed in accordance with the variation in order to improve cleaning efficiency.

さらに、特許文献3、4、5には、被洗浄物を洗浄液の入った洗浄槽に漬けて、異物センサーで洗浄液中の異物数を計測し、異物が所定数以下となると洗浄を終了する洗浄装置が記載されている。   Further, in Patent Documents 3, 4, and 5, the object to be cleaned is immersed in a cleaning tank containing a cleaning liquid, the number of foreign substances in the cleaning liquid is measured by a foreign substance sensor, and the cleaning is finished when the number of foreign substances falls below a predetermined number. An apparatus is described.

一般に被洗浄対象に付着している異物の大きさと数には分布傾向がある。図12はインクジェット部品の洗浄廃液中における異物の大きさと数の関係を示すグラフである。異物が大きくなる程数は多く、異物が小さい程数は少ないことがわかる。各産業分野で許容される異物の大きさ、数は異なるため、従来のように異物の数のみを判断基準として洗浄を行うと、大きな異物が洗浄されているにもかかわらず、洗浄が困難な小さい異物が検出されるため、洗浄時間が過剰となる。   In general, the size and number of foreign substances adhering to the object to be cleaned tend to be distributed. FIG. 12 is a graph showing the relationship between the size and the number of foreign matters in the cleaning waste liquid for inkjet parts. It can be seen that the larger the foreign object, the larger the number, and the smaller the foreign object, the smaller the number. Since the size and number of foreign substances allowed in each industrial field are different, if cleaning is performed using only the number of foreign substances as a criterion as in the past, cleaning is difficult even though large foreign objects are being cleaned. Since small foreign matter is detected, the cleaning time becomes excessive.

従来の洗浄装置では、異物センサーを用いて洗浄制御を行っている。しかし、特許文献3、4、5に記載のものは、被洗浄物全体を漬けた洗浄液の異物を検出して洗浄の制御を行う。このため、本来洗浄すべき被洗浄面以外の箇所に付着した異物まで検出しており、過度に洗浄を行ってしまうことがある。   In a conventional cleaning apparatus, cleaning control is performed using a foreign matter sensor. However, those described in Patent Documents 3, 4, and 5 perform cleaning control by detecting foreign matter in the cleaning liquid in which the entire object to be cleaned is immersed. For this reason, even foreign substances adhering to locations other than the surface to be cleaned are detected, and cleaning may be performed excessively.

本発明は上述の点にかんがみてなされたものであり、高い効率で洗浄を行うことができる洗浄装置を提供することを目的とする。   The present invention has been made in view of the above points, and an object thereof is to provide a cleaning apparatus capable of performing cleaning with high efficiency.

本発明に係る洗浄装置は、被洗浄対象物の被洗浄面に付着した異物を洗浄液で除去する洗浄装置において、前記被洗浄面の洗浄に使用した洗浄液を回収する回収路と、前記回収路に配置され前記管路中を流れる洗浄液に含まれる異物の大きさおよび数を検出する異物センサーと、前記異物センサーで検出した異物の大きさおよび数に基づいて、前記被洗浄対象物の洗浄を継続するか、洗浄を終了するか、の判断を行う判断手段と、を備えることを特徴とする。   The cleaning apparatus according to the present invention is a cleaning apparatus that removes foreign matter adhering to a surface to be cleaned with a cleaning liquid, a recovery path for recovering the cleaning liquid used for cleaning the surface to be cleaned, and a recovery path. The foreign object sensor that detects the size and number of foreign substances contained in the cleaning liquid that is disposed and flows in the pipe line, and the cleaning of the object to be cleaned is continued based on the size and number of foreign substances detected by the foreign substance sensor. Determining means for determining whether or not to end the cleaning.

本発明によれば、被洗浄物の被洗浄面の洗浄に使用した洗浄液に含まれる異物の大きさおよび数を検出して洗浄の継続、終了を判断するので、無駄な洗浄を行うことなく高い効率で洗浄を行うことができる。   According to the present invention, since the size and number of foreign matters contained in the cleaning liquid used for cleaning the surface to be cleaned of the object to be cleaned are detected to determine whether or not the cleaning is continued, it is high without performing unnecessary cleaning. Washing can be performed efficiently.

本発明に係る洗浄装置の洗浄対象であるインク吐出ヘッドの斜視図である。It is a perspective view of the ink discharge head which is the cleaning object of the cleaning device according to the present invention. 同インク吐出ヘッドの液室長手方向の断面図である。It is sectional drawing of the liquid chamber longitudinal direction of the ink discharge head. 同インク吐出ヘッドの液室短手方向の断面図である。FIG. 3 is a cross-sectional view of the ink discharge head in the lateral direction of the liquid chamber. 本発明に係る洗浄装置の実施形態1に係る洗浄装置における流路形成部品の移動処理手順を示す概略図である。It is the schematic which shows the movement process procedure of the flow-path formation component in the cleaning apparatus which concerns on Embodiment 1 of the cleaning apparatus which concerns on this invention. 同洗浄装置の配管状態を示す模式図である。It is a schematic diagram which shows the piping state of the washing | cleaning apparatus. 同洗浄装置の洗浄ステージを示すものであり(a)は、洗浄ステージの斜視図、(b)は(a)中のA−A線に相当する断面図、(c)は(a)中のB−B線に相当する断面図である。FIG. 2 shows a cleaning stage of the cleaning apparatus, wherein (a) is a perspective view of the cleaning stage, (b) is a cross-sectional view corresponding to the AA line in (a), and (c) is in (a). It is sectional drawing equivalent to a BB line. 同洗浄装置の処理工程を示すフローチャートである。It is a flowchart which shows the process process of the washing | cleaning apparatus. 同洗浄下ステージおよび周辺配管の概略構成を示すものであり、(a)は側面図、(b)は正面図、(c)は(b)中のC−C線に相当する断面図、(d)は(a)中のD−D線に相当する断面図である。FIG. 2 shows a schematic configuration of the stage under cleaning and peripheral piping, (a) is a side view, (b) is a front view, (c) is a cross-sectional view corresponding to line CC in (b), d) is a sectional view corresponding to line DD in (a). 同洗浄上ステージおよび周辺配管の概略構成を示すものであり、(a)は側面図、(b)は正面図、(c)は(b)中のC−C線に相当する断面図、(d)は(a)中のD−D線に相当する断面図である。FIG. 2 shows a schematic configuration of the cleaning upper stage and peripheral piping, (a) is a side view, (b) is a front view, (c) is a cross-sectional view corresponding to line CC in (b), ( d) is a sectional view corresponding to line DD in (a). 本発明に係る洗浄装置の実施形態2に係る洗浄上ステージを示すものであり、(a)は側面図、(b)は正面図、(c)は(b)中のC−C線に相当する断面図、(d)は(a)中のD−D線に相当する断面図である。FIG. 7 shows a cleaning upper stage according to Embodiment 2 of the cleaning apparatus according to the present invention, wherein (a) is a side view, (b) is a front view, and (c) is equivalent to a CC line in (b). (D) is sectional drawing equivalent to the DD line in (a). 同洗浄装置の外観構成を示す斜視図である。It is a perspective view which shows the external appearance structure of the washing | cleaning apparatus. インクジェットヘッド部品の洗浄排液中の異物の大きさと数の分布傾向の一例を示した図である。It is the figure which showed an example of the distribution tendency of the magnitude | size and number of the foreign material in the washing | cleaning drainage of an inkjet head component.

以下、本発明を実施するための形態に係る洗浄装置について説明する。実施形態に係る洗浄装置は、被洗浄物としてインク吐出ヘッドの流路形成部品を洗浄する。まず、洗浄装置の被洗浄対象物である流路形成部品を備えるインク吐出ヘッドについて説明する。図1は同インク吐出ヘッドの外観斜視説明図、図2は同じく同インク吐出ヘッドの液室長手方向(ノズル配列方向と直交する方向)の断面説明図、図3は同じく同インク吐出ヘッドの液室短手方向(ノズル配列方向)の断面説明図である。   Hereinafter, a cleaning apparatus according to an embodiment for carrying out the present invention will be described. The cleaning device according to the embodiment cleans the flow path forming component of the ink discharge head as an object to be cleaned. First, an ink discharge head including a flow path forming component that is an object to be cleaned of a cleaning device will be described. 1 is an external perspective view of the ink discharge head, FIG. 2 is a cross-sectional explanatory view of the same ink discharge head in the longitudinal direction of the liquid chamber (direction perpendicular to the nozzle arrangement direction), and FIG. It is sectional explanatory drawing of a chamber short direction (nozzle arrangement direction).

