JP2017199756A - Cooling member, cooling device, electronic apparatus, and method of forming cooling member - Google Patents

Cooling member, cooling device, electronic apparatus, and method of forming cooling member Download PDF

Info

Publication number
JP2017199756A
JP2017199756A JP2016088280A JP2016088280A JP2017199756A JP 2017199756 A JP2017199756 A JP 2017199756A JP 2016088280 A JP2016088280 A JP 2016088280A JP 2016088280 A JP2016088280 A JP 2016088280A JP 2017199756 A JP2017199756 A JP 2017199756A
Authority
JP
Japan
Prior art keywords
cooling
force
heat
base
cooling member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016088280A
Other languages
Japanese (ja)
Other versions
JP6769087B2 (en
Inventor
山田 靖
Yasushi Yamada
靖 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2016088280A priority Critical patent/JP6769087B2/en
Publication of JP2017199756A publication Critical patent/JP2017199756A/en
Application granted granted Critical
Publication of JP6769087B2 publication Critical patent/JP6769087B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce the thickness of a device that includes a cooling member for cooling a heating component.SOLUTION: A cooling member 20 includes a substrate 21 thermally connected to a cooled object 27. In the substrate 21, a tilted receiving surface 21k is formed at a site that is a side surface when a thermal connection surface 21b thermally connected to the cooled object 27 is a bottom surface. The tilted receiving surface 21k tilts in a direction toward the thermal connection surface 21b, and receives a force from the side of a substrate 21 side, and applies the force, as a pressing force from the base 21 to the cooled object 27, to the substrate 21.SELECTED DRAWING: Figure 5

Description

本発明は、発熱部品を冷却する技術に関する。   The present invention relates to a technique for cooling a heat generating component.

電気回路の誤動作や熱損傷を招く虞がある熱を発する発熱部品は、電気回路の誤動作や熱損傷を防止するために、ヒートシンク等の冷却部材を利用して冷却される。図7は、発熱部品にヒートシンクを装着した態様の一例を表す断面図である。この図の例では、ケース40の内部に収容された回路基板41に発熱部品42が搭載されている。ヒートシンク43は、その発熱部品42に放熱グリス44を介して熱接続された状態で配置され、ねじ45によって、回路基板41と共にケース40に固定されている。なお、図7の例では、ねじ45にはコイルばね47が挿通されており、ねじ45の鍔部46とヒートシンク43との間にコイルばね47が配設されている。コイルばね47は、ねじ45によりヒートシンク43がケース40に取り付けられている状態において圧縮状態となり、回路基板41に押し付ける方向の付勢力をヒートシンク43に作用する。   A heat generating component that generates heat that may cause malfunction or thermal damage of the electric circuit is cooled using a cooling member such as a heat sink in order to prevent malfunction or thermal damage of the electric circuit. FIG. 7 is a cross-sectional view illustrating an example of a mode in which a heat sink is attached to a heat-generating component. In the example of this figure, a heat generating component 42 is mounted on a circuit board 41 accommodated inside the case 40. The heat sink 43 is arranged in a state where it is thermally connected to the heat generating component 42 via the heat radiation grease 44, and is fixed to the case 40 together with the circuit board 41 by screws 45. In the example of FIG. 7, a coil spring 47 is inserted through the screw 45, and the coil spring 47 is disposed between the flange portion 46 of the screw 45 and the heat sink 43. The coil spring 47 is in a compressed state when the heat sink 43 is attached to the case 40 by the screw 45, and acts on the heat sink 43 with a biasing force in a direction of pressing against the circuit board 41.

なお、特許文献1には、ヒートシンクを板バネを利用して冷却対象の部品に押し付ける構成が示されている。また、特許文献2には、冷却対象の部品と冷却フィン等を一体的に樹脂によりモールドする構成が示されている。   Note that Patent Document 1 discloses a configuration in which a heat sink is pressed against a component to be cooled using a leaf spring. Patent Document 2 discloses a configuration in which a component to be cooled, a cooling fin, and the like are integrally molded with resin.

