JP2015046525A - Division method of workpiece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To keep good quality in processing by preventing clogging, glazing or the like of an abrasive grind wheel during grinding in pre-dicing.SOLUTION: In a division method of a workpiece, an isolation groove (13) is formed along a division schedule line (15) on a surface (11) of the workpiece (W), a cut groove (14) deeper than the isolation groove is formed in a non-device region (17) of the workpiece, a liquid resin containing abrasive grains for dressing of an abrasive grind wheel (52) is filled into the cut groove to form a dressing member (21), the workpiece is ground from the rear surface (12) side, and grinding is made possible up to the finished thickness of the workpiece while performing dressing of the abrasive grind wheel.

Description

  The present invention divides into individual devices by forming separation grooves along the planned division lines formed on the surface of the workpiece, and grinding the back surface of the workpiece to expose the separation grooves from the back surface. The present invention relates to a method for dividing a workpiece.

  A workpiece on which a device such as an IC or LSI is formed on the surface is divided into individual devices along a division line by a dicing apparatus or the like and used for various electronic devices. In recent years, in order to meet demands for downsizing, thinning, and the like of electronic devices, a dividing method called pre-dicing has been proposed as a method for dividing a workpiece (see, for example, Patent Document 1). In the first dicing, half-cutting is performed from the surface side of the workpiece along the line to be divided, and a separation groove having a depth corresponding to the finished thickness of the device is formed in the workpiece. And it grinds from the back surface side of a workpiece, exposes a separation groove from the back surface, penetrates the separation groove in the thickness direction, and divides the workpiece into individual devices.

JP 11-40520 A

  However, when grinding a relatively heavy work piece such as LT (lithium tantalate), LN (lithium niobate) or gallium nitride, the grinding wheel may become clogged or clogged during grinding. It was. For this reason, there is a problem in that it is necessary to make sharpening frequently during grinding, or depending on the material, processing cannot be performed with high quality.

  The present invention has been made in view of the above points, and a workpiece dividing method capable of preventing clogging or crushing of a grinding wheel during grinding and performing processing with high quality in pre-dicing. The purpose is to provide.

  A workpiece dividing method according to the present invention is a workpiece dividing method in which a workpiece formed by dividing a plurality of devices on a surface by a plurality of division lines is divided into individual devices. A separation groove forming step for forming a separation groove having a depth corresponding to the finished thickness of the workpiece along a planned division line on the surface of the workpiece, and a protective member is attached to the surface of the workpiece on which the separation groove is formed And a grinding step of dividing the work piece into individual devices by exposing the back surface of the work piece with a grinding wheel to expose the separation groove formed on the front face on the back surface. In the separation groove forming process, the cutting groove is formed at a depth that is deeper than the depth corresponding to the finished thickness in a region that does not affect the device and does not penetrate the back surface of the workpiece, and the separation groove forming process is performed. After applying protective material Before carrying out the process, a liquid resin containing abrasive grains for sharpening a grinding wheel is filled into a groove having a depth deeper than the depth corresponding to the finished thickness and not penetrating the back surface of the workpiece, and set to cure. A member filling step.

  According to this configuration, the separation groove along the division line is formed on the surface of the workpiece, and the cutting groove is formed in a region on the surface of the workpiece that does not affect the device. The cutting groove is filled with a liquid resin containing abrasive grains for grinding wheels, and the liquid resin is cured to form a dressing member in an area where the device of the workpiece is not affected. Then, the workpiece is ground from the back surface side of the workpiece, and the separation groove is exposed from the back surface of the workpiece, so that the workpiece is divided into individual devices along the planned division line. At this time, since the sharpening member is formed at a position deeper than the depth corresponding to the finished thickness, the sharpening member is exposed from the back surface before the separation groove during grinding from the back surface side of the workpiece, and the grinding wheel Grinding while sharpening. Therefore, clogging or crushing of the grinding wheel during grinding is prevented, and the workpiece can be processed with high quality. Moreover, it is not necessary to interrupt the grinding process in order to sharpen the grinding wheel. In addition, the area | region which does not have the influence of the device of a workpiece shows the area | region which is not used as a device chip | tip after division | segmentation of a workpiece. Therefore, in the sharpening member filling step, the liquid resin does not adhere to the device chip.

  In the method for dividing a workpiece according to the present invention, in the sharpening member filling step, the liquid resin is filled from the groove bottom to a position that does not reach a depth corresponding to the finished thickness.