インク吐出ヘッドはインクジェットプリンタに使用される。インク吐出ヘッドは、流路板1と、この流路板1の一面に接合した振動板部材2と、流路板1の振動板部材2の接合面と反対側の面に接合したノズル板3と、を備える。流路板1と振動板部材2とは、組み立てられた状態において流路構成部品を形成し、この流路構成部品が洗浄装置で洗浄される被洗浄物となる。インク吐出ヘッドには、これらによって液滴を吐出する複数のノズル4がノズル連通路(以下、「連通管」という。)5を介してそれぞれ連通する複数の圧力室6が形成される。   The ink discharge head is used in an ink jet printer. The ink discharge head includes a flow path plate 1, a vibration plate member 2 bonded to one surface of the flow path plate 1, and a nozzle plate 3 bonded to a surface of the flow path plate 1 opposite to the bonding surface of the vibration plate member 2. And comprising. The flow path plate 1 and the diaphragm member 2 form a flow path component in the assembled state, and the flow path component becomes an object to be cleaned that is cleaned by the cleaning device. In the ink ejection head, a plurality of pressure chambers 6 are formed in which a plurality of nozzles 4 that eject droplets communicate with each other via a nozzle communication path (hereinafter referred to as “communication pipe”) 5.

圧力室6のインクの流れ方向上流側には流体抵抗部7および液体導入部8がそれぞれ形成されている。インクは、後述するフレーム部材17に形成した共通液室10から振動板部材2に形成されたフィルター部21を介して液体導入部8に導入される。インクは、液体導入部8から流体抵抗部7を介して圧力室6に供給される。   A fluid resistance portion 7 and a liquid introduction portion 8 are respectively formed on the upstream side of the pressure chamber 6 in the ink flow direction. Ink is introduced into the liquid introduction part 8 from the common liquid chamber 10 formed in the frame member 17 described later through the filter part 21 formed in the diaphragm member 2. Ink is supplied from the liquid introduction unit 8 to the pressure chamber 6 through the fluid resistance unit 7.

流路板1は、シリコン基板を異方性エッチングして、連通管5、圧力室6、流体抵抗部7などの開口部や溝部をそれぞれ形成している。連通管5および圧力室6などを形成するエッチングで残された部分が流路間隔壁を形成する。   The flow path plate 1 anisotropically etches the silicon substrate to form openings and grooves such as the communication tube 5, the pressure chamber 6, and the fluid resistance portion 7. The portions left by etching that form the communication pipe 5 and the pressure chamber 6 form a flow path interval wall.

振動板部材2は、各圧力室6および流体抵抗部7などの壁面を形成する壁面部材であり、変形可能な第1層2Aと、第1層2A上に積層した第1層2Aより厚い第2層2Bとからなる。また、振動板部材2は、各圧力室6の壁面を形成する変形可能な第1層2Aで形成された振動領域2aを有する。   The diaphragm member 2 is a wall surface member that forms wall surfaces such as the pressure chambers 6 and the fluid resistance portion 7, and the first layer 2A that is deformable and the first layer 2A that is thicker than the first layer 2A laminated on the first layer 2A. It consists of two layers 2B. Moreover, the diaphragm member 2 has a vibration region 2 a formed by a deformable first layer 2 </ b> A that forms the wall surface of each pressure chamber 6.

振動板部材2は、振動領域2aに第2層2Bで形成した島状凸部2bに、振動領域2aを変形させ、液滴を吐出させるエネルギーを発生する駆動素子が接合されている。この駆動素子としては、積層型圧電部材である圧電部材12の圧電素子柱12Aを使用する。   In the diaphragm member 2, a driving element that generates energy for deforming the vibration region 2 a and ejecting droplets is joined to the island-shaped convex portion 2 b formed of the second layer 2 </ b> B in the vibration region 2 a. As this drive element, the piezoelectric element column 12A of the piezoelectric member 12 which is a laminated piezoelectric member is used.

圧電部材12はハーフカットダイシングによりくし歯状に圧電素子柱12A、12Bを形成したものである。この圧電素子柱12Aは駆動波形を印加され駆動圧電柱となる。また、圧電素子柱12Bは駆動波形を印加せずに流路間隔壁6aを支持する支柱として非駆動圧電柱となる。すなわち、圧電部材12の圧電素子柱12A、12Bは圧力室6の配列密度の2倍の密度で配列された所謂バイピッチ構造を備える。この圧電部材12の下端面はベース部材13に接合している。   The piezoelectric member 12 is formed by forming piezoelectric element columns 12A and 12B in a comb-tooth shape by half-cut dicing. The piezoelectric element column 12A is applied with a driving waveform to become a driving piezoelectric column. The piezoelectric element column 12B is a non-driving piezoelectric column as a column that supports the flow path interval wall 6a without applying a driving waveform. That is, the piezoelectric element columns 12 </ b> A and 12 </ b> B of the piezoelectric member 12 have a so-called bi-pitch structure arranged at a density twice the arrangement density of the pressure chambers 6. The lower end surface of the piezoelectric member 12 is joined to the base member 13.

圧電部材12は、圧電層と内部電極層を交互に積層し、内部電極を交互に端面の端面電極(外部電極)である個別電極および共通電極にそれぞれ電気的に接続したものである。圧電層は、例えば厚さ10〜50μm/1層のチタン酸ジルコン酸鉛(PZT)からなる。また、共通電極は、例えば厚さ数μm/1層の銀・パラジューム(AgPd)からなる。そして、個別電極にはFPC(フレキシブルプリント基板)15の個別電極ラインがはんだ接合され、また、共通電極は圧電部材12の端部に電極層を設けて個別電極側端面に回し込んでFPC15のGND電極が接続されている。FPC15には図示しないドライバーIC(Integrated Circuit)が実装されており、これにより圧電素子柱12Aへの駆動電圧印加を制御している。   The piezoelectric member 12 is formed by alternately stacking piezoelectric layers and internal electrode layers, and electrically connecting the internal electrodes to the individual electrodes and the common electrode, which are the end electrodes (external electrodes) on the end surfaces. The piezoelectric layer is made of, for example, lead zirconate titanate (PZT) having a thickness of 10 to 50 μm / layer. The common electrode is made of, for example, silver / palladium (AgPd) having a thickness of several μm / layer. An individual electrode line of an FPC (flexible printed circuit board) 15 is soldered to the individual electrode, and the common electrode is provided with an electrode layer at the end of the piezoelectric member 12 and is turned to the end surface on the individual electrode side. The electrode is connected. A driver IC (Integrated Circuit) (not shown) is mounted on the FPC 15 to control application of a driving voltage to the piezoelectric element column 12A.

ノズル板3は、ニッケル(Ni)の金属プレートから形成したものであり、エレクトロフォーミング法(電鋳)で製造している。ノズル板3には各圧力室6に対応して直径10〜35μmのノズル4を形成し、流路板1に接着剤接合している。そして、このノズル板3の液滴吐出側面(吐出方向の表面:吐出面、または圧力室6側と反対の面)には、はっ水層を設けている。   The nozzle plate 3 is formed from a nickel (Ni) metal plate, and is manufactured by an electroforming method (electroforming). A nozzle 4 having a diameter of 10 to 35 μm is formed on the nozzle plate 3 corresponding to each pressure chamber 6, and is bonded to the flow path plate 1 with an adhesive. A water repellent layer is provided on the droplet discharge side surface (surface in the discharge direction: discharge surface or the surface opposite to the pressure chamber 6 side) of the nozzle plate 3.

また、FPC15を実装した圧電部材12およびベース部材13などで構成される圧電型アクチュエータの外周側には、エポキシ系樹脂あるいはポリフェニレンサルファイトで射出成形により形成したフレーム部材17を接合している。そして、このフレーム部材17には共通液室10を形成し、さらに共通液室10に外部からインクを供給するために連結管19を介してインクが供給される供給口20を形成している。連結管19はさらに図示しないサブタンクやインクカートリッジなどのインク供給源に接続される。   Further, a frame member 17 formed by injection molding with an epoxy resin or polyphenylene sulfite is joined to the outer peripheral side of the piezoelectric actuator composed of the piezoelectric member 12 mounted with the FPC 15 and the base member 13. A common liquid chamber 10 is formed in the frame member 17, and a supply port 20 through which ink is supplied to the common liquid chamber 10 through the connecting pipe 19 is formed to supply ink to the common liquid chamber 10 from the outside. The connecting pipe 19 is further connected to an ink supply source such as a sub tank or an ink cartridge (not shown).