特開平10−70222号公報JP-A-10-70222 特開2014−183058号公報JP 2014-183058 A

ところで、薄型化が要求されている装置に、発熱部品およびヒートシンクを搭載する場合に、ヒートシンクを発熱部品に装着する、又は、押し付ける構造に起因して、装置の薄型化を妨げる場合がある。例えば、図7に表されるような構成の場合には、ねじ45がヒートシンク43よりも突出してしまう場合が有り、その突出しているねじ45の突出部分が、装置の薄型化を妨げる。また、板バネによってヒートシンクを発熱部品に押し付ける構成を持つ場合には、ヒートシンクを発熱部品に強固に押し付けるために板バネは大きな弾性力を持たなければならず、このために、板バネは大きなものとなる。この大きな板バネに起因して装置の薄型化が妨げられる。   By the way, when a heat-generating component and a heat sink are mounted on a device that is required to be thin, the thinning of the device may be hindered due to a structure in which the heat sink is attached to or pressed against the heat-generating component. For example, in the case of the configuration shown in FIG. 7, the screw 45 may protrude from the heat sink 43, and the protruding portion of the protruding screw 45 hinders the thinning of the device. In addition, when the heat sink is pressed against the heat-generating component by the leaf spring, the leaf spring must have a large elastic force in order to firmly press the heat sink against the heat-generating component. It becomes. This large leaf spring prevents the device from being thinned.

本発明は上記課題を解決するために考え出された。すなわち、本発明の主な目的は、発熱部品を冷却する冷却部材を備えた装置の薄型化を図る技術を提供することにある。   The present invention has been devised to solve the above problems. That is, a main object of the present invention is to provide a technique for reducing the thickness of an apparatus provided with a cooling member for cooling a heat generating component.

上記目的を達成するために、本発明の冷却部材は、様相の一つとして、
冷却対象に熱接続する基体を有し、
前記基体には、前記冷却対象に熱接続する熱接続面を底面とした場合に側面となる部位に、前記熱接続面に向かう方向に傾き、かつ、前記基体の側方側からの力を受け当該力を前記基体から前記冷却対象への押し付け力として前記基体に作用させる傾斜受け面が形成されている。
In order to achieve the above object, the cooling member of the present invention is one aspect,
Having a substrate thermally connected to the object to be cooled;
The base body is inclined in a direction toward the heat connection surface at a portion that becomes a side surface when a heat connection surface that is thermally connected to the object to be cooled is a bottom surface, and receives a force from a side of the base body. An inclined receiving surface is formed that applies the force to the substrate as a pressing force from the substrate to the object to be cooled.

本発明の冷却装置は、様相の一つとして、
本発明の冷却部材と、
前記冷却部材における傾斜受け面に、前記基体の側方側からの力を作用する押圧部材と
を備える。
As one aspect of the cooling device of the present invention,
A cooling member of the present invention;
A pressing member that applies a force from the side of the base to the inclined receiving surface of the cooling member is provided.

また、本発明の電子機器は、様相の一つとして、
冷却対象である発熱部品と、
本発明の冷却部材と、
前記冷却部材における傾斜受け面に、前記基体の側方側からの力を作用する押圧部材と
を備える。
In addition, the electronic device of the present invention is one aspect,
A heat generating component to be cooled;
A cooling member of the present invention;
A pressing member that applies a force from the side of the base to the inclined receiving surface of the cooling member is provided.

さらに、本発明の冷却部材の形成方法は、様相の一つとして、
冷却対象に熱接続する熱接続面を有する基体における前記熱接続面を底面とした場合に側面となる部位に、
前記熱接続面に向かう方向に傾き、かつ、前記基体の側方側からの力を受け当該力を前記基体から前記冷却対象への押し付け力として前記基体に作用させる傾斜受け面を形成する。
Furthermore, the method for forming the cooling member of the present invention includes, as one aspect,
When the heat connection surface in the base body having a heat connection surface thermally connected to the object to be cooled is a bottom surface,
An inclined receiving surface is formed which is inclined in a direction toward the heat connection surface and receives a force from the side of the substrate and applies the force to the substrate as a pressing force from the substrate to the object to be cooled.

本発明によれば、発熱部品を冷却する冷却部材を備えた装置の薄型化を図ることができる。   According to the present invention, it is possible to reduce the thickness of an apparatus including a cooling member that cools a heat-generating component.

本発明に係る第1実施形態の冷却部材を備えた電子機器の構成を説明する模式的な断面図である。It is typical sectional drawing explaining the structure of the electronic device provided with the cooling member of 1st Embodiment which concerns on this invention. 図1に表される電子機器の構成を図1の上方側から見た態様を表す模式的な平面図である。FIG. 2 is a schematic plan view illustrating a configuration in which the configuration of the electronic device illustrated in FIG. 1 is viewed from the upper side in FIG. 1. 本発明に係る第2実施形態の冷却部材の構成を説明する模式的な断面図である。It is typical sectional drawing explaining the structure of the cooling member of 2nd Embodiment which concerns on this invention. 第2実施形態の冷却部材を備える冷却装置の一構成例を説明する模式的な断面図である。It is typical sectional drawing explaining the example of 1 structure of a cooling device provided with the cooling member of 2nd Embodiment. 第2実施形態の冷却部材を備える電子機器の一構成例を説明する模式的な断面図である。It is typical sectional drawing explaining the example of 1 structure of an electronic device provided with the cooling member of 2nd Embodiment. 本発明に係るその他の実施形態を説明する図である。It is a figure explaining other embodiment concerning the present invention. 冷却部材を備える電子機器の一構成例を説明する模式的な断面図である。It is typical sectional drawing explaining the example of 1 structure of an electronic device provided with a cooling member.