  According to the present invention, by forming a sharpening member on the workpiece, the workpiece can be ground while sharpening the grinding wheel, and clogging or clogging of the grinding wheel during grinding is prevented. Thus, processing can be performed with high quality.

It is a perspective view of the to-be-processed object which concerns on 1st Embodiment. It is a figure which shows an example of the separation groove formation process which concerns on 1st Embodiment. It is a figure which shows an example of the sharpening member filling process which concerns on 1st Embodiment. It is a figure which shows an example of the protection member sticking process which concerns on 1st Embodiment. It is a figure which shows an example of the grinding process which concerns on 1st Embodiment. It is a perspective view of the to-be-processed object which concerns on 2nd Embodiment. It is a figure which shows an example of the isolation | separation groove | channel formation process which concerns on 2nd Embodiment. It is a figure which shows an example of the sharpening member filling process which concerns on 2nd Embodiment. It is a figure which shows an example of the protection member sticking process which concerns on 2nd Embodiment. It is a figure which shows an example of the grinding process which concerns on 2nd Embodiment.

  A workpiece dividing method according to the first embodiment will be described with reference to the accompanying drawings. A workpiece to be processed will be described with reference to FIG. FIG. 1 is a perspective view of a workpiece according to the first embodiment. FIG. 1 shows a state in which a protective member is attached to the surface of the workpiece after separation grooves and cutting grooves are formed on the surface of the workpiece.

  As shown in FIG. 1, the workpiece W is formed in a substantially disc shape, and is partitioned into a plurality of regions by grid-like division planned lines 15 arranged on the surface 11. In the center of the workpiece W, a device 18 is formed in each area partitioned by the division lines 15. The surface 11 of the workpiece W is divided into a device region 19 in which a plurality of devices 18 are formed and a non-device region 17 surrounding the device region 19. A notch 16 indicating a crystal orientation is formed on the outer edge of the workpiece W. A separation groove 13 is formed on the surface 11 of the workpiece W along the division line 15, and a cutting groove 14 is formed in the non-device region 17 of the surface 11.

  The cutting groove 14 is formed with a dressing member 21 by curing a liquid resin containing dressing abrasive grains. A sheet-like protective member 22 for protecting the device 18 is attached to the surface 11 of the workpiece W. The workpiece W may be a semiconductor wafer in which devices such as IC and LSI are formed on a semiconductor substrate such as silicon and gallium arsenide, or an optical device such as LED on a ceramic, glass, and sapphire inorganic material substrate. The formed optical device wafer may be used. In particular, in the dividing method according to the present embodiment, a relatively heavy grinding is applied to LT (lithium tantalate), LN (lithium niobate), gallium nitride, etc., and the grinding wheel 52 (see FIG. 5) is clogged. It is effective for the workpiece W that is likely to be clogged.

  The workpiece W shown in FIG. 1 is processed through a separation groove forming step, a sharpening member filling step, and a protective member attaching step, and the workpiece W is divided into individual devices 18 by performing a grinding step. The In the separation groove forming step, the separation groove 13 is formed along the planned division line 15 on the surface 11 of the workpiece W (see FIG. 2A). In the separation groove forming step, the cutting groove 14 is formed deeper than the separation groove 13 in the non-device region 17 that does not affect the device 18 (see FIG. 2B). In the sharpening member filling step, a liquid resin containing sharpening abrasive grains of the grinding wheel 52 (see FIG. 5) is filled in the cutting grooves 14 formed on the surface 11 of the workpiece W (see FIG. 3A). The setting member 21 is formed in the non-device region 17 of the workpiece W by curing the liquid resin (see FIG. 3B).

  In the protective member attaching step, a sheet-like protective member 22 is attached to the surface 11 of the workpiece W on which the separation groove 13 is formed (see FIG. 4). In the grinding process, the workpiece W is ground from the back surface 12 side, and the separation grooves 13 of the workpiece W are exposed from the back surface 12 of the workpiece W, so that the workpiece W is divided into individual devices 18. (See FIG. 5). At this time, since the setting member 21 is exposed from the back surface 12 before the separation groove 13, the workpiece W is ground while the setting of the grinding wheel is performed by the setting member 21. For this reason, clogging or crushing of the grinding wheel 52 during grinding is prevented, and the workpiece is processed with high quality.