このインク吐出ヘッドでは、圧電部材12は600dpiの間隔でダイシングされており、それが対向して2列配置され、圧力室6およびノズル4は、1列300dpiの間隔で2列がそれぞれ千鳥配置に整列している。このような構造により、このインク吐出ヘッドは、600dpiの解像度を1回の走査で得ることができる。   In this ink discharge head, the piezoelectric members 12 are diced at an interval of 600 dpi, and are arranged in two rows facing each other, and the pressure chambers 6 and the nozzles 4 are arranged in a staggered manner at two intervals at an interval of 300 dpi. Aligned. With such a structure, this ink ejection head can obtain a resolution of 600 dpi in one scan.

このインク吐出ヘッドにおいては、以下のようにノズル4からインクが吐出される。すなわち、例えば圧電素子柱12Aに印加する電圧を基準電位から下げることによって圧電素子柱12Aを収縮させる。これにより、振動板部材2の圧力室6の壁面を形成する振動領域2aが下降して圧力室6の容積が膨張して、圧力室6内にインクが流入する。その後圧電素子柱12Aに印加する電圧を上げて後圧電素子柱12Aを積層方向に伸長させ、振動板部材2をノズル4方向に変形させて圧力室6の容積を収縮させる。これにより、圧力室6内のインクが加圧され、ノズル4からインク滴が吐出される。   In this ink discharge head, ink is discharged from the nozzle 4 as follows. That is, for example, the piezoelectric element column 12A is contracted by lowering the voltage applied to the piezoelectric element column 12A from the reference potential. As a result, the vibration region 2 a forming the wall surface of the pressure chamber 6 of the vibration plate member 2 is lowered, the volume of the pressure chamber 6 is expanded, and ink flows into the pressure chamber 6. Thereafter, the voltage applied to the piezoelectric element column 12A is increased to extend the rear piezoelectric element column 12A in the stacking direction, and the diaphragm member 2 is deformed in the nozzle 4 direction to contract the volume of the pressure chamber 6. Thereby, the ink in the pressure chamber 6 is pressurized and ink droplets are ejected from the nozzle 4.

そして、後圧電素子柱12Aに印加する電圧を基準電位に戻すと振動板部材2が初期位置に復元し、圧力室6が膨張して負圧が発生する。このとき、共通液室10から圧力室6内にインクが充填される。そこで、ノズル4のメニスカス面の振動が減衰して安定した後、次の液滴吐出のための動作に移行する。   When the voltage applied to the rear piezoelectric element column 12A is returned to the reference potential, the diaphragm member 2 is restored to the initial position, and the pressure chamber 6 expands to generate a negative pressure. At this time, ink is filled from the common liquid chamber 10 into the pressure chamber 6. Therefore, after the vibration of the meniscus surface of the nozzle 4 is attenuated and stabilized, the operation proceeds to the next droplet discharge.

なお、このヘッドの駆動方法については上述の例(引き−押し打ち)に限るものではなく、駆動波形の与えた方によって引き打ちや押し打ちなどを行うこともできる。   The driving method of the head is not limited to the above-described example (drawing-pushing), and it is also possible to perform striking, pushing, etc. depending on the direction of the drive waveform.

<実施形態1>
次に、本発明に係る洗浄装置の実施形態1に係る洗浄装置について詳細に説明する。実施形態1に係る洗浄装置30は、被洗浄対象物であるインク吐出ヘッドの流路形成部品41内に形成され、流路形成部品41を貫通する孔部である流路内に混入した異物を洗浄液で洗浄する。すなわち、洗浄液は、流路の内面を含む被洗浄面として洗浄する。流路形成部品41は、流路板1と振動板部材2とで構成される。異物としては、製造時に付着したタンパク質、セルロース、シリコン小片等が挙げられる。
<Embodiment 1>
Next, the cleaning apparatus according to Embodiment 1 of the cleaning apparatus according to the present invention will be described in detail. The cleaning device 30 according to the first embodiment is configured to remove foreign matters that are formed in the flow path forming component 41 of the ink discharge head that is the cleaning target and mixed in the flow path that is a hole that penetrates the flow path forming component 41. Wash with cleaning solution. That is, the cleaning liquid is cleaned as a surface to be cleaned including the inner surface of the flow path. The flow path forming component 41 includes the flow path plate 1 and the diaphragm member 2. Examples of the foreign material include protein, cellulose, and silicon pieces attached at the time of manufacture.

まず、洗浄装置30での流路形成部品41の移動処理について説明する。図4は本発明に係る洗浄装置の実施形態1に係る洗浄装置における流路形成部品の移動処理手順を示す概略図である。流路形成部品41は、投入トレイ42に例えば15個が配置され、トレイ投入口44に配置されている。   First, the movement process of the flow path forming component 41 in the cleaning device 30 will be described. FIG. 4 is a schematic view showing a flow processing procedure of the flow path forming component in the cleaning apparatus according to Embodiment 1 of the cleaning apparatus according to the present invention. For example, 15 flow path forming components 41 are disposed on the input tray 42 and are disposed on the tray input port 44.

洗浄処理に際して、配置された流路形成部品41を1つずつトレイ投入ハンド45で真空吸着し、アライメントステージ46へと搬送する。アライメントステージ46ではX,Y方向のプッシャー46aを突き当て位置決めを行う。ついで、位置決めした流路形成部品41を洗浄ステージ投入ハンド47で真空吸着し、洗浄ステージ48へ搬送する。洗浄ステージ48では流路形成部品41の洗浄処理がなされる。   During the cleaning process, the arranged flow path forming components 41 are vacuum-sucked one by one by the tray loading hand 45 and conveyed to the alignment stage 46. In the alignment stage 46, pushers 46a in the X and Y directions are abutted and positioned. Next, the positioned flow path forming component 41 is vacuum-sucked by the cleaning stage loading hand 47 and conveyed to the cleaning stage 48. In the cleaning stage 48, the flow path forming component 41 is cleaned.

洗浄ステージ48で洗浄された流路形成部品41は、洗浄ステージ排出ハンド49で真空吸着され、排出トレイ50に整列配置される。その後、整列配置された流路形成部品41は、トレイ排出口51から取り出される。流路形成部品41の移動状態および各ハンドの動きはセンサーにて常時監視されており、各ステージに流路形成部品41が搭載されない時間が最短になるように連動して駆動される。   The flow path forming component 41 cleaned by the cleaning stage 48 is vacuum-sucked by the cleaning stage discharge hand 49 and aligned on the discharge tray 50. Thereafter, the flow path forming components 41 arranged in an aligned manner are taken out from the tray discharge port 51. The movement state of the flow path forming component 41 and the movement of each hand are constantly monitored by sensors, and are driven in conjunction so that the time during which the flow path forming component 41 is not mounted on each stage is minimized.

次に洗浄装置30の洗浄ステージ48での処理について説明する。図5は同洗浄装置の配管状態を示す模式図である。洗浄装置30は、流路形成部品41が配置される洗浄下ステージ52と、この洗浄下ステージ52を上側から覆う洗浄上ステージ53と、を備える。流路形成部品41は、洗浄下ステージ52と洗浄上ステージ53との間に配置されて洗浄される。   Next, processing at the cleaning stage 48 of the cleaning device 30 will be described. FIG. 5 is a schematic view showing a piping state of the cleaning device. The cleaning apparatus 30 includes a lower cleaning stage 52 on which the flow path forming component 41 is disposed, and an upper cleaning stage 53 that covers the lower cleaning stage 52 from above. The flow path forming component 41 is disposed between the lower cleaning stage 52 and the upper cleaning stage 53 and cleaned.

洗浄下ステージ52の下流側には、洗浄液をためるタンク63と、洗浄装置30において洗浄液を流通経路において正圧に保持しつつ洗浄液を送出するダイアフラムポンプ65とを備える。ダイアフラムポンプ65の下流には、洗浄液の液圧を調整するレギュレーター68と、洗浄液の流速すなわち流量を測定する流速センサー69と、洗浄液から異物を除去するフィルター70と、洗浄バルブ57とが接続されている。タンク63には、洗浄液を冷却するクーラー64、タンクを大気圧にする圧力開放バルブ91が設置されている。ダイアフラムポンプ65から洗浄液をタンク63に戻す経路が配置され、この経路には、リリーフバルブ66と、フィルター67とが配置されている。   On the downstream side of the lower cleaning stage 52, a tank 63 for storing the cleaning liquid and a diaphragm pump 65 for sending the cleaning liquid while holding the cleaning liquid at a positive pressure in the flow path in the cleaning device 30 are provided. Downstream of the diaphragm pump 65, a regulator 68 that adjusts the pressure of the cleaning liquid, a flow rate sensor 69 that measures the flow rate of the cleaning liquid, that is, a flow rate, a filter 70 that removes foreign substances from the cleaning liquid, and a cleaning valve 57 are connected. Yes. The tank 63 is provided with a cooler 64 for cooling the cleaning liquid and a pressure release valve 91 for bringing the tank to atmospheric pressure. A path for returning the cleaning liquid from the diaphragm pump 65 to the tank 63 is disposed, and a relief valve 66 and a filter 67 are disposed in this path.

