JP2015037129A - Heat sink holding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink holding device which has improved workability when fixing a heat sink to a substrate mounted with a heating component.SOLUTION: A heat sink holding apparatus comprises: a heat sink H for dissipating heat generated by a semiconductor device (heating component) D mounted on a surface of a substrate B; a heat sink spacer 1 for holding the heat sink H in such a state that it is brought into contact with the semiconductor device D from the substrate B surface side; and a coil spring (elastic material) 2 for applying elastic force to the heat sink H toward the semiconductor device D. The heat sink spacer 1 has: a holding part 13 for supporting and holding the heat sink H; and a fixed part 14 fitted into a fixing hole 201 on the substrate B so as to be fixed to the substrate B. When the fixed part 14 is not fitted into the fixing hole 201, a contact surface of the heat sink H is spaced apart from a contact surface of the semiconductor device D, whereas when the fixed part 14 is fitted into the fixing hole 201, the contact surface of the heat sink H is brought into contact with the contact surface of the semiconductor device D by means of the elastic force of the coil spring 2.

Description

  The present invention relates to a heat sink holding device for cooling a heat generating component mounted on a substrate, and more particularly to a heat sink holding device with improved workability when a heat sink is attached to and detached from a substrate.

  A heat sink is disposed on the substrate to cool a heat generating component mounted on the substrate, such as a semiconductor device or other electronic component, and the heat sink is held on the substrate in contact with the heat generating component. ing. In Patent Document 1, a heat sink is placed on a semiconductor device mounted on a substrate, screws with coil springs inserted through holding holes provided at a plurality of locations of the heat sink, and the screws are coupled to the substrate to thereby attach the heat sink. A configuration is adopted in which the substrate is held in contact with the semiconductor device. In Patent Document 2, a cradle is attached to a plurality of locations on a board on which an electronic component is mounted, and a holding hole provided in a heat sink placed on the electronic component is fitted into the cradle, and then a coil spring is mounted thereon. The structure which hold | maintains a heat sink is taken by fastening to the receiving stand by which the fastening member which inserted was inserted.

Japanese Patent Application Laid-Open No. 2004-235481 JP2011-228512A

  In the technique of Patent Document 1, in order to hold the heat sink, it is necessary to fasten the tip of the screw inserted into the holding hole provided in the heat sink to the fixing hole provided in the substrate. At this time, since the operator's viewpoint is above the heat sink, the tip of the screw becomes a blind spot due to the heat sink, and it is difficult to position the screw with respect to the fixing hole of the substrate, which causes a decrease in workability. In particular, when a highly thermoconductive adhesive is disposed on the upper surface of the semiconductor device and is in close contact with the lower surface of the heat sink, the heat sink adheres to the upper surface of the semiconductor device with the adhesive when the screw is not positioned. It is necessary to carry out correction work for that.

  In the technique of Patent Document 2, since the holding hole of the heat sink is fitted to the cradle provided on the substrate, the positioning of the heat sink is improved compared to Patent Document 1. However, in Patent Document 2, there are a step of mounting a cradle on a substrate, a step of positioning a heat sink with respect to the cradle and fitting a holding hole, and a step of fastening a fastening member to the cradle. This is necessary, and the number of processes increases and workability decreases. Further, since a cradle is required in addition to the coil spring and the fastening member, the number of parts is increased, which is disadvantageous in terms of cost.

  Furthermore, since both Patent Documents 1 and 2 fasten a screw or a fastening member to a substrate or a cradle by a screw mechanism, it is necessary to rotate the screw or the fastening member at the time of fastening. It takes time for the rolling work, which is a factor of reducing workability.

  The objective of this invention is providing the heat sink holding | maintenance apparatus which improved the workability | operativity at the time of fixing a heat sink to a board | substrate.