  Hereinafter, with reference to FIG. 2 to FIG. 5, a method for dividing a workpiece according to the first embodiment will be described in detail. 2 shows an example of a separation groove forming process, FIG. 3 shows a sharpening member filling process, FIG. 4 shows a protective member attaching process, and FIG. 5 shows an example of a grinding process.

  As shown in FIG. 2, in the separation groove forming step, first, the separation groove 13 is formed. 2A, the workpiece W is held on a chuck table 32 of a cutting apparatus (not shown) with the device 18 facing upward, and the cutting blade 31 is scheduled to divide the surface 11 of the workpiece W. Positioned on line 15. The chuck table 32 is cut and fed relative to the cutting blade 31 in the X direction in a state where the workpiece W is cut by the cutting blade 31 while the cutting water is sprayed. Thereby, the separation groove 13 having a depth corresponding to the finished thickness T of the device 18 is formed. In this way, the separation grooves 13 are formed along all the division lines 15 in the X direction of the workpiece W.

  Subsequently, in the separation groove forming step, a cutting groove 14 for the sharpening member 21 (see FIG. 3) is formed. As shown in FIG. 2B, the cutting blade 31 is positioned in the non-device region 17 of the workpiece W. The chuck table 32 is cut and fed relative to the cutting blade 31 in the X direction in a state where the workpiece W is cut by the cutting blade 31 while the cutting water is sprayed. Thereby, a cutting groove 14 having a depth D that is deeper than the finished thickness T and does not penetrate the back surface 12 of the workpiece W is formed. In this way, the cutting groove 14 is formed in the non-device region 17 of the workpiece W, and the new cutting groove 14 is formed adjacent to the cutting groove 14 to widen the groove width.

  After the separation groove 13 and the cutting groove 14 in the X direction are formed, the chuck table 32 is rotated 90 degrees. A separation groove 13 is formed along a planned division line 15 in the Y direction perpendicular to the X direction, and a cutting groove 14 is formed in the non-device region 17. As a result, the separation grooves 13 along all the division lines 15 are formed, and the cutting grooves 14 for the sharpening member 21 (see FIG. 3) are formed. In this embodiment, the cutting groove 14 is formed after the separation groove 13 is formed. However, the separation groove 13 may be formed after the cutting groove 14 is formed. Further, although the cutting groove 14 is formed by the cutting blade 31 for the separation groove 13, the cutting groove 14 may be formed by a cutting blade having a blade width larger than that of the cutting blade 31 for the separation groove 13.

  As shown in FIG. 3, after the separation groove forming step, a sharpening member filling step is performed. As shown in FIG. 3A, in the sharpening member filling step, the workpiece W is held on the chuck table 42 of the liquid resin filling device (not shown) with the device 18 facing upward. Further, the nozzle 41 is positioned above the cutting groove 14 formed in the workpiece W, and a liquid resin (shaping member 21) containing sharpening abrasive grains is filled into the cutting groove 14 from the tip of the nozzle 41. At this time, in the above-described separation groove forming step, the groove width of the cutting groove 14 is formed wider than the discharge port of the nozzle 41, and the cutting groove 14 is easily filled with the liquid resin.

  The liquid resin is configured by containing GC (Green Carborundum) having a particle diameter finer than the abrasive grains of the grinding wheel 52 in a thermoplastic resin such as shift wax. The nozzle 41 is heated by a heater (not shown), and the hardening of the liquid resin in the nozzle 41 is suppressed. For this reason, the liquid resin is less likely to be clogged at the discharge port of the nozzle 41 when the liquid resin is filled. Further, since the cutting groove 14 is formed in the non-device region 17 that does not affect the device 18, the liquid resin adheres to the device 18 even when the liquid resin is filled in a position slightly deviated from the cutting groove 14. There is no. As described above, the region that does not affect the device 18 indicates a region that is not used as a device chip after the division on the workpiece W.

  Then, as shown in FIG. 3B, the liquid resin is filled from the groove bottom of the cutting groove 14 to a height H that does not reach the depth corresponding to the finished thickness T of the device 18. The height H of the liquid resin at this time is adjusted by the filling amount of the liquid resin by the nozzle 41, the feed speed of the chuck table 42, and the like. As the liquid resin is cooled and hardened, the sharpening member 21 is formed in the non-device region 17 of the workpiece W. As described above, the dressing member 21 for the grinding wheel 52 (see FIG. 5) is formed on the workpiece W, so that it is not necessary to provide a dresser board in the grinding device (not shown). Moreover, since the surface of the dressing member 21 is deeper than the finished thickness T, the dressing member 21 remains even when the workpiece W is thinned from the back surface 12 side to the finished thickness T. There is no.

