JP2017199756A - Cooling member, cooling device, electronic apparatus, and method of forming cooling member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the thickness of a device that includes a cooling member for cooling a heating component.SOLUTION: A cooling member 20 includes a substrate 21 thermally connected to a cooled object 27. In the substrate 21, a tilted receiving surface 21k is formed at a site that is a side surface when a thermal connection surface 21b thermally connected to the cooled object 27 is a bottom surface. The tilted receiving surface 21k tilts in a direction toward the thermal connection surface 21b, and receives a force from the side of a substrate 21 side, and applies the force, as a pressing force from the base 21 to the cooled object 27, to the substrate 21.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a technique for cooling a heat generating component.

  A heat generating component that generates heat that may cause malfunction or thermal damage of the electric circuit is cooled using a cooling member such as a heat sink in order to prevent malfunction or thermal damage of the electric circuit. FIG. 7 is a cross-sectional view illustrating an example of a mode in which a heat sink is attached to a heat-generating component. In the example of this figure, a heat generating component 42 is mounted on a circuit board 41 accommodated inside the case 40. The heat sink 43 is arranged in a state where it is thermally connected to the heat generating component 42 via the heat radiation grease 44, and is fixed to the case 40 together with the circuit board 41 by screws 45. In the example of FIG. 7, a coil spring 47 is inserted through the screw 45, and the coil spring 47 is disposed between the flange portion 46 of the screw 45 and the heat sink 43. The coil spring 47 is in a compressed state when the heat sink 43 is attached to the case 40 by the screw 45, and acts on the heat sink 43 with a biasing force in a direction of pressing against the circuit board 41.

  Note that Patent Document 1 discloses a configuration in which a heat sink is pressed against a component to be cooled using a leaf spring. Patent Document 2 discloses a configuration in which a component to be cooled, a cooling fin, and the like are integrally molded with resin.

JP-A-10-70222 JP 2014-183058 A

  By the way, when a heat-generating component and a heat sink are mounted on a device that is required to be thin, the thinning of the device may be hindered due to a structure in which the heat sink is attached to or pressed against the heat-generating component. For example, in the case of the configuration shown in FIG. 7, the screw 45 may protrude from the heat sink 43, and the protruding portion of the protruding screw 45 hinders the thinning of the device. In addition, when the heat sink is pressed against the heat-generating component by the leaf spring, the leaf spring must have a large elastic force in order to firmly press the heat sink against the heat-generating component. It becomes. This large leaf spring prevents the device from being thinned.

  The present invention has been devised to solve the above problems. That is, a main object of the present invention is to provide a technique for reducing the thickness of an apparatus provided with a cooling member for cooling a heat generating component.

In order to achieve the above object, the cooling member of the present invention is one aspect,
Having a substrate thermally connected to the object to be cooled;
The base body is inclined in a direction toward the heat connection surface at a portion that becomes a side surface when a heat connection surface that is thermally connected to the object to be cooled is a bottom surface, and receives a force from a side of the base body. An inclined receiving surface is formed that applies the force to the substrate as a pressing force from the substrate to the object to be cooled.

As one aspect of the cooling device of the present invention,
A cooling member of the present invention;
A pressing member that applies a force from the side of the base to the inclined receiving surface of the cooling member is provided.

In addition, the electronic device of the present invention is one aspect,
A heat generating component to be cooled;
A cooling member of the present invention;
A pressing member that applies a force from the side of the base to the inclined receiving surface of the cooling member is provided.

Furthermore, the method for forming the cooling member of the present invention includes, as one aspect,
When the heat connection surface in the base body having a heat connection surface thermally connected to the object to be cooled is a bottom surface,
An inclined receiving surface is formed which is inclined in a direction toward the heat connection surface and receives a force from the side of the substrate and applies the force to the substrate as a pressing force from the substrate to the object to be cooled.

  According to the present invention, it is possible to reduce the thickness of an apparatus including a cooling member that cools a heat-generating component.