以下に、本発明に係る実施形態を図面を参照しつつ説明する。   Embodiments according to the present invention will be described below with reference to the drawings.

<第1実施形態>
図1は、本発明に係る第1実施形態の冷却部材を備えた電子機器の構成を模式的に表す断面図である。図2は、図1における上方側から図1の構成を見た模式的な平面図である。第1実施形態の電子機器1は、発熱部品3を備えた回路基板4と、回路基板4を収容するケース5と、発熱部品3を冷却する冷却部材であるヒートシンク7と、ねじ8とを備えている。
<First Embodiment>
FIG. 1 is a cross-sectional view schematically showing a configuration of an electronic apparatus including the cooling member according to the first embodiment of the present invention. FIG. 2 is a schematic plan view of the configuration of FIG. 1 viewed from above in FIG. The electronic device 1 according to the first embodiment includes a circuit board 4 provided with a heat generating component 3, a case 5 that accommodates the circuit board 4, a heat sink 7 that is a cooling member that cools the heat generating component 3, and a screw 8. ing.

この電子機器1では、発熱部品3を搭載した回路基板4は、ケース5の内部空間に収容され、ねじ14によりケース5に固定されている。   In the electronic apparatus 1, the circuit board 4 on which the heat generating component 3 is mounted is accommodated in the internal space of the case 5 and is fixed to the case 5 with screws 14.

ヒートシンク7は、基体10と、基体10の上部に立設されている複数のフィン11とを有している。基体10は、冷却対象である発熱部品3と熱接続する熱接続面10bを有している。この第1実施形態では、基体10の熱接続面10bと発熱部品3との間には放熱グリス13が介設され、当該放熱グリス13によって、熱接続面10bと発熱部品3との間における熱伝導率の低下が抑制される。   The heat sink 7 includes a base body 10 and a plurality of fins 11 provided upright on the base body 10. The base 10 has a thermal connection surface 10b that is thermally connected to the heat-generating component 3 that is a cooling target. In the first embodiment, a heat radiation grease 13 is interposed between the heat connection surface 10 b of the base 10 and the heat generating component 3, and the heat radiation between the heat connection surface 10 b and the heat generation component 3 is provided by the heat radiation grease 13. A decrease in conductivity is suppressed.

発熱部品3の熱は、放熱グリス13を通って熱接続面10bから基体10に伝達され、当該基体10に伝達された熱は、主に、当該基体10の上部のフィン11から放熱される。ヒートシンク7は、このように、発熱部品3の熱を放熱し、発熱部品3を冷却する。   The heat of the heat generating component 3 is transmitted to the base body 10 from the heat connection surface 10 b through the heat radiation grease 13, and the heat transmitted to the base body 10 is mainly radiated from the fins 11 on the base body 10. Thus, the heat sink 7 dissipates the heat of the heat generating component 3 and cools the heat generating component 3.

このヒートシンク7における基体10には、熱接続面10bを底面とした場合に側面となる部位に傾斜受け面であるテーパ面10sが形成されている。第1実施形態では、テーパ面10sは、基体10の側面の上縁部に基体10を周回する方向に全周に亘って形成されている。このテーパ面10sは、熱接続面10bに向かう方向に傾き、かつ、基体の側方側からの力を受け当該力を基体10から冷却対象である発熱部品3への押し付け力として基体10に作用させる機能を持つ。テーパ面10sの傾斜角度は、ヒートシンク7(基体10)を発熱部品3に押し付ける押し付け力を考慮して設計される。   The base 10 of the heat sink 7 has a tapered surface 10s that is an inclined receiving surface at a portion that becomes a side surface when the thermal connection surface 10b is a bottom surface. In the first embodiment, the taper surface 10 s is formed on the upper edge of the side surface of the base body 10 over the entire circumference in the direction around the base body 10. The taper surface 10s is inclined in a direction toward the heat connection surface 10b, and receives a force from the side of the substrate, and acts on the substrate 10 as a pressing force from the substrate 10 to the heat generating component 3 to be cooled. It has a function to let you. The inclination angle of the tapered surface 10 s is designed in consideration of the pressing force that presses the heat sink 7 (base 10) against the heat generating component 3.