  As shown in FIG. 4, a protective member sticking process is implemented after the sharpening member filling process. In the protective member attaching step, the protective member 22 is attached to the surface 11 of the workpiece W. By attaching the protective member 22 to the surface 11 of the workpiece W, the device 18 formed on the surface 11 of the workpiece W is protected by the protective member 22. The protective member 22 is not limited to the protective tape, and may be any member that can protect the device 18 of the workpiece W, and may be a rigid substrate such as a glass plate or a carbon plate. Further, the protective member attaching step may be performed manually by an operator or may be performed by a protective member attaching device (not shown).

  As shown in FIG. 5, a grinding process is implemented after a protection member sticking process. As shown in FIG. 5A, in the grinding process, the workpiece W is held on the chuck table 53 with the front surface 11 to which the protective member 22 is attached facing down, and above the back surface 12 of the workpiece W, A grinding means 5 is positioned. Then, the grinding wheel 51 of the grinding means 5 is brought close to the chuck table 53 while rotating around the Z axis, and the grinding wheel 52 provided on the surface of the grinding wheel 51 and the back surface 12 of the workpiece W are in rotational contact. Thus, the workpiece W is ground in the thickness direction (arrow direction) from the back surface 12 side.

  When the back surface 12 of the workpiece W is ground by a certain amount, the sharpening member 21 formed in the cutting groove 14 of the workpiece W is exposed from the back surface 12. For this reason, the grinding wheel 52 is sharpened by the sharpening abrasive grains contained in the sharpening member 21 during grinding. Thus, since the sharpening member 21 is exposed from the back surface 12 that is the surface to be ground, the grinding wheel 52 is sharpened during grinding of the workpiece W. For this reason, it is possible to perform grinding while maintaining the quality by preventing clogging and crushing of the grinding wheel 52 even on the workpiece W that is subjected to a relatively heavy grinding load such as LT, LN, gallium nitride, and the like. . Further, it is not necessary to interrupt the grinding process for sharpening the grinding wheel 52.

  Further, as shown in FIG. 5B, when the workpiece W is ground to the finished thickness T by the grinding means 5, the separation groove 13 appears from the back surface 12 side of the workpiece W, and the grinding by the grinding means 5 is performed. Is stopped. Thereby, the separation groove 13 along the planned dividing line 15 penetrates in the thickness direction of the workpiece W, and the workpiece W is divided into the individual devices 18. At this time, since the sharpening member 21 is removed from the workpiece W by the grinding wheel 52 before the workpiece W reaches the finished thickness T, the sharpening member 21 may remain on the workpiece W after the division. No.

  As described above, according to the method for dividing the workpiece W according to the first embodiment, the separation groove 13 along the division line 15 is formed on the surface 11 of the workpiece W, and the non-device region 17 is formed. A cutting groove 14 is formed. The cutting groove 14 is filled with a liquid resin containing the sharpening abrasive grains of the grinding wheel 52, and the sharpening member 21 is formed on the workpiece W by curing the liquid resin. Then, the workpiece W is ground from the back surface 12 side of the workpiece W, and the separation grooves 13 are exposed from the back surface 12 of the workpiece W, so that the workpiece W is divided into individual devices 18 along the scheduled division line 15. Is done. At this time, since the dressing member 21 is formed at a position deeper than the depth corresponding to the finished thickness T, the grinding is performed from the back surface 12 before the separation groove 13 during grinding from the back surface 12 side of the workpiece W. The member 21 is exposed and ground while the grinding wheel 52 is sharpened. Therefore, problems of the grinding wheel 52 such as clogging or crushing during grinding can be prevented, and the workpiece W can be processed with high quality. Further, it is not necessary to interrupt the grinding process in order to sharpen the grinding wheel 52.

  Next, a workpiece dividing method according to the second embodiment will be described with reference to FIGS. The second embodiment differs from the first embodiment only in that the liquid resin is filled with a part of the separation groove as a cutting groove. Therefore, the differences will be mainly described in detail. 6 to 10, the same components as those of the first embodiment will be described with the same reference numerals for the sake of convenience.