It is typical sectional drawing explaining the structure of the electronic device provided with the cooling member of 1st Embodiment which concerns on this invention. FIG. 2 is a schematic plan view illustrating a configuration in which the configuration of the electronic device illustrated in FIG. 1 is viewed from the upper side in FIG. 1. It is typical sectional drawing explaining the structure of the cooling member of 2nd Embodiment which concerns on this invention. It is typical sectional drawing explaining the example of 1 structure of a cooling device provided with the cooling member of 2nd Embodiment. It is typical sectional drawing explaining the example of 1 structure of an electronic device provided with the cooling member of 2nd Embodiment. It is a figure explaining other embodiment concerning the present invention. It is typical sectional drawing explaining the example of 1 structure of an electronic device provided with a cooling member.

  Embodiments according to the present invention will be described below with reference to the drawings.

<First Embodiment>
FIG. 1 is a cross-sectional view schematically showing a configuration of an electronic apparatus including the cooling member according to the first embodiment of the present invention. FIG. 2 is a schematic plan view of the configuration of FIG. 1 viewed from above in FIG. The electronic device 1 according to the first embodiment includes a circuit board 4 provided with a heat generating component 3, a case 5 that accommodates the circuit board 4, a heat sink 7 that is a cooling member that cools the heat generating component 3, and a screw 8. ing.

  In the electronic apparatus 1, the circuit board 4 on which the heat generating component 3 is mounted is accommodated in the internal space of the case 5 and is fixed to the case 5 with screws 14.

  The heat sink 7 includes a base body 10 and a plurality of fins 11 provided upright on the base body 10. The base 10 has a thermal connection surface 10b that is thermally connected to the heat-generating component 3 that is a cooling target. In the first embodiment, a heat radiation grease 13 is interposed between the heat connection surface 10 b of the base 10 and the heat generating component 3, and the heat radiation between the heat connection surface 10 b and the heat generation component 3 is provided by the heat radiation grease 13. A decrease in conductivity is suppressed.

  The heat of the heat generating component 3 is transmitted to the base body 10 from the heat connection surface 10 b through the heat radiation grease 13, and the heat transmitted to the base body 10 is mainly radiated from the fins 11 on the base body 10. Thus, the heat sink 7 dissipates the heat of the heat generating component 3 and cools the heat generating component 3.

  The base 10 of the heat sink 7 has a tapered surface 10s that is an inclined receiving surface at a portion that becomes a side surface when the thermal connection surface 10b is a bottom surface. In the first embodiment, the taper surface 10 s is formed on the upper edge of the side surface of the base body 10 over the entire circumference in the direction around the base body 10. The taper surface 10s is inclined in a direction toward the heat connection surface 10b, and receives a force from the side of the substrate, and acts on the substrate 10 as a pressing force from the substrate 10 to the heat generating component 3 to be cooled. It has a function to let you. The inclination angle of the tapered surface 10 s is designed in consideration of the pressing force that presses the heat sink 7 (base 10) against the heat generating component 3.

  That is, in the first embodiment, screw holes 16 having a through-hole shape penetrating from the outside of the case to the inside of the case are formed at a plurality of places on the case wall of the case 5 facing the tapered surface 10s with a space therebetween. Here, the shape of the base 10 of the heat sink 7 viewed from the upper side in FIG. 1 is a rectangular shape (square shape) as shown in FIG. Two screw holes 16 are formed in each of the case wall portions 5a, 5b, 5c, and 5d facing the rectangular four sides on the upper portion of the base body 10, respectively. In addition, the screw holes 16 formed in the case walls 5 a and 5 c facing each other are arranged at positions that are line-symmetric with respect to the center line of the base body 10. Similarly, the screw holes 16 formed in the case walls 5 b and 5 d facing each other are arranged at positions that are line-symmetric with respect to the center line of the base body 10. Further, the screw hole 16 is formed so that the central axis thereof is parallel to the heat connection surface 10 b of the base body 10.