すなわち、第1実施形態では、テーパ面10sと間隔を介して向き合うケース5のケース壁の複数個所に、ケース外部からケース内部に貫通する貫通孔の態様を持つねじ穴16が形成されている。ここでは、ヒートシンク7の基体10を図1における上方側から見た形状は、図2に表されているように、長方形状(正方形状)である。基体10の上部における長方形状の四辺にそれぞれ向き合う各ケース壁部分5a,5b,5c,5dには、ねじ穴16が2つずつ形成されている。かつ、互いに向き合うケース壁5a,5cに形成されるねじ穴16は、基体10の中心線に対して線対称となる位置に配置されている。また同様に、互いに向き合うケース壁5b,5dに形成されているねじ穴16は、基体10の中心線に対して線対称となる位置に配置されている。さらに、ねじ穴16は、その中心軸が基体10の熱接続面10bと平行となるように形成される。   That is, in the first embodiment, screw holes 16 having a through-hole shape penetrating from the outside of the case to the inside of the case are formed at a plurality of places on the case wall of the case 5 facing the tapered surface 10s with a space therebetween. Here, the shape of the base 10 of the heat sink 7 viewed from the upper side in FIG. 1 is a rectangular shape (square shape) as shown in FIG. Two screw holes 16 are formed in each of the case wall portions 5a, 5b, 5c, and 5d facing the rectangular four sides on the upper portion of the base body 10, respectively. In addition, the screw holes 16 formed in the case walls 5 a and 5 c facing each other are arranged at positions that are line-symmetric with respect to the center line of the base body 10. Similarly, the screw holes 16 formed in the case walls 5 b and 5 d facing each other are arranged at positions that are line-symmetric with respect to the center line of the base body 10. Further, the screw hole 16 is formed so that the central axis thereof is parallel to the heat connection surface 10 b of the base body 10.

ねじ8は、ケース5の外部からねじ穴16に螺合することにより、ケース5に固定される。また、ねじ穴16に螺合したねじ8の先端部は、基体10のテーパ面10sに当接し、ねじ込み量に応じた押圧力をテーパ面10sに作用する。すなわち、ねじ8は、基体10の側方側からテーパ面10sに力を作用する押圧部材として機能する。このねじ8からテーパ面10sが受けた押圧力は、基体10から発熱部品3への押し付け力として基体10に作用する。その基体10から発熱部品3への押し付け力の大きさは、ねじ8のねじ込み量により調整することができる。例えば、ねじ8は、トルクレンチにより締め付けられる。   The screw 8 is fixed to the case 5 by being screwed into the screw hole 16 from the outside of the case 5. Further, the tip of the screw 8 screwed into the screw hole 16 abuts on the taper surface 10s of the base 10, and a pressing force corresponding to the screwing amount acts on the taper surface 10s. That is, the screw 8 functions as a pressing member that applies force to the tapered surface 10 s from the side of the base body 10. The pressing force received by the tapered surface 10 s from the screw 8 acts on the base 10 as a pressing force from the base 10 to the heat generating component 3. The magnitude of the pressing force from the base 10 to the heat generating component 3 can be adjusted by the screwing amount of the screw 8. For example, the screw 8 is tightened by a torque wrench.

また、ねじ8からテーパ面10sへの押圧力の大きさと、当該押圧力に起因した基体10から発熱部品3への押し付け力の大きさとの関係は、テーパ面10sの傾斜角度によって変化する。このことにより、テーパ面10sの傾斜角度は、ねじ8からテーパ面10sへの押圧力を効率良く発熱部品3への押し付け力として基体10に作用させることができるように設計される。   In addition, the relationship between the magnitude of the pressing force from the screw 8 to the tapered surface 10s and the magnitude of the pressing force from the base 10 to the heat generating component 3 due to the pressing force varies depending on the inclination angle of the tapered surface 10s. Thus, the inclination angle of the tapered surface 10 s is designed so that the pressing force from the screw 8 to the tapered surface 10 s can be efficiently applied to the base body 10 as a pressing force against the heat generating component 3.

上記のように、第1実施形態では、ねじ8は、基体10を発熱部品3に押し付ける押圧部材として機能する。ケース5(ケース壁)は、回路基板4を収容する機能に加えて、ねじ8(押圧部材)を固定する固定部材としても機能する。さらに、ヒートシンク7(冷却部材)と、ねじ8(押圧部材)と、ケース5(固定部材)とによって、冷却対象である発熱部品3を冷却する冷却装置が構成される。   As described above, in the first embodiment, the screw 8 functions as a pressing member that presses the base 10 against the heat generating component 3. The case 5 (case wall) functions as a fixing member for fixing the screw 8 (pressing member) in addition to the function of housing the circuit board 4. Furthermore, the heat sink 7 (cooling member), the screw 8 (pressing member), and the case 5 (fixing member) constitute a cooling device that cools the heat-generating component 3 that is a cooling target.