  The present invention relates to a heat generating component mounted on a surface of a substrate, a heat sink for dissipating heat generated by the heat generating component, and a heat sink that holds the heat sink in contact with the heat generating component from the surface side of the substrate A spacer and an elastic material that is supported by the heat sink spacer and applies an elastic force to the heat sink in a direction toward the heat generating component. In addition, the heat sink spacer has a holding portion that supports and holds the heat sink, and a fixing portion that fits into a fixing hole provided in the substrate and is fixed to the substrate, and holds and fixes the heat sink in the holding portion. When the part does not fit into the fixing hole, the contact surface of the heat sink is separated from the contact surface of the heat generating component, and when the fixing part fits into the fixing hole, the contact surface of the heat sink becomes elastic. It is the structure contact | abutted by the contact surface of a heat-emitting component with the elastic force of.

  That is, the length of the heat sink spacer from the surface of the substrate to the contact surface of the heat sink when the fixing portion is in contact with the surface of the substrate is larger than the height dimension of the heat generating component from the surface of the substrate. The length from the surface of the substrate to the contact surface of the heat sink when the portion is fitted in the fixing hole is smaller than the height of the heat-generating component from the substrate surface.

  In the present invention, it is preferable that the heat sink spacer has a configuration in which the fixing portion can be attached to and detached from the fixing hole when operated from the surface side of the substrate.

According to the present invention, until the heat sink spacer is fixed to the substrate, the contact surface of the heat sink held by the holding portion does not contact the upper surface of the semiconductor device as the heat generating component. The position can be determined by arbitrarily moving. At this time, since the positioning can be performed by sensing that the fixing portion is pre-fitted into the fixing hole, the positioning is easily performed only by the touch of the operator without visually recognizing the fixing hole or the fixing portion of the substrate. be able to. After positioning, the heat sink is brought into contact with the contact surface of the heat-generating component by fitting the fixed portion of the heat sink spacer to the fixed portion, and a favorable heat radiation effect can be expected by keeping the close state with the elastic material. By operating the heat sink spacer from the front surface side of the substrate to engage and release the fixed hole in the fixing portion, the heat sink can be attached and detached only from the front surface side of the substrate.

1 is a front sectional view of a heat sink holding device according to a first embodiment of the present invention. The disassembled perspective view of the heat sink holding | maintenance apparatus of FIG. FIG. 3 is an enlarged exploded perspective view of a heat sink spacer according to the first embodiment. 1 of front sectional drawing which shows the assembly procedure of a heat sink holding | maintenance apparatus. 2 of front sectional drawing which shows the assembly procedure of a heat sink holding | maintenance apparatus. 3 of front sectional drawing which shows the assembly procedure of a heat sink holding | maintenance apparatus. 4 of front sectional drawing which shows the assembly procedure of a heat sink holding | maintenance apparatus. FIG. 6 is a perspective view of a heat sink spacer according to the second embodiment. Sectional drawing in the position which follows the aa and bb line in the assembly state of the heat sink of Embodiment 2. FIG. FIG. 6 is a perspective view of a heat sink spacer according to a third embodiment. The expanded perspective view of the fixing | fixed part of the heat sink of Embodiment 3, and sectional drawing in alignment with the cc line in an assembly state.

(Embodiment 1)
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front sectional view of an embodiment in which the present invention is configured as a heat sink holding device of a semiconductor device, and FIG. 2 is an exploded perspective view thereof. In these figures, a semiconductor device D packaged in a rectangular flat shape is mounted on the surface of a substrate B, and two fixing holes 201 are opened in the substrate B at positions where the semiconductor device D is sandwiched left and right. Yes. A heat sink H is placed on the upper surface of the semiconductor device D. In the following description, the vertical direction is based on FIG. The sheet sink H includes a main surface portion 100 having a rectangular plate shape made of aluminum or other metal having high thermal conductivity, and a plurality of standing fin-shaped cooling fins 102 are provided in a wide area on the upper surface of the main surface portion 100. It is integrally formed. The upper surface of the semiconductor device D is coated with a highly heat conductive adhesive C having a high thermal conductivity, and the lower surface of the main surface portion 100 of the heat sink H is brought into close contact with the upper surface of the semiconductor device D by the adhesive C. Heat transfer between the two is enhanced. The high heat transfer adhesive C may be a high heat transfer adhesive sheet, and the following is referred to as a high heat transfer adhesive or the like.