  The screw 8 is fixed to the case 5 by being screwed into the screw hole 16 from the outside of the case 5. Further, the tip of the screw 8 screwed into the screw hole 16 abuts on the taper surface 10s of the base 10, and a pressing force corresponding to the screwing amount acts on the taper surface 10s. That is, the screw 8 functions as a pressing member that applies force to the tapered surface 10 s from the side of the base body 10. The pressing force received by the tapered surface 10 s from the screw 8 acts on the base 10 as a pressing force from the base 10 to the heat generating component 3. The magnitude of the pressing force from the base 10 to the heat generating component 3 can be adjusted by the screwing amount of the screw 8. For example, the screw 8 is tightened by a torque wrench.

  In addition, the relationship between the magnitude of the pressing force from the screw 8 to the tapered surface 10s and the magnitude of the pressing force from the base 10 to the heat generating component 3 due to the pressing force varies depending on the inclination angle of the tapered surface 10s. Thus, the inclination angle of the tapered surface 10 s is designed so that the pressing force from the screw 8 to the tapered surface 10 s can be efficiently applied to the base body 10 as a pressing force against the heat generating component 3.

  As described above, in the first embodiment, the screw 8 functions as a pressing member that presses the base 10 against the heat generating component 3. The case 5 (case wall) functions as a fixing member for fixing the screw 8 (pressing member) in addition to the function of housing the circuit board 4. Furthermore, the heat sink 7 (cooling member), the screw 8 (pressing member), and the case 5 (fixing member) constitute a cooling device that cools the heat-generating component 3 that is a cooling target.

  In the heat sink 7 of the first embodiment, by providing the base 10 with the tapered surface 10 s, a force from the side of the base 10 can be applied to the base 10 as a force for pressing the base 10 against the heat generating component 3. . Thereby, since the pressing member that presses the base 10 against the heat generating component 3 can be disposed on the side of the base 10, the heat sink 7 can suppress the electronic device 1 including the heat sink 7 from being raised. In other words, the heat sink 7 in the first embodiment can contribute to thinning of the electronic device 1.

  Moreover, in 1st Embodiment, the press member which acts on the base | substrate 10 with the pressing force is comprised by the screw 8, The said press member is a simple structure, This structure also contributes to thickness reduction of the electronic device 1. .

  Furthermore, the pressing member by the screw 8 can easily adjust the magnitude of the pressing force acting on the base 10 by the screwing amount. Thereby, the electronic device 1 of the first embodiment can press the heat sink 7 against the heat generating component 3 with an appropriate pressing force.

  Furthermore, since the taper surface 10s is formed over the entire circumference of the upper edge portion on the side surface of the base body 10, the screw 8 is tapered even if the position of the screw 8 is shifted laterally from the design position. 10s can be pressed. For this reason, the configuration in which the tapered surface 10 s is formed over the entire periphery of the upper edge of the side surface of the base body 10 can reduce the trouble of adjusting the arrangement position of the screw 8 with high accuracy.

Second Embodiment
A second embodiment according to the present invention will be described.

  FIG. 3 is a schematic cross-sectional view illustrating a cooling member according to a second embodiment of the present invention. FIG. 4 is a schematic cross-sectional view illustrating a configuration example of a cooling device including the cooling member of FIG. FIG. 5 is a schematic cross-sectional view illustrating a configuration example of an electronic device including the cooling member of FIG.

  The cooling member 20 of the second embodiment includes a base body 21 that is thermally connected to a cooling target (for example, the heat generating component 27 in FIG. 5). The base 21 has a heat connection surface 21b that is thermally connected to the object to be cooled. Furthermore, the base body 21 has an inclined receiving surface 21k at a portion that becomes a side surface when the heat connection surface 21b is a bottom surface. The inclined receiving surface 21k is inclined in the direction toward the heat connection surface 21b, and receives a force from the side of the base 21 so that the force acts on the base 21 as a pressing force from the base 21 to the cooling target. Is formed.

  The cooling member 20 having such a configuration constitutes a cooling device 23 together with the pressing member 24, as shown in FIG. The pressing member 24 has a configuration in which a force F from the side of the base 21 is applied to the inclined receiving surface 21 k of the base 21 in the cooling member 20.

  Moreover, the cooling member 20 comprises the electronic device 26 with the press member 24 and the heat-emitting component 27, as represented by FIG. The heat generating component 27 is a cooling target that is cooled by the cooling member 20.