  As shown in FIG. 6, the surface 11 of the workpiece W is partitioned in a grid pattern by the division lines 15, a device region 19 in which the device 18 is formed, and a non-device region 17 surrounding the device region 19. It is divided into. Further, a separation groove 13 is formed along the planned division line 15 on the surface 11 of the workpiece W, and a cutting groove 14 is formed along the planned division line 15 located at the end. The cutting groove 14 is filled with a dressing member 21 (see FIG. 8) obtained by curing a liquid resin containing dressing abrasive grains, and the surface 11 of the workpiece W is a sheet for protecting the device 18. A protective member 22 is attached.

  The workpiece W shown in FIG. 6 is processed through the separation groove forming step, the sharpening member filling step, and the protective member attaching step, as in the workpiece W according to the first embodiment, and the grinding step is performed. As a result, the workpiece W is divided into the individual devices 18. Among these, in the separation groove forming step, the separation grooves 13 are formed along the remaining division lines 15 except for the division line 15 located at the end (see FIG. 7A). Further, in the separation groove forming step, the cutting groove 14 is formed deeper than the separation groove 13 along the planned division line 15 located at the end (see FIG. 7B). Other sharpening member filling step (see FIG. 8), protective member attaching step (see FIG. 9), and grinding step (see FIG. 10) are substantially the same as the respective steps according to the first embodiment.

  Hereinafter, with reference to FIG. 7 to FIG. 10, a method for dividing a workpiece according to the second embodiment will be described in detail. FIG. 7 shows an example of a separation groove forming process, FIG. 8 shows a sharpening member filling process, FIG. 9 shows a protective member attaching process, and FIG. 10 shows an example of a grinding process.

  As shown in FIG. 7, in the separation groove forming step, first, the separation groove 13 is formed. As shown in FIG. 7A, the workpiece W is held on the chuck table 32 of the cutting apparatus (not shown) with the device 18 facing upward, and the cutting blade 31 is positioned on the scheduled division line 15. The chuck table 32 is cut and fed relative to the cutting blade 31 in the X direction in a state where the workpiece W is cut by the cutting blade 31 while the cutting water is sprayed. Thereby, the separation groove 13 having a depth corresponding to the finished thickness T of the device 18 is formed. In this way, the separation grooves 13 are formed along the remaining division lines 15 in the X direction except for the division line 15 positioned at the extreme end of the workpiece W.

  Subsequently, in the separation groove forming step, the cutting groove 14 for filling the sharpening member 21 (see FIG. 8) is formed. As shown in FIG. 7B, the cutting blade 31 is positioned on the scheduled division line 15 located at the extreme end. The chuck table 32 is cut and fed relative to the cutting blade 31 in the X direction in a state where the workpiece W is cut by the cutting blade 31 while the cutting water is sprayed. As a result, a cutting groove 14 having a depth D that is deeper than the finished thickness T and does not penetrate the back surface 12 of the workpiece W is formed by the cutting blade 31. In this way, the cutting groove 14 is formed along the division end line 15 at the extreme end. After the separation groove 13 and the cutting groove 14 in the X direction are formed, the separation groove 13 and the cutting groove 14 are similarly formed in the Y direction.

  As shown in FIG. 8, after the separation groove forming step, a sharpening member filling step is performed. As shown in FIG. 8A, in the sharpening member filling step, the liquid resin (shaping member 21) containing sharpening abrasive grains is filled into the cutting groove 14 of the workpiece W held on the chuck table 42. Then, as shown in FIG. 8B, the liquid resin is filled from the groove bottom of the cutting groove 14 to a height H that does not reach a depth corresponding to the finished thickness T of the device 18. As the liquid resin is cooled and hardened, the sharpening member 21 is formed along the dividing line 15 at the extreme end. The cutting groove 14 in which the sharpening member 21 is formed also functions as the separation groove 13 of the splitting line 15 at the end.

  As shown in FIG. 9, a protective member sticking process is implemented after the sharpening member filling process. In the protective member attaching step, the protective member 22 is attached to the surface 11 of the workpiece W. By attaching the protective member 22 to the surface 11 of the workpiece W, the device 18 formed on the surface 11 of the workpiece W is protected by the protective member 22.