  In addition, a plurality of holding holes 101 are opened in the main surface portion 100 of the heat sink H in a region where the cooling fins 102 are not formed and in a region located around the semiconductor device D. Here, two holding holes 101 are opened at two positions on the main surface portion 100 of the heat sink H, that is, at positions where the semiconductor device D is sandwiched between right and left. These two holding holes 101 are opposed to each other immediately above the two fixing holes 201 opened in the substrate B. Further, a heat sink spacer (hereinafter referred to as “H spacer”) 1 is fitted into the holding hole 101, and a lower end of the H spacer 1 is fitted into the fixing hole 201. Thus, the heat sink H is held on the substrate B. Here, both the holding hole 101 and the fixing hole 201 are circular holes, and the inner diameters of the holding hole 101 and the fixing hole 201 may be equal. In this embodiment, the inner diameter of the holding hole 101 is fixed. The diameter of the hole 201 is somewhat larger than the inner diameter.

  FIG. 3 is a partially exploded perspective view in which the H spacer 1 is enlarged. The H spacer 1 is formed by resin molding, and a generally cylindrical body 12 projects downward from the lower surface of the small-diameter disk-shaped head 11, and further downward from the lower surface of the body 12. The holding part 13 and the fixing part 14 protrude in a two-stage configuration. A pair of support pieces 12a are projected in a reverse arrow-shaped arrowhead shape at a position close to the head portion 11 on the trunk portion 12, and the support pieces 12a are used to support a coil spring 2 described later. . The holding portion 13 has a pair of holding pieces 13a protruding in an arrowhead shape on both sides of a stem 13b protruding straight downward from the lower surface of the body portion 12, and the holding pieces 13a are formed in the heat sink H. Used to hold Similarly, the fixing portion 14 has a pair of fixing pieces 14a protruding in a reverse arrow shape on both sides of a stem 14b protruding straight downward from the lower surface of the holding portion 13, and the fixing pieces 14a are It is fitted into the fixing hole 201 of the substrate B. Each of the pair of support pieces 12a, holding pieces 13a, and fixed pieces 14a is normally held at an outer diameter dimension larger than the outer diameter dimension of the body portion 12, but in the radial direction when subjected to an external force. The diameter is reduced by elastic deformation. In particular, when the holding piece 13a is reduced in the inner diameter direction, the outer diameter is reduced to be smaller than the inner diameter of the holding hole 101. Further, when the fixed piece 14a is reduced in diameter in the inner diameter direction, the outer diameter is reduced to be smaller than the inner diameter of the holding hole 101 and the fixed hole 201.

  In the H spacer 1, as shown in FIG. 1, the length (height) h1 from the upper end of the holding piece 13a to the lower end of the fixed piece 14a is the height h2 of the semiconductor device D, To be precise, when the semiconductor device D is mounted on the substrate B, it is designed to be larger than the height from the surface of the main surface portion 100 of the substrate B to the upper surface of the semiconductor device D. In this case, when the high heat transfer adhesive C or the like is disposed on the upper surface of the semiconductor device D, the height to the upper surface of the high heat transfer adhesive C or the like is larger. On the other hand, when the H spacer 1 is fixed to the substrate B, the length h3 from the surface of the substrate B to the upper end of the holding piece 13a is the height of the semiconductor device D (high heat transfer adhesive or the like). When C is included, the height is set to be smaller than h2).