  Since the cooling member 20 according to the second embodiment includes the inclined receiving surface 21k, the cooling member 20 has a configuration that does not require the pressing member 24 to be disposed in the raising direction of the electronic device 26 including the cooling member 20. The bulk of the electronic device 26 caused by the member can be suppressed. That is, the cooling member 20 of the second embodiment can reduce the thickness of the electronic device 26.

<Other embodiments>
The present invention is not limited to the first and second embodiments, and can take various forms. For example, in the first embodiment, the tapered surface 10 s is formed over the entire circumference of the upper edge portion on the side surface of the base body 10. Instead, as shown in the plan view of FIG. 6, a tapered surface 10 s as an inclined receiving surface may be partially formed on the upper edge portion of the side surface of the base body 10.

  In the first embodiment, the heat dissipation grease 13 is interposed between the base 10 of the heat sink 7 and the heat generating component 3. However, instead of the heat dissipation grease 13, a heat dissipation sheet may be interposed. Good. Furthermore, the base 10 and the heat generating component 3 may be in direct contact with each other. Furthermore, in the first embodiment, the base body 10 has a quadrangular shape as viewed from above, but the shape of the base body 10 is not particularly limited.

  Furthermore, in the first embodiment, the pressing member is configured to have a screw 8. Instead of this, the pressing member may be configured to apply a pressing force to the tapered surface (inclined receiving surface) 10s with a configuration other than the screw. Further, the number and arrangement position of the action points at which the pressing member (screw 8) applies the pressing force to the base body 10 are appropriately set in consideration of the pressing force from the base body 10 to the heat generating component 3.

  Furthermore, in the first embodiment and the like, the tapered surface 10 s that is an inclined receiving surface is formed on the upper edge of the side surface of the base 10. Instead, for example, when the substrate 10 is thick, a recess may be provided on the side surface of the substrate 10 and an inclined surface functioning as an inclined receiving surface may be formed on the inner wall surface of the recess.

DESCRIPTION OF SYMBOLS 1,26 Electronic device 3,27 Heat-generating component 5 Case 7 Heat sink 8 Screw 10, 21 Base 16 Screw hole 20 Cooling member 23 Cooling device 24 Pressing member

Claims (7)

Having a substrate thermally connected to the object to be cooled;
The base body is inclined in a direction toward the heat connection surface at a portion that becomes a side surface when a heat connection surface that is thermally connected to the object to be cooled is a bottom surface, and receives a force from a side of the base body. A cooling member formed with an inclined receiving surface that applies the force to the base as a pressing force from the base to the object to be cooled.   The cooling member according to claim 1, wherein the inclined receiving surface is formed over the entire circumference in a direction of circling the side surface of the base body at an upper edge portion of the side surface. The cooling member according to claim 1 or 2,
A cooling device comprising: a pressing member that applies a force from a side of the base to an inclined receiving surface of the cooling member. A fixing member for fixing the pressing member;
The pressing member is fixed to the fixing member by being screwed into a screw hole formed in the fixing member, and is displaced in an advancing / retreating direction with respect to the inclined receiving surface and acting on the inclined receiving surface. The cooling device according to claim 3, wherein the cooling device is a screw capable of changing the magnitude of pressure. A heat generating component to be cooled;
The cooling member according to claim 1 or 2,
An electronic device comprising: a pressing member that applies a force from a side of the base to an inclined receiving surface of the cooling member. A case for accommodating the heat generating component;
The case wall of the case facing the inclined receiving surface in the cooling member functions as a fixing member that fixes the pressing member;
The pressing member is fixed to the case wall by being screwed into a screw hole formed in the case wall as the fixing member, and is displaced in a forward / backward direction with respect to the inclined receiving surface. The electronic device according to claim 5, wherein the electronic device is configured by a screw capable of changing a magnitude of a pressing force acting on the screw. When the heat connection surface in the base body having a heat connection surface thermally connected to the object to be cooled is a bottom surface,
A cooling member that is inclined in a direction toward the heat connection surface and that forms a tilt receiving surface that receives a force from a side of the substrate and applies the force to the substrate as a pressing force from the substrate to the cooling target. Forming method.

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