また、洗浄下ステージ52には、洗浄終了後に空気をブローするため、加圧エアー源59、エアー圧力調整用のレギュレーター61、リリーフバルブ66、エアーブローバルブ58が接続されている。   In addition, a pressurized air source 59, an air pressure adjusting regulator 61, a relief valve 66, and an air blow valve 58 are connected to the lower cleaning stage 52 in order to blow air after completion of cleaning.

洗浄上ステージ53からの洗浄液は、回収路を経由してタンク63に回収される。回収路は、異物センサー72が配置される計測路と、洗浄液をタンク63に戻す迂回経路とに分岐される。異物センサー72の測定容量を越える洗浄液は迂回経路からタンク63に戻される。迂回経路には、排出経路バルブ56、流速調整機構である電磁式流速調整バルブ71が配置される。測定経路には、測定経路バルブ54、異物センサー72が配置され、異物センサー72からの洗浄液は流速センサー73で流速が計測されてタンク63に戻る。また、計測経路には、大気開放経路バルブ55、圧力センサー60が配置されている。なお、流速調整機構は、測定経路および迂回経路の少なくとも一方に設けることができる。   The cleaning liquid from the cleaning upper stage 53 is recovered in the tank 63 via the recovery path. The recovery path is branched into a measurement path where the foreign matter sensor 72 is arranged and a bypass path for returning the cleaning liquid to the tank 63. The cleaning liquid exceeding the measurement capacity of the foreign matter sensor 72 is returned to the tank 63 from the detour path. In the bypass path, a discharge path valve 56 and an electromagnetic flow rate adjustment valve 71 that is a flow rate adjustment mechanism are arranged. In the measurement path, a measurement path valve 54 and a foreign matter sensor 72 are arranged, and the flow rate of the cleaning liquid from the foreign matter sensor 72 is measured by the flow rate sensor 73 and returns to the tank 63. In addition, an air release path valve 55 and a pressure sensor 60 are arranged in the measurement path. The flow rate adjusting mechanism can be provided in at least one of the measurement path and the detour path.

また、洗浄装置30には、判断手段であるシーケンサー74を備える。シーケンサー74は、CPU(Central Processing Unit)、RAM(Random Access
Memory)、ROM(Read Only Memory)等を備えたコンピュータで構成することができる。管理ソフトウエアをCPUで実行することにより、判断を実行する。異物センサー72からの測定値信号75、流速センサー73からの異常信号76はシーケンサー74に入力され、シーケンサー74は、後述する流速増減信号77および終了信号78を発生する。
Further, the cleaning apparatus 30 includes a sequencer 74 that is a determination unit. The sequencer 74 includes a CPU (Central Processing Unit), a RAM (Random Access).
Memory), ROM (Read Only Memory), and the like can be used. The determination is executed by executing the management software on the CPU. The measurement value signal 75 from the foreign matter sensor 72 and the abnormal signal 76 from the flow rate sensor 73 are input to the sequencer 74, and the sequencer 74 generates a flow rate increase / decrease signal 77 and an end signal 78 described later.

このような構成を備える洗浄装置30において、洗浄ステージ投入ハンド47で洗浄ステージ48へと搬送された流路形成部品41は、まず、洗浄下ステージ52上に配置される。その後、図6(a)、(b)に示すように、洗浄上ステージ53が下降し、流路形成部品41を洗浄下ステージ52とで挟み込み、流路形成部品41の開口部周囲を封止する。これにより、流路形成部品41の流路内に洗浄液を流入させ流出させる。このため、洗浄下ステージ52および洗浄上ステージ53の流路形成部品41と接触部材が配置される。接触部材は、流路形成部品41に傷を付けにくい弾性体が望ましい。   In the cleaning apparatus 30 having such a configuration, the flow path forming component 41 transported to the cleaning stage 48 by the cleaning stage loading hand 47 is first arranged on the lower cleaning stage 52. Thereafter, as shown in FIGS. 6A and 6B, the upper cleaning stage 53 is lowered, the flow path forming component 41 is sandwiched between the lower cleaning stage 52, and the periphery of the opening of the flow path forming component 41 is sealed. To do. As a result, the cleaning liquid flows into and out of the flow path of the flow path forming component 41. For this reason, the flow path forming component 41 and the contact member of the lower cleaning stage 52 and the upper cleaning stage 53 are arranged. The contact member is preferably an elastic body that does not easily damage the flow path forming component 41.

図6は同洗浄装置の洗浄ステージを示すものであり(a)は、洗浄ステージの斜視図、(b)は(a)中のA−A線に相当する断面図、(c)は(a)中のB−B線に相当する断面図である。この例では接触部材として洗浄下ステージシート79および洗浄上ステージシート81が配置される。洗浄下ステージシート79および洗浄上ステージシート81は、シリコンゴムで成形されており、流路形成部品41への傷付きを防止すると共に、良好なシール性を確保している。なお、図6(a)、(b)では、洗浄下ステージシート79と振動板部材2、洗浄上ステージシート81と流路板1との間には、隙間を描いているが、実際にはこれらの間は密着状態とする。   6A and 6B show a cleaning stage of the cleaning apparatus, wherein FIG. 6A is a perspective view of the cleaning stage, FIG. 6B is a cross-sectional view corresponding to the line AA in FIG. It is sectional drawing equivalent to the BB line in the inside. In this example, the lower cleaning stage sheet 79 and the upper cleaning stage sheet 81 are disposed as contact members. The under-washing stage sheet 79 and the over-washing stage sheet 81 are formed of silicon rubber, preventing damage to the flow path forming component 41 and ensuring good sealing performance. 6 (a) and 6 (b), a gap is drawn between the cleaning stage sheet 79 and the diaphragm member 2, and the cleaning stage sheet 81 and the flow path plate 1. Between these, it shall be in a close contact state.

このような状態で、流路形成部品41の流路の内面を洗浄対象面とする。なお、洗浄下ステージシート79の内側に配置される振動板部材2の下側面の一部、および洗浄上ステージシート81の内側に配置される1の上側面の一部も洗浄液に触れるが、これらの部分を洗浄する目的ではない。必要に応じて、洗浄下ステージシート79および洗浄上ステージシート81の形状を変更して洗浄液に触れる部分を小さくすることができる。   In such a state, the inner surface of the flow path of the flow path forming component 41 is set as a surface to be cleaned. A part of the lower side surface of the diaphragm member 2 disposed inside the stage sheet 79 under cleaning and a part of the upper side surface 1 disposed inside the stage sheet 81 above the cleaning also touch the cleaning liquid. The purpose is not to clean the part. If necessary, the shape of the stage sheet 79 under cleaning and the stage sheet 81 above cleaning can be changed to reduce the portion that comes into contact with the cleaning liquid.

その後、封止状態の確認のため、測定経路バルブ54、大気開放経路バルブ55、排出経路バルブ56、洗浄バルブ57を閉じた状態でエアーブローバルブ58を開放し、加圧エアー源59からエアーを流入させる。そして、エアーが設定された圧力に達したことを確認し、エアーブローバルブ58を閉める。設定された時間中、圧力センサー60にて圧力値の推移を監視し、圧力の減少量が閾値以下である場合、封止できていると判断し、次のステップへ進む。また、加圧エアー源59からのエアーはレギュレーター61にて圧力管理され、加圧エアー源59からのエアー中の異物はフィルター62に捕捉される。   Thereafter, in order to confirm the sealing state, the air blow valve 58 is opened with the measurement path valve 54, the air release path valve 55, the discharge path valve 56, and the cleaning valve 57 closed, and air is supplied from the pressurized air source 59. Let it flow. Then, after confirming that the air has reached the set pressure, the air blow valve 58 is closed. During the set time, the pressure sensor 60 monitors the transition of the pressure value, and when the pressure decrease amount is equal to or less than the threshold value, it is determined that the sealing has been performed, and the process proceeds to the next step. Air from the pressurized air source 59 is pressure-controlled by the regulator 61, and foreign matter in the air from the pressurized air source 59 is captured by the filter 62.