  As shown in FIG. 3, the H spacer 1 is fitted with a coil spring 2 having a larger inner diameter than the outer diameter of the body 12. In this embodiment, the inner diameter dimension of the coil spring 2 is larger than the normal outer diameter dimension of the holding piece 13a and the fixed piece 14a, and smaller than the outer diameter dimension of the support piece 12a. The coil spring 2 is fitted from the lower end side of the H spacer 1 to the body 12 through the fixed piece 14a and the holding piece 13a. At this time, as shown in FIGS. 1 and 2, the upper end portion of the coil spring 2 is fitted to the body portion 12 while reducing the diameter of the support piece 12a, and after the fitting, the support piece 12a is elastically restored and expanded in diameter. The upper end of the coil spring 2 is supported by the support piece 12a. Accordingly, the coil spring 2 is held in a suspended state by the support piece 12 a around the body portion 12 of the H spacer 1.

  The operation of mounting the heat sink H on the substrate B using the H spacer 1 having this configuration will be described with reference to FIGS. 4A to 4D. In these drawings, only one of the two H spacers 1 is shown. As shown in FIGS. 4A and 4B, the H spacer 1 is fitted into the holding hole 101 of the heat sink H from the upper surface side of the heat sink H. At this time, the two H spacers 1 are fitted into the holding holes 101, respectively. By this insertion work, the fixing piece 14a of the H spacer 1 is inserted through the holding hole 101 while being reduced in diameter, and then the holding piece 13a is inserted through the holding hole 101 while being reduced in diameter. 4B, the holding piece 13a is elastically restored and expanded in diameter on the lower surface side of the heat sink H, the upper end portion of the holding piece 13a is engaged with the inner edge of the holding hole 101, and the holding piece 13a is engaged with the heat sink H. Support. At the same time, the upper end of the coil spring 2 is in contact with the lower surface of the head 11 of the H spacer 1 and the lower end of the coil spring 2 is in contact with the upper surface of the heat sink H. The heat sink H is held by the H spacer 1 while being elastically contacted with the upper end portion of the holding piece 13a by the elastic restoring force generated in the coil spring 2.

  Then, the heat sink H is placed on the substrate B. A semiconductor device D is mounted on the surface of the substrate B, and the heat sink H is placed at a position covering the semiconductor device D. When placed, the lower end of the H spacer 1, that is, the lower end of the fixed piece 14a is in contact with the surface of the substrate B. At this time, as shown in FIG. 1, the length h1 from the lower end portion of the fixing piece 14a to the upper end portion of the holding piece 13a, that is, the lower surface of the heat sink H is the height of the semiconductor device D (high heat transfer adhesive C or the like). 4), the lower surface of the heat sink H does not come into contact with the upper surface of the semiconductor device D, the highly heat-conductive adhesive C, or the like. When the heat sink H is appropriately moved on the substrate B in this state, the lower end portion of the H spacer 1 is slid on the surface of the substrate B, and the fixing spacer 201 provided in the substrate B at each moving position is provided with the H spacer 1. A state of entering. That is, in this embodiment, the fixing pieces 14a of the two H spacers 1 are pre-fitted into the corresponding fixing holes 201, respectively. As a result, each H spacer 1 is positioned with respect to the fixing hole 201. Therefore, the upper surface of the substrate B, in particular, the fixing hole 201 becomes a blind spot by the heat sink H, and the operator directly sees the fixing hole 201. Even if it cannot be performed, it is possible to appropriately position the heat sink H with respect to the substrate B.