  As shown in FIG. 10, a grinding process is implemented after a protection member sticking process. As shown in FIG. 10A, in the grinding process, the workpiece W is held on the chuck table 53 with the front surface 11 with the protective member 22 attached down, and grinding is performed above the back surface 12 of the workpiece W. Means 5 are positioned. Then, the grinding wheel 51 of the grinding means 5 is brought close to the chuck table 53 while rotating around the Z axis, and the workpiece W is ground in the thickness direction (arrow direction) from the back surface 12 side. When the back surface 12 of the workpiece W is ground by a certain amount, the sharpening member 21 formed in the cutting groove 14 of the workpiece W is exposed from the back surface 12. For this reason, the grinding wheel 52 is sharpened by the sharpening abrasive grains contained in the sharpening member 21 during grinding.

  Further, as shown in FIG. 10B, the workpiece W is ground to the finished thickness T by the grinding means 5. At this time, the setting member 21 is removed from the workpiece W by the grinding wheel 52 before the workpiece W reaches the finished thickness T. When the sharpening member 21 is removed, the cutting groove 14 also functions as the separation groove 13. For this reason, the separation groove 13 and the cutting groove 14 are exposed from the back surface 12 side of the workpiece W, and the workpiece W is divided into individual devices 18.

  As described above, also in the method for dividing the workpiece W according to the second embodiment, as in the first embodiment, the grinding wheel 52 such as clogging or clogging of the grinding wheel 52 during grinding is provided. Is prevented, and the workpiece W can be processed with high quality. Further, it is not necessary to interrupt the grinding process in order to sharpen the grinding wheel 52. Moreover, since the cutting groove 14 functions also as the separation groove 13 of the division | segmentation scheduled line 15 of the endmost, the cutting groove 14 can be combined with the separation groove 13, and work man-hour is reduced rather than 1st Embodiment. It is possible.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above-described embodiment, the cutting grooves 14 are configured to be linearly formed in the X direction and the Y direction, but are not limited to this configuration. The cutting groove 14 may be formed in any way as long as it is formed deeper than the depth corresponding to the finished thickness T and does not penetrate the back surface 12 of the workpiece W.

  In the above-described embodiment, the thermoplastic resin is used as the liquid resin. However, the present invention is not limited to this configuration. The liquid resin may be any material that cures after being filled in the workpiece, and may be composed of, for example, a thermosetting resin or an ultraviolet curable resin.

  In the embodiment described above, the liquid resin (shaping member 21) is filled from the bottom of the cutting groove 14 to a height H that does not reach the depth corresponding to the finished thickness T of the device 18. The configuration is not limited to this. The liquid resin (shaping member 21) may be filled up to a height that reaches the finished thickness T.

  As described above, the present invention has an effect of preventing clogging or crushing of a grinding wheel during grinding and performing processing with high quality in the prior dicing, and in particular, LT, LN, The present invention is useful for a method of dividing a workpiece, such as gallium nitride, which divides a workpiece that is relatively hard to grind into individual devices.

DESCRIPTION OF SYMBOLS 11 Workpiece surface 12 Workpiece back surface 13 Separation groove 14 Cutting groove 15 Divided line 16 Notch 17 Non-device area 18 Device 19 Device area 21 Sharpening member 22 Protection member 31 Cutting blade 41 Nozzle 51 Grinding wheel 52 Grinding wheel W Workpiece T Finished thickness H Filling height of sharpening member D Depth of cutting groove

Claims (2)

A workpiece dividing method for dividing a workpiece formed by dividing a plurality of devices on a surface by a plurality of scheduled division lines into individual devices,
A separation groove forming step of forming a separation groove having a depth corresponding to the finished thickness of the device along a planned division line on the surface of the workpiece, and a protective member on the surface of the workpiece on which the separation groove is formed Protective member attaching process for attaching, and separating the work piece into individual devices by grinding the back surface of the work piece with a grinding wheel to expose the separation groove formed on the front face. And at least a grinding process to
In the separation groove forming step, a cutting groove is formed in a region that does not affect the device at a depth that is deeper than the depth corresponding to the finished thickness and does not penetrate the back surface of the workpiece,
After carrying out the separation groove forming step and before carrying out the protective member attaching step, a grinding wheel is inserted into a groove having a depth deeper than the depth corresponding to the finished thickness and not penetrating the back surface of the workpiece. And a dressing member filling step of filling and curing a liquid resin containing the sharpening abrasive grains.   2. The method for dividing a workpiece according to claim 1, wherein in the sharpening member filling step, the liquid resin is filled from the groove bottom to a position that does not reach a depth corresponding to the finished thickness.

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