洗浄装置30では洗浄液として、乾燥時間が短く、常温で乾燥可能なフッ素系有機溶剤を用いる。洗浄液はタンク63に蓄えられており、蒸散量を低減するため、タンク63内に設置されたクーラー64により常時冷却されている。また、洗浄液を流路形成部品41に通液しない状態においては、常時稼働しているダイアフラムポンプ65で送られた洗浄液はリリーフバルブ66を介して、異物を捕捉するフィルター67に至る。そして、タンク63へと戻るよう、常に循環することで洗浄液を常にフィルタリングし、清浄な状態を保つことができる。   In the cleaning apparatus 30, a fluorinated organic solvent that has a short drying time and can be dried at room temperature is used as the cleaning liquid. The cleaning liquid is stored in the tank 63 and is always cooled by a cooler 64 installed in the tank 63 in order to reduce the transpiration amount. Further, in a state where the cleaning liquid is not passed through the flow path forming component 41, the cleaning liquid sent by the diaphragm pump 65 that is always operating reaches the filter 67 that captures foreign matter via the relief valve 66. The cleaning liquid can always be filtered by constantly circulating so as to return to the tank 63, and a clean state can be maintained.

続いて、流路形成部品41の流路に洗浄液を通すことにより異物の除去を行う(図6(a)、(b)中の矢印)。測定経路バルブ54、大気開放経路バルブ55、エアーブローバルブ58を閉めた状態で排出経路バルブ56および洗浄バルブ57を開放し、タンク63内の洗浄液をダイアフラムポンプ65にて送る。レギュレーター68で圧力を調整し、流速センサー69で洗浄状態に異常がないことを監視する。洗浄液は、フィルター70で異物を捕捉された後、洗浄バルブ57を介して洗浄ステージ48へ流入し、洗浄バルブ57、電磁式流速調整バルブ71を通過し、タンク63へ排出される。電磁式流速調整バルブ71は、経路内の断面積を段階的に変化させる。   Subsequently, the foreign matter is removed by passing the cleaning liquid through the flow path of the flow path forming component 41 (arrows in FIGS. 6A and 6B). The discharge path valve 56 and the cleaning valve 57 are opened with the measurement path valve 54, the air release path valve 55, and the air blow valve 58 closed, and the cleaning liquid in the tank 63 is sent by the diaphragm pump 65. The regulator 68 adjusts the pressure, and the flow rate sensor 69 monitors that there is no abnormality in the cleaning state. After the foreign substance is captured by the filter 70, the cleaning liquid flows into the cleaning stage 48 through the cleaning valve 57, passes through the cleaning valve 57 and the electromagnetic flow rate adjustment valve 71, and is discharged to the tank 63. The electromagnetic flow rate adjusting valve 71 changes the cross-sectional area in the path stepwise.

ここで、洗浄装置30の通液開始時は、配管内には空気が混入している。このため、あらかじめ実験により設定された空気が排出されるまでの時間だけ通液した後、測定経路バルブ54を開放することで異物センサー72へ流路形成部品41を通過し、異物を含んだ洗浄液中に含まれる異物の大きさおよび数の測定を行う。異物センサー72を通過した洗浄液は異物センサー72に流れる流速を測定するための流速センサー73を通過し、タンク63へ戻る。異物センサー72は、通過する洗浄液にレーザー光を照射し、この状態を受光素子で観測することにより異物の大きさおよび数を測定する。異物センサー72からの測定値信号75が発信され、測定値信号75を受けたシーケンサー74は、洗浄を継続するか、洗浄を終了するかの判断を行う。そして、シーケンサー74は、洗浄を終了すると判断すると、終了信号78を各バルブに発信し、各バルブの開閉状態が次のステップへ移行する。   Here, air is mixed in the piping when the cleaning device 30 starts to flow. For this reason, after passing the air set in advance by the experiment until the air is discharged, the measurement path valve 54 is opened to pass the flow path forming component 41 to the foreign matter sensor 72 and the cleaning solution containing foreign matter. Measure the size and number of foreign matter contained therein. The cleaning liquid that has passed through the foreign matter sensor 72 passes through the flow rate sensor 73 for measuring the flow rate flowing through the foreign matter sensor 72 and returns to the tank 63. The foreign matter sensor 72 measures the size and number of foreign matters by irradiating the cleaning liquid passing therethrough with laser light and observing this state with a light receiving element. A measurement value signal 75 is transmitted from the foreign matter sensor 72, and the sequencer 74 that has received the measurement value signal 75 determines whether to continue the cleaning or to end the cleaning. When the sequencer 74 determines that the cleaning is finished, it sends an end signal 78 to each valve, and the open / close state of each valve shifts to the next step.

異物センサー72に流れ込む流速Aと排出経路バルブ56に流れ込む流速Bの割合は、電磁式流速調整バルブ71により調整できる。実施形態1に係る洗浄装置30では、流速センサー73により流速Aを測定し、流速センサー73は流速Aが異物センサー72の計測仕様から外れる場合、シーケンサー74に異常信号76を発信する。シーケンサー74は異物センサー72の計測仕様範囲に収まるように、電磁式流速調整バルブ71に流速増減信号77を発信し、それを受けた電磁式流速調整バルブ71は流速増減信号77に従って流速を自動で調整するフィードバック機構を備える。従って、流速Aは異物センサー72の計測仕様範囲内に抑えつつ、流速Bを高め、異物の除去能力を向上させることができる。   The ratio of the flow rate A flowing into the foreign matter sensor 72 and the flow rate B flowing into the discharge path valve 56 can be adjusted by the electromagnetic flow rate adjustment valve 71. In the cleaning apparatus 30 according to the first embodiment, the flow rate sensor 73 measures the flow rate A, and the flow rate sensor 73 transmits an abnormal signal 76 to the sequencer 74 when the flow rate A deviates from the measurement specification of the foreign matter sensor 72. The sequencer 74 transmits a flow rate increase / decrease signal 77 to the electromagnetic flow rate adjustment valve 71 so that it falls within the measurement specification range of the foreign matter sensor 72, and the electromagnetic flow rate adjustment valve 71 that receives it automatically changes the flow rate according to the flow rate increase / decrease signal 77. A feedback mechanism for adjustment is provided. Therefore, the flow rate A can be suppressed within the measurement specification range of the foreign matter sensor 72, the flow rate B can be increased, and the foreign matter removal capability can be improved.

シーケンサー74から洗浄終了を指示する終了信号78が出力されると、洗浄中に開放されていた測定経路バルブ54、洗浄バルブ57が閉められ、配管内の洗浄液を排出するため、エアーブローバルブ58が開放される。このとき、タンク63に接続さ、大気に連通した圧力開放バルブ91が開放されて、加圧エアー源59からのエアーでタンク63内の圧力が高まることを防止する。あらかじめ設定された時間エアーブローを行い、配管内の洗浄液が抜けた状態で排出経路バルブ56、エアーブローバルブ58、圧力開放バルブ91が閉められ、配管内を大気圧に戻すため大気開放経路バルブ55が開放される。なお、これらのバルブの操作手順等は必要に応じて変更できる。   When an end signal 78 instructing the end of cleaning is output from the sequencer 74, the measurement path valve 54 and the cleaning valve 57 that were opened during the cleaning are closed, and the air blow valve 58 is discharged to discharge the cleaning liquid in the pipe. Opened. At this time, the pressure release valve 91 connected to the tank 63 and communicated with the atmosphere is opened to prevent the pressure in the tank 63 from being increased by the air from the pressurized air source 59. Air discharge is performed for a preset time, and the discharge path valve 56, the air blow valve 58, and the pressure release valve 91 are closed in a state where the cleaning liquid in the pipe has been removed, and the atmosphere release path valve 55 is returned to return the inside of the pipe to atmospheric pressure. Is released. The operation procedure of these valves can be changed as necessary.

以上の一連の流れをもって、流路形成部品41の洗浄が行われる。洗浄終了後の流路形成部品41は洗浄ステージ排出ハンド49により排出トレイ50へ搬送され、続いて洗浄される流路形成部品41が洗浄ステージ投入ハンド47により洗浄ステージ48へ搬送される。   The flow path forming component 41 is cleaned with the above-described series of flows. After the cleaning, the flow path forming component 41 is transported to the discharge tray 50 by the cleaning stage discharge hand 49, and the flow path forming component 41 to be subsequently cleaned is transported to the cleaning stage 48 by the cleaning stage loading hand 47.