  In this state, the operator presses the head of the H spacer 1. As a result, as shown in FIG. 4C, the fixing piece 14a at the lower end of the H spacer 1 is reduced in diameter and inserted through the fixing hole 201, and is expanded in diameter by elastic return on the back surface of the substrate B as shown in FIG. It is engaged with the inner edge of the fixing hole 201 to be in a fitted state. Since the H spacer 1 is fixed to the substrate B by this fitting, the heat sink H is held on the substrate B by the H spacer 1. At this time, as shown in FIG. 1, the length h3 between the upper end portion of the holding piece 13a of the H spacer 1 and the upper end portion of the fixed piece 14a is smaller than the height h2 of the semiconductor device D. It is brought into contact with the upper surface of the semiconductor device D or the upper surface of the highly heat conductive adhesive C or the like. In this abutted state, the upper end portion of the holding piece 13a is in a state of being separated downward from the lower surface of the heat sink H. Therefore, the elastic force of the coil spring 2 acts as a force that makes the heat sink H elastically contact the upper surface of the semiconductor device D. Is done. Thereby, the lower surface of the heat sink H is brought into close contact with the upper surface of the semiconductor device D, here, the high heat transfer adhesive etc. C, and the heat generated in the semiconductor device D is transferred to the heat sink H via the high heat transfer adhesive etc. C. The semiconductor device D is cooled by transferring heat to the heat and dissipating heat therefrom.

  As described above, in this heat sink holding device, if the H spacer 1 supporting the coil spring 2 in advance is fitted in the holding hole 101 of the heat sink H, the H spacer 1 is positioned with respect to the fixing hole 201 of the substrate B. In addition, the heat sink H can be easily positioned with respect to the semiconductor device D. After positioning, the heat sink H can be mounted simply by pressing the head 11 of the H spacer 1 and fitting the H spacer 1 into the fixing hole 201 of the substrate B. Therefore, positioning of the heat sink H when the heat sink H is assembled to the substrate B is easy, and screw fixing work such as pivoting the H spacer 1 is not necessary when the heat sink H is fixed thereafter. This can be done and the workability is improved. Further, since the components for holding the heat sink H are only the H spacer 1 and the coil spring 2, it can be constructed at low cost.

(Embodiment 2)
In the first embodiment, the fixing piece 14a of the H spacer 1 that fits into the fixing hole 201 of the substrate B is a reverse-shaped arrowhead shape that can be elastically deformed in the radial direction. In order to remove the H spacer 1 from the substrate B, it is necessary to reduce the diameter of the fixing piece 14a from the lower surface side of the substrate B and release the engagement with the fixing hole 201. Therefore, the H spacer of the second embodiment enables the substrate B to be detached from the fixing hole by rotating the H spacer by a small angle from the upper surface side of the substrate B, that is, from the upper surface side of the heat sink H. FIG. 5 is a perspective view of the H spacer 1 </ b> A according to the second embodiment, and parts equivalent to those in the first embodiment are denoted by the same reference numerals. This H spacer 1 </ b> A has a somewhat smaller diameter cylindrical shaft 15 extending as a fixed portion below the body portion 12 from the holding portion 13, and has a diameter for constituting a fixed portion on the circumferential surface of the lower end of the cylindrical shaft 15. A pair of short rods 15a projecting in the required direction toward the direction are formed. A click knob 13c is formed on the circumferential surface of the body portion 12 located immediately above the holding portion 13 and protrudes with a very short dimension in a direction perpendicular to the pair of short rods 15a. Yes. Here, two click knobs 13c are formed in the diameter direction.

  Correspondingly, the holding hole 101A opened in the heat sink H is based on a circular shape through which the body portion 12 can be inserted, and the shape direction in which the short rod 15a can be inserted into two positions in the diameter direction of the circular hole. The groove 103 is formed. The fixing hole 201A opened in the substrate B is based on a circle through which the cylindrical shaft 15 can be inserted, and the short rod 15a of the fixing portion 15 can be inserted into two places in the diameter direction of the circle serving as the reference. It is formed in a planar shape in which a radial groove 202 is formed.