第1実施形態のヒートシンク7は、基体10にテーパ面10sを備えることにより、基体10の側方側からの力を、当該基体10を発熱部品3に押し付ける力として基体10に作用させることができる。これにより、基体10を発熱部品3に押し付ける押圧部材を、基体10の側方側に配置することが可能となるので、ヒートシンク7は、当該ヒートシンク7を含む電子機器1の嵩上げを抑制できる。換言すれば、第1実施形態におけるヒートシンク7は、電子機器1の薄型化に寄与することができる。   In the heat sink 7 of the first embodiment, by providing the base 10 with the tapered surface 10 s, a force from the side of the base 10 can be applied to the base 10 as a force for pressing the base 10 against the heat generating component 3. . Thereby, since the pressing member that presses the base 10 against the heat generating component 3 can be disposed on the side of the base 10, the heat sink 7 can suppress the electronic device 1 including the heat sink 7 from being raised. In other words, the heat sink 7 in the first embodiment can contribute to thinning of the electronic device 1.

また、第1実施形態では、基体10に押圧力を作用する押圧部材は、ねじ8により構成されており、当該押圧部材は簡素な構成であり、この構成も電子機器1の薄型化に寄与する。   Moreover, in 1st Embodiment, the press member which acts on the base | substrate 10 with the pressing force is comprised by the screw 8, The said press member is a simple structure, This structure also contributes to thickness reduction of the electronic device 1. .

さらに、ねじ8による押圧部材は、ねじ込み量により基体10に作用する押圧力の大きさを簡単に調整することができる。これにより、第1実施形態の電子機器1は、適切な押し付け力でもってヒートシンク7を発熱部品3に押し付けることができる。   Furthermore, the pressing member by the screw 8 can easily adjust the magnitude of the pressing force acting on the base 10 by the screwing amount. Thereby, the electronic device 1 of the first embodiment can press the heat sink 7 against the heat generating component 3 with an appropriate pressing force.

さらに、テーパ面10sは基体10の側面における上縁部の全周に亘って形成されているので、ねじ8の配置位置が設計位置よりも横側にずれてしまっても、ねじ8はテーパ面10sを押圧することができる。このため、基体10の側面上縁部の全周に亘ってテーパ面10sが形成されている構成は、ねじ8の配置位置を高精度に調整するという手間を削減することができる。   Furthermore, since the taper surface 10s is formed over the entire circumference of the upper edge portion on the side surface of the base body 10, the screw 8 is tapered even if the position of the screw 8 is shifted laterally from the design position. 10s can be pressed. For this reason, the configuration in which the tapered surface 10 s is formed over the entire periphery of the upper edge of the side surface of the base body 10 can reduce the trouble of adjusting the arrangement position of the screw 8 with high accuracy.

<第2実施形態>
本発明に係る第2実施形態を説明する。
Second Embodiment
A second embodiment according to the present invention will be described.

図3は、本発明に係る第2実施形態の冷却部材を説明する模式的な断面図である。図4は、図3の冷却部材を備えた冷却装置の一構成例を説明する模式的な断面図である。図5は、図3の冷却部材を備えた電子機器の一構成例を説明する模式的な断面図である。   FIG. 3 is a schematic cross-sectional view illustrating a cooling member according to a second embodiment of the present invention. FIG. 4 is a schematic cross-sectional view illustrating a configuration example of a cooling device including the cooling member of FIG. FIG. 5 is a schematic cross-sectional view illustrating a configuration example of an electronic device including the cooling member of FIG.

第2実施形態の冷却部材20は、冷却対象(例えば、図5における発熱部品27)に熱接続する基体21を有する。この基体21は、冷却対象に熱接続する熱接続面21bを有する。さらに、基体21は、熱接続面21bを底面とした場合に側面となる部位に、傾斜受け面21kを有する。この傾斜受け面21kは、熱接続面21bに向かう方向に傾き、かつ、基体21の側方側からの力を受け当該力を基体21から冷却対象への押し付け力として基体21に作用させるように形成されている。   The cooling member 20 of the second embodiment includes a base body 21 that is thermally connected to a cooling target (for example, the heat generating component 27 in FIG. 5). The base 21 has a heat connection surface 21b that is thermally connected to the object to be cooled. Furthermore, the base body 21 has an inclined receiving surface 21k at a portion that becomes a side surface when the heat connection surface 21b is a bottom surface. The inclined receiving surface 21k is inclined in the direction toward the heat connection surface 21b, and receives a force from the side of the base 21 so that the force acts on the base 21 as a pressing force from the base 21 to the cooling target. Is formed.