次に洗浄中の異物測定の流れについて説明する。図7は同洗浄装置の処理工程を示すフローチャートである。流路形成部品41内を通過した、異物が混入した洗浄液中の異物を洗浄上ステージ53に取付けられた異物センサー72で計測する。まず測定回数である「n」を「0」に設定する(ステップS1)。そして、設定した測定時間内に異物センサー72を通過した異物の大きさを検出し(ステップS2)、設定された大きさの異物の検出数が所定時間内に設定された数以下であるかを判定する(ステップS3)。そして、回数「n」に「1」を加算して(ステップS4)、許容できる大きさの異物が許容できる数以下となる測定が設定した回数(N)だけ連続すると(ステップS5のYES)とシーケンサー74が洗浄終了の終了信号78を発信する。実施形態1では、10μm以上の異物が、数「0」となった回数が2回連続すると洗浄終了の信号を発生する。なお、異物の大きさ、数、回数については必要に応じて変更できる。   Next, the flow of foreign matter measurement during cleaning will be described. FIG. 7 is a flowchart showing the processing steps of the cleaning apparatus. The foreign matter in the cleaning liquid mixed with foreign matter that has passed through the flow path forming component 41 is measured by the foreign matter sensor 72 attached to the cleaning upper stage 53. First, “n” as the number of measurements is set to “0” (step S1). Then, the size of the foreign matter that has passed through the foreign matter sensor 72 within the set measurement time is detected (step S2), and whether or not the number of detected foreign matters is equal to or less than the number set within the predetermined time. Determine (step S3). Then, “1” is added to the number of times “n” (step S4), and when the number of times that the number of allowable foreign substances is less than or equal to the allowable number continues for the set number of times (N) (YES in step S5). The sequencer 74 transmits a cleaning end signal 78. In the first embodiment, a cleaning end signal is generated when the number of foreign matters of 10 μm or more reaches the number “0” twice. The size, number, and number of foreign matters can be changed as necessary.

ここで、異物センサー72は、測定された異物が異物であるか、もしくはそれ以外の例えば気泡であるかの判断はできない。このため、気泡の混入は測定誤差に直結する。よって、正しい測定結果を得るためには気泡の発生を抑える配管構成が重要となる。以下、気泡を抑えることができる構成について説明する。   Here, the foreign matter sensor 72 cannot determine whether the measured foreign matter is a foreign matter or other bubbles, for example. For this reason, mixing of bubbles directly leads to measurement errors. Therefore, in order to obtain a correct measurement result, a piping configuration that suppresses the generation of bubbles is important. Hereinafter, the structure which can suppress a bubble is demonstrated.

まず、洗浄下ステージ52の構成について説明する。図8は同洗浄下ステージおよび周辺配管の概略構成を示すものであり、(a)は側面図、(b)は正面図、(c)は(b)中のC−C線に相当する断面図、(d)は(a)中のD−D線に相当する断面図である。洗浄下ステージ52は、化学的に安定であり、洗浄液に腐食されにくいステンレス製である。洗浄下ステージ52には、流路形成部品41とのシール性を確保するため、流路形成部品41の開口部に合わせて吐出口が形成された洗浄下ステージシート79がライニング加工で形成されている。   First, the configuration of the lower cleaning stage 52 will be described. FIG. 8 shows a schematic configuration of the stage under cleaning and peripheral piping, (a) is a side view, (b) is a front view, and (c) is a cross-section corresponding to line CC in (b). FIG. 4D is a cross-sectional view corresponding to the line DD in FIG. The lower cleaning stage 52 is made of stainless steel that is chemically stable and hardly corroded by the cleaning liquid. In the lower cleaning stage 52, a lower cleaning stage sheet 79 having a discharge port formed in accordance with the opening of the flow path forming component 41 is formed by a lining process in order to ensure sealing performance with the flow path forming component 41. Yes.

洗浄バルブ57が開放されることでT字継ぎ手80下側から洗浄液が通される。また、洗浄液通液前の封止状態確認時および通液終了後の配管内の洗浄液排出時に加圧エアー源59からのエアーを供給するエアーブローバルブ58はT字継ぎ手80に対して横方向に接続されている。洗浄バルブ57が横方向に設置されているとエアーブローにより、たまった洗浄液が徐々に押し出される。これに対して、下方向に配置されているとたまった洗浄液はエアーブローで押し出されにくいこととなる。   When the cleaning valve 57 is opened, the cleaning liquid is passed from the lower side of the T-shaped joint 80. An air blow valve 58 for supplying air from the pressurized air source 59 is provided laterally with respect to the T-shaped joint 80 when the sealing state is confirmed before the cleaning liquid is passed and when the cleaning liquid is discharged from the pipe after the liquid is passed. It is connected. When the cleaning valve 57 is installed in the lateral direction, the accumulated cleaning liquid is gradually pushed out by air blow. On the other hand, if it is arranged in the downward direction, the accumulated cleaning liquid is difficult to be pushed out by air blow.

このため、洗浄液の排出時間を充分に長く取らないと、洗浄終了後に流路形成部品41が洗浄ステージ48から開放された際に流路形成部品が洗浄液でぬれるおそれがある。従って、洗浄バルブ57とエアーブローバルブ58との位置関係は、洗浄バルブ57は下方向が望ましい。また、測定ノイズとなる気泡の混入量を低減するため、洗浄下ステージ52と洗浄バルブ57、エアーブローバルブ58間の配管長さは短ければ短いほど良い。   For this reason, if the discharge time of the cleaning liquid is not sufficiently long, the flow path forming component may get wet with the cleaning liquid when the flow path forming component 41 is released from the cleaning stage 48 after completion of the cleaning. Accordingly, the positional relationship between the cleaning valve 57 and the air blow valve 58 is preferably downward. In addition, in order to reduce the amount of bubbles that become measurement noise, the shorter the piping length between the lower cleaning stage 52, the cleaning valve 57, and the air blow valve 58, the better.

次に、洗浄上ステージ53の構成を説明する。図9は同洗浄上ステージおよび周辺配管の概略構成を示すものであり、(a)は側面図、(b)は正面図、(c)は(b)中のC−C線に相当する断面図、(d)は(a)中のD−D線に相当する断面図である。洗浄上ステージ53は、洗浄下ステージ52と同様に、ステンレス製である。洗浄上ステージ53には流路形成部品41の開口部に合わせて吐出口が形成された洗浄上ステージシート81がライニング加工で形成されている。   Next, the configuration of the cleaning upper stage 53 will be described. FIG. 9 shows a schematic configuration of the cleaning upper stage and peripheral piping, (a) is a side view, (b) is a front view, and (c) is a cross-section corresponding to the line CC in (b). FIG. 4D is a cross-sectional view corresponding to the line DD in FIG. The upper cleaning stage 53 is made of stainless steel like the lower cleaning stage 52. On the cleaning upper stage 53, a cleaning upper stage sheet 81 having a discharge port formed in accordance with the opening of the flow path forming component 41 is formed by lining processing.

また、洗浄上ステージ53の内部では、流路がT字継ぎ手82で分岐しており、上側に測定経路バルブ54が、さらに下流側に異物センサー72が設置されている。通液開始時には測定経路バルブ14が閉じられ、横方向の分岐経路に洗浄液が通り、測定ノイズとなる気泡が配管型路から排出された段階で測定経路バルブ54を開放することで、異物センサー72への気泡の侵入を押さえることできる。しかし、配管経路の凹凸部にたまり排出しきれなかった気泡が異物センサー72に侵入した場合、上述した構成にすることで、浮力により気泡は上方向に力を受けるため、排出しやすくなる。   In the upper cleaning stage 53, the flow path is branched by a T-shaped joint 82, the measurement path valve 54 is installed on the upper side, and the foreign matter sensor 72 is installed on the downstream side. The measurement path valve 14 is closed at the start of liquid flow, the cleaning liquid passes through the branch path in the horizontal direction, and the foreign substance sensor 72 is opened by opening the measurement path valve 54 when bubbles that become measurement noise are discharged from the pipe-type path. Can suppress the invasion of bubbles. However, when air bubbles that have accumulated in the concavo-convex portion of the piping path have entered the foreign matter sensor 72, the above-described configuration makes it easier for the air bubbles to be discharged because they receive upward force due to buoyancy.