  In the H spacer 1A of the second embodiment, the heat sink H can be held on the substrate B in exactly the same manner as the H spacer 1 of the first embodiment. However, in the second embodiment, when the H spacer 1A is inserted through the holding hole 101A of the heat sink H, an operation for adjusting the position around the axis is performed so that the short rod 15a is inserted through the groove 103 of the holding hole 101A. When the H spacer 1A is pushed in after adjusting this position, the holding piece 13a is inserted through the holding hole 101A, and the upper edge of the holding piece 13a is in contact with the lower surface of the heat sink H. The heat sink H can be held by 1A. Further, by placing the fixing portion 15 at the lower end of the H spacer 1A on the substrate B, the heat sink H can be held in a state where the heat sink H and the semiconductor device D (not shown) are kept apart, and at the same time, the heat sink By moving H on the substrate B, the heat sink H can be positioned with respect to the substrate B, that is, the H spacer 1A can be positioned with respect to the fixing hole 201A. Needless to say, the lower surface of the heat sink H is separated from the upper surface of the semiconductor device D during this positioning. After the positioning, the H spacer 1A is pressed down to fit the fixing portion 15 into the fixing hole 201A. At this time, an operation of adjusting the position around the axis is performed so that the short rod 15a passes through the groove 202 of the fixing hole 201A. Further, after the short rod 15a is inserted through the fixing hole 201A, the H spacer 1A is rotated about 90 degrees as shown in FIG. 6B, and the short rod 15a is inserted into the fixing hole 201A on the back surface of the substrate B. Work to engage the inner edge. Accordingly, the H spacer 1A is fixed to the substrate B, and the heat sink H can be held on the substrate by the H spacer 1A. Since the pivoting operation of the H spacer 1A in this attachment work may be about 90 degrees, the work is not particularly complicated, and the work can be easily performed as a whole.

  In a state where the heat sink H is held on the substrate B, the heat sink H is elastically contacted with the upper surface of the semiconductor device D by the elastic force of the coil spring 2 as in the first embodiment, and the heat dissipation effect is enhanced. Further, since the short rod 15a is engaged with the inner edge of the fixing hole 201A on the lower surface of the substrate B, the H spacer 1A holds the heat sink H on the substrate B without dropping off from the substrate B. Can do. At this time, as shown in FIG. 6A, since the click knob 13c of the holding portion 13 engages with the groove 103 of the holding hole 101A, the operator can change the axis rotation position of the H spacer 1A by the click feeling at this time. The short rod 15a can be reliably set at a position orthogonal to the groove 202 of the fixing hole 201A. Further, the engagement of the click knob 13c and the groove 103 of the holding hole 101A suppresses the axial rotation of the H spacer 1A, and the H spacer 1A is not rotated even by some external force, and the short rod 15a is fixed. Release from engagement with the hole 101A is prevented.

  When the heat sink H is removed from the substrate B, the short rod 15a is moved into the groove 202 of the fixing hole 201A by picking the head 11 of the H spacer 1A and rotating the click knob 13c to the position where it is removed from the groove 103 of the holding hole 101A. The fixing portion 15 of the H spacer 1A can be pulled out from the fixing hole 201A, and the heat sink H can be detached from the substrate B. That is, the H spacer 1A and the heat sink H can be removed from the substrate B only by an operation on the upper surface side of the substrate B, which is effective for reuse.

(Embodiment 3)
In the second embodiment, the holding hole 101A and the fixing hole 201A that open to the heat sink H and the substrate B need to form grooves 103 and 202 into which the short rod 15a of the fixing portion 15 of the H spacer 1A can be inserted. Compared with the case where the simple circular holding hole 101 and the fixing hole 201 as shown in Fig. 1 are opened, the drilling operation is somewhat troublesome. In particular, in the case of using the existing circular holding hole 101 as in the first embodiment as the holding hole of the heat sink H, it is necessary to rework the holding hole. In the third embodiment, the H spacer can be attached and detached even when the holding hole is formed in a circular shape.

  FIG. 7 is a perspective view of the H spacer 1 </ b> B according to the third embodiment, and parts equivalent to those in the first embodiment are denoted by the same reference numerals. In the H spacer 1B of the third embodiment, a cylindrical shaft 16 protrudes downward from the holding portion 13 as a fixed portion, and the lower surface of the cylindrical shaft 16 has a required diameter and a flat or conical or convex spherical surface ( Here, a thick disk 16a having a flat upper surface is provided. The diameter of the disk 16a is equal to or smaller than the diameter of the body 12. Then, as shown in an enlarged view in FIG. 8 (a), two opposing circumferential positions located on the diameter of the disk 16a have a triangular fan shape toward the center over the entire thickness of the disk 16a. A notch 16b is formed. In addition, a fixed recess 16c in which the upper surface of the disk 16a is cut into the same triangular fan shape as the notch 16b with a required thickness is integrally formed at two places on the diameter orthogonal to the notch 16b. Is formed. The depth of the fixed recess 16c, that is, the thickness obtained by reducing the disk 16a from the upper surface is approximately the same as the thickness of the substrate B.

  As shown in FIG. 7, the holding hole 101 opened to the heat sink H is circular like the first embodiment, but has a shape that allows the disc 16a to the body 12 to be inserted. Further, the fixing hole 201B opened in the substrate B is based on a circle corresponding to the disk 16a, and is a triangular fan-shaped protrusion toward the center at two locations on the diameter of the circle serving as the reference. Part 203. The planar shape of the protrusion 203 is the same as the planar shape of the notch 16b formed in the disk 16a and the planar shape of the fixed recess 16c.

  In the third embodiment, similarly to the first embodiment, the heat sink H can be held by the H spacer 1B. That is, when the fixing portion 16 and the holding portion 13 of the H spacer 1B are inserted into the holding hole 101 of the heat sink H and the holding portion 13 is inserted, the holding piece 13a is elastically restored, and the heat sink is the same as in the first embodiment. Hold H. At this time, the heat sink H is separated from the upper surface of the semiconductor device D (not shown) by bringing the fixing portion 16 of the H spacer 1B into contact with the upper surface of the substrate B. As a result, the heat sink H can be positioned with respect to the substrate B, or the H spacer 1B can be positioned with respect to the fixing hole 201B. After this positioning is performed, the H spacer 1B is axially adjusted so that the notch 16b of the disk 16a corresponds to the protrusion 203 of the fixing hole 201B. Thereby, the disc 16a can be inserted through the fixing hole 201B, and is inserted into the lower surface side of the substrate B by pushing the H spacer 1B. Then, when the H spacer 1B is rotated approximately 90 degrees, the fixing recess 16c of the disk 16a is fitted into the protrusion 203 of the fixing hole 201B from the lower surface side of the substrate B as shown in FIG. The Since the upper surface of the disk 16a is elastically contacted with the lower surface of the substrate B from below by the elastic force of the coil spring 2, the engagement state between the fixed recess 16c and the projection 203 is maintained by this elastic contact force, and the H spacer 1B is The heat sink H can be held on the substrate B without dropping from B.

  When the heat sink H is removed from the substrate B, the head 11 of the H spacer 1B is pushed toward the substrate B to release the fitting between the fixed recess 16c and the projection 203, so that the H spacer 1B can be rotated. In this state, the H spacer 1B is rotated about 90 degrees. When the shaft 16 rotates and the notch 16b corresponds to the protrusion 203, the disk 16a can be pulled out above the substrate B through the fixing hole 201B, and the heat sink H can be removed from the substrate B. That is, the H spacer 1B and the heat sink H can be removed from the substrate B only by an operation on the upper surface side of the substrate B, which is effective for reuse.

  The present invention is not limited to the first, second, and third embodiments described above, and the shape and structure of the holding portion and the fixing portion of the H spacer can be appropriately changed. The holding part may be configured to support and hold the heat sink in a state where the elastic force of the coil spring is applied to the heat sink. The fixing part may be configured to fit the H spacer into the fixing hole of the substrate to be in a fixed state. In this case, it is preferable to configure so that the fixing portion can be attached to and detached from the fixing hole. On the other hand, the present invention requires that the lower surface of the heat sink does not come into contact with the upper surface of the semiconductor device when the lower end of the H spacer contacts the substrate while the H spacer holds the heat sink. In particular, when a high heat transfer adhesive or the like is formed on the upper surface of the semiconductor device, the lower surface of the heat sink should not be in contact with the high heat transfer adhesive or the like. For this reason, it is important to set the distance between the holding part and the fixed part in the vertical direction of the H spacer to an appropriate distance dimension corresponding to the height dimension of the semiconductor device.

  In the first, second, and third embodiments, adjustment of the elastic force of the coil spring is not particularly described. However, it corresponds to a difference in height of the semiconductor device, a difference in elastic force of the coil spring itself, and the like. The coil spring support position relative to the H spacer may be adjusted. For example, it is possible to adjust the elastic force that the coil spring applies to the heat sink by providing a plurality of step portions on the support piece and supporting the upper end portion of the coil spring at any of the plurality of step portions. it can. Thereby, the heat sink is brought into contact with the upper surface of the semiconductor device with an appropriate contact force, and preferable heat conduction is possible. When it is not necessary to adjust the elastic force of the coil spring, the coil spring may only be fitted to the H spacer, and in this case, it is not necessary to provide a support portion for the H spacer. Furthermore, as long as the heat sink can be brought into contact with the semiconductor device with an elastic force, another form of spring may be used instead of the coil spring. This spring may be constituted by an elastic piece integrally formed with a part of the H spacer.

  In the first, second, and third embodiments, the semiconductor device is exemplified as the heat generating component. However, the present invention is similarly applied to other electronic components, that is, heat sinks of electronic components that generate heat when driven. be able to. In this case, the upper surface of the heat generating component and the lower surface of the heat sink do not necessarily have to be flat surfaces, and any structure may be used as long as both are brought into close contact with each other by the elastic force and heat conduction from the heat generating component is enhanced.

  The present invention can be applied as a device for holding a heat sink for radiating heat-generating components such as a semiconductor device.

B Substrate H Heat sink D Semiconductor device (Heat generation component)
C High heat transfer adhesive, etc. 1, 1A, 1B Heat sink spacer (H spacer)
2 Coil spring (elastic material)
11 Head 12 Body 12a Supporting piece 13 Holding part 13a Holding piece 14 Fixing part 14a Fixing piece 15 Fixing part (Cylindrical axis)
15a Short rod 16 fixed part (cylinder axis)
16a disc 16b notch 16c fixing recess 101, 101A, 101B holding hole 201, 201A, 201B fixing hole

Claims (3)

  A heat generating component mounted on the surface of the substrate, a heat sink for dissipating heat generated by the heat generating component, and a heat sink spacer for holding the heat sink in contact with the heat generating component from the surface side of the substrate And an elastic material that is supported by the heat sink spacer and applies an elastic force to the heat sink in a direction toward the heat-generating component, the heat sink spacer supporting the heat sink, and a substrate. A fixing portion that fits into a fixing hole provided in the fixing hole and is fixed to the substrate, holds the heat sink in the holding portion, and the fixing portion does not fit in the fixing hole. The abutting surface of the heat sink is spaced apart from the abutting surface of the heat generating component, and when the fixing portion is fitted in the fixing hole, the abutting surface of the heat sink is Heat sink retention device, characterized in that the elastic force of the serial elastic member is configured to be in contact with the contact surface of the heat generating component.   The length of the heat sink spacer from the surface of the substrate to the contact surface of the heat sink when the fixed portion is in contact with the surface of the substrate is a height dimension of the heat generating component from the surface of the substrate. And the length from the surface of the substrate to the contact surface of the heat sink when the fixing portion is fitted in the fixing hole is smaller than the height dimension of the heat generating component from the surface of the substrate. The heat sink holding device according to claim 1. The heat sink holding device according to claim 1, wherein the heat sink spacer is configured so that the fixing portion can be attached to and detached from the fixing hole when operated from the front surface side of the substrate.

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