このような構成を持つ冷却部材20は、図4に表されるように、押圧部材24と共に、冷却装置23を構成する。押圧部材24は、冷却部材20における基体21の傾斜受け面21kに、基体21の側方側からの力Fを作用する構成を持つ。   The cooling member 20 having such a configuration constitutes a cooling device 23 together with the pressing member 24, as shown in FIG. The pressing member 24 has a configuration in which a force F from the side of the base 21 is applied to the inclined receiving surface 21 k of the base 21 in the cooling member 20.

また、冷却部材20は、図5に表されるように、押圧部材24および発熱部品27と共に、電子機器26を構成する。発熱部品27は、冷却部材20により冷却される冷却対象である。   Moreover, the cooling member 20 comprises the electronic device 26 with the press member 24 and the heat-emitting component 27, as represented by FIG. The heat generating component 27 is a cooling target that is cooled by the cooling member 20.

第2実施形態の冷却部材20は、傾斜受け面21kを備えることにより、当該冷却部材20を備える電子機器26の嵩上げ方向に押圧部材24を配置しなくとも済む構成を持つことになるから、押圧部材に起因した電子機器26の嵩高を抑制できる。つまり、第2実施形態の冷却部材20は、電子機器26の薄型化を図ることができる。   Since the cooling member 20 according to the second embodiment includes the inclined receiving surface 21k, the cooling member 20 has a configuration that does not require the pressing member 24 to be disposed in the raising direction of the electronic device 26 including the cooling member 20. The bulk of the electronic device 26 caused by the member can be suppressed. That is, the cooling member 20 of the second embodiment can reduce the thickness of the electronic device 26.

<その他の実施形態>
なお、本発明は第1や第2の実施形態に限定されず、様々な実施の態様を採り得る。例えば、第1実施形態では、基体10の側面における上縁部の全周に亘ってテーパ面10sが形成されている。これに代えて、図6の平面図に表されるように、基体10の側面における上縁部に傾斜受け面としてのテーパ面10sが部分的に形成されてもよい。
<Other embodiments>
The present invention is not limited to the first and second embodiments, and can take various forms. For example, in the first embodiment, the tapered surface 10 s is formed over the entire circumference of the upper edge portion on the side surface of the base body 10. Instead, as shown in the plan view of FIG. 6, a tapered surface 10 s as an inclined receiving surface may be partially formed on the upper edge portion of the side surface of the base body 10.

また、第1実施形態では、ヒートシンク7の基体10と発熱部品3との間には、放熱グリス13が介設されているが、放熱グリス13に代えて、放熱シートが介設されていてもよい。さらにまた、基体10と発熱部品3は直接に接触する構成であってもよい。さらに、第1実施形態では、基体10は、上方側から見た形状が四角形状であるが、基体10の形状は特に限定されない。   In the first embodiment, the heat dissipation grease 13 is interposed between the base 10 of the heat sink 7 and the heat generating component 3. However, instead of the heat dissipation grease 13, a heat dissipation sheet may be interposed. Good. Furthermore, the base 10 and the heat generating component 3 may be in direct contact with each other. Furthermore, in the first embodiment, the base body 10 has a quadrangular shape as viewed from above, but the shape of the base body 10 is not particularly limited.

さらに、第1実施形態では、押圧部材は、ねじ8を有して構成されている。これに代えて、押圧部材は、ねじ以外の構成でもってテーパ面(傾斜受け面)10sに押圧力を作用する構成であってもよい。さらに、押圧部材(ねじ8)が基体10に押圧力を作用する作用点の数および配置位置は、基体10から発熱部品3への押し付け力を考慮して適宜設定されるものである。   Furthermore, in the first embodiment, the pressing member is configured to have a screw 8. Instead of this, the pressing member may be configured to apply a pressing force to the tapered surface (inclined receiving surface) 10s with a configuration other than the screw. Further, the number and arrangement position of the action points at which the pressing member (screw 8) applies the pressing force to the base body 10 are appropriately set in consideration of the pressing force from the base body 10 to the heat generating component 3.

さらに、第1実施形態等では、傾斜受け面であるテーパ面10sは、基体10の側面の上縁部に形成されている。これに代えて、例えば、基体10が厚い場合には、基体10の側面に凹部を設け、当該凹部の内壁面に傾斜受け面として機能する傾斜面を形成してもよい。   Furthermore, in the first embodiment and the like, the tapered surface 10 s that is an inclined receiving surface is formed on the upper edge of the side surface of the base 10. Instead, for example, when the substrate 10 is thick, a recess may be provided on the side surface of the substrate 10 and an inclined surface functioning as an inclined receiving surface may be formed on the inner wall surface of the recess.