<実施形態2>
次に実施形態2に係る洗浄装置30について説明する。実施形態に係る洗浄装置30は、洗浄上ステージを実施形態1と異なる構成とする。図10は本発明に係る洗浄装置の実施形態2に係る洗浄上ステージを示すものであり、(a)は側面図、(b)は正面図、(c)は(b)中のC−C線に相当する断面図、(d)は(a)中のD−D線に相当する断面図である。洗浄上ステージ53は、ステンレスである。洗浄上ステージ53には流路形成部品41の開口部に合わせて吐出口が形成された洗浄上ステージシート81がライニング加工で形成されている。洗浄上ステージ53の出口では、T字継ぎ手82で分岐しており、測定経路バルブ54が、さらに下流側に異物センサー72が設置されている。このため、洗浄液が異物センサー72の上方向から下方向に流入する。また、洗浄上ステージ53と、異物センサー72との間に開閉バルブである測定経路バルブ54が配置されている。測定経路バルブ54は、洗浄中の任意のタイミングで開閉できる。この例では、通液開始時には閉じられ、横方向の分岐経路に洗浄液が通り、測定ノイズとなる気泡が配管型路から排出された段階で測定経路バルブ54を開放する。これにより異物センサー72への気泡の侵入を押さえることができる。この例では、気泡は浮力で上方向に力を受けるため、測定経路に侵入しにくくなる。
<Embodiment 2>
Next, the cleaning apparatus 30 according to the second embodiment will be described. The cleaning apparatus 30 according to the embodiment has a different cleaning stage from that of the first embodiment. FIG. 10 shows a cleaning upper stage according to Embodiment 2 of the cleaning apparatus according to the present invention, where (a) is a side view, (b) is a front view, and (c) is CC in (b). Sectional drawing equivalent to a line, (d) is sectional drawing equivalent to the DD line in (a). The upper cleaning stage 53 is stainless steel. On the cleaning upper stage 53, a cleaning upper stage sheet 81 having a discharge port formed in accordance with the opening of the flow path forming component 41 is formed by lining processing. At the outlet of the upper cleaning stage 53, a branch is made by a T-shaped joint 82, a measurement path valve 54 is installed, and a foreign substance sensor 72 is installed further downstream. For this reason, the cleaning liquid flows from the upper side to the lower side of the foreign matter sensor 72. A measurement path valve 54 that is an open / close valve is disposed between the cleaning upper stage 53 and the foreign matter sensor 72. The measurement path valve 54 can be opened and closed at any timing during cleaning. In this example, the liquid is closed at the start of liquid passage, the cleaning liquid passes through the branch path in the horizontal direction, and the measurement path valve 54 is opened at the stage where bubbles that become measurement noise are discharged from the pipe-type path. As a result, the entry of bubbles into the foreign matter sensor 72 can be suppressed. In this example, since the bubbles receive upward force due to buoyancy, it is difficult to enter the measurement path.

図11は同洗浄装置の外観構成を示す斜視図である。洗浄装置30は、投入モジュール85、洗浄モジュール86、排出モジュール87、空圧回路88、液体回路89と、配電盤90とを備え一体に構成されている。これにより、必要最小の洗浄時間にて許容レベルの清浄度を達成可能な洗浄を行うことができる洗浄装置を提供することが可能となる。   FIG. 11 is a perspective view showing an external configuration of the cleaning apparatus. The cleaning device 30 includes an input module 85, a cleaning module 86, a discharge module 87, a pneumatic circuit 88, a liquid circuit 89, and a switchboard 90, and is configured integrally. As a result, it is possible to provide a cleaning apparatus capable of performing cleaning that can achieve an acceptable level of cleanliness with a minimum required cleaning time.

以上のように、実施形態に係る洗浄装置によれば、洗浄液中の異物の大きさおよび数の両方を任意の時間、または任意の測定体積で測定し、許容される異物の大きさおよび数の閾値に基づいて信号を出力する。従って、オペレーターに所望の大きさの異物がどの程度残っているかの洗浄処理状態を知らせることができる。   As described above, according to the cleaning device according to the embodiment, both the size and number of foreign matters in the cleaning liquid are measured at an arbitrary time or at an arbitrary measurement volume, and the allowable size and number of foreign matters are measured. A signal is output based on the threshold value. Therefore, it is possible to inform the operator of the cleaning process state of how much foreign matter of a desired size remains.

また、許容される清浄度が達成できた場合、速やかに洗浄を終了することができるため、無駄無く効率的な洗浄が可能になる。   In addition, when the permissible cleanliness can be achieved, the cleaning can be quickly completed, so that efficient cleaning without waste is possible.

また、被洗浄対象内に洗浄液を注入および排出し被洗浄面に付着する汚れを除去するので、被洗浄面だけの清浄度を要求される対象を洗浄する場合、被洗浄面のみを通過した洗浄液を測定できる。このため、被洗浄物の被洗浄面以外に付着した異物に影響されない測定結果に基づいて洗浄を完了できる。   Also, since the cleaning liquid is injected into and discharged from the object to be cleaned to remove the dirt adhering to the surface to be cleaned, the cleaning liquid that has passed through only the surface to be cleaned when cleaning an object that requires cleanliness only on the surface to be cleaned Can be measured. For this reason, the cleaning can be completed based on the measurement result that is not affected by the foreign matter adhering to the surface other than the surface to be cleaned.

また、異物センサーの設置位置を、被洗浄対象より排出される洗浄液全てを回収する配管経路中に設置するので、被洗浄対象より除去された異物全てを測定可能となる。さらに、要求される清浄度が高く、数個の異物も許容できない場合には、被洗浄対象より排出される洗浄液の一部のみで測定することができる。このとき測定しなかった残りの洗浄液に数個の異物が存在し、サンプリングした洗浄液に異物が存在しない場合が確率的に生じる場合に効果的である。   Moreover, since the installation position of the foreign matter sensor is installed in the piping path for collecting all the cleaning liquid discharged from the subject to be cleaned, all foreign matters removed from the subject to be cleaned can be measured. Furthermore, when the required cleanliness is high and several foreign substances cannot be allowed, measurement can be performed with only a part of the cleaning liquid discharged from the object to be cleaned. This is effective in the case where several foreign matters exist in the remaining cleaning liquid that has not been measured at this time, and the case where no foreign substances exist in the sampled cleaning liquid occurs stochastically.

また、異物センサーによって測定可能な流速仕様が異なる場合においては配管型路に流速調整機構を設置し、異物センサーの仕様範囲に流速を調整することができ、正確な測定ができる。   In addition, when the flow rate specifications that can be measured differ depending on the foreign matter sensor, a flow rate adjustment mechanism is installed in the piping path, and the flow rate can be adjusted within the specification range of the foreign matter sensor, so that accurate measurement can be performed.

また、異物センサーに仕様以上の流速で洗浄液を流すとき、洗浄後の洗浄液を排出する経路を被洗浄対象と異物センサー間で分岐し、異物センサーを備える測定経路と異物センサーを備えない排出経路に分けることができる。これにより、いずれかの経路に流速調整機構を備えることで測定経路には仕様の流速を流し、残りの洗浄液を排出経路に流すことで流速を高めつつ、測定精度を落とさない洗浄ができる。   In addition, when the cleaning liquid is allowed to flow through the foreign matter sensor at a flow rate that exceeds the specifications, the path for discharging the cleaning liquid after cleaning branches between the object to be cleaned and the foreign matter sensor, and is divided into a measurement route with the foreign matter sensor and a discharge route without the foreign matter sensor. Can be divided. Accordingly, by providing a flow rate adjusting mechanism in any of the paths, the specified flow rate is allowed to flow in the measurement path, and the remaining cleaning liquid is allowed to flow in the discharge path, thereby increasing the flow rate and cleaning without reducing the measurement accuracy.

また、異物測定に際して、測定ノイズとなる洗浄液の気泡を、配管内を正圧とすることで抑制し、洗浄液が負圧となることによる洗浄液の気体への状態変化を防ぐことができる。これにより、異物センサーにおける気泡の影響を排除し、異物を確実に測定できる。   In addition, when measuring foreign matter, bubbles in the cleaning liquid that cause measurement noise can be suppressed by setting the inside of the pipe to a positive pressure, and a change in the state of the cleaning liquid to the gas due to the negative pressure of the cleaning liquid can be prevented. Thereby, the influence of the bubble in a foreign material sensor is excluded, and a foreign material can be measured reliably.

また、断面積の変化により配管抵抗を変えて流速調整を行うので、配管内への気泡の混入等を防止しつつ流速調整ができ、測定ノイズを発生させることがない。また、異物センサーの仕様を変更しても容易に対応可能となる。   Further, since the flow rate is adjusted by changing the pipe resistance according to the change in the cross-sectional area, the flow rate can be adjusted while preventing bubbles from being mixed into the pipe, and measurement noise is not generated. In addition, even if the specification of the foreign matter sensor is changed, it can be easily handled.

また、異物センサーへの液の流入方向を異物センサー下方向から上方向とすることで、測定系路内に測定ノイズとなる気泡が侵入した際に、浮力の影響により気泡の排出が容易となる。   Also, by setting the flow direction of the liquid to the foreign matter sensor from the lower side to the upper side of the foreign matter sensor, when bubbles that become measurement noise enter the measurement system, the bubbles can be easily discharged due to the influence of buoyancy. .

また、異物センサーへの液の流入を異物センサー上方向から下方向にした場合、被洗浄対象と異物センサーの間に開閉バルブを備えるものとできる。これにより、配管内が洗浄液で満たされた状態でバルブを開くことで測定系路内に気泡の侵入を防ぐことができる。   Moreover, when the inflow of the liquid to the foreign matter sensor is changed from the upper side to the lower side of the foreign matter sensor, an opening / closing valve can be provided between the object to be cleaned and the foreign matter sensor. Thereby, it is possible to prevent bubbles from entering the measurement system by opening the valve in a state where the inside of the pipe is filled with the cleaning liquid.

また、開閉バルブを洗浄中の任意のタイミングで開閉できるので、配管内に測定ノイズとなる気泡がない状態で異物センサーへ洗浄液を通液することができ、測定ノイズを低減することができる。   In addition, since the open / close valve can be opened and closed at any timing during cleaning, the cleaning liquid can be passed through the foreign matter sensor without bubbles that become measurement noise in the pipe, and measurement noise can be reduced.

なお、前記各実施形態では、被洗浄物としてインク吐出ヘッドの流路形成部品を対象とし、被洗浄面として流路形成部品の流路内面を洗浄する場合を例として説明したが、被洗浄物および被洗浄面はこれに限らない。   In each of the above-described embodiments, the flow path forming component of the ink discharge head is targeted as an object to be cleaned, and the flow path inner surface of the flow path forming component is cleaned as an example of the surface to be cleaned. The surface to be cleaned is not limited to this.

30:洗浄装置
41:流路形成部品
42:投入トレイ
44:トレイ投入口
45:トレイ投入ハンド
46:アライメントステージ
46a:プッシャー
47:洗浄ステージ投入ハンド
48:洗浄ステージ
49:洗浄ステージ排出ハンド
50:排出トレイ
51:トレイ排出口
52:洗浄下ステージ
53:洗浄上ステージ
54:測定経路バルブ(開閉バルブ)
55:大気開放経路バルブ
56:排出経路バルブ
57:洗浄バルブ
58:エアーブローバルブ
59:加圧エアー源
60:圧力センサー
61:レギュレーター
62:フィルター
63:タンク
64:クーラー
65:ダイアフラムポンプ
66:リリーフバルブ
67:フィルター
68:レギュレーター
69:流速センサー
70:フィルター
71:電磁式流速調整バルブ(流速調整機構)
72:異物センサー
73:流速センサー
74:シーケンサー(判断手段)
30: Cleaning device 41: Flow path forming component 42: Input tray 44: Tray input port 45: Tray input hand 46: Alignment stage 46a: Pusher 47: Cleaning stage input hand 48: Cleaning stage 49: Cleaning stage discharge hand 50: Discharge Tray 51: Tray discharge port 52: Lower cleaning stage 53: Upper cleaning stage 54: Measurement path valve (open / close valve)
55: Air release path valve 56: Discharge path valve 57: Cleaning valve 58: Air blow valve 59: Pressurized air source 60: Pressure sensor 61: Regulator 62: Filter 63: Tank 64: Cooler 65: Diaphragm pump 66: Relief valve 67: Filter 68: Regulator 69: Flow rate sensor 70: Filter 71: Electromagnetic flow rate adjustment valve (flow rate adjustment mechanism)
72: Foreign matter sensor 73: Flow rate sensor 74: Sequencer (determination means)

特開2003―93991公報参照See JP-A-2003-93991 特開平11−233478公報参照See JP-A-11-233478 特開2001−276760公報参照See JP 2001-276760 A 特開平11−233478公報参照See JP-A-11-233478 特開平2−157077公報参照See JP-A-2-157070

Claims (10)

被洗浄対象物の被洗浄面に付着した異物を洗浄液で除去する洗浄装置において、
前記被洗浄面の洗浄に使用した洗浄液を回収する回収路と、
前記回収路に配置され前記回収路を流れる洗浄液に含まれる異物の大きさおよび数を検出する異物センサーと、
前記異物センサーで検出した異物の大きさおよび数に基づいて、前記被洗浄対象物の洗浄を継続するか、洗浄を終了するか、の判断を行う判断手段と、
を備えることを特徴とする洗浄装置。
In a cleaning device that removes foreign matter adhering to the surface to be cleaned with a cleaning liquid,
A recovery path for recovering the cleaning liquid used for cleaning the surface to be cleaned;
A foreign matter sensor that detects the size and number of foreign matter contained in the cleaning liquid that is arranged in the recovery passage and flows through the recovery passage;
Based on the size and number of foreign matter detected by the foreign matter sensor, determination means for determining whether to continue cleaning the object to be cleaned or to end the cleaning;
A cleaning apparatus comprising:
前記被洗浄対象物の前記被洗浄面が、前記被洗浄対象物を貫通する孔部の内面を含み、前記洗浄液を前記孔部に注入して排出することにより異物を除去することを特徴とする請求項1に記載の洗浄装置。   The surface to be cleaned of the object to be cleaned includes an inner surface of a hole penetrating the object to be cleaned, and foreign matter is removed by injecting and discharging the cleaning liquid into the hole. The cleaning apparatus according to claim 1. 前記判断手段は、あらかじめ設定した大きさの異物を、あらかじめ設定した数以下、あらかじめ設定した回数だけ連続して測定した、とき洗浄を終了すると判断することを特徴とする請求項1に記載の洗浄装置。   2. The cleaning according to claim 1, wherein the determination unit determines that the cleaning is finished when the predetermined size of foreign matter is continuously measured for a predetermined number of times or less in advance. apparatus. 前記回収路は、前記異物センサーを備える測定経路と、前記異物センサーを備えない迂回経路とを備えることを特徴とする請求項1に記載の洗浄装置。   The cleaning apparatus according to claim 1, wherein the recovery path includes a measurement path including the foreign matter sensor and a detour path not including the foreign matter sensor. 前記測定経路および前記迂回経路の少なくとも一方に前記異物センサーの計測仕様範囲内に流速を調整する流速調整機構を備えることを特徴とする請求項4に記載の洗浄装置。   The cleaning apparatus according to claim 4, further comprising a flow rate adjusting mechanism that adjusts a flow rate within a measurement specification range of the foreign matter sensor in at least one of the measurement path and the bypass path. 前記流速調整機構は、経路内の断面積を段階的に変化させる機構を備えることを特徴とする請求項5に記載の洗浄装置。   The cleaning apparatus according to claim 5, wherein the flow rate adjusting mechanism includes a mechanism that changes a cross-sectional area in the path in a stepwise manner. 前記洗浄液の流通経路において前記洗浄液を正圧に保持する機構を備えることを特徴とする請求項1に記載の洗浄装置。
The cleaning apparatus according to claim 1, further comprising a mechanism that holds the cleaning liquid at a positive pressure in the flow path of the cleaning liquid.
前記異物センサーには、前記洗浄液が前記異物センサーの下方向から上方向に流入させることを特徴とする請求項1に記載の洗浄装置。   The cleaning apparatus according to claim 1, wherein the cleaning liquid is allowed to flow into the foreign matter sensor from below to above the foreign matter sensor. 前記異物センサーには、前記洗浄液が前記異物センサーの上方向から下方向に流入させ、前記被洗浄対象物と前記異物センサーとの間に開閉バルブを備えることを特徴とする請求項1に記載の洗浄装置。   2. The foreign matter sensor according to claim 1, further comprising an open / close valve between the object to be cleaned and the foreign matter sensor. Cleaning device. 前記開閉バルブは洗浄中の任意のタイミングで開閉できることを特徴とする請求項9に記載の洗浄装置。   The cleaning device according to claim 9, wherein the opening / closing valve can be opened and closed at an arbitrary timing during cleaning.
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