1,26 電子機器
3,27 発熱部品
5 ケース
7 ヒートシンク
8 ねじ
10,21 基体
16 ねじ穴
20 冷却部材
23 冷却装置
24 押圧部材
DESCRIPTION OF SYMBOLS 1,26 Electronic device 3,27 Heat-generating component 5 Case 7 Heat sink 8 Screw 10, 21 Base 16 Screw hole 20 Cooling member 23 Cooling device 24 Pressing member

Claims (7)

冷却対象に熱接続する基体を有し、
前記基体には、前記冷却対象に熱接続する熱接続面を底面とした場合に側面となる部位に、前記熱接続面に向かう方向に傾き、かつ、前記基体の側方側からの力を受け当該力を前記基体から前記冷却対象への押し付け力として前記基体に作用させる傾斜受け面が形成されている冷却部材。
Having a substrate thermally connected to the object to be cooled;
The base body is inclined in a direction toward the heat connection surface at a portion that becomes a side surface when a heat connection surface that is thermally connected to the object to be cooled is a bottom surface, and receives a force from a side of the base body. A cooling member formed with an inclined receiving surface that applies the force to the base as a pressing force from the base to the object to be cooled.
前記傾斜受け面は、前記側面の上縁部に前記基体の側面を周回する方向に全周に亘って形成されている請求項1に記載の冷却部材。   The cooling member according to claim 1, wherein the inclined receiving surface is formed over the entire circumference in a direction of circling the side surface of the base body at an upper edge portion of the side surface. 請求項1又は請求項2に記載の冷却部材と、
前記冷却部材における傾斜受け面に、前記基体の側方側からの力を作用する押圧部材と
を備える冷却装置。
The cooling member according to claim 1 or 2,
A cooling device comprising: a pressing member that applies a force from a side of the base to an inclined receiving surface of the cooling member.
前記押圧部材を固定する固定部材をさらに備え、
前記押圧部材は、前記固定部材に形成されているねじ穴に螺合することによって、前記固定部材に固定され、かつ、前記傾斜受け面に対し進退方向に変位し当該傾斜受け面に作用する押圧力の大きさを変化可能なねじである請求項3に記載の冷却装置。
A fixing member for fixing the pressing member;
The pressing member is fixed to the fixing member by being screwed into a screw hole formed in the fixing member, and is displaced in an advancing / retreating direction with respect to the inclined receiving surface and acting on the inclined receiving surface. The cooling device according to claim 3, wherein the cooling device is a screw capable of changing the magnitude of pressure.
冷却対象である発熱部品と、
請求項1又は請求項2に記載の冷却部材と、
前記冷却部材における傾斜受け面に、前記基体の側方側からの力を作用する押圧部材と
を備える電子機器。
A heat generating component to be cooled;
The cooling member according to claim 1 or 2,
An electronic device comprising: a pressing member that applies a force from a side of the base to an inclined receiving surface of the cooling member.
前記発熱部品を収容するケースをさらに備え、
前記冷却部材における傾斜受け面に向き合う前記ケースのケース壁が、前記押圧部材を固定する固定部材として機能し、
前記押圧部材は、前記固定部材としての前記ケース壁に形成されたねじ穴に螺合することによって、前記ケース壁に固定され、かつ、前記傾斜受け面に対し進退方向に変位し当該傾斜受け面に作用する押圧力の大きさを変化可能なねじにより構成される請求項5に記載の電子機器。
A case for accommodating the heat generating component;
The case wall of the case facing the inclined receiving surface in the cooling member functions as a fixing member that fixes the pressing member;
The pressing member is fixed to the case wall by being screwed into a screw hole formed in the case wall as the fixing member, and is displaced in a forward / backward direction with respect to the inclined receiving surface. The electronic device according to claim 5, wherein the electronic device is configured by a screw capable of changing a magnitude of a pressing force acting on the screw.
冷却対象に熱接続する熱接続面を有する基体における前記熱接続面を底面とした場合に側面となる部位に、
前記熱接続面に向かう方向に傾き、かつ、前記基体の側方側からの力を受け当該力を前記基体から前記冷却対象への押し付け力として前記基体に作用させる傾斜受け面を形成する
冷却部材の形成方法。
When the heat connection surface in the base body having a heat connection surface thermally connected to the object to be cooled is a bottom surface,
A cooling member that is inclined in a direction toward the heat connection surface and that forms a tilt receiving surface that receives a force from a side of the substrate and applies the force to the substrate as a pressing force from the substrate to the cooling target. Forming method.
JP2016088280A 2016-04-26 2016-04-26 Method for forming cooling member, cooling device, electronic device and cooling member Active JP6769087B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016088280A JP6769087B2 (en) 2016-04-26 2016-04-26 Method for forming cooling member, cooling device, electronic device and cooling member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016088280A JP6769087B2 (en) 2016-04-26 2016-04-26 Method for forming cooling member, cooling device, electronic device and cooling member

Publications (2)

Publication Number Publication Date
JP2017199756A true JP2017199756A (en) 2017-11-02
JP6769087B2 JP6769087B2 (en) 2020-10-14

Family

ID=60239441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016088280A Active JP6769087B2 (en) 2016-04-26 2016-04-26 Method for forming cooling member, cooling device, electronic device and cooling member

Country Status (1)

Country Link
JP (1) JP6769087B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019102491A (en) * 2017-11-28 2019-06-24 株式会社Pfu Electronic apparatus
JP2020129604A (en) * 2019-02-08 2020-08-27 沖電気工業株式会社 Electronic apparatus

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6480386B1 (en) * 2002-02-28 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly with pressing wedges
CN2587135Y (en) * 2002-11-27 2003-11-19 世顶企业有限公司 Radiator fastener structure
US6665188B1 (en) * 2002-11-19 2003-12-16 Kocam International Co., Ltd. Snapping device for CPU cooler
US20050108877A1 (en) * 2003-11-24 2005-05-26 Peterson Eric C. Apparatus and method for coupling a thermal dissipation device to an electronic substrate
US20090229808A1 (en) * 2008-03-17 2009-09-17 Chung-Jun Chu Heat-conducting assembly
JP2013118334A (en) * 2011-12-05 2013-06-13 Toyota Motor Corp Semiconductor cooler
JP2015073054A (en) * 2013-10-04 2015-04-16 三菱電機株式会社 Heat radiator

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6480386B1 (en) * 2002-02-28 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly with pressing wedges
US6665188B1 (en) * 2002-11-19 2003-12-16 Kocam International Co., Ltd. Snapping device for CPU cooler
CN2587135Y (en) * 2002-11-27 2003-11-19 世顶企业有限公司 Radiator fastener structure
US20050108877A1 (en) * 2003-11-24 2005-05-26 Peterson Eric C. Apparatus and method for coupling a thermal dissipation device to an electronic substrate
US20090229808A1 (en) * 2008-03-17 2009-09-17 Chung-Jun Chu Heat-conducting assembly
JP2013118334A (en) * 2011-12-05 2013-06-13 Toyota Motor Corp Semiconductor cooler
JP2015073054A (en) * 2013-10-04 2015-04-16 三菱電機株式会社 Heat radiator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019102491A (en) * 2017-11-28 2019-06-24 株式会社Pfu Electronic apparatus
JP2020129604A (en) * 2019-02-08 2020-08-27 沖電気工業株式会社 Electronic apparatus
JP7367308B2 (en) 2019-02-08 2023-10-24 沖電気工業株式会社 Electronics

Also Published As

Publication number Publication date
JP6769087B2 (en) 2020-10-14

Similar Documents

Publication Publication Date Title
US20070146990A1 (en) Heat dissipating assembly
JP6036894B2 (en) Cooling device and equipment
JP2006278941A (en) Heat sink device and plug-in unit
JP6352583B2 (en) Semiconductor device
JP6885194B2 (en) Electronics
US10271419B2 (en) Heat dissipating structure and electronic device
JP2008198864A (en) Electronic equipment and semiconductor package
JP6381340B2 (en) Heat dissipation structure and electronic device equipped with the same
JP2008041893A (en) Heat radiating apparatus
JP2017199756A (en) Cooling member, cooling device, electronic apparatus, and method of forming cooling member
JP2007305649A (en) Means for fixing radiator
JP5640616B2 (en) Heat dissipation structure for electronic components
JP2008277330A (en) Heat radiation device
JP2008103577A (en) Heat dissipating structure for power module, and motor controller equipped with the same
JP2012129379A (en) Radiation fin
JP7325316B2 (en) semiconductor equipment
JP2018096613A (en) Heat radiation structure and electronic apparatus
JP2016131218A (en) Heat radiation device
JP2012222173A (en) Semiconductor device
JP2012064705A (en) Radiator attachment structure and electronic apparatus
JP4862385B2 (en) Electronics
JP2017174894A (en) Cooling device, electronic device, and heat sink mounting method
WO2020261382A1 (en) Semiconductor device
JP2015065314A (en) Electronic apparatus
JP4451752B2 (en) Heat dissipation member and semiconductor parts

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190315

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191105

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191119

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200714

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200812

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200825

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200907

R150 Certificate of patent or registration of utility model

Ref document number: 6769